JP2005174980A5 - - Google Patents

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Publication number
JP2005174980A5
JP2005174980A5 JP2003408671A JP2003408671A JP2005174980A5 JP 2005174980 A5 JP2005174980 A5 JP 2005174980A5 JP 2003408671 A JP2003408671 A JP 2003408671A JP 2003408671 A JP2003408671 A JP 2003408671A JP 2005174980 A5 JP2005174980 A5 JP 2005174980A5
Authority
JP
Japan
Prior art keywords
bonded
electronic component
flexible film
laminated
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003408671A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005174980A (ja
JP4345464B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003408671A priority Critical patent/JP4345464B2/ja
Priority claimed from JP2003408671A external-priority patent/JP4345464B2/ja
Publication of JP2005174980A publication Critical patent/JP2005174980A/ja
Publication of JP2005174980A5 publication Critical patent/JP2005174980A5/ja
Application granted granted Critical
Publication of JP4345464B2 publication Critical patent/JP4345464B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003408671A 2003-12-08 2003-12-08 電子部品が接合された回路基板用部材の製造方法 Expired - Fee Related JP4345464B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003408671A JP4345464B2 (ja) 2003-12-08 2003-12-08 電子部品が接合された回路基板用部材の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003408671A JP4345464B2 (ja) 2003-12-08 2003-12-08 電子部品が接合された回路基板用部材の製造方法

Publications (3)

Publication Number Publication Date
JP2005174980A JP2005174980A (ja) 2005-06-30
JP2005174980A5 true JP2005174980A5 (cg-RX-API-DMAC7.html) 2007-01-25
JP4345464B2 JP4345464B2 (ja) 2009-10-14

Family

ID=34730285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003408671A Expired - Fee Related JP4345464B2 (ja) 2003-12-08 2003-12-08 電子部品が接合された回路基板用部材の製造方法

Country Status (1)

Country Link
JP (1) JP4345464B2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6580808B2 (ja) * 2012-06-19 2019-09-25 日鉄ケミカル＆マテリアル株式会社 表示装置及びその製造方法
JP2019068016A (ja) * 2017-10-05 2019-04-25 Dic株式会社 補強部付フレキシブルプリント配線板の製造方法

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