JP2005147956A - Electron beam irradiation unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce complexity of deflection control work, increase in aberration of electron beam, effect to resolution and instability of electron beam. <P>SOLUTION: A differential pumping float head 4 non-contact floating the front part of an electron beam emission hole 26 from an electron beam irradiator 3 and restrictively holding in vacuum has a vacuum seal valve 31 opening and closing an electron beam transmission hole 30. The vacuum seal valve 31 forms an open state in which the electron beam transmission hole 30 of the differential evacuation float head 4 and an arrange state arranging an electron beam transmission hole 32 with smaller inner diameter than that of the electron beam emission hole 26 and the electron beam transmission hole 30 of the differential pumping float head 4, in a light path position of the electron beam 2. The diameter of the electron beam transmission hole 30 is made sufficiently large. When the optical axis of the electron beam is controlled, the electron beam position is controlled with a parallel movement control of the optical axis by opening the vacuum seal valve 31 and making the margin large. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electron beam irradiation apparatus, for example, an electron beam exposure apparatus, a fine processing apparatus using electron beam irradiation, an electron beam irradiation apparatus applied to a scanning electron microscope observation apparatus, and the like.

In recent years, with the development of miniaturization technology, development of microfabrication apparatuses using short-wavelength light such as ultraviolet rays or electron beams has been actively performed.
With respect to ultraviolet light, development of an ultraviolet irradiation apparatus capable of processing a minute dimension of about 100 nm by using near-field light with an objective lens having a numerical aperture (NA) of 1 or more is underway.

On the other hand, development of a drawing apparatus by electron beam exposure has been actively promoted as a further miniaturization means.
Among them, one of the electron beam lithography systems that has been effective in recent years is that the electron beam emitted from the electron beam irradiation device body (column) is locally exhausted only in the vicinity of the passage. A proposal has been made of an electron beam irradiation apparatus that is evacuated (Patent Document 1).
In this type of apparatus, as shown in FIG. 9, the schematic configuration is shown, and in FIG. 10, the schematic cross-sectional view of the main part of FIG. Until the beam 2 reaches the electron beam irradiation body, a static pressure type is used for maintaining the degree of vacuum in the electron beam path so as not to cause electron scattering, for example, about 10 ⁻³ Pa. A differential exhaust flying head 4 is provided.

The differential exhaust flying head 4 is coupled to the electron beam irradiation apparatus main body 1 by an expansion / contraction coupling mechanism 5 so as to be movable in the axial direction of the electron beam irradiation apparatus main body 1, and differentially exhausted from the electron beam irradiation apparatus main body 1. Airtightness with the flying head 4 is maintained.
The electron beam irradiation apparatus main body 1 includes an electron gun 11, a first condenser lens 12, a structure portion (hereinafter simply referred to as an aperture) 13 having an electron beam transmission aperture in the center, a second condenser lens 14, and an electron beam in the center. Blanking aperture structure (hereinafter referred to as blanking aperture) 15 having a transmissive aperture, a first scanning coil 16 and a first micro scanning coil 16s, a second scanning coil 17 and a second micro coil, and an objective forming an objective lens It has a lens coil 18 and the like.
Further, a vacuum maintaining ring 25 having an electron beam radiation hole 26 at the center is fitted to the tip of the objective lens 18 of the electron beam irradiation apparatus main body 1.
The electron beam irradiation apparatus main body 1 is evacuated to a high vacuum by a vacuum pump (not shown).

  The differential exhaust flying head 4 has an electron beam transmission hole 19 at the center, and first and second gases respectively opened on the outer surface of the differential exhaust flying head 19 on the surface facing the electron beam irradiation body 3 disposed on the support 20. The suction ports 21 and 22 and the gas supply port 24 having the ventilation pad 23 are disposed, for example, intermittently. The first and second gas suction ports 21 and 22 are connected to a vacuum pump to forcibly exhaust, and a compressed gas supply source is coupled to the gas supply port 24.

In this configuration, the differential exhaust levitation head 4 is subjected to the electron beam irradiation body by the differential pressure by selecting the suction from the first and second gas suction ports 21 and 22 and the gas supply from the gas supply port 24. 3 so as to float with a gap G of several μm, for example, 5 μm, that is, in a non-contact manner.
At the same time, a vacuum seal is made by suction, that is, exhaust, from the gap space between the differential exhaust flying head 4 and the electron beam irradiation body 2 by the first and second gas suction ports 21 and 22. A vacuum is formed in the vicinity of the electron beam transmission hole 19 inside the arrangement portion.

In the electron beam irradiation apparatus having this configuration, the differential exhaust floating head 4 and the electron beam irradiation body 3 are configured to face each other in a non-contact manner with a minute interval. The relative transition with the beam irradiation body is smoothly performed, and at the same time, the risk of scratching the surface of the electron beam irradiation body, for example, a photoresist film formed on the surface, for example, for performing electron beam exposure, is avoided. .
Further, the electron beam path emitted from the main body of the electron beam irradiation apparatus is limited to a high vacuum without being held in an overall vacuum including the electron beam irradiation body as in the conventional general electron beam irradiation apparatus. Therefore, a large vacuum chamber such as in conventional electron beam drawing or a scanning line electron microscope is not necessary. Accordingly, the occupied area and the occupied space are reduced, and the evacuation time is shortened.

However, in an electron beam irradiation apparatus having a differential exhaust floating head, a local vacuum system that realizes a high vacuum by using a differential exhaust floating head only in an electron beam irradiation area, for example, an exposure area, or a high speed, for example, is adopted. In order to realize the exposure, the electron beam is turned on / off, for example, by adopting a high-speed blanking mechanism such as a blanking aperture 15 shown in FIG. 9, compared to an electron microscope or an electron beam drawing apparatus in semiconductor manufacturing, There is a problem that the position adjustment of the electron beam axis, that is, the alignment becomes extremely complicated, and the operation takes a long time.
Further, the problem is that the aberration of the electron beam occurs, and there is a problem that alignment for avoiding the occurrence of this aberration is extremely difficult.

That is, in an ordinary electron beam irradiation apparatus based on the all vacuum method, not based on the local vacuum method, the electron beam from the objective lens is directly irradiated onto the electron beam irradiation body. In the case of the local vacuum method shown in FIG. 1, there is a great difference in passing the electron beam transmission hole 19 of the differential exhaust flying head.
That is, the alignment of the electron beam axis in a normal electron beam irradiation apparatus is, for example, in the example of FIG. 9, the mechanical emission direction of the electron beam from the electron gun 1, the condenser lens 12, the aperture 13, the condenser lens 14, and blanking. Adjustment is performed with the aperture 15 and the objective lens coil 18 constituting the objective lens.
Since the inner diameter Φ1 on the exit end side of the objective lens is, for example, 5 mm, the electron beam irradiating device main body can form an electron beam profile with sufficiently small aberrations even when the assembly accuracy of the respective electron lenses is taken into consideration. .

  However, with respect to the local vacuum system in which the differential exhaust flying head 4 is provided, the orifice of the vacuum maintaining ring having an inner diameter Φ of, for example, 0.5 nm to 2.0 nm, for example 0.8 mm, after the objective lens (in FIG. The beam radiation hole 26) and the electron beam transmission hole 19 of the differential exhaust flying head 4 need to pass through. By the way, the inner diameter Φ2 of the electron beam transmission hole 19 is, for example, as compared with the case where the inner diameter Φ1 of the objective lens is 5 mm as described above so that the vacuum sealing by the differential exhaust flying head can be performed satisfactorily. For example, a small diameter of 1 mm is selected.

Therefore, as shown in FIG. 11, when the original emission beam axis of the electron beam from the electron beam irradiation apparatus main body does not coincide with the electron beam transmission hole 19, the electron beam is narrowed or the beam optical path is deflected. Adjustment is made to pass through the electron beam transmission hole 26 by the method.
However, in practice, since there is a limit to narrowing the beam, the electron beam 2 is normally transmitted through the beam transmission hole 19 by deflecting the beam optical path.

  However, in this case, since the electron beam alignment range is narrow, the electron beam does not pass through the center of each lens, an off-axis aberration is generated, or each aperture or lens is incident obliquely. In addition, the amount of collision of electrons with the lens components increases, and a large amount of electrons are reflected, causing instability of the electron beam. In addition, this collision causes many problems such as contamination, ie, an increase in contaminants (mainly carbon deposition).

By the way, in the electron beam irradiation apparatus having the differential exhaust floating head, the differential exhaust floating head is vacuum-sealed by so-called cooperation with the electron beam irradiation body. In an exchange operation or the like, in a state where the electron beam irradiation body is not opposed to the differential exhaust flying head, the vacuum sealing effect cannot be obtained, the degree of vacuum in the electron beam irradiation apparatus main body 1 is lowered, and the electron gun 11 Inconveniences such as deterioration of the cathode and damage to the exhaust means of the electron beam irradiation apparatus main body occur.
In order to avoid such an inconvenience, an electron beam irradiation apparatus has been proposed in which a valve for opening and closing the electron beam transmission hole 19 is provided in the differential exhaust flying head (see, for example, Patent Document 2).

JP 2001-242300 A, JP 2002-257998 A

  In the present invention, an electron beam emitted from the electron beam irradiation apparatus main body is allowed to pass through the electron beam transmission hole of the above-described differential exhaust floating head in the local vacuum type electron beam irradiation apparatus having the differential exhaust floating head. Condensation work due to deflection adjustment of condenser lenses and objective lenses, problems of working time, work time problems, increased electron beam aberration, effects on resolution, contamination problems due to use outside the proper range of deflection adjustment It is an object of the present invention to provide an electron beam irradiation apparatus that solves or reduces the problem of instability of an electron beam.

  That is, in the present invention, in the electron beam irradiation apparatus having the differential exhaust floating head, the opening / closing valve, that is, the vacuum sealing valve, is specially configured in the differential exhaust floating head. It is a solution.

  An electron beam irradiation apparatus according to the present invention includes an electron beam irradiation apparatus main body having an electron beam emission hole, a differential exhaust flying head formed with an electron beam transmission hole facing the electron beam emission hole, and the differential exhaust floating An electron beam irradiation body supporting the electron beam irradiation body so as to face the head, and the differential exhaust floating head moves the differential exhaust floating head by the static pressure differential exhaust. A vacuum seal that floats in a non-contact manner from the beam irradiation body and that holds the front portion of the electron beam emission hole in a limited vacuum is configured, and the differential exhaust flying head includes the electron beam transmission hole. The vacuum sealing valve has an inner diameter of the electron beam emitting hole of the electron beam irradiation apparatus main body and the electron beam transmitting hole of the differential exhaust flying head. At least a small-diameter electron beam passage hole, and this vacuum sealing valve has an open state in which the electron beam transmission hole of the differential exhaust flying head is opened, and the small-diameter electron beam passage hole has the electron beam irradiation device. And an arrangement state in which the electron beam is arranged in the optical path position of the electron beam from the main body.

  Further, the present invention is the above-mentioned electron beam irradiation apparatus, wherein the vacuum sealing valve has an open state in which an electron beam transmission hole of the differential exhaust flying head is opened during fine adjustment of the electron beam; When irradiating the electron beam irradiation body with the electron beam, the electron beam irradiation device has an electron beam passing hole having an inner diameter smaller than the inner diameter of the electron beam emitting hole of the electron beam irradiation device main body and the electron beam transmission hole of the differential exhaust flying head. And an arrangement state in which the electron beam is arranged in the optical path position of the electron beam from the main body.

  Further, the present invention is the above-described electron beam irradiation apparatus, wherein in the vacuum sealing valve, a relative position between the differential exhaust floating head and the electron beam irradiation body is a non-facing position. In some cases, the electron beam transmission hole of the differential exhaust flying head is closed.

  In the present invention, the vacuum sealing valve has a moving body having an electron beam passage hole, and the inner diameter of the electron beam passage hole of the moving body is such that the inner diameter of the electron beam irradiation apparatus main body The electron beam irradiation device is selected to be smaller than the inner diameter of the electron beam transmitting hole of the differential exhaust flying head, and the electron beam passing hole is adjusted by adjusting the position of the moving body when the electron beam irradiation body is irradiated with the electron beam irradiation body. It is characterized by being arranged in the optical path position of the electron beam from the main body.

  Further, the present invention provides the vacuum sealing valve at a predetermined movement position of the movable body when the relative position between the differential exhaust flying head and the electron beam irradiation body is a non-opposing position. The electron beam transmission hole of the differential exhaust flying head is closed.

Further, according to the present invention, the vacuum sealing valve has a moving body having at least first and second electron beam passage holes having different inner diameters, and the first electron beam passage hole of the vacuum sealing valve has the The inner diameter is selected to be smaller than the inner diameter of the electron beam emitting hole of the electron beam irradiation apparatus body and the electron beam transmitting hole of the differential exhaust flying head, and the second electron beam passage hole is formed on the differential exhaust flying head. The second electron beam passage hole is selected to be equal to or larger than the electron beam transmission hole, and at the predetermined movement position of the movable body during the fine adjustment of the electron beam, the second electron beam passage hole is transmitted through the differential exhaust flying head. Opposite the hole, the electron beam transmission hole is opened, and when the electron beam is irradiated onto the electron beam irradiation body, the first electron beam passage hole is moved through the first electron beam passage hole by adjusting the position of the moving body. Characterized in that it is configured to be disposed in an optical path position of the electron beam from the beam irradiation system main unit.
Further, according to the present invention, the above-described vacuum sealing valve having the first and second electron beam transmission holes is such that the relative position between the differential exhaust floating head and the electron beam irradiation body is a non-facing position. In this case, the electron beam transmitting hole of the differential exhaust flying head is closed at a predetermined movement position of the moving body.

  The electron beam irradiation apparatus according to the present invention is configured to float in a non-contact manner with respect to the electron beam irradiation body by the differential exhaust flying head and to locally vacuum seal the front part of the electron beam emitting portion. However, by providing a vacuum sealing valve that opens and closes the electron beam transmission hole of the differential exhaust flying head, the electron beam irradiated body with respect to the differential exhaust flying head, for example, in replacement work of the electron beam irradiated body, etc. In the state where the two are not opposed to each other, the electron beam transmission hole of the differential exhaust floating head can be blocked, and the cathode damage described at the beginning, which is caused by sucking outside air into the electron beam irradiation apparatus main body, and therefore, the lifetime is reduced. Etc. can be avoided.

  In particular, according to the configuration of the present invention, by providing a vacuum sealing valve on the differential exhaust flying head, a difference can be obtained during fine adjustment of the electron beam, particularly fine adjustment of the axial center position, and further fine adjustment such as focusing. Since the electron beam transmission hole of the dynamic exhaust flying head can be opened, the electron beam axis adjustment margin can be increased by selecting the electron beam transmission hole of the differential exhaust flying head sufficiently large. be able to. That is, as described with reference to FIG. 11, the electron beam is not deflected as in the case where the electron beam is transmitted through a narrow electron transmission hole, as shown in FIG. While maintaining a parallel relationship with the mechanical central axis OO of the main body, that is, by fine adjustment by parallel movement, a small-diameter electron beam passage hole of the vacuum sealing valve is formed on the axis of the electron beam subjected to this axis adjustment. The electron beam irradiation can be performed without obstructing the vacuum seal.

  Therefore, in the above-described conventional structure, the work complexity, work time problem, increase of electron beam aberration, influence on resolution associated with deflection adjustment are improved, and use outside the proper range of deflection adjustment is also possible. Apertures of each part caused by being avoidable and oblique incidence on the coils constituting the objective lens are avoided, thereby reducing the contamination, the irradiation position of the electron beam, inducing instability and the like.

When the electron beam irradiation object is irradiated with the electron beam for the purpose, a small electron beam passage hole is formed by the vacuum sealing valve, so that electrons to the electron beam irradiation object can be formed with high resolution. Beam irradiation can be performed.
Further, by adopting a structure with a moving body in which an electron beam passage hole is formed as the vacuum sealing valve structure, it is possible to substantially open and close the electron beam passage and control its diameter with a simple structure.

An embodiment of an electron beam irradiation apparatus according to the present invention will be described.
The electron beam irradiation apparatus according to the present invention includes an electron beam irradiation apparatus body 1, a differential exhaust flying head 4, And an electron beam irradiation body support 20 that holds the beam irradiation body 3.

The support 20 is configured to rotate about an axis Om-Om parallel to the axis of the electron lens system of the electron beam irradiation apparatus body 1 and is orthogonal to the axis Om-Om. Is disposed on a movable moving stage 100.
On the moving stage 100, an electron beam adjusting substrate support 120 for supporting the electron beam adjusting substrate 103 so as to be juxtaposed with the electron beam irradiation body 3 with a small gap is provided, for example, in the above-described axial center. For example, the expansion means 102 is arranged via a bellows so as to be movable in the Om-Om direction. The height of the support 120 is adjusted by the expansion / contraction means 102, and the height difference between the electron beam adjusting substrate 103 and the electron beam irradiation body 3 is set to be within 1 μm.

The electron beam irradiator 3 is, for example, a silicon substrate coated with a photoresist layer for performing a required pattern exposure by an electron beam for forming a master disk of a stamper for forming an optical disk, or the like according to the purpose of electron beam irradiation. A substrate or the like.
The electron beam adjusting substrate 103 is engraved with a fine pattern, for example, 0.2 μmL / S (line and space), 0.2 μm hole, or the like, in order to perform electron beam axis adjustment, objective lens adjustment, and the like. A substrate is used. The electron beam adjusting substrate 103 is preferably a substrate that is minimally charged by electron beam irradiation. For example, it can be constituted by a metal substrate made of Ni, Pt or the like. Alternatively, a semiconductor silicon substrate can be used. Further, in order to prevent charging in the adjustment substrate, grounding is performed for improving electrical continuity.

  The differential exhaust levitation head 4 is coupled to the electron beam irradiation apparatus main body 1 so as to be movable in the axial direction of the electron beam irradiation apparatus main body 1 by a telescopic coupling mechanism 5 having a bellows configuration, for example. And the differential exhaust flying head 4 are kept airtight.

The main body 1 of the electron beam irradiation device includes an electron gun 11, a first condenser lens 12, an aperture 13, a second condenser lens 14, a blanking aperture 15, a first scanning coil 16, a first micro scanning coil 16s, The two scanning coils 17, the second minute coil 17 s, the coils constituting the objective lens 18 that forms the objective lens, and the like are arranged on the same axis OO.
The central hole of the objective lens 18 is an electron beam emission hole 26. The diameter Φ1 of the electron beam emission hole 26 is, for example, 5 mm.
The inside of the electron beam irradiation apparatus main body 1, that is, the inside of the housing is evacuated to a high vacuum by a vacuum pump (not shown).

For example, as shown in FIG. 2, the differential exhaust flying head 4 has an electron beam transmission hole 30 facing the electron beam emission hole 26 on a central axis that coincides as much as possible with the axis OO of the electron beam irradiation apparatus main body 1. Have And the 1st and 2nd gas suction opening 21 and 22 opened to the opposing surface with the to-be-electron beam irradiation body 3 arrange | positioned at the support body 20 of the outer periphery, and the gas supply port 24 which has the ventilation pad 23 are provided. These are respectively arranged intermittently on the respective concentric circles centering on the central axis of the differential exhaust flying head.
These first and second gas suction ports 21 and 22 are forcibly exhausted by connecting exhaust means (not shown), respectively, and a compressed gas supply source is coupled to the gas supply port 24 and required. A gas, for example, an inert gas is ejected to the electron beam irradiation body 3 through the ventilation pad 23 at a flow rate of.

The first and second gas suction ports 21 and 22 can obtain a high degree of vacuum through a vent hole passing through the inside of the differential exhaust floating head, for example, 10 ⁻⁸ Pa such as a cryopump, a turbo molecular pump, and an ion sputtering pump. The evacuation means having the vacuum capability of FIG. 1 is evacuated to evacuate the electron beam passage to about 1 × 10 ⁻⁴ Pa.
With respect to the degree of vacuum at the gas suction ports 21 and 22, higher suction is performed toward the suction port closer to the electron beam transmission hole 30. For example, in the illustrated example, the first gas suction port 21 has a vacuum degree of about 1 × 10 ⁰ Pa, and the second gas suction port 22 has a vacuum degree of about 1 × 10 ² Pa. Connect means.

On the other hand, a compressed gas supply source is connected to a gas supply port 24 provided with a ventilation pad 23 as a static pressure levitation means through a vent hole passing through the differential exhaust levitation head 4. This compressed gas is supplied at 5 × 10 ⁵ Pa, for example. As this gas, it is desirable to use nitrogen or an inert gas and lightweight helium (He), neon (Ne), argon (Ar)).

In this configuration, the differential exhaust levitation head 4 faces the differential exhaust pressure head 4 by the selection of the suction from the first and second gas suction ports 21 and 22 and the gas supply from the gas supply port 24. From the surface of the electron beam adjusting substrate 103 or the electron beam irradiation body 3 to be arranged, it floats with a gap G of several μm, for example, 5 μm, that is, is opposed in a non-contact manner.
At the same time, a vacuum seal is made by suction, that is, exhaust, from the gap space between the differential exhaust flying head 4 and the electron beam irradiation body 2 by the first and second gas suction ports 21 and 22. The vicinity of the electron beam transmission hole 30 inside the arrangement portion 21 and 22, that is, the electron beam passage is evacuated.

  Although the inner diameter of the electron beam transmitting hole 30 of the differential exhaust flying head 4 can be somewhat smaller than the inner diameter Φ1 of the electron beam emitting hole 26 of the electron beam irradiation apparatus main body 1, It is preferable that the inner diameter is equal to or larger than, for example, 5 mm.

In the differential exhaust flying head 4, a vacuum sealing valve 31 that opens and closes the electron beam transmission hole 30 is disposed.
The vacuum sealing valve 31 has an open state in which the electron beam transmission hole 30 of the differential exhaust flying head 4 is opened, a closed state, and the electron beam transmission hole 30 substantially smaller than the opening diameter Φ2. It is set as the structure which takes a state.
The vacuum sealing valve 31 has a width larger than the opening diameter Φ2 of the electron beam transmission hole 30 of the differential exhaust flying head 4 and is movable along the Y direction perpendicular to the axis of the electron beam transmission hole 30. For example, it can be configured by a bar-shaped moving body that can be moved minutely in the X direction orthogonal to the axial direction and the Y direction.

The vacuum sealing valve 31 is selected to have a diameter Φ3 of, for example, 1 mm, which is sufficiently smaller than the diameter Φ2 of the electron beam transmission hole of the differential exhaust floating head 4 described above, for example, as shown in FIGS. For example, one electron beam transmission hole 32 is formed.
Alternatively, as shown in FIGS. 5 to 7, the vacuum sealing valve 31 includes the first electron beam transmission hole 32 having the above-described diameter Φ3 and the inner diameter of the electron beam transmission hole 30 of the differential exhaust flying head 4, for example. The second electron beam passage hole 33 has an inner diameter Φ4 that is equal to or larger than Φ2.
2 to 7, parts corresponding to those in FIG.

Next, the operation of the above-described electron beam irradiation apparatus of the present invention will be described.
First, an electron beam irradiation apparatus having a configuration in which the vacuum sealing valve 31 has one electron beam passage hole 32 having a small diameter Φ2 described above will be described with reference to FIGS.
2, 3, and 4 respectively show the main part of the electron beam irradiation apparatus of the present invention in the finely adjusted state of the electron beam, the closed state of the vacuum sealing valve 31, and the electron beam irradiation state to the electron beam irradiation body 3. A schematic sectional view is shown.

First, as shown in FIG. 2, the electron beam 2 is adjusted. At this time, the moving stage 100 described in FIG. 1 is moved, and the electron beam adjusting substrate 101 is disposed at a position facing the differential exhaust flying head 4.
Electron beam adjustment is performed mainly by adjusting the irradiation position of the electron beam using the adjustment substrate 101 described above. For example, relative position adjustment, focusing adjustment, depth adjustment, etc. with respect to the axis OO of the electron beam irradiation apparatus main body 1 are performed.

After this adjustment, as shown in FIG. 3, the vacuum sealing valve 31 is moved to a predetermined position to close the electron beam transmission hole 30. In this way, the differential exhaust flying head 4 and the electron beam irradiation apparatus main body 1 are shut off from the outside.
Thereafter, the moving stage 100 is moved, and the target electron beam irradiation body 3 is replaced with the electron beam adjusting substrate 101 at a predetermined position facing the differential exhaust flying head 4 as shown in FIG. And place it.
Thereafter, as shown in FIG. 8, the vacuum sealing valve 31 is finely adjusted in the X and Y directions so that the axial center position of the electron beam 2 adjusted earlier and the central axis of the first electron beam transmission hole 32 are adjusted. The electron beam irradiation body 3 is irradiated with an electron beam.
At this time, the support 20 is rotated, and the electron beam 2 from the electron beam irradiation apparatus main body 1 is scanned on the electron beam irradiation body 3 by moving the moving stage 100 in the Y direction.
Thereafter, the vacuum sealing valve 31 shown in FIG. 3 is closed and the electron beam irradiation body 3 is moved and exchanged, and the next electron beam irradiation operation is performed.

In the example described with reference to FIGS. 2 to 4, the vacuum sealing valve 31 has only a small electron beam passage hole 32. As described above, the first and second electron beam passage holes are used. It can also be set as the structure provided with 32 and 33. FIG.
5, 6, and 7 correspond to FIGS. 2, 3, and 4 described above when the vacuum sealing valve 31 having the first and second electron beam passage holes 32 and 33 is used. 2 is a schematic cross-sectional view of the main part of the electron beam irradiation apparatus of the present invention in a finely adjusted state of the electron beam to be performed, a closed state of the vacuum sealing valve 31 and an electron beam irradiation state to the electron beam irradiation body 3. In this case, as shown in FIG. 5, the second electron beam transmission hole 33 opens the electron beam transmission hole 30 of the differential evacuation floating head 4 by the vacuum sealing valve 31 in a finely adjusted state of the electron beam. In other cases, operations and operations similar to those described with reference to FIGS. 2 to 4 are performed.

As described above, in the electron beam irradiation apparatus according to the present invention, as described with reference to FIGS. 2 and 5, the electron beam transmission hole 30 of the differential exhaust flying head 4 having a large diameter is opened and the electrons are opened. Since the beam is finely adjusted, as shown in FIG. 8, for example, due to an assembly error, the axis of the lens system or the like in the electron beam irradiation apparatus main body 1 is shifted, and the electron beam irradiation apparatus main body 1 and the differential exhaust surface rise. Even when an error such as an axis misalignment with the head 4 occurs, the electron beam 2 from the electron beam emission hole 26 can pass through the electron beam transmission hole 30 of the differential exhaust flying head 4.
That is, as shown in FIG. 11, a small-diameter electron beam transmission hole 19 is used, and the electron beam 2 from the electron beam emission hole 26 is deflected by the differential exhaust floating head 4 without deflecting the beam axis itself as in the conventional structure. Can pass through the electron beam transmission hole 30.

  Then, by bringing the electron beam transmitting hole 30 to the adjusted position, the electron beam passing hole 32 having a small diameter provided in the vacuum sealing valve 31 at the position where the electron beam 2 is transmitted in this way, The arrival of unnecessary electrons to the electron beam irradiation body is avoided, the resolution is improved, and the electron beam passage hole 32 has a small diameter. Made.

In the case shown in FIG. 8, it is possible to avoid the contamination caused by the collision of the electron beam with each part, which is caused by deflecting the electron beam axis and passing it through the small-diameter electron beam transmission hole 19. Then, it is possible to move to a position that does not face, for example, the electron beam irradiation body 3 is exchanged.
Therefore, it is excellent in resolution, and it is possible to avoid contamination and damage to the electron beam irradiation body 3 and the electron beam irradiation apparatus 1 and to improve the lifetime of the electron beam irradiation apparatus main body apparatus 1.

  The electron beam irradiation apparatus according to the present invention is not limited to the above-described example, and can be changed to various configurations according to the applied electron beam irradiation apparatus, the electron beam irradiation body, and the like. Nor.

It is a schematic block diagram of an example of the electron beam irradiation apparatus by this invention. It is a schematic sectional drawing of the principal part in an electron beam adjustment state of an example of the electron beam irradiation apparatus by this invention. It is a schematic sectional drawing of the principal part in an electron irradiation state of an example of the electron beam irradiation apparatus by this invention. It is a schematic sectional drawing of the principal part in the non-opposing state of an electron beam irradiation body of an example of the electron beam irradiation apparatus by this invention. It is a schematic sectional drawing of the principal part in the electron beam adjustment state of the other example of the electron beam irradiation apparatus by this invention. It is a schematic sectional drawing of the principal part in the electron irradiation state of the other example of the electron beam irradiation apparatus by this invention. It is a schematic sectional drawing of the principal part in the non-opposing state of an electron beam irradiation body of an example of the electron beam irradiation apparatus by this invention. It is an optical path diagram with which it uses for description of this invention apparatus. It is a schematic sectional drawing of the conventional electron beam irradiation apparatus. It is a schematic sectional drawing of the principal part of the conventional electron beam irradiation apparatus. It is an optical path figure with which it uses for description of a conventional apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Electron beam irradiation apparatus main body, 2 ... Electron beam, 3 ... Electron beam irradiation body, 4 ... Differential exhaust floating head, 5 ... Telescopic coupling mechanism, 11 ... Electron Gun, 12 ... 1st condenser lens, 13 ... Aperture, 14 ... 2nd condenser lens, 15 ... Blanking aperture, 16 ... 1st scanning coil, 16s ... 1st minute Scanning coil, 17 ... second scanning coil, 17s ... second minute scanning coil, 18 ... objective lens coil, 19 ... electron beam transmission hole, 20 ... support for electron beam irradiation body Body 21... First gas suction port 22... Second gas suction port 23 .. vent pad 24 .. gas supply port 25. Beam exit hole, 30... Electron beam transmission hole, 31. Vacuum sealing valve, 32 ... electron beam apertures, 100 ... moving stage, 103 ... electron beam adjustment substrate, 105 ... stretching means

Claims (7)

An electron beam irradiation apparatus body having an electron beam emission hole;
A differential exhaust flying head formed with an electron beam transmission hole facing the electron beam emission hole;
An electron beam irradiation body supporting the electron beam irradiation body facing the differential exhaust flying head;
The differential exhaust levitation head floats the differential exhaust levitation head from the electron beam irradiation body in a non-contact manner by static pressure differential evacuation, and the front part of the electron beam emission hole is evacuated in a limited manner. To make up the vacuum seal to hold,
The differential exhaust flying head has a vacuum sealing valve for opening and closing the electron beam transmission hole,
The vacuum sealing valve has at least an electron beam emission hole of the electron beam irradiation apparatus main body and an electron beam passage hole having a diameter smaller than the inner diameter of the electron beam transmission hole of the differential exhaust floating head,
The vacuum sealing valve has an open state in which the electron beam transmission hole of the differential exhaust flying head is opened, and the small-diameter electron beam passage hole is disposed at an optical path position of the electron beam from the electron beam irradiation apparatus main body. An electron beam irradiation apparatus characterized in that the arrangement state is formed.   The vacuum sealing valve includes an open state in which an electron beam transmission hole of the differential exhaust floating head is opened during fine adjustment of the electron beam, and an electron beam irradiation device at the time of electron beam irradiation to the electron beam irradiation body. An arrangement state in which an electron beam passing hole having an inner diameter smaller than the inner diameter of the electron beam emitting hole of the main body and the electron beam transmitting hole of the differential exhaust flying head is disposed at the optical path position of the electron beam from the main body of the electron beam irradiation device; The electron beam irradiation apparatus according to claim 1, wherein:   The vacuum sealing valve closes the electron beam transmission hole of the differential exhaust floating head when the relative position between the differential exhaust floating head and the electron beam irradiation body is a non-facing position. The electron beam irradiation apparatus according to claim 1, wherein the electron beam irradiation apparatus is configured as described above. The vacuum sealing valve has a moving body having an electron beam passage hole,
The electron beam passage hole of the movable body is selected so that the inner diameter thereof is smaller than the inner diameters of the electron beam emission hole of the electron beam irradiation apparatus body and the electron beam transmission hole of the differential exhaust flying head,
When the electron beam is irradiated onto the electron beam irradiation body, the electron beam passage hole is arranged in the optical path position of the electron beam from the electron beam irradiation apparatus main body by adjusting the position of the moving body. The electron beam irradiation apparatus according to claim 1.   The vacuum sealing valve is configured such that when the relative position between the differential exhaust floating head and the electron beam irradiation body is a non-opposing position, the differential exhaust is performed at a predetermined movement position of the movable body. 2. The electron beam irradiation apparatus according to claim 1, wherein the electron beam transmission hole of the flying head is closed. The vacuum sealing valve has a moving body having at least first and second electron beam passage holes having different inner diameters,
The inner diameter of the first electron beam passage hole of the vacuum sealing valve is selected to be smaller than the inner diameter of the electron beam emission hole of the electron beam irradiation apparatus main body and the electron beam transmission hole of the differential exhaust flying head, The second electron beam passage hole is selected to be equal to or larger than the electron beam transmission hole of the differential exhaust flying head,
When adjusting the electron beam, the second electron beam passage hole is opposed to the electron beam transmission hole of the differential exhaust flying head at a predetermined movement position of the moving body, and the electron beam transmission hole is opened.
When the electron beam is irradiated onto the electron beam irradiation body, the first electron beam passage hole is arranged in the optical path position of the electron beam from the electron beam irradiation apparatus main body by adjusting the position of the moving body. The electron beam irradiation apparatus according to claim 1.   The vacuum sealing valve is configured such that when the relative position between the differential exhaust floating head and the electron beam irradiation body is a non-opposing position, the differential exhaust is performed at a predetermined movement position of the movable body. The electron beam irradiation apparatus according to claim 6, wherein the electron beam transmission hole of the flying head is closed.

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