JP2005158914A - Printed circuit board - Google Patents

Printed circuit board Download PDF

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JP2005158914A
JP2005158914A JP2003393399A JP2003393399A JP2005158914A JP 2005158914 A JP2005158914 A JP 2005158914A JP 2003393399 A JP2003393399 A JP 2003393399A JP 2003393399 A JP2003393399 A JP 2003393399A JP 2005158914 A JP2005158914 A JP 2005158914A
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circuit board
printed circuit
heat
pad
heat dissipation
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JP2003393399A
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Japanese (ja)
Inventor
Takashi Nagai
尚 永井
Koichi Tsutsumi
康一 堤
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Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
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Priority to JP2003393399A priority Critical patent/JP2005158914A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed circuit board which can enhance heat dissipation effect of IC. <P>SOLUTION: A heat conductive material is provided to fill a through-hole in the printed circuit board wherein a heat dissipation pattern for contact with a heat dissipation pad of IC is formed on the surface of printed circuit board and the heat dissipation pattern and one or a plurality of through-holes are formed on the printed circuit board. As the heat conductive material filling the through-hole, the solder, for example, is used. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

この発明は、放熱パッドを有するＩＣが装着されるプリント基板に関する。   The present invention relates to a printed circuit board on which an IC having a heat radiation pad is mounted.

消費電力が大きいＩＣには放熱パッドが設けられているものがある。   Some ICs with high power consumption are provided with heat dissipation pads.

図１は放熱パッドを有するＩＣが装着される従来のプリント基板を示し、図２は、図１のプリント基板に、放熱パッドを有するＩＣが装着された状態を示している。   FIG. 1 shows a conventional printed board on which an IC having a heat dissipating pad is mounted, and FIG. 2 shows a state in which an IC having a heat dissipating pad is mounted on the printed board of FIG.

プリント基板１０表面には、平面から見て矩形の凹部が形成されており、この凹部に平面から見て矩形の導熱体性の放熱パターン１１が設けられている。放熱パターン１１およびプリント基板１０には、それらを貫通しかつ内面に導電層が形成されている複数の貫通穴（スルーホール）１２が形成されている。放熱パターン１１とスルーホール１２とは、スルーホール１２の内面の導電層によって、熱的に接触している。この例では、放熱パターン１１に熱的に接触したスルーホール１２は、４列４行の配置で計１６個形成されている。   The surface of the printed circuit board 10 is formed with a rectangular recess as viewed from the plane, and a rectangular heat conductive heat dissipation pattern 11 is provided in the recess as viewed from the plane. The heat radiation pattern 11 and the printed circuit board 10 are formed with a plurality of through holes (through holes) 12 that pass through them and have a conductive layer formed on the inner surface. The heat radiation pattern 11 and the through hole 12 are in thermal contact with each other by the conductive layer on the inner surface of the through hole 12. In this example, a total of 16 through holes 12 in thermal contact with the heat radiation pattern 11 are formed in an arrangement of 4 columns and 4 rows.

ＩＣ２０の裏面には、放熱パッド２１が設けられている。ＩＣ２０は、その放熱パッド２１がプリント基板１０上に形成された放熱パターン１１に接触した状態で、プリント基板１０に装着されている。ＩＣ２０から放熱パッド２１を介して放熱パターン１１に伝導された熱は、スルーホール１２を介して、プリント基板の他の層や裏面にも伝導せしめられる。   A heat dissipation pad 21 is provided on the back surface of the IC 20. The IC 20 is mounted on the printed circuit board 10 in a state where the heat radiation pad 21 is in contact with the heat radiation pattern 11 formed on the printed circuit board 10. Heat conducted from the IC 20 to the heat radiation pattern 11 via the heat radiation pad 21 is also conducted to other layers and the back surface of the printed circuit board via the through hole 12.

このようなプリント基板１０では、ＩＣ２０の放熱パッド２１とプリント基板１０上の放熱パターン１１との接触面積が大きい方が、ＩＣ２０からプリント基板１０への熱伝導効率が上がり、また、放熱パターン１１に熱的に接触する全スルーホール１２の横断面面積の総和が大きい方が、放熱パターン１１からプリント基板１０の他の層や裏面への熱伝導効率が上がることになる。   In such a printed circuit board 10, the heat conduction efficiency from the IC 20 to the printed circuit board 10 increases as the contact area between the heat radiation pad 21 of the IC 20 and the heat radiation pattern 11 on the printed circuit board 10 increases. The larger the sum of the cross-sectional areas of all the through-holes 12 that are in thermal contact, the higher the efficiency of heat conduction from the heat radiation pattern 11 to the other layers and the back surface of the printed circuit board 10.

しかしながら、放熱パターン１１に熱的に接触する全スルーホール１２の横断面面積の総和を大きくさせると、ＩＣ２０の放熱パッド２１とプリント基板１０上の放熱パターン１１との接触面積が小さくなるためＩＣ２０からプリント基板１０への熱伝導効率が下がり、ＩＣ２０の放熱パッド２１とプリント基板１０上の放熱パターン１１との接触面積を大きくすると、放熱パターン１１に熱的に接触する全スルーホール１２の横断面面積の総和が小さくなるため放熱パターン１１からプリント基板１０の他の層や裏面への熱伝導効率が下がる。   However, if the sum of the cross-sectional areas of all the through holes 12 that are in thermal contact with the heat dissipation pattern 11 is increased, the contact area between the heat dissipation pad 21 of the IC 20 and the heat dissipation pattern 11 on the printed circuit board 10 is reduced. When the heat conduction efficiency to the printed circuit board 10 decreases and the contact area between the heat radiation pad 21 of the IC 20 and the heat radiation pattern 11 on the printed circuit board 10 is increased, the cross-sectional area of all the through holes 12 that are in thermal contact with the heat radiation pattern 11 Therefore, the heat conduction efficiency from the heat radiation pattern 11 to the other layers and the back surface of the printed circuit board 10 decreases.

つまり、ＩＣ２０の放熱パッド２１とプリント基板１０上の放熱パターン１１との接触面積が大きいことという第１条件と、放熱パターン１１に熱的に接触する全スルーホール１２の横断面面積の総和が大きいことという第２条件とを同時に満たすようにすることはできないため、ＩＣ２０の放熱効果を十分に高めることは困難であった。   That is, the first condition that the contact area between the heat dissipation pad 21 of the IC 20 and the heat dissipation pattern 11 on the printed circuit board 10 is large, and the sum of the cross-sectional areas of all the through holes 12 that are in thermal contact with the heat dissipation pattern 11 is large. Therefore, it is difficult to satisfy the second condition, ie, the heat dissipation effect of the IC 20 sufficiently.

この発明は、ＩＣの放熱効果を高めることができるようになるプリント基板を提供することを目的とする。   An object of this invention is to provide the printed circuit board which can improve the heat dissipation effect of IC.

請求項１に記載の発明は、ＩＣの放熱パッドと接触させるための放熱パターンがプリント基板表面に形成され、かつ放熱パターンおよびプリント基板を貫通する１または複数のスルーホールが形成されているプリント基板において、スルーホール内に導熱材が充填されていることを特徴とする。   According to a first aspect of the present invention, there is provided a printed circuit board in which a heat radiation pattern for making contact with a heat radiation pad of an IC is formed on the surface of the printed circuit board, and one or a plurality of through holes penetrating the heat radiation pattern and the printed circuit board are formed. The heat conduction material is filled in the through hole.

請求項２に記載の発明は、請求項１に記載の発明において、スルーホール内に充填されている導熱材が半田であることを特徴とする。   The invention described in claim 2 is characterized in that, in the invention described in claim 1, the heat conducting material filled in the through hole is solder.

この発明によれば、ＩＣの放熱効果を高めることができるようになる。   According to the present invention, the heat dissipation effect of the IC can be enhanced.

以下、図３〜図６を参照して、この発明の実施の形態について説明する。   The embodiment of the present invention will be described below with reference to FIGS.

以下、第１実施例について説明する。   The first embodiment will be described below.

図３は放熱パッドを有するＩＣが装着される第１実施例のプリント基板を示し、図４は、図３のプリント基板に、放熱パッドを有するＩＣが装着された状態を示している。   FIG. 3 shows a printed circuit board according to the first embodiment on which an IC having a heat radiating pad is mounted, and FIG. 4 shows a state in which an IC having a heat radiating pad is mounted on the printed circuit board of FIG.

プリント基板１０表面には、平面から見て矩形の凹部が形成されており、この凹部に平面から見て矩形の導熱体性の放熱パターン１１が設けられている。放熱パターン１１およびプリント基板１０には、それらを貫通しかつ内面に導電層が形成されている複数の貫通穴（スルーホール）１２が形成されている。この例では、スルーホール１２は、４列４行の配置で計１６個形成されている。各スルーホール１２内には、導熱材１３が充填されている。導熱材１３としては、金属等の熱伝導のよい部材が用いられる。この例では、導熱材１３としては半田が用いられている。   The surface of the printed circuit board 10 is formed with a rectangular recess as viewed from the plane, and a rectangular heat conductive heat dissipation pattern 11 is provided in the recess as viewed from the plane. The heat radiation pattern 11 and the printed circuit board 10 are formed with a plurality of through holes (through holes) 12 that pass through them and have a conductive layer formed on the inner surface. In this example, a total of 16 through holes 12 are formed in an arrangement of 4 columns and 4 rows. Each through hole 12 is filled with a heat conducting material 13. As the heat conducting material 13, a member having good heat conductivity such as metal is used. In this example, solder is used as the heat conducting material 13.

ＩＣ２０の裏面には、放熱パッド２１が設けられている。ＩＣ２０は、その放熱パッド２１がプリント基板１０上に形成された放熱パターン１１に接触した状態で、プリント基板１０に装着されている。   A heat dissipation pad 21 is provided on the back surface of the IC 20. The IC 20 is mounted on the printed circuit board 10 in a state where the heat radiation pad 21 is in contact with the heat radiation pattern 11 formed on the printed circuit board 10.

この実施例では、放熱パターン１１に熱的に接触したスルーホール１２内に、導熱材１３が充填されているので、放熱パターン１１に開けられたスルーホール１２の部分も実質的に放熱パターンとして作用するため、図１および図２に示す従来のプリント基板に比べて、ＩＣ２０の放熱パッド２１とプリント基板１０上の放熱パターン１１との接触面積を実質的に大きくすることができる。この結果、ＩＣの放熱効果を高めることができるようになる。   In this embodiment, since the heat conducting material 13 is filled in the through hole 12 that is in thermal contact with the heat radiation pattern 11, the portion of the through hole 12 opened in the heat radiation pattern 11 also substantially acts as a heat radiation pattern. Therefore, the contact area between the heat radiation pad 21 of the IC 20 and the heat radiation pattern 11 on the printed circuit board 10 can be substantially increased as compared with the conventional printed circuit board shown in FIGS. As a result, the heat dissipation effect of the IC can be enhanced.

以下、第２実施例について説明する。   The second embodiment will be described below.

図５は放熱パッドを有するＩＣが装着される第２実施例のプリント基板を示し、図６は、図５のプリント基板に、放熱パッドを有するＩＣが装着された状態を示している。   FIG. 5 shows a printed circuit board according to a second embodiment on which an IC having a heat radiating pad is mounted. FIG. 6 shows a state in which an IC having a heat radiating pad is mounted on the printed circuit board of FIG.

図５および図６において、図３および図４と対応する部分には、同じ符号を付してある。   5 and 6, the same reference numerals are given to the portions corresponding to those in FIGS. 3 and 4.

第２実施例では、放熱パターン１１およびプリント基板１０を貫通しているスルーホール１２Ａは、１つだけ形成されており、その横断面形状は矩形である。スルーホール１２Ａは、放熱パターン１１の周縁部の内側を貫通するように、形成されている。スルーホール１２Ａ内には、導熱材１３Ａが充填されている。導熱材１３Ａとしては、金属等の熱伝導のよい部材が用いられる。この例では、導熱材１３としては半田が用いられている。   In the second embodiment, only one through hole 12A penetrating the heat radiation pattern 11 and the printed board 10 is formed, and its cross-sectional shape is rectangular. The through hole 12 </ b> A is formed so as to penetrate the inside of the peripheral edge of the heat dissipation pattern 11. The through hole 12A is filled with a heat conducting material 13A. As the heat conducting material 13A, a member having good heat conductivity such as metal is used. In this example, solder is used as the heat conducting material 13.

表１は、実験結果を示している。   Table 1 shows the experimental results.

Figure 2005158914
Figure 2005158914

表１において、”従来例”とは、図１に示すプリント基板を表し、”第２実施例で半田なし”は、図５に示すようなプリント基板においてスルーホール１２Ａ内に半田が充填されてないものを表し、”第２実施例”は、図５に示すようなプリント基板を表している。   In Table 1, "conventional example" represents the printed circuit board shown in FIG. 1, and "no solder in the second embodiment" means that the printed circuit board as shown in FIG. The “second embodiment” represents a printed circuit board as shown in FIG.

この実験結果から、第２実施例では、”従来例”および”第２実施例で半田なし”に比べて、ＩＣの表面温度を低くすることができることがわかる。   From this experimental result, it can be seen that the surface temperature of the IC can be lowered in the second embodiment as compared with the “conventional example” and “no solder in the second embodiment”.

放熱パッドを有するＩＣが装着される従来のプリント基板を示す平面図である。It is a top view which shows the conventional printed circuit board with which IC which has a thermal radiation pad is mounted | worn. 図１のプリント基板に、放熱パッドを有するＩＣが装着された状態を示す断面図である。FIG. 2 is a cross-sectional view illustrating a state where an IC having a heat dissipation pad is mounted on the printed board of FIG. 1. 放熱パッドを有するＩＣが装着される第１実施例のプリント基板を示す平面図である。It is a top view which shows the printed circuit board of 1st Example with which IC which has a thermal radiation pad is mounted | worn. 図３のプリント基板に、放熱パッドを有するＩＣが装着された状態を示す断面図である。FIG. 4 is a cross-sectional view showing a state where an IC having a heat dissipation pad is mounted on the printed board of FIG. 3. 放熱パッドを有するＩＣが装着される第２実施例のプリント基板を示す平面図である。It is a top view which shows the printed circuit board of 2nd Example with which IC which has a thermal radiation pad is mounted | worn. 図５のプリント基板に、放熱パッドを有するＩＣが装着された状態を示す断面図である。FIG. 6 is a cross-sectional view illustrating a state where an IC having a heat dissipation pad is mounted on the printed board of FIG. 5.

符号の説明Explanation of symbols

１０ プリント基板
１１ 放熱パターン
１２、１２Ａ スルーホール
１３、１３Ａ 導熱材
２０ ＩＣ
２１ 放熱パッド 10 Printed Circuit Board 11 Heat Dissipation Pattern 12, 12A Through Hole 13, 13A Heat Conducting Material 20 IC
21 Heat dissipation pad

Claims (2)

ＩＣの放熱パッドと接触させるための放熱パターンがプリント基板表面に形成され、かつ放熱パターンおよびプリント基板を貫通する１または複数のスルーホールが形成されているプリント基板において、スルーホール内に導熱材が充填されていることを特徴とするプリント基板。 In a printed circuit board in which a heat radiation pattern for making contact with the heat radiation pad of the IC is formed on the surface of the printed circuit board and one or a plurality of through holes penetrating the heat radiation pattern and the printed circuit board are formed, a heat conductive material is placed in the through hole. A printed circuit board characterized by being filled. スルーホール内に充填されている導熱材が半田であることを特徴とする請求項１に記載のプリント基板。 The printed circuit board according to claim 1, wherein the heat conducting material filled in the through hole is solder.
JP2003393399A 2003-11-25 2003-11-25 Printed circuit board Pending JP2005158914A (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8039752B2 (en) 2008-02-21 2011-10-18 Keihin Corporation Heat dissipation structure of a print circuit board
EP2388812A2 (en) * 2010-05-17 2011-11-23 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipating assembly
JP2012019181A (en) * 2010-06-09 2012-01-26 Jianzhun Electric Mach Ind Co Ltd Coupling structure for heat dissipating module
JP2012138528A (en) * 2010-12-27 2012-07-19 Tanaka Kikinzoku Kogyo Kk High heat dissipation/high reliability metal core wiring board
JP2014099458A (en) * 2012-11-13 2014-05-29 Nec Access Technica Ltd Surface mounting structure and surface mounting method
JP2014146843A (en) * 2014-05-19 2014-08-14 Hitachi Automotive Systems Ltd Heat dissipation structure of control device
TWI488346B (en) * 2012-03-12 2015-06-11 Lite On Electronics Guangzhou Led package structure

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8039752B2 (en) 2008-02-21 2011-10-18 Keihin Corporation Heat dissipation structure of a print circuit board
EP2388812A2 (en) * 2010-05-17 2011-11-23 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipating assembly
JP2012019181A (en) * 2010-06-09 2012-01-26 Jianzhun Electric Mach Ind Co Ltd Coupling structure for heat dissipating module
JP2012138528A (en) * 2010-12-27 2012-07-19 Tanaka Kikinzoku Kogyo Kk High heat dissipation/high reliability metal core wiring board
TWI488346B (en) * 2012-03-12 2015-06-11 Lite On Electronics Guangzhou Led package structure
JP2014099458A (en) * 2012-11-13 2014-05-29 Nec Access Technica Ltd Surface mounting structure and surface mounting method
JP2014146843A (en) * 2014-05-19 2014-08-14 Hitachi Automotive Systems Ltd Heat dissipation structure of control device

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