JP2005203640A - Device and method for deciding process conditions, device and method for deciding exposure conditions and program - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a process conditions deciding device which supplements a shortage of historical data required for feedback, while suppressing an impact made by differences between a plurality of processing equipment and processing members on a decision of process conditions. <P>SOLUTION: The process conditions deciding device includes historical data retaining portion 112 which stores the historical data of already processed lots; a retaining portion 113 of equipment affinity information which stores an affinity between the processing equipment; a retaining portion 114 of reticle affinity information which stores an affinity between the processing members; a data acquisition portion 123 which acquires the historical data of the already processed lots using the processing equipment and the processing members to be used for processing unprocessed lots, and acquires the historical data of the already processed lots which are processed in combination where either of the processing equipment and the processing members to be used for the unprocessed lots is identical but the other is better in affinity; and a conditions computing portion 124 which decides the process conditions based on the historical data. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a technology for controlling process conditions for processing product materials by MBPC (Model Based Process Control) in the manufacture of electronic device products, and in particular, in a manufacturing factory where a plurality of processing apparatuses are installed, The present invention relates to a technique for determining process conditions in a processing step that selectively uses the processing apparatus.

In manufacturing factories that manufacture electronic device products such as semiconductor products and liquid crystal panels, in order to manufacture products with high accuracy, process data of processed lots and measurement data of processing results (hereinafter collectively referred to as history data) are modeled. A process condition determining apparatus that determines a process condition for processing an unprocessed lot by feedback using an equation is used.
As an example of the process condition determining apparatus, there is an exposure condition determining apparatus that determines a process condition (exposure condition) in an exposure process in manufacturing a semiconductor product.

For example, Patent Document 1 discloses a technique for determining an exposure condition by MBPC.
In a semiconductor product manufacturing factory, an exposure process for forming a specific wiring layer (mask layer) of a specific product is not always processed by the same exposure apparatus. Processed.
There is a difference in controllability between processing apparatuses such as an exposure apparatus, and even if processing is performed under the same process conditions, there is a fine difference in processing results between apparatuses. In processing steps that require high accuracy, such as exposure steps, it is necessary to consider the influence of such differences between apparatuses on the processing results. Similarly, it is necessary to consider the influence of differences between processing members such as an exposure original (reticle) used together with the exposure apparatus on the processing result.

Therefore, in the conventional process condition determining apparatus, only history data of processed lots processed using the same processing apparatus and processing members as those used for processing of unprocessed lots is used for feedback. In addition, the influence of differences between apparatuses and processing members on the determination of process conditions is suppressed.
Japanese Patent Laid-Open No. 11-260683

However, in the determination of process conditions by MBPC, if the number of history data used for feedback is small, the influence of errors increases.
Therefore, if only processed lots processed with the same processing equipment and processing members used for processing unprocessed lots are used to determine process conditions, the number of history data that can be used is insufficient, and the process is calculated by feedback. There is a problem that the accuracy of conditions deteriorates.

In particular, the situation is serious in the current electronic device product manufacturing factories where the number of products is decreasing.
In view of such problems, the present invention suppresses the influence of differences between processing apparatuses and processing members on the determination of process conditions, and can compensate for the shortage of history data required for feedback, and exposure conditions An object is to provide a determination device, a process condition determination method, an exposure condition determination method, and a program.

  In order to achieve the above object, the process condition determining apparatus according to the present invention selects a combination from a combination of a plurality of processing apparatuses and a plurality of processing members to process an unprocessed lot. A process condition determining device for determining a process condition of the processing device, and compatibility between the processing device and storage means for storing history data including the process condition used in the already processed lot and the processing result under the condition And the compatibility storage means for storing the compatibility between the processing members, and the combination of the processing device and the processing member to be used for processing the unprocessed lot, when the combination of the processed lot related to the combination has been selected in the past First acquisition means for acquiring history data, history data of a processed lot in which one of the processing apparatus and the processing member according to the combination is used, with reference to the compatibility storage means and the other Second acquisition means for acquiring history data of processed lots related to combinations with compatible ones, and determination means for determining process conditions for processing unprocessed lots based on the acquired history data It is characterized by providing.

  By the way, the processing technology for semiconductor products has been refined year by year, and the process rules have reached the nanometer (nm) order. Along with this, the accuracy of MBPC is required to be further improved, but the accuracy of the process conditions that can be controlled by the conventional method has reached its limit. It is expected that process conditions will be out of control.

  Therefore, the exposure condition determining apparatus according to the present invention selects the combination of a plurality of exposure apparatuses and a plurality of reticles to perform exposure of an unprocessed lot and exposes the exposure conditions of the exposure apparatus related to the combination. Is an exposure condition determining apparatus for determining the history of the exposure data used in the already processed lot and the processing result under the condition, and the storage means for storing the history data. History data of a processed lot related to the same combination as the exposure apparatus and reticle combination, and the combination of the alignment destination exposure apparatus and alignment destination reticle used to form the alignment destination mask layer for aligning the exposure position is an unprocessed lot Acquisition means for acquiring from the storage means history data of a processed lot that is the same as the combination used for forming the matching destination mask layer, and based on the acquired history data. There are, characterized in that it comprises a determination means for determining an exposure condition for exposing the untreated lot.

  With the above configuration, the process condition determination apparatus according to the present invention calculates the process condition with high accuracy when there is no history data of a processed lot having the same combination of the processing apparatus and the processing member, or the number of data in the history data. Even if the number of cases required is not sufficient, the history data of processed lots processed with a combination that has little influence on the determination of process conditions due to differences between processing units and processing members can be used to reduce the number of data items. Can be supplemented.

Therefore, it is possible to determine highly accurate process conditions with a sufficient number of data while suppressing the influence of differences between processing apparatuses and processing members on the determination of process conditions, which contributes to improving the yield of products. it can.
In addition, the process condition determination device further compares the history data of the processed lots related to the first combination with the history data of the processed lots related to the second combination, and the processing devices related to both combinations are the same. When the processing members are different and the processing results of both are similar, it is determined that the processing member according to the first combination and the processing member according to the second combination are compatible, and the processing according to the combination of both. A compatibility determination unit that determines that the processing device according to the first combination and the processing device according to the second combination are good when the members are the same, the processing devices are different, and the processing results of both are similar. It may be provided.

Thereby, the compatibility between the processing apparatuses and the compatibility between the processing members can be individually determined.
Therefore, even when there is no processed lot processed with the combination used for processing the unprocessed lot, it is possible to infer a combination similar in processing result to the combination used for processing the unprocessed lot.

Further, determination of process conditions in the determining means requires history data of a predetermined number or more, and the history data used for determining the process conditions in the determining means is new one of the acquired history data. To the predetermined number.
As a result, when the number of acquired history data exceeds the number necessary to determine highly accurate process conditions, the history data to be used is narrowed down to the required number and the latest ones, thereby reducing the process conditions. It is possible to calculate process conditions with high accuracy while effectively reducing the amount of calculation required to determine.

  The exposure condition condition determining apparatus according to the present invention selects the combination of a plurality of exposure apparatuses and a plurality of reticles to perform exposure of an unprocessed lot, and sets the exposure conditions of the exposure apparatus related to the combination. An exposure condition determining apparatus for determining, a storage means for storing history data including exposure conditions used in already processed lots and processing results under the conditions, and exposure to be used for processing of unprocessed lots The history data of a processed lot related to the same combination of the apparatus and the reticle, and the combination of the alignment destination exposure apparatus and alignment destination reticle used to form the alignment destination mask layer for aligning the exposure position is the unprocessed lot. Based on the acquired history data, the acquisition means for acquiring the history data of the processed lot that is the same as the combination used for forming the matching destination mask layer from the storage means , Characterized in that it comprises a determination means for determining an exposure condition for exposing the untreated lot.

Thus, the exposure condition condition determining apparatus according to the present invention takes into account the state of a lot to be put into the exposure process based on the difference between the alignment destination exposure apparatuses on which the alignment destination mask layer is formed and between the alignment destination reticles. The exposure conditions can be determined with higher accuracy.
In addition, the exposure condition determining apparatus further includes compatibility storage means for storing compatibility between exposure apparatuses, compatibility between reticles, compatibility between alignment destination exposure apparatuses, and compatibility between alignment destination reticles, and processing of unprocessed lots. History data of processed lots related to the same combination as the exposure apparatus and reticle to be used, and either one of the alignment destination exposure apparatus and alignment destination reticle used for forming the alignment destination mask layer, The history data of the processed lot that is the same as that used for forming the matching mask layer of the unprocessed lot, and the other is compatible with the one used for forming the matching mask layer of the unprocessed lot. Further, an additional acquisition unit that acquires from the storage unit may be provided.

  Thereby, when there is no history data of processed lots that match the combination of the exposure apparatus and the reticle, or when the number of data of history data is less than the number necessary to calculate the exposure conditions with high accuracy, Insufficient number of data can be compensated for with historical data of processed lots processed with a combination in which the difference between exposure apparatuses and reticles has little influence on the determination of exposure conditions.

Therefore, it is possible to determine the exposure conditions with a sufficient number of data and high accuracy while suppressing the influence of the difference between the exposure apparatuses and the reticles on the determination of the exposure conditions, which can contribute to the improvement of the product yield. .
In addition, determination of exposure conditions in the determination unit requires history data of a predetermined number or more, and the history data used for determination of exposure conditions in the determination unit is new one of the acquired history data. To the predetermined number.

  As a result, when the number of acquired history data exceeds the number necessary to determine highly accurate exposure conditions, the history data to be used is narrowed down to the required number and the latest ones, so that A highly accurate exposure condition can be calculated while effectively reducing the amount of calculation required for the determination.

1. Embodiment 1
The present invention can be applied to a process condition determining apparatus generally used in a manufacturing factory that manufactures electronic device products such as semiconductor products and liquid crystal panels. In the present embodiment, exposure is performed as an example of such a process condition determining apparatus. The condition determination device is taken up.
The exposure condition determining apparatus according to the present embodiment will be described below with reference to the drawings.

1.1. Manufacturing Process In a manufacturing process for manufacturing a semiconductor product, a plurality of wiring layers are formed on a semiconductor wafer. Each wiring layer is formed by exposing a mask pattern to a resist applied on a semiconductor wafer and etching the semiconductor wafer based on the pattern.
FIG. 1 is a diagram schematically showing a manufacturing process according to the first embodiment.

  The manufacturing process includes other processing steps such as etching in addition to the exposure step. Here, the Nth mask layer (hereinafter referred to as the Nth layer) is formed in the exposure step that is the subject of the present invention. An Nth exposure process 10 and an N + m exposure process 20 for forming an N + mth mask layer (hereinafter referred to as an N + m layer) are illustrated. FIG. 1 also shows exposure condition determining apparatuses 100 and 200 that determine the exposure conditions of the Nth exposure process 10 and the N + m exposure process 10 included in the manufacturing process in addition to the manufacturing process.

1.1.1. Nth exposure step 10
The Nth exposure process 10 is an exposure process for forming an Nth layer on a semiconductor wafer, and any one of the exposure / development apparatus group 11 and any one of the reticle group 12; Processing is performed using the alignment deviation measuring device 13 and the line width measuring device 14. As the exposure / development apparatus and reticle used here, an empty apparatus and reticle are selected for each lot.

Each device (11a to 11c) constituting the exposure / development device group 11 has the same function, but even when exposure is performed under the same exposure conditions, a difference in processing results occurs between the devices.
Each apparatus of the exposure / development apparatus group 11 notifies the exposure condition determining apparatus 100 of the lot number, the identification number of the own apparatus, and the identification number of the reticle to be used when processing is started, and requests transmission of the exposure conditions. In response to this request, the exposure condition determining apparatus 100 transmits an exposure amount, an alignment correction value (offset, shot magnification, shot rotation, wafer rotation) and the like as exposure conditions. The exposure / development apparatus that has received the exposure conditions adjusts the alignment of the semiconductor wafer using the exposure conditions to form the Nth layer.

  Each of the reticles (12a to 12c) constituting the reticle group 12 is an exposure master of the Nth layer having the same mask pattern, but even when used for exposure under the same exposure conditions, There is a difference in processing results. Each of the reticles 12a to 12c includes an alignment mark mask pattern in addition to the Nth layer wiring mask pattern, and the wiring pattern and the alignment mark are formed on the exposed and developed semiconductor wafer.

For the semiconductor wafer on which the Nth layer is exposed and developed, the misalignment measuring device 13 measures the misalignment of the exposure position of the mask pattern, and the line width measuring device 14 measures the line width of the mask pattern. These measurement data are transmitted from the alignment deviation measuring device 13 and the line width measuring device 14 to the exposure condition determining device 100.
1.1.2. N + m exposure step 20
The N + m exposure step 20 is an exposure step of forming an N + m layer on a semiconductor wafer processed through other processing steps after the processing in the Nth exposure step 10. 1, any one of the reticle groups 22, an alignment deviation measuring device 23, and a line width measuring device 24. As in the Nth exposure step 10, as the exposure / development apparatus and reticle used here, an empty apparatus and reticle are selected for each lot.

Similarly to the exposure / development apparatus group 11, the exposure / development apparatus groups (21a to 21c) constituting the exposure / development apparatus group 21 differ in processing results even when exposed under the same exposure conditions. Occurs.
Each apparatus in the exposure / development apparatus group 21 notifies the exposure condition determining apparatus 200 of the lot number, the identification number of the own apparatus, and the identification number of the reticle to be used when starting the processing, and requests transmission of the exposure conditions. Each device of the exposure / development device group 21 that has received the exposure condition transmitted from the exposure condition determination device 200 in response to the request sets the exposure condition for the alignment mark formed on the semiconductor wafer in the Nth exposure step. Use to adjust alignment and expose.

Each of the reticles (22a to 22c) constituting the reticle group 22 is an exposure original of the (N + m) th layer having the same mask pattern. However, similarly to the reticle group 12, a difference occurs in processing results between the reticles.
For the semiconductor wafer on which the N + m layer is exposed and developed, the misalignment measuring device 23 measures the misalignment of the exposure position of the mask pattern, and the line width measuring device 24 measures the line width of the mask pattern. These measurement data are transmitted from the misalignment measuring device 23 and the line width measuring device 24 to the exposure condition determining device 200.

  In the exposure position adjustment (alignment adjustment) in the exposure process, in general, the alignment is adjusted not on the outer shape of the semiconductor wafer but on the previously processed mask layer. A mask layer including an alignment mark used for alignment adjustment in a specific exposure process is referred to as an alignment destination mask layer for the specific exposure process. At this time, the mask layer which is the alignment destination of the exposure position is not necessarily the mask layer processed immediately before.

FIG. 2 is a diagram showing the relationship between the mask layers that are exposure destinations in the exposure process. For example, the (N + m) exposure step 20 is an exposure step in which the Nth layer is the matching destination mask layer.
1.2. Exposure condition determining apparatus 100
Next, the exposure condition determining apparatus 100 that determines the exposure conditions for the Nth exposure step 10 will be described.

Specifically, the exposure condition determining apparatus 100 includes a processor, a RAM, a ROM recording a program, a hard disk, and the like, and the processor realizes its function by executing the program recorded in the ROM.
The exposure condition determining apparatus 100 is connected to the exposure / development apparatus group 11, the alignment deviation measuring apparatus 13, and the line width measuring apparatus 14 via a network such as a LAN, and can communicate with these apparatuses. it can.

FIG. 3 is a block diagram showing a functional configuration of the exposure condition determining apparatus 100 according to the first embodiment.
The exposure condition determination apparatus 100 includes functional blocks of a data holding unit 110, a calculation unit 120, and an update unit 130, and accumulates history data of processed lots that have been processed in the Nth exposure step 10 and stores the history data. The exposure conditions for processing the unprocessed lot in the Nth exposure step 10 are determined by feedback.

1.2.1. Data holding unit 110
Specifically, the data holding unit 110 is a partial recording area of the hard disk, and includes a combination information holding unit 111, a history data holding unit 112, a device compatibility information holding unit 113, a reticle compatibility information holding unit 114, a condition temporary storage It comprises a holding unit 115 and an exposure condition / coefficient holding unit 116.

1.2.1.1. Combination information holding unit 111
The combination information holding unit 111 is a recording area that holds the combination information table 111b.
FIG. 4 is a diagram illustrating a data structure of the combination information table 111a.
The combination information table 111a is a table for managing information notified from the exposure / development apparatus group 11 (apparatus and reticle used for processing in the Nth exposure step 10) for each processed lot in the Nth exposure step 10. .

  In the combination information table 111a, the same number of combination information as the number of processed lots processed in the Nth exposure step 10 is accumulated. Each combination information has a one-to-one correspondence with each processed lot processed in the Nth exposure step 10, and (i) a lot number, (ii) an exposure / development apparatus used in the Nth exposure step 10, and (Iii) The reticle used in the Nth exposure step 10.

The combination information table 111a is processed by the same combination of exposure / development apparatus and reticle as the unprocessed lot and is used for searching the processed lot.
1.2.1.2. History data holding unit 112
The history data holding unit 112 is a recording area that holds the history data table 112a.
FIG. 5 shows the data structure of the history data table 112a.

The history data table 112a is a table for managing the exposure conditions given to the exposure / development apparatus group 11 and the measurement data of the Nth exposure step 10 notified from the alignment deviation measuring apparatus 13 and the line width measuring apparatus 14. .
In the history data table 112a, the same number of history data as the number of processed lots processed in the Nth exposure step 10 is accumulated. Each history data has a one-to-one correspondence with each processed lot processed in the Nth exposure step 10 and includes a lot number, exposure conditions, number of data, processing date and time, and measurement data.

In FIG. 5, offset values are shown as exposure conditions and measurement data. However, exposure conditions such as exposure amount, shot magnification, shot rotation, wafer rotation, and line width, shot magnification, shot rotation, wafer rotation, etc. Measurement data is accumulated in the same way.
The history data table 112a is used for accumulating history data used for feedback when determining exposure conditions for unprocessed lots.

1.2.1.3. Device compatibility information holding unit 113
The device compatibility information holding unit 113 is a recording area for holding the device compatibility information table 113a.
FIG. 6 is a diagram illustrating a data structure of the device compatibility information table 113a.
The apparatus compatibility information table 113a indicates whether the difference between the processing result expected from the exposure condition and the measurement data is similar between the apparatuses 11a to 11c constituting the exposure / development apparatus group 11. The table shows the compatibility between the devices, and the compatibility of the comparison target device with respect to the comparison source device is indicated by either “◯ (good compatibility)” or “× (poor compatibility)”. FIG. 6 shows that the device 11b is compatible with the device 11a and the devices 11a and 11b are compatible with the device 11c.

When there is no processed lot processed using the comparison source apparatus, the history data of the processed lot processed using the comparison target apparatus that is considered compatible in the apparatus compatibility information table 113a is fed back. By using this, it is possible to suppress the influence of differences between apparatuses on the determination of exposure conditions.
1.2.1.4. Reticle compatibility information holding unit 114
The reticle compatibility information holding unit 114 is a recording area that holds a reticle compatibility information table 114a.

FIG. 7 shows the data structure of reticle compatibility information table 114a.
The reticle compatibility information table 114a indicates whether or not the reticles 12a to 12c constituting the reticle group 12 are similar in tendency to cause a difference between processing results expected from exposure conditions and measurement data. The compatibility of the comparison target reticle with respect to the comparison source reticle is indicated by either “◯ (good compatibility)” or “× (poor compatibility)”. FIG. 7 shows that the 112a reticle is compatible with the 112b reticle.

When there is no processed lot processed using the reticle of the comparison source, the history data of the processed lot processed using the comparison target reticle of which compatibility is good in the reticle compatibility information table 114a is fed back. By using this, the influence of the difference between the reticles on the determination of the exposure conditions can be suppressed.
1.2.1.5. Condition temporary holding unit 115
The condition temporary holding unit is a recording area for temporarily recording the exposure condition of the unprocessed lot determined by the condition calculation unit 124 described later. After the exposure condition is determined, the processing of the lot is finished and the alignment deviation measurement is performed. The exposure conditions are temporarily held until measurement data is notified from the apparatus 13 and the line width measuring apparatus 14.

1.2.1.6. Exposure condition / coefficient holding unit 116
In the exposure condition formula / coefficient holding unit 116, a model formula used for feedback of history data and a coefficient are recorded in a condition calculation unit 124 described later.
1.2.2. Calculation unit 120
The calculation unit 120 in FIG. 3 is a functional block that transmits the exposure conditions of an unprocessed lot in response to a request from any of the exposure / development apparatuses 11a to 11c, and includes a request reception unit 121 and a combination selection unit 122. , A data acquisition unit 123, a condition calculation unit 124, and a condition transmission unit 125.

The request receiving unit 121 is a functional block that receives an exposure condition request from an exposure / development apparatus that processes an unprocessed lot. The exposure condition request includes a lot number of an unprocessed lot to be processed, an identification number of a requesting apparatus, and an identification number of a reticle to be used.
The combination selection unit 122 selects a processed lot processed by a combination of an apparatus and a reticle indicated by the exposure condition request, and an apparatus and a reticle, or both of the apparatuses and reticles indicated by the exposure condition request. A processed lot processed with a combination replaced with a good one is selected from the combination information table 111a. An apparatus compatible with the apparatus indicated by the exposure condition request and a reticle compatible with the reticle indicated by the exposure condition request are specified by the apparatus compatibility information table 113a and the reticle compatibility information table 114a, respectively.

The data acquisition unit 123 acquires the history data of the processed lot selected by the combination selection unit 122 from the history data table 112a.
The condition calculation unit 124 uses the model formula and coefficient recorded in the exposure condition formula / coefficient holding unit 116 to feed back the history data acquired by the data acquisition unit 123 to calculate the exposure condition. The calculated exposure condition is notified to the condition transmission unit 125 by the condition calculation unit 124 and recorded in the condition temporary storage unit 115.

The condition transmission unit 125 transmits the exposure condition calculated by the condition calculation unit 124 to the requesting exposure / development apparatus.
1.2.2.1. Operation of Calculation Unit 120 The calculation unit 120 configured as described above realizes exposure condition determination processing according to the following procedure.

FIG. 8 is a diagram showing an operation flow of the exposure condition determination process in the calculation unit 120.
First, the request accepting unit 121 accepts an exposure condition request transmitted by any device in the exposure / development apparatus group 11, and sets an exposure / development apparatus and a reticle used for processing an unprocessed lot indicated by the exposure condition request. The combination selection unit 122 is notified (S11).
The combination selection unit 122 notified of the combination of the exposure / development apparatus and reticle used for processing the unprocessed lot selects a lot for which history data is to be acquired by a lot selection process described later (S12).

  The data acquisition unit 123 acquires the history data of the lot selected by the combination selection unit 122 from the history data table 112a (S13). When the number of data of the history data acquired here is less than the number of data necessary for calculating a high-accuracy exposure condition by feedback (S14: No), the combination selection unit 122 selects a lot (S12). ) And acquisition of history data by the data acquisition unit 123 (S13) is repeated.

  When the total number of data items of the acquired history data reaches the number necessary for calculating the exposure condition with high accuracy by feedback (S14: Yes), the condition calculation unit 124 sets the exposure condition expression / coefficient holding unit. The obtained history data is fed back using the model formula recorded in 116 to calculate an exposure condition (S14), and the condition transmission unit 125 indicates the calculated exposure condition by the exposure condition request. Transmit to the developing device (S15).

  By the above operation, when there is no history data of the processed lot processed by the same combination as the exposure / development apparatus and reticle used for the unprocessed lot, or the exposure data with high accuracy is calculated. Therefore, when the number of cases necessary for this is not reached, the difference between the exposure results expected from the exposure conditions and the measured data is processed in a combination similar to the combination of the exposure / development apparatus and reticle used for unprocessed lots. In addition, deficiencies in the number of data can be compensated by the history data of already processed lots.

In addition, the selection of the lot from which history data is acquired in S12 is performed according to the following procedure.
FIG. 9 is a diagram showing a flow of operation of lot selection processing in the combination selection unit 122.
First, the combination selection unit 122 searches the combination information table 111a for lots processed using the exposure / development apparatus and reticle indicated by the exposure condition request (S21). When there is a lot that meets the conditions and has not yet been selected (S21: Yes), the lot is selected as a target for acquiring history data (S26).

  If there is no lot that matches the condition of S21 or if it has already been selected (S21: No), the combination selection unit 122 selects a reticle that is compatible with the reticle indicated by the exposure condition request in the reticle compatibility information table 114a. The lot that is specified by using the reticle and the exposure / development apparatus indicated by the request for the exposure condition is searched from the combination information table 111a (S22). If there is a lot that meets the conditions and has not yet been selected (S22: Yes), the lot is selected as a target for acquiring history data (S26).

  If there is no lot that meets the condition of S22 or if it has already been selected (S22: No), the combination selection unit 122 selects an exposure / development apparatus that is compatible with the exposure / development apparatus indicated by the exposure condition request. A lot that has been specified using the apparatus compatibility information table 113a and processed using a reticle that is indicated by the compatible exposure / development apparatus and exposure condition request is searched from the combination information table 111a (S23). If there is a lot that meets the conditions and has not yet been selected (S23: Yes), the lot is selected as a target for acquiring history data (S26).

  If there is no lot that meets the conditions of S23, or if the lot has already been selected (S23: No), the combination selection unit 122 is compatible with the exposure / development apparatus indicated by the exposure condition request, and A lot processed using a reticle that is compatible with the reticle indicated by the exposure condition request is searched from the combination information table 111a (S24). If there is a lot that meets the conditions and has not yet been selected (S24: Yes), the lot is selected as a target for acquiring history data (S26).

If there is no lot that meets the condition of S24, or if it has already been selected (S24: No), the lot for which history data is to be acquired is not selected.
With the above operation, a processed lot processed with a combination similar to the combination of the exposure / development apparatus and reticle used for an unprocessed lot tends to cause a difference between the exposure result expected from the exposure conditions and the measurement data. History data can be acquired.

1.2.3. Update unit 130
The update unit 130 illustrated in FIG. 3 is a functional block that acquires measurement data from the alignment deviation measurement device 13 and the line width measurement device 14 and updates the recording content of the data holding unit 110. It consists of a data recording unit 132 and a compatibility information update unit 133.
The information accepting unit 131 accepts measurement data of a lot subjected to exposure and development from the alignment deviation measuring device 103 and the line width measuring device 14.

The history data recording unit 132 registers the received measurement data in the history data holding unit 112 together with the exposure conditions held in the condition temporary holding unit 115.
The compatibility information update unit 133 compares the received measurement data with the measurement data of the already processed lot stored in the history data table 112a, and the exposure / development apparatus and reticle that processed the lot to be measured, and other data The compatibility with the exposure / development apparatus and the reticle is determined, and the apparatus compatibility information table 113a and the reticle compatibility information table 114a are updated.

  At this time, the measurement data to be compared with the received measurement data is the same as the exposure / development apparatus and reticle that processed the lot to be measured, and the other is processed in a different combination. It is the measurement data of a processing lot. Further, when the measured values and the target values of the standards are similar between the two measured data, it is determined that the compatibility of the different sides of the exposure / development apparatus and the reticle is good.

For example, the compatibility of the apparatus or reticle is as follows between the two lots of the comparison source and the comparison destination in the distribution curve in which the measurement data is plotted for each lot with the horizontal axis shown in FIG. 10 as the measurement value and the vertical axis as the frequency. When the conditions (Ai) to (Aiv) are satisfied, the compatibility is good.
(Ai) The deviation of the median value from the target value of the standard is the same in both lots (Aii) The median value of the comparison target lot is closer to the target value than the median value of the comparison source lot (Aiii) The median difference is less than 5% of the upper and lower limit width of the standard (Aiv) The comparison process capability index Cp is 1.00 or more 1.2.3.1. Operation of Compatibility Information Update Unit 133 Hereinafter, the operation of the compatibility determination process will be described.

FIG. 11 is a diagram illustrating a flow of the operation of the compatibility determination process in the compatibility information update unit 133.
First, the compatibility information update unit 133 acquires the measurement data when the measurement data of the lot subjected to the exposure process is received by the information reception unit 131 (S31).
The compatibility information update unit 133 further combines the lots processed in the combination of the exposure / development apparatus and the reticle used for the processing of the lot to be measured, one of which is the same and the other different, as shown in FIG. Search is made in the information table 111a (S32). If detected (S32: Yes), the measurement data of the detected lot is acquired from the history data table 112a (S33).

  When the measurement data acquired in S31 and the measurement data acquired in S33 satisfy all of the conditions (Ai) to (Aiv) (S34 to S37: all Yes), the compatibility information update unit 133 determines both lots. When the processed exposure / development apparatus and reticle are judged to have good compatibility on different sides (S38), and any of the conditions (Ai) to (Aiv) is not satisfied (S34 to S37: No) Then, it is determined that the compatibility on the different side is different between the exposure / development apparatus and the reticle that processed both lots (S39), and either the apparatus compatibility information table 113a or the reticle compatibility information table 114a is updated.

Thereafter, the processing of S33 to S39 is repeated for all lots that meet the conditions of S32.
By the above operation, each time a new lot is processed, the device compatibility information table 113a and the reticle compatibility information table 114a can be updated according to the latest device status.

Hereinafter, a specific example of the compatibility determination process will be described with reference to FIGS. 4, 6, 7, and 10.
(1) First, when the measurement data of the lot number 1 shown in FIG. 4 is received, the compatibility determination process is not performed because there is no processed lot.
(2) When the measurement data of the lot number 2 is received, the compatibility determination process is executed using the history data of the lot number 1.

  The lot (distribution curve d1) processed by the exposure / development apparatus 11b and the reticle 12b is used as a comparison source, and the lot (distribution curve d2) processed by the exposure / development apparatus 11b and the reticle 12a. ) Is a comparison destination, d1 and d2 satisfy the above conditions (Ai) to (Aiv). As a result, in the reticle compatibility information table 114a shown in FIG. 7, “◯” is set in the columns of the comparison source 12b and the comparison destination 12a.

On the other hand, when the lot (d2) of lot number 1 is the comparison source and the lot (d1) of lot number 2 is the comparison destination, the median value m1 of the comparison destination d1 is a target value from the median value m2 of the comparison source d2. In the reticle compatibility information table 114a, “x” is set in the columns of the comparison source 12a and the comparison destination 12b because the condition (Aii) is not satisfied.
(3) When the measurement data of the lot number 3 is received, the compatibility determination process is executed using the lot history data of the lot numbers 1 and 2.

  When the lot number 3 (distribution curve d3) processed by the exposure / development apparatus 11b and the reticle 12c is the comparison source, and the lot numbers 1 and 2 are the comparison destinations, the median value of the comparison source d3 Although m3 deviates from the target value in the positive direction, the median value of any of the comparison destinations d1 and d2 deviates from the target value in the negative direction and does not satisfy the condition (Ai). Accordingly, in the reticle compatibility information table 114a, “X” is set in the columns of the comparison source 12c and the comparison destination 12a, and the columns of the comparison source 12c and the comparison destination 12b.

On the contrary, when the lot number 1 and the lot number 2 are used as the comparison source and the lot number 3 as the comparison destination, the condition (Ai) is not satisfied. Therefore, in the reticle compatibility information table 114a, “x” is set in the columns of the comparison source 12a and the comparison destination 12c, and the columns of the comparison source 12b and the comparison destination 12c.
(4) When the measurement data of the lot number 4 is received, the lot number 1 and lot number 2 are different from each other because the exposure / development apparatus and the reticle used in the processing are different from each other. The compatibility determination process is executed for the lot number 3 having the same reticle used in the above.

  When the lot (d3) of the lot number 3 is the comparison source and the lot (d4) of the lot number 4 processed by the exposure / development apparatus 11a and the reticle 12c is the comparison destination, the conditions (Ai) to (Aiii) Is satisfied, but Cp of d4 is less than 1.00 and does not satisfy the condition (Aiv). Therefore, in the device compatibility information table 113a shown in FIG. 6, “x” is set in the columns of the comparison source 11b and the comparison destination 11a. Is done.

Thereafter, each time the measurement data of lots after lot number 5 is received, the above compatibility determination process is executed, and the device compatibility information table 113a and the reticle compatibility information table 114a are updated.
The process capability index Cp is defined by a value obtained by dividing the upper and lower limit width of the standard by 6 times the standard deviation, and indicates the degree of variation of the product with respect to the standard.

1.3. Exposure condition determining apparatus 200
Next, the exposure condition determining apparatus 200 that determines the exposure condition of the N + m exposure step 20 will be described.
The exposure condition determination device 200 is connected to the exposure / development device group 11, the exposure / development device group 21, the alignment deviation measurement device 23, and the line width measurement device 24 via a network such as a LAN. The apparatus can communicate with the apparatus, accumulates history data of processed lots processed in the (N + m) exposure step 20, feeds back the history data, and sets exposure conditions for processing unprocessed lots in the (N + m) exposure step 20. decide.

The exposure condition determining device 200 has the same hardware configuration as the exposure condition determining device 100.
Hereinafter, a software configuration different from that of the exposure condition determining apparatus 100 will be described. The description of the same components as those in the exposure condition determining apparatus 100 is omitted.
1.3.1. Combination information holding unit 111
The combination information holding unit 111 holds a combination information table 111b instead of the combination information table 111a.

FIG. 12 is a diagram illustrating a data structure of the combination information table 111b.
The combination information table 111b is information received from the exposure / development apparatus group 11 and the exposure / development apparatus group 21 (the apparatus and reticle used in the processing of the Nth exposure step 10 and the processing used in the N + m exposure step 20). (Apparatus and reticle) are managed for each processed lot in the (N + m) th exposure step 20.

  In the combination information table 111b, the same number of combination information as the number of already processed lots processed in the (N + m) th exposure step 20 is accumulated. Each combination information has a one-to-one correspondence with each processed lot processed in the (N + m) exposure step 20, and (i) lot number, and (ii) an exposure / mask that forms the alignment destination mask layer in the (N + m) exposure step 20. Development apparatus (apparatus used in the Nth exposure process 10), (iii) reticle (reticle used in the Nth exposure process 10) on which the alignment mask layer of the N + m exposure process 20 is formed, and (iv) the N + m exposure process And (v) a reticle used in the (N + m) th exposure step 20.

1.3.2. Device compatibility information holding unit 113
The device compatibility information holding unit 113 includes each device (21a to 21c) of the exposure / development device group 21 in addition to the device compatibility information table 113a indicating the compatibility between the devices (11a to 11c) of the exposure / development device group 11. Holds a table showing the compatibility between. The table showing the compatibility between the devices of the exposure / development device group 21 has the same data structure as the device compatibility information table 113a, and a detailed description thereof will be omitted.

1.3.3. Reticle compatibility information holding unit 114
In addition to the reticle compatibility information table 114a indicating the compatibility between the reticles (12a to 12c) of the reticle group 12, the reticle compatibility information holding unit 114 is a table indicating the compatibility between the reticles (21a to 21c) of the reticle group 22. Hold. Note that the table showing the compatibility between the reticles of the reticle group 22 has the same data structure as the reticle compatibility information table 114a, and a detailed description thereof will be omitted.

1.3.4. Operation of Calculation Unit 120 In the exposure condition determining apparatus 200, a processed lot to be used for feedback is selected by a procedure different from that of the exposure condition determining apparatus 100.
The operation of lot selection processing in the exposure condition determining apparatus 200 will be described below.
FIG. 13 is a diagram showing the flow of operation of lot selection processing in the exposure condition determining apparatus 200.

(1) The combination selection unit 122
a. Apparatus used in the Nth exposure step 10 b. Reticle used in the Nth exposure step 10 c. Equipment used in N + m exposure step 20 d. A processed lot whose reticle used in the N + m exposure step 20 is the same as the lot indicated by the exposure condition request is searched from the combination information table 111b (S41). If there is a lot that meets the conditions and has not yet been selected (S41: Yes), the lot is selected as a target for acquiring history data (S49).

  (2) If there is no lot that meets the conditions of S41, or if a lot has already been selected (S41: No), b. Is compatible with that used in the lot indicated by the exposure condition request, and a. c. And d. Is searched for from the combination information table 111b for a processed lot that is identical to the lot indicated by the exposure condition request (S42). If there is a lot that meets the conditions and has not yet been selected (S42: Yes), the lot is selected as a target for acquiring history data (S49).

  (3) If there is no lot that meets the conditions of S42, or if a lot has already been selected (S42: No), a. Is compatible with that used in the lot indicated by the exposure condition request, and b. To d. Is searched from the combination information table 111b for a processed lot that is identical to the lot indicated by the exposure condition request (S43). When there is a lot that meets the conditions and has not yet been selected (S43: Yes), the lot is selected as a target for acquiring history data (S49).

  (4) If there is no lot that meets the conditions of S43, or if a lot has already been selected (S43: No), a. And b. Is compatible with that used in the lot indicated by the exposure condition request, and c. And d. Is searched from the combination information table 111b for processed lots that are identical to the lot indicated by the exposure condition request (S44). If there is a lot that meets the conditions and has not yet been selected (S44: Yes), the lot is selected as a target for acquiring history data (S49).

  (5) If there is no lot that meets the conditions of S44, or if a lot has already been selected (S44: No), c. Is compatible with that used in the lot indicated by the exposure condition request, and a. b. And d. Is searched for from the combination information table 111b for processed lots having the same as the lot indicated by the exposure condition request (S45). If there is a lot that meets the conditions and has not yet been selected (S45: Yes), the lot is selected as a target for acquiring history data (S49).

  (6) If there is no lot that meets the conditions of S45, or if a lot has already been selected (S45: No), d. Is compatible with that used in the lot indicated by the exposure condition request, and a. To c. Is searched from the combination information table 111b for processed lots that are the same as the lot indicated by the exposure condition request (S46). If there is a lot that meets the conditions and has not yet been selected (S46: Yes), the lot is selected as a target for acquiring history data (S49).

  (7) If there is no lot that meets the conditions of S46, or if a lot has already been selected (S46: No), c. And d. Is compatible with that used in the lot indicated by the exposure condition request, and a. And b. Is searched from the combination information table 111b for a processed lot that is identical to the lot indicated by the exposure condition request (S47). When there is a lot that meets the conditions and has not yet been selected (S47: Yes), the lot is selected as a target for acquiring history data (S49).

(8) If there is no lot that meets the condition of S47, or if it has already been selected (S47: No), a lot for which history data is to be acquired is not selected (S48).
In addition, in order to specify what is compatible with the exposure / development apparatus and reticle used for the lot indicated by the exposure condition request, the apparatus compatibility information holding unit 113 and the tables held by the reticle compatibility information holding unit 114 are used.

Due to the above operation, a tendency that a difference between the exposure result expected from the exposure condition and the measurement data is caused by the combination of the exposure / development apparatus and the reticle in the Nth exposure process 10 and the N + m exposure process 20 of the unprocessed lot. A processed lot processed in a similar combination can be a target for acquiring history data.
2. Embodiment 2
In the first embodiment, an object to be used for feedback is selected without considering the processing date and time of history data. However, the characteristics of the exposure / development apparatus and the reticle may change over time.

Therefore, in the second embodiment, an exposure condition determination apparatus 300 that takes into account the influence of changes in the characteristics of the exposure / development apparatus and the reticle over time on the determination of the exposure conditions will be described.
2.1. Exposure condition determining apparatus 300
The exposure condition determining apparatus 300 according to the second embodiment is an exposure condition determining apparatus that determines the exposure condition of the Nth exposure step 10 and is used in place of the exposure condition determining apparatus 100 described in the first embodiment. .

The exposure condition determination device 300 has the same hardware configuration as the exposure condition determination device 100. Hereinafter, the operation of the exposure condition determining apparatus 200 will be described by paying attention to the difference from the exposure condition determining apparatus 100.
2.2. Operation of Calculation Unit 120 In the exposure condition determination device 300, the exposure condition is determined by a procedure different from that of the exposure condition determination device 100.

The operation of the exposure condition determination process in the exposure condition determination apparatus 300 will be described below.
FIG. 14 is a diagram showing the flow of the operation of the exposure condition determination process of the exposure condition determination apparatus 300.
First, the request accepting unit 121 accepts an exposure condition request transmitted by any device in the exposure / development apparatus group 11, and sets an exposure / development apparatus and a reticle used for processing an unprocessed lot indicated by the exposure condition request. The combination selection unit 122 is notified (S51).

  The combination selection unit 122 that is notified of the combination of the exposure / development apparatus and the reticle used for processing the unprocessed lot searches the processed lots that meet the conditions of S21 to S24 in FIG. 9 in order from the condition of S21. When processed lots that match any of the conditions are recorded in the combination information table 111a, all processed lots that match the same conditions are selected (S52).

  The data acquisition unit 123 acquires the processing date and time and the number of data of all processed lots selected by the combination selection unit 122 from the history data table 112a, and the current date and time (or the date and time when the unprocessed lot is scheduled to be processed). From this, it is determined whether or not the value obtained by accumulating the number of data of processed lots within a standard search period (for example, 3 days) exceeds the number necessary for calculating highly accurate exposure conditions by feedback (S53).

  If the result of the determination in S53 is affirmative (S53: Yes), the data acquisition unit 123 accumulates the number of data from the selected processing lot that dates back to the current point in time and that has a new processing date and time. The history data of the already processed lots up to the required number is acquired from the history data table 112a (S54). The condition calculation unit 124 calculates the exposure condition by feeding back the acquired history data (S58), and the condition transmission unit 125 transmits the calculated exposure condition to the exposure / development apparatus indicated by the exposure condition request. (S59).

When the result of the determination in S53 is negative (S53: No), the combination selection unit 122 further determines whether there is a lot that satisfies the conditions of S21 to S24 in FIG. (S55).
If the result of the determination in S55 is negative (S55: No), the data acquisition unit 123 accumulates the number of data from the selected processed lot that dates back to the current point in time and has a new processing date and time. The history data of the already processed lots until the necessary number is reached is acquired from the history data table 112a. However, even when the accumulation of the number of data has not reached the necessary number, the history data of the processed lots processed before the search period limitation described later is not acquired (S56). The condition calculation unit 124 that has received the history data feeds back the acquired history data to calculate the exposure condition (S58), and the condition transmission unit 125 sets the calculated exposure condition to the exposure / exposure indicated by the exposure condition request. The data is transmitted to the developing device (S59).

When the result of the determination in S55 is affirmative (S55: Yes), the data acquisition unit 123 acquires history data of a processed lot within a standard search period (for example, 3 days) from the history data table 112a (S57). .
Thereafter, the processing from S52 is repeated to determine the exposure conditions. However, when the cumulative data number is calculated in S53 to S57, a value obtained by adding the data number of the history data acquired in the previous procedure is used.

The search period in S54 is reduced as follows (restriction of history data used for feedback).
FIG. 15 is a diagram schematically illustrating the reduction of the search period according to the number of data.
In the figure, the median value of the distribution of each lot is plotted with the horizontal axis representing time and the vertical axis representing measured values.

If the cumulative number of lots processed from the current time (t ₀ ) to the time (t ₁ ) that goes back to the standard search period exceeds the required number, the number of data is accumulated from the newest processing date and time. The period until the required number of cases is reached is set as the reduced search period (t ₂ ), and the processed lots processed up to the reduced search period (t ₂ ) are set as feedback targets.
Further, the search period is extended (addition of history data used for feedback) in S56 as follows.

FIG. 16 is a diagram schematically showing the expansion of the search period according to the number of data.
In the figure, the median value of the distribution of each lot is plotted with the horizontal axis representing time and the vertical axis representing measured values.
If the number of lot data processed from the current time point (t ₀ ) to the time point (t ₃ ) that goes back to the standard search period is less than the required number, the number of data is accumulated from the latest processing date and time. The period until the required number of cases is reached is defined as the extended search period (t ₄ ), and the processed lots processed by the extended search period (t ₄ ) are set as feedback targets.

However, the past history data may cause the characteristics of the exposure / development apparatus and the reticle to change beyond the allowable range. Therefore, even if the search period limit (t ₅ ) is set and the number of data accumulation has not reached the required number, the expanded search period (t ₄ ) is not expanded in the past than the search period limit (t ₅ ). And
By the above operation, even if the lot is processed with a combination of an exposure / development apparatus and reticle similar in processing result to the exposure / development apparatus and reticle used for processing an unprocessed lot, it meets other conditions. If there is a lot, the exposure condition can be determined without using the history data of the lot processed in the past than the standard search period.

Furthermore, if the number of historical data of processed lots that meet the conditions exceeds the number necessary to calculate high-precision exposure conditions by feedback, the historical data used for feedback is the number of necessary, and By narrowing down to recent ones, it is possible to calculate highly accurate exposure conditions while effectively reducing the amount of calculation required for feedback.
Here, the exposure condition determining apparatus 300 that determines the exposure conditions of the Nth exposure step 10 in consideration of changes in the characteristics of the exposure / development apparatus and the reticle over time has been described. By setting the conditions for selecting a processed lot in S55 to the conditions shown in S41 to S47 in FIG. 13, the characteristics of the exposure / development apparatus and the reticle over time are similarly applied to the exposure conditions of the N + m exposure step 20. Can be determined in consideration of changes in

3. Other Modifications Although the present invention has been described based on the above-described embodiment, it is needless to say that the present invention is not limited to the above-described embodiment. The following cases are also included in the present invention.
(1) The present invention may be the method described above. Further, the present invention may be a computer program that realizes these methods by a computer, or may be a digital signal composed of the computer program.

  The present invention also provides a computer-readable recording medium such as a flexible disk, hard disk, CD-ROM, MO, DVD, DVD-ROM, DVD-RAM, BD (Blu-ray Disc). ), Recorded in a semiconductor memory or the like. Further, the present invention may be the computer program or the digital signal recorded on these recording media.

In the present invention, the computer program or the digital signal may be transmitted via an electric communication line, a wireless or wired communication line, a network represented by the Internet, or the like.
The present invention may be a computer system including a microprocessor and a memory, wherein the memory stores the computer program, and the microprocessor operates according to the computer program.

In addition, the program or the digital signal is recorded on the recording medium and transferred, or the program or the digital signal is transferred via the network or the like, and is executed by another independent computer system. It is good.
(2) In the present embodiment, the configuration in which the exposure condition is determined by the individual exposure condition determination device for each of the Nth exposure process and the N + mth exposure process has been described. It is not necessary to use a separate exposure condition determination device for each exposure process.

  The exposure condition determining apparatus according to the present invention allocates, for example, a recording area of a hard disk to each of the Nth exposure process and the N + m exposure process, and the exposure process corresponding to the recording area allocated to each exposure process. When the exposure / development apparatus requests the determination of the exposure conditions, the Nth exposure process and the (N + m) th exposure process are notified by receiving notification from the requesting apparatus of the exposure process. Both exposure conditions in the exposure process may be determined by a single exposure condition determination device.

In addition, a recording area of the hard disk is assigned to each exposure process for forming a wiring layer of a predetermined semiconductor product, history data of the corresponding exposure process is managed in each recording area, and a wiring layer of the predetermined semiconductor product is formed. The exposure conditions for all the exposure steps may be determined by a single exposure condition determination device.
Furthermore, in a manufacturing plant that manufactures a plurality of semiconductor products, a hard disk recording area is allocated for each exposure process for forming a wiring layer of each semiconductor product, and the corresponding exposure process history is recorded in the recording area allocated to each exposure process. Manufacture by managing the data and receiving notification from the requesting device of which wiring layer of which product is used when the exposure / development device determines the exposure conditions. The exposure conditions for a plurality of exposure processes for forming the wiring layers of the respective semiconductor products manufactured in the factory may be determined by a single exposure condition determination device.

(3) In the present embodiment, the present invention has been described by taking the determination of the exposure conditions in the exposure process as an example. However, the present invention is not limited to the exposure process, and is high in processing results of electronic device products such as semiconductor products and liquid crystal panels. The present invention can be applied to determination of process conditions in a manufacturing process that requires accuracy.
For example, the present invention can be similarly applied to a process condition determining apparatus that determines a discharge time in an etching process that selectively uses any one of a plurality of etchers and chambers.

  (4) The above embodiment and the above modifications may be combined.

  INDUSTRIAL APPLICABILITY The present invention can be applied to manufacturing processes for manufacturing semiconductor products, PDPs, liquid crystal panels, and the like by selectively using a plurality of processing apparatuses and processing members, and is useful when manufacturing products of various types and small quantities. .

It is a figure which shows typically the manufacturing process which concerns on this Embodiment 1. FIG. It is a figure which shows the relationship between each mask layer used as the alignment destination of an exposure position in an exposure process. It is a block diagram which shows the function structure of the exposure condition determination apparatus 100 which concerns on this Embodiment 1. FIG. It is a figure which shows the data structure of the combination information table 111a. It is a figure which shows the data structure of the log | history data table 112a. It is a figure which shows the data structure of the apparatus compatibility information table 113a. It is a figure which shows the data structure of the reticle compatibility information table 114a. It is a figure which shows the flow of operation | movement of the exposure condition determination process in the calculation part. It is a figure which shows the flow of operation | movement of the lot selection process in the combination selection part. It is a figure which shows the distribution curve which plotted the measurement data for every lot by making a horizontal axis a measured value and a vertical axis | shaft into frequency. It is a figure which shows the flow of the operation | movement of the compatibility determination process in the compatibility information update part 133. FIG. It is a figure which shows the data structure of the combination information table 111b. It is a figure which shows the flow of operation | movement of the lot selection process in the exposure condition determination apparatus 200. FIG. It is a figure which shows the flow of operation | movement of the exposure condition determination process of the exposure condition determination apparatus. It is a figure which shows typically reduction of the search period according to the number of data. It is a figure which shows typically the expansion of the search period according to the number of data.

Explanation of symbols

10 Nth exposure step 11, 21 Exposure / development device group 11a, 11b, 11c, 21a, 21b, 21c
Exposure / development device 12, 22 Reticle group 12a, 12b, 12c, 22a, 22b, 22c
Reticle 13, 23 Alignment deviation measuring device 14, 24 Line width measuring device 20 N + m exposure process 100, 200, 300
Exposure condition determining device 110 Data holding unit 111 Combination information holding unit 111a, 111b
Combination information table 112 History data holding unit 112a History data table 113 Device compatibility information holding unit 113a Device compatibility table 114 Reticle compatibility information holding unit 114a Reticle compatibility information table 115 Condition temporary holding unit 116 Exposure condition formula / coefficient holding unit 120 Calculation unit 121 Request reception unit 122 Combination selection unit 123 Data acquisition unit 124 Condition calculation unit 125 Condition transmission unit 130 Update unit 131 Information reception unit 132 History data recording unit 133 Compatibility information update unit

Claims (13)

A process condition determining device that determines a process condition of a processing device related to a combination when selecting one combination from a combination of a plurality of processing devices and a plurality of processing members to process an unprocessed lot,
Storage means for storing history data consisting of process conditions used in the already processed lots and processing results under those conditions;
Compatibility storage means for storing compatibility between processing devices and compatibility between processing members;
When a combination of a processing apparatus and a processing member to be used for processing an unprocessed lot has been selected in the past, first acquisition means for acquiring history data of the processed lot related to the combination;
History data of processed lots using one of the processing apparatus and the processing member related to the combination and having a good compatibility with the other with reference to the compatibility storage means Second acquisition means for acquiring
A process condition determining apparatus comprising: a determining unit that determines a process condition for processing an unprocessed lot based on the acquired history data. The process condition determining apparatus further includes:
Comparing history data of processed lots according to the first combination with history data of processed lots according to the second combination;
When the processing apparatuses related to both combinations are the same, the processing members are different, and the processing results of both are similar, the processing members related to the first combination and the processing members related to the second combination are good Judgment,
When the processing members related to both combinations are the same, the processing devices are different, and the processing results of both are similar, the processing device related to the first combination and the processing device related to the second combination are good The process condition determining apparatus according to claim 1, further comprising compatibility determination means for determining. The determination of the process conditions in the determination means requires a history data of a predetermined number or more,
2. The exposure condition determining apparatus according to claim 1, wherein the history data used for determining the process condition in the determining means is the predetermined number from the newest acquired history data. The processing apparatus is an exposure apparatus;
The process condition determining apparatus according to claim 1, wherein the processing member is a reticle. An exposure condition determining device for determining an exposure condition of an exposure apparatus related to a combination when performing exposure of an unprocessed lot by selecting one combination from a combination of a plurality of exposure apparatuses and a plurality of reticles,
Storage means for storing history data composed of exposure conditions used in processed lots and processing results under the conditions;
History data of processed lots related to the same combination as the exposure apparatus and reticle to be used for processing of unprocessed lots, and an alignment destination exposure apparatus used for forming an alignment destination mask layer for aligning exposure positions; An acquisition unit that acquires history data of a processed lot whose combination of alignment destination reticles is the same as that used for forming an alignment destination mask layer of an unprocessed lot from a storage unit;
An exposure condition determining apparatus comprising: a determining unit that determines an exposure condition for exposing an unprocessed lot based on acquired history data. The exposure condition determining device further includes:
Compatibility storage means for storing the compatibility between exposure apparatuses, the compatibility between reticles, the compatibility between alignment destination exposure apparatuses, and the compatibility between alignment destination reticles;
An alignment destination exposure apparatus and alignment destination reticle that are history data of an already processed lot related to the same combination as the combination of an exposure apparatus and a reticle to be used for processing an unprocessed lot, and used for forming an alignment destination mask layer One of these is the same as that used for forming the alignment mask layer of the unprocessed lot, and the other is compatible with the one used for forming the alignment mask layer of the unprocessed lot. The exposure condition determining apparatus according to claim 5, further comprising: additional acquisition means for acquiring processing lot history data from the storage means. The determination of the exposure conditions in the determination means requires a history data of a predetermined number or more,
7. The exposure condition determining apparatus according to claim 6, wherein the history data used for determining the exposure condition in the determining means is the predetermined number from the newest acquired history data. When selecting one combination from a combination of a plurality of processing devices and a plurality of processing members to process an unprocessed lot, a process condition determining method for determining a process condition of a processing device related to the combination,
A combination of processing devices and processing members to be used for processing unprocessed lots in the past from a recording device that records historical data consisting of process conditions used in processed lots and processing results under those conditions. A first acquisition step of acquiring history data of processed lots related to the combination when selected,
A determination step for determining compatibility between processing devices and compatibility between processing members;
History data of processed lots using one of the processing apparatus and the processing member related to the combination and having been determined to be compatible with the other in the determination step. A second acquisition step of acquiring from the recording device;
And a determining step for determining a process condition for processing an unprocessed lot based on the acquired history data. An exposure condition determination method for determining an exposure condition of an exposure apparatus related to a combination when selecting one combination from a combination of a plurality of exposure apparatuses and a plurality of reticles to perform exposure of an unprocessed lot,
Same as the combination of exposure device and reticle to be used for processing of unprocessed lots from the recording device in which history data consisting of exposure conditions used in processed lots and processing results under those conditions is recorded History data of processed lots related to the combination, and the combination of the alignment destination exposure apparatus and alignment destination reticle used for forming the alignment destination mask layer for aligning the exposure position is used for forming the alignment destination mask layer of the unprocessed lot. An acquisition step of acquiring history data of processed lots that are identical to the combination that has been
And a determining step for determining an exposure condition for exposing an unprocessed lot based on the acquired history data. The exposure condition determination method is further
A determination step for determining compatibility between exposure apparatuses, compatibility between reticles, compatibility between exposure apparatuses, and compatibility between alignment apparatuses;
An alignment destination exposure apparatus and alignment destination reticle that are history data of an already processed lot related to the same combination as the combination of an exposure apparatus and a reticle to be used for processing an unprocessed lot, and used for forming an alignment destination mask layer Either one of the two is the same as that used for forming the matching mask layer of the unprocessed lot, and the other is compatible with the one used for forming the matching mask layer of the unprocessed lot in the determination step. The exposure condition determination method according to claim 9, further comprising: an additional acquisition step of acquiring history data of a processed lot that has been determined to be good from the recording apparatus. When selecting one combination from a combination of a plurality of processing devices and a plurality of processing members to process an unprocessed lot, a program for causing a computer to determine the process conditions of the processing device related to the combination,
A combination of processing devices and processing members to be used for processing unprocessed lots in the past from a recording device that records historical data consisting of process conditions used in processed lots and processing results under those conditions. A first acquisition step of acquiring history data of processed lots related to the combination when selected,
A determination step for determining compatibility between processing devices and compatibility between processing members;
History data of processed lots using one of the processing apparatus and the processing member related to the combination, and processed lot history data related to a combination with one determined to be compatible with the other in the determination step A second acquisition step of acquiring from the recording device;
And a determination step for determining a process condition for processing an unprocessed lot based on the acquired history data. When selecting one combination from a combination of a plurality of exposure apparatuses and a plurality of reticles to perform exposure of an unprocessed lot, a program for causing a computer to determine the exposure conditions of the exposure apparatus related to the combination,
Same as the combination of exposure device and reticle to be used for processing of unprocessed lots from the recording device in which history data consisting of exposure conditions used in processed lots and processing results under those conditions is recorded History data of processed lots related to the combination, and the combination of the alignment destination exposure apparatus and alignment destination reticle used for forming the alignment destination mask layer for aligning the exposure position is used for forming the alignment destination mask layer of the unprocessed lot. An acquisition step of acquiring history data of processed lots that are identical to the combination that has been
And a determination step for determining an exposure condition for exposing an unprocessed lot based on the acquired history data. The program further
A determination step for determining compatibility between exposure apparatuses, compatibility between reticles, compatibility between exposure apparatuses, and compatibility between alignment apparatuses;
An alignment destination exposure apparatus and alignment destination reticle that are history data of an already processed lot related to the same combination as the combination of an exposure apparatus and a reticle to be used for processing an unprocessed lot, and used for forming an alignment destination mask layer Either one of the two is the same as that used for forming the matching mask layer of the unprocessed lot, and the other is compatible with the one used for forming the matching mask layer of the unprocessed lot in the determination step. The program according to claim 12, further comprising: an additional acquisition step of acquiring history data of a processed lot that has been determined to be good from the recording device.

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