JP2005187242A - Etching method for optical fiber - Google Patents

Etching method for optical fiber Download PDF

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JP2005187242A
JP2005187242A JP2003428556A JP2003428556A JP2005187242A JP 2005187242 A JP2005187242 A JP 2005187242A JP 2003428556 A JP2003428556 A JP 2003428556A JP 2003428556 A JP2003428556 A JP 2003428556A JP 2005187242 A JP2005187242 A JP 2005187242A
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optical fiber
etching
signal light
diameter
etching method
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Noriyoshi Hiroi
典良 広井
Akinori Sugimura
彰紀 杉村
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Namiki Precision Jewel Co Ltd
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Namiki Precision Jewel Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/66—Chemical treatment, e.g. leaching, acid or alkali treatment
    • C03C25/68—Chemical treatment, e.g. leaching, acid or alkali treatment by etching

Abstract

<P>PROBLEM TO BE SOLVED: To provide an etching method which can perform etching of an optical fiber while controlling the diameter dimension of the optical fiber. <P>SOLUTION: The etching method comprises the following: an optical fiber is immersed in an etching solution, and signal light is caused to be incident from a light source upon one end of the optical fiber, propagated through the core inside of the optical fiber, and caused to go out of the other end; the decay of power of the signal light at the time of its going out is measured in comparison with the power of the signal light at the time of its being incident; and when the variation of the decay reaches a predetermined value while being measured, the immersed optical fiber is pulled up from the etching solution to end the etching. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、ネットワーク装置等に用いられる光ファイバのエッチング方法に関するものであり、特に光ファイバの直径寸法を制御しながら細径化を行うためのエッチング方法に関する。   The present invention relates to an optical fiber etching method used in a network device or the like, and more particularly to an etching method for reducing the diameter while controlling the diameter of an optical fiber.

光通信分野等においては、光信号を結合又は分岐させるネットワーク装置として光カプラや光ファイバアレイ等が用いられている。このようなネットワーク装置の製造方法としては、複数本の光ファイバを並列させて一部を加熱融着し、更に延伸して融着延伸部を形成して作製する方法や、光ファイバの一部の側面をコア近傍まで研磨して研磨面を形成してなる複数本の光ファイバを、各々の研磨面を接触させた状態で固定して作製する方法などが知られている。   In the optical communication field and the like, an optical coupler, an optical fiber array, or the like is used as a network device for coupling or branching optical signals. As a method for manufacturing such a network device, a method in which a plurality of optical fibers are arranged in parallel and a part is heated and fused, and further stretched to form a fused and stretched part, or a part of the optical fiber is manufactured. For example, a method is known in which a plurality of optical fibers formed by polishing the side surfaces to the vicinity of the core to form a polished surface are fixed in a state where the polished surfaces are in contact with each other.

更に、光ファイバの一部の側面部分を化学的なエッチング方法によって細径化し、その細径部を添設して接触部分を加熱融着させる作製方法も考案されている（例えば、特許文献１を参照。）。   Furthermore, a manufacturing method has been devised in which a part of the side surface portion of the optical fiber is reduced in diameter by a chemical etching method, and the contacted portion is heated and fused by attaching the reduced diameter portion (for example, Patent Document 1). See).

特開平０２−１６８２０８号公報（第２−４頁、第７図）Japanese Patent Laid-Open No. 02-168208 (page 2-4, FIG. 7)

図３に、上記化学的なエッチング方法によって細径化された光ファイバの一例を示す。上記のエッチング方法は、フッ酸を含むエッチング液を用いて光ファイバ５の一部のクラッド６側面部分をエッチング除去し、他の光ファイバと比較して、コア７からクラッド６側面までの厚みを薄くして細径部８を形成するという方法である。   FIG. 3 shows an example of an optical fiber thinned by the chemical etching method. The etching method described above uses an etchant containing hydrofluoric acid to etch away a portion of the side surface of the cladding 6 of the optical fiber 5, and has a thickness from the core 7 to the side surface of the cladding 6 as compared with other optical fibers. This is a method of forming the narrow-diameter portion 8 by reducing the thickness.

しかしながら、化学的なエッチング方法により形成された光ファイバ細径部の直径寸法はばらつきが大きく、その原因として、エッチング中の湿度や、１本１本の光ファイバが固有に有するコアの偏芯といったばらつき等が考えられるが、確かなことは不明である。従って、エッチング部分の光ファイバの直径寸法を一定に制御するためには、直接、直径寸法を測定しながらエッチングを行うことが最も確実ではある。しかしながら、エッチング溶中に浸漬している光ファイバ部分を、測定器材を用いて物理的に直接測定することは非常に困難であり、実質的に、エッチング部分の直径寸法を制御しながら光ファイバのエッチングを行う方法は、確立されていないと云える。   However, the diameter dimension of the optical fiber thin-diameter portion formed by the chemical etching method varies widely, such as the humidity during etching and the eccentricity of the core inherent to each optical fiber. Variations are conceivable, but certainty is unknown. Therefore, in order to keep the diameter dimension of the optical fiber in the etched portion constant, it is most certain to perform the etching while directly measuring the diameter dimension. However, it is very difficult to physically measure the optical fiber portion immersed in the etching solution directly using a measuring device, and substantially control the diameter size of the etched portion while controlling the diameter dimension of the optical fiber. It can be said that the method of performing etching has not been established.

本発明は上記課題に鑑みてなされたものであり、その目的は、光ファイバの直径寸法を制御しながらのエッチングが可能となる、光ファイバのエッチング方法を提供することである。   The present invention has been made in view of the above problems, and an object of the present invention is to provide an optical fiber etching method that enables etching while controlling the diameter of the optical fiber.

本発明の請求項１記載の発明は、光ファイバをエッチング液中に浸漬すると共に、光ファイバの一端に光源からの信号光を入射し、前記光ファイバのコア内部で前記信号光を伝搬して、前記光ファイバの他端から前記信号光を出射し、前記光ファイバへの入射時の前記信号光のパワーに対する、前記光ファイバからの出射時の前記信号光のパワーの減衰を測定し、その減衰の変化量を測定しながら、所定の変化量に到達した時点で、浸漬している前記光ファイバをエッチング液中から引き上げて、エッチングを終了することを特徴とする、光ファイバのエッチング方法である。   According to the first aspect of the present invention, an optical fiber is immersed in an etching solution, signal light from a light source is incident on one end of the optical fiber, and the signal light is propagated inside the core of the optical fiber. The signal light is emitted from the other end of the optical fiber, and the attenuation of the power of the signal light at the time of emission from the optical fiber with respect to the power of the signal light at the time of incidence on the optical fiber is measured, An optical fiber etching method characterized in that, when a predetermined amount of change is reached while measuring the amount of change in attenuation, the immersed optical fiber is pulled up from the etching solution and etching is terminated. is there.

本発明の光ファイバのエッチング方法に依れば、光ファイバをエッチング液に浸漬させている間、信号光を光ファイバのコア内部に伝搬させ、その信号光を光ファイバ他端で感知することによって、エッチング液に浸漬中のコア内部を伝搬した信号光のパワーの減衰を測定するものである。エッチングによって細径化されるクラッドに囲まれたコア内部を伝搬する信号光の伝搬損失は増大するので、前記減衰の変化量を測定することによって、光ファイバの細径部の直径寸法を間接的に測定することが可能となる。従って、エッチング部分の直径寸法を制御しながら、光ファイバのエッチングを行うことが可能となる。   According to the optical fiber etching method of the present invention, while the optical fiber is immersed in the etching solution, the signal light is propagated inside the core of the optical fiber, and the signal light is sensed at the other end of the optical fiber. The attenuation of the power of the signal light propagated through the core being immersed in the etching solution is measured. Since the propagation loss of the signal light propagating through the core surrounded by the cladding that is thinned by etching increases, the diameter of the thin portion of the optical fiber is indirectly measured by measuring the amount of change in the attenuation. It becomes possible to measure. Therefore, the optical fiber can be etched while controlling the diameter of the etched portion.

以下、本発明に係る光ファイバのエッチング方法の実施の形態を、図面に基づいて詳細に説明する。図１は本発明による光ファイバのエッチング方法の一実施形態を模式的に示す図である。図１より、光ファイバ１の一方の端部（一端）には、光源２から信号光が入射されている。光源２はレーザダイオード（ＬＤ）等の半導体レーザ素子であり、信号光の周波数帯域としては、光通信の信号光増幅用に使用されている950〜1050nmや、光通信の伝搬信号光用に使用されている1280〜1350nm又は1450〜1650nm等が挙げられる。   Embodiments of an optical fiber etching method according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a diagram schematically showing an embodiment of an optical fiber etching method according to the present invention. As shown in FIG. 1, the signal light is incident on one end (one end) of the optical fiber 1 from the light source 2. The light source 2 is a semiconductor laser element such as a laser diode (LD), and the frequency band of signal light is 950 to 1050 nm used for signal light amplification in optical communication, and is used for propagation signal light in optical communication. 1280 to 1350 nm or 1450 to 1650 nm.

光ファイバ１は図示しないコアの周りをクラッドが包囲することで形成される、一般的なタイプの単一モード光ファイバであり、光源２から入射された信号光をコア内部で伝搬して、もう一方の端部（他端）から出射する。その光ファイバ他端には、メータ３が光学的に結合される。メータ３では、光ファイバ１への入射時の信号光のパワーに対する、光ファイバ１からの出射時の信号光のパワーの減衰を測定する。   The optical fiber 1 is a general type single-mode optical fiber formed by surrounding a core (not shown) with a clad. The optical fiber 1 propagates the signal light incident from the light source 2 inside the core. The light is emitted from one end (the other end). A meter 3 is optically coupled to the other end of the optical fiber. The meter 3 measures the attenuation of the signal light power at the time of emission from the optical fiber 1 with respect to the power of the signal light at the time of incidence on the optical fiber 1.

このように両端に光源２とメータ３とが光学的に結合・接続された光ファイバ１を、エッチング液４中に浸漬させる。エッチング液４には、一例として、フッ化アンモニウム（NH4F）・フッ酸（HF）・純水（H2O）の混合水溶液を用いるとするが、更に過酸化水素水（H2O2）を混合したものを使用しても良い。 Thus, the optical fiber 1 in which the light source 2 and the meter 3 are optically coupled and connected to both ends is immersed in the etching solution 4. For example, a mixed aqueous solution of ammonium fluoride (NH 4 F), hydrofluoric acid (HF), and pure water (H 2 O) is used as the etchant 4, but hydrogen peroxide (H 2 O 2 ) is used. ) May be used.

エッチング液４に浸漬される光ファイバ１部分のクラッドがエッチング液によって溶解され、次第に細径化されることによって、浸漬されている光ファイバ１部分にその長さ寸法に亘って伝搬損失が発生し、光ファイバ１から出射される信号光のパワーが減衰される。その減衰の変化量をメータ３で測定する。従って、エッチング液４に浸漬されているクラッドが細径化されるほど伝搬損失が増大するため、前記出射される信号光のパワーの減衰の変化量も大きくなり、減衰の変化量によってどれ程エッチングによるクラッドの細径化が進行しているかが間接的に測定できる。よって結果的に、エッチング液４に浸漬されている光ファイバ１部分（細径部）の直径寸法を割り出すことが可能になる。   When the cladding of the optical fiber 1 part immersed in the etching solution 4 is dissolved by the etching solution and gradually reduced in diameter, a propagation loss occurs over the length of the immersed optical fiber 1 part. The power of the signal light emitted from the optical fiber 1 is attenuated. The amount of change in attenuation is measured with the meter 3. Accordingly, since the propagation loss increases as the diameter of the clad immersed in the etching solution 4 is reduced, the amount of change in attenuation of the power of the emitted signal light also increases, and the amount of etching depends on the amount of change in attenuation. It is possible to indirectly measure whether or not the cladding is being reduced in diameter. As a result, the diameter dimension of the optical fiber 1 portion (thin diameter portion) immersed in the etching solution 4 can be determined.

減衰の変化量に応じた、細径部の直径寸法の割り出し方には種々の方法が考えられるが、本実施の形態では、予め試料を用意し、その試料をエッチング液４でエッチングさせたときのエッチングレートから割り出すという方法を採った。そして、所定の直径寸法に相当すると割り出した変化量に到達した時点で、光ファイバ１をエッチング液４から引き上げ、エッチングを終了する。   Various methods are conceivable for determining the diameter of the small-diameter portion in accordance with the amount of change in attenuation. In this embodiment, when a sample is prepared in advance and the sample is etched with the etching solution 4 The method of calculating from the etching rate was adopted. When the amount of change determined to correspond to a predetermined diameter is reached, the optical fiber 1 is pulled up from the etching solution 4 and the etching is finished.

本発明における光ファイバのエッチング方法は、エッチング部分の光ファイバの直径寸法を、測定された減衰の変化量に応じて間接的に測定するという方法である。従って、エッチング以外で発生する伝搬損失は、出来る限り抑制することが望ましく、例えば、エッチング液４に浸漬させる光ファイバ１長は、光ファイバ１の元の直径寸法と比較して充分に長く設定する事とし、エッチング液４中での光ファイバ１の曲がりを防止して、曲がり損失や、光ファイバ１への応力付与を防止することが好ましく、目安としては100mm程度とする。   The optical fiber etching method in the present invention is a method in which the diameter dimension of the optical fiber in the etched portion is indirectly measured according to the measured amount of attenuation change. Accordingly, it is desirable to suppress the propagation loss generated other than etching as much as possible. For example, the length of the optical fiber 1 immersed in the etching solution 4 is set to be sufficiently longer than the original diameter dimension of the optical fiber 1. In particular, it is preferable to prevent bending of the optical fiber 1 in the etching solution 4 to prevent bending loss and application of stress to the optical fiber 1.

＜実施例＞
次に、本発明に係る光ファイバのエッチング方法によってエッチングを施した光ファイバについて、減衰変化量−直径寸法グラフを参照しながら説明を行う。図２にその減衰変化量−直径寸法グラフを示す。なお、光ファイバに伝搬させる信号光の波長は、1550nmとした。更に、エッチング液には、NH4F：HF：H2O＝３：１：１混合比のものを使用し、エッチング部分の光ファイバ直径寸法は、予め、同一のエッチング液によってエッチングを行った試料のエッチングレートから計算したものを対応表示した。 <Example>
Next, the optical fiber etched by the optical fiber etching method according to the present invention will be described with reference to the attenuation change-diameter dimension graph. FIG. 2 shows the attenuation change-diameter dimension graph. The wavelength of the signal light propagated through the optical fiber was 1550 nm. Furthermore, NH 4 F: HF: H 2 O = 3: 1: 1 mixture ratio was used as the etchant, and the optical fiber diameter of the etched part was previously etched with the same etchant. The results calculated from the etching rate of the sample are displayed in correspondence.

図２のグラフより、直径寸法約30μｍを切るあたりまでは減衰値はほぼ一定を維持し、約30μｍを切るあたりから変化が現れ始めることが分かる。従って、直径寸法約30μｍが、光ファイバのエッチング部分の直径寸法測定における基準点と見なせることが明らかになった。更に、0.1dBの減衰変化量に対応する直径寸法（約22μｍ）までは細径化しても問題無いことも判明した。   From the graph of FIG. 2, it can be seen that the attenuation value remains almost constant until the diameter dimension is cut below about 30 μm, and the change starts to appear around about 30 μm. Accordingly, it has been clarified that the diameter dimension of about 30 μm can be regarded as a reference point in the diameter dimension measurement of the etched portion of the optical fiber. Furthermore, it has been found that there is no problem even if the diameter is reduced to a diameter dimension (about 22 μm) corresponding to an attenuation change amount of 0.1 dB.

本発明に係る光ファイバのエッチング方法を、光通信分野等で使用されるネットワーク装置（光カプラや光ファイバアレイ等）に用いられる光ファイバに適用することにより、複数の光ファイバのエッチング部分の直径寸法を均一に保って、高品質なネットワーク装置を提供することが可能となる。   By applying the optical fiber etching method according to the present invention to an optical fiber used in a network device (such as an optical coupler or an optical fiber array) used in the optical communication field or the like, the diameter of the etched portion of a plurality of optical fibers It becomes possible to provide a high-quality network device while keeping the dimensions uniform.

本発明に係る光ファイバのエッチング方法の、一実施形態を模式的に示す図。The figure which shows typically one Embodiment of the etching method of the optical fiber which concerns on this invention. 本発明に係る光ファイバのエッチング方法によってエッチングを施した光ファイバの減衰変化量−直径寸法グラフ。The attenuation change-diameter dimension graph of the optical fiber which etched with the etching method of the optical fiber which concerns on this invention. 従来の化学的なエッチング方法によって細径化された光ファイバの一例を示す斜視図。The perspective view which shows an example of the optical fiber thinned by the conventional chemical etching method.

符号の説明Explanation of symbols

１ 光ファイバ
２ 光源
３ メータ
４ エッチング液 1 Optical fiber 2 Light source 3 Meter 4 Etching solution

Claims (1)

光ファイバをエッチング液中に浸漬すると共に、光ファイバの一端に光源からの信号光を入射し、前記光ファイバのコア内部で前記信号光を伝搬して、前記光ファイバの他端から前記信号光を出射し、前記光ファイバへの入射時の前記信号光のパワーに対する、前記光ファイバからの出射時の前記信号光のパワーの減衰を測定し、その減衰の変化量を測定しながら、所定の変化量に到達した時点で、浸漬している前記光ファイバをエッチング液中から引き上げて、エッチングを終了することを特徴とする、光ファイバのエッチング方法。   The optical fiber is immersed in an etching solution, signal light from a light source is incident on one end of the optical fiber, the signal light is propagated inside the core of the optical fiber, and the signal light is transmitted from the other end of the optical fiber. Measuring the attenuation of the power of the signal light at the time of emission from the optical fiber with respect to the power of the signal light at the time of incidence on the optical fiber, A method of etching an optical fiber, wherein when the amount of change is reached, the immersed optical fiber is pulled up from the etching solution and etching is terminated.
JP2003428556A 2003-12-25 2003-12-25 Etching method for optical fiber Pending JP2005187242A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108844559A (en) * 2018-08-24 2018-11-20 南京航空航天大学 A kind of system and method preparing micro-nano fiber sensor
US11332407B2 (en) 2016-12-22 2022-05-17 Magic Leap, Inc. Methods and systems for fabrication of shaped fiber elements using laser ablation

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63139025A (en) * 1986-11-29 1988-06-10 Tatsuta Electric Wire & Cable Co Ltd Production of optical fiber base material
JPH02168208A (en) * 1988-12-22 1990-06-28 Fujikura Ltd Optical fiber coupler and its production
JP2000035395A (en) * 1998-05-13 2000-02-02 Seiko Instruments Inc Probe sharpening method
JP2000186993A (en) * 1998-10-15 2000-07-04 Seiko Instruments Inc Probe-sharpening method, and probe
JP2002131173A (en) * 2000-10-20 2002-05-09 Sunx Ltd Optical fiber sensor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63139025A (en) * 1986-11-29 1988-06-10 Tatsuta Electric Wire & Cable Co Ltd Production of optical fiber base material
JPH02168208A (en) * 1988-12-22 1990-06-28 Fujikura Ltd Optical fiber coupler and its production
JP2000035395A (en) * 1998-05-13 2000-02-02 Seiko Instruments Inc Probe sharpening method
JP2000186993A (en) * 1998-10-15 2000-07-04 Seiko Instruments Inc Probe-sharpening method, and probe
JP2002131173A (en) * 2000-10-20 2002-05-09 Sunx Ltd Optical fiber sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11332407B2 (en) 2016-12-22 2022-05-17 Magic Leap, Inc. Methods and systems for fabrication of shaped fiber elements using laser ablation
CN108844559A (en) * 2018-08-24 2018-11-20 南京航空航天大学 A kind of system and method preparing micro-nano fiber sensor

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