JP2005208465A5 - - Google Patents

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JP2005208465A5
JP2005208465A5 JP2004016730A JP2004016730A JP2005208465A5 JP 2005208465 A5 JP2005208465 A5 JP 2005208465A5 JP 2004016730 A JP2004016730 A JP 2004016730A JP 2004016730 A JP2004016730 A JP 2004016730A JP 2005208465 A5 JP2005208465 A5 JP 2005208465A5
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carbon atoms
organic group
group
integer
divalent
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JP2004016730A
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JP4403811B2 (en
JP2005208465A (en
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市販されている化合物としては、酸化スズ−酸化チタン複合粒子の”オプトレイクTR−502”、”オプトレイクTR−504”、酸化ケイ素−酸化チタン複合粒子の”オプトレイクTR−503”、”オプトレイクTR−512”、”オプトレイクTR−513”、”オプトレイクTR−514”、”オプトレイクTR−515”、酸化チタン粒子の”オプトレイクTR−505”(以上、商品名、触媒化成工業(株)製)、酸化ジルコニウム粒子((株)高純度化学研究所製)、酸化スズ−酸化ジルコニウム複合粒子(触媒化成工業(株)製)、酸化スズ粒子((株)高純度化学研究所製)等が挙げられる。 Commercially available compounds include “Op-Trake TR-502” and “Op-trake TR-504” of tin oxide-titanium oxide composite particles, “Op-trake TR-503 ” of “silicon oxide-titanium oxide composite particles ”, “Opto” Lake TR-512 ”,“ Optlake TR-513 ”,“ Optlake TR-514 ”,“ Optlake TR-515 ” ,“ Oplake TR-505 ”of titanium oxide particles Zirconium oxide particles (manufactured by Kosei Chemical Laboratory Co., Ltd.), tin oxide-zirconium oxide composite particles (manufactured by Catalyst Chemical Industry Co., Ltd.), tin oxide particles (manufactured by Kojundo Chemical Laboratory Co., Ltd.) Manufactured) and the like.

Claims (4)

(A)一般式(1)で表される構造単位を主成分とするポリマー、(B)チオエーテル基、フルオレン基、スルホニル基から選ばれる基を1種以上有し、かつフェノール性水酸基および/またはチオフェノール基を含有する化合物、(C)エステル化したキノンジアジド化合物、(D)アルミニウム化合物、ケイ素化合物、スズ化合物、チタン化合物、ジルコニウム化合物から少なくとも1種選ばれる粒子径1nmから30nmの無機粒子を含有するポジ型感光性樹脂組成物。
Figure 2005208465
(式中Rは2個以上の炭素原子を有する2価から8価の有機基、Rは2個以上の炭素原子を有する2価から6価の有機基、Rは水素、または炭素数1から20までの有機基を示す。nは10から100000までの範囲、mは0から2までの整数、p、qは0から4までの整数を示す。)
(A) the general formula (1) a polymer composed mainly of structural units represented, (B) a thioether group, a fluorene group, possess on 1 or more kinds of group selected from a sulfonyl group, and phenolic hydroxyl group and / Or a compound containing a thiophenol group, (C) an esterified quinonediazide compound, (D) an inorganic particle having a particle diameter of 1 nm to 30 nm selected from at least one selected from an aluminum compound, a silicon compound, a tin compound, a titanium compound, and a zirconium compound. A positive photosensitive resin composition to be contained.
Figure 2005208465
(Wherein R 1 is a divalent to octavalent organic group having 2 or more carbon atoms, R 2 is a divalent to hexavalent organic group having 2 or more carbon atoms, and R 3 is hydrogen or carbon. And represents an organic group having a number of 1 to 20. n represents a range of 10 to 100,000, m represents an integer of 0 to 2, and p and q represent an integer of 0 to 4.
一般式(1)のR(COOR)m(OH)pが、一般式(2)で表される請求項1記載のポジ型感光性樹脂組成物。
Figure 2005208465
(R、Rは炭素数2〜20より選ばれる2価〜4価の有機基を示し、Rは、炭素数3
〜20より選ばれる3価〜6価の有機基を示し、R、Rは水素、あるいは炭素数1〜20までの有機基を示す。o、sは0から2までの整数、rは1〜4までの整数を示す。)
The positive photosensitive resin composition according to claim 1, wherein R 1 (COOR 3 ) m (OH) p in the general formula (1) is represented by the general formula (2).
Figure 2005208465
(R 4 and R 6 represent a divalent to tetravalent organic group selected from 2 to 20 carbon atoms, and R 5 represents 3 carbon atoms.
Shows the selected Ru trivalent to hexavalent organic group than to 20, R 7, R 8 represents an organic group having hydrogen or up to 20 carbon atoms. o and s are integers from 0 to 2, and r is an integer from 1 to 4. )
一般式(1)のR(OH)qが、一般式(3)〜(5)に表される少なくとも1種である請求項1記載のポジ型感光性樹脂組成物。
Figure 2005208465
(R、R11は炭素数2〜20より選ばれる3価〜4価の有機基を示し、R10は炭素数2〜30より選ばれる2価の有機基を示す。t、uは1あるいは2の整数を示す。R12、R14は炭素数2〜20までの2価の有機基を示し、R13は、炭素数3〜20より選ばれる3価〜6価の有機基を示す。vは1〜4までの整数を示す。R15は炭素数2〜20より選ばれる2価の有機基を示し、R16は、炭素数3〜20より選ばれる3価〜6価の有機基を示す。wは1〜4までの整数を示す。)
The positive photosensitive resin composition according to claim 1, wherein R 2 (OH) q in the general formula (1) is at least one kind represented by the general formulas (3) to (5).
Figure 2005208465
(R 9, R 11 is a trivalent to tetravalent organic group Ru selected from 2 to 20 carbon atoms, R 10 represents a divalent organic group selected from C2-30 .t, u is 1 or .R 12 showing a second integer, R 14 represents a divalent organic group of up to 20 carbon atoms, R 13 is trivalent to hexavalent organic group Ru selected from 3 to 20 carbon atoms shown .v represents an integer of 1 to 4 .R 15 represents a divalent organic group selected from 2 to 20 carbon atoms, R 16 is trivalent 6 which Ru is selected from 3 to 20 carbon atoms (W represents an integer of 1 to 4.)
請求項1記載のポジ型感光性樹脂組成物に紫外線を照射した後、加熱して形成された耐熱性樹脂のレリーフパターン。 A relief pattern of a heat resistant resin formed by irradiating the positive photosensitive resin composition according to claim 1 with ultraviolet rays and then heating.
JP2004016730A 2004-01-26 2004-01-26 Positive photosensitive resin composition Expired - Lifetime JP4403811B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004016730A JP4403811B2 (en) 2004-01-26 2004-01-26 Positive photosensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004016730A JP4403811B2 (en) 2004-01-26 2004-01-26 Positive photosensitive resin composition

Publications (3)

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JP2005208465A JP2005208465A (en) 2005-08-04
JP2005208465A5 true JP2005208465A5 (en) 2009-04-02
JP4403811B2 JP4403811B2 (en) 2010-01-27

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004310076A (en) * 2003-03-26 2004-11-04 Sumitomo Bakelite Co Ltd Positive photosensitive resin composition, and semiconductor device and display element
WO2006132962A2 (en) * 2005-06-03 2006-12-14 Fujifilm Electronic Materials U.S.A. Inc. Novel photosensitive resin compositions
JP2007122024A (en) * 2005-09-28 2007-05-17 Toray Ind Inc Photosensitive composition
JP4946105B2 (en) * 2006-03-15 2012-06-06 東レ株式会社 Resin composition and method for forming relief pattern using the same
JP5162787B2 (en) * 2007-03-30 2013-03-13 Jsr株式会社 Resin composition, cured film and optical member
JP4986071B2 (en) 2007-03-30 2012-07-25 国立大学法人東京工業大学 Resin composition, cured product and optical member
JP5252338B2 (en) * 2007-11-22 2013-07-31 Jsr株式会社 Diamine compound, polyamic acid and imidized polymer produced using the same
KR100913058B1 (en) * 2008-08-25 2009-08-20 금호석유화학 주식회사 Composition for positive photosensitive resin, method of forming pattern and semiconductor device
KR101200140B1 (en) * 2009-08-31 2012-11-12 금호석유화학 주식회사 Positive typed photosensitive composition
CN103460304A (en) * 2011-12-19 2013-12-18 松下电器产业株式会社 Transparent conductive film, substrate with transparent conductive film, and method for manufacturing same
WO2016148176A1 (en) * 2015-03-19 2016-09-22 東レ株式会社 Positive photosensitive resin composition, cured film, tft substrate, interlayer insulating film, display device, and methods for producing same

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