JP2005167079A5 - - Google Patents

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Publication number
JP2005167079A5
JP2005167079A5 JP2003405983A JP2003405983A JP2005167079A5 JP 2005167079 A5 JP2005167079 A5 JP 2005167079A5 JP 2003405983 A JP2003405983 A JP 2003405983A JP 2003405983 A JP2003405983 A JP 2003405983A JP 2005167079 A5 JP2005167079 A5 JP 2005167079A5
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JP
Japan
Prior art keywords
light
led element
emitting device
mixture
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003405983A
Other languages
English (en)
Japanese (ja)
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JP2005167079A (ja
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Publication date
Application filed filed Critical
Priority to JP2003405983A priority Critical patent/JP2005167079A/ja
Priority claimed from JP2003405983A external-priority patent/JP2005167079A/ja
Publication of JP2005167079A publication Critical patent/JP2005167079A/ja
Publication of JP2005167079A5 publication Critical patent/JP2005167079A5/ja
Withdrawn legal-status Critical Current

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JP2003405983A 2003-12-04 2003-12-04 発光装置 Withdrawn JP2005167079A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003405983A JP2005167079A (ja) 2003-12-04 2003-12-04 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003405983A JP2005167079A (ja) 2003-12-04 2003-12-04 発光装置

Publications (2)

Publication Number Publication Date
JP2005167079A JP2005167079A (ja) 2005-06-23
JP2005167079A5 true JP2005167079A5 (enrdf_load_stackoverflow) 2006-10-12

Family

ID=34728494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003405983A Withdrawn JP2005167079A (ja) 2003-12-04 2003-12-04 発光装置

Country Status (1)

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JP (1) JP2005167079A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8858004B2 (en) 2005-12-22 2014-10-14 Cree, Inc. Lighting device
US9105817B2 (en) 2003-09-18 2015-08-11 Cree, Inc. Molded chip fabrication method and apparatus
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2264798B1 (en) 2003-04-30 2020-10-14 Cree, Inc. High powered light emitter packages with compact optics
US7005679B2 (en) 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
KR100807015B1 (ko) * 2005-08-16 2008-02-25 가부시끼가이샤 도시바 발광 장치
KR100693463B1 (ko) * 2005-10-21 2007-03-12 한국광기술원 2 이상의 물질을 포함하는 봉지층을 구비한 광 확산 발광다이오드
JP4881001B2 (ja) * 2005-12-29 2012-02-22 シチズン電子株式会社 発光装置
WO2007077869A1 (ja) * 2006-01-04 2007-07-12 Rohm Co., Ltd. 薄型発光ダイオードランプとその製造方法
JP5013713B2 (ja) * 2006-01-04 2012-08-29 ローム株式会社 発光装置及びその製造方法
EP3422425B1 (en) 2006-04-24 2022-02-23 CreeLED, Inc. Side-view surface mount white led
US8425271B2 (en) * 2006-09-01 2013-04-23 Cree, Inc. Phosphor position in light emitting diodes
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
KR100849782B1 (ko) 2007-02-12 2008-07-31 삼성전기주식회사 Ｌｅｄ 패키지의 제조방법
DE102007021904A1 (de) 2007-02-28 2008-09-04 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung mit Gehäusekörper
JP2009111140A (ja) * 2007-10-30 2009-05-21 Sanyo Electric Co Ltd 発光装置及びその製造方法
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
BR112013004504B1 (pt) * 2010-08-31 2022-02-22 Nichia Corporation Método para fabricar um dispositivo emissor de luz e dispositivo emissor de luz
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
JP2013026590A (ja) * 2011-07-26 2013-02-04 Toyoda Gosei Co Ltd 発光装置の製造方法
JP5284432B2 (ja) * 2011-09-02 2013-09-11 三菱レイヨン株式会社 光源装置
JP5919753B2 (ja) * 2011-11-18 2016-05-18 日亜化学工業株式会社 発光装置および発光装置の製造方法
JP5327356B2 (ja) * 2012-05-14 2013-10-30 日亜化学工業株式会社 発光装置
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
WO2016056727A1 (en) 2014-10-10 2016-04-14 Lg Electronics Inc. Light emitting device package and method of fabricating the same
US9954148B2 (en) 2014-10-24 2018-04-24 Citizen Electronics Co., Ltd. Light-emitting apparatus with optical element and method of manufacturing the same
KR101937111B1 (ko) 2018-12-12 2019-01-09 (주)솔라루체 Led 패키지
CN114038982B (zh) * 2021-11-25 2024-07-26 盐城东山精密制造有限公司 一种高对比度哑光粉配比led发光源元件封裝材料

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9105817B2 (en) 2003-09-18 2015-08-11 Cree, Inc. Molded chip fabrication method and apparatus
US8858004B2 (en) 2005-12-22 2014-10-14 Cree, Inc. Lighting device
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages

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