JP2005203694A - Solder sucker - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solder sucker by which removal and touch-up of an electronic component are performed easily in a short time. <P>SOLUTION: A solder melting nozzle 3 is set for solder 40 on the lead 21a of an electronic component 21 from the upside of a printed circuit board 20, a solder sucking nozzle 11 is set for the solder 40 on the lead 21a of the electronic component 21 from a downside of the printed circuit board 20, adequate temperature for solder melting and air blasting time are constantly set for solder melting by a solder melting control part 5, hot blast supplied from a hot blast generation/supply part 6 is injected to the solder 40 for solder melting, sucking timing and sucking time are set by a solder sucking control part 13; and melted solder 40 is sucked through the sucking nozzle 11 using sucking force generated by a sucking force generation part 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a solder sucking device that enables melting and sucking of solder on a printed circuit board when replacing or removing an electronic component mounted on the printed circuit board by soldering.

  As shown in FIG. 4, the electronic component 21 mounted on the printed circuit board 20 is a highly integrated circuit IC, a capacitor, a resistor, a transformer, a connector, and the like. The circuit configuration is such that a certain condition is calculated from the signal, the result is judged, and a command is issued.

  In recent years, in particular, the mounting density of the electronic components 21 has increased, and the printed circuit board 20 on which the electronic components 21 are mounted has also been reduced in size, so that the circuit formation is also a multilayered printed circuit board. ing.

  In the parts replacement operation performed there, the conventional solder sucking device 30 shown in FIG. 5 has been used. The solder sucker 30 is provided with a solder sucker nozzle 31 at the tip of the solder rod 30A, melts the solder 40 with the heat of the solder rod 30A, and sucks the melted solder 40 by the suction force of the solder sucker suction portion 32. It is what I did.

  As shown in FIG. 6, the tip 33 a of the solder rod 33 is applied from one of the through holes 22 of the printed circuit board 20, and the solder suction nozzle 35 of the solder sucker 34 is applied from the other of the through holes 22. The solder 40 is melted by the heat of the solder rod 33, and the melted solder 40 is sucked by the sucking nozzle 35.

  Further, as shown in FIG. 9, there is a method using a local soldering device 36 for removing the electronic component 21. The local soldering device 36 is provided with a local soldering nozzle 38 at the center of the mounting portion 37 on which the printed circuit board 20 is placed, and a support post 39A is provided at the rear of the mounting portion 37, and the target lamp 39 is held by the support post 39A. This is the configuration.

  Then, as shown in FIGS. 10 and 11, the printed circuit board 20 on which the electronic component 21 to be replaced is mounted is set on the mounting portion 37, and the solder 41 is jetted from the local soldering nozzle 38, and the solder is generated by the heat. 40 is melted while the electronic component 21 is extracted from the upper part.

In addition, as a conventional solder sucking device, a solder sucker of a type in which a solder sucking nozzle is provided at the tip of the solder rod and the solder melted by the heat of the solder rod is sucked by a pump is put into practical use and used. (See Patent Document 1).
Japanese Patent Laid-Open No. 11-104823 (page 6, FIG. 1)

  In the conventional solder sucking device 30 shown in FIG. 5, even if the solder 40 melted by the heat of the soldering iron is sucked, the printed circuit board 20 is deprived of heat and the solder 40 does not melt. There is a problem that the solder 40 cannot be sucked up easily by the heat capacity of the soldering iron.

  Further, in the solder sucking method shown in FIG. 6 described above, a long time is taken to force the solder 40 to melt by applying the tip 33a of the solder rod 33 to the through hole 22 of the printed circuit board 20. 7 and 8, as shown in FIG. 7 and FIG. 8, peeling a or deficiency b may occur in the through hole 22 of the printed circuit board 20, and further, a damaged portion c may occur in the base material of the printed circuit board 20, Due to these damages, there is a problem that the entire printed circuit board 20 on which the other electronic components 21 are mounted becomes unusable.

  Further, in the case of using the local soldering device 36 shown in FIG. 9 for the removal of the electronic component 21 described above, the solder 40 remains in the through hole 22 and is blocked, so that it is further shown in FIG. The solder sucking operation is performed using the solder sucking device 3, and it takes time to remove the electronic component 21. In addition, when the electronic component 21 that is a replacement component is a multi-pin, there has been a problem that the above-described blotting operation takes an enormous amount of time and is inefficient.

  Further, in the solder sucking device disclosed in Patent Document 1 described above, even if the solder melted by the heat of the soldering iron is sucked, the printed circuit board is deprived of heat and the solder does not melt, There was a problem that solder could not be easily absorbed by the heat capacity of the soldering iron.

  The present invention has been made in order to solve the above-described problems, and the object of the present invention is to make it possible to melt and easily absorb the solder of the printed circuit board so that it is easy and short. It is an object of the present invention to provide a solder sucking device capable of removing and correcting electronic components in time.

  In order to achieve the above object, a solder sucking device according to the present invention is a solder sucking device that melts solder of a lead portion of an electronic component mounted on a printed circuit board and sucks the melted solder, A solder melting means for melting the solder and a molten solder suction means for sucking the molten solder melted by the solder melting means are provided, and the solder melting means and the molten solder suction means are independent of each other.

  With this configuration, in the operation of removing the electronic component mounted on the printed circuit board, the solder melting operation and the solder sucking operation of the lead portion of the electronic component can be performed simultaneously, and the electronic component can be easily removed in a short time. Correction work can be performed.

  Further, the solder blotting apparatus according to the present invention is the solder blotting apparatus according to the present invention described above, wherein the solder melting means generates a hot air to the solder melting nozzle that jets the hot air to the solder, and this hot air is used as the solder melting nozzle. A hot air generating / supplying section, and a solder melting control section for controlling the temperature, air volume, and blowing time of the hot air, and the molten solder suction means includes a solder suction nozzle for sucking molten solder, and this solder suction. A suction force generation unit that generates the suction force of the nozzle and a solder suction control unit that controls the suction timing and suction time of the solder suction nozzle are provided.

  With this configuration, the solder melting nozzle is set on the solder of the lead part of the electronic component from above the printed circuit board, and the solder suction nozzle is set on the solder of the lead part from below the printed circuit board. In order to melt the solder, set a certain solder melting proper temperature and blowing time, blow the hot air supplied from the hot air generation / supply part toward the solder of the electronic component, melt the solder, and the solder suction control part By setting the suction timing and suction time, the molten solder can be sucked from the solder suction nozzle with the suction force generated by the suction force generation part, and the solder melting work and solder sucking work of the lead part of the electronic component can be performed Can be done simultaneously. In addition, since the solder melting nozzle and the solder suction nozzle can set the operation time of the solder melting nozzle and the solder suction nozzle, damage to the printed circuit board and electronic parts due to excessive application of the solder melting nozzle and the solder suction nozzle Can be prevented.

  The solder sucking device according to the present invention is the solder sucking device according to the present invention described above, wherein the hot air generating / supplying unit includes a heater, a blower that sends out the heat generated by the heater as hot air, and hot air from the solder melting nozzle. The solder melting control unit is composed of a temperature controller that adjusts the temperature of the heater, and a timer that sets the heating time of the heater and the driving time of the blower, and the suction force The generating part is constituted by a vacuum pump, and the solder suction control part is constituted by a timer for controlling the suction timing and time of the vacuum pump.

  With this configuration, the hot air generation / supply unit can send out the heat generated by the heater as hot air with the blower and guide the hot air to the solder melting nozzle through the blower tube. The solder melting control unit is a temperature controller. By adjusting the temperature of the heater, the heating time of the heater and the driving time of the blower can be set with a timer. The suction force generation unit generates suction force by driving the vacuum pump, and the solder suction control unit can control the suction timing and time of the vacuum pump with the timer.

  Moreover, the solder sucking device according to the present invention is the above-described solder sucking device according to the present invention, wherein the molten solder suction means has a filter for collecting the molten solder sucked by the solder suction nozzle.

  With this configuration, the molten solder suction means can collect the solder sucked by the solder suction nozzle with the filter.

  According to the solder blotting device according to the present invention, in the operation of removing the electronic component mounted on the printed circuit board, the solder melting operation and the solder blotting operation of the lead part of the electronic component can be performed at the same time. Electronic parts can be removed and corrected in a short time.

  Further, according to the solder sucking device according to the present invention, the solder melting nozzle and the solder suction nozzle can set the operating time of the solder melting nozzle and the solder suction nozzle, so that the solder melting nozzle and the solder suction nozzle can be set. Damage to the printed circuit board and electronic components due to excessive application can be prevented.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is an explanatory view showing a state where an electronic component is removed by melting the solder of the lead part of the electronic component by using the solder blotting device according to the present invention, and FIG. 2 is a diagram of melting the through-hole solder by the solder blotting device. FIG. 3 is an explanatory view showing a state in which molten solder is sucked by the solder sucking device.

  The solder sucking device according to the present invention includes a solder melting device 1 constituting a solder melting means and a molten solder suction device 2 constituting a molten solder suction means.

  The solder melting apparatus 1 includes a solder melting nozzle 3, a hot air generation / supply unit 4 that generates hot air and supplies the hot air to the solder melting nozzle 3, and solder melting control that controls the temperature, air volume, and blowing time of the hot air. Part 5.

  The solder melting nozzle 3 has a hot air introduction port 3B at the base and an injection port 3A at the tip for injecting hot air toward the soldered portion of the electronic component. It is a nozzle that can be heated without adding.

  The hot air generation / supply unit 4 includes a heater 6, a blower 7 that sends out heat generated by the heater 6 as hot air, and a blower tube 8 that guides the hot air to the solder melting nozzle 3. Further, the solder melting control unit 5 includes a temperature controller 9 that adjusts the temperature of the heater 6 and a timer 10 that sets the heating time of the heater 6 and the driving time of the blower 7, and sets and stores each condition. It is a device that can.

  The hot air outlet 4 </ b> A of the hot air generating / supplying unit 4 is connected to one end of the blower tube 8, and the other end of the blower tube 8 is connected to the hot air introducing port 3 </ b> B of the solder melting nozzle 3.

  As shown in FIG. 2, the molten solder suction apparatus 2 includes a solder suction nozzle 11 that sucks molten solder, a suction force generation unit 12 that generates a suction force of the solder suction nozzle 11, and a suction timing of the solder suction nozzle 11. And a solder suction control unit 13 for controlling the suction time and a filter 14 for collecting the molten solder sucked by the solder suction nozzle 11.

  The solder suction nozzle 11 has a molten solder outlet port portion 11B at the base portion and a wide suction port 11A at the tip portion for sucking the molten solder, and aims to suck the molten solder. This is a nozzle.

  Further, the suction force generation unit 12 is configured by a vacuum pump 12A, and the solder suction control unit 13 includes a timer 13A and a control circuit 13B for controlling the suction timing and suction time of the solder suction nozzle 11, as shown in FIG. The suction force generator 12 and the solder suction controller 13 are housed in a suction box 16. The suction box 16 is provided with a suction port 16 </ b> A connected to the suction force generator 12.

  A filter 14 is attached to the molten solder outlet port 11B of the suction nozzle 11 by an attachment member 15. One end of the suction tube 17 is connected to the suction port 16 </ b> A of the suction box 16, and the other end of the suction tube 17 is connected to the attachment member 15.

  A plurality of electronic components 21 are mounted on the printed circuit board 20. In this mounting, each lead part 21a of the electronic component 21 is inserted into a through hole 22 provided in the printed circuit board 20, and the lead part 21a is inserted into the through hole 22 by solidifying the solder 40 filled in the through hole 22. It is done by sticking to.

  Next, the removal of the electronic component 21 and the solder blotting operation by the solder blotting apparatus configured as described above will be described.

  First, as shown in FIG. 1, an electronic component 21 to be replaced with a printed circuit board 20 is set above the suction port 11A of the solder suction nozzle 11, and the solder melting nozzle 3 is placed above the lead portion 21a of the electronic component 21. Set.

  Then, the heat generated by the heater 5 is sent as hot air by driving the blower 6 and sent to the solder melting nozzle 3 through the blower tube 8. When the solder 40 is melted by the hot air from the solder melting nozzle 3, the electronic component 21 is pulled out from above. The heating time is a time set by the timer 10 of the solder melting control unit 5.

  Next, as shown in FIG. 2, with the electronic component 21 removed from the printed circuit board 20, the solder 40 in the through hole 22 is again heated and melted by the solder melting nozzle 3.

  When the solder 40 is melted, the vacuum pump 12A of the solder suction control unit 12 in the molten solder suction device 2 is operated and the solder 5 melted by the solder suction nozzle 11 is sucked. The timing of solder suction is controlled by the timer 13A.

  Next, as shown in FIG. 3, the sucked solder 40 is collected on the filter 14, and the solder sucking operation is completed. The attachment member 15 is removed from the molten solder outlet 11B of the suction nozzle 11, and the filter 14 is taken out and cleaned.

  As described above, according to the embodiment of the present invention, the solder melting nozzle 3 is set on the solder 40 of the lead portion 21a of the electronic component 21 from above the printed circuit board 20, and the lead is formed from below the printed circuit board 20. The solder suction nozzle 11 is set on the solder 40 of the portion 21a, the solder melting control unit 5 sets a certain solder melting appropriate temperature and blowing time for the purpose of solder melting, and hot air supplied from the hot air generation / supply unit 6 Is ejected toward the solder 40 to melt the solder, the suction timing and the suction time are set by the solder suction control unit 13, and the molten solder is discharged from the solder suction nozzle 11 by the suction force generated by the suction force generation unit 12. It is possible to suck and to perform the melting operation of the solder 40 of the lead portion 21a of the electronic component 21 and the solder sucking operation at the same time. In it is possible to carry out the removal and modification work of the electronic component 21.

  In addition, since the operation time of the solder melting nozzle 5 and the solder suction nozzle 11 can be set by the solder melting control unit 5 and the solder suction control unit 13, a printed circuit caused by excessive application of the solder melting nozzle 5 and the solder suction nozzle 11. Damage to the plate 20 can be prevented. In addition, the solder melting control unit 5 and the solder suction control unit 13 are used as one control unit, so that the electronic component 21 can be more efficiently removed by linking the solder melting control and the solder suction control. .

  Further, in the solder sucking operation after the electronic component 21 of the printed circuit board 20 is previously removed by an existing device (for example, the conventional solder sucking device described with reference to FIG. 5), the solder sucking operation according to the above-described embodiment of the present invention is performed. It is possible to perform solder heating and solder suction simultaneously in the apparatus. In this case, it is possible to work easily and in a short time.

  The solder blotting device of the present invention can perform the solder melting operation and the solder blotting operation of the lead part of the electronic component at the same time in the operation of removing the electronic component mounted on the printed circuit board. It has the effect that it can be removed and repaired, and when replacing electronic components mounted on a printed circuit board by soldering, the printed circuit board solder can be melted and easily sucked out. Useful for solder blotting devices.

It is explanatory drawing which shows the state which melts the solder of the lead part of an electronic component using the solder blotting apparatus which concerns on this invention, and removes an electronic component. It is explanatory drawing which shows the state which melted the solder of the through hole with the solder blotting device. It is explanatory drawing which shows the state which attracted the molten solder with the solder blotting apparatus. It is a perspective view which shows the structure of a printed circuit board. It is explanatory drawing which shows the solder blotting operation | work using the conventional solder blotting apparatus. It is explanatory drawing of the solder blotting operation | work by the conventional solder blotting apparatus. It is explanatory drawing of the printed circuit board damage by the solder blotting by the conventional solder blotting apparatus. It is explanatory drawing of the printed circuit board damage by the solder blotting by the conventional solder blotting apparatus. It is the perspective view which showed the external appearance of the local soldering apparatus. It is explanatory drawing which shows the operation | work which removes an electronic component using a local soldering apparatus. It is explanatory drawing which shows the operation | work which removes an electronic component using a local soldering apparatus.

Explanation of symbols

1 Solder melting equipment (solder melting means)
2 Molten solder suction device (molten solder suction means)
3 Solder Melting Nozzle 4 Hot Air Generation / Supply Unit 5 Solder Melting Control Unit 6 Heater 7 Blower 8 Blower Tube 9 Temperature Controller 10 Timer 11 Solder Suction Nozzle 12 Suction Force Generation Unit 13 Solder Suction Control Unit 14 Filter 15 Mounting Member 16 Suction Box 20 Printed circuit board 21 Electronic component 21a Lead part 22 Through hole 40 Solder

Claims (4)

A solder blotting device for melting the solder of the lead portion of the electronic component mounted on the printed circuit board and sucking out the melted solder,
A solder melting means for melting the solder; and a molten solder suction means for sucking the molten solder melted by the solder melting means, wherein the solder melting means and the molten solder suction means are independent of each other. Solder suction device. The solder melting means includes a solder melting nozzle that injects hot air onto the solder, a hot air generation / supply unit that generates the hot air and supplies the hot air to the solder melting nozzle, and the temperature, air volume, and blowing of the hot air. A solder melting control unit that controls time,
The molten solder suction means includes a solder suction nozzle that sucks the molten solder, a suction force generation unit that generates a suction force of the solder suction nozzle, and a solder suction control that controls a suction timing and a suction time of the solder suction nozzle. The solder sucking device according to claim 1, further comprising a portion. The hot air generation / supply unit includes a heater, a blower that sends out the heat generated by the heater as the hot air, and a blower tube that guides the hot air to the solder melting nozzle. A temperature controller for adjusting the temperature of the heater, and a timer for setting the heating time of the heater and the driving time of the blower,
3. The solder suction according to claim 2, wherein the suction force generation unit is configured by a vacuum pump, and the solder suction control unit is configured by a timer that controls suction timing and time of the vacuum pump. apparatus. The solder sucking device according to claim 2 or 3, wherein the molten solder suction means includes a filter that collects the molten solder sucked by the solder suction nozzle.

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