JP2005204729A - Image pickup device for endoscope - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image pickup device for an endoscope in which the integration degree of electronic components is high and an image sensor is disposed at such a position that an inspection is facilitated. <P>SOLUTION: In the image pickup device 1 for the endoscope including a rigid flexible substrate 2 for which flexible substrates 11 and 12 extended from an image pickup substrate 10 where the image sensor 13 is disposed are bent, since the image sensor 13 is disposed on the image pickup substrate 10 with the extending direction of the flexible substrates 11 and 12 to the image pickup substrate 10 as a reference, whether or not the image sensor 13 is disposed at an appropriate position is easily inspected with the extending direction of the flexible substrates 11 and 12 as an indicator. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an endoscope imaging device that is introduced into a subject and observes the subject site, and more particularly to an endoscope imaging device suitable for a capsule endoscope or the like.

  In recent years, in the field of endoscopy, for example, a capsule-type interior which is introduced into a body cavity of a subject through a mouth and can capture image information in the body cavity by imaging the digestive organs such as the small intestine with an imaging device. An endoscope has appeared. Here, as a capsule endoscope that is small and can be easily assembled, a capsule endoscope that includes a rigid flexible substrate obtained by bending a rigid substrate extending from a rigid substrate on which an image sensor is disposed has been proposed. (See Patent Document 1).

WO 02/102224 pamphlet

  By the way, the image sensor is a large electronic component among the electronic components mounted on the capsule endoscope. Depending on the position of the image sensor, other electronic components such as an electronic component for driving the image sensor are arranged. The installation position is determined. Therefore, the size, particularly the outer diameter, of the capsule endoscope is determined depending on how the image sensor is arranged on the rigid substrate. This is a problem not only for capsule endoscopes but also for all endoscope imaging devices that are always required to be downsized.

  Further, when inspecting whether or not the image sensor disposed on the rigid board is properly attached, it is difficult to determine whether or not the image sensor is properly attached to the rigid board without any index.

  The present invention has been made in view of the above, and an object of the present invention is to provide an imaging apparatus for an endoscope in which an image sensor is disposed at a position where electronic components are highly integrated and inspection is easy. .

  In order to solve the above-described problems and achieve the object, an endoscope imaging apparatus according to claim 1 of the present invention is a rigid-flexible board obtained by bending a flexible board extending from a rigid board on which an image sensor is disposed. In the endoscope imaging device, the image sensor is arranged on the rigid substrate with reference to the extending direction of the flexible substrate with respect to the rigid substrate.

  An endoscope imaging apparatus according to a second aspect of the present invention is the endoscope imaging apparatus according to the first aspect, wherein the extending direction of the flexible substrate with respect to the rigid substrate is aligned with the pixel arrangement direction of the image sensor. It is characterized by that.

  An endoscope imaging apparatus according to a third aspect of the present invention is the endoscope imaging apparatus according to the first or second aspect, wherein electronic components for driving the image sensor are disposed on a rigid substrate using the image sensor as a reference. Features.

  An endoscope imaging apparatus according to a fourth aspect of the present invention is the endoscope imaging device according to the first aspect, wherein the image sensor has an outer peripheral shape having two sides parallel to each other, and the extending direction of the flexible substrate relative to the rigid substrate and the image sensor. This image sensor is arranged so that two parallel sides of the image sensor are parallel to each other.

  An endoscope imaging apparatus according to a fifth aspect of the present invention is the electronic component for driving the image sensor according to the fourth aspect, wherein the image sensor has an outer peripheral shape having two sides parallel to each other with the image sensor as an arrangement reference. The electronic component is arranged on a rigid substrate so that the two parallel sides of the electronic component and the two parallel sides of the image sensor are parallel to each other.

  In the endoscope imaging apparatus according to the present invention, since the image sensor is disposed on the rigid substrate with reference to the extending direction of the flexible substrate with respect to the rigid substrate, the image sensor is appropriately used with the extending direction of the flexible substrate as an index. There is an effect that it can be easily inspected whether or not it is disposed at any position.

  In addition, since the extending direction of the flexible substrate relative to the rigid substrate is aligned with the pixel array direction of the image sensor, and the image sensor is disposed, the electronic components for driving the image sensor can be aligned with the pixel array direction. The degree of integration of electronic components can be increased. For this reason, there exists an effect that the imaging device for endoscopes can be reduced more.

  In addition, since the electronic components for driving the image sensor are disposed on the rigid substrate using the image sensor as a reference for disposition, the degree of integration of the electronic components can be increased. For this reason, there exists an effect that the imaging device for endoscopes can be reduced more.

  In addition, the image sensor has an outer peripheral shape having two sides parallel to each other, and this image sensor has a parallel relationship between the extending direction of the flexible substrate relative to the rigid substrate and the two sides parallel to the image sensor. Therefore, the degree of integration of electronic components can be increased. For this reason, there exists an effect that the imaging device for endoscopes can be reduced more.

  Electronic components for driving an image sensor having an outer peripheral shape having two sides parallel to each other using the image sensor as an arrangement reference are two parallel sides provided in the electronic component and two parallel sides provided in the image sensor. Since the electronic components are arranged on the rigid substrate so that the two are in parallel with each other, the degree of integration of the electronic components can be increased. For this reason, there exists an effect that the imaging device for endoscopes can be reduced more in size.

  Exemplary embodiments of an endoscope imaging apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. Note that the present invention is not limited to the embodiments.

  FIG. 1 is a side sectional view showing a configuration of a capsule endoscope as an application example of an endoscope imaging apparatus according to an embodiment of the present invention, and FIG. 2 is an upper surface of a developed rigid flexible substrate shown in FIG. FIG. 3, FIG. 3 is a bottom view of the developed rigid flexible substrate shown in FIG. 1, FIG. 4 is a diagram showing the front surface of the imaging substrate, FIG. 5 is a side sectional view in which a lens mounting member is attached to the imaging substrate, and FIG. FIG. 7 is a diagram showing the rear surface of the imaging substrate, FIG. 7 is a diagram showing the front surface of the illumination substrate, FIG. 8 is a diagram showing the rear surface of the illumination substrate, FIG. 9 is a side sectional view of the illumination substrate, and FIG. FIG. 11 is a side sectional view of the switch board, FIG. 12 is a side sectional view of the switch board, FIG. 13 is a rear view of the power board, and FIG. FIG. 15 is a side sectional view of the transmission unit, and FIG. 16 is a rear view of the transmission unit. It is a diagram.

  In this embodiment, for example, a capsule endoscope that takes an image of a body cavity by introducing it into the body cavity of a subject from the mouth of a person or an animal will be described as an example.

  As shown in FIG. 1, the capsule endoscope 1 includes a folded rigid-flex board 2 and a capsule 70 that covers the folded rigid-flex board 2. As shown in FIGS. 2 and 3, the rigid flexible substrate 2 is formed by integrally forming rigid rigid substrates 10, 30, 40, 50 and flexible substrates 11, 12, 41, 54 having bendable flexibility. The rigid substrates 10, 30, 40, 50 can be stacked by bending the flexible substrates 11, 12, 41 alternately in opposite directions.

  The rigid board includes an imaging board 10 for executing a function of imaging a test site in the subject, an illumination board 30 for executing a function of illuminating the test site, and power for executing each function. A switch board 40 for controlling the supply of power and a power supply board 50 for supplying power for executing each function. The illumination board 30 and the imaging board 10, the imaging board 10 and the switch board 40, and the switch board 40 and the power board 50 are connected in a straight line by flexible boards 11, 12, and 41, respectively. A flexible board 54 extends from the right edge 50A of the power supply board 50, and a transmission board 61 constituting the transmission unit 60 is electrically connected to the flexible board 54 through through-hole lands.

  As shown in FIG. 4, the imaging substrate 10 has a substantially disk shape, and the right edge portion 10 </ b> A and the left edge portion 10 </ b> B of the imaging substrate 10 are notched by straight lines that are parallel to each other to form two sides. It is. Flexible substrates 11 and 12 extend from the right edge 10A and the left edge 10B, respectively. For this reason, when the flexible substrates 11 and 12 are bent, unreasonable deformation of the flexible substrates 11 and 12 can be suppressed by the linear right edge portion 10A and the left edge portion 10B, respectively.

  This right edge portion 10A or left edge portion 10B, that is, the extending direction of the flexible substrates 11 and 12 (two sides by the notches) is a reference for disposing electronic components disposed on the imaging substrate 10, and is shown in FIG. As described above, the image sensor 13 is mounted on the front surface of the imaging substrate 10 by a ball grid array so that the extending direction of the flexible substrates 11 and 12 coincides with the pixel arrangement direction. The image sensor 13 has a solid-state imaging device 13A having a polygonal outer shape, for example, a rectangular outer peripheral shape having two sets of two sides that are parallel to each other, such as a CCD (Charge Coupled Diode), and an upper surface thereof. And a rectangular cover glass 13B laminated in a rectangular shape. Here, the cover glass 13B covers the upper surface of the solid-state imaging device 13A. Here, the arrangement direction of the pixels is parallel to the side forming the outer peripheral shape of the image sensor 13, but the present invention is not necessarily limited thereto.

  As shown in FIG. 5, the lens support member 14 is attached to the upper surface of the cover glass 13B. The lens support member 14 is disposed in close contact with the cover glass 13B and supports the small diameter lens 15 and the large diameter lens 16 that form an image on the image sensor 13, and includes a holder 17 and a lens frame 18. Yes.

  The holder 17 includes a base portion 17A that comes into contact with the upper surface (light receiving surface) of the image sensor 13 and a cylindrical portion 17B that extends upward from the base portion 17A, and is configured by a cylindrical member having a generally cylindrical shape as a whole. doing. The hole portion 17C formed in the cylindrical portion 17B penetrates the base portion 17A and can guide the light incident from above the holder 17 to the image sensor 13. The outer surface of the lower surface of the base portion 17A, that is, the surface that comes into contact with the upper surface of the image sensor 13 has a substantially square shape with one side substantially the same length as the short side of the cover glass 13B. A contact portion 17D that contacts the side surface of the cover glass 13B extends downward from each other.

  In the holder 17, the lower surface of the base portion 17A is in contact with the upper surface of the cover glass 13B, while the contact portion 17D and the side surfaces forming two adjacent sides of the upper surface of the cover glass 13B are in contact with each other. Is positioned with high accuracy.

  Further, a reinforcing portion 17E having substantially the same shape as the contact portion 17D is formed extending from the lower edge portion of the holder 17, and the cover glass 13B and the holder 17 are fixed by the black adhesive 19 after positioning. It is. A black adhesive 19 is applied to the exposed surface of the cover glass 13B that is not covered by the holder 17, so that light can be prevented from entering from the exposed surface, and a clear image can be projected onto the image sensor 13. It is. The solid-state imaging element 13A is not limited to a CCD, and for example, a CMOS (Complementary Metal Oxide Semiconductor) can be used.

  A lens frame 18 is attached to the holder 17. The lens frame 18 supports the small-diameter lens 15 and the large-diameter lens 16 inside, and has an outer diameter equal to or smaller than the inner diameter of the cylindrical portion 17B of the holder 17 and has a cylindrical shape. A front end portion 18A, a small diameter portion 18B, and a large diameter portion 18C are formed on the inner peripheral surface of the lens frame 18, and step portions 18D and 18E are formed at each boundary portion.

  The distal end portion 18A is a portion that takes in incident light that connects an image to the image sensor 13, and the distal end side is formed in a funnel shape. The small-diameter portion 18B is fitted with a small-diameter lens 15 that has a flat front surface and a convex rear surface and a large refractive index of light. The flat portion of the small-diameter lens 15 is in contact with the step portion 18D of the tip portion 18A. The peripheral surface portion is fitted to the small diameter portion 18B. The large-diameter portion 18C is fitted with a cylindrical spacer 20 and a large-diameter lens 16 having a convex front surface and a flat rear surface and a small refractive index of light. The spacer 20 includes the small-diameter lens 15 and the large-diameter lens 16. Are separated by a predetermined interval.

  A small diameter portion 18F and a large diameter portion 18G are formed on the outer peripheral surface of the lens frame 18, and a step portion 18H is formed at the boundary portion. The large diameter portion 18 </ b> G is fitted to the inner peripheral surface of the cylindrical portion 17 </ b> B of the holder 17, and the lens frame 18 can move forward and backward with respect to the holder 17. Therefore, it is possible to adjust the image position projected onto the image sensor 13 by moving the lens frame 18 back and forth, and after adjusting the image position, the holder 17 and the lens frame 18 are fixed by an adhesive 21 or the like.

  As shown in FIG. 4, a large capacitor 22 is disposed on the front surface of the imaging substrate 10 as an electronic component for a power supply voltage circuit for driving the image sensor 13 on both sides of the image sensor 13 as a reference. is there. The large capacitor 22 has a substantially rectangular outer peripheral shape having two sets of two sides parallel to each other. That is, the two sides of the image sensor 13 and the two sides of the large capacitor 22 are arranged in parallel. Further, other electronic components 23 such as capacitors and resistors necessary for driving the image sensor 13 are arranged in an orderly manner while avoiding the image sensor 13 and the large capacitor 22.

  On the other hand, as shown in FIG. 6, the microprocessor 24 is arranged at the approximate center of the rear surface of the imaging board 10 with the extending direction of the right edge 10 </ b> A or the left edge 10 </ b> B, that is, the flexible boards 11, 12 as an arrangement reference. (Digital Signal Processor) is mounted by flip chip bonding, and electronic components 25 such as capacitors are arranged in an orderly manner with reference to the microprocessor. For this reason, the electronic components 25 can be integrated, which can contribute to downsizing of the capsule endoscope 1. The microprocessor 24 performs drive control of the capsule endoscope 1, signal processing of the image sensor 13, and drive control of the illumination board 30.

  As shown in FIG. 7, the illumination board 30 has a substantially disk shape, and the right edge 30A of the illumination board 30 is cut out in a straight line and formed on one side. The flexible substrate 12 extending from the left edge of the imaging substrate 10 is connected to the right edge 30A. For this reason, when the flexible substrate 12 is bent, unreasonable deformation of the flexible substrate 12 can be suppressed.

  A through hole 30 </ b> B is formed at the center of the illumination substrate 30, and the through hole 30 </ b> B and the right edge 30 </ b> A serve as an arrangement reference for electronic components arranged on the illumination substrate 30. The through hole 30B fits with the small diameter portion 18F of the lens frame 18 when the illumination substrate 30 is stacked on the imaging substrate 10 with a desired interval, and is substantially the same as the small diameter portion 18F of the lens frame 18. It has a shape.

  On the front surface of the illumination substrate 30, an illumination component 31 made of a light emitting element such as a light emitting diode (Light Emitting Diode) that irradiates a subject in front of the illumination substrate 30 is disposed. A total of four illumination components 31 are arranged, one on each of the top, bottom, left, and right so as to surround the through hole 30B. The illumination component 31 is not limited to a light emitting diode, and for example, EL (electroluminescence) can be used. Also, the number is not limited to four.

  As shown in FIGS. 8 and 9, on the rear surface of the illumination board 30, an electronic component 32 for driving the illumination component 31, an electronic component 33 for supplying a stable voltage to the illumination component 31, and a small size are provided. An electronic component 34 such as a capacitor is disposed.

  As shown in FIG. 10, tall electronic components such as the driving electronic component 32 and the electronic component 33 for supplying a stable voltage bend the flexible substrate 12 that connects the imaging substrate 10 and the illumination substrate 30. When the imaging substrate 10 and the illumination substrate 30 are stacked with a desired interval, a short capacitor or resistor disposed on the surface of the imaging substrate 10 facing the illumination substrate 30 (the front surface of the imaging substrate 10). It faces the electronic component 23 such as.

  On the other hand, a short electronic component 34 such as a small capacitor is formed by bending the flexible substrate 12 that connects the imaging substrate 10 and the illumination substrate 30 and arranging the imaging substrate 10 and the illumination substrate 30 to face each other. It faces the tall large capacitor 22 disposed on the surface of the imaging substrate 10 facing the illumination substrate 30 (front surface of the imaging substrate 10).

  That is, in the rigid flexible substrate 2 in which the flexible substrate 12 connecting the imaging substrate 10 and the illumination substrate 30 is bent and the imaging substrate 10 and the illumination substrate 30 are disposed, the tall substrate disposed in front of the imaging substrate 10 is tall. The electronic component 25 for a high drive, the electronic component 33 for supplying a stable voltage, and the small small component for supplying a stable voltage in a manner in which the large capacitor 22, the small small capacitor, and the electronic component 25 such as a resistor are alternately combined. An electronic component 34 such as a capacitor is disposed on the rear surface of the illumination board 30.

  For this reason, the distance between the imaging substrate 10 and the illumination substrate 30 is higher than the sum of the tall electronic components disposed on the front surface of the imaging substrate 10 and the tall electronic components disposed on the rear surface of the illumination substrate 30. Can be narrowed. The flexible substrate 12 is formed longer than the assembly length of the image sensor 13 and the lens support member 14.

  The illuminating board 30 configured in this manner is disposed in opposition to the imaging board 10 with a predetermined interval, and is then electrically insulated and fixed by an adhesive 35 having an insulating property.

  As shown in FIGS. 11 and 12, the switch board 40 has a substantially disk shape like the imaging board 10, and the right edge 40 </ b> A and the left edge 40 </ b> B of the switch board 40 are formed by two parallel sides. Notched. The flexible substrate 11 extending from the right edge of the imaging substrate 10 is connected to the left edge 40B, and the flexible substrate 41 extends from the right edge 40A. For this reason, when the flexible substrate 41 is bent, the deformation of the flexible substrate 41 can be suppressed.

  The right edge portion 40A and the left edge portion 40B, that is, the extending direction of the flexible boards 11 and 41, is an arrangement reference for electronic components arranged on the switch board 40. An oval insertion hole 42 is formed in parallel with the hole.

  A reed switch 43 is disposed on the front surface of the switch substrate 40 so as to sink into the insertion hole portion 42, and the height of the image pickup substrate 10 projecting to the front surface side is suppressed. The reed switch 43 is a latch-type switch, and is turned off in an initial state, and is turned from an off state to an on state by moving away a magnet (not shown) close to the reed switch 43. In addition, electronic components such as a memory 44, a vibrator 45, and a MIX 46 are arranged in an orderly manner so as to surround the reed switch 43.

  The memory 44 stores an initial value of the microprocessor 24, color variation and white balance of the solid-state imaging device 13A, a unique number of the capsule endoscope 1, and the like. The vibrator 45 is stored in the microprocessor 24. Give the basic clock. The MIX 46 is mounted by flip chip bonding, and has a function of mixing two signals of the video signal and the clock signal output from the microprocessor 24 into one signal. A contact 47 that contacts the positive electrode of the battery is provided on the rear surface of the switch substrate 40. The contact 47 is formed of a leaf spring.

  As shown in FIGS. 13 and 14, the power supply board 50 has a substantially disk shape, and the right edge 50 </ b> A and the left edge 50 </ b> B of the power supply board 50 are cut out by two parallel sides. The flexible board 41 extending from the right edge 40A of the switch board 40 is connected to the left edge 50B. For this reason, it is possible to suppress excessive deformation of the flexible substrate when the flexible substrate is bent. Although not shown in the drawing, a contact point that contacts the negative electrode of the battery is provided on the front surface of the power supply substrate 50, and a DCDC converter 51 is provided on the rear surface of the power supply substrate 50. The DCDC converter 51 controls the voltage obtained by the battery 52 in order to obtain a certain voltage necessary for the capsule endoscope 1.

  As shown in FIG. 1, a plurality of (three in the present embodiment) batteries 52 are sandwiched between the power supply board 50 and the switch board 40, and the heat shrinkable tube 53 formed in a ring shape is shrunk. Thus, the battery 52 is integrated between the switch substrate 40 and the power supply substrate 50 in a state of being gripped. An elliptical slit 41 </ b> A is formed in the central portion of the flexible substrate 41, and the flexible substrate 41 adheres along the outer periphery of the battery 52. The battery 52 is a button-type silver oxide battery or the like whose outer shape is a disk shape, and a plurality of the batteries 52 are arranged in series with the negative electrode side facing the power supply substrate 50. The battery 52 is not limited to a silver oxide battery, and for example, a rechargeable battery or a power generation battery may be used.

  A flexible board 54 extends to the right edge 50 </ b> A of the power supply board 50, and a transmission unit 60 is connected to the flexible board 54. The transmission unit 60 is formed independently of the rigid flexible substrate 2 and then connected to the flexible substrate 54 through a through-hole land.

  As shown in FIGS. 15 and 16, the transmission unit 60 includes a transmission board 61 and an antenna board 62, and the transmission board 61 has a substantially disk shape. The right edge portion 61A of the transmission board 61 is cut out by one straight line to form one side, and this one side serves as an arrangement reference for electronic components arranged on the transmission board 61. Electronic components are arranged with this one side as a reference. The antenna substrate 62 is attached to a terminal 63 erected from the rear surface of the transmission substrate 61, and a substantially spiral antenna pattern 64 is formed on the rear surface of the antenna substrate 62. The transmission unit 60 can extract a signal having a certain frequency, amplitude, and waveform from the signal mixed by the switch board 40 and transmit the signal from the antenna board 62 to the outside.

  As shown in FIG. 1, the switch board 40, the imaging board 10, the power supply board 50, and the transmission unit 60 configured as described above are arranged to face each other with a predetermined interval and then have an insulating adhesive 65. Therefore, it is electrically insulated and fixed.

  The laminated rigid flexible substrate 2 constitutes the internal configuration of the capsule endoscope 1, and the laminated rigid flexible substrate 2 is covered with a capsule 70. The capsule 70 has a tip cover 71 and a case 72.

  The front end cover 71 covers the front side of the illumination board 30, has a substantially hemispherical dome shape, and has an open rear side. The tip cover 71 is transparent or translucent, and transmits the illumination light of the illumination component 31 to the outside of the capsule 70 and transmits an image illuminated with the illumination light to the inside of the capsule 70.

  In addition, the opening portion of the tip cover 71 is formed with a connection end portion 71A extending in the opening direction (rearward) over the entire circumference of the opening. The connecting end 71A has a cylindrical shape formed in an inner and outer shape without a draft at the time of molding, and the outer peripheral surface of the connecting end 71A forms a joint surface with the case 72. An endless projection 71B is provided on the joint surface over the entire circumference. The protrusion 71B is provided at an arbitrary position within the overlapping width of the joint surface, for example, at the central position in the overlapping width direction, separated from the end of the connection end 71A of the tip cover 71.

  Further, as shown in FIG. 1, in the distal end cover 71, the base end portion extending from the connection end portion 71A is substantially hemispherical dome-shaped portion covering the front side of the illumination board 30 or the connection end portion 71A. A thick portion 71C having a thick cross section is provided. The thick portion 71C ensures the strength of the connecting end portion 71A of the tip cover 71 and prevents the tip cover 71 from cracking, for example, when dropped.

  Further, in the distal end cover 71, an abutting portion 71D is formed on the inner peripheral surface of the base end portion extending from the connecting end portion 71A. By bringing the illumination substrate 30 into contact with the contact portion 71D, the tip cover 71 and the folded rigid flexible substrate 2 can be positioned in a predetermined positional relationship in the axial direction.

  Further, in the distal end cover 71, the inner diameter of the base end portion extending from the connection end 71 </ b> A has substantially the same diameter as the outer diameters of the illumination board 30 and the imaging board 10. For this reason, the tip cover 71 and the folded rigid flexible substrate 2 can be positioned in the radially outward direction, and the inner peripheral surface of the connection end portion 71A of the tip cover 71 and the outer peripheral surface of the illumination substrate 30 are in contact with each other. The connection end 71A restricts the capsule 70 from being deformed inward.

  When the rigid cover 2 that is folded inside the capsule 70 is accommodated by connecting the tip cover 71 and the case 72, the rigid flexible substrate 2 folded with the inner peripheral surface of the connection end 71 </ b> A of the tip cover 71. Adhesive is injected between and fixed. As described above, when the rigid flexible substrate 2 folded to the front end cover 71 is fixed, the illumination substrate 30 of the rigid flexible substrate 2 is positioned in the front end cover 71.

  The case 72 is a part that covers the rigid flexible substrate 2 folded on the rear side of the tip cover 71. In the case 72, a cylindrical barrel portion 72A and a rear end portion 72B having a substantially hemispherical dome shape are integrally formed, and the front side of the barrel portion 72A is opened. The opening 72C of the case 72 is formed with a connection end 72D extending in the opening direction (front) over the entire circumference of the opening. The connection end portion 72D has a cylindrical shape formed in an inner shape without a draft at the time of molding, and the inner peripheral surface of the connection end portion 72D forms a joint surface with the tip cover 71. The joint surface is provided with an endless groove 72E over the entire circumference. Further, the groove 72E is provided in accordance with the position of the protrusion 71B provided on the tip cover 71. The polymerization width is preferably 3 mm within a range of approximately 1 to 5 mm, and the position where the groove 72E is provided is preferably the center of the polymerization width.

  The protrusion 71B and the groove 72E thus provided engage with each other when the tip cover 71 and the case 72 are overlapped on the joint surface. Thus, the protrusion 71B and the groove 72E hold the state where the tip cover 71 and the case 72 are connected by engagement with each other. Since the projection 71B is provided over the entire circumference of the joining surface and the groove 72E is provided over the entire circumference of the joining surface, the projection 71B and the groove 72E are engaged, and the tip cover 71 and the case 72 are connected. In a state, relative sliding rotation of each joint surface is possible.

  And after apply | coating the resin material 80 to the outer peripheral surface of the folded rigid flexible board | substrate 2 and apply | coating an adhesive agent to the joint surface of the connection end part of the front end cover 71, the joint surface of the joint end part of the front end cover 71, and a case The front end cover 71 and the case 72 are connected by superimposing the joint surfaces of the joint ends of 72. For this reason, the gap between the outer peripheral surface of the folded rigid flexible substrate 2 and the inner peripheral surface of the capsule is filled with a resin material, and the connection surface of the connection end of the tip cover 71 and the connection surface of the connection end of the case 72 The adhesive enters between the two. Thereafter, in a state where the tip cover 71 and the case 72 are connected, the tip cover 71 and the case 72 are relatively slid and rotated, and an adhesive is connected to the joint surface of the connection end of the tip cover 71 and the case 72. Spread between the joints at the ends. As a result, watertightness between the tip cover 71 and the case 72 is ensured, and the entire capsule 70 can be sealed watertight.

  Further, as shown in the figure, the connecting portions appearing on the outer surface side of the capsule in a state where the tip cover 71 and the case 72 are connected are chamfered. This chamfering reduces the step that can occur on the outer surface of the capsule between the tip cover 71 and the case 72, and prevents the step from being caught and generating an external force that separates the tip cover 71 and the case 72. be able to.

  The tip cover 71 is made of cycloolefin polymer, polycarbonate, acrylic, polysulfone or urethane, and particularly preferred for ensuring the optical performance and strength of the cycloolefin polymer or polycarbonate. The case 72 is made of cycloolefin polymer, It is formed of polycarbonate, acrylic, polysulfone or urethane, and polysulfone is particularly preferable for ensuring strength.

  Next, a medical system using the capsule endoscope described above will be described. FIG. 17 is a schematic view of a medical system using a capsule endoscope.

  As shown in FIG. 17, a medical system using a capsule endoscope includes a capsule endoscope 1 housed in a package 100, a jacket 102 to be worn by a patient, that is, an examinee, and a removable jacket 102. A receiver 103 and a computer 104 are included.

  The jacket 102 is provided with antennas 102a, 102b, 102c, and 102d that capture radio waves transmitted from the antenna substrate 62 of the capsule endoscope 1. The capsule 102 is encapsulated via the antennas 102a, 102b, 102c, and 102d. Communication between the mold endoscope 1 and the receiver 103 is possible. Note that the number of antennas 102a, 102b, 102c, and 102d is not limited to four as shown in FIG. A plurality of antennas 102a, 102b, 102c, and 102d can satisfactorily receive radio waves according to the position accompanying the movement of the capsule endoscope 1. Further, the position of the capsule endoscope 1 in the body cavity can be detected by the reception intensity of each antenna 102a, 102b, 102c, 102d.

  The receiver 103 performs white balance processing on captured image data that is sequentially received, and stores the image data that has undergone white balance processing, for example, in a compact flash (R) memory card (CF memory card) 105. Reception by the receiver 103 is not synchronized with the start of imaging of the capsule endoscope 1, and the start and end of reception are controlled by the operation of the input unit of the receiver 103.

  The computer 104 performs reading / writing of the CF memory card 105 and the like. The computer 104 has a processing function for a doctor or nurse (examiner) to perform a diagnosis based on an image of an internal organ of a patient, which is a subject imaged by the capsule endoscope 1. .

  The general operation of the system will be described. First, before starting the inspection, the capsule endoscope is taken out from the package 100. Thereby, the reed switch 43 of the capsule endoscope 1 shifts from the off state to the on state, and the main power supply is turned on. Next, the examinee swallows the capsule endoscope 1 from the mouth. Thereby, the capsule endoscope 1 passes through the esophagus, advances in the body cavity by the peristaltic movement of the digestive tract cavity, and sequentially captures images in the body cavity. The capsule endoscope 1 outputs radio waves of the captured image as the imaging result as necessary or as needed. This radio wave is captured by the antennas 102a, 102b, 102c, and 102d of the jacket 102. The captured radio waves are relayed from the antennas 102a, 102b, 102c, and 102d to the receiver 103 as signals. Next, when the observation (examination) of the subject by the capsule endoscope is completed, the CF memory card 105 storing the captured image data is taken out from the receiver 103 and inserted into the memory card insertion hole of the computer 104. The computer 104 reads the captured image data stored in the CF memory card 105 and stores the captured image data corresponding to each patient.

  In the capsule endoscope 1 according to the above-described embodiment, the illumination board 30, the imaging board 10, the switch board 40, and the power board 50 are connected in a straight line by the flexible boards 11, 12, and 41. When the substrates 11, 12, and 41 are bent, the illumination substrate 30, the imaging substrate 10, the switch substrate 40, and the power supply substrate 50 may be positioned in this order. For example, if they are on the same plane, they are necessarily connected on a straight line. It doesn't have to be a thing.

  According to the capsule endoscope 1 described above, since the image sensor 13 is disposed with reference to the extending direction of the flexible substrates 11 and 12, the image sensor 13 is configured using the extending direction of the flexible substrates 11 and 12 as an index. It can be easily inspected whether or not it is disposed at an appropriate position.

  In addition, since the image sensor 13 is arranged with the extending direction of the flexible substrates 11 and 12 and the pixel arrangement direction aligned, the electronic components 22 and 23 for driving the image sensor 13 can be arranged to coincide with the pixel arrangement direction. The degree of integration of the electronic components 22 and 23 can be increased. For this reason, the capsule endoscope 1 can be further downsized.

  In addition, since the electronic components 22 and 23 for driving the image sensor 13 are disposed using the image sensor 13 as a disposition reference, the degree of integration of the electronic components 22 and 23 can be increased. For this reason, the capsule endoscope 1 can be further downsized.

1 is a side cross-sectional view illustrating a configuration of a capsule endoscope as an application example of an endoscope imaging apparatus according to an embodiment of the present invention. FIG. 2 is a developed top view of the rigid flexible substrate shown in FIG. 1. It is the bottom view which developed the rigid flexible substrate shown in FIG. It is the figure which showed the front surface of the imaging substrate. It is side sectional drawing which attached the lens attachment member to the imaging substrate. It is the figure which showed the rear surface of the imaging substrate. It is the figure which showed the front surface of the illumination board | substrate. It is the figure which showed the rear surface of the illumination board | substrate. It is a sectional side view of an imaging board. It is the sectional side view which showed the lamination | stacking state of the imaging substrate and the illumination board | substrate. It is the figure which showed the front surface of the switch board. It is a sectional side view of a switch board. It is the figure which showed the rear surface of the power supply board. It is a sectional side view of a power supply board. It is a sectional side view of a transmission unit. It is the figure which showed the rear surface of the transmission unit. It is a schematic diagram of a medical system using a capsule endoscope.

Explanation of symbols

1 Capsule Endoscope 2 Rigid Flexible Substrate 10 Imaging Substrate (Rigid Substrate)
10A Right edge 10B Left edge 11 Flexible substrate 12 Flexible substrate 13 Image sensor 13A Solid-state imaging device 13B Cover glass 14 Lens support member 15 Small diameter lens 16 Large diameter lens 17 Holder 18 Lens frame 19 Adhesive 20 Spacer 21 Adhesive 22 Large Capacitor 23 Electronic component 24 Microprocessor 25 Electronic component 30 Lighting board (rigid board)
40 Switch board (rigid board)
41 Flexible substrate 50 Power supply substrate (rigid substrate)
54 Flexible substrate 60 Transmitting unit

Claims (5)

In an endoscope imaging device including a rigid flexible substrate obtained by bending a flexible substrate extending from a rigid substrate on which an image sensor is disposed,
An imaging apparatus for an endoscope, wherein an image sensor is disposed on a rigid substrate with reference to an extending direction of the flexible substrate with respect to the rigid substrate.   2. The endoscope image pickup apparatus according to claim 1, wherein the image sensor is disposed such that an extending direction of the flexible substrate with respect to the rigid substrate coincides with a pixel arrangement direction of the image sensor.   The endoscope imaging apparatus according to claim 1 or 2, wherein an electronic component for driving the image sensor with the image sensor as a reference is disposed on a rigid substrate.   The image sensor has an outer peripheral shape having two sides parallel to each other, and the image sensor is arranged so that the extending direction of the flexible substrate with respect to the rigid substrate and the two parallel sides provided in the image sensor are parallel to each other. The endoscope imaging apparatus according to claim 1, wherein the endoscope imaging apparatus is provided. Using the image sensor as an arrangement reference, an electronic component for driving an image sensor having an outer peripheral shape having two sides parallel to each other is divided into two sides that are parallel to the electronic component and two sides that are parallel to the image sensor. The endoscope imaging apparatus according to claim 4, wherein the electronic component is disposed on a rigid substrate so that the two are parallel to each other.

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