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基板上に物理的真空蒸着技術に基づくニッケル系の真空薄膜を形成する工程と、この真空薄膜を形成した基板を置換金メッキ浴において置換金メッキ処理を施し該真空薄膜の表面に置換金層を形成する工程とを有することを特徴とする導電性金属膜の形成方法。
A step of forming a nickel-based vacuum thin film on a substrate based on a physical vacuum deposition technique, and a substrate on which the vacuum thin film is formed is subjected to a substitution gold plating treatment in a substitution gold plating bath to form a substitution gold layer on the surface of the vacuum thin film. A process for forming a conductive metal film.
前記真空薄膜の表面に置換金層を形成する工程の後に、無電解金メッキ浴において無電解金メッキ処理を施し前記置換金層の表面に金メッキ皮膜を形成する工程を有することを特徴とする請求項１記載の導電性金属膜の形成方法。
2. The method of forming a gold plating film on the surface of the replacement gold layer by performing an electroless gold plating treatment in an electroless gold plating bath after the step of forming the replacement gold layer on the surface of the vacuum thin film. The formation method of the electroconductive metal film of description.
前記基板上にニッケル系の真空薄膜を形成する工程の後に、該真空薄膜をパターン形成する工程を含み、該パターン形成した真空薄膜の基板を置換金メッキ浴において置換金メッキ処理を施し該真空薄膜の表面に置換金層を形成する工程とを有することを特徴とする請求項１または２記載の導電性金属膜の形成方法。
A step of patterning the vacuum thin film after the step of forming a nickel-based vacuum thin film on the substrate, and subjecting the patterned vacuum thin film substrate to a substitution gold plating treatment in a substitution gold plating bath; The method for forming a conductive metal film according to claim 1, further comprising: forming a substitutional gold layer.
JP2003416422A2003-12-152003-12-15Method of depositing electrically conductive metal film
PendingJP2005171364A
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