JP2005183801A - Electric circuit forming equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electric circuit forming equipment capable of forming an electric circuit and visible information easily on a substrate. <P>SOLUTION: The electric circuit forming equipment comprises a head for forming an electric circuit, a head for forming visible information, and a carriage for mounting both the head for forming an electric circuit and the head for forming visible information. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an ink jet type electric circuit forming apparatus for forming visible information and an electric circuit on a substrate.

  Barcode printers, etc. exist as technology that forms information that can be recognized by the naked eye as information that is output to paper with a printer connected to a network terminal. Etc. are used.

However, the conventional bar code formation is limited in that the amount of information is limited and rewriting is not possible. In addition, since it is impossible to take countermeasures against counterfeiting of information, an ID card in which an RFID (Radio Frequency-Identification) chip or the like that can be rewritten and has a large amount of information is attracting attention. As a technique for easily forming such an electric circuit such as an RFID chip, there is a wiring formation method using an ink jet method (for example, see Patent Document 1).
JP-A-11-274671

  As a familiar method of using the RFID chip, it is conceivable to form the RFID chip on a substrate such as paper, cloth or polyester film. For example, a concert ticket, a gift certificate, a product package, a book cover or the like in which an RFID chip or the like is embedded may be used. If the outer box of the product is printed by the IJ method and the RFID chip is formed by the IJ method instead of the barcode, the outer box can be printed and the chip can be formed at the same time. Furthermore, it can be widely used such as printing a book cover by the IJ method and simultaneously forming an RFID chip on the back cover by the IJ method.

  The present invention is an apparatus for directly forming visible information and an electric circuit on a substrate with a single device, and a carriage on which both a head for forming an electric circuit and a head for printing visible information are mounted on the substrate. Is to solve the problem of positional deviation by scanning, and to provide an electric circuit forming apparatus capable of forming a fine electric circuit and visible information.

  The present invention provides an electric circuit forming head for forming an electric circuit on the substrate by supplying a liquid for forming an electric circuit to the substrate, and a visible information by supplying a liquid for forming visible information to the substrate. And a carriage for mounting both the visible information forming head and the visible information forming head on the substrate. About.

  By using the present invention, the electric circuit forming apparatus can be saved in space, and further, the problem of misalignment when the electric circuit is formed on the substrate can be solved, and a fine electric circuit and visible information can be formed on the substrate. It becomes.

  The electrical circuit in this specification is an electronic element such as an RFID chip, a transistor, a diode, a capacitor, a wiring connecting coils and electronic elements, and a conductive pattern, an insulating pattern, A semiconductor pattern etc. are shown. Furthermore, the electric circuit substrate in this specification includes the electric circuit and the substrate on which the electric circuit is formed.

  The liquid for forming an electric circuit refers to a liquid containing a material necessary for forming the electric circuit, such as a conductive pattern forming liquid, an insulating pattern forming liquid, and a semiconductor pattern forming liquid. Visible information in this specification indicates not only significant information such as characters and graphics but also information in which images, patterns, patterns, etc. are widely formed on a print medium regardless of significance.

  The substrate used in the present invention is not only a substrate for forming an electric circuit that has been generally used in the past, but also a familiar material such as paper, cloth, polyester film, and other inorganic materials (SiO2, Al2O3, TiO2, ZrO2) ceramic substrate.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 11 shows a main part of an electric circuit forming apparatus using an ink jet method used in the embodiment of the present invention. Data processing apparatus 1, substrate transport unit 2, carriage transport unit 3, visible information forming head 4, visible information forming tank 5, insulating pattern forming head 6, insulating pattern forming tank 7, semiconductor pattern forming head 8, a semiconductor pattern forming tank 9, a conductive pattern forming head 10, a conductive pattern forming tank 11, a solid-state image element head 12, and a heat curing device 13. In addition, when there is a material necessary for forming an electric circuit such as an adhesive material, a tank and a head for the material are arranged.

  The data processing apparatus 1 controls a substrate transport unit, a carriage transport unit, a visible information forming head, an insulating pattern forming head, a semiconductor pattern forming head, a conductive pattern forming head, a solid-state image element head, and a heat curing device. To do.

  The substrate transport unit 2 can temporarily stop the substrate at a desired position by the data processing apparatus. After the formation of the visible information and the electric circuit is completed, the substrate can be discharged and a new substrate can be supplied. It has a configuration.

  The carriage transport unit 3 has a mechanism that moves on the X and Y axis linear guides so that it can be moved to any position on the substrate, and is positioned using a stepping motor, servo motor, or linear motor as a power source. Be controlled. On the carriage, a visible information forming head 4, an insulating pattern forming head 6, a semiconductor pattern forming head 8, a conductive pattern forming head 10, and a solid-state image element head 12 are arranged side by side. In FIG. 11, for the explanation of the apparatus configuration, the head and the tank for each application are set as one set. In practice, however, a plurality of heads and tanks are used for each application according to the color of the visible information ink and the circuit forming material. The structure has a set head and tank. Each head discharges the fluid, such as a method of discharging the fluid by causing a volume change in the piezoelectric element, or a method of generating a bubble by applying heat to the heating element and discharging the fluid by its volume expansion. It has a possible structure.

  The tanks 5, 7, 9, and 11 in FIG. 11 are integrated with the head or configured on the carriage via a liquid supply pipe, and each includes a visible information forming liquid containing a pigment or a dye, Insulating liquid containing inorganic materials such as SiO2, Al2O3, TiO2 and organic materials such as polyimide, inorganic materials such as Si and Ge, and organic materials such as amine, hydrazone, stilbene, and starbust The conductive liquid is filled with a semiconductor liquid and a metal material such as solder, Pt, Ag, Au, In, and Ga.

  The solid-state image sensor head 12 has a CCD (charge coupled device) or a solid-state image sensor such as a CMOS sensor arranged on the same carriage as the head, and detects the coordinates of the underlying electric circuit pattern using the same drive mechanism as the head. By doing so, it is possible to improve the alignment accuracy when the pattern of the next layer is formed.

  The heat curing device 13 is intended to heat and cure discharged ink or circuit forming liquid or volatilize the solvent by a radiant heat source such as an infrared lamp or a xenon lamp. The heat treatment conditions here depend on the curing conditions of the thermosetting components of the ink and circuit forming liquid, but usually the portion where the electric circuit is formed has a temperature of 80 to 150 degrees. Set to. Here, when the substrate is made of a material that can withstand the heat treatment, it is possible to use a method in which a resistor is brought into contact with the substrate to heat the entire substrate. On the contrary, when there is an influence of alteration due to heat treatment depending on the material of the ink, the circuit formation, or the material of the substrate, a structure that combines the heat radiation and cooling mechanism of the substrate or the formation portion is adopted.

  Further, depending on the material of the circuit forming liquid, it is possible to cure the circuit forming portion by irradiating with light or both instead of heat treatment as curable energy. The wavelength used for light irradiation is a wavelength within the range where the photocurable component has practical sensitivity and depends on the component of the circuit-forming liquid. A range of 200 nm to 600 nm is used, and a discharge tube such as a mercury lamp, a xenon lamp, or a fluorescent lamp is used as the light source.

  FIG. 1 is a schematic block diagram showing a system configuration of an electric circuit forming apparatus according to the present invention. The data processing apparatus 1 has an input / output interface 31 for receiving visible information formation information and electric circuit formation information from the outside, and formation of visible information (color, pattern, etc.) and electric circuit formation from the outside. Based on input information 32 such as information (such as electrical circuit drawings), a printed pattern of visible information, an insulating pattern of the insulating layer, a semiconductor pattern of the semiconductor layer, and a conductive pattern of the electric wiring layer are created and stored in the storage device 34. Along with the input / output interface 33, the substrate transport unit 2, the carriage transport unit 3, the visible information forming head 4, the insulating pattern forming head 6, the semiconductor pattern forming head 8, the conductive pattern forming head 10, The solid-state image element head 12 and the heat curing device 13 are controlled.

  FIG. 2 is an external view showing an example of the cartridge used in the present invention. A cartridge that can be removed from the carriage and replaced is shown. Reference numeral 205 denotes a tank for storing circuit forming material and visible information ink. Reference numeral 202 denotes a head unit, which discharges the electric circuit forming material and visible information ink from the discharge port 206 as droplets. Such a cartridge for forming visible information and a cartridge for forming an electric circuit are attached to the carriage.

  FIG. 3 is a cross-sectional view of the recording head in the present invention. A heater board 5100 is provided on the upper surface of the support 5300. The heater board 5100 is provided with a temperature adjustment heater (temperature increase heater) 5110 for keeping the recording head warm and adjusting the temperature. Reference numeral 5200 denotes a wiring board disposed on the support 5300. The wiring board 5200 is connected to the temperature control heater 5110, the discharge heater 5113, and other signal lines by wire bonding or the like (wiring). Is not shown). The liquid for discharge passes through the common liquid chamber 5112 and fills the flow path. The liquid in the flow path is heated by the discharge heater 5113, bubbles 5114 are generated, and the liquid in the flow path is discharged as droplets 5115 and landed on the substrate P.

  FIG. 4 is an explanatory diagram of the heater board in the recording head used in the present invention, and is a view of the heater board 5100 as viewed from above.

  Reference numeral 5500 denotes a meniscus control heater, 5400 denotes a diode matrix diode, 5401 denotes a wire bonding pad, and 5402 denotes a wiring pattern to the discharge heater 5113.

  In this embodiment, an example is described in which the above-described electric circuit forming apparatus is used to form visible information and an insulating layer on paper or cloth and a thin film transistor as an electric circuit on the insulating layer.

  FIG. 5 shows a schematic plan view of the electric circuit of the present embodiment. On the formation surface of the paper or cloth base 14, there is a visible information forming area 15, a positioning pattern 16 indicating position information, and an electric circuit forming area 17 on a heat-resistant organic polymer film 23 that is an insulating layer. Here, since the insulating layer 23 serving as the foundation of the electric circuit can be formed in a necessary minimum region, the material for forming the heat-resistant organic polymer film is saved, and a wide visible information area is taken. Can do.

  FIG. 6A is a schematic cross-sectional view taken along line A-A ′ of FIG. A visible information pattern 22 and a heat-resistant organic polymer film 23 that is an insulating layer are formed on paper or cloth 14, and an organic semiconductor film 24 that is a semiconductor pattern and an insulating pattern are formed on the heat-resistant organic polymer film 23. An organic insulating film 25, conductive films 26, 28 and 29 which are conductive patterns, and an organic polymer protective film 27 which is an insulating pattern are formed. FIG. 6B is a schematic cross-sectional view showing the thickness of each pattern of the electric circuit to be formed. The thickness of the pattern formed by one movement of the carriage is “t”.

  FIG. 7 shows a step of forming a thin film transistor which is the electric circuit shown in FIG.

  In (1) of FIG. 7, the visible information 22 is formed in the visible information forming area 15 on paper or cloth by an ink jet method. At this time, at least two or more positioning patterns 16 in the electric circuit formation area 17 are formed. Here, the positioning pattern 16 may be formed of visible information ink or other ink. However, when the visible information 22 is formed, it is desirable to form the positioning pattern 16 simultaneously with visible information.

  In (2) of FIG. 7, the position coordinate of the positioning pattern 16 is read by the solid-state image element head 12, and the heat-resistant organic high layer which is an electrically insulating layer of polyimide or the like is formed on the electric circuit forming area 17 by an ink jet method on the basis of this coordinate. The molecular film 23 is formed, and heat treatment is performed under a temperature condition in which the solvent in the pattern is completely removed by a heat curing apparatus and the film constituting the pattern is cured.

  Here, in order to alleviate the unevenness of the paper and cloth serving as the substrate and form an insulating layer having a smooth surface, it is desirable that the viscosity of the discharged heat-resistant organic polymer material be several cp or less.

  In this embodiment, the material of the heat-resistant organic polymer film 23 that is an insulating layer is selected from organic materials because of brittleness. However, when an insulating pattern is formed by stacking, the upper layer is made of SiO 2 or the like. It is also possible to perform smoothing using a fluid containing the inorganic material as a raw material.

  Next, the positioning pattern 106 is formed in the electric circuit formation area. As long as the positioning pattern 106 is a material having good affinity with the heat-resistant organic polymer film 23 in the electric circuit formation area, visible information ink or another material that forms an electric circuit may be used. In the present embodiment, an example is shown in which the positioning pattern 106 is formed in a portion closer to the electric circuit forming portion in order to increase the positioning accuracy. If the required accuracy of the electric circuit is low and the paper or cloth that is the base is a material that is not easily deformed, the positioning pattern 16 formed in FIG. 7A can also be used.

  Next, in FIG. 8, a method for forming the thin film transistor described in FIG. 7 and its continuation will be described.

  FIG. 8 is a cross-sectional view schematically showing a method of forming the thin film transistor shown in FIG.

  (1) in FIG. 8 corresponds to a cross-sectional view taken along line A-A 'in (1) of FIG. (2) and (3) in FIG. 8 correspond to the cross-sectional view taken along the line (2) AA ′ in FIG. 7, and (3) in FIG. 8 shows that the thickness of the heat-resistant organic polymer film 23 is 2 t. Therefore, the carriage is moved twice so that the heat-resistant organic polymer film 23 which is an insulating layer is formed to have a thickness of 2t, and a thermosetting process is performed. In this way, when the required thickness, strength, and flatness are not achieved by the film formation and thermosetting treatment in a single process, the desired thickness can be obtained by repeating the same process several times. A pattern having strength and flatness can be formed.

  In FIG. 8 (4), the organic semiconductor film 24, which is a semiconductor pattern, and the insulating pattern are formed on the heat-resistant organic polymer film 23 of the insulating layer formed earlier in one scan based on the circuit formation data. An organic insulating film 25 as a gate insulating film, an organic polymer protective film 27 as an insulating pattern, a conductive film 28 as a source / drain electrode as a conductive pattern, and a conductive film 29 as an electric wiring as a conductive pattern. Each pattern is formed by an inkjet method, and a thermosetting process is performed for each pattern formation.

  In (5) to (13) of FIG. 8, based on the circuit formation data, the organic semiconductor film 24 which is a semiconductor pattern, the organic insulating film 25 and the organic polymer protective film 27 which are insulating patterns, and the gate electrode which is a conductive pattern. Various patterns of the conductive film 26 and the conductive films 28 and 29 which are conductive patterns are sequentially formed, and a thin film transistor is formed by repeating the thermosetting process for each pattern formation.

  In the thermosetting treatment, the solvent in each pattern is completely removed by a heat curing apparatus, and heat treatment is performed under a temperature condition in which the film constituting each pattern is cured. The temperature of the heat treatment is set to a temperature at which there is no influence of alteration or the like on the pattern formed as paper and visible information. For example, when polyimide is used as the heat-resistant organic polymer film, it is generally necessary to perform a heat treatment at about 300 ° C. Therefore, a heat-resistant sheet (or heat-resistant paper) is used as the substrate, and visible information formed on the paper surface. The ink is processed at a temperature at which the ink does not change (discolor).

  Further, the positioning pattern 106 is simultaneously formed in each process, the position coordinates are read by the solid-state image element, and used for alignment of the formation pattern in the next process.

  As a result, the thin film transistor which is the electric circuit shown in FIG. 6 can be formed with high accuracy.

  Furthermore, non-contact RFID chips and electronic elements such as diodes can be formed on paper by forming a coil made of a conductive film and a capacitor made of a conductive film and an organic insulating film through the same process. It is.

  In this example, using the above-described electric circuit forming apparatus, a visible information pattern and an insulating layer are formed on paper or cloth, and a Si transistor cell, which is a microelectronic element prepared in advance on the insulating layer, An example is shown in which an electric circuit is formed by an ink jet method so as to be arranged by an ink jet method and to connect the arranged transistor cells. Here, the microelectronic element refers to a microtransistor, a microdiode, a microcapacitor, or the like having a circuit formed in a microcell (such as a polyhedron or a sphere) such as silicon and having a size that can be ejected by an inkjet method.

  FIG. 9 shows a schematic cross-sectional view of the electric circuit of the present embodiment. A visible information pattern 22 and a heat-resistant organic polymer film 23 that is an insulating layer are formed on paper or cloth 14, and an Si transistor cell 51 and an organic material that is an insulating pattern are formed on the heat-resistant organic polymer film 23. An insulating film 25, a conductive film 26 that is a conductive pattern, and an organic polymer protective film 27 that is an insulating pattern are formed.

  FIG. 10 shows a process of forming the electric circuit shown in FIG.

  In (1) of FIG. 10, the visible information 22 is formed in the visible information forming area 15 on paper or cloth by an ink jet method. Next, a heat-resistant organic polymer film 23 that is an electrically insulating layer such as polyimide is formed on the electric circuit forming area 17 by an ink jet method, a positioning pattern 16 is formed, and a thermosetting process is performed.

  As long as the positioning pattern 16 is made of a material having a good affinity with the heat-resistant organic polymer film 23 in the electric circuit formation area 17, it may be visible information ink or other ink that forms an electric circuit. The process for forming the heat-resistant organic polymer film 23 as the insulating layer, which is the foundation for forming the electric circuit, and the heating conditions are basically the same as those in the first embodiment. In addition, in order to obtain the required thickness, strength, and flatness, the process of forming the organic polymer film by the ink jet method and the thermosetting process are repeated several times. In this example, a pre-made Si transistor cell diffused in a solvent (a water-soluble alcohol or a water-insoluble organic solvent containing a surfactant as a dispersant) is ejected by an inkjet method, It arrange | positions on the heat resistant organic polymer film | membrane 23. FIG. Since the electric circuit is formed so as to connect the arranged Si transistor cells, the tolerance of flatness required for the base is larger than that of the first embodiment, and on the heat-resistant organic polymer film having irregularities on the order of μm. It is also possible to form a circuit.

  In (2) of FIG. 10, the position coordinate of the positioning pattern 16 is read by the solid-state element head 12, and the Si transistor cell 51 diffused in the solvent is discharged by the ink jet method using this coordinate as a reference. 51 is arranged at a desired position. Here, the Si transistor cell has a plurality of electrode pads 52 drawn from the gate electrode and the source / drain electrodes.

  FIG. 10 (3) is a cross-sectional view taken along the line A-A 'of FIG. 10 (2), and is a schematic view in which Si transistor cells, which are microelectronic elements, are arranged at desired positions. When the microelectronic element is a polyhedron, the electrode pad 52 has a plurality of electrode pads on different surfaces so that the electrode pad can be always connected when an electric circuit is formed in a later process, regardless of which surface faces upward. ing. Even when the microelectronic element is spherical, it has a structure having a plurality of electrode pads so that the electrode pads and the electric circuit can be connected without fail.

  Next, the position coordinates of the electrode pad 52 of the Si transistor cell are read by a solid-state image element head, and an electric circuit pattern is created on the data processing device. Here, when the detected number of connectable Si transistor cells is not sufficient to form an electric circuit and a desired electric circuit pattern cannot be formed, the Si transistor cell 51 is again set to the ink jet system. In the same manner as in the above process, the position coordinates of the electrode pad 52 of the Si transistor cell are read by the solid-state image element head, and an electric circuit pattern is created on the data processing device.

  In (4) of FIG. 10, a conductive film 26 as an electric circuit which is a conductive pattern is formed by an ink jet method in accordance with the electric circuit pattern created on the data processing apparatus, and desired electric wiring is connected. Here, not all of the Si transistor cells arranged on the insulating layer are connected, but only the cells necessary for forming a desired electric circuit are selected and connected.

  Next, using a heat curing apparatus, the solvent on the paper surface is completely removed, and a heat curing process is performed under a temperature condition where the conductive film 26 is cured. Then, an organic insulating film 25 that is an insulating pattern is formed on the conductive film 26 and subjected to a thermosetting process. Finally, an organic polymer protective film 27 as a protective film that is an insulating pattern is formed, and the thermosetting process is performed. Apply.

  In this way, by forming a transistor portion that requires fine processing as a semi-finished product in advance, and applying the IJ method only for wiring connection between transistors, the degree of integration of the electric circuit can be increased, and higher functionality can be achieved. The electric circuit can be easily formed.

  Further, as in the case of the first embodiment, a non-contact RFID can be formed by forming a coil or a capacitor using a liquid that forms an electric circuit, or by discharging and arranging a coil or a capacitor that is a semi-finished product with IJ. Chips can also be formed on the paper.

  In the steps of Examples 1 and 2, by forming visible information after forming an electric circuit, the ink used for forming the visible information can be replaced with one having lower heat resistance. Furthermore, by reading this information using the positioning pattern used at the time of forming the electric circuit, a positional shift in the formation of visible information can be prevented and the accuracy can be improved.

  Further, in the printing process of the first and second embodiments, the visible information is printed by substituting the black ink for the electric circuit forming liquid among the ink used for visible information printing, for example, The number of ink heads to be mounted can be reduced, and a printing apparatus having a simpler structure can be obtained. Further, if the ink for forming an electric circuit contains a pigment or a dye, it can be shared with other color visible ink heads.

  As a means for detecting erroneous mounting of the cartridge, an example in which a ROM is mounted in a part of the cartridge can be given. By recording the type of each cartridge in the ROM, it becomes possible to determine the type of cartridge mounted on the electric circuit forming device side, so the electric circuit forming information and visible information forming information are sent from the host device. At the time of receiving, it is possible to receive only data suitable for the mounted cartridge. As a result, when the mounted ink cartridge and the print data do not correspond to each other, the information is not received. Further, when the erroneous mounting is detected by the detecting means, a warning is issued, thereby causing an error. Formation can be prevented.

  In each of the embodiments, a description has been given by taking an example of a type of printing apparatus that prints normal visible information. However, the present invention is not limited to this, and the head can be moved to any position of the X, Y plotter method. It is also possible to use a device having a simple shape.

  Furthermore, in the description of the embodiment, the two-dimensional driving method in the X and Y directions is described, but the three-dimensional driving in which the Z direction which is the height direction of the layer structure is added according to the layer structure of the electric circuit. In this case, by storing the printed print layer information, the parameter value in the Z direction is matched with the information from the stored information and the information indicating what layer the printing layer will be printed from now on. Can be changed. As a result, it is possible to form an electric circuit while keeping the distance between the base and the head constant, and the printing accuracy is improved.

Schematic block diagram showing the system configuration of the electric circuit forming apparatus of the present invention External view of cartridge used in the present invention Sectional view of the recording head used in the present invention Explanatory drawing of the heater board in the recording head used in the present invention Schematic plan view of an electric circuit in Example 1 1A is a schematic cross-sectional view taken along line A-A ′ of FIG. 1, and FIG. 1B is a schematic cross-sectional view showing the thickness of each pattern of the electric circuit formed in FIG. 1. The schematic plan view which shows the formation process of the electric circuit in Example 1 Schematic sectional view showing the formation process diagram of the electric circuit in Example 1 Schematic sectional view of the electric circuit of Example 2 The schematic plan view which shows the formation process of the electric circuit in Example 2. Main parts of an electric circuit forming apparatus using an ink jet method

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Data processing apparatus 2 Base | substrate conveyance part 3 Carriage conveyance part 4 Visible information formation head 5 Visible information formation tank 6 Insulation pattern formation head 7 Insulation pattern formation tank 8 Semiconductor pattern formation head 9 Semiconductor pattern formation tank DESCRIPTION OF SYMBOLS 10 Conductive pattern formation head 11 Conductive pattern formation tank 12 Solid-state image element head 13 Heat curing apparatus 14 Paper or cloth base | substrate 15 Visible information formation area 16, 106 Positioning pattern 17 Electric circuit formation area 22 Visible information pattern 23 Heat resistant organic Polymer film 24 Organic semiconductor film 25 Organic insulating film 26, 28, 29 Conductive film 27 Organic polymer protective film 31, 33 Input / output interface 32 Input information 34 Storage device 51 Si transistor cell 52 Electrode pad 202 Head 205 Tank 206 Discharge port 5100 Heater board 5110 Temperature control heater (heater for temperature increase)
5112 Common liquid chamber 5113 Discharge heater 5114 Bubble 5115 Droplet 5200 Wiring substrate 5300 Support 5400 Diode matrix diode 5401 Wire bonding pad 5402 Discharge heater wiring pattern 5500 Meniscus control heater P Substrate

Claims (7)

An electric circuit forming head for forming an electric circuit on the substrate by supplying a liquid for forming the electric circuit to the substrate;
A visible information forming head for forming visible information on the substrate by supplying a liquid for forming visible information to the substrate;
A carriage for mounting both the electric circuit forming head and the visible information forming head;
An electrical circuit forming apparatus comprising:   2. The electric circuit forming apparatus according to claim 1, wherein the electric circuit formed on the base and / or a solid-state image element for reading the position coordinates of the visible information is mounted on the carriage.   The tank which stores the liquid which forms the said electric circuit, and the tank which stores the liquid which forms the said visible information are mounted in the said carriage, The Claim 1 or Claim 2 characterized by the above-mentioned. Electric circuit forming device.   4. The electric circuit forming apparatus according to claim 1, wherein one of the liquids forming the electric circuit is a conductive liquid that forms a conductive pattern on the base.   The electric circuit forming apparatus according to claim 1, wherein one of the liquids forming the electric circuit is an insulating liquid that forms an insulating pattern on the base.   6. The electric circuit forming apparatus according to claim 1, wherein one of the liquids that forms the electric circuit is a semiconductor liquid that forms a semiconductor pattern on the substrate.   The electric circuit forming apparatus according to claim 1, wherein the electric circuit forming apparatus is an ink jet system.

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