JP2005156445A - Circuit board and current detection method - Google Patents

Circuit board and current detection method Download PDF

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JP2005156445A
JP2005156445A JP2003397570A JP2003397570A JP2005156445A JP 2005156445 A JP2005156445 A JP 2005156445A JP 2003397570 A JP2003397570 A JP 2003397570A JP 2003397570 A JP2003397570 A JP 2003397570A JP 2005156445 A JP2005156445 A JP 2005156445A
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wiring
current
correction
current detection
circuit
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Takeya Yanagihara
健也 柳原
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Mitsuba Corp
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Mitsuba Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board capable of detecting an accurate current value independently of a surrounding environment or dispersion at the manufacturing time. <P>SOLUTION: A current detection wire 3 connected to a power load or the like is formed on a substrate body 2. In addition, a correction wire 11 for correcting a detected value of voltage drop in a prescribed distance of the current detection wire 3 is provided on the substrate body 2 close to the current detection wire 3, and necessary correction is performed to the voltage drop of the current detection wire 3 by using the voltage drop in the prescribed distance when a constant current I2 is made to flow in the correction wire 11, to thereby determine the current I1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、主回路に流れる電流を電圧降下に基づいて検出するように構成された回路基板に関する。   The present invention relates to a circuit board configured to detect a current flowing in a main circuit based on a voltage drop.

モータなどの電力負荷の制御を行うために製造される回路基板は、基板本体に銅配線を形成し、所定の回路素子などを実装した構成を有している。このような回路基板において、電力負荷に供給する電流は、所定の抵抗値を有する銅配線の電圧降下に基づいてモニタしている(例えば、特許文献1参照)。具体的には、銅配線の設計時の抵抗値と、電圧降下の実測値とから、電流を演算している。
特開2002−5968号公報
A circuit board manufactured for controlling a power load such as a motor has a configuration in which copper wiring is formed on a board body and predetermined circuit elements are mounted. In such a circuit board, the current supplied to the power load is monitored based on the voltage drop of the copper wiring having a predetermined resistance value (see, for example, Patent Document 1). Specifically, the current is calculated from the resistance value at the time of designing the copper wiring and the actually measured value of the voltage drop.
JP 2002-5968 A

しかしながら、電流値を求める際の銅配線の抵抗値は設計値が用いられるが、銅の抵抗値は温度係数が大きく、基板温度が変化すると抵抗値が変化してしまうので、検出誤差が発生しやすかった。また、プリント配線の場合には、ロット毎に銅配線の厚さが異なることがあるので、銅配線の実際の抵抗値が設計値と異なる場合もあり、電流値の誤差が発生する原因になっていた。
この発明は、このような課題を鑑みてなされたものであり、周囲の環境や、製造時のばらつきに依存せずに正しい電流値を検出することができる回路基板を提供することを目的とする。また、このような回路基板を用いて主回路に流れる電流を精度良く検出することを目的とする。
However, although the design value is used as the resistance value of the copper wiring when obtaining the current value, the resistance value of copper has a large temperature coefficient, and the resistance value changes when the substrate temperature changes, so that a detection error occurs. It was easy. Also, in the case of printed wiring, the copper wiring thickness may vary from lot to lot, so the actual resistance value of the copper wiring may differ from the design value, causing an error in the current value. It was.
The present invention has been made in view of such a problem, and an object of the present invention is to provide a circuit board capable of detecting a correct current value without depending on the surrounding environment and variations during manufacture. . It is another object of the present invention to accurately detect a current flowing through a main circuit using such a circuit board.

上記の課題を解決する本発明の請求項1に係る発明は、基板本体に、主回路に流れる電流を検出するための電流検出用配線を形成し、前記電流検出用配線における電圧降下を検出する電圧検出回路を前記電流検出用配線に接続し、前記電流検出用配線に近接した位置に、前記電圧検出回路で検出する前記電流検出用配線の電圧降下の検出値を補正する補正回路を設けたことを特徴とする回路基板とした。
この回路基板によれば、電流検出用配線の近傍に補正回路を設けたので、主回路に流れる電流を電流検出用配線における電圧降下から検出するにあたり、電流検出用配線の温度に起因する誤差を補正回路から得られる情報で補正することができる。
In the invention according to claim 1 of the present invention for solving the above-mentioned problem, a current detection wiring for detecting a current flowing in a main circuit is formed on a substrate body, and a voltage drop in the current detection wiring is detected. A voltage detection circuit is connected to the current detection wiring, and a correction circuit for correcting a detected value of the voltage drop of the current detection wiring detected by the voltage detection circuit is provided at a position close to the current detection wiring. The circuit board is characterized by this.
According to this circuit board, since the correction circuit is provided in the vicinity of the current detection wiring, in detecting the current flowing through the main circuit from the voltage drop in the current detection wiring, an error caused by the temperature of the current detection wiring is eliminated. Correction can be made with information obtained from the correction circuit.

請求項2に係る発明は、請求項1に記載の回路基板において、前記補正回路は、定電流源に接続された前記補正用配線を前記電流検出用配線の近傍に形成すると共に、前記補正用配線における電圧降下を検出する補正用電圧検出回路を備えることを特徴とする。
この回路基板では、補正回路は補正用配線に定電流を流した際の電圧降下を検出する回路として構成してある。したがって、定電流を補正用配線に流したときの電圧降下を検出すると、その温度における抵抗値を正確に測定することができる。ここで、補正用配線と電流検出用配線とは近接配置されているので、その温度は同じとみなせる。したがって、このようにして検出した補正用配線の抵抗値で、電流検出用配線の抵抗値を補正すると、主回路に流れる電流は、電流検出用配線及び補正用配線の電圧降下の比に所定の定数を乗じた値として得られるようになるので、主回路に流れる電流を温度に依存せずに精度良く求めることができる。
According to a second aspect of the present invention, in the circuit board according to the first aspect, the correction circuit forms the correction wiring connected to a constant current source in the vicinity of the current detection wiring and the correction circuit. A correction voltage detection circuit for detecting a voltage drop in the wiring is provided.
In this circuit board, the correction circuit is configured as a circuit for detecting a voltage drop when a constant current is passed through the correction wiring. Therefore, when a voltage drop is detected when a constant current is passed through the correction wiring, the resistance value at that temperature can be accurately measured. Here, since the correction wiring and the current detection wiring are arranged close to each other, the temperatures thereof can be regarded as the same. Therefore, when the resistance value of the current detection wiring is corrected with the resistance value of the correction wiring detected in this way, the current flowing through the main circuit has a predetermined voltage drop ratio between the current detection wiring and the correction wiring. Since it is obtained as a value multiplied by a constant, the current flowing through the main circuit can be accurately obtained without depending on the temperature.

請求項3に係る発明は、請求項2に記載の回路基板において、前記電流検出用配線及び前記補正用配線は、プリント配線であり、略同じ厚さを有することを特徴とする。
この回路基板によれば、プリント配線によって簡単に電流検出用配線及び補正用配線を形成することができる。さらに、電流検出用配線及び補正用配線が同じ材料で、かつ同じ厚さになるので、補正用配線の抵抗値を用いて電流検出用配線の抵抗値を容易に補正することができる。
The invention according to claim 3 is the circuit board according to claim 2, wherein the current detection wiring and the correction wiring are printed wirings and have substantially the same thickness.
According to this circuit board, the current detection wiring and the correction wiring can be easily formed by the printed wiring. Furthermore, since the current detection wiring and the correction wiring are made of the same material and have the same thickness, the resistance value of the current detection wiring can be easily corrected using the resistance value of the correction wiring.

請求項4に係る発明は、請求項3に記載の回路基板において、前記補正用配線の線幅は、前記電圧検出用配線の線幅よりも狭いことを特徴とする。
この回路基板によれば、補正用配線の抵抗が大きくなるので、補正用配線を流れる電流は小さくなる。したがって、補正回路の定電流源の電流制御が容易になる。
According to a fourth aspect of the present invention, in the circuit board according to the third aspect, the line width of the correction wiring is narrower than the line width of the voltage detection wiring.
According to this circuit board, since the resistance of the correction wiring is increased, the current flowing through the correction wiring is decreased. Therefore, current control of the constant current source of the correction circuit is facilitated.

請求項5に係る発明は、請求項1から請求項4のいずれか一項に記載の回路基板において、前記基板本体は、金属材料が用いられた金属製基板であることを特徴とする。
この回路基板によれば、基板本体の熱伝導が良好になり、基板温度のばらつきが少なくなる。
According to a fifth aspect of the present invention, in the circuit board according to any one of the first to fourth aspects, the substrate body is a metal substrate using a metal material.
According to this circuit board, the heat conduction of the board body is improved, and variations in the board temperature are reduced.

請求項6に係る発明は、主回路に流れる電流を電流検出用配線に流し、前記電流検出用配線における電圧降下を検出すると共に、前記電流検出用配線に近接して設けられた補正用配線に定電流を流し、前記補正用配線における電圧降下を検出し、前記電流検出用配線及び前記補正用配線におけるそれぞれの電圧降下から、前記主回路に流れる電流値として、温度変化に依存しない電流値を得ることを特徴とする電流検出方法とした。
この電流検出方法によれば、補正用配線に定電流を流した際の電圧降下を検出することで、その温度における補正用配線の抵抗値が得られるので、この抵抗値を用いて電流検出用配線の抵抗値を補正することができる。このようにして温度補正された電流検出用配線の抵抗値と、実測した電圧降下とから主回路に流れる電流を検出することができる。このようにして電流を検出すると基板本体や、配線の温度に影響を受けることがなくなる。
According to a sixth aspect of the present invention, a current flowing through the main circuit is caused to flow through the current detection wiring, a voltage drop in the current detection wiring is detected, and a correction wiring provided close to the current detection wiring is provided. A constant current is supplied, a voltage drop in the correction wiring is detected, and a current value that does not depend on a temperature change is obtained as a current value flowing in the main circuit from each voltage drop in the current detection wiring and the correction wiring. It was set as the electric current detection method characterized by obtaining.
According to this current detection method, the resistance value of the correction wiring at that temperature can be obtained by detecting the voltage drop when a constant current is passed through the correction wiring. The resistance value of the wiring can be corrected. Thus, the current flowing through the main circuit can be detected from the resistance value of the current detection wiring whose temperature has been corrected and the actually measured voltage drop. When the current is detected in this manner, the temperature of the substrate body and the wiring is not affected.

請求項1に記載した発明によれば、電流検出用配線の近傍に補正回路を設け、補正回路の情報に基づいて電流検出用配線側の電気特性に補正を行うようにしたので、主回路に流れる電流を、温度に依存せずに精度良く検出することができる。
請求項2に記載した発明によれば、補正回路を定電流源に接続した補正用配線を含んだ構成としたので、補正用配線の抵抗値で電流検出用配線の温度特性を補正することができる。したがって、主回路に流れる電流を、温度に依存せずに精度良く検出することができる。
請求項3に記載した発明によれば、電流検出用配線及び補正用配線をプリント配線にすることで、両者の厚さを略同一にすることができるので、回路基板毎に配線の厚さが異なる場合であって、主回路に流れる電流を、精度良く検出することができる。
請求項4に記載した発明によれば、補正用配線の線幅を狭くしたので、一定の電流を補正用配線に安定して流すことができる。したがって、補正用配線の抵抗値を精度良く測定できるので、これに基づいて補正される主回路の電流も高精度に検出できる。
請求項5に記載した発明によれば、基板本体を金属製にしたので、基板温度のばらつきが少なくなり、精度良く電流を検出できる。
請求項6に記載した発明によれば、電流検出用配線に近接して設けられた補正用配線に定電流を流し、補正用配線における電圧降下を検出し、電流検出用配線の抵抗値を補正するようにしたので、基板本体や、配線の温度に影響を受けることがなくなり、主回路に流れる電流を精度良く検出できる。
According to the first aspect of the present invention, the correction circuit is provided in the vicinity of the current detection wiring, and the electric characteristics on the current detection wiring side are corrected based on the information of the correction circuit. The flowing current can be accurately detected without depending on the temperature.
According to the invention described in claim 2, since the correction circuit includes the correction wiring connected to the constant current source, the temperature characteristic of the current detection wiring can be corrected by the resistance value of the correction wiring. it can. Therefore, the current flowing through the main circuit can be accurately detected without depending on the temperature.
According to the invention described in claim 3, since the current detection wiring and the correction wiring are printed wirings, the thicknesses of both can be made substantially the same. In different cases, the current flowing through the main circuit can be detected with high accuracy.
According to the fourth aspect of the invention, since the line width of the correction wiring is narrowed, a constant current can be stably passed through the correction wiring. Therefore, since the resistance value of the correction wiring can be measured with high accuracy, the current of the main circuit corrected based on this can be detected with high accuracy.
According to the fifth aspect of the present invention, since the substrate body is made of metal, variations in the substrate temperature are reduced, and the current can be detected with high accuracy.
According to the invention described in claim 6, a constant current is supplied to the correction wiring provided close to the current detection wiring, a voltage drop in the correction wiring is detected, and the resistance value of the current detection wiring is corrected. As a result, the current flowing through the main circuit can be accurately detected without being affected by the temperature of the substrate body and wiring.

発明を実施するための最良の形態について図面を参照しながら詳細に説明する。
図1に示すように、回路基板1は、基板本体2上に所定の回路を形成した構成を有している。なお、この回路基板1は、例えば、モータなどの電力負荷(主回路)に供給される電流を検出するために設けられている。
基板本体2は、ガラスなどのセラミックスや、ガラス及び合成樹脂からなる材料、アルミニウムなどの金属材料が用いられる。ここで、基板温度のばらつきを最小限に留める観点からは、熱伝導性が良好な金属材料を用いることが望ましい。
The best mode for carrying out the invention will be described in detail with reference to the drawings.
As shown in FIG. 1, the circuit board 1 has a configuration in which a predetermined circuit is formed on a board body 2. The circuit board 1 is provided to detect a current supplied to a power load (main circuit) such as a motor, for example.
The substrate body 2 is made of ceramics such as glass, a material made of glass and synthetic resin, or a metal material such as aluminum. Here, from the viewpoint of keeping the variation in the substrate temperature to a minimum, it is desirable to use a metal material having good thermal conductivity.

基板本体2上には、線幅がW1で略コ字形状を有する電流検出用配線3が形成されている。この電流検出用配線3は、所定の抵抗値を有する銅製のプリント配線である。その一端及び他端には、それぞれリード線4及びリード線5がハンダなどを用いて取り付けられている。リード線5は、主回路に接続されている。リード線4は、主回路に電流を供給する回路に接続されている。なお、基板本体2が金属材料からなる場合には、基板表面に絶縁層を形成した上から電流検出用配線3が形成される。   On the substrate body 2, a current detection wiring 3 having a line width W1 and a substantially U-shape is formed. The current detection wiring 3 is a copper printed wiring having a predetermined resistance value. A lead wire 4 and a lead wire 5 are attached to one end and the other end using solder or the like, respectively. The lead wire 5 is connected to the main circuit. The lead wire 4 is connected to a circuit that supplies current to the main circuit. When the substrate body 2 is made of a metal material, the current detection wiring 3 is formed after an insulating layer is formed on the substrate surface.

また、この電流検出用配線3には、一端から他端に至るまでの中間の直線部分3aにおいて、L1の間隔をおいて2つの配線6,7が接続されている。この配線6,7は、電流検出用配線3よりも十分に狭い線幅を有しており、各々が電流検出用配線3の電圧(電圧降下)を検出する主電圧検出回路8に接続されている。すなわち、主電圧検出回路8は、電流検出用配線3の長さL1の間の電圧を検出するように電流検出用配線3に接続されている。   The current detection wiring 3 is connected with two wirings 6 and 7 at an interval L1 in an intermediate straight line portion 3a from one end to the other end. The wirings 6 and 7 have a sufficiently narrow line width than the current detection wiring 3, and each is connected to a main voltage detection circuit 8 that detects the voltage (voltage drop) of the current detection wiring 3. Yes. That is, the main voltage detection circuit 8 is connected to the current detection wiring 3 so as to detect a voltage between the lengths L1 of the current detection wiring 3.

さらに、基板本体2には、電流検出用配線3の他に、主電圧検出回路8で検出する長さL1間の電圧を補正する補正回路9が形成されている。補正回路9は、定電流源10に補正用配線11を接続した構成を有している。定電流源10は、トランジスタなどから構成され、電流検出用配線3よりも小さい電流を、安定して供給することができる電源回路である。補正用配線11は、電流検出用配線3の線幅W1よりも十分に狭い線幅W2を有している。この補正用配線11は、電流検出用配線3と同時に形成されたプリント配線であり、補正用配線11と電流検出用配線3との厚さは略同一である。このため、補正用配線11の単位長さ当たりの抵抗は、電流検出用配線3の単位長さ当たりの抵抗よりも大きい。   Further, in addition to the current detection wiring 3, a correction circuit 9 for correcting the voltage between the lengths L <b> 1 detected by the main voltage detection circuit 8 is formed on the substrate body 2. The correction circuit 9 has a configuration in which a correction wiring 11 is connected to a constant current source 10. The constant current source 10 is a power supply circuit that includes a transistor or the like and can stably supply a current smaller than that of the current detection wiring 3. The correction wiring 11 has a line width W2 that is sufficiently narrower than the line width W1 of the current detection wiring 3. The correction wiring 11 is a printed wiring formed at the same time as the current detection wiring 3, and the thickness of the correction wiring 11 and the current detection wiring 3 is substantially the same. For this reason, the resistance per unit length of the correction wiring 11 is larger than the resistance per unit length of the current detection wiring 3.

また、補正用配線11を一部分である直線部分11aは、電流検出用配線3において主電圧検出回路8が接続されている直線部分3aに沿って、その近傍に配置されている。そして、この直線部分11aには、長さL2の間隔を置いて、2つの配線12,13が接続されている。この配線12,13は、補正用配線9の長さL2の間の電圧降下を検出する補正用電圧検出回路14に接続されている。
長さL2は、電流検出用配線3の電圧降下を検出する長さL1よりも長い。さらに、補正用配線11において、配線12,13が接続されている箇所は、対向して配置されている電流検出用配線3からみて、配線6の接続箇所よりもリード線4側である。同様に、配線14が接続されている箇所は、対向して配置されている電流検出用配線3からみて、配線7の接続箇所よりもリード線5側である。すなわち、配線6,7は、補正用配線11側の配線12,13に隣接する位置に挟まれる範囲に設置されている。
Further, the straight line portion 11a which is a part of the correction wiring 11 is disposed in the vicinity of the straight line portion 3a to which the main voltage detection circuit 8 is connected in the current detection wiring 3. The two wirings 12 and 13 are connected to the straight line portion 11a with an interval of a length L2. The wirings 12 and 13 are connected to a correction voltage detection circuit 14 that detects a voltage drop between the length L2 of the correction wiring 9.
The length L2 is longer than the length L1 for detecting the voltage drop of the current detection wiring 3. Further, in the correction wiring 11, the location where the wirings 12 and 13 are connected is closer to the lead wire 4 than the connection location of the wiring 6 when viewed from the current detection wiring 3 arranged oppositely. Similarly, the location where the wiring 14 is connected is closer to the lead wire 5 than the location where the wiring 7 is connected, as viewed from the current detection wiring 3 arranged oppositely. That is, the wirings 6 and 7 are installed in a range sandwiched between positions adjacent to the wirings 12 and 13 on the correction wiring 11 side.

なお、電流検出用配線3の長さL1の電圧降下の検出値と、補正用配線11の長さL2の電圧降下の検出値とは、不図示のマイクロコンピュータからなる制御装置に出力される。この制御装置は、例えば、主回路に電流を供給する回路に実装されている。制御装置には、少なくとも主電圧検出回路8、補正電圧検出回路14、定電流源10が接続されており、その他の主回路に流れる電流を制御する回路(不図示)も接続されている。
ここで、制御装置は、補正電圧回路14の電圧V1に対する主電圧検出回路8の電圧V2の比に、所定の定数C1を乗じて、電流検出用配線3に流れる電流を演算するようにプログラムされている。すなわち、電流I1の計算式は、下記の式1に示すようになっている。
The detection value of the voltage drop of the length L1 of the current detection wiring 3 and the detection value of the voltage drop of the length L2 of the correction wiring 11 are output to a control device including a microcomputer (not shown). This control device is mounted on, for example, a circuit that supplies current to the main circuit. At least the main voltage detection circuit 8, the correction voltage detection circuit 14, and the constant current source 10 are connected to the control device, and a circuit (not shown) for controlling the current flowing through the other main circuits is also connected.
Here, the control device is programmed to calculate the current flowing through the current detection wiring 3 by multiplying the ratio of the voltage V2 of the main voltage detection circuit 8 to the voltage V1 of the correction voltage circuit 14 by a predetermined constant C1. ing. That is, the calculation formula of the current I1 is as shown in the following formula 1.

Figure 2005156445
Figure 2005156445

定数C1は、電流検出用配線3において電圧降下を検出する長さL1及び配線の幅W1と、補正用配線11において電圧降下を検出する長さL2及び配幅W2と、定電流源10の電流値I2とで表される。これは、電流検出用配線3の抵抗を、同じ導電性材料で同じ厚さを有する補正用配線11の抵抗で除算した値に定電流源I2を乗じたものである。つまり、式1において定数C1を電圧V2で除算した値が、補正回路9により補正された電流検出用配線3の抵抗値に相当する。なお、定数Cの値は、制御装置に接続されたメモリに記憶しておいても良い。また、定数C1の代わりに、長さL1,L2、線幅W1,W2、電流I2をメモリに記憶しても良い。   The constant C1 includes the length L1 and the wiring width W1 for detecting the voltage drop in the current detection wiring 3, the length L2 and the distribution width W2 for detecting the voltage drop in the correction wiring 11, and the current of the constant current source 10. It is represented by the value I2. This is obtained by multiplying a value obtained by dividing the resistance of the current detection wiring 3 by the resistance of the correction wiring 11 having the same thickness with the same conductive material by the constant current source I2. That is, the value obtained by dividing the constant C1 by the voltage V2 in Equation 1 corresponds to the resistance value of the current detection wiring 3 corrected by the correction circuit 9. Note that the value of the constant C may be stored in a memory connected to the control device. Further, the lengths L1 and L2, the line widths W1 and W2, and the current I2 may be stored in the memory instead of the constant C1.

次に、この実施の形態の作用について説明する。なお、ここでの回路基板は、モータと、モータに供給するドライバ回路との間に介挿され、モータに流れる電流をドライバ回路にフィードバックするために用いられる回路基板として説明する。
モータを回転させる際には、外部からの入力される信号に基づいて、ドライバがモータに電流を供給する。モータに供給される電流は、図1のリード線4から電流検出用配線3を通り、リード線5に流れ、モータに供給される。
Next, the operation of this embodiment will be described. The circuit board here is described as a circuit board that is inserted between a motor and a driver circuit that supplies the motor, and is used to feed back the current flowing through the motor to the driver circuit.
When rotating the motor, the driver supplies a current to the motor based on an externally input signal. The current supplied to the motor flows from the lead wire 4 of FIG. 1 through the current detection wiring 3 to the lead wire 5 and is supplied to the motor.

電流検出用配線3に電流が流れると、長さL1の間の電圧降下、つまり電圧V2が主電圧検出回路8により検出される。
また、同時に、制御装置からの指令に応じて補正回路9の定電流源10が、補正用配線11に電流I2を流す。これにより、補正用電圧検出回路14が、長さL1の間の電圧降下、つまり電圧V1を検出する。
制御装置は、前記の式1に従って、電圧V1と電圧V2の比に定数C1を乗じて、電流検出用配線3を流れる電流I1を演算する。そして、このようにして検出された電流I1に基づいて、モータに供給する電流がドライバ回路により制御される。
When a current flows through the current detection wiring 3, a voltage drop during the length L 1, that is, the voltage V 2 is detected by the main voltage detection circuit 8.
At the same time, the constant current source 10 of the correction circuit 9 causes the current I2 to flow through the correction wiring 11 in accordance with a command from the control device. Thereby, the correction voltage detection circuit 14 detects the voltage drop during the length L1, that is, the voltage V1.
The control device calculates the current I1 flowing through the current detection wiring 3 by multiplying the ratio of the voltage V1 and the voltage V2 by a constant C1 according to the above-described equation 1. Based on the current I1 thus detected, the current supplied to the motor is controlled by the driver circuit.

この実施の形態によれば、基板本体2が熱伝導率の高い材料から構成されているので、温度むらが生じにくい。さらに、電流検出用配線3と補正用配線11とが近接して配置されているので、2つの配線3,11の温度は同じとみなせる。したがって、補正用配線11の情報を利用して電流検出用配線3の抵抗値を補正すれば、温度が変化しても正しい電流値を得ることができる。
配線3,11は、同じ導電性材料のプリント配線からなるので、その厚さは略同一である。したがって、電流検出用配線3の厚さのばらつきにより回路基板1毎に生じる電流値I1のばらつきも防止できる。そして、材料及び厚さが同一であることから、式1に示すように、電圧V1,V2を変数とし、電圧の比に定数を乗じただけで、簡単に電流値I1を得ることができる。ここで、補正用配線11は、抵抗値の大きい配線であるので、定電流I2の通電を安定させることができ、電流値I1の検出精度も高い。
また、このようにして電流値I1を高精度に検出することで、モータなどの主回路の電流制御を精度良く行うことができる。
According to this embodiment, since the substrate body 2 is made of a material having high thermal conductivity, temperature unevenness hardly occurs. Furthermore, since the current detection wiring 3 and the correction wiring 11 are arranged close to each other, the temperatures of the two wirings 3 and 11 can be regarded as the same. Therefore, if the resistance value of the current detection wiring 3 is corrected using the information of the correction wiring 11, a correct current value can be obtained even if the temperature changes.
Since the wirings 3 and 11 are printed wirings of the same conductive material, the thicknesses thereof are substantially the same. Therefore, the variation in the current value I1 generated for each circuit board 1 due to the variation in the thickness of the current detection wiring 3 can also be prevented. Since the material and thickness are the same, the current value I1 can be easily obtained simply by multiplying the voltage ratio by a constant with the voltages V1 and V2 as variables as shown in Equation 1. Here, since the correction wiring 11 is a wiring having a large resistance value, the energization of the constant current I2 can be stabilized, and the detection accuracy of the current value I1 is high.
In addition, by detecting the current value I1 with high accuracy in this way, current control of the main circuit such as a motor can be performed with high accuracy.

なお、本発明の前記の実施の形態に限定されずに広く応用することができる。
例えば、基板本体2上で、電流検出用配線3の近傍に、補正回路として温度センサを配置しても良い。この場合には、回路基板1の出荷前に、所定の温度に管理された環境下で、一定の電流を電流検出用配線3に通電させて銅配線の厚さのばらつきを校正する。さらに、この校正値を制御装置に接続された不揮発性のメモリに記憶させる。また、温度毎に異なる抵抗の補正値も、メモリに記憶しておく。そして、実際に回路基板1に流れる電流を検出する際には、電流検出用配線3についての電圧降下を検出すると共に、温度センサで基板本体2の温度を検出し、メモリに記憶されている補正値を用いて電流値I1を演算する。この回路基板1によれば、温度が変化するような場合でも、簡単な構成で、精度良く電流値を検出することができる。
The present invention is not limited to the above-described embodiment, and can be widely applied.
For example, a temperature sensor may be arranged as a correction circuit in the vicinity of the current detection wiring 3 on the substrate body 2. In this case, before the circuit board 1 is shipped, a constant current is passed through the current detection wiring 3 in an environment controlled at a predetermined temperature to calibrate the variation in the thickness of the copper wiring. Further, the calibration value is stored in a non-volatile memory connected to the control device. Also, resistance correction values that differ for each temperature are stored in the memory. When the current actually flowing through the circuit board 1 is detected, the voltage drop of the current detection wiring 3 is detected, the temperature of the board body 2 is detected by the temperature sensor, and the correction stored in the memory is detected. The current value I1 is calculated using the value. According to this circuit board 1, even when the temperature changes, it is possible to detect the current value with high accuracy with a simple configuration.

また、電流検出用配線3は、直線形状に限定されずに任意の形状にすることができる。さらに、補正用配線11は、電流検出用配線3を覆うように基板本体2に固定されたカバーに形成しても良い。カバーを熱伝達率の高い材料から構成すると、基板本体2の温度と、カバーの温度とが略同一になるので、前記の実施の形態と同様の効果が得られる。   Further, the current detection wiring 3 is not limited to a linear shape and can be formed in an arbitrary shape. Further, the correction wiring 11 may be formed on a cover fixed to the substrate body 2 so as to cover the current detection wiring 3. If the cover is made of a material having a high heat transfer coefficient, the temperature of the substrate main body 2 and the temperature of the cover become substantially the same, and the same effect as in the above embodiment can be obtained.

本発明の実施の形態における回路基板を示す図である。It is a figure which shows the circuit board in embodiment of this invention.

符号の説明Explanation of symbols

2 基板本体
3 電流検出用配線
8 主電圧検出回路(電圧検出回路)
9 補正回路
10 定電流源
11 補正用配線
14 補正用電圧検出回路
W1 線幅
W2 線幅

2 Substrate body 3 Current detection wiring 8 Main voltage detection circuit (voltage detection circuit)
9 Correction Circuit 10 Constant Current Source 11 Correction Wiring 14 Correction Voltage Detection Circuit W1 Line Width W2 Line Width

Claims (6)

基板本体に、主回路に流れる電流を検出するための電流検出用配線を形成し、前記電流検出用配線における電圧降下を検出する電圧検出回路を前記電流検出用配線に接続し、前記電流検出用配線に近接した位置に、前記電圧検出回路で検出する前記電流検出用配線の電圧降下の検出値を補正する補正回路を設けたことを特徴とする回路基板。   A current detection wiring for detecting a current flowing in the main circuit is formed on the substrate body, a voltage detection circuit for detecting a voltage drop in the current detection wiring is connected to the current detection wiring, and the current detection wiring A circuit board comprising a correction circuit for correcting a detected value of a voltage drop of the current detection wiring detected by the voltage detection circuit at a position close to the wiring. 前記補正回路は、定電流源に接続された前記補正用配線を前記電流検出用配線の近傍に形成すると共に、前記補正用配線における電圧降下を検出する補正用電圧検出回路を備えることを特徴とする請求項1に記載の回路基板。   The correction circuit includes a correction voltage detection circuit that forms the correction wiring connected to a constant current source in the vicinity of the current detection wiring and detects a voltage drop in the correction wiring. The circuit board according to claim 1. 前記電流検出用配線及び前記補正用配線は、プリント配線であり、略同じ厚さを有することを特徴とする請求項2に記載の回路基板。   The circuit board according to claim 2, wherein the current detection wiring and the correction wiring are printed wirings and have substantially the same thickness. 前記補正用配線の線幅は、前記電圧検出用配線の線幅よりも狭いことを特徴とする請求項3に記載の回路基板。   The circuit board according to claim 3, wherein a line width of the correction wiring is narrower than a line width of the voltage detection wiring. 前記基板本体は、金属材料が用いられた金属製基板であることを特徴とする請求項1から請求項4のいずれか一項に記載の回路基板。   The circuit board according to any one of claims 1 to 4, wherein the substrate body is a metal substrate using a metal material. 主回路に流れる電流を電流検出用配線に流し、前記電流検出用配線における電圧降下を検出すると共に、前記電流検出用配線に近接して設けられた補正用配線に定電流を流し、前記補正用配線における電圧降下を検出し、前記電流検出用配線及び前記補正用配線におけるそれぞれの電圧降下から、前記主回路に流れる電流値として、温度変化に依存しない電流値を得ることを特徴とする電流検出方法。

The current flowing through the main circuit is supplied to the current detection wiring, a voltage drop in the current detection wiring is detected, and a constant current is supplied to the correction wiring provided close to the current detection wiring. A current detection that detects a voltage drop in the wiring and obtains a current value that does not depend on a temperature change as a current value that flows in the main circuit from each voltage drop in the current detection wiring and the correction wiring. Method.

JP2003397570A 2003-11-27 2003-11-27 Circuit board and current detection method Withdrawn JP2005156445A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014096433A (en) * 2012-11-08 2014-05-22 Hitachi Chemical Co Ltd Printed circuit board having intelligence function and method of measuring wiring temperature of printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014096433A (en) * 2012-11-08 2014-05-22 Hitachi Chemical Co Ltd Printed circuit board having intelligence function and method of measuring wiring temperature of printed circuit board

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