JP2005148481A - Optical waveguide package and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical waveguide package in which the amount of fluctuation of optical power caused by temperature variation is made small. <P>SOLUTION: The optical waveguide package is provided with a waveguide device 20 on which an optical waveguide 19 is formed and a fiber array 21 on which an optical fiber 41 is fixed. The waveguide device 20 is provided with a first substrate 30, a core 19a, a clad layer 31, a first cover glass 33 and a photosetting type first adhesive layer 32. The fiber array 21 is provided with a second substrate 51, an optical fiber 41, a second cover glass 52 and a photosetting type second adhesive layer 53. Thickness of the adhesive layers 32 and 53 are respectively 15 to 50 μm. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an optical waveguide package applied to an optical branching device for optical communication, and a method for manufacturing the same.

  In an optical package including an optical waveguide assembly formed by bonding a waveguide device and a fiber array, when an environmental test such as a temperature cycle test is performed, the fluctuation amount of the optical power is an allowable value (variation width: 0. 0). 4 dB), and the optical characteristics may deteriorate. In addition, the bonded portion between the waveguide device and the fiber array may peel off, and desired optical characteristics may not be obtained.

  In order to make it difficult to peel off the bonded portion of such an optical waveguide assembly, it is also known to increase the bonding strength by performing a silane coupling treatment on the bonding surface, for example, as described in Patent Document 1 below. It has been.

  However, the amount of fluctuation in optical power cannot be reduced simply by increasing the strength of the bonded portion of the optical waveguide assembly. As a result of diligent research on the cause of fluctuations in optical power, the thickness of the adhesive layer between the optical waveguide and the cover glass varies due to the undulations that occur on the substrate when forming the optical waveguide, and the amount of fluctuation in optical power. It has been found that it has an influence.

  For example, in a conventional waveguide assembly 1 schematically shown in FIG. 14, a core 3 and a cladding layer 4 are formed on a substrate 2 by a film forming process such as CVD. The substrate 2 is wavy due to stress generated during film formation and heat treatment for relieving the stress. The undulation radius R is 5 to 20 m.

  A large number of optical waveguides 5 are formed on the substrate 2 by the cores 3 having the same pattern and the clad layers 4 covering the cores 3, and the cover glass 7 is bonded on the clad layer 4 via the adhesive layer 6. Has been. By cutting the waveguide assembly 1 at a position indicated by a two-dot chain line in FIG. 14, waveguide devices divided one by one can be obtained.

However, when waviness is generated in the substrate 2 as in the waveguide assembly 1, the thickness t1 of the adhesive layer 6 located in the valley of the waviness is the thickness of the adhesive layer 6 located in the waviness peak. It becomes larger than t2. For this reason, the thickness of the adhesive layer 6 of each waveguide device varies in the range of several μm to 100 μm. Here, it was found that when the thickness of the adhesive layer 6 exceeds a certain level, the fluctuation amount of the optical power exceeds the allowable value.
Japanese Patent No. 3,289,266

  Accordingly, an object of the present invention is to provide an optical waveguide package with a small amount of fluctuation in optical power and a method for manufacturing the same.

  The present invention is an optical waveguide package having a waveguide device in which an optical waveguide is formed, and a fiber array bonded to an end face of the waveguide device, the waveguide device comprising: a first substrate; A core formed on the first substrate; a clad layer covering the core; a first cover glass overlaid on the clad layer; and a first cover glass and the clad layer that are bonded to each other. An adhesive layer, and the fiber array includes a second substrate, an optical fiber fixed to the second substrate, a second cover glass overlaid on the second substrate, and the second substrate. A second adhesive layer that adheres the substrate and the second cover glass, and the thickness of the first adhesive layer is 10 to 50 μm, more preferably 15 to 50 μm.

  In a preferred embodiment of the present invention, the thickness of the second adhesive layer is 10 to 50 μm, more preferably 15 to 50 μm. Further, the first substrate on which the optical waveguide is formed has undulations with a radius of curvature of 5 to 20 m.

  According to a first aspect of the present invention, there is provided a method of manufacturing an optical waveguide package according to the present invention, comprising: obtaining a waveguide assembly by forming a plurality of optical waveguides having the same pattern on a single substrate at an equal pitch; A step of obtaining a split piece including one optical waveguide by cutting the assembly between adjacent optical waveguides, and a photocurable adhesive layer having a thickness of 10 to 50 μm on the optical waveguide of the split piece. And obtaining a waveguide device by adhering a cover glass.

  According to a second aspect of the present invention, there is provided a method of manufacturing an optical waveguide package according to the present invention, comprising: obtaining a waveguide aggregate by forming a plurality of optical waveguides having the same pattern on a single substrate at an equal pitch; Cutting the aggregate between adjacent optical waveguides to obtain a split piece including a smaller number of optical waveguides than the number of optical waveguides included in the waveguide aggregate; and on the optical waveguides of the split pieces A step of obtaining a waveguide device assembly by adhering a cover glass via a photo-curing adhesive layer having a thickness of 10 to 50 μm, and cutting the waveguide device assembly between adjacent optical waveguides Thus, a step of obtaining one waveguide device divided by one is provided.

  According to a third aspect of the present invention, there is provided a method of manufacturing an optical waveguide package according to the present invention, comprising: obtaining a waveguide aggregate by forming a plurality of optical waveguides having the same pattern on a single substrate at an equal pitch; A waveguide device assembly is formed by adhering a cover glass having a curved surface corresponding to the undulation of the substrate of the assembly to the optical waveguide of the waveguide assembly via a photo-curing adhesive layer having a thickness of 10 to 50 μm. And a step of obtaining waveguide devices divided into one by cutting the waveguide device assembly between adjacent optical waveguides.

  According to a fourth aspect of the present invention, there is provided a method of manufacturing an optical waveguide package according to the present invention, comprising: obtaining a waveguide assembly by forming a plurality of optical waveguides having the same pattern on a single substrate at an equal pitch; On the pedestal having a curved surface corresponding to the undulation of the substrate of the waveguide assembly, a flat cover glass is laminated on the optical waveguide of the assembly with a photo-curing adhesive interposed therebetween. The waveguide assembly and the cover glass through the adhesive layer having a thickness of 10 to 50 μm by applying a load from above the cover glass and curing the adhesive. A step of obtaining a waveguide device assembly formed by bonding, and a step of obtaining a waveguide device divided into one by cutting the waveguide device assembly between adjacent optical waveguides. ing

  According to the optical waveguide package of the present invention, the amount of fluctuation of the optical power due to temperature change can be reduced, so that the optical characteristics are improved, and peeling of the bonded portion due to temperature change can be prevented.

  According to the method for manufacturing an optical waveguide package of the present invention, the adhesive layer can be made to have a desired thickness even when the substrate of the optical waveguide is wavy, and the fluctuation amount of optical power due to temperature change can be reduced. Can do.

An embodiment of the present invention will be described below with reference to FIGS.
An optical waveguide package 10 shown in FIG. 1 includes a housing 11 and an optical waveguide combined body 12 accommodated in the housing 11. The housing 11 includes a housing main body 11a made of, for example, a synthetic resin, and a lid 11b. The housing body 11a and the lid 11b may be machined metal.

  The housing main body 11a is formed with a coupling body accommodating portion 15 formed of a recess having a size capable of accommodating the optical waveguide coupling body 12. The lid 11b is superimposed on the housing main body 11a so as to cover the combined body accommodation portion 15, and is fixed to the housing main body 11a with an adhesive or the like.

  As shown in FIG. 2, the optical waveguide combination 12 includes a waveguide device 20 in which the optical waveguide 19 is formed, a first fiber array 21 bonded to one end of the waveguide device 20, and the waveguide device 20. And a second fiber array 22 bonded to the other end. The optical waveguide 19 is formed so that the multi-core waveguide core 19b branches from the single-core waveguide core 19a, and the light incident from the single-core waveguide core 19a is equally applied to the multi-core waveguide core 19b. Can be distributed.

  As shown in FIG. 3, the sealing material 25 is filled in the housing body 11a with almost no gap. When the sealing material 25 is cured inside the housing 11, the optical waveguide assembly 12 is sealed at a predetermined position in the housing body 11a. This sealing material 25 alleviates the influence of temperature changes and vibrations outside the housing 11 on the optical waveguide assembly 12.

  A portion of the waveguide device 20 is shown in FIG. The waveguide device 20 includes a first substrate 30 made of a quartz glass wafer, the cores 19a and 19b formed on the substrate 30, a clad layer 31 covering the cores 19a and 19b, and a first adhesive. A layer 32 and a first cover glass 33 are provided. The cores 19a and 19b are patterned into a predetermined shape through a film forming process such as CVD and etching such as RIE.

  The cover glass 33 is used to protect the optical waveguide 19 and increase the bonding area between the waveguide device 20 and the fiber arrays 21 and 22 when the waveguide device 20 is bonded to the fiber arrays 21 and 22.

  The first adhesive layer 32 is made of, for example, an acrylic-based radical curable ultraviolet curable resin, and fixes the clad layer 31 and the cover glass 33 to each other. The adhesive layer 32 may be, for example, a cation curable ultraviolet curable resin such as epoxy. The thickness T1 of the first adhesive layer 32 is adjusted to 10 to 50 μm for the reason described later.

  The refractive index of the optical waveguide 19 is 0.1 to several percent higher than the refractive indexes of the substrate 30 and the cladding layer 31. The refractive index of the cladding layer 31 is equivalent to that of quartz glass. When a silicon wafer is used for the substrate 30, before forming the optical waveguide 19, a lower cladding layer having a refractive index lower than that of the optical waveguide 19 is formed on the substrate 30, and a core is formed on the lower cladding layer. 19a and 19b are formed.

  FIG. 6 shows the result of measuring the loss fluctuation width when the thickness of the adhesive layer 32 is variously changed and a temperature cycle load is applied in the temperature range of [−40 ° C. to + 85 ° C.]. As shown in FIG. 6, it was found that when the thickness T1 of the adhesive layer 32 is 50 μm or less, the fluctuation amount (loss fluctuation width) of the optical power falls within the allowable value of 0.4 dB. Even when the silane coupling treatment was performed on the adhesive surface, the amount of fluctuation in optical power was hardly improved.

  When the thickness T1 of the adhesive layer 32 is less than 10 μm, the adhesive surface may peel off when the temperature changes from 20 ° C. to 85 ° C., and adheres to a temperature cycle of [−40 ° C. to + 85 ° C.]. Sometimes the surface could not withstand. If the thickness T1 of the adhesive layer 32 was 10 μm or more, such a problem did not occur.

  When the thickness of the adhesive layer 32 is 15 to 50 μm, the optical power after the lapse of the specified time is within ± 0.2 dB of the value before the test in the high temperature and high humidity storage test performed in an atmosphere of 85 ° C. and 85 RH. It was confirmed to fit. For these reasons, the thickness T1 of the adhesive layer 32 is 10 to 50 μm, more preferably 15 to 50 μm.

  A single-core optical fiber member 40 is attached to the first fiber array 21. The optical fiber member 40 includes a single optical fiber 41 and a covering material 42 that covers the optical fiber 41. The covering portion 40 a of the optical fiber member 40 (the portion covered with the covering material 42) is fixed to the substrate 51 of the fiber array 21 by the adhesive 43.

  As shown in FIG. 4, the first fiber array 21 includes a second substrate 51 in which a V-groove 50 is formed, a second cover glass 52, and a second adhesive layer 53. The second substrate 51 and the cover glass 52 are fixed to each other by the adhesive layer 53. For the same reason as the first adhesive layer 32, the thickness T2 of the second adhesive layer 53 is 10 to 50 μm, preferably 15 to 50 μm. The optical fiber 41 is positioned by a V-groove 50 formed in the substrate 51 and fixed to the substrate 51 by an adhesive layer 53.

  The first fiber array 21 configured as described above is bonded to one end face of the waveguide device 20 by a light curable adhesive having translucency. 1 and 2 indicates the joint. The distal end surface of the optical fiber 41 is optically connected to the waveguide core 19a of the waveguide device 20.

  As shown in FIGS. 1, 2 and 5, the second fiber array 22 includes a second substrate 55, a second cover glass 56, a second adhesive layer 57, and multi-core light. And a fiber member 60. For example, eight V-grooves 50 ′ are formed in the second substrate 55 in parallel with each other.

  The multi-core optical fiber member 60 includes a plurality of (for example, eight) optical fibers 61 arranged in parallel to each other, and a covering material 62 that covers these optical fibers 61. As shown in FIG. 5, the optical fiber 61 is positioned by accommodating the tip of the optical fiber 61 in the V groove 50 ′ of the substrate 55.

  The substrate 55, the cover glass 56, and the optical fiber 61 are fixed to each other by the second adhesive layer 57. The second adhesive layer 57 is made of a photo-curing adhesive similar to the first adhesive layer 32, and its thickness T2 is 10 to 50 μm for the same reason as the first adhesive layer 32, Preferably, it is adjusted to 15 to 50 μm. The covering portion 60 a (the portion covered with the covering material 62) of the optical fiber member 60 is fixed to the second substrate 55 by the adhesive 63 that is softer than the second adhesive layer 57.

  The second fiber array 22 configured as described above is bonded to the other end face of the waveguide device 20 with a light curable adhesive having translucency. 1 and 2 indicates the joint. The end face of each optical fiber 61 is optically connected to each waveguide core 19b of the waveguide device 20, respectively.

  The optical waveguide assembly 12 is accommodated in the housing body 11a as shown in FIG. Guide member accommodating portions 70 and 71 are formed at both ends of the housing body 11a, that is, at one end side and the other end side of the combined body accommodating portion 15, respectively. A spacer 72 (shown in FIG. 1) for positioning the optical waveguide assembly 12 may be provided between the bottom of the housing main body 11a and the optical waveguide assembly 12.

  A first elastic guide member 81 is accommodated in one guide member accommodating portion 70. The elastic guide member 81 is made of a material having rubber elasticity such as silicone. The elastic guide member 81 is formed with a fiber insertion hole 85 through which the single-core optical fiber member 40 can pass and a notch 86 through which the optical fiber member 40 can be inserted into the fiber insertion hole 85 from the peripheral surface side. Has been.

  An end portion 87 of the first elastic guide member 81 projects outward from an opening 88 on one end side of the housing 11. The end portion 87 has a tapered shape (for example, a truncated cone shape) that becomes narrower toward the tip end.

  A second elastic guide member 92 is accommodated in the other guide member accommodating portion 71. The elastic guide member 92 is made of the same material as the first elastic guide member 81. As shown in FIG. 1, the second elastic guide member 92 has a fiber insertion hole 95 into which the tape-shaped optical fiber member 60 can be inserted, and the optical fiber member 60 from the peripheral surface side of the elastic guide member 92 to the fiber. A notch 96 that can be inserted into the insertion hole 95 is formed.

  An end portion 97 of the second elastic guide member 92 projects outward from the opening 98 on the other end side of the housing 11. The end 97 has a tapered shape that becomes narrower toward the tip.

Next, a first embodiment of the manufacturing process of the waveguide device 20 will be described with reference to FIGS.
As schematically shown in FIG. 7, a plurality of optical waveguides 19 having the same pattern are formed on a single substrate 30 at an equal pitch, whereby a waveguide assembly 100 is obtained. In order to relieve the stress generated when the waveguide assembly 100 is formed, heat treatment is performed at a temperature of about 1000 ° C. In this waveguide assembly 100, undulation is generated by the stress generated when the optical waveguide 19 is formed or by the heat treatment. The curvature radius R of the swell is 5 to 20 m.

  By cutting this waveguide assembly 100 between the optical waveguides 19 adjacent to each other as shown by, for example, a two-dot chain line in FIG. 7, the number of waveguide assemblies 100 is smaller (about 1 to 5). A segment 100a (FIG. 8) including the optical waveguide 19 is obtained.

  A photocurable liquid adhesive is supplied between the divided piece 100a and the cover glass 33, and the adhesive is cured by irradiating with ultraviolet rays. The thickness of the adhesive layer 32 is controlled to 10 to 50 μm. The cover glass 33 is fixed to the clad layer 31 by the adhesive layer 32. When the split piece 100a includes only one optical waveguide 19, the cover glass 33 is bonded to the split piece 100a, and then the light incident surface and the light exit surface are polished.

  As shown in FIG. 9, in the case of a split piece 100a including two or more optical waveguides 19, a position indicated by a two-dot chain line is a waveguide device assembly 20 ′ formed by bonding a cover glass 33 to the split piece 100a. The waveguide device 20 divided into one by one is obtained. After that, the light incident surface and the light exit surface of the waveguide device 20 are polished.

  As described above, the flat cover glass 33 is bonded to the divided piece 100 a including one or several optical waveguides 19 by the adhesive layer 32. By carrying out like this, it can suppress that the thickness of the adhesive bond layer 32 varies, and thickness T1 of the adhesive bond layer 32 can be controlled in the range of 10-50 micrometers. As shown in FIG. 7, when the curvature radius R of the undulation is 5 to 20 m, if the total length of the plurality of optical waveguides 19 is about 22 mm, the thickness T1 of the adhesive layer 32 may be 50 μm or less. it can.

  The fiber arrays 21 and 22 are joined to the waveguide device 20 obtained by the above process. For example, after positioning the waveguide cores 19a and 19b of the waveguide device 20 and the fiber arrays 21 and 22 using an aligner, the fiber arrays 21 and 22 are bonded to the end face of the waveguide device 20 with an adhesive. Join.

Below, 2nd Embodiment of the manufacturing method of the waveguide device 20 is described with reference to FIG. 10 and FIG.
As schematically shown in FIG. 10, a plurality of optical waveguides 19 having the same pattern are formed on a single substrate 30 at an equal pitch, whereby a waveguide assembly 100 is obtained. In the present embodiment, a cover glass 33 having a curved surface 33a corresponding to the undulation of the waveguide assembly 100 is used.

  As shown in FIG. 11, a waveguide device assembly 20 ′ including a plurality of optical waveguides 19 is obtained by bonding a cover glass 33 to the waveguide assembly 100 via an adhesive layer 32. After that, this waveguide device assembly 20 ′ is cut at a position indicated by a two-dot chain line in FIG. 11 to obtain one waveguide device 20 divided by one.

  As in the second embodiment, the thickness variation of the adhesive layer 32 can be reduced by stacking the cover glass 33 having the curved surface 33a corresponding to the undulation of the waveguide assembly 100, The thickness of the adhesive layer 32 can be controlled in the range of 10 to 50 μm.

Below, 3rd Embodiment of the manufacturing method of the waveguide device 20 is described with reference to FIG. 12 and FIG.
Similar to the second embodiment, a plurality of optical waveguides 19 having the same pattern are formed on a single substrate 30 at an equal pitch, whereby a waveguide assembly 100 is obtained. In the present embodiment, a pedestal 110 having a curved surface 110 a corresponding to the undulation of the waveguide assembly 100 and a flat cover glass 33 are used.

  As shown in FIG. 13, the waveguide assembly 100 is placed on a pedestal 110 having a curved surface 110 a, a load is applied from above the cover glass 33 by the pressing member 111, and the waveguide assembly is interposed via the adhesive layer 32. By bonding the body 100 and the cover glass 33, the waveguide device assembly 20 ′ is obtained. The thickness T1 of the adhesive layer 32 is 10 to 50 μm, more preferably 15 to 50 μm. By cutting this waveguide device aggregate 20 ′ between the optical waveguides 19 adjacent to each other, the waveguide devices 20 divided into one by one are obtained.

  As in the third embodiment, the thickness of the adhesive layer 32 can be controlled in the range of 10 to 50 μm by using the pedestal 110 having the curved surface 110a and applying a load to the cover glass 33. It is.

  In carrying out this invention, the first substrate constituting the waveguide device, the core, the clad layer, the first cover glass, the first adhesive layer, the second substrate constituting the fiber array, the light It goes without saying that the constituent elements such as the fiber, the second cover glass, and the second adhesive layer can be variously changed without departing from the gist of the present invention.

The disassembled perspective view of the optical waveguide package which shows one Embodiment of this invention. FIG. 2 is a plan view of an optical waveguide combination of the optical waveguide package shown in FIG. 1. The perspective view of the state which filled the optical waveguide package shown by FIG. 1 with the sealing material. The perspective view which shows a part of waveguide device and 1st fiber array of the optical waveguide package shown by FIG. Sectional drawing of the 2nd fiber array which follows the F5-F5 line | wire in FIG. The figure which shows the relationship between the adhesive agent thickness of the optical waveguide coupling body in the optical waveguide package shown by FIG. 1, and a loss fluctuation range. Sectional drawing which shows typically the waveguide assembly in which the wave | undulation produced. Sectional drawing which shows the division piece and cover glass of the waveguide aggregate | assembly shown by FIG. FIG. 9 is a cross-sectional view of a state in which the divided pieces of the waveguide assembly shown in FIG. Sectional drawing which shows typically the waveguide aggregate | assembly in which the wave | undulation produced, and the cover glass which has a curved surface. FIG. 11 is a cross-sectional view showing a state where the waveguide assembly and the cover glass shown in FIG. 10 are bonded by an adhesive layer. Sectional drawing which shows typically the waveguide aggregate | assembly in which the wave | undulation produced, and the base which has a curved surface. FIG. 13 is a cross-sectional view of a state in which the waveguide assembly and the cover glass illustrated in FIG. 12 are bonded by an adhesive layer. Sectional drawing of the state by which the conventional waveguide assembly and the cover glass were adhere | attached by the adhesive bond layer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Optical waveguide package 12 ... Optical waveguide coupling body 19 ... Optical waveguide 20 ... Waveguide device 20 '... Waveguide device assembly 21, 22 ... Fiber array 30 ... 1st board | substrate 31 ... Cladding layer 32 ... 1st adhesion | attachment Agent layer 33 ... first cover glass 41 ... optical fiber 51 ... second substrate 52 ... second cover glass 53 ... second adhesive layer 55 ... second substrate 56 ... second cover glass 57 ... first 2 adhesive layers 61 ... optical fiber 100 ... waveguide assembly 100a ... divided piece 110 ... pedestal

Claims (7)

A waveguide device in which an optical waveguide is formed;
A fiber array bonded to the end face of the waveguide device;
An optical waveguide package comprising:
The waveguide device is:
A first substrate;
A core formed on the first substrate;
A cladding layer covering the core;
A first cover glass overlaid on the cladding layer;
A first adhesive layer that bonds the first cover glass and the cladding layer;
Have
The fiber array is
A second substrate;
An optical fiber fixed to the second substrate;
A second cover glass overlaid on the second substrate;
A second adhesive layer for bonding the second substrate and the second cover glass;
Have
An optical waveguide package, wherein the first adhesive layer has a thickness of 10 to 50 μm.   The optical waveguide package according to claim 1, wherein the second adhesive layer has a thickness of 10 to 50 μm.   3. The optical waveguide package according to claim 1, wherein the first substrate on which the optical waveguide is formed has undulations having a curvature radius of 5 to 20 m. Obtaining a waveguide aggregate by forming a plurality of optical waveguides of the same pattern on a single substrate at an equal pitch; and
Obtaining a split piece including one optical waveguide by cutting the waveguide aggregate between adjacent optical waveguides;
A step of obtaining a waveguide device by adhering a cover glass on the optical waveguide of the divided piece via a photocurable adhesive layer having a thickness of 10 to 50 μm;
An optical waveguide package manufacturing method characterized by comprising: Obtaining a waveguide aggregate by forming a plurality of optical waveguides of the same pattern on a single substrate at an equal pitch; and
Cutting the waveguide assembly between adjacent optical waveguides to obtain a split piece including a smaller number of optical waveguides than the number of optical waveguides included in the waveguide assembly;
A step of obtaining a waveguide device assembly by adhering a cover glass on the optical waveguide of the divided piece via a photocurable adhesive layer having a thickness of 10 to 50 μm;
Cutting the waveguide device assembly between adjacent optical waveguides to obtain a waveguide device divided into one piece;
An optical waveguide package manufacturing method characterized by comprising: Obtaining a waveguide aggregate by forming a plurality of optical waveguides of the same pattern on a single substrate at an equal pitch; and
A waveguide is formed by adhering a cover glass having a curved surface corresponding to the undulation of the substrate of the waveguide assembly to the optical waveguide of the waveguide assembly through a photo-curing adhesive layer having a thickness of 10 to 50 μm. Obtaining a device aggregate;
Cutting the waveguide device assembly between adjacent optical waveguides to obtain a waveguide device divided into one piece;
An optical waveguide package manufacturing method characterized by comprising: Obtaining a waveguide aggregate by forming a plurality of optical waveguides of the same pattern on a single substrate at an equal pitch; and
On the pedestal having a curved surface corresponding to the undulation of the substrate of the waveguide assembly, a flat cover glass is laminated on the optical waveguide of the waveguide assembly with a photocurable adhesive interposed therebetween. A step of placing the waveguide assembly;
A waveguide formed by adhering the waveguide assembly and the cover glass through an adhesive layer having a thickness of 10 to 50 μm by applying a load from above the cover glass and curing the adhesive. Obtaining a device aggregate;
Cutting the waveguide device assembly between adjacent optical waveguides to obtain a waveguide device divided into one piece;
An optical waveguide package manufacturing method characterized by comprising:

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