JP2005168217A - Terminal structure and terminal member of wire for automobile - Google Patents

Terminal structure and terminal member of wire for automobile Download PDF

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JP2005168217A
JP2005168217A JP2003405090A JP2003405090A JP2005168217A JP 2005168217 A JP2005168217 A JP 2005168217A JP 2003405090 A JP2003405090 A JP 2003405090A JP 2003405090 A JP2003405090 A JP 2003405090A JP 2005168217 A JP2005168217 A JP 2005168217A
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terminal member
electric wire
terminal
semiconductive
layer
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Masahiro Tokunaga
昌弘 徳永
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a terminal structure and a terminal member of a wire for automobile, in which insulation characteristics can be improved by relaxing the concentration of the lines of electric force at the terminal of the wire for the automobile. <P>SOLUTION: The terminal structure of a wire for automobile comprises a wire for automobile, having an insulation layer 130 and an outer semiconductive layer 140, and a terminal member 200 fixed to the outside of the exposed outer semiconductive layer 140 and insulation layer 130, while touching both layers in the terminal of that wire. The terminal member 200 comprises a plurality of split pieces 210A and 210B being formed into a hollow body when they are closed, and an open/close mechanism (coupling band) 240 for coupling the split pieces to open/close freely. The terminal member further comprises a circular cone semiconductive part 230 connected with the outer semiconductive layer 140 of the wire, and an insulating part 220 arranged on the insulation layer 130 of the wire integrally with the semiconductive part 230. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、自動車用電線の端末構造と自動車用電線の端末部材に関するものである。   The present invention relates to a terminal structure of an automobile electric wire and an automobile electric wire terminal member.

従来から自動車のワイヤハーネス用電線として、図10に記載のものが知られている。これは中心側から順に導体110、絶縁層130、シールド層150、シース160を具えている(例えば特許文献1)。このうち、シールド層150には、一般に細径の金属線の編組材が用いられている。このような電線は、通常の内燃機関を用いた自動車は勿論、電気自動車やハイブリッド車などにも利用されている。例えば、ハイブリッド車では、バッテリから288Vの直流をインバータに供給し、インバータで3相交流に変換して車両駆動用のモータに給電している。車両減速時にはモータが発電機として機能し、発生した回生電力をインバータに供給して直流に変換し、バッテリの充電に供している。   Conventionally, the wire shown in FIG. 10 is known as an electric wire for a wire harness of an automobile. This includes a conductor 110, an insulating layer 130, a shield layer 150, and a sheath 160 in order from the center side (for example, Patent Document 1). Of these, a braided material of a thin metal wire is generally used for the shield layer 150. Such electric wires are used not only for automobiles using ordinary internal combustion engines but also for electric cars and hybrid cars. For example, in a hybrid vehicle, a direct current of 288V is supplied from a battery to an inverter, converted into a three-phase alternating current by the inverter, and supplied to a motor for driving the vehicle. When the vehicle decelerates, the motor functions as a generator, and the generated regenerative power is supplied to the inverter and converted into direct current to be used for charging the battery.

特開平6−124608号公報(図17)JP-A-6-124608 (FIG. 17)

しかし、上記の電線では、その端末部において電界集中が発生し、部分放電の発生や、それに伴う絶縁破壊への進展が生じやすくなるという問題があった。   However, the above-described electric wire has a problem that electric field concentration occurs at the terminal portion, and partial discharge is likely to occur and the accompanying breakdown is likely to develop.

図11に示すように、端末処理を行う場合、電線の各被覆層を段剥ぎする。その際、特にシールド層150の端末に電気力線が集中し、このシールド層端末付近の絶縁層130の電位傾度が大きくなる。図における破線が電気力線、一点鎖線が等電位線である。その結果、電線自体の耐電圧特性を低下させることとなり、絶縁劣化や絶縁破壊の要因となる。特に、高電圧対応を考慮した場合、これらの問題点は一層顕著となる。   As shown in FIG. 11, when the terminal process is performed, each coating layer of the electric wire is stripped. At this time, the lines of electric force concentrate particularly on the terminal of the shield layer 150, and the potential gradient of the insulating layer 130 near the terminal of the shield layer increases. The broken lines in the figure are electric lines of force, and the alternate long and short dashed lines are equipotential lines. As a result, the withstand voltage characteristic of the electric wire itself is lowered, which causes a deterioration of insulation and a breakdown. In particular, these problems become more prominent when high voltage support is taken into consideration.

従って、本発明の主目的は、自動車用電線の端末における電気力線の集中を緩和して、絶縁特性の改善を図ることができる自動車用電線の端末構造と自動車用電線の端末部材とを提供することにある。   Therefore, the main object of the present invention is to provide a terminal structure for an automobile electric wire and a terminal member for an automobile electric wire that can alleviate the concentration of electric lines of force at the terminal of an automobile electric wire and improve insulation characteristics. There is to do.

本発明は、自動車用電線の端末に電気力線の集中を緩和する部材を用い、この部材を電線に装着容易な構成とすることで上記の目的を達成する。   The present invention achieves the above object by using a member that relaxes the concentration of the lines of electric force at the terminal of the electric wire for automobiles, and making this member easy to attach to the electric wire.

本発明自動車用電線の端末構造は、絶縁層と外部半導電層とを有する自動車用電線と、この電線の端末において、露出させた外部半導電層と絶縁層の外側に両層と接触状態で装着される端末部材とを具える。この端末部材は、閉じることで中空体に形成される複数の分割片と、各分割片を開閉自在に連結する開閉機構とを有する。さらに、この端末部材は、円錐面形状を有して前記電線の外部半導電層と接続される半導電部と、この半導電部と一体で前記電線の絶縁層上に配される絶縁部とを有することを特徴とする。   The terminal structure of an automotive electric wire according to the present invention includes an automotive electric cable having an insulating layer and an external semiconductive layer, and the outer end of the exposed external semiconductive layer and insulating layer at the end of the electric wire in contact with both layers. And a terminal member to be mounted. The terminal member includes a plurality of divided pieces formed in a hollow body by being closed, and an opening / closing mechanism that connects the divided pieces so as to be freely opened and closed. Further, the terminal member has a semiconducting portion having a conical surface shape and connected to the outer semiconductive layer of the electric wire, and an insulating portion arranged on the insulating layer of the electric wire integrally with the semiconductive portion. It is characterized by having.

また、本発明自動車用電線の端末部材は、外部半導電層と絶縁層とを露出した自動車用電線の端末に、これら両層と接触状態で装着される自動車用電線の端末部材である。この端末部材は、閉じることで中空体に形成される複数の分割片と、各分割片を開閉自在に連結する開閉機構とを有する。さらに、この端末部材は、円錐面形状を有して前記電線の外部半導電層と接続される半導電部と、この半導電部と一体で前記電線の絶縁層上に配される絶縁部とを有することを特徴とする。   Moreover, the terminal member of the electric wire for motor vehicles of this invention is a terminal member of the electric wire for motor vehicles attached to the terminal of the electric wire for motor vehicles which exposed the external semiconductive layer and the insulating layer in contact with these both layers. The terminal member includes a plurality of divided pieces formed in a hollow body by being closed, and an opening / closing mechanism that connects the divided pieces so as to be freely opened and closed. Further, the terminal member has a semiconducting portion having a conical surface shape and connected to the outer semiconductive layer of the electric wire, and an insulating portion arranged on the insulating layer of the electric wire integrally with the semiconductive portion. It is characterized by having.

このように、円錐面形状を有する半導電部と、この半導電部と一体の絶縁部を有する端末部材を電線の端末部に設け、この半導電部を電線の外部半導電層と接続する。つまり、この構成により、ストレスコーンを電線の端末部に形成したことになり、シールド層端部および外部半導電層端部における電界集中を緩和し、端末構造の絶縁特性を改善することができる。   Thus, the terminal member which has the semiconductive part which has a conical surface shape, and the insulating part integral with this semiconductive part is provided in the terminal part of an electric wire, and this semiconductive part is connected with the external semiconductive layer of an electric wire. That is, with this configuration, the stress cone is formed at the end portion of the electric wire, so that the electric field concentration at the end portion of the shield layer and the end portion of the external semiconductive layer can be alleviated and the insulation characteristics of the end structure can be improved.

以下、本発明端末構造または端末部材の構成をより詳しく説明する。   Hereinafter, the terminal structure of the present invention or the structure of the terminal member will be described in more detail.

(端末部材)
<分割片>
端末部材は複数の分割片から構成される。代表的には、各分割片は、組み合わせた際、電線に被せられるように中空の円錐状に構成される。つまり、各分割片は、一端が先細り状であって、断面形状が2つの同心円弧と、この円弧の端部をつなぐ径方向の直線とで囲まれる形状を有する。分割片の数は通常2つが好適である。その場合、2つの分割片で電線を挟み込むことで容易に装着することができる。特に、絶縁テープと半導電性テープを手作業で巻き付けてストレスコーンを形成するような場合に比べれば、開閉式の分割片を用いることは格段に装着性に優れる。もちろん、3つ以上の分割片で端末部材を構成しても構わない。
(Terminal member)
<Divided piece>
The terminal member is composed of a plurality of divided pieces. Typically, each divided piece is configured in a hollow conical shape so as to be covered with an electric wire when combined. That is, each divided piece has a shape in which one end is tapered and the cross-sectional shape is surrounded by two concentric arcs and a radial straight line connecting the ends of the arcs. In general, the number of divided pieces is preferably two. In that case, it can mount | wear easily by pinching an electric wire with two division | segmentation pieces. In particular, the use of the open / close-type divided pieces is significantly superior to the case where the stress cone is formed by manually winding the insulating tape and the semiconductive tape. Of course, you may comprise a terminal member with three or more division | segmentation pieces.

これら各分割片は半導電部と絶縁部とから構成される。通常、半導電部は端末部材の外周側に形成され、絶縁部は半導電部の内周側に形成される。また、半導電部は円錐面形状を有することとする。特に、半導電部は、その一部が端末部材の内周側に露出するように配置し、電線の外部半導電層と接続しやすいように構成することが好ましい。円錐面形状に半導電部を形成することで、電線の外部半導電層と接続した際にシールド層あるいは外部半導電層の端部周辺における電気力線の集中を効果的に緩和することができる。   Each of these divided pieces includes a semiconductive portion and an insulating portion. Usually, the semiconductive portion is formed on the outer peripheral side of the terminal member, and the insulating portion is formed on the inner peripheral side of the semiconductive portion. The semiconductive portion has a conical surface shape. In particular, the semiconductive portion is preferably arranged so that a part of the semiconductive portion is exposed on the inner peripheral side of the terminal member, and is configured to be easily connected to the external semiconductive layer of the electric wire. By forming the semiconductive portion in the shape of a conical surface, it is possible to effectively alleviate the concentration of electric lines of force around the end of the shield layer or the external semiconductive layer when connected to the external semiconductive layer of the electric wire. .

この半導電部の体積抵抗率は、1×103〜1×105Ω・cmであることが好ましい。このような抵抗率を確保することで、電線の外部半導電層との抵抗率を整合させ、電界集中の緩和を図る点で望ましい。この抵抗率の下限を下回ると、半導電部に電流が流れることによるジュール熱の発生の原因となる。逆に、上限を超えると抵抗率が高くなりすぎ、シールド層端部周辺および外部半導電層端部周辺の電位傾度の緩和効果が十分期待できない。 The volume resistivity of the semiconductive portion is preferably 1 × 10 3 to 1 × 10 5 Ω · cm. Ensuring such a resistivity is desirable in terms of matching the resistivity with the outer semiconductive layer of the electric wire and reducing electric field concentration. Below the lower limit of the resistivity, Joule heat is generated due to current flowing through the semiconductive portion. On the other hand, if the upper limit is exceeded, the resistivity becomes too high, and the effect of relaxing the potential gradient around the edge of the shield layer and around the edge of the external semiconductive layer cannot be expected sufficiently.

一方、絶縁部は半導電部と一体に構成される。通常、絶縁部は分割片を組み合わせた際に中空の円錐状に形成される。つまり、絶縁部は内周側に電線がはめ込まれる凹部を有する。   On the other hand, the insulating part is formed integrally with the semiconductive part. Usually, the insulating part is formed in a hollow conical shape when the divided pieces are combined. In other words, the insulating portion has a recess into which the electric wire is fitted on the inner peripheral side.

また、各分割片の接合面は、隣接する分割片の接合面と適合する凹凸面であることが好ましい。端末部材は、複数の分割片を組み合わせて構成するため、必然的に各分割片同士の接合面が生じる。この接合面の沿面距離を稼いで絶縁特性を高めるため、接合面は凹凸面に形成することが好ましい。この凹凸面は、例えば連続する湾曲面で構成した波型とし、単に隣接する分割片と密接する形状でも良いし、互いに係合して後述するロック機構を兼ね備える形状であっても良い。また、この凹凸面は接合面の沿面距離を稼ぐことが目的であるため、接合面の一部に形成しておいても有効であるが、全面にわたって凹凸状に形成しておくことがより好ましい。   Moreover, it is preferable that the joining surface of each division | segmentation piece is an uneven | corrugated surface matched with the joining surface of an adjacent division piece. Since the terminal member is configured by combining a plurality of divided pieces, a joining surface between the divided pieces is inevitably generated. In order to increase the creepage distance of the joint surface and enhance the insulation characteristics, the joint surface is preferably formed on an uneven surface. The uneven surface may be, for example, a wave shape constituted by a continuous curved surface, and may simply have a shape that is in close contact with adjacent divided pieces, or may have a shape that engages with each other and also has a lock mechanism that will be described later. Further, since the uneven surface is intended to increase the creepage distance of the joint surface, it is effective to form it on a part of the joint surface, but it is more preferable to form the uneven surface over the entire surface. .

<開閉機構>
上記の各分割片は、開閉可能なように連結機構で互いに連結される。開閉機構は、複数の分割片をヒンジ状に連結できるものであれば構わない。その代表例としては、各分割片をつなぐ可とう性の連結帯が挙げられる。この開閉機構は絶縁材料で構成することが好ましい。例えば、ポリエチレンやポリプロピレンが利用できる。
<Opening and closing mechanism>
Each of the divided pieces is connected to each other by a connecting mechanism so as to be opened and closed. The opening / closing mechanism may be any mechanism that can connect a plurality of divided pieces in a hinge shape. A typical example is a flexible connecting band that connects the divided pieces. This opening / closing mechanism is preferably made of an insulating material. For example, polyethylene or polypropylene can be used.

<ロック機構>
複数の分割片を、電線を覆うように被せて閉じれば端末部材を電線に装着できるが、分割片を閉じた状態に保持する必要がある。そのため、端末部材には、分割片を閉じた状態に保持するロック機構を有することが好ましい。
<Lock mechanism>
The terminal member can be attached to the electric wire by closing the plurality of divided pieces so as to cover the electric wire, but it is necessary to hold the divided pieces in a closed state. Therefore, it is preferable that the terminal member has a lock mechanism that holds the divided pieces in a closed state.

ロック機構は、各分割片同士の係合により、各分割片を閉じた状態に保持できるものであれば、特に構成は問わない。例えば、ロック機構は、端末部材の外周側に設けたり、各分割片の接合面に設けることが考えられる。   The lock mechanism is not particularly limited as long as it can hold each divided piece in a closed state by engagement between the divided pieces. For example, it is conceivable that the lock mechanism is provided on the outer peripheral side of the terminal member or on the joint surface of each divided piece.

端末部材の外周側に設けたロック機構の一例としては、接合する一方の分割片の外周に係合凸部を形成し、他方の分割片の外周に係合凹部を形成して、これら係合凸部と係合凹部とを係合することで分割片を閉じた状態に保持する構成が挙げられる。端末部材の外周側にロック機構を形成することで、各分割片のロックとロック解除が容易に行なえ、さらにロックされていることの確認も容易にできる。   As an example of the lock mechanism provided on the outer peripheral side of the terminal member, an engagement convex portion is formed on the outer periphery of one of the divided pieces to be joined, and an engagement concave portion is formed on the outer periphery of the other divided piece. The structure which hold | maintains the division piece in the closed state by engaging a convex part and an engagement recessed part is mentioned. By forming a lock mechanism on the outer peripheral side of the terminal member, each divided piece can be easily locked and unlocked, and it can be easily confirmed that it is locked.

一方、分割片の接合面に設けたロック機構の一例としては、接合する一方の分割片の接合面に係合凸部を形成し、他方の分割片の接合面に係合凹部を形成して、これら係合凸部と係合凹部とを係合することで分割片を閉じた状態に保持する構成が挙げられる。端末部材の内周側にロック機構を形成することで、端末部材の外周側に突起物を設けることなく分割片を閉じた状態に保持でき、端末部周辺の電界分布をより均一化することが可能である。この場合、係合凸部や係合凹部は、接合面の全面ではなく一部に形成されていても構わない。   On the other hand, as an example of the lock mechanism provided on the joint surface of the split piece, an engagement convex portion is formed on the joint surface of one split piece to be joined, and an engagement concave portion is formed on the joint surface of the other split piece. The structure which hold | maintains the division piece in the closed state by engaging these engagement convex parts and engagement concave parts is mentioned. By forming a lock mechanism on the inner peripheral side of the terminal member, the divided pieces can be held closed without providing protrusions on the outer peripheral side of the terminal member, and the electric field distribution around the terminal portion can be made more uniform. Is possible. In this case, the engaging convex portion and the engaging concave portion may be formed on a part of the joint surface instead of the entire surface.

ロック機構の材質は、絶縁材料とすることが好適である。例えば、ポリエチレンやポリプロピレンが利用できる。なお、ロック機構を用いない場合、若干面倒ではあるが、閉じた分割片の外周にテープを巻きつけるなどして分割片が開かないようにすることも可能である。   The material of the lock mechanism is preferably an insulating material. For example, polyethylene or polypropylene can be used. When the lock mechanism is not used, although it is a little troublesome, it is possible to prevent the divided pieces from opening by winding a tape around the outer periphery of the closed divided pieces.

<製造方法>
このような端末部材は、モールドで形成することができる。例えば、先に分割片の絶縁部、開閉機構、ロック機構を絶縁材料でモールドにより一体に成形しておく。端末部材が一対の分割片を有する場合、両分割片を開いた状態で成形を行う。つまり、ロック機構の係合凸部が上下金型の水平分割面にまたがり、係合凹部と開閉機構とがほぼ上下金型の水平分割面に沿うように金型内形状を構成する。これにより、上下の金型を開いた際に成形品を金型から支障なく抜き出すことができる。係合凹部が円筒状の場合、内周孔を形成するために中子を用いればよい。次に、得られた成形品を別の金型に挿入し、半導電材料で絶縁部の外周に半導電部を形成すればよい。
<Manufacturing method>
Such a terminal member can be formed by a mold. For example, the insulating part of the split piece, the opening / closing mechanism, and the lock mechanism are previously formed integrally with an insulating material by molding. When a terminal member has a pair of division | segmentation piece, it shape | molds in the state which opened both division | segmentation pieces. That is, the inner shape of the mold is configured such that the engaging convex portion of the locking mechanism extends over the horizontal dividing surface of the upper and lower molds, and the engaging concave portion and the opening / closing mechanism are substantially along the horizontal dividing surface of the upper and lower molds. Thereby, when the upper and lower molds are opened, the molded product can be extracted from the mold without any trouble. When the engaging recess is cylindrical, a core may be used to form the inner peripheral hole. Next, the obtained molded product is inserted into another mold, and the semiconductive portion may be formed on the outer periphery of the insulating portion with a semiconductive material.

<電線端末への装着状態>
端末部材は、外部半導電層と絶縁層とを露出した自動車用電線の端末に、これら両層と接触状態で装着される。つまり、端末部材の半導電部を電線の外部半導電層と接続し、端末部材の絶縁部を電線の絶縁層上に配置する。
<Attached state to the wire terminal>
The terminal member is attached to the terminal of the automobile electric wire from which the external semiconductive layer and the insulating layer are exposed, in contact with both the layers. That is, the semiconductive portion of the terminal member is connected to the external semiconductive layer of the electric wire, and the insulating portion of the terminal member is disposed on the insulating layer of the electric wire.

(自動車用電線)
<基本構成>
本発明端末構造に用いる電線は、導体、絶縁層、外部半導電層およびシールド層を有することを基本構成とする。
(Automotive wire)
<Basic configuration>
The electric wire used for the terminal structure of the present invention basically has a conductor, an insulating layer, an external semiconductive layer, and a shield layer.

<導体>
導体は、必要な送電容量が確保できるものであればよく、特に材質・構成が限定されるわけではない。材質としては、銅線、錫めっき銅線、アルミ線、アルミ合金線、鋼心アルミ線、カッパーフライ線、ニッケルめっき銅線、銀めっき銅線、銅覆アルミ線などが挙げられる。導体の構成としては、単線とより線が考えられるが、一般に複数の素線をより合わせたより線構造が好適である。
<Conductor>
The conductor is not particularly limited in material and configuration as long as the necessary power transmission capacity can be secured. Examples of the material include copper wire, tin-plated copper wire, aluminum wire, aluminum alloy wire, steel core aluminum wire, copper fly wire, nickel-plated copper wire, silver-plated copper wire, and copper-covered aluminum wire. As the configuration of the conductor, a single wire and a stranded wire are conceivable, but generally a stranded wire structure in which a plurality of strands are combined is preferable.

<絶縁層>
絶縁層は電線の電圧に応じた耐電圧性を具える構成とする。絶縁層の材質としては、エチレンプロピレンゴム、ビニル樹脂(例えば、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリビニルアルコールなど)、ポリスチレン、ポリエチレン、クロロスルフォン化ポリエチレンゴム、珪素ゴム、ポリテトラフルオロエチレンなど挙げられる。特に、架橋ポリオレフィン、中でも架橋ポリエチレンが好適である。
<Insulating layer>
The insulating layer is configured to have voltage resistance according to the voltage of the electric wire. Examples of the material for the insulating layer include ethylene propylene rubber, vinyl resin (eg, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, etc.), polystyrene, polyethylene, chlorosulfonated polyethylene rubber, silicon rubber, polytetrafluoroethylene, and the like. In particular, a cross-linked polyolefin, particularly a cross-linked polyethylene is preferred.

この絶縁層は、後述する内部半導電層を設ける場合、内部半導電層と同時押出またはタンデム押出することが好ましい。絶縁層と内部半導電層を同時または連続して押し出すことで、両層間に異物が混入したりギャップが生じることを抑制できる。特に、同時押出によれば、一度の押出工程で内部半導電層と絶縁層を形成することができる。さらに、押出にて内部半導電層を形成すれば、導電性布テープを利用した場合と異なって導電性布テープの端部やケバなどの不整部がなく、水トリーの起点を排除することができる。   This insulating layer is preferably co-extruded or tandem extruded with the internal semiconductive layer when an internal semiconductive layer to be described later is provided. By extruding the insulating layer and the internal semiconductive layer simultaneously or successively, it is possible to prevent foreign matter from entering between the two layers and the occurrence of a gap. In particular, according to the coextrusion, the internal semiconductive layer and the insulating layer can be formed by a single extrusion process. Furthermore, if the internal semiconductive layer is formed by extrusion, unlike the case where conductive cloth tape is used, there are no irregular parts such as edges or indentations on the conductive cloth tape, and the origin of the water tree is eliminated. Can do.

<外部半導電層>
絶縁層の外側に外部半導電層を設けることで、絶縁層とシールド層との界面における微小なギャップを埋め、部分放電の発生を抑制することができる。また、これら微小なギャップをなくすることで、水トリーの発生の起点をなくすこともでき、水トリーの発生に起因する絶縁劣化を抑制することができる。
<External semiconductive layer>
By providing the external semiconductive layer outside the insulating layer, a minute gap at the interface between the insulating layer and the shield layer can be filled and the occurrence of partial discharge can be suppressed. Further, by eliminating these minute gaps, the starting point of water tree generation can be eliminated, and insulation deterioration due to water tree generation can be suppressed.

外部半導電層は、樹脂と導電性フィラーとの混合物で構成することが好ましい。導電性フィラーの混合により、所定の導電率を半導電層に付与することができる。樹脂はポリエチレン、ポリ塩化ビニルおよびポリ酢酸ビニルよりなる群から選択される少なくとも一種が望ましい。フィラーはカーボンブラックが好適に利用できる。   The outer semiconductive layer is preferably composed of a mixture of a resin and a conductive filler. Predetermined conductivity can be imparted to the semiconductive layer by mixing conductive fillers. The resin is preferably at least one selected from the group consisting of polyethylene, polyvinyl chloride, and polyvinyl acetate. Carbon black can be suitably used as the filler.

その他、外部半導電層の好適な材質として、特開平6-203651号公報に記載のものもある。すなわち、(A)酢酸ビニル含有量30〜70質量%のエチレン−酢酸ビニル共重合体、及びアクリル酸エチル含有量20〜40質量%のエチレン−アクリル酸エチル共重合体からなる群より選ばれた少なくとも1種の共重合体100重量部に対して、(B)導電性カーボンブラック20〜100重量部、及び(C)分子中に少なくとも1つのエポキシ基を持ち、かつ、融点が40℃以上のエポキシ化合物0.5〜50重量部を含有する組成物である。   Other suitable materials for the external semiconductive layer are those described in JP-A-6-203651. That is, it was selected from the group consisting of (A) an ethylene-vinyl acetate copolymer having a vinyl acetate content of 30 to 70% by mass and an ethylene-ethyl acrylate copolymer having an ethyl acrylate content of 20 to 40% by mass. (B) 20 to 100 parts by weight of conductive carbon black, and (C) at least one epoxy group in the molecule, and a melting point of 40 ° C. or more with respect to 100 parts by weight of at least one copolymer. It is a composition containing 0.5 to 50 parts by weight of an epoxy compound.

外部半導電層の体積抵抗率は1×103〜1×105Ω・cmとすることが好ましい。このような抵抗率を確保することで、部分放電抑止の点で望ましい。この抵抗率の下限を下回ると、半導電層に電流が流れることによるジュール熱の発生の原因となる。逆に、上限を超えると抵抗率が高くなりすぎ、導体とシールド層との界面あるいは導体と絶縁層との界面における電位傾度の緩和効果が十分期待できない。 The volume resistivity of the outer semiconductive layer is preferably 1 × 10 3 to 1 × 10 5 Ω · cm. Ensuring such a resistivity is desirable in terms of suppressing partial discharge. Below the lower limit of the resistivity, Joule heat is generated due to current flowing through the semiconductive layer. On the contrary, if the upper limit is exceeded, the resistivity becomes too high, and the effect of relaxing the potential gradient at the interface between the conductor and the shield layer or the interface between the conductor and the insulating layer cannot be sufficiently expected.

<内部半導電層>
さらに、導体と絶縁層との間に内部半導電層を設けてもよい。内部半導電層を設けることで、導体と絶縁層との間における部分放電の発生や水トリーの発生を抑制することができる。内部半導電層の好ましい構成材料や抵抗率は、上述した外部半導電層と同様である。
<Internal semiconductive layer>
Furthermore, an internal semiconductive layer may be provided between the conductor and the insulating layer. By providing the internal semiconductive layer, it is possible to suppress the occurrence of partial discharge and water tree between the conductor and the insulating layer. Preferred constituent materials and resistivity of the internal semiconductive layer are the same as those of the external semiconductive layer described above.

<シールド層>
シールド層は銅線などの金属線の編組材を用いることができる。シールド層を設けることで、誘導防止用の遮蔽と危険防止用の遮蔽を行なうことができる。
<Shield layer>
For the shield layer, a braided material of a metal wire such as a copper wire can be used. By providing the shield layer, guidance prevention shielding and danger prevention shielding can be performed.

<シース>
その他、シールド層の上にシースを設けてもよい。シースを設けることで、シールド層の機械的保護を図ることができる。シースは、一般にクロロプレンゴム、ビニル樹脂、ポリエチレンなどで構成される。
<Sheath>
In addition, a sheath may be provided on the shield layer. By providing the sheath, the shield layer can be mechanically protected. The sheath is generally made of chloroprene rubber, vinyl resin, polyethylene or the like.

<電線用途>
本発明端末構造に用いられる自動車用電線には、ガソリンエンジンなどの内燃機関を用いた自動車に用いられる電線はもちろん、電気自動車またはハイブリッドカーに用いられる電線が含まれる。電気自動車やハイブリッドカーの場合、代表的にはバッテリ、インバータ、走行用モータ、ジェネレータなどの間を接続する電線が挙げられる。特に高電圧用途での利用が好適である。例えば400V以上、より好ましくは600V以上、さらに好ましくは1kV以上での利用が期待できる。
<Wire application>
The electric wires for automobiles used in the terminal structure of the present invention include electric wires used in electric vehicles or hybrid cars as well as electric wires used in automobiles using an internal combustion engine such as a gasoline engine. In the case of an electric vehicle or a hybrid car, typically, an electric wire connecting between a battery, an inverter, a traveling motor, a generator, and the like can be given. It is particularly suitable for use in high voltage applications. For example, utilization at 400 V or higher, more preferably 600 V or higher, and even more preferably 1 kV or higher can be expected.

本発明端末構造によれば、自動車用電線の端末におけるシールド層端部や外部半導電層端部における電気力線の集中を緩和し、絶縁特性を強化することができる。また、本発明端末部材は、上記の端末構造を形成するのに最適な構造部材であり、電線端末に容易に装着することができる。   According to the terminal structure of the present invention, the concentration of electric lines of force at the end of the shield layer and the end of the external semiconductive layer at the end of the electric wire for automobiles can be alleviated and the insulation characteristics can be enhanced. The terminal member of the present invention is an optimal structural member for forming the above terminal structure, and can be easily attached to the electric wire terminal.

以下、本発明端末構造の実施の形態を説明する。   Hereinafter, embodiments of the terminal structure of the present invention will be described.

まず、この端末構造に用いる電線の構成から説明する。図1は本発明端末構造に用いるワイヤハーネス用電線の断面図である。   First, the structure of the electric wire used for this terminal structure will be described. FIG. 1 is a cross-sectional view of a wire harness wire used in the terminal structure of the present invention.

この電線は中心から順に、導体110、内部半導電層120、絶縁層130、外部半導電層140、シールド層150、シース160を具えている。   The electric wire includes a conductor 110, an inner semiconductive layer 120, an insulating layer 130, an outer semiconductive layer 140, a shield layer 150, and a sheath 160 in this order from the center.

ここでは、0.32mm径の軟銅線を19本より合わせて撚り素線を形成し、さらに、この撚り素線を19本より合わせて公称断面積30sqの導体110を構成した。   Here, 19 strands of 0.32 mm diameter annealed copper wire were combined to form a twisted strand, and further, 19 strands were combined to form a conductor 110 having a nominal cross-sectional area of 30 sq.

この導体110の直上に内部半導電層120を形成する。その材質には、ポリエチレンにカーボンブラックを配合した混合物を用いた。得られた内部半導電層120の厚さは0.3mm、体積抵抗率は1×104Ω・cmである。この内部半導電層120は次に述べる絶縁層と同時押出にて形成した。 An internal semiconductive layer 120 is formed immediately above the conductor 110. As the material, a mixture of polyethylene and carbon black was used. The obtained internal semiconductive layer 120 has a thickness of 0.3 mm and a volume resistivity of 1 × 10 4 Ω · cm. The internal semiconductive layer 120 was formed by coextrusion with an insulating layer described below.

内部半導電層120の上には絶縁層130が形成される。絶縁層130の材質はポリエチレンであり、その厚さは1.1mmである。この絶縁層130の内部半導電層120と同時押出により形成されるため、両層間に異物が混入したりギャップができるおそれが少なく、部分放電の抑制に一層効果的である。   An insulating layer 130 is formed on the inner semiconductive layer 120. The material of the insulating layer 130 is polyethylene, and its thickness is 1.1 mm. Since the insulating layer 130 is formed by co-extrusion with the inner semiconductive layer 120, there is little possibility that foreign matter is mixed or a gap is formed between both layers, which is more effective in suppressing partial discharge.

続いて、絶縁層の架橋を行なう。ここでは、絶縁層に電子線を照射して架橋を行なった。その結果、絶縁層は固化して、その融点が上昇した。架橋前の絶縁層の融点は約120℃、架橋後の同融点は約150℃である。   Subsequently, the insulating layer is crosslinked. Here, the insulating layer was irradiated with an electron beam for crosslinking. As a result, the insulating layer solidified and its melting point increased. The melting point of the insulating layer before cross-linking is about 120 ° C., and the same melting point after cross-linking is about 150 ° C.

次に、絶縁層130の上に外部半導電層140を形成する。外部半導電層140も押出により形成した。ここでは、外部半導電層の押出は、絶縁層(内部半導電層)の押出とは独立して行なった。外部半導電層140の材質はポリ塩化ビニルにカーボンブラックを配合した混合物を用いた。得られた外部半導電層140の厚さは0.3mm、体積抵抗率は1×104Ω・cmである。 Next, an external semiconductive layer 140 is formed on the insulating layer 130. The outer semiconductive layer 140 was also formed by extrusion. Here, the outer semiconductive layer was extruded independently of the insulating layer (inner semiconductive layer). As the material of the outer semiconductive layer 140, a mixture of carbon black and polyvinyl chloride was used. The obtained outer semiconductive layer 140 has a thickness of 0.3 mm and a volume resistivity of 1 × 10 4 Ω · cm.

外部半導電層140の上にはシールド層150が形成される。シールド層150は、0.32mm径の軟銅線からなる編組材を用いた。   A shield layer 150 is formed on the outer semiconductive layer 140. For the shield layer 150, a braided material made of an annealed copper wire having a diameter of 0.32 mm was used.

そして、シールド層150の上にシース160を形成する。ここでは、ポリ塩化ビニルを厚さ1.0mmに押し出してシース160を形成した。   Then, a sheath 160 is formed on the shield layer 150. Here, the sheath 160 was formed by extruding polyvinyl chloride to a thickness of 1.0 mm.

次に、端末部材の構成を説明する。図2は分割片を開いた状態の端末部材を示す太径側の端面図、図3は分割片を閉じた状態の端末部材を示す太径側の端面図、図4は端末部材の縦断面図である。   Next, the configuration of the terminal member will be described. FIG. 2 is an end view on the large diameter side showing the terminal member with the split piece open, FIG. 3 is an end view on the large diameter side showing the terminal member with the split piece closed, and FIG. 4 is a longitudinal section of the terminal member. FIG.

図2、図3に示すように、本発明端末部材200は2つの分割片210A、210Bを可とう性の連結帯240(開閉機構)で開閉自在に連結した構成で、両分割片210A、210Bを閉じた状態に保持するロック機構250を有する。   As shown in FIG. 2 and FIG. 3, the terminal member 200 of the present invention has a configuration in which two divided pieces 210A and 210B are connected to each other by a flexible connecting band 240 (opening / closing mechanism) so as to be opened and closed. And a lock mechanism 250 that holds the device in a closed state.

各分割片210A、210Bは円錐台を縦断面で分割した形状を有している。つまり、この端末部材200は、各分割片210A、210Bを閉じた状態において一端が細く、他端が太くなった中空の円錐台形状を構成する(図4参照)。その内周側が中空円錐台状の絶縁部220で形成され、この絶縁部220の外周に薄く半導電部230が一体に被着されている。本例では、絶縁部220をポリエチレンで、半導電部230をポリエチレンにカーボンブラックを配合したもので構成した。半導電部230の厚さは1.0mmである。半導電部230は、絶縁部220の一端よりも細径側に突出し、絶縁部220の一端と半導電部230の突出箇所との間に段差を形成している。この段差を有することで、上述した電線の端末を段剥ぎした際、絶縁部220を電線の絶縁層130(図1参照)上に密着し、半導電部230を電線の外部半導電層140(図1参照)上に密着させることができる。本例における半導電部230の体積抵抗率も1×104Ω・cmとした。また、半導電部230は絶縁部220の全周を覆っているのではない。端末部材200における外周面のうち、後述する連結帯240やロック機構250の周辺は絶縁部220で構成されている。 Each of the divided pieces 210A and 210B has a shape obtained by dividing a truncated cone by a longitudinal section. That is, the terminal member 200 forms a hollow truncated cone shape in which one end is thin and the other end is thick in a state where the divided pieces 210A and 210B are closed (see FIG. 4). The inner peripheral side is formed of a hollow frustoconical insulating portion 220, and a thin semiconductive portion 230 is integrally attached to the outer periphery of the insulating portion 220. In this example, the insulating part 220 is made of polyethylene, and the semiconductive part 230 is made of polyethylene and carbon black. The thickness of the semiconductive portion 230 is 1.0 mm. The semiconductive portion 230 protrudes to the narrower diameter side than one end of the insulating portion 220, and a step is formed between one end of the insulating portion 220 and the protruding portion of the semiconductive portion 230. By having this step, when the end of the above-described electric wire is peeled off, the insulating portion 220 is brought into close contact with the insulating layer 130 (see FIG. 1) of the electric wire, and the semiconductive portion 230 is connected to the outer semiconductive layer 140 ( (See Fig. 1). The volume resistivity of the semiconductive portion 230 in this example was also 1 × 10 4 Ω · cm. Further, the semiconductive portion 230 does not cover the entire circumference of the insulating portion 220. Of the outer peripheral surface of the terminal member 200, the periphery of a connecting band 240 and a lock mechanism 250, which will be described later, is constituted by an insulating portion 220.

これら一対の分割片210A、210Bは連結帯240にて連結されている。連結帯240も分割片210A、210Bと共にモールドで一体に形成している。この連結帯240はポリエチレンで形成しており、分割片210A、210Bの開閉に伴って屈曲可能である。   The pair of divided pieces 210A and 210B are connected by a connecting band 240. The connecting band 240 is also integrally formed with the divided pieces 210A and 210B by a mold. The connecting band 240 is made of polyethylene and can be bent as the divided pieces 210A and 210B are opened and closed.

一方、ロック機構250は、端末部材における連結帯240の設けられた位置と対向する位置に形成されている。このロック機構250は、図2に示すように、一方の分割片210Aの外周縁部に、先端が膨出部を有する棒状の係合凸部251が形成され、他方の分割片210Bの外周縁部に、円筒状の係合凹部252が形成されている。膨出部の外径は係合凹部252の内径よりも大きく、係合凸部251における膨出部以外の箇所の長さと係合凹部252の長さとがほぼ等しいため、係合凸部251を係合凹部252に圧入すれば、両分割片210A、210Bを閉じた状態に保持することができる(図3参照)。このロック機構もポリエチレンで形成した。   On the other hand, the lock mechanism 250 is formed at a position facing the position where the connecting band 240 is provided in the terminal member. As shown in FIG. 2, in the lock mechanism 250, a rod-like engagement convex portion 251 having a bulging portion at the tip is formed on the outer peripheral edge of one divided piece 210A, and the outer peripheral edge of the other divided piece 210B. A cylindrical engagement recess 252 is formed in the part. Since the outer diameter of the bulging portion is larger than the inner diameter of the engaging concave portion 252 and the length of the portion other than the bulging portion in the engaging convex portion 251 and the length of the engaging concave portion 252 are substantially equal, If the engagement recess 252 is press-fitted, both the split pieces 210A and 210B can be held closed (see FIG. 3). This locking mechanism was also made of polyethylene.

このような端末部材200を上記の電線端末に装着した状態の縦断面図を図5に示す、電線の端末は各被覆層が段剥ぎされ、端末側から導体110、内部半導電層120、絶縁層130、外部半導電層140、シールド層150が順次段階的に露出されている。この電線端末の絶縁層130と外部半導電層140の両層を上記分割片で覆うように挟み込む。その際、端末部材の係合凸部251(図3参照)を係合凹部252(図3参照)に係合して、両分割片210A、210B(図3参照)が閉じた状態に保持されるようにする。この分割片210A、210Bの挟み込みにより、端末部材の絶縁部220が電線の絶縁層130上に、端末部材の半導電部230が電線の外部半導電層140上に密着される。その後、導体端部に圧着端子(図示せず)を装着し、電線に装着した端末部材周辺を絶縁テープあるいは熱収縮チューブで覆って端末処理を完成させる。   FIG. 5 shows a longitudinal cross-sectional view of such a terminal member 200 attached to the above-mentioned electric wire end. Each end of the electric wire is stripped of the covering layers, and the conductor 110, the internal semiconductive layer 120, and the insulation are separated from the end side. The layer 130, the outer semiconductive layer 140, and the shield layer 150 are exposed in stages. Both the insulating layer 130 and the outer semiconductive layer 140 of the electric wire end are sandwiched so as to be covered with the above-mentioned divided pieces. At that time, the engagement convex portion 251 (see FIG. 3) of the terminal member is engaged with the engagement concave portion 252 (see FIG. 3), and both split pieces 210A and 210B (see FIG. 3) are held in a closed state. So that By sandwiching the divided pieces 210A and 210B, the insulating portion 220 of the terminal member is brought into close contact with the insulating layer 130 of the electric wire, and the semiconductive portion 230 of the terminal member is brought into close contact with the outer semiconductive layer 140 of the electric wire. Thereafter, a crimp terminal (not shown) is attached to the conductor end, and the periphery of the terminal member attached to the electric wire is covered with an insulating tape or a heat shrinkable tube to complete the terminal treatment.

端末部材を電線に装着した状態での電気力線と等電位線も伴せて図5に示す。破線が電気力線、一点鎖線が等電位線を示す。この図から明らかなように、シールド層150や外部半導電層140の端部周辺への電気力線の集中が緩和され、その箇所の電位傾度も緩和されていることがわかる。   FIG. 5 shows the lines of electric force and equipotential lines when the terminal member is mounted on the electric wire. A broken line indicates an electric force line, and an alternate long and short dash line indicates an equipotential line. As is apparent from this figure, the concentration of the electric lines of force around the end portions of the shield layer 150 and the outer semiconductive layer 140 is alleviated, and the potential gradient at that location is also alleviated.

つまり、本発明端末構造は、電線端末に端末部材をはめ込むことでストレスコーンを形成し、電気力線がシールド層端部や外部半導電層端部に集中することを緩和することができる。また、本発明端末部材は、電線を挟み込むことで、容易に装着することができる。   That is, in the terminal structure of the present invention, the stress cone is formed by fitting the terminal member to the wire terminal, and the electric field lines can be reduced from being concentrated on the shield layer end portion or the outer semiconductive layer end portion. Moreover, this invention terminal member can be easily mounted | worn by pinching an electric wire.

次に、実施例1とは異なる構成のロック機構を有する本発明端末部材を説明する。図6は実施例2における分割片を開いた状態の端末部材を示す太径側の端面図、図7は分割片を開いた状態の端末部材を示す太径側の端面図である。   Next, the terminal member of the present invention having a lock mechanism having a configuration different from that of the first embodiment will be described. FIG. 6 is an end view on the large diameter side showing the terminal member in a state where the divided piece is opened in Example 2, and FIG. 7 is an end view on the large diameter side showing the terminal member in a state where the divided piece is opened.

この端末部材も円錐台状で半導電部230と絶縁部220とから構成され、ロック機構の形態が異なる点を除いて、他の構成は実施例1と同様である。   This terminal member is also in the shape of a truncated cone and is composed of a semiconductive portion 230 and an insulating portion 220, and the other configuration is the same as that of the first embodiment except that the form of the lock mechanism is different.

本例では、ロック機構を各分割片210A、210Bの接合面に設けた。つまり、一方の分割片210Aの接合面のうち、絶縁部220で構成される面に計4つの係合凸部253を設け、他方の分割片210Bの接合面のうち、絶縁部220で構成される面に合計4つの係合凹部254を形成する。係合凸部253は、例えば棒状や平板状の突起とすればよい。係合凹部254は、この係合凸部253がはめ込まれる形状・サイズとする。これら係合凸部253と係合凹部254も端末部材を成形する際に一体に構成される。   In this example, the lock mechanism is provided on the joining surface of each of the split pieces 210A and 210B. In other words, a total of four engaging convex portions 253 are provided on the surface constituted by the insulating portion 220 among the joining surfaces of one divided piece 210A, and the insulating portion 220 is constituted among the joining surfaces of the other divided piece 210B. A total of four engaging recesses 254 are formed on the surface to be mounted. The engaging convex portion 253 may be a rod-like or flat projection, for example. The engagement recess 254 has a shape and size into which the engagement protrusion 253 is fitted. The engaging convex portion 253 and the engaging concave portion 254 are also integrally formed when the terminal member is molded.

このような分割片210A、210Bを閉じれば、係合凸部253が係合凹部254に係合し、両分割片210A、210Bを閉じた状態に保持することができる。特に、係合凸部253の一部を膨出させ、この係合凸部253に対応した係合凹部254としておけば、閉じた分割片210A、210Bが開くことを効果的に抑制できてより好ましい。   If such split pieces 210A and 210B are closed, the engaging convex portion 253 can be engaged with the engaging concave portion 254, and both the split pieces 210A and 210B can be held closed. In particular, if a part of the engaging convex part 253 bulges out and is formed as an engaging concave part 254 corresponding to the engaging convex part 253, it is possible to effectively prevent the closed divided pieces 210A and 210B from opening. preferable.

次に、各分割片の接合面を凹凸に形成した本発明端末部材を説明する。図8は実施例3における分割片を開いた状態の端末部材の一部を示す太径側の端面図、図9は同分割片の接合面の正面図である。   Next, the terminal member of the present invention in which the joining surface of each divided piece is formed in an uneven shape will be described. FIG. 8 is an end view on the large-diameter side showing a part of the terminal member in a state in which the split piece in Example 3 is opened, and FIG. 9 is a front view of the joint surface of the split piece.

この端末部材も円錐台状で半導電部230と絶縁部220とから構成され、複数の分割片210A、210Bを連結機構で連結し、さらに分割片210A、210Bを閉じた状態に保持するロック機構を有する点で実施例1や実施例2と同様である。図8、図9では、連結機構やロック機構は省略している。   This terminal member also has a truncated cone shape and is composed of a semiconductive portion 230 and an insulating portion 220, and a plurality of divided pieces 210A and 210B are connected by a connecting mechanism, and the divided pieces 210A and 210B are held in a closed state. It is the same as that of Example 1 and Example 2 by the point which has. In FIG. 8 and FIG. 9, the connecting mechanism and the locking mechanism are omitted.

本例では分割片210A、210Bの接合面のうち、絶縁部220で形成される面に、半導電部230に沿った突条260と溝265を形成して凹凸面とした。つまり、一方の分割片の接合面には2本の突条260と1本の溝265を、他方の分割片には1本の突条260と2本の溝265を形成した。各突条と溝の断面は矩形である。このような分割片を接合すれば、一方の分割片の突条が他方の分割片の溝にはめ込まれ、分割片を閉じた状態の接合面が凹凸に形成される。そのため沿面距離を稼ぐことができ、絶縁性能を向上させることができる。   In this example, protrusions 260 and grooves 265 along the semiconductive portion 230 are formed on the surface formed by the insulating portion 220 among the bonding surfaces of the split pieces 210A and 210B to form an uneven surface. That is, two protrusions 260 and one groove 265 are formed on the joint surface of one divided piece, and one protrusion 260 and two grooves 265 are formed on the other divided piece. The cross section of each protrusion and groove is rectangular. When such divided pieces are joined, the protrusions of one of the divided pieces are fitted into the grooves of the other divided piece, and a joining surface in a state in which the divided pieces are closed is formed to be uneven. Therefore, creepage distance can be earned and insulation performance can be improved.

本発明端末構造および端末部材によれば、自動車用電線の端末におけるシールド層端部や外部半導電層端部における電気力線の集中を緩和し、絶縁特性を強化することができる。そのため、自動車のワイヤハーネス用途の電線、特に、電気自動車やハイブリッド自動車のバッテリ、コンバータ、インバータ、モータ、ジェネレータ間を接続するのに用いる電線への適用が期待される。   According to the terminal structure and the terminal member of the present invention, the concentration of electric lines of force at the end of the shield layer and the end of the external semiconductive layer at the end of the automobile electric wire can be alleviated, and the insulation characteristics can be enhanced. Therefore, it is expected to be applied to electric wires for use in automobile wire harnesses, particularly electric wires used to connect batteries, converters, inverters, motors, and generators of electric vehicles and hybrid vehicles.

図1は本発明端末構造に用いるワイヤハーネス用電線の断面図である。FIG. 1 is a cross-sectional view of a wire harness wire used in the terminal structure of the present invention. 図2は分割片を開いた状態の端末部材を示す太径側の端面図である。FIG. 2 is an end view on the large diameter side showing the terminal member in a state where the divided pieces are opened. 図3は分割片を閉じた状態の端末部材を示す太径側の端面図である。FIG. 3 is an end view on the large diameter side showing the terminal member in a state where the divided pieces are closed. 図4は端末部材の縦断面図である。FIG. 4 is a longitudinal sectional view of the terminal member. 図5は図2の端末部材を電線端末に装着した状態の縦断面図である。FIG. 5 is a longitudinal sectional view of the terminal member of FIG. 図6は実施例2における分割片を開いた状態の端末部材を示す太径側の端面図である。FIG. 6 is an end view on the large-diameter side showing the terminal member in a state in which the split piece in Example 2 is opened. 図7は実施例2における分割片を閉じた状態の端末部材を示す太径側の端面図である。FIG. 7 is an end view on the large-diameter side showing the terminal member in a state where the divided pieces in Example 2 are closed. 図8は実施例3における分割片の太径側部分端面図である。FIG. 8 is a partial end view of the large-diameter side of the split piece according to the third embodiment. 図9は実施例3の分割片の接合面を示す正面図である。FIG. 9 is a front view showing the joint surface of the split piece of the third embodiment. 図10は従来の自動車用電線の構造を示す断面図である。FIG. 10 is a cross-sectional view showing the structure of a conventional automobile electric wire. 図11は図10の電線の端末における電気力線分布を示す説明図である。FIG. 11 is an explanatory diagram showing a distribution of electric lines of force at the end of the electric wire of FIG.

符号の説明Explanation of symbols

100 電線 110 導体 120 内部半導電層 130 絶縁層 140 外部半導電層
150 シールド層 160 シース
200 端末部材 210A、210B 分割片 220 絶縁部 230 半導電部
240 連結帯 250 ロック機構 251、253 係合凸部 252、254 係合凹部
260 突条 265 溝
100 Electric wire 110 Conductor 120 Internal semiconductive layer 130 Insulating layer 140 External semiconductive layer
150 Shield layer 160 Sheath
200 Terminal member 210A, 210B Split piece 220 Insulating part 230 Semiconductive part
240 Coupling band 250 Lock mechanism 251, 253 Engaging protrusion 252, 254 Engaging recess
260 ridge 265 groove

Claims (12)

絶縁層と外部半導電層とを有する自動車用電線と、
この電線の端末において、露出させた外部半導電層と絶縁層の外側に両層と接触状態で装着される端末部材とを有し、
この端末部材は、
閉じることで中空体に形成される複数の分割片と、
各分割片を開閉自在に連結する開閉機構とを有し、
さらに前記端末部材は、
円錐面形状を有して前記電線の外部半導電層と接続される半導電部と、
この半導電部と一体で前記電線の絶縁層上に配される絶縁部とを有することを特徴とする自動車用電線の端末構造。
An automotive electric wire having an insulating layer and an external semiconductive layer;
In the end of this electric wire, it has a terminal member attached in contact with both layers on the outside of the exposed external semiconductive layer and insulating layer,
This terminal member is
A plurality of divided pieces formed into a hollow body by closing,
An open / close mechanism for connecting each of the divided pieces so as to be openable and closable;
Further, the terminal member is
A semiconductive portion having a conical shape and connected to the outer semiconductive layer of the wire;
A terminal structure for an automobile electric wire, comprising an insulating portion that is integral with the semiconductive portion and disposed on an insulating layer of the electric wire.
端末部材は、さらに各分割片を閉じた状態に保持するロック機構を有することを特徴とする請求項1に記載の自動車用電線の端末構造。   The terminal structure of the electric wire for automobiles according to claim 1, wherein the terminal member further has a lock mechanism for holding each divided piece in a closed state. ロック機構が端末部材の外周側に設けられていることを特徴とする請求項2に記載の自動車用電線の端末構造。   The terminal structure for an automobile electric wire according to claim 2, wherein the lock mechanism is provided on the outer peripheral side of the terminal member. ロック機構が端末部材を構成する各分割片の接合面に形成されていることを特徴とする請求項2に記載の自動車用電線の端末構造。   The terminal structure of an automobile electric wire according to claim 2, wherein the lock mechanism is formed on a joint surface of each divided piece constituting the terminal member. 端末部材の半導電部の体積抵抗率は、1×103〜1×105Ω・cmであることを特徴とする請求項1〜4のいずれかに記載の自動車用電線の端末構造。 The terminal structure of an automobile electric wire according to any one of claims 1 to 4, wherein the volume resistivity of the semiconductive portion of the terminal member is 1 x 10 3 to 1 x 10 5 Ω · cm. 各分割片における接合面が、隣接する分割片の接合面と適合する凹凸面であることを特徴とする請求項1〜5のいずれかに記載の自動車用電線の端末構造。   The terminal structure of an automobile electric wire according to any one of claims 1 to 5, wherein a joining surface in each divided piece is an uneven surface that matches a joining surface of an adjacent divided piece. 外部半導電層と絶縁層とを露出した自動車用電線の端末に、これら両層と接触状態で装着される自動車用電線の端末部材であって、
この端末部材は、
閉じることで中空体に形成される複数の分割片と、
各分割片を開閉自在に連結する開閉機構とを有し、
さらに前記端末部材は、
円錐面形状を有して前記電線の外部半導電層と接続される半導電部と、
この半導電部と一体で前記電線の絶縁層上に配される絶縁部とを有することを特徴とする自動車用電線の端末部材。
A terminal member of an automobile electric wire that is mounted in contact with these two layers on the terminal of an automobile electric wire that exposes the external semiconductive layer and the insulating layer,
This terminal member is
A plurality of divided pieces formed into a hollow body by closing,
An open / close mechanism that connects each of the divided pieces so as to be openable and closable;
Further, the terminal member is
A semiconductive portion having a conical shape and connected to the outer semiconductive layer of the wire;
A terminal member for an automotive electric wire, comprising an insulating portion that is integrated with the semiconductive portion and disposed on the insulating layer of the electric wire.
端末部材は、さらに各分割片を閉じた状態に保持するロック機構を有することを特徴とする請求項7に記載の自動車用電線の端末部材。   The terminal member for an automobile electric wire according to claim 7, wherein the terminal member further includes a lock mechanism for holding each divided piece in a closed state. ロック機構が端末部材の外周側に設けられていることを特徴とする請求項8に記載の自動車用電線の端末部材。   The terminal member for an automobile electric wire according to claim 8, wherein the lock mechanism is provided on an outer peripheral side of the terminal member. ロック機構が端末部材を構成する各分割片の接合面に形成されていることを特徴とする請求項8に記載の自動車用電線の端末部材。   9. The terminal member for an automobile electric wire according to claim 8, wherein the lock mechanism is formed on a joint surface of each divided piece constituting the terminal member. 端末部材の半導電部の体積抵抗率は、1×103〜1×105Ω・cmであることを特徴とする請求項7〜10のいずれかに記載の自動車用電線の端末部材。 The volume resistivity of the semiconductive portion of the terminal member is 1 × 10 3 to 1 × 10 5 Ω · cm, and the terminal member for an automobile electric wire according to claim 7. 各分割片における絶縁部の接合面が隣接する接合面と適合する凹凸面であることを特徴とする請求項7〜11のいずれかに記載の自動車用電線の端末部材。   12. The terminal member for an automobile electric wire according to claim 7, wherein the joining surface of the insulating portion in each divided piece is an uneven surface that matches an adjacent joining surface.
JP2003405090A 2003-12-03 2003-12-03 Terminal structure and terminal member of wire for automobile Pending JP2005168217A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101685623B1 (en) * 2016-08-11 2016-12-12 구주기술 주식회사 Cable terminal connection device
KR101685624B1 (en) * 2016-08-11 2016-12-12 구주기술 주식회사 Cable connection device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101685623B1 (en) * 2016-08-11 2016-12-12 구주기술 주식회사 Cable terminal connection device
KR101685624B1 (en) * 2016-08-11 2016-12-12 구주기술 주식회사 Cable connection device

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