JP2005150218A - Method and apparatus for manufacturing laminated electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent breakdown of deformation of green sheet generated when a temporary base material is peeled from the green sheet. <P>SOLUTION: An ultrasonic actuator 111 is embedded within a base plate 110 and the ultrasonic vibration is applied to the green sheet 10 and temporary base material 11. With ultrasonic vibration, a bonding force between the green sheet 10 and temporary base material 11 is reduced and thereby the temporary base material 11 can be peeled with less amount of force. Moreover, it is also possible to peel the temporary base material 11 by moving the green sheet in the lateral direction while an ultrasonic wave head 71 is slid in contact to a part of the temporary base material 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a manufacturing method and a manufacturing apparatus for a multilayer electronic component, and more particularly, a manufacturing method for peeling a temporary substrate such as a PET film from a green sheet used for multilayer electronic components such as chip capacitors and inductors, and the like. It relates to a manufacturing apparatus.

  With the recent miniaturization of electronic equipment, the demand for high-density mounting of electronic components is increasing, and in order to mount electronic components with high density, multilayer electronic components such as surface mount chip capacitors and inductors are required. Widely used. The demand for high-density mounting does not stop, and further miniaturization of multilayer electronic components is required.

  In general, a multilayer electronic component is configured by laminating a green sheet in which a conductor pattern is formed on an insulator layer such as ceramic. This green sheet has been reduced in thickness with the miniaturization of parts, and in recent years, a sheet having a thickness of several micrometers has been used.

  Thus, since one green sheet is extremely thin and easily damaged, the green sheet before lamination is formed on a temporary substrate such as a PET film. Then, while holding the green sheet by the temporary substrate, the green sheet is sequentially laminated on the lamination stage, and the green sheet is pressed and heated from above the temporary substrate toward the green sheet laminate. The sheets are bonded together. In this way, after the green sheets are stacked, the temporary substrate that is no longer needed is peeled off from the green sheets. By repeating this process, a laminate composed of a plurality of green sheets is completed. That is, in this method, the temporary substrate is peeled after the green sheets are laminated.

  As a method of peeling the temporary substrate from the green sheet, there is a method of peeling the temporary substrate from the green sheet before laminating the green sheet and laminating only the green sheet, in addition to the method described above.

  However, in the former method, that is, the method of peeling the temporary substrate after laminating the green sheets, the green sheets are overlapped with the temporary substrate, and heating and pressurization are performed from the temporary substrate side. For this reason, not only the adhesive force between the green sheets is increased, but also the adhesive force between the green sheet and the temporary substrate is increased. For this reason, when the temporary substrate is peeled from the green sheet, excessive stress is applied to the green sheet, causing problems such as breakage of the green sheet, deformation of the conductor pattern, and defects in the laminate.

  Usually, in order to facilitate peeling, the surface of the temporary substrate to be bonded to the green sheet is subjected to release treatment (water repellent treatment) such as silicon treatment. It is difficult to avoid this problem. As the green sheet thickness is reduced, the mechanical strength of the green sheet is reduced. On the other hand, the adhesive strength between the green sheet and the temporary substrate is constant regardless of the thickness of the green sheet. It can be said that it was easier to break than before.

  The same problem also occurs in the latter method, that is, a method in which the temporary substrate is previously peeled from the green sheet and only the green sheets are laminated. That is, when the temporary substrate is peeled from the green sheet, excessive stress is applied to the temporary substrate and the green sheet, causing problems such as deformation and breakage of the green sheet and the conductor pattern.

  Furthermore, it is conceivable to facilitate peeling by strengthening the silicon mold release treatment on the surface of the temporary substrate and weakening the adhesion between the green sheet and the temporary substrate. However, it is generally necessary to increase the “water repellency” of the temporary substrate in order to weaken the adhesive force. However, if the water repellency of the temporary substrate is increased too much, the green sheet is repelled when the green sheet is formed on the temporary substrate. It becomes easy. That is, the “leakage (hydrophilicity)” of the temporary substrate is deteriorated, and when the green sheet is formed on the temporary substrate, a pinhole or the like may occur in the green sheet. Such a problem is remarkable in a thin green sheet, and it becomes difficult to produce a uniform green sheet.

In view of the above problems, various techniques have been devised. In order to facilitate the peeling of the green sheet, a method has been devised in which a ceramic raw sheet formed on a PET film is subjected to thermocompression bonding, and then a PET film such as a carrier film is linearly peeled (for example, Patent Document 1). ). That is, in this method, by applying a temperature of 70 ° C. and a pressure of 100 kg / cm ² to a laminated sheet for 10 seconds and then peeling the PET film, peeling becomes easy, and the ceramic raw sheet is damaged. The problem is to be avoided.

  However, when the ceramic sheet is pressure-bonded under the above-described conditions, the temperature of the ceramic raw sheet and the PET film rises as a whole, and plastic deformation easily occurs, and the adhesion strength between the PET film and the ceramic raw sheet increases. End up. As a result, there is a drawback in that the PET film tends to be incompletely peeled off.

  As another conventional technique, a transfer laminating method has been devised in which a conductor is formed on a releasable stainless steel plate (temporary substrate) and the stainless steel plate is deformed to peel the conductor from the stainless steel plate. (For example, patent document 2). However, in this method, there is no substantial difference from the conventional peeling method in that the releasability of the stainless steel plate is used, and it is difficult to avoid the above problem.

  Furthermore, as another conventional technique, a method of peeling a sheet material (soft body) attached to a continuous sheet using ultrasonic waves has been devised (for example, Patent Document 3). In such a method, the release sheet is peeled while transmitting the ultrasonic wave generated from the ultrasonic vibration unit to the suction mechanism and applying the ultrasonic wave to the release sheet from the suction mechanism.

However, this prior art does not relate to a configuration in which sheet materials are stacked like a green sheet made of a ceramic material. Further, this prior art does not disclose a configuration in which ultrasonic waves are applied to a part of the green sheet while the green sheet is moved.
JP-A-5-47595 Japanese Patent Laid-Open No. 2003-17351 Japanese Patent Application Laid-Open No. 11-1114896

  The present invention has been made in view of the above-described problems, and a problem to be solved by the present invention is to facilitate the peeling of the temporary substrate from the green sheet.

  In order to solve the above-described problems, the present invention provides a method for manufacturing a laminated electronic component in which green sheets are laminated, a step of applying ultrasonic waves to the green sheet attached to a temporary substrate, And a step of peeling from the green sheet.

  Thereby, the adhesive force between the green sheet and the temporary substrate is weakened, and the temporary substrate can be easily peeled from the green sheet.

  In the present invention, an ultrasonic wave is simultaneously applied to each part of the green sheet, or an ultrasonic wave is sequentially applied to each part of the green sheet.

  Furthermore, the present invention provides the ultrasonic head for applying ultrasonic waves by moving the temporary base and the ultrasonic head relative to each other while bringing the ultrasonic head into contact with a part of the temporary base. An ultrasonic wave is applied to each part of the green sheet in order.

  In the present invention, the green sheet is laminated after the temporary substrate is peeled from the green sheet, or the green sheet is laminated before the temporary substrate is peeled from the green sheet.

  Furthermore, the present invention provides a method for manufacturing a multilayer electronic component in which green sheets are laminated, a step of determining an ultrasonic application condition based on physical characteristics of the temporary substrate and the green sheet, and a method based on the ultrasonic application condition. And a step of applying an ultrasonic wave to the green sheet adhered to the temporary substrate, and a step of peeling the temporary substrate from the green sheet.

The best mode for carrying out the present invention will be described below with reference to the drawings.
(First embodiment)
FIG. 1 is a schematic view of a multilayer electronic component manufacturing apparatus according to a first embodiment. The manufacturing apparatus includes a manufacturing apparatus main body 1 for laminating green sheets and a controller 2 for controlling the manufacturing apparatus main body 1.

  The manufacturing apparatus main body 1 generally includes a table 101, a heating / pressurizing plate 120, a driving device 122, a stack stage 130, a suction conveyance plate 140, and a base plate 110. A stack stage 130 is disposed on the upper surface of the table 101, and a green sheet laminate 330 is formed on the stack stage 130. A heater 131 is embedded in the stack stage 130, and the heater 131 can heat the green sheet from below. The heater 131 has a temperature sensor, and the detection signal output from the temperature sensor is input to the controller 2. The controller 2 can control the temperature of the heater 131 based on the detection signal.

  A temporary adhesive film (not shown) for temporarily fixing the green sheet is placed on the stack stage 130. This temporary adhesive film is composed of a foamed pressure-sensitive adhesive sheet, a UV release sheet, and the like, and fixes the green sheet laminate until the green sheet laminate is laminated. In addition, after a lamination process is complete | finished, a green sheet laminated body is peeled from a temporary adhesive film.

  A driving device 122 is fixed to the heating / pressure plate 120, and the heating / pressure plate 120 can be moved up and down by the driving device 122. A heater 121 is embedded in the heating / pressure plate 120, and the pressure plate 120 is heated by the heater 121.

  A base plate 110 is disposed in the vicinity of the table 101, and an ultrasonic actuator 111 is embedded in the base plate 110. The ultrasonic actuator 11 is for applying a longitudinal vibration to the surface of the green sheet, but a lateral vibration may be used. A green sheet with a temporary substrate attached is placed on the base plate 110. By applying ultrasonic waves to the green sheet, the temporary substrate can be easily peeled from the green sheet. An adsorption device is embedded in the base plate 110, and the temporary substrate can be adsorbed and held by the adsorption device.

  Above the base plate 110, an adsorption conveyance plate 140 for conveying the green sheet while adsorbing is provided. The suction conveyance plate 140 is provided with a horizontal direction driving device 141 and a vertical direction driving device 142, and the suction plate 140 is moved in the horizontal direction and the vertical direction. That is, the green sheet can be moved from the base plate 110 to the stack stage 130.

  FIG. 2 is a block diagram showing the configuration of the controller 2. The controller 2 includes a bus 200, a CPU 201, a memory 202, a hard disk drive 203, a display unit 204, an input unit 205, an A / D converter 206, a D / A converter 207, and a digital interface 208.

  The bus 200 includes a data bus and an address bus, and has a function of transferring data between the CPU 200 and the memory 202 and the like. The memory 202 is used as a work memory for the operation of the CPU 201, and the hard disk drive 203 is for storing a control program. The display unit 204 includes a liquid crystal display, an LED display, and the like, and is used to display the operating conditions of the control program and the operating conditions of the manufacturing apparatus 1 to the operator. The input unit 205 includes buttons, a keyboard, and the like, and has a function of inputting operating conditions of the manufacturing apparatus.

  The A / D converter 206 converts an analog signal from the temperature sensor into a digital signal and sends it to the CPU 201. The D / A converter 207 converts the amplitude instruction signal and frequency instruction signal of the ultrasonic wave determined by the CPU 201 into an analog signal and sends it to the ultrasonic actuator 111. Thereby, the ultrasonic actuator 111 generates an ultrasonic wave having an amplitude and a frequency based on these signals. The D / A converter 207 also has a function of converting the heater control signal determined by the CPU 201 into an analog signal. The CPU 201 can determine the heater control signal based on the signal from the temperature sensor so that the temperature of the green sheet laminate becomes the set temperature, and can control the temperature of the heaters 121 and 131 based on the heater control signal. .

  The digital interface 208 is for sending signals for controlling various operations of the manufacturing apparatus main body 1. That is, a signal for instructing the operation of the driving devices 122, 141, 142, etc. is output from the digital interface 208. The drive devices 122, 141, 142, and the like are configured to move the transport suction plate 140 or the heating / pressurizing plate 120 in a predetermined direction based on these signals.

  FIG. 3 shows a cross-sectional view of the green sheet according to the present embodiment. The green sheet 10 has a sheet shape made of a ceramic material or the like, and is formed by the following steps. First, a slurry made of a dielectric material or magnetic material, an organic binder, and an organic solvent is applied on a temporary substrate 11 made of a resin-based film such as PET to a predetermined thickness using a doctor blade method and then sufficiently dried. Thereafter, a metal pattern 12 made of a metal powder-containing paste is formed on the green sheet 10 using a screen printing method or the like. Through the above steps, one green sheet 10 is completed. The green sheet is not limited to a card shape as shown in FIG. 3, but may be a tape shape.

  The temporary substrate 11 described above can be made of a resin-based film such as PET, PE, or PP that has been subjected to a silicon release treatment, or a metal plate such as a stainless steel plate that has been subjected to a Ni / PTFE release treatment.

Since the green sheet contains a soft material as described above, the sound velocity is a relatively low value such as 1,500 m / sec and the acoustic impedance is 1.5 kg / m ² · S × 10 ⁵ . On the other hand, since the temporary substrate is made of a hard material such as PET film or metal, the sound velocity is 3,000 to 5,000 m / sec, and the acoustic impedance is ³ to ⁵ kg / m ² · S × 10 ⁵ . That is, it can be confirmed from this result that the acoustic impedance of the temporary substrate 11 is larger than the acoustic impedance of the green sheet 10.

  Subsequently, the manufacturing method according to the present embodiment will be described with reference to FIGS. 4-7 is a figure which shows in order the process from peeling of a temporary base | substrate to lamination | stacking of a green sheet, and FIG. 8 is a flowchart for demonstrating the said process based on a present Example.

  First, as shown in FIG. 4, the green sheet 10 with the temporary base 11 is placed on the base plate 110. The operator operates the controller 2 to turn on the heaters 121 and 131. The pressurizing / heating plate 120 and the stack stage 130 are started to be heated (step S61). Further, the controller 2 drives the ultrasonic actuator 111 to apply ultrasonic vibration to the temporary substrate 11 side on the base plate 110 (step S62). When ultrasonic waves are applied to the temporary substrate 11 and the green sheet 10, the adhesive force at the contact surfaces of both is reduced. That is, since the acoustic impedance of the green sheet 10 is different from the acoustic impedance of the temporary substrate 11, the adhesive force between the contact surfaces of both is reduced.

  In this state, the controller 2 drives the driving device 142 and the suction conveyance plate 140 starts to descend toward the green sheet 140. Then, the suction conveyance plate 140 pulls the green sheet 10 upward while sucking the green sheet 10 (see FIG. 4). Thereby, the green sheet 10 is peeled off from the temporary substrate 11 (step S63). As described above, since the adhesive force between the green sheet 10 and the temporary substrate 11 is reduced by applying ultrasonic waves, the temporary substrate 11 can be easily peeled from the green sheet 10.

  Subsequently, the driving device 141 conveys the suction conveyance plate 140 toward the stack stage 130 (step S64, see FIG. 5), and places the green sheet 10 on the green sheet laminate 10a (see FIG. 6). The green sheet laminate 10a is formed on the stack stage 130 with a temporary adhesive film 132 interposed therebetween.

  When the green sheet 10 is placed on the green sheet laminate 10 a, the suction conveyance plate 140 is retracted to the original position, that is, the base plate 110. The heating / pressurizing plate 120 presses the placed green sheet 10 to the green sheet laminate 10a (see step S65, FIG. 7). Thereby, the green sheet 10 is laminated | stacked on the green sheet 10a. In this way, the processes of steps S61 to S65 are repeated until the stacking of the predetermined number of green sheets is completed (YES in step S66). When the lamination of the green sheet laminate 10a is finished, the controller 2 finishes the process.

  In the above heating / pressurizing step (step S65, FIG. 7), the green sheet 10 may be heated and pressurized together with the suction conveyance plate 140 without retracting the suction conveyance plate 140.

It is desirable that the ultrasonic wave, temperature, and pressure to be applied in the above manufacturing method have the following numerical values.
Ultrasonic vibration mode: preferably longitudinal vibration Ultrasonic frequency: 15-40 KHz (preferably 20 KHz)
Ultrasonic vibration amplitude: 6 to 60 μm (preferably 6 to 20 μm)
Stack stage temperature: room temperature to 60 ° C. (preferably room temperature to 40 ° C.)
Ultrasonic head unit temperature: room temperature to 60 ° C. (preferably room temperature)
Press pressure: 0.5 to 20 kg / cm ² (preferably 5 to 10 kg / cm ² )
Ultrasonic application time: 0.1 to 3 seconds (preferably 0.3 to 1 second)
Moreover, the result of having evaluated the adhesive force of the green sheet 10 and the temporary base | substrate 11 with peel strength by application of ultrasonic vibration is shown below.
Temporary substrate material No ultrasonic wave Ultrasonic wave PET 0.2-0.5 0.05-0.1
SUS 0.4-0.6 0.05-0.1

  Here, it is assumed that the surface of PET is subjected to silicon treatment, and the surface of SUS is subjected to Nimflon treatment (Ni / PTFE eutectoid plating treatment). In general, there is a correlation between the peel strength and the adhesion force, and it can be confirmed from the above results that the adhesion force between the temporary substrate and the green sheet is greatly reduced by the application of ultrasonic vibration. That is, there is a difference of several times in the acoustic impedance between the green sheet and the temporary substrate such as PET, so that the energy of the applied ultrasonic waves is concentrated on the contact surface between the green sheet and the temporary substrate, and the adhesion force is reduced. To do. As a result, the temporary substrate can be peeled from the green sheet with less force, and various problems such as deformation and breakage of the green sheet, structural defects in the laminate, and poor electrical characteristics can be avoided. Furthermore, since the deformation of the green sheet can be prevented, it is possible to improve the lamination accuracy of the green sheet.

  As described above, since the adhesive force between the green sheet and the temporary substrate can be weakened without strengthening the silicon release treatment, the so-called “leakage (hydrophilicity)” of the temporary substrate is not deteriorated. . For this reason, when forming a green sheet on a temporary base | substrate, it also becomes possible to prevent that a defect, such as a pinhole, arises in a green sheet.

(Second embodiment)
Subsequently, a method and apparatus for manufacturing a multilayer electronic component according to a second embodiment of the present invention will be described with reference to FIGS. Unlike the first embodiment, the present embodiment is characterized in that the green sheet 10 is moved while applying an ultrasonic wave.

  As shown in FIG. 9, an ultrasonic head 71 is provided at the end of the base plate 70. A temporary substrate suction plate 72 is disposed adjacent to the base plate 70. The temporary substrate adsorption plate 72 is configured to be movable up and down while adsorbing the temporary substrate 11. Thus, the temporary substrate 11 can be peeled by sucking only the temporary substrate downward from the green sheet conveyed from the base plate 70.

  The operation of the manufacturing apparatus having the above configuration will be described below. First, the green sheet 10 to which the temporary base 11 is attached is placed on the base plate 70 of FIG. 9, and the green sheet 10 is adsorbed by the adsorbing and conveying plate 140 in the horizontal direction (right direction in the figure). Move. At this time, the ultrasonic head 71 is in contact with a part of the surface of the temporary substrate 11, and ultrasonic waves are sequentially transmitted from the front end portion to the rear end portion of the temporary substrate 11 as the temporary substrate 11 moves in the horizontal direction. Applied. As a result, ultrasonic waves are applied to all parts of the temporary substrate 11, and the adhesive force between the temporary substrate 11 and the green sheet is weakened.

  When the green sheet 10 is conveyed to the temporary substrate adsorption plate, the temporary substrate adsorption plate 72 moves downward while adsorbing the temporary substrate 11. At this time, since the green sheet 10 is adsorbed and held by the adsorbing and conveying plate 140, the temporary substrate 11 is peeled from the green sheet 10. As described above, since the adhesive force between the temporary substrate 11 and the green sheet 10 is weakened, the temporary substrate 11 can be peeled off with less force.

  Subsequently, the suction conveyance plate 140 conveys the green sheet 10 toward the stack plate 130 and places it on the green sheet laminate 10a. Thereafter, as in the first embodiment, the green sheet 10 is pressure-bonded onto the green sheet laminate 10a by the pressurizing / heating plate 120 (see FIGS. 5 to 7).

  In the above-described heating / pressurizing step (FIG. 7), the green sheet 10 may be heated and pressurized together with the suction conveyance plate 140 without retracting the suction conveyance plate 140.

  Also in this embodiment, it is possible to achieve the same effect as in the first embodiment. That is, the temporary substrate can be easily peeled from the green sheet, and various problems such as deformation and breakage of the green sheet, structural defects of the laminate, and poor electrical characteristics can be avoided.

(Third embodiment)
Subsequently, a manufacturing method and a manufacturing apparatus according to a third embodiment of the present invention will be described with reference to FIGS. FIGS. 11-14 represents the outline of the lamination | stacking process based on a present Example, FIG. 15 is a flowchart for demonstrating the said process.

  As shown in FIG. 11, in this embodiment, instead of providing the ultrasonic actuator on the base plate 110 according to the second embodiment, the ultrasonic actuator 146 is provided on the suction conveyance plate 145 for conveying the green sheet 10. Provided. That is, an ultrasonic actuator 146 is embedded in the suction conveyance plate 145, and ultrasonic vibration can be applied to the temporary substrate 11 side while the green sheet 10 is sucked. The manufacturing method according to the present embodiment will be described below.

  First, the operator operates the controller 2 to turn on the heaters 121 and 131 and starts heating the pressure / heating plate 120 and the stack stage 130 (step S151). Further, the controller 2 drives the driving device 141 to lower the suction conveyance plate 145 toward the green sheet 10 on the base plate 110. The green sheet 10 is placed on the base plate 110 with the temporary base 11 on the upper side.

  The controller 2 adsorbs the temporary substrate 11 side together with the green sheet 10. And the adsorption conveyance plate 145 conveys the green sheet 10 on the green sheet laminated body 10a, and stops adsorption | suction of the green sheet 10. FIG. Thereby, the green sheet 10 is mounted on the green sheet laminated body 10 with the temporary base | substrate 11 (step S152).

  The suction conveyance plate 145 is retracted on the base plate 110, and the heating and pressure plate 120 presses the green sheet 10 to the green sheet laminate 10a (see step S153, FIG. 13). Thereby, the green sheet 10 is adhere | attached on the green sheet laminated body 10a.

  Subsequently, the suction conveyance plate 145 moves again onto the green sheet laminate 10a, sucks the temporary substrate 11 attached to the green sheet 10a, and peels it off while turning on the ultrasonic actuator 146 (steps S154 to S155). FIG. 14). At this time, since ultrasonic waves are applied to the temporary substrate 11 and the green sheet 10, the ultrasonic vibration energy is concentrated on the contact surfaces of both due to the difference in acoustic impedance. Thereby, since the adhesive force between the temporary substrate 11 and the green sheet 10 is reduced, the temporary substrate 11 can be peeled with less force. Then, until the stacking of the predetermined number of green sheets 10 is completed (YES in step S156), the above-described processing is repeatedly executed, and the desired green sheet stacked body 10a is completed.

  In the above-described heating / pressurizing step (step S153, FIG. 13), the green sheet 10 may be heated and pressurized together with the suction conveyance plate 145 without retracting the suction conveyance plate 145.

  Also in this embodiment, it is possible to achieve the same effect as the above-described embodiment. That is, the temporary substrate can be peeled from the green sheet with less force, and various problems such as deformation and breakage of the green sheet, structural defects in the laminate, and poor electrical characteristics can be avoided.

(Fourth embodiment)
Subsequently, a manufacturing method and a manufacturing apparatus according to a fourth embodiment of the present invention will be described with reference to FIGS. In this embodiment, as shown in FIG. 19, after the green sheet 10 with the temporary substrate 11 attached thereto is pressure-bonded to the green sheet laminate 10a, the ultrasonic head 150 partially ultrasonically applies the temporary substrate 11 to the green substrate 10a. The vibration is applied.

  In the manufacturing apparatus configured as described above, the suction conveyance plate 140 conveys the green sheet 10 onto the green sheet laminate 10a while adsorbing the green sheet 10 (FIG. 16). Since the suction conveyance plate 140 sucks the temporary substrate 11 side, the green sheet 10 side faces downward. The suction conveyance plate 140 places the green sheet 10 on the green sheet laminate 10 a (FIG. 17) and then retracts on the base plate 110. Then, the heat and pressure plate 120 presses the green sheet 10 to the green sheet laminate 10a (FIG. 18).

  Subsequently, the ultrasonic head 150 moves in the direction of the arrow while sliding on the temporary base 11 (FIG. 19). Thereby, ultrasonic vibration is applied to the whole temporary substrate 11, and the adhesive force of the temporary substrate 11 and the green sheet 10 falls.

  Note that the ultrasonic head 150 may be slidably contacted with only a part of the temporary substrate 11 without being slidably contacted. In this state, the suction conveyance plate 140 moves again onto the green sheet laminate 10a, and peels off while adsorbing the temporary substrate 11 attached to the green sheet 10a (FIG. 20). Since the adhesive force between the green sheet 10 and the temporary base 11 is reduced by the above-described ultrasonic wave application step, the temporary base 11 can be peeled off with less force. Then, the above-described process is repeatedly executed until the lamination of the predetermined number of green sheets 10 is completed, and a desired green sheet laminate 10a is completed.

  In the above-described heating / pressurizing step (FIG. 18), the green sheet 10 may be heated and pressurized together with the suction conveyance plate 140 without retracting the suction conveyance plate 140.

  In this example, similarly to the above-described example, the temporary substrate can be easily peeled off from the green sheet with less force, and the green sheet can be easily deformed, damaged, structural defects in the laminate, Various problems such as defects can be avoided.

(5th Example)
Then, the manufacturing apparatus based on 5th Example is demonstrated. This manufacturing apparatus is a modification of the third embodiment described above, and can automatically determine the lamination process profile by inputting conditions such as the thickness of the green sheet and the material of the ceramic material to the controller. It is.

  A profile created in advance by an experiment or the like is used. That is, while changing each of a plurality of conditions such as the thickness of the green sheet, the optimum amplitude, frequency, heating temperature, and pressure value of the ultrasonic vibration are measured in advance, and the hard disk of the controller 2 using these values as a profile. The drive 203 is stored. In the actual lamination process, by inputting various conditions such as the film thickness of the green sheet to the controller 2, the controller 2 reads the optimum profile from the hard disk drive 202 and executes the lamination process based on this profile. Can do.

  The outline of the manufacturing method according to the present embodiment will be described with reference to the flowchart shown in FIG. First, physical characteristic parameters obtained by an operator operation or sensor detection are input to the controller 2 (steps S701 to S704). Based on the input conditions, the controller 2 reads an optimum profile from the database, performs arithmetic processing as necessary (step 721), and determines an output profile (step S705).

  Subsequently, the controller 2 heats the heaters provided on each of the stack stage 130 and the heating / pressurizing plate 120 according to the output profile (step S706). If the heater does not need to be turned on every cycle of the flowchart of FIG. 21, step S706 may be performed only at START, and the flow may be started after confirming that the heater temperature has reached a predetermined temperature. .

  After the heater is controlled to a predetermined temperature, the suction transport plate 145 transports the green sheet 10 to the green sheet laminate 10a while sucking the green sheet 10 (step S707) (step S708). Thereafter, the controller 2 controls the pressure and the frequency and amplitude of the ultrasonic actuator according to the determined output profile, and executes the thermocompression bonding and peeling work (steps S709 to S711).

  As a more detailed example, first, the operator inputs the size and film thickness of the green sheet to the controller 2 (step S701). Similarly, the operator inputs the material and particle size of the ceramic material (step S702), and inputs the softening point and amount of the organic binder (step S703). Furthermore, the controller 2 measures the room temperature in which the manufacturing apparatus main body 1 is installed using a sensor (step S704). Based on the conditions input in this way, the controller 2 reads the optimum profile from the hard disk drive 203 and develops it in the memory 202 (step S705).

  Subsequently, the controller 2 heats the heater provided in each of the stack stage 130 and the heating / pressure plate 120 (step S706). The heating profile of the heater is not only controlled to be constant, but can be changed with time according to the processing content of the lamination process.

  After the heater is controlled to a predetermined temperature, the suction transport plate 145 transports the green sheet 10 to the green sheet laminate 10a while sucking the green sheet 10 (step S707) (step S708). The pressurizing / heating plate 120 pressurizes the green sheet 10 (step S709). The controller 2 controls the frequency and amplitude of the ultrasonic actuator according to the determined profile, and applies ultrasonic waves to the green sheet 10 (step S710). In addition, regarding the profile of the ultrasonic wave, not only the on / off control but also the amplitude and frequency can be varied. For example, control such as gradually increasing the amplitude of the ultrasonic wave applied to the green sheet 10 with time, or conversely, may be performed. Further, pressurization can be controlled so as to vary with time.

  After the green sheets 10 are stacked, the suction conveyance plate 145 peels off the temporary substrate 11 (step S711). At this time, the stress required for peeling is measured using a stress sensor provided on the suction conveyance plate 145 (step S712). If the stress required for peeling exceeds a predetermined value, the possibility of deformation of the green sheet 10 increases, so the controller 2 automatically changes the profile (step S713). Based on the profile thus changed, the next green sheet 10 stacking step is executed. When the stacking of all the green sheets 10 is completed by the above processing (step S714), the controller 2 stops the operation of the apparatus main body 1.

  According to the present embodiment, the temporary substrate stacking process can be executed using an optimum profile according to the conditions such as the green sheet, and therefore, the effects of the above-described embodiments can be obtained more reliably.

  It should be noted that the present invention is not limited to the above-described embodiments, and can be modified without departing from the spirit of the present invention. For example, although the multilayer ceramic capacitor has been described in the above-described embodiments, it goes without saying that the present invention can also be applied to a multilayer inductor. Further, the material of the temporary substrate is not limited to the resin film, and may be a metal such as a stainless plate having no flexibility, glass, ceramics, or a composite thereof. The surface treatment of the temporary substrate may be a resin-based mold release treatment such as silicon / fluorine treatment, a metal-type mold release treatment such as nickel / chromium / titanium / molybdenum, or a combination of Ni / PTFE eutectoid plating or Ti / N / Al / N composite release processing may also be used.

  Furthermore, the process of applying ultrasonic waves may be divided into two. For example, in the first ultrasonic application step, a profile that can maximize the adhesion between green sheets is used, and in the second ultrasonic application step, the adhesion between the green sheet and the temporary substrate is the highest. A decreasing profile can be used.

It is a figure which shows the outline of the manufacturing apparatus which concerns on 1st Example of this invention. It is a block diagram of the controller concerning the 1st example of the present invention. It is sectional drawing of the green sheet which concerns on 1st Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 1st Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 1st Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 1st Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 1st Example of this invention. It is a flowchart showing the manufacturing method which concerns on 1st Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 2nd Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 2nd Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 3rd Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 3rd Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 3rd Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 3rd Example of this invention. It is a flowchart showing the manufacturing method which concerns on 3rd Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 4th Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 4th Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 4th Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 4th Example of this invention. It is a figure for demonstrating the manufacturing method which concerns on 4th Example of this invention. It is a flowchart showing the manufacturing method which concerns on 5th Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Manufacturing apparatus main body 2 Controller 10 Green sheet 10a Green sheet laminated body 11 Temporary base | substrate 110 Base plate 111 Ultrasonic actuator 140 Adsorption conveyance plate

Claims (17)

In the manufacturing method of the multilayer electronic component in which the green sheets are laminated,
Applying ultrasonic waves to the green sheet adhered to the temporary substrate;
And a step of peeling the temporary substrate from the green sheet.   The method for manufacturing a multilayer electronic component according to claim 1, wherein an ultrasonic wave is simultaneously applied to each portion of the green sheet.   The method for manufacturing a multilayer electronic component according to claim 1, wherein ultrasonic waves are sequentially applied to each portion of the green sheet.   By moving the temporary base and the ultrasonic head relative to each other of the green sheet while bringing an ultrasonic head for applying ultrasonic waves into contact with part of the temporary base, 4. The method of manufacturing a multilayer electronic component according to claim 3, wherein ultrasonic waves are sequentially applied to the multilayer electronic component.   5. The method for manufacturing a multilayer electronic component according to claim 1, wherein the green sheet is laminated after the temporary substrate is peeled from the green sheet.   The manufacturing method according to claim 1, wherein the green sheets are laminated before the temporary substrate is peeled from the green sheets. In the manufacturing method of the multilayer electronic component in which the green sheets are laminated,
Determining ultrasonic application conditions based on physical properties of the temporary substrate and the green sheet;
Applying ultrasonic waves to the green sheet attached to the temporary substrate based on the ultrasonic wave application conditions;
And a step of peeling the temporary substrate from the green sheet.   The method for manufacturing a multilayer electronic component according to claim 1, wherein the green sheet includes a ceramic material.   The temporary substrate is made of resin, metal, glass, ceramics, or a composite containing these, which has an acoustic impedance larger than the acoustic impedance of the green sheet. A method of manufacturing a multilayer electronic component.   The method for manufacturing a multilayer electronic component according to claim 9, wherein a release treatment is performed on a surface of the temporary substrate that is in contact with the green sheet. In the manufacturing equipment for laminated electronic parts with green sheets laminated,
Ultrasonic application means for applying ultrasonic waves to the green sheet adhered to the temporary substrate;
An apparatus for manufacturing a multilayer electronic component, comprising: peeling means for peeling the temporary substrate from the green sheet.   The apparatus for manufacturing a multilayer electronic component according to claim 11, wherein the ultrasonic wave application unit applies ultrasonic waves simultaneously to each portion of the green sheet.   The apparatus for manufacturing a multilayer electronic component according to claim 11, wherein the ultrasonic wave application unit sequentially applies ultrasonic waves to each portion of the green sheet.   A moving means is provided for moving the temporary base and the ultrasonic head relative to each other while contacting an ultrasonic head for applying ultrasonic waves to a part of the temporary base. The apparatus for manufacturing a multilayer electronic component according to claim 13.   15. The multilayer electronic component manufacturing apparatus according to claim 11, further comprising a stacking unit that stacks the green sheet after the temporary substrate is peeled from the green sheet.   15. The manufacturing apparatus according to claim 11, further comprising a stacking unit that stacks the green sheet before the temporary substrate is peeled from the green sheet. In the manufacturing equipment for laminated electronic parts with green sheets laminated,
Determination means for determining ultrasonic application conditions based on physical properties of the temporary substrate and the green sheet;
Based on the ultrasonic wave application conditions, an ultrasonic wave application means for applying an ultrasonic wave to the green sheet adhered to the temporary substrate,
An apparatus for manufacturing a multilayer electronic component, comprising: peeling means for peeling the temporary substrate from the green sheet.

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