JP2005202046A - Wavelength multiplexed light transmission module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wavelength multiplexed light transmission module being easily downsized. <P>SOLUTION: A plate type optical multiplexer 3 having incident parts 2 on a plurality of sides 15 and 16 is formed, a laser oscillators 4a, 4b, 4c and 4d are oppositely arranged at the respective incident parts 2 of the optical multiplexer 3, and a plurality of circuit substrates 5 and 6 for driving the laser oscillators 4a, 4b, 4c and 4d are laminated and arranged in the front and back face direction of the optical multiplexer 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a wavelength division multiplexing optical transmission module that multiplexes and transmits a plurality of laser beams having different wavelengths.

  In order to transmit / receive more information, there is a technique for transmitting and receiving a plurality of laser beams having different wavelengths. In this technique, as shown in FIG. 4, a wavelength division multiplexing optical transmission module 20 that multiplexes and transmits a plurality of laser beams having different wavelengths and is connected to the wavelength division multiplexing optical transmission module 20 via an optical fiber 21 and transmitted. The optical signal is transmitted / received to / from the wavelength division multiplexed light receiving module 22 that receives the laser beam by demultiplexing it for each wavelength.

  And as a wavelength division multiplexing optical transmission module, the thing of patent documents 1 is known.

  As shown in FIG. 5, the wavelength multiplexing optical transmission module 23 multiplexes two laser oscillators 4a and 4b that transmit laser beams having different wavelengths and laser beams emitted from the respective laser oscillators 4a and 4b. An optical multiplexer 24 is provided.

  Some wavelength division multiplexing optical transmission modules have four laser oscillators 4a, 4b, 4c and 4d as shown in FIG. These laser oscillators 4 a, 4 b, 4 c, and 4 d are arranged in a line along one side of the optical multiplexer 25, and are connected to the circuit board 27 through leads 26. The optical multiplexer 25 is composed of an optical waveguide element and is formed in a plate shape. Further, the optical multiplexer 25 and the circuit board 27 are arranged with their sides facing each other.

JP-A-5-93825 JP 2003-14994 A

  By the way, in the above-described wavelength multiplexing optical transmission module, since all the laser oscillators 4a, 4b, 4c, and 4d are arranged along one side of the optical multiplexer 25, the size of one side becomes large and the wavelength multiplexing optical transmission module becomes large. There was a problem that it would become. Further, since the circuit board 27 and the optical multiplexer 25 are arranged to face each other, a space for arranging the circuit board 27 and the optical multiplexer 25 in the abutting direction is necessary, and it is difficult to reduce the size of the wavelength division multiplexing optical transmission module. There was a problem of doing.

  Furthermore, the electronic component 12 for driving all the laser oscillators 4a, 4b, 4c, and 4d is disposed on the same circuit board, so that there is a problem that electronic crosstalk occurs and the signal deteriorates. It was. Then, the electronic components 12 are arranged on the same circuit board, so that the components 12 are densely packed, and there is a problem that thermal interference to the optical multiplexer is also increased.

  Accordingly, an object of the present invention is to provide a wavelength multiplexing method that can solve the above-described problems, can be easily downsized, reduce electronic crosstalk between electronic components, and prevent thermal interference from each electronic component to the optical multiplexer. It is to provide an optical transmission module.

  In order to achieve the above object, the present invention forms a plate-shaped optical multiplexer having incident portions on a plurality of sides, and a laser oscillator is disposed opposite to each incident portion of the optical multiplexer, so that the optical coupling is performed. A plurality of circuit boards for driving the laser oscillator are arranged in the front and back direction of the waver.

  The optical multiplexer may have the incident portion on each of opposite sides.

  The circuit board may be fixed to the casing via a heat transfer material.

  And the said heat-transfer material is fixed to the back side of the said circuit board, and it is good to arrange | position between a circuit board and the said optical multiplexer.

  The optical multiplexer may be disposed between the circuit boards.

  According to the present invention, the wavelength division multiplexing optical transmission module can be easily reduced in size and electronic crosstalk between electronic components can be reduced. Further, it is possible to prevent thermal interference from the electronic component to the optical multiplexer.

  FIG. 1 is a front sectional view of a wavelength division multiplexing optical transmission module, and FIG. 2 is a sectional view taken along line AA in FIG.

  As shown in FIGS. 1 and 2, the wavelength division multiplexing optical transmission module 1 includes a plate-shaped optical multiplexer 3 having incident portions 2 on a plurality of sides 15 and 16, and incident portions 2 of the optical multiplexer 3. The laser oscillators 4 a, 4 b, 4 c, and 4 d arranged opposite to each other, and circuit boards 5 and 6 for driving the laser oscillator 4 arranged in a plurality of layers in the front and back direction of the optical multiplexer 3 are configured. Yes.

  The optical multiplexer 3 is formed in a rectangular plate shape and has a plurality of optical transmission paths 7 therein. Each of the optical transmission lines 7 forms the incident part 2 on both sides of the optical multiplexer 3 and is joined together, and forms an emission part 8 for emitting laser light on the front of the optical multiplexer 3. .

  The laser oscillators 4a, 4b, 4c, and 4d are made of laser diodes (Can-LD) with a metal casing, and are configured to oscillate laser beams having different wavelengths. The laser oscillators 4a, 4b, 4c, and 4d are aligned with the corresponding incident portions 2 and fixed to a fixed system such as the casing 9.

  One circuit board 5, 6 is disposed above and below the optical multiplexer 3, and is fixed to the casing 9 that forms the outer shell of the wavelength division multiplexing optical transmission module 1 via the heat transfer material 10. Has been. Specifically, the heat transfer material 10 is made of a metal plate, and is fixed in close contact with the back sides of the circuit boards 5 and 6. The heat transfer material 10 has one side portion and a rear portion fixed to the casing 9 so that the heat transferred from the circuit boards 5 and 6 can be released to the casing 9 satisfactorily. In addition, each heat transfer material 10 is disposed so as to be spaced apart in the vertical direction, and is configured to support the optical multiplexer 3 via the support legs 11 therebetween. The support legs 11 are formed of a resin having a high thermal resistance, and hardly transmit the heat of the heat transfer material 10 to the optical multiplexer 3. Thus, the circuit boards 5 and 6 are arranged so that the back side faces the optical multiplexer 3, and the circuit board main body 13 and the optical multiplexer 3 are transmitted between the heat generating electronic component (IC or the like) 12 and the optical multiplexer 3. The heat material 10 is interposed to block heat from the electronic component 12 toward the optical multiplexer 3.

  The circuit board 5 arranged on the upper side and the circuit board 6 arranged on the lower side are connected to different laser oscillators 4a, 4b, 4c and 4d, respectively, and a plurality of laser oscillators 4a, 4b and 4c are connected. 4d is shared and driven. Specifically, the circuit board 5 disposed on the upper side is connected to the two laser oscillators 4c and 4d along one side of the optical multiplexer 3 via the leads 14, and the circuit board disposed on the lower side. 6 is connected to two laser oscillators 4 a and 4 b along the other side of the optical multiplexer 3 via leads 14. The other ends of the circuit boards 5 and 6 and the heat transfer material 10 are separated from the casing 9 so as to pass leads 14 extending from the front side of the circuit boards 5 and 6. The other ends of the circuit boards 5, 6 and the heat transfer material 10 and the optical multiplexer 3 are arranged so that the ends are aligned, and the lead 14 and the laser oscillators 4a, 4b, 4c, 4d can be easily taken. It can be turned.

  Next, the operation of this embodiment will be described.

  Heat generated from the electronic component 12 is transferred to the heat transfer material 10 through the circuit boards 5 and 6. Since the heat transfer material 10 is made of a metal having good heat transfer properties and is fixed in close contact with the back side of the circuit boards 5 and 6, the heat of the circuit boards 5 and 6 does not stay on the circuit boards 5 and 6. It is efficiently transmitted to the heat transfer material 10. Further, since the heat transfer material 10 is fixed to the back side of the circuit boards 5 and 6 and is disposed between the circuit boards 5 and 6 and the optical multiplexer 3, it directly radiates heat from the electronic component 12 to the optical multiplexer 3. It will never be done.

  The heat transferred to the heat transfer material 10 is transferred from one side and the rear portion of the heat transfer material 10 to the casing 9 and is radiated to the outside of the module 1. At this time, since the heat transfer material 10 and the optical multiplexer 3 are separated via the support legs 11, the heat of the circuit boards 5 and 6 is hardly transmitted to the optical multiplexer 3, and the optical multiplexer 3 Laser light from the laser oscillators 4a, 4b, 4c, and 4d can be transmitted efficiently.

  In this manner, the plate-shaped optical multiplexer 3 having the incident portions 2 on the plurality of sides 15 and 16 is formed, and the laser oscillators 4a, 4b, 4c, and 4d are opposed to the incident portions 2 of the optical multiplexer 3, respectively. In order to arrange a plurality of circuit boards 5 and 6 for driving the laser oscillators 4a, 4b, 4c and 4d in the front and back direction of the optical multiplexer 3, the incident portion 2 of the optical multiplexer 3 is provided. The lengths of the sides 15 and 16 can be shortened according to the number of the incident portions 2, and the lengths of the sides of the circuit boards 5 and 6 connected to the laser oscillators 4a, 4b, 4c and 4d are also shortened accordingly. Can be formed. Furthermore, in order to arrange the optical multiplexer 3 and the circuit boards 5 and 6 so as to overlap with each other, the optical multiplexer 3 and the circuit board 5 and 6 are arranged in a plane space in which one of the optical multiplexer 3 and the circuit boards 5 and 6 is arranged. Both the circuit boards 5 and 6 can be installed, and the wavelength division multiplexing optical transmission module 1 can be easily downsized.

  Moreover, since the incident part 2 was formed in each of the opposing sides 15 and 16 of the optical multiplexer 3, the optical transmission path 7 can be combined with a simple structure, and the enlargement and cost increase of the optical multiplexer 3 are prevented. be able to.

  Since the circuit boards 5 and 6 are fixed to the casing 9 via the heat transfer material 10, the heat of the circuit boards 5 and 6 can be released to the casing 9 well via the heat transfer material 10.

  Further, since the heat transfer material 10 is fixed to the back side of the circuit boards 5 and 6 and is disposed between the circuit boards 5 and 6 and the optical multiplexer 3, the electrons mounted on the circuit boards 5 and 6 are used. Heat from the component 12 toward the optical multiplexer 3 can be blocked by the circuit board body 13 and the heat transfer material 10.

  And since the optical multiplexer 3 was arrange | positioned between the upper and lower circuit boards 5 and 6, the circuit boards 5 and 6 and each laser oscillator 4a, 4b, 4c, 4d can be easily connected with the lead | lead 14, The circuit boards 5 and 6 and the optical multiplexer 3 can be easily overlapped and arranged.

  In particular, by arranging the electronic components 12 for driving the laser oscillators 4a, 4b, 4c, and 4d separately on the upper and lower circuit boards 5 and 6, crosstalk between the electronic components 12 divided on the upper and lower sides is prevented. Crosstalk can be reduced.

  In the above-described embodiment, the other ends of the circuit boards 5 and 6 and the optical multiplexer 3 are separated from the casing 9 with their ends aligned, but the present invention is not limited to this. For example, as shown in FIG. 3, the circuit boards 17 and 18 may be formed to extend by the installation space of the laser oscillators 4a, 4b, 4c, and 4d, and the leads 19 may be formed short.

  Further, although the laser oscillators 4a, 4b, 4c, and 4d are made of laser diodes (Can-LD) with a metal casing, other types of semiconductor lasers (not shown) may be used.

  The circuit boards 5 and 6 are arranged one by one in the vertical direction of the optical multiplexer 3, but a plurality of circuit boards 5 and 6 may be arranged in the upper, lower or upper and lower directions of the optical multiplexer 3. Good.

  Further, a plate-shaped heat shield (not shown) may be disposed between the optical multiplexer 3 and the heat transfer material 10. This heat shield may be formed of a resin having a high thermal resistance.

It is front sectional drawing of a wavelength division multiplexing optical transmission module. It is AA arrow sectional drawing of FIG. It is front sectional drawing of the wavelength division multiplexing optical transmission module which shows other embodiment. It is a schematic explanatory drawing of a wavelength division multiplexing optical transmission module and a wavelength division multiplexing optical reception module. It is a top view of the conventional wavelength division multiplexing optical transmission module. It is a top view of the conventional wavelength division multiplexing optical transmission module.

Explanation of symbols

2 Incident part 3 Optical multiplexer 4a Laser oscillator 4b Laser oscillator 4c Laser oscillator 4d Laser oscillator 5 Circuit board 6 Circuit board 9 Casing 10 Heat transfer material 15 Side 16 (for optical multiplexer) Side (for optical multiplexer)

Claims (5)

  A plate-shaped optical multiplexer having incident portions on a plurality of sides is formed, a laser oscillator is disposed opposite to each incident portion of the optical multiplexer, and the laser oscillator is driven in the front and back direction of the optical multiplexer. A wavelength division multiplexing optical transmission module, wherein a plurality of circuit boards are arranged to overlap each other.   The wavelength division multiplexing optical transmission module according to claim 1, wherein the optical multiplexer has the incident portion on each of opposite sides.   The wavelength division multiplexing optical transmission module according to claim 1, wherein the circuit board is fixed to the casing via a heat transfer material.   4. The wavelength division multiplexing optical transmission module according to claim 3, wherein the heat transfer material is fixed to a back side of the circuit board and is disposed between the circuit board and the optical multiplexer. The wavelength division multiplexing optical transmission module according to claim 1, wherein the optical multiplexer is disposed between the circuit boards.

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