JP2005197047A - Image display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image display device preventing generation of discharge and damage on a spacer with improved reliability and display quality. <P>SOLUTION: A spacer body structure 22 supporting an ambient pressure load acting on a first and a second substrates is provided between the first substrate 10 with a phosphor screen formed and the second substrate 12 fitted with a plurality of electron emission sources 18. The spacer body structure is provided with a support substrate 24 arranged in opposition to the first and the second substrates, equipped with a plurality of electron beam passing holes 26 set in opposition to the respective electron emission sources and coated with an insulating layer 25, as well as a plurality of spacers 30a, 30b erected on at least either surface of the support substrate 24 among the plurality of electron beam passing holes. A peripheral edge part of the support substrate is covered with an insulating member 48 set in superposition on the insulating layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an image display device including a substrate disposed oppositely and a spacer structure disposed between the substrates.

  2. Description of the Related Art In recent years, various flat-type image display devices have attracted attention as next-generation lightweight and thin display devices that replace cathode ray tubes (hereinafter referred to as CRTs). For example, a surface conduction electron-emitting device (hereinafter referred to as SED) is being developed as a kind of field emission device (hereinafter referred to as FED) that functions as a flat display device.

  The SED includes a first substrate and a second substrate that are arranged to face each other at a predetermined interval, and these substrates are joined to each other through a rectangular side wall to form a vacuum envelope. Yes. Three color phosphor layers are formed on the inner surface of the first substrate, and on the inner surface of the second substrate, a large number of electron-emitting devices corresponding to each pixel are arranged as an electron source for exciting the phosphor. Each electron-emitting device includes an electron-emitting portion and a pair of electrodes that apply a voltage to the electron-emitting portion.

  In the SED, it is important to maintain a high degree of vacuum in the space between the first substrate and the second substrate, that is, in the vacuum envelope. When the degree of vacuum is low, the lifetime of the electron-emitting device, and hence the lifetime of the device, is reduced. In order to support an atmospheric pressure load acting between the first substrate and the second substrate and maintain a gap between the substrates, a large number of plate-like or columnar spacers are arranged between the two substrates (for example, Patent Documents). 1). These spacers are erected on a plate-like grid disposed between the first substrate and the second substrate.

In such an SED, when an image is displayed, an anode voltage is applied to the phosphor layer, and an electron beam emitted from the electron-emitting device is accelerated by the anode voltage to collide with the phosphor layer, so that the phosphor Flash and display image. In order to obtain practical display characteristics, it is necessary to use a phosphor similar to a normal cathode ray tube and set the anode voltage to several kV or more, preferably 5 kV or more.
JP 2001-272927 A

  In the SED configured as described above, the luminance of the display image depends on the acceleration voltage applied between the first substrate and the second substrate. Therefore, it is desirable to apply a high voltage between the first and second substrates. However, the gap between the first substrate and the second substrate is set to be relatively small, such as about 1 to 2 mm, from the viewpoints of resolution, support member characteristics, manufacturability, and the like. Therefore, when a high voltage is applied, it is inevitable that a strong electric field is formed in a small gap between the first substrate and the second substrate, and discharge (dielectric breakdown) is likely to occur between the two substrates. When such a discharge occurs, the phosphor screen, the electron-emitting device, or the drive circuit is damaged, which becomes a serious problem.

  Usually, since the grid disposed between the first and second substrates is formed of a metal plate, discharge may occur from the edge portion around the grid to the first substrate or the second substrate. In order to suppress discharge, the surface of the grid is covered with an insulating layer. However, it is difficult to cover the edge portion without any defects, which may cause injury during mass production.

  Further, the grid peripheral portion is attracted to the first substrate or the second substrate side by the Coulomb force generated during the operation of the SED. Therefore, for the purpose of preventing deformation of the grid peripheral portion, it is desirable to provide a spacer also on the grid peripheral portion. However, in this case, when the SED is manufactured, the spacer may become an obstacle and the handling of the grid may be deteriorated, and the peripheral spacer may be damaged when the grid is gripped.

  The present invention has been made in view of the above points, and an object of the present invention is to provide an image display device that prevents the occurrence of discharge and damages to spacers, and has improved reliability and display quality.

  In order to achieve the above object, an image display device according to an aspect of the present invention is configured to excite the phosphor screen while being disposed to face the first substrate with a gap between the first substrate on which the phosphor screen is formed. A second substrate provided with a plurality of electron emission sources, and a spacer structure provided between the first and second substrates and supporting an atmospheric pressure load acting on the first and second substrates, A spacer structure disposed opposite to the first and second substrates, each having a plurality of electron beam passage holes facing the electron emission source and coated with an insulating layer; A plurality of spacers erected on at least one surface of the support substrate between a plurality of electron beam passage holes, and a peripheral portion of the support substrate is provided so as to overlap the insulating layer Covered by members It is characterized by a door.

  An image display device according to another aspect of the present invention includes a first substrate on which a phosphor screen is formed, and a plurality of electron emission sources that are disposed to face the first substrate with a gap therebetween and excite the phosphor screen. And a spacer structure that is provided between the first and second substrates and supports an atmospheric pressure load that acts on the first and second substrates, and the spacer structure includes: A support substrate disposed opposite to the first and second substrates, each having a plurality of electron beam passage holes facing the electron emission source and covered with an insulating layer; and the plurality of electron beam passages A plurality of spacers erected on at least one surface of the support substrate between the holes, and an insulating layer covering a peripheral portion of the support substrate is an insulation covering the other part of the support substrate More than twice the thickness of the layer It is characterized in that have been made.

  According to the present invention, it is possible to provide an image display device in which the peripheral edge of the support substrate of the spacer structure is covered with the insulating member, thereby suppressing the occurrence of discharge at the peripheral edge of the support member and improving the reliability and display quality. it can.

Hereinafter, an embodiment in which the present invention is applied to an SED, which is a kind of FED, as a flat-type image display device will be described in detail with reference to the drawings.
As shown in FIGS. 1 to 4, the SED includes a first substrate 10 and a second substrate 12 each made of a rectangular glass plate, and these substrates have a gap of about 1.0 to 2.0 mm. Corresponding arrangement. The 1st board | substrate 10 and the 2nd board | substrate 12 comprise the flat vacuum envelope 15 by which the peripheral part was joined through the rectangular-frame-shaped side wall 14 which consists of glass, and the inside was maintained at the vacuum.

  A phosphor screen 16 that functions as a phosphor screen is formed on the inner surface of the first substrate 10. The phosphor screen 16 is configured by arranging phosphor layers R, G, and B that emit light in red, green, and blue, and a light shielding layer 11, and these phosphor layers are formed in a stripe shape, a dot shape, or a rectangular shape. Yes. On the phosphor screen 16, a metal back 17 and a getter film 19 made of aluminum or the like are sequentially formed.

  On the inner surface of the second substrate 12, a number of surface-conduction electron-emitting elements 18 that emit electron beams are provided as electron emission sources for exciting the phosphor layers R, G, and B of the phosphor screen 16. Yes. These electron-emitting devices 18 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. Each electron-emitting device 18 includes an electron emitting portion (not shown) and a pair of device electrodes for applying a voltage to the electron emitting portion. On the inner surface of the second substrate 12, a large number of wirings 21 for supplying a potential to the electron-emitting devices 18 are provided in a matrix shape, and end portions thereof are drawn out of the vacuum envelope 15.

  The side wall 14 functioning as a bonding member is sealed to the peripheral edge of the first substrate 10 and the peripheral edge of the second substrate 12 by, for example, a sealing material 20 such as low-melting glass or low-melting metal. Are joined.

  As shown in FIGS. 2 to 5, the SED includes a spacer structure 22 disposed between the first substrate 10 and the second substrate 12. The spacer structure 22 includes a grid 24 made of a rectangular metal plate disposed between the first and second substrates 10 and 12, and a large number of columnar spacers integrally provided on both sides of the grid. It is configured.

  The grid 24 functioning as a support substrate has a first surface 24a facing the inner surface of the first substrate 10 and a second surface 24b facing the inner surface of the second substrate 12, and is arranged in parallel with these substrates. . A large number of electron beam passage holes 26 are formed in the grid 24 by etching or the like. The electron beam passage holes 26 are arranged in a plurality of columns and a plurality of rows so as to face the electron emission elements 18 and transmit the electron beams emitted from the electron emission elements. Assuming that the longitudinal direction of the vacuum envelope 15 is X and the width direction perpendicular thereto is Y, the electron beam passage holes 26 are arranged at a predetermined pitch in the longitudinal direction X and the width direction Y. Here, the pitch in the width direction Y is set larger than the pitch in the longitudinal direction X.

The grid 24 is formed with a thickness of 0.1 to 0.3 mm using, for example, an iron-nickel metal plate. On the surface of the grid 24, an oxide film made of an element constituting a metal plate, for example, an oxide film made of Fe ₃ O ₄ or NiFe ₂ O ₄ is formed. Further, the surfaces 24a and 24b of the grid 24 and the wall surfaces of the respective electron beam passage holes 26 are covered with an insulating layer 25 having glass as a main component and having a discharge current limiting effect.

  A plurality of first spacers 30 a are integrally provided on the first surface 24 a of the grid 24, and are positioned between adjacent electron beam passage holes 26. The tip of the first spacer 30 a is in contact with the inner surface of the first substrate 10 through the getter film 19, the metal back 17, and the light shielding layer 11 of the phosphor screen 16.

  A plurality of second spacers 30 b are integrally provided on the second surface 24 b of the grid 24, and are positioned between adjacent electron beam passage holes 26. The tip of the second spacer 30 b is in contact with the inner surface of the second substrate 12. Here, the tip of each second spacer 30 b is located on the wiring 21 provided on the inner surface of the second substrate 12. The first and second spacers 30 a and 30 b are arranged at a pitch several times larger than the electron beam passage holes 26 in the longitudinal direction X and the width direction Y. The first and second spacers 30a and 30b are aligned with each other, and are formed integrally with the grid 24 with the grid 24 sandwiched from both sides.

  As shown in FIGS. 4 and 5, each of the first and second spacers 30a and 30b is formed in a tapered shape having a diameter that decreases from the grid 24 side toward the extending end. For example, each first spacer 30a has an elongated oval cross-sectional shape. Similarly, each second spacer 30b has an elongated oval cross-sectional shape. The first and second spacers 30 a and 30 b are provided on the grid 24 in a state where the longitudinal direction thereof coincides with the longitudinal direction X. Further, spacers are not provided upright at the periphery of the grid from the outermost edge of the grid 24 to an area of about 10 mm, and the grid periphery forms a grip portion 27 for gripping the grid 24 during manufacturing.

  The spacer structure 22 configured as described above is disposed between the first substrate 10 and the second substrate 12. The first and second spacers 30a and 30b are in contact with the inner surfaces of the first substrate 10 and the second substrate 12, thereby supporting the atmospheric pressure load acting on these substrates and maintaining the distance between the substrates at a predetermined value. doing. The peripheral edge portion of the grid 24 constituting the grip portion 27 is covered with an insulating member 48 that is disposed so as to overlap the insulating layer 25.

  As shown in FIGS. 2 to 4, the insulating member 48 includes four first insulating members 50, second insulating members 52, and third insulating members 54 each formed in a long and narrow bar shape having a rectangular cross section. It has a book one by one. At the peripheral edge of each side of the grid 24, the first insulating member 50 is sandwiched between the grid peripheral edge and the first substrate 10 and extends over almost the entire length of one side of the grid. The second insulating member 50 is sandwiched between the peripheral edge of the grid and the first substrate 10 and extends over almost the entire length of one side of the grid. The third insulating member 54 is sandwiched between the first and second substrates 10 and 12 and extends over substantially the entire length of one side of the grid, and the outer edge of the grid 24, the first and second insulating members 50. , 52 are arranged in contact with each other. Accordingly, the peripheral edge of each side of the grid 24 is covered with the first to third insulating members 50, 52, and 54. The first and second insulating members 50 are in contact with the first and second substrates 10 and 12, respectively, and also function as spacers that support the peripheral edge of the grid 24 and the first and second substrates.

  The first to third insulating members 50, 52, and 54 are made of the same material as the first and second spacers 30a and 30b, for example, glass or ceramic. The first to third insulating members 50, 52, and 54 are, for example, the first and second substrates 10 and 12 by a sealing material 56 such as low-melting glass or low-melting metal, or by an inorganic adhesive. It is fixed to each. The first to third insulating members 50, 52, and 54 are linear members that extend along the periphery of the grid 24. However, the first to third insulating members 50, 52, and 54 may be formed in a frame shape in which four sides are integrated. Good. Further, the insulating member 48 is not limited to all four sides of the grid 24, and may be provided so as to cover at least the peripheral portions of the two sides.

  The SED includes a voltage supply unit (not shown) that applies a voltage to the grid 24 and the metal back 17 of the first substrate 10. The voltage supply unit is connected to the grid 24 and the metal back 17, and applies a voltage of 12 kV to the grid 24 and 10 kV to the metal back 17, for example. When an image is displayed in the SED, an anode voltage is applied to the phosphor screen 16 and the metal back 17, and the electron beam emitted from the electron emitter 18 is accelerated by the anode voltage to collide with the phosphor screen 16. . As a result, the phosphor layer of the phosphor screen 16 is excited to emit light and display an image.

Next, the manufacturing method of SED comprised as mentioned above is demonstrated. First, a method for manufacturing the spacer structure 22 will be described.
First, a grid 24 having a predetermined dimension and a rectangular plate-like upper mold and lower mold having substantially the same dimensions as this grid are prepared. In this case, a metal plate made of Fe-50% Ni having a thickness of 0.12 mm is degreased, washed and dried, and then the electron beam passage hole 26 is formed by etching. After the entire metal plate is oxidized, an insulating film is formed on the grid surface including the inner surface of the electron beam passage hole 26. Further, a coating solution containing glass as a main component is applied on the insulating film, dried, and baked to form a high resistance film. Thereby, the grid 24 is obtained.

  The upper mold and the lower mold as the molds are formed in a flat plate shape using a transparent material that transmits ultraviolet rays, for example, transparent silicon, transparent polyethylene terephthalate, or the like. The upper mold has a flat abutting surface that abuts against the grid 24 and a large number of bottomed spacer forming holes for forming the first spacer 30a. The spacer forming holes are opened in the contact surface of the upper mold, and are arranged at a predetermined interval. Similarly, the lower mold has a flat contact surface and a large number of bottomed spacer forming holes for molding the second spacer. Each of the spacer forming holes is opened on the contact surface of the lower mold, and is arranged at a predetermined interval.

  Next, the spacer forming material is filled into the upper mold spacer forming hole and the lower mold spacer forming hole. As the spacer forming material, a glass paste containing at least an ultraviolet curable binder (organic component) and a glass filler is used. The specific gravity and viscosity of the glass paste are appropriately selected.

  The upper mold filled with the spacer forming material is positioned and the contact surface is brought into close contact with the first surface 24 a of the grid 24. Similarly, the lower mold is positioned, and the contact surface is brought into close contact with the second surface 24 b of the grid 24. In a state where the upper mold and the lower mold are in close contact with the grid 24, ultraviolet rays (UV) are irradiated from the outside of the upper mold and the lower mold toward the spacer forming material. Since the upper mold and the lower mold are each formed of an ultraviolet transmissive material, the irradiated ultraviolet rays are transmitted through the upper mold and the lower mold and irradiated to the filled spacer forming material. Thereby, the spacer forming material is cured by ultraviolet rays.

  Subsequently, the upper mold and the lower mold are peeled from the grid 24 so that the cured spacer forming material remains on the grid 24. Next, the grid 24 provided with the spacer forming material is heat-treated in a heating furnace, the binder is blown from the spacer forming material, and then the spacer forming material is subjected to main baking at about 500 to 550 ° C. for 30 minutes to 1 hour. . Thereby, the spacer structure 22 in which the first and second spacers 30a and 30b are formed on the grid 24 is obtained.

  On the other hand, in the manufacture of the SED, the first substrate 10 provided with the phosphor screen 16 and the metal back 17 in advance, the second substrate on which the electron-emitting device 18 and the wiring 21 are provided and the side wall 14 is joined. 12 are prepared. Subsequently, as shown in FIG. 6A, the second insulating members 52 are respectively arranged and fixed in regions facing the periphery of the grid 24 of the second substrate 12. Next, the spacer structure 22 is positioned on the second substrate 12, and the peripheral edge of the grid 24 is placed on the second insulating member 52. As shown in FIG. 6B, the first insulating member 50 is placed on the peripheral portion of each side of the grid 24.

  After that, as shown in FIG. 6C, the third insulating member 54 is disposed outside the periphery of the grid 24 and outside the first and second insulating members 50 and 52, and on the second substrate 12. Fix it. In this way, the peripheral edge of the grid 24 is covered with the first to third insulating members 50, 52, and 54. Subsequently, as shown in FIG. 6 (d), the first substrate 10 and the second substrate 12 are arranged in a vacuum chamber, the inside of the vacuum chamber is evacuated, and then the first substrate is removed via the side wall 14. Bond to the substrate. Thereby, SED provided with the spacer structure 22 is manufactured.

  According to the SED configured as described above, the peripheral edge portion of the grid 24 is covered with the first to third insulating members 50, 52, and 54 disposed so as to overlap the insulating layer 25. Therefore, even if there is a defect in the insulating layer 25 at the periphery of the grid 24, the grid periphery can be reliably covered with the first to third insulating members 50, 52, 54. Therefore, it is possible to suppress the generation of discharge at the peripheral edge of the grid 24 and obtain an SED with improved reliability.

  Further, the insulating member 48 can function as a spacer that supports the grid periphery, and the first and second spacers at the grid periphery can be omitted. Thereby, at the time of manufacture of SED, it becomes possible to utilize a grid peripheral part as the holding part 27 without a spacer, and the handleability of the spacer structure 22 improves. At the same time, it is possible to prevent damage to the spacer during SED manufacturing. Therefore, the manufacturing yield is improved, and an SED with high reliability and high display quality can be obtained.

  Next explained is an SED according to the second embodiment of the invention. In the first embodiment described above, the insulating member 48 includes the independent first to third insulating members. However, according to the present embodiment, the insulating member 48 includes the first to third members. It has a structure integrally provided with an insulating member. That is, as shown in FIGS. 7 to 9, each insulating member 48 is formed in an elongated bar shape and has a rectangular cross-sectional shape. On one side surface of the insulating member 48, a slit 48a extending over the entire length is formed. Each insulating member 48 is attached to the grid and covers the peripheral edge of the grid in a state where the peripheral edge of the grid 24 is fitted in the slit 48a. The insulating member 48 also functions as a spacer that is sandwiched between the first and second substrates 10 and 12 and supports the peripheral edge of the grid.

  In the SED manufacturing process, as shown in FIG. 9, after forming the spacer structure 22, an insulating member 48 is attached to each side of the peripheral edge of the grid 24. Subsequently, the insulating member 48 is fixed at a predetermined position on the second substrate 12, and the spacer structure 22 is disposed on the second substrate. At this time, the spacer structure 22 can be handled while the insulating member 48 is held. Thereafter, the SED is manufactured by the same process as that of the first embodiment described above.

  Other configurations are the same as those of the first embodiment described above, and the same portions are denoted by the same reference numerals and detailed description thereof is omitted. And also in 2nd Embodiment, the effect similar to 1st Embodiment can be acquired. In the second embodiment, since the insulating member 48 is integrally formed, the number of parts is small, and the manufacturing efficiency can be improved.

  As shown in FIG. 10, in the second embodiment, the insulating member 48 is provided with a metal plate 60 exposed in the slit 48 a, and the metal plate is in contact with the peripheral surface of the grid 24. The member 48 may be attached to the periphery of the grid. By providing the metal plate 60, the mechanical strength of the portion of the insulating member that contacts the grid can be improved.

  In the above-described embodiment, the spacer structure 22 is configured to integrally include the first and second spacers and the grid, but the second spacer 30b may be formed on the second substrate 12. The spacer structure 22 may include only the support substrate and the second spacer, and the support substrate may be in contact with the first substrate.

  As shown in FIGS. 11 and 12, according to the SED according to the third embodiment of the present invention, the spacer structure 22 is formed only on the support substrate 24 made of a rectangular metal plate and on one surface of the support substrate. And a large number of columnar spacers 30 which are erected integrally. The support substrate 24 has a first surface 24 a facing the inner surface of the first substrate 10 and a second surface 24 b facing the inner surface of the second substrate 12, and is arranged in parallel with these substrates. A large number of electron beam passage holes 26 are formed in the support substrate 24 by etching or the like. The electron beam passage apertures 26 are respectively arranged to face the electron emission elements 18 and transmit the electron beams emitted from the electron emission elements.

  The first and second surfaces 24a and 24b of the support substrate 24 and the inner wall surface of each electron beam passage hole 26 are covered with an insulating layer 25 whose main component is glass, ceramic or the like. The support substrate 24 is provided with a first surface 24 a in surface contact with the inner surface of the first substrate 10 via the getter film, the metal back 17, and the phosphor screen 16. The electron beam passage hole 26 provided in the support substrate 24 faces the phosphor layers R, G, and B of the phosphor screen 16. Thereby, each electron-emitting device 18 is opposed to the corresponding phosphor layer through the electron beam passage hole 26.

  A plurality of spacers 30 are erected integrally on the second surface 24 b of the support substrate 24. The extended end of each spacer 30 is in contact with the inner surface of the second substrate 12, here, the wiring 21 provided on the inner surface of the second substrate 12. Each of the spacers 30 is formed in a tapered shape with a diameter decreasing from the grid 24 side toward the extending end. Each spacer 30 is formed in an oval shape whose cross section along the direction parallel to the surface of the support substrate 24 is elongated. The spacer 30 is provided on the support substrate 24 in a state in which the longitudinal direction thereof coincides with the longitudinal direction X of the vacuum envelope.

  The spacer structure 22 configured as described above acts on these substrates when the support substrate 24 comes into surface contact with the first substrate 10 and the extended end of the spacer 30 contacts the inner surface of the second substrate 12. The atmospheric pressure load is supported and the distance between the substrates is maintained at a predetermined value. The peripheral edge of the support substrate 24 is covered with an insulating member 48 that is disposed so as to overlap the insulating layer 25.

  The insulating member 48 includes four each of the first insulating member 50, the second insulating member 52, and the third insulating member 54, each of which is formed in an elongated bar shape having a rectangular cross section. At the peripheral edge of each side of the grid 24, the first insulating member 50 is sandwiched between the grid peripheral edge and the first substrate 10 and extends over almost the entire length of one side of the grid. The second insulating member 50 is sandwiched between the peripheral edge of the grid and the first substrate 10 and extends over almost the entire length of one side of the grid. The third insulating member 54 is sandwiched between the first and second substrates 10 and 12 and extends over substantially the entire length of one side of the grid, and the outer edge of the grid 24, the first and second insulating members 50. , 52 are arranged in contact with each other. Accordingly, the peripheral edge of each side of the grid 24 is covered with the first to third insulating members 50, 52, and 54. The first and second insulating members 50 are in contact with the first and second substrates 10 and 12, respectively, and also function as spacers that support the peripheral edge of the grid 24 and the first and second substrates.

  The first to third insulating members 50, 52, and 54 are made of the same material as the first and second spacers 30a and 30b, for example, glass or ceramic. The first to third insulating members 50, 52, and 54 are, for example, the first and second substrates 10 and 12 by a sealing material 56 such as low-melting glass or low-melting metal, or by an inorganic adhesive. It is fixed to each. The first to third insulating members 50, 52, and 54 are linear members that extend along the periphery of the grid 24. However, the first to third insulating members 50, 52, and 54 may be formed in a frame shape in which four sides are integrated. Good. Further, the insulating member 48 is not limited to all four sides of the grid 24, and may be provided so as to cover at least the peripheral portions of the two sides.

  In the third embodiment, other configurations are the same as those of the first embodiment described above, and the same reference numerals are given to the same portions, and detailed descriptions thereof are omitted. The SED according to the third embodiment can be manufactured by a manufacturing method similar to the manufacturing method according to the above-described embodiment. In the third embodiment, the same operational effects as those of the first embodiment described above can be obtained.

  As shown in FIG. 13, according to the SED according to the fourth embodiment of the present invention, the surface of the grid 24 and the inner surface of the electron beam passage hole 26 are covered with the insulating layer 25, and It is covered with an insulating layer 62 having a thickness more than twice that of the portion. That is, in the fourth embodiment, the insulating layer 62 is provided instead of the insulating member described above. In the fourth embodiment, other configurations are the same as those of the first embodiment described above, and the same reference numerals are given to the same portions, and detailed description thereof is omitted. And also in 3rd Embodiment, generation | occurrence | production of the discharge in a grid peripheral part can be suppressed, and the other effect similar to 1st Embodiment mentioned above can be acquired.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

  The insulating member and the spacer may be formed of different materials. In this case, the difference between the Young's modulus of the insulating member and the Young's modulus of the spacer forming material is set within 10%. If the difference between the Young's modulus of the insulating member in the periphery of the grid and the spacer on the inner side of the grid exceeds the value set above, the following decrease occurs and substrate cracking occurs: To do. That is, when the inside of the vacuum envelope composed of the first substrate and the second substrate is evacuated by a vacuum pump, the “crush amount” of the member due to the difference in Young's modulus between the insulating member and the spacer Due to the difference, a height shift in the spacer height direction occurs in the first substrate or the second substrate. As a result, cracks occur at the periphery of the substrate. In the case where an insulating member is not used, this phenomenon corresponds to a portion corresponding to the frame of the first substrate or the second substrate when the gap between the frame portion height of the vacuum envelope and the spacer height is large. The reason and the reason for the occurrence of substrate cracking are the same.

  The diameter and height of the spacer, the dimensions and materials of the other components are not limited to the above-described embodiment, and can be appropriately selected as necessary. The spacer is not limited to the columnar spacer described above, and a plate-like spacer may be used. Various filling conditions for the spacer forming material can be selected as necessary. In addition, the present invention is not limited to the one using a surface conduction electron-emitting device as an electron source, but can be applied to an image display device using another electron source such as a field emission type or a carbon nanotube.

The perspective view which shows SED which concerns on 1st Embodiment of this invention. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. The perspective view of said SED fractured | ruptured along line AA of FIG. Sectional drawing which expands and shows the said SED. The perspective view which shows the spacer structure of said SED. Sectional drawing which shows the manufacturing process of the said SED roughly. Sectional drawing of SED which concerns on 2nd Embodiment of this invention. Sectional drawing which expands and shows SED which concerns on 2nd Embodiment. The perspective view which shows the spacer structure of SED which concerns on 2nd Embodiment. Sectional drawing which shows the modification of the insulating member in the said 2nd Embodiment. The perspective view which fractures | ruptures and shows SED which concerns on 3rd Embodiment of this invention. Sectional drawing which expands and shows SED which concerns on 3rd Embodiment. Sectional drawing which expands and shows SED which concerns on 4th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... 1st board | substrate, 12 ... 2nd board | substrate, 14 ... Side wall, 15 ... Vacuum envelope,
16 ... phosphor screen, 18 ... electron-emitting device, 22 ... spacer structure,
24 ... Grid, support substrate, 26 ... Electron beam passage hole, 30 ... Spacer,
30a ... 1st spacer, 30b ... 2nd spacer, 48 ... Insulating member,
50 ... 1st insulating member, 52 ... 2nd insulating member, 54 ... 3rd insulating member

Claims (9)

A first substrate on which a phosphor screen is formed;
A second substrate disposed opposite to the first substrate and provided with a plurality of electron emission sources for exciting the phosphor screen;
A spacer structure provided between the first and second substrates and supporting an atmospheric pressure load acting on the first and second substrates;
The spacer structure is disposed to face the first and second substrates, each has a plurality of electron beam passage holes facing the electron emission source, and a support substrate covered with an insulating layer; A plurality of spacers erected on at least one surface of the support substrate between the plurality of electron beam passage holes,
An image display device, wherein a peripheral edge portion of the support substrate is covered with an insulating member provided so as to overlap the insulating layer.   2. The image display device according to claim 1, wherein the support substrate has a rectangular shape, and the insulating member is provided so as to cover at least two sides of the periphery of the support substrate.   The said insulating member is contact | abutted to at least one of the said 1st board | substrate and a 2nd board | substrate, and is supporting the peripheral part of the said support substrate, The Claim 1 characterized by the above-mentioned. Image display device.   The image display device according to claim 1, wherein the edge member and the spacer are made of the same material.   4. The insulating member and the spacer are formed of different materials, and the Young's modulus of the insulating member is within 10% of the difference from the Young's modulus of the spacer forming material. The image display device according to any one of the above.   6. The image display device according to claim 1, wherein the insulating member is made of glass or ceramic. A first substrate on which a phosphor screen is formed;
A second substrate disposed opposite to the first substrate and provided with a plurality of electron emission sources for exciting the phosphor screen;
A spacer structure provided between the first and second substrates and supporting an atmospheric pressure load acting on the first and second substrates;
The spacer structure is disposed opposite to the first and second substrates, each of which has a plurality of electron beam passage holes facing the electron emission source and is covered with an insulating layer; A plurality of spacers erected on at least one surface of the support substrate between the plurality of electron beam passage holes, and an insulating layer covering a peripheral portion of the support substrate An image display device characterized in that it is formed to have a thickness more than twice that of an insulating layer covering the portion.   The support substrate has a first surface facing the first substrate and a second surface facing the second substrate, and the spacers are erected on the first surface, respectively. A plurality of first spacers having extended ends in contact with the first substrate, and a plurality of first spacers standing on the second surface and having extended ends in contact with the second substrate. The image display device according to claim 1, further comprising a second spacer.   The support substrate has a first surface in contact with the first substrate and a second surface opposed to the second substrate with a gap, and the spacer is erected on the second surface. The image display device according to claim 1, wherein the image display device has an extended end that is in contact with the second substrate.

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