CA2200866C - Optical data connection between adjacent subassemblies - Google Patents
Optical data connection between adjacent subassemblies Download PDFInfo
- Publication number
- CA2200866C CA2200866C CA002200866A CA2200866A CA2200866C CA 2200866 C CA2200866 C CA 2200866C CA 002200866 A CA002200866 A CA 002200866A CA 2200866 A CA2200866 A CA 2200866A CA 2200866 C CA2200866 C CA 2200866C
- Authority
- CA
- Canada
- Prior art keywords
- bgl
- subassembly
- transmitting
- optical data
- data connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
- H04B10/803—Free space interconnects, e.g. between circuit boards or chips
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Communication System (AREA)
Abstract
In order to seduce the number of multiple plug-in connectors in an optical data-link between adjacent component assemblies, the invention calls for at least one suitably modulated beam of light (SK) to be radiated by one assembly (BGL) to the adjacent assembly (BGL) through the space between the assemblies (BGL).
Description
22008~b Description Optical data connection between adjacent subassemblies The invention relates to an optical data connec-tion between adjacent subassemblies which are arranged parallel and side by side within a subassembly frame, in which connection at least one correspondingly modulated light beam is emitted through the interspace between adjacent subassemblies from one subassembly to the adjacent subassembly, at least one transmitting module having a laser diode arrangement which emits a slightly divergent light beam being arranged on one subassembly, and at least one receiving module having a photodiode arrangement being arranged on the opposite subassembly.
An optical data connection of this type is known, for example, from DE 37 39 629 A1. However, in the case of this known optical data connection, transmission can take place in only one direction, since each subassembly has a transmitting module only on one side and a receiving module on the other side.
However, optical data connections between adjac-ent subassemblies are already known (see, for example, "Optoelectronic interconnection based on a light-guiding plate with holographic coupling elements", Optical engineering 30 (10), 1620-1623 (October 1991)) which permit duplex operation. In this case, the optical connection is carried out via a light-guiding glass plate in the back plane printed circuit board. In this case there are considerable problems in the coupling of the light beams into and out of the light-guiding glass plate.
It is therefore the object of the present inven-tion to specify an ogtical data connection between adjacent subassemblies of the type mentioned at the beginning which is distinguished by a simple construction and permits transmitting and receiving operation in both directions.
P44 34 358.2-35 This object is achieved in the case of an optical data connection of the type mentioned at the beginning by providing on one side of each subassembly a single-part transmitting and receiving module having a laser diode arrangement and a photodiode arrangement (PD), the laser diode arrangement and the photodiode arrangement being arranged within the transmitting and receiving module, lying parallel to the subassembly printed circuit board and being arranged opposite each other offset by a specific amount, surface plane mirrors for deflecting the light beams through 90 degrees being provided between these two arrangements in the respective beam paths, and one of the light beams passing through an aperture in the subassembly printed circuit board.
The optical data connection according to the invention is distinguished by a simple construction. As a result of the fact that a single module is needed for transmitting and receiving and apertures in the subassembly are provided at the place of mounting of the module, a single module can transmit and receive in both directions.
DE 39 08 786 A1 has already disclosed a method of information transmission between circuit boards of an electronic circuit. However, the components for carrying out this known information transmission method cannot be constructed in modular fashion. Moreover, the known method is not position-tolerant and exhibits considerable transmission losses. In addition, it is not easy to implement in practice.
An advantageous refinement of the optical data connection according to the invention can be character-ized in that AMENDED SHEET
P44 34 358.2-35 the transmitting and receiving module contains a plurality of laser diode arrangements and photodiode arrangements side by side.
The invention is described in more detail below using an exemplary embodiment shown in the figure.
In the figures:
FIG 1 shows the basic construction of an optical data connection according to the present invention, and FIG 2 shows the basic construction of transmitting and receiving modules for the construction of an optical data connection, the modules being able to transmit and receive in both directions.
FIG 1 shows the basic construction of an optical data connection according to the present invention between two subassembly printed circuit boards BGL, which are arranged parallel and side by side. Arranged on each printed circuit board are transmitting locations SO and receiving locations EO, opposite which corresponding AMENDED SHEET
EO and transmitting locations SO lie on the other subassembly printed circuit board. In FIG 1, the expan-sion of the beam can be seen, as a result of which the optical connection is tolerant in terms of position and does not have to be adjusted. The expansion is optimized to the maximum received power at given tolerances and connection lengths.
The transmitting location essentially comprises a laser diode and the receiving location essentially comprises a photodiode. A plurality of transmitting locations SO and receiving locations SO can be accommo-dated within one transmitting and receiving module SEM.
FIG 2 shows in principle a particularly expedient construction of such transmitting and receiving modules.
To form the light beam, lenses L are combined both with the laser diodes LD and with the photodiodes PD. These lenses are in each case integrated with a laser diode LD
or with a photodiode PD in a submodule. This integration can also include the electronics necessary for the electro-optic conversion. In the case of the embodiment of transmitting and receiving modules SEM shown in FIG 2, the submodules are arranged lying down, in order to reduce the module constructional height. The deflection into the emission directions is carried out via surface plane mirrors SP. Here, all the necessary components are arranged in one single module. The module SEM can be fitted to both sides of a subassembly in order to produce connections to both sides. If, as is shown in FIG 2, apertures are provided in the subassembly printed circuit board and in the corresponding housing wall of the module, a single module can transmit and receive in both directions.
In this arrangement, a module can contain a plurality of transmitting and receiving channels side by side, the minimum channel separation being able to lie in the range from 5 to 10 mm.
Finally, the advantages of the optical data connection according to the invention are summarized once more:
The optical connections to adjacent subassemblies need no longer be led via the back plane, the back plane is relieved, the routing on the subassembly is simplified. The optical connection can transmit almost arbitrarily high data 5 rates, the restriction lying exclusively in the electro-optic converters.
Transmitting and receiving modules can be arranged arbitrarily on the subassembly printed circuit board, even directly in the vicinity of high-frequency sources and sinks.
Impedance matching problems are dispensed with in the case of the optical data connection.
The optical data connection is a contactless connection, as a result of which the use of plug and socket connectors is dispensed with.
Cross-talk on parallel channels is negligible, even at high frequencies, and is independent of the data rate.
In accordance with this invention, there is provided an optical data connection between adjacent subassemblies (BGL) which are arranged parallel and side by side within a subassembly frame, in which connection at least one correspondingly modulated light beam is emitted through the interspace between adjacent subassemblies (BGL) from one subassembly (BGL) to the adjacent subassembly (BGL), at least one transmitting module (SO) having a laser diode arrangement which emits a slightly divergent light beam being arranged on one subassembly (BGL), and at least one receiving module (EO) having a photodiode arrangement being arranged on the opposite subassembly (BGL), characterized in that, on one side of each subassembly (BGL) there is provided a single-part transmitting and receiving module 5a (SEM) having a laser diode arrangement (LD) and a photodiode arrangement (PD), the laser diode arrangement (LD) and the photodiode arrangement (PD) being arranged within the Y
transmitting and receiving module (SEM), lying parallel to the subassembly printed circuit board (BGL) and being arranged opposite each other offset by a specific amount, surface plane mirrors (SP) for deflecting the light beams through 90 degrees being provided between these two arrangements in the respective beam paths, and in that one of the light beams (SK) passes through an aperture (D) in the subassembly printed circuit board (BGL).
An optical data connection of this type is known, for example, from DE 37 39 629 A1. However, in the case of this known optical data connection, transmission can take place in only one direction, since each subassembly has a transmitting module only on one side and a receiving module on the other side.
However, optical data connections between adjac-ent subassemblies are already known (see, for example, "Optoelectronic interconnection based on a light-guiding plate with holographic coupling elements", Optical engineering 30 (10), 1620-1623 (October 1991)) which permit duplex operation. In this case, the optical connection is carried out via a light-guiding glass plate in the back plane printed circuit board. In this case there are considerable problems in the coupling of the light beams into and out of the light-guiding glass plate.
It is therefore the object of the present inven-tion to specify an ogtical data connection between adjacent subassemblies of the type mentioned at the beginning which is distinguished by a simple construction and permits transmitting and receiving operation in both directions.
P44 34 358.2-35 This object is achieved in the case of an optical data connection of the type mentioned at the beginning by providing on one side of each subassembly a single-part transmitting and receiving module having a laser diode arrangement and a photodiode arrangement (PD), the laser diode arrangement and the photodiode arrangement being arranged within the transmitting and receiving module, lying parallel to the subassembly printed circuit board and being arranged opposite each other offset by a specific amount, surface plane mirrors for deflecting the light beams through 90 degrees being provided between these two arrangements in the respective beam paths, and one of the light beams passing through an aperture in the subassembly printed circuit board.
The optical data connection according to the invention is distinguished by a simple construction. As a result of the fact that a single module is needed for transmitting and receiving and apertures in the subassembly are provided at the place of mounting of the module, a single module can transmit and receive in both directions.
DE 39 08 786 A1 has already disclosed a method of information transmission between circuit boards of an electronic circuit. However, the components for carrying out this known information transmission method cannot be constructed in modular fashion. Moreover, the known method is not position-tolerant and exhibits considerable transmission losses. In addition, it is not easy to implement in practice.
An advantageous refinement of the optical data connection according to the invention can be character-ized in that AMENDED SHEET
P44 34 358.2-35 the transmitting and receiving module contains a plurality of laser diode arrangements and photodiode arrangements side by side.
The invention is described in more detail below using an exemplary embodiment shown in the figure.
In the figures:
FIG 1 shows the basic construction of an optical data connection according to the present invention, and FIG 2 shows the basic construction of transmitting and receiving modules for the construction of an optical data connection, the modules being able to transmit and receive in both directions.
FIG 1 shows the basic construction of an optical data connection according to the present invention between two subassembly printed circuit boards BGL, which are arranged parallel and side by side. Arranged on each printed circuit board are transmitting locations SO and receiving locations EO, opposite which corresponding AMENDED SHEET
EO and transmitting locations SO lie on the other subassembly printed circuit board. In FIG 1, the expan-sion of the beam can be seen, as a result of which the optical connection is tolerant in terms of position and does not have to be adjusted. The expansion is optimized to the maximum received power at given tolerances and connection lengths.
The transmitting location essentially comprises a laser diode and the receiving location essentially comprises a photodiode. A plurality of transmitting locations SO and receiving locations SO can be accommo-dated within one transmitting and receiving module SEM.
FIG 2 shows in principle a particularly expedient construction of such transmitting and receiving modules.
To form the light beam, lenses L are combined both with the laser diodes LD and with the photodiodes PD. These lenses are in each case integrated with a laser diode LD
or with a photodiode PD in a submodule. This integration can also include the electronics necessary for the electro-optic conversion. In the case of the embodiment of transmitting and receiving modules SEM shown in FIG 2, the submodules are arranged lying down, in order to reduce the module constructional height. The deflection into the emission directions is carried out via surface plane mirrors SP. Here, all the necessary components are arranged in one single module. The module SEM can be fitted to both sides of a subassembly in order to produce connections to both sides. If, as is shown in FIG 2, apertures are provided in the subassembly printed circuit board and in the corresponding housing wall of the module, a single module can transmit and receive in both directions.
In this arrangement, a module can contain a plurality of transmitting and receiving channels side by side, the minimum channel separation being able to lie in the range from 5 to 10 mm.
Finally, the advantages of the optical data connection according to the invention are summarized once more:
The optical connections to adjacent subassemblies need no longer be led via the back plane, the back plane is relieved, the routing on the subassembly is simplified. The optical connection can transmit almost arbitrarily high data 5 rates, the restriction lying exclusively in the electro-optic converters.
Transmitting and receiving modules can be arranged arbitrarily on the subassembly printed circuit board, even directly in the vicinity of high-frequency sources and sinks.
Impedance matching problems are dispensed with in the case of the optical data connection.
The optical data connection is a contactless connection, as a result of which the use of plug and socket connectors is dispensed with.
Cross-talk on parallel channels is negligible, even at high frequencies, and is independent of the data rate.
In accordance with this invention, there is provided an optical data connection between adjacent subassemblies (BGL) which are arranged parallel and side by side within a subassembly frame, in which connection at least one correspondingly modulated light beam is emitted through the interspace between adjacent subassemblies (BGL) from one subassembly (BGL) to the adjacent subassembly (BGL), at least one transmitting module (SO) having a laser diode arrangement which emits a slightly divergent light beam being arranged on one subassembly (BGL), and at least one receiving module (EO) having a photodiode arrangement being arranged on the opposite subassembly (BGL), characterized in that, on one side of each subassembly (BGL) there is provided a single-part transmitting and receiving module 5a (SEM) having a laser diode arrangement (LD) and a photodiode arrangement (PD), the laser diode arrangement (LD) and the photodiode arrangement (PD) being arranged within the Y
transmitting and receiving module (SEM), lying parallel to the subassembly printed circuit board (BGL) and being arranged opposite each other offset by a specific amount, surface plane mirrors (SP) for deflecting the light beams through 90 degrees being provided between these two arrangements in the respective beam paths, and in that one of the light beams (SK) passes through an aperture (D) in the subassembly printed circuit board (BGL).
Claims (2)
1. Optical data connection between adjacent subassemblies (BGL) which are arranged parallel and side by side within a subassembly frame, in which connection at least one correspondingly modulated light beam is emitted through the interspace between adjacent subassemblies (BGL) from one subassembly (BGL) to the adjacent subassembly (BGL), at least one transmitting module (SO) having a laser diode arrangement which emits a slightly divergent light beam being arranged on one subassembly (BGL), and at least one receiving module (EO) having a photodiode arrangement being arranged on the opposite subassembly (BGL), characterized in that, on one side of each subassembly (BGL) there is provided a single-part transmitting and receiving module (SEM) having a laser diode arrangement (LD) and a photodiode arrangement (PD), the laser diode arrangement (LD) and the photodiode arrangement (PD) being arranged within the transmitting and receiving module (SEM), lying parallel to the subassembly printed circuit board (BGL) and being arranged opposite each other offset by a specific amount, surface plane mirrors (SP) for deflecting the light beams through 90 degrees being provided between these two arrangements in the respective beam paths, and in that one of the light beams (SK) passes through an aperture (D) in the subassembly printed circuit board (BGL).
2. Optical data connection according to Claim 1, characterized in that the transmitting and receiving module (SEM) contains a plurality of laser diode arrange-ments and photodiode arrangements (LD, PD) side by side.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP4434358.2 | 1994-09-26 | ||
| DE19944434358 DE4434358C1 (en) | 1994-09-26 | 1994-09-26 | Optical data connection between neighboring modules |
| PCT/DE1995/001247 WO1996010302A1 (en) | 1994-09-26 | 1995-09-12 | Optical data-link between adjacent component assemblies |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2200866A1 CA2200866A1 (en) | 1996-04-04 |
| CA2200866C true CA2200866C (en) | 2007-01-09 |
Family
ID=6529214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002200866A Expired - Fee Related CA2200866C (en) | 1994-09-26 | 1995-09-12 | Optical data connection between adjacent subassemblies |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0783807A1 (en) |
| JP (1) | JPH09511885A (en) |
| CN (1) | CN1076549C (en) |
| BR (1) | BR9509207A (en) |
| CA (1) | CA2200866C (en) |
| DE (1) | DE4434358C1 (en) |
| TW (1) | TW300287B (en) |
| WO (1) | WO1996010302A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5920664A (en) * | 1996-06-03 | 1999-07-06 | Nippon Telegraph And Telephone Corporation | Board-to-board and unit-to-unit optical interconnection system |
| DE19840355A1 (en) * | 1998-09-04 | 2000-03-09 | Abb Patent Gmbh | Optoelectronic component, esp. for communications between circuit boards, has two main surfaces with optical communications arrangements contg. infrared transmitters/receivers, etc. |
| BR0206054A (en) * | 2002-06-26 | 2004-04-20 | Fidia Spa | Optically connected system for data transfer between industrial automation devices |
| CN103135181B (en) * | 2011-12-01 | 2016-01-13 | 鸿富锦精密工业（深圳）有限公司 | Optical transport module |
| CN115113344A (en) * | 2021-03-18 | 2022-09-27 | 富士康(昆山)电脑接插件有限公司 | Contactless connector and assembly thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3739629A1 (en) * | 1987-11-23 | 1989-06-01 | Siemens Ag | Circuit arrangement for slide-in units which transmit information between themselves within a data-processing device |
| DE3908786A1 (en) * | 1989-03-17 | 1989-08-03 | Cordell Steve | Method for data transfer between boards of an electronic circuit |
| GB9017306D0 (en) * | 1990-08-07 | 1990-09-19 | British Aerospace | Optical backplane |
| DE4136893A1 (en) * | 1991-11-09 | 1993-05-13 | Ant Nachrichtentech | OPTICAL TRANSMITTER AND RECEIVER ARRANGEMENT |
| JPH06252855A (en) * | 1993-03-01 | 1994-09-09 | Sharp Corp | Equipment for optical wireless communication |
-
1994
- 1994-09-26 DE DE19944434358 patent/DE4434358C1/en not_active Expired - Lifetime
-
1995
- 1995-09-12 WO PCT/DE1995/001247 patent/WO1996010302A1/en not_active Application Discontinuation
- 1995-09-12 EP EP95930393A patent/EP0783807A1/en not_active Ceased
- 1995-09-12 BR BR9509207A patent/BR9509207A/en not_active IP Right Cessation
- 1995-09-12 CA CA002200866A patent/CA2200866C/en not_active Expired - Fee Related
- 1995-09-12 JP JP8511257A patent/JPH09511885A/en active Pending
- 1995-09-12 CN CN95196067A patent/CN1076549C/en not_active Expired - Fee Related
- 1995-09-15 TW TW84109673A patent/TW300287B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO1996010302A1 (en) | 1996-04-04 |
| EP0783807A1 (en) | 1997-07-16 |
| JPH09511885A (en) | 1997-11-25 |
| CN1076549C (en) | 2001-12-19 |
| TW300287B (en) | 1997-03-11 |
| BR9509207A (en) | 1997-10-14 |
| DE4434358C1 (en) | 1996-03-28 |
| CA2200866A1 (en) | 1996-04-04 |
| CN1163028A (en) | 1997-10-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |