JP2005146768A - Manufacturing method for chamber device, chamber equipment, liquid drop discharging equipment and electro-optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a chamber device, a chamber equipment, a liquid drop discharging equipment and an electro-optical device by which both of the flow of the outside atmosphere into the inside and the flow of the inside atmosphere to the outside is restrained when a worker goes in and out. <P>SOLUTION: The chamber device 7 comprises a main chamber 80 housing a work processing device in which the work processing needs to be carried out in the atmosphere isolated from the surrounding atmosphere, a preliminary chamber 81 adjacent to the main chamber 80, a main chamber door 152 for opening and closing a main chamber doorway 151, and a preliminary chamber door 162 for opening and closing a doorway to the outside. In the chamber device 7, each of the main chamber 80 and the preliminary chamber 81 is provided with an air supplying device and an air exhausting device. The chamber device 7 further comprises an open/close detector for detecting the open/close state of each of the doors and locking devices 155, 164, so that at least one of the main chamber door 152 and the preliminary chamber door 162 may be controlled to be prohibited from opening. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a chamber device, a chamber facility, a droplet discharge facility, and a method for manufacturing an electro-optical device that isolate an internal atmosphere containing the device from an external atmosphere.

  In recent years, it has been possible to manufacture an electro-optical device or the like using a droplet discharge device (inkjet device) that discharges and draws a functional droplet from a discharge nozzle of a functional droplet discharge head toward a work (substrate or the like). Has been done.

  Such a droplet discharge device needs to form a pattern with high accuracy and needs to be used in a clean atmosphere with little dust. Therefore, the droplet discharge device is sealed with a chamber, and the atmosphere around the droplet discharge device is isolated from the outside atmosphere, thereby keeping the atmosphere around the droplet discharge device clean.

  In addition, in order to prevent the external atmosphere from entering when the work is frequently exchanged, a spare chamber for temporarily storing the workpiece is provided, and the gas in the spare chamber is replaced with the same gas as the atmosphere in the chamber. (See Patent Document 1).

Republished Patent International Publication Number WO00 / 55891

  However, a process for manufacturing an electro-optical device or the like includes a process that requires high accuracy in addition to a process that uses a droplet discharge device. Each of these processes may be carried out continuously. In that case, each apparatus that requires high accuracy used in a process that requires high accuracy is installed near the droplet discharge device. Yes. Further, in recent electro-optical devices that have been highly densified, semiconductor elements such as switching elements for driving pixels of the electro-optical device are integrally formed in the electro-optical device. A semiconductor manufacturing process for forming a semiconductor element needs to be performed in a clean environment, and the substrate on which the semiconductor element is formed needs to be stored in a clean environment. Furthermore, the substrates of recent electro-optical devices tend to increase in size to increase the size of the device and the efficiency of manufacturing, and the number of substrates exceeding 2 square meters is increasing. Such a large substrate has a high risk of breakage during transportation, and the transportation work itself is difficult. Therefore, it is not preferable to transport the substrate on which the semiconductor element is formed over a long distance, and it is preferable that the semiconductor manufacturing apparatus is also installed near the droplet discharge apparatus.

  On the other hand, there are various functional liquids handled by the droplet discharge device, some functional liquids volatilize organic gas, and some functional liquids generate mist when discharging droplets. The mist of the functional liquid or organic gas volatilized from the functional liquid may flow out and adhere to equipment installed in the vicinity, which may damage the equipment, impairing equipment used in processes that require high accuracy. At the same time, the yield of manufactured products may be reduced. In particular, semiconductor elements that are being miniaturized are susceptible to serious effects even if they are contaminated at the molecular level, and even if trace amounts of contaminants are affected, the product is greatly affected. The adhesion of the electro-optical device may damage the circuit of the electro-optical device and affect the electrical characteristics of the electro-optical device, thereby reducing the manufacturing yield of the electro-optical device. However, functional liquids used for the formation of resin products such as plus sensors and metal wiring are difficult to suppress volatile gases, and these functional liquids address the above-mentioned problems by suppressing the generation of volatile gases. Have difficulty.

  In particular, since humans are involved in the maintenance work of the droplet discharge device and the replenishment and replacement of the functional fluid, it is necessary to make the opening large enough for humans (operators) to enter and exit, Outflow of mist, organic gas, etc. could not be prevented due to mixing with the external atmosphere. The conventional spare chamber of Patent Document 1 does not deal with a large opening through which a human can pass, does not suppress the outflow of gas in the chamber, and does not solve such a problem. It was.

  Therefore, the present invention provides a chamber device, a chamber facility, a droplet discharge facility, and an electro-optical device capable of suppressing both the inflow of the external atmosphere and the outflow of the internal atmosphere to the outside when the worker enters and exits. It aims to provide a method.

  The chamber apparatus of the present invention is a chamber apparatus that accommodates a workpiece processing apparatus that needs to perform workpiece processing in an atmosphere isolated from the surrounding atmosphere, and is adjacent to the main chamber that accommodates the workpiece processing apparatus and the main chamber. A door that opens and closes a main chamber entrance / exit provided in a partition that separates the spare chamber from the main chamber and the spare chamber, and is capable of isolating the gas in the main chamber from the gas in the spare chamber when closed. A door that opens and closes an external doorway provided on the wall of the spare room and a spare room door that can isolate the gas outside the chamber device from the gas inside the spare room when closed. It is characterized by that.

  According to the configuration and method of the present invention, the main chamber communicates with the outside through the spare chamber, so that the gas in the main chamber can be prevented from leaking to the outside, and the external gas enters the main chamber. Can be suppressed. Furthermore, since the door that can close the opening is provided in each of the opening that communicates the main chamber and the spare chamber and the opening that communicates the spare chamber and the outside, the gas in the main chamber can be more reliably leaked to the outside. It is possible to suppress the external gas from entering the main chamber.

  In this case, it is preferable that each of the main chamber and the spare chamber includes an air supply device and an exhaust device, and at least the exhaust device provided in the spare chamber includes an exhaust flow rate adjusting device.

  According to this configuration, the gas in the spare room can be replaced with clean air supply in a state in which the spare room is separated from the main room and the outside, and the gas that has entered the spare room from the main room or the outside that has entered the spare room. Can be eliminated. Therefore, the possibility that gas in the main room or outside enters the outside or main room through the spare room can be extremely reduced.

  In this case, an open / close detection device that detects the open / close state of the main chamber door and the spare chamber door, a lock device that sets the main chamber door and the spare chamber door to the open prohibited state or the open prohibition released state, and the open / close state It is preferable to provide a lock control device that operates the lock device based on the detection result of the detection device and controls so that at least one of the main chamber door and the spare chamber door is in an open prohibited state.

  According to this configuration, since at least one of the main chamber door and the spare chamber door is always closed, there is no opportunity for the main chamber and the outside to be in a continuous state, and the main chamber or the external gas is in the spare chamber. Even if it enters, it cannot enter the outside or the main room. Therefore, the possibility that gas in the main chamber or outside passes through the spare chamber and enters the outside or main chamber can be extremely reduced.

  In this case, based on the detection result of the open / close detection device, there is further provided a timing device that can measure the time from when the preliminary chamber door is opened and closed, and the lock control device is an exhaust device provided in the preliminary chamber by the timing device. When at least a predetermined time for exhausting the gas corresponding to the capacity of the spare room is measured, it is preferable to cancel the state in which the main chamber door is prohibited to be opened by the lock device.

  According to this configuration, the gas in the spare chamber that may have been mixed with an external gas by opening the spare chamber door is supplied from the air supply device in a state where the spare chamber is isolated from the outside and the main chamber. After being replaced by air, the main room door is opened. Therefore, the possibility that the gas that has entered the preliminary chamber from the outside further enters the main chamber can be extremely reduced.

  In this case, based on the detection result of the open / close detection device, there is further provided a timing device capable of measuring the time from when the main chamber door is opened and closed, and the lock control device is an exhaust device provided in the spare room by the timing device. When at least a predetermined time for exhausting the gas corresponding to the capacity of the spare room is measured, it is preferable to cancel the prohibition of opening the spare room door by the lock device.

  According to this configuration, the gas in the spare chamber that may have been mixed with the gas in the main chamber by opening the main chamber door is supplied from the air supply device in a state where the spare chamber is isolated from the outside and the main chamber. The spare room door is opened after the air is replaced. Therefore, the possibility that the gas that has entered the preliminary chamber from the main chamber flows out to the outside can be extremely reduced.

  In this case, the main chamber and the spare chamber have a determination unit as to whether they are unmanned. When the main chamber and the spare chamber are unattended, the determination unit controls the exhaust flow rate adjusting device to exhaust the exhaust device provided in the preliminary chamber. It is preferable to stop by.

  According to this configuration, since the exhaust is stopped, the supply of air becomes unnecessary, and the load on the supply device can be reduced and the energy consumption can be reduced. When the spare room is unattended, the spare room is a space isolated from the main room and the outside and does not require air conditioning. Therefore, the chamber apparatus is not affected by the stoppage of exhaust. Therefore, energy consumption can be reduced without affecting the performance of the chamber apparatus.

  In this case, there is further provided a timing device capable of measuring the time since the exhaust device started exhausting from the state in which the exhaust device provided in the preliminary chamber is stopped, and the exhaust device provided in the preliminary chamber by the timing device. It is preferable that at least the time for exhausting the gas corresponding to the capacity of the spare room is measured, and the opening prohibition state of the spare room door by the lock device is canceled based on the time measurement information.

  According to this configuration, after the spare room is isolated from the outside and the main room, the spare room door is opened after being replaced with the air supplied from the air supply device. Therefore, the possibility that the gas that has entered the spare room from the main room flows out from the opened spare room door to the outside can be extremely reduced.

  In this case, it is preferable that a work supply / exhaust port for supplying and discharging a work is provided on a wall that constitutes the main chamber and does not face the partition wall, and the external doorway and the spare chamber door are provided on the wall that does not face the partition wall.

  According to this configuration, the spare room door can be used without affecting the work supply and removal work to the work supply / discharge material port, and even if the spare room is provided on both sides of the main room. The chamber apparatus can be installed adjacently.

  In this case, it is preferable that a plurality of external doorways and spare chamber doors are provided, and the locking devices corresponding to the plurality of spare chamber doors are controlled in conjunction with each other.

  According to this configuration, a convenient doorway can be selected according to the layout around the chamber apparatus. Moreover, it is possible to reduce the restriction of the degree of freedom of device arrangement due to the convenience of entering and exiting the chamber device.

  In this case, it is preferable that the spare chamber is provided at two locations on both sides of the main chamber.

  According to this configuration, a convenient doorway can be selected according to the layout around the chamber apparatus. Moreover, it is possible to reduce the restriction of the degree of freedom of device arrangement due to the convenience of entering and exiting the chamber device. Also, corresponding to the equipment in the main room, it is possible to work from the efficient direction and enter the main room. Furthermore, it becomes easy for a plurality of workers to work on the apparatus in the main room at the same time.

  In this case, the spare room is preferably a work space for performing work on the work processing apparatus accommodated in the main room through the main room doorway with the main room door opened.

  According to this configuration, the spare chamber serves as both a facility for suppressing the mixing of the gas in the main chamber and the external gas and the area for performing the operation, and suppresses the mixing of the gas in the main chamber and the external gas. This eliminates the need for a separate facility and saves space for the facility.

  In this case, it is preferable that the chamber pressure in the preliminary chamber is higher than the chamber pressure in the main chamber.

  According to this configuration, when the main chamber door is opened, the gas in the spare chamber flows toward the main chamber having a lower chamber pressure. Therefore, even if the main chamber door is opened, the main chamber is moved from the main chamber to the spare chamber. The possibility of gas outflow can be reduced.

  In this case, it is preferable that the chamber pressure in the spare chamber is lower than the chamber pressure around the chamber device.

  According to this configuration, when the spare chamber door is opened, the gas in the spare chamber is less likely to flow to the outside with higher chamber pressure. The possibility of gas outflow can be reduced. Therefore, the possibility of gas outflow from the main chamber to the outside can be reduced.

  In this case, it is preferable that the chamber pressure in the preliminary chamber is lower than the chamber pressure in the main chamber.

  According to this configuration, when the main chamber door is opened, the gas in the spare chamber is less likely to flow toward the main chamber having a higher chamber pressure. It is possible to reduce the possibility of inflow of gas.

  In this case, it is preferable that the chamber pressure in the preliminary chamber is higher than the chamber pressure around the chamber device.

  According to this configuration, when the spare chamber door is opened, the gas in the spare chamber flows toward the outside having a lower chamber pressure. Therefore, even if the spare chamber door is opened, the gas from the outside to the spare chamber is opened. The possibility of entering is reduced. Therefore, the possibility of gas entering from the outside into the main chamber can be reduced.

  In this case, the work processing device is a droplet discharge device, and is provided in the main chamber. The work processing device is provided with a sub chamber adjacent to the spare chamber through the partition wall and an exhaust device for exhausting the gas in the sub chamber. It is preferable that a liquid supply tank of a droplet discharge device is installed in the chamber, and the gas in the sub chamber is exhausted from the exhaust device.

  According to this configuration, the functional liquid mist in the main chamber or the evaporated functional liquid solvent in the main chamber is isolated by isolating the supply tank in the main chamber that is highly likely to have a high concentration of functional liquid mist or evaporated functional liquid solvent. It is possible to reduce the concentration. Further, by taking the exhaust gas from the sub chamber, it is possible to prevent the gas having a high possibility of concentration such as the functional liquid mist and the evaporated functional liquid solvent from diffusing into the main chamber.

  In this case, a work opening provided in the partition between the sub chamber and the spare chamber and a door for opening and closing the work opening, and when closed, the gas inside the sub chamber and the gas inside the spare chamber can be isolated. A sub chamber door is preferably provided.

  According to this configuration, it is possible to perform replacement of the liquid supply tank or the like that is highly likely to have a high concentration of functional liquid mist, evaporated functional liquid solvent, or the like from the spare chamber. Even if a gas with high possibility of high concentration, such as functional liquid mist or evaporated functional liquid solvent, flows into the spare chamber, the spare chamber door must be connected to the outside only after the spare chamber gas is replaced with clean air. Since the gas is not opened, it is possible to extremely reduce the possibility that a gas having a high concentration such as the functional liquid mist that has flowed into the spare chamber or the evaporated functional liquid solvent is released to the outside.

  The chamber equipment of the present invention is characterized in that the above-described chamber devices are connected to each other at a portion of the preliminary chamber, and the connected preliminary chamber is an integral space.

  According to this configuration, it is possible to efficiently install a plurality of apparatuses that are preferably installed in the chamber apparatus.

  The droplet discharge facility according to the present invention is characterized in that a droplet discharge device is installed as the workpiece processing device in the chamber apparatus or the main chamber of the chamber facility.

  According to this configuration, when an organic gas is generated and the organic gas adheres to another manufacturing apparatus, there is a high possibility that the attached manufacturing apparatus will be corroded and the yield of manufactured products may be reduced. Droplet discharge is easy to disperse mist of functional liquid in the atmosphere while using functional liquid that is highly likely to affect product characteristics by adhering to the product and that is likely to reduce the manufacturing yield of the product. Since the droplet discharge device that performs the operation is installed in the chamber device that is very unlikely to release the internal gas to the outside, the possibility of scattering of functional liquid mist to the periphery can be extremely reduced, The possibility of serious adverse effects on the equipment can be minimized, and the possibility of affecting the product characteristics and reducing the production yield of the product can be minimized.

  The electro-optical device manufacturing method according to the present invention is characterized in that an electro-optical device is manufactured by using a droplet discharge device in a main chamber by a chamber device, a chamber facility, or a droplet discharge facility.

  According to this method, pattern formation by the droplet discharge device is performed in an atmosphere in which entry of dust and the like from the outside is suppressed. Therefore, pattern formation of the electro-optical device can be performed with high quality and high yield. . Furthermore, the mist of the functional liquid generated from the droplet discharge device and the outflow of the solvent evaporated from the functional liquid are suppressed, and adverse effects on other manufacturing apparatuses of the electro-optical apparatus installed in the vicinity and the manufactured electro-optical apparatus Can be suppressed, a decrease in the yield of the electro-optical device can be suppressed, and an electro-optical device with high quality and high yield can be manufactured.

  Hereinafter, with reference to the accompanying drawings, a chamber apparatus according to an embodiment of the present invention, a droplet discharge facility to which the chamber apparatus is applied, and a structure and a manufacturing method (manufacturing process) of an electro-optical device manufactured thereby Will be described.

(First embodiment)
FIG. 1 and FIG. 2 are a plan view and a side view, respectively, showing an embodiment of a droplet discharge facility of the present invention. Hereinafter, for convenience of explanation, one horizontal direction (a direction corresponding to the left and right direction in FIGS. 1 and 2) is referred to as a “Y-axis direction”, which is perpendicular to the Y-axis direction and is in a horizontal direction ( The direction corresponding to the vertical direction in FIG. 1 is referred to as “X-axis direction”.

  A droplet discharge facility (droplet discharge system) 10 shown in these drawings includes a droplet discharge device (inkjet drawing device) 1 having a droplet discharge head 111 and a chamber device 7 that accommodates the droplet discharge device. The droplet discharge device 1 is a state of minute droplets on a substrate W as a workpiece by using, for example, a liquid (discharge liquid) such as ink or a functional liquid containing a target material by an inkjet method (droplet discharge method). This is a device that forms (draws) a predetermined pattern by discharging with, and can be used, for example, to manufacture a color filter or an organic EL device in a liquid crystal display device or to form a metal wiring on a substrate. This is an industrial droplet discharge device.

  First, the droplet discharge device 1 will be described, and the chamber device 7 will be described later. The droplet discharge apparatus 1 includes an apparatus main body 2, a substrate table (work placement unit) 3, a head unit 11 in which a plurality of droplet discharge heads (inkjet heads) 111 are installed, and maintenance of the droplet discharge head 111. A maintenance device 12 that performs the above operation, a blow device 14 that blows gas onto the substrate W, a laser length measuring device 15 that measures the movement distance of the substrate table 3, a control device 16, and a dot dropout detection unit 19.

  As shown in FIG. 2, the apparatus main body 2 includes a gantry 21 installed on the floor, and a stone surface plate 22 installed on the gantry 21. On the stone surface plate 22, the substrate table 3 is installed so as to be movable in the Y-axis direction with respect to the apparatus main body 2. The substrate table 3 moves forward and backward in the Y-axis direction by driving the linear motor 101. The substrate W is placed on the substrate table 3.

  As shown in FIG. 1, in the vicinity of two sides along the X-axis direction of the substrate table 3, the liquid is discharged (flushed) from the droplet discharge head 111 before the droplet discharge (drawing) on the substrate W, respectively. A pre-drawing flushing unit (not shown) for receiving the discharged droplets is installed. A suction tube (not shown) is connected to the pre-drawing flushing unit, and the discharged and discharged discharge liquid passes through this suction tube and is collected by the drainage device.

  The moving distance of the substrate table 3 in the Y-axis direction is measured by a laser length measuring device 15 as a moving distance detecting means. The laser length measuring device 15 has a laser length measuring device sensor head 51, a prism 52 and a laser length measuring device main body 53 installed in the apparatus main body 2, and a corner cube 54 installed on the substrate table 3. Laser light emitted from the laser measuring instrument sensor head 51 along the X-axis direction is bent by the prism 52 and proceeds in the Y-axis direction, and is irradiated onto the corner cube 54. The reflected light from the corner cube 54 returns to the laser length measuring sensor head 51 through the prism 52. In the droplet discharge device 1, the discharge timing from the droplet discharge head 111 is generated based on the movement distance (current position) of the substrate table 3 detected by the laser length measuring device 15.

  In the apparatus main body 2, a main carriage 102 that supports the head unit 11 is installed so as to be movable in the X-axis direction in the space above the substrate table 3. The head unit 11 having a plurality of droplet discharge heads 111 moves forward and backward in the X-axis direction together with the main carriage 102 by driving a linear motor actuator 103 including a linear motor and a guide.

  In the droplet discharge device 1 of the present embodiment, so-called main scanning of the droplet discharge head 111 is based on the discharge timing generated using the laser length measuring device 15 while moving the substrate table 3 in the Y-axis direction. The droplet discharge head 111 is driven (selective discharge of discharged droplets). Correspondingly, so-called sub-scanning is performed by movement of the head unit 11 (droplet ejection head 111) in the X-axis direction.

  The apparatus main body 2 is provided with a blower 14 that semi-drys the droplets discharged onto the substrate W. The blow device 14 has a nozzle that opens in a slit shape along the X-axis direction, and blows gas toward the substrate W from the nozzle while transporting the substrate W in the Y-axis direction by the substrate table 3. In the droplet discharge device 1 of the present embodiment, two blow devices 14 are provided that are located at positions separated from each other in the Y-axis direction.

  The maintenance device 12 is installed on the side of the gantry 21 and the stone surface plate 22. The maintenance device 12 includes a capping unit (capping device) 121 for capping the droplet discharge head 111 during standby of the head unit 11, a cleaning unit (cleaning device) 122 for wiping the nozzle formation surface of the droplet discharge head 111, A regular flushing unit 123 that receives regular flushing of the droplet discharge head 111 and a weight measuring unit 125 are provided.

  In addition, the maintenance device 12 includes a moving table 124 that can move in the Y-axis direction. The capping unit 121, the cleaning unit 122, the regular flushing unit 123, and the weight measuring unit 125 are arranged on the moving table 124 in the Y-axis direction. It is installed side by side. When the moving table 124 moves in the Y-axis direction with the head unit 11 moving above the maintenance device 12, any one of the capping unit 121, the cleaning unit 122, the regular flushing unit 123, and the weight measuring unit 125 drops. It can be positioned below the discharge head 111. The head unit 11 moves above the maintenance device 12 during standby, and performs capping, cleaning (wiping), and regular flushing in a predetermined order.

  The capping unit 121 has a plurality of caps arranged so as to correspond to each of the plurality of droplet discharge heads 111 and a lifting mechanism that lifts and lowers these caps. When the head unit 11 is on standby, the nozzle forming surface can be prevented from drying by covering the nozzle forming surface of the droplet discharge head 111 with this cap. Further, the capping by the capping unit 121 is for cleaning the flow path with the cleaning liquid when the head unit 11 is initially filled with the discharging liquid or when the discharging liquid is discharged from the head unit 11 when the discharging liquid is replaced with a different type. It is also done when doing.

  A suction tube (not shown) leading to each cap is connected to the capping unit 121, and the functional liquid discharged from the droplet discharge head 111 during capping passes through this suction tube, and passes through the capping drainage device ( (Not shown) and collected for reuse. However, the cleaning liquid collected when the flow path is cleaned is not reused.

  The cleaning unit 122 operates such that a wiping sheet containing a cleaning liquid (for example, a solvent capable of dissolving a functional liquid) is run by a roller, and the nozzle forming surface of the droplet discharge head 111 is wiped and cleaned by the wiping sheet. To do.

  The regular flushing unit 123 is used for flushing when the head unit 11 is on standby, and receives the ejected liquid droplets discarded and ejected by the liquid droplet ejection head 111. A suction tube (not shown) is connected to the regular flushing unit 123, and the discarded functional liquid passes through the suction tube and is collected by a drainage device (not shown).

  The weight measurement unit 125 is used to measure a single droplet discharge amount (weight) from the droplet discharge head 111 as a preparation stage of a droplet discharge operation on the substrate W. That is, before the droplet discharge operation on the substrate W, the head unit 11 moves above the weight measurement unit 125 and drops droplets from the discharge nozzles of each droplet discharge head 111 one or more times to the weight measurement unit 125. Discharge against. The weight measuring unit 125 includes a liquid receiver that receives the discharged droplets and a weight scale such as an electronic balance, and measures the weight of the discharged droplets. Alternatively, the liquid receiver may be removed and measurement may be performed with a scale outside the apparatus. A control device to be described later calculates the amount (weight) of one discharge droplet in the discharge nozzle based on the weight measurement result, and the droplet is set so that the calculated value becomes equal to a predetermined design value. The applied voltage of the head driver that drives the ejection head 111 is corrected.

  The dot dropout detection unit 19 is fixedly installed at a place on the stone surface plate 22 that does not overlap the movement area of the substrate table 3 and is located below the movement area of the head unit 11. The missing dot detection unit 19 detects missing dots caused by clogging of the nozzles of the droplet discharge head 111 and includes, for example, a light projecting unit and a light receiving unit that project and receive laser light. Yes. When dot missing detection is performed, the head unit 11 discards and discharges droplets from each nozzle while moving in the X-axis direction in the space above the dot missing detection unit 19. The projected droplet is projected and received to optically detect the presence and location of a clogged nozzle. At this time, the discharge liquid discharged from the droplet discharge head 111 is collected in a tray provided in the dot dropout detection unit 19, and passes through a suction tube (not shown) connected to the bottom of the tray to be drained ( (Not shown).

  A control device (control means) (not shown) controls the operation of each part of the droplet discharge device 1 and executes a control operation of the CPU (Central Processing Unit) and the droplet discharge device 1. And a storage unit that stores (stores) various programs such as programs and various data. In the illustrated configuration, the control device is installed outside a chamber 70 described later.

  The gantry 21 includes a frame 211 formed by assembling an angle member or the like in a square shape, and a plurality of support legs 212 distributed and arranged at the lower part of the frame 211. The stone surface plate 22 is made of a solid stone material, and the upper surface thereof has high flatness. The stone surface plate 22 prevents the influence of ambient environmental conditions, vibrations, and the like, and the substrate table 3 and the head unit 11 can be moved with high accuracy.

  On the stone surface plate 22, a linear motor 101 and an air slider 108 are installed as a Y-axis direction moving mechanism. The substrate table 3 is supported by the air slider 108 so as to be able to move smoothly in the Y-axis direction, and moves in the Y-axis direction by driving the linear motor 101. In addition, a θ-axis rotation mechanism (not shown) is provided at the lower part of the substrate table 3, so that the substrate table 3 is within a predetermined range with a vertical θ-axis passing through the center of the substrate table 3 as a rotation center. It can be turned. The substrate table 3 is formed with a plurality of suction grooves (suction portions) 33 for sucking and fixing the placed substrate W.

  The apparatus main body 2 includes four support columns 23 installed on a stone surface plate 22 and two parallel beams (beams) 24 and 25 extending along the X-axis direction supported by these support columns 23. And further. The substrate table 3 can pass under the girders 24 and 25.

  On the girders 24 and 25, the main carriage 102 and the camera carriage 106 are installed so as to be bridged between the girders 24 and 25, respectively. A linear motor actuator 103 is installed in the beam 24 as an X-axis direction moving mechanism common to the main carriage 102 and the camera carriage 106. The main carriage 102 and the camera carriage 106 are installed so as to be able to move smoothly in the X-axis direction by guidance of the linear motor actuator 103 and a linear guide provided on the beam 25, respectively. The main carriage 102 and the camera carriage 106 move independently in the X-axis direction by driving the linear motor actuator 103.

  A head unit 11 is supported on the main carriage 102. When the head unit 11 moves in the X-axis direction together with the main carriage 102, sub-scanning of the droplet discharge head 111 is performed. The head unit 11 is connected to a pipe (not shown) for supplying the discharge liquid, a wiring cable (not shown), and the like. The head unit 11 is detachable from the main carriage 102.

  The camera carriage 106 is provided with a recognition camera for recognizing an image of alignment marks provided at predetermined positions on the substrate W. The recognition camera is supported in a state of being suspended downward from the camera carriage 106. Note that the recognition camera may be used for other purposes.

  The head unit 11 holds a plurality of droplet discharge heads 111 having the same structure as shown in FIG. Here, FIG. 4A is a diagram of the head unit 11 observed from the substrate table 3 side. In the head unit 11, two rows of six droplet discharge heads 111 are arranged so that the longitudinal direction of each droplet discharge head 111 forms an angle with respect to the X-axis direction. Further, the droplet discharge head 111 for discharging the functional liquid has two nozzle rows 112 and 112 each extending in the longitudinal direction of the droplet discharge head 111 as shown in FIG. . One nozzle row is a row in which 180 nozzles 114 are arranged in a row, and the interval between the nozzles 114 along the direction of the nozzle rows 112 and 112 is about 140 μm. The nozzles 114 between the two nozzle rows 112 and 112 are arranged so as to be shifted by a half pitch (about 70 μm). Each droplet discharge head 111 is arranged so that the nozzles 114 are continuous at a constant pitch in the X-axis direction, and the pitch can be changed by adjusting the angle with respect to the X-axis direction of the droplet discharge head 111. .

  This arrangement pattern is an example. If the droplet discharge head 111 is a dedicated component for various substrates W, nozzles that match the substrate W may be disposed. Alternatively, a row of six droplet discharge heads 111 may be configured with one droplet discharge head. That is, the number of droplet discharge heads 111, the number of columns, and the arrangement pattern can be set arbitrarily. In any case, the dots formed by all the discharge nozzles 114 of the twelve droplet discharge heads 111 need only be continuous in the X-axis direction. Further, the head switching valve may be attached to each droplet discharge head 111 or may be attached to each of the plurality of droplet discharge heads 111.

  As shown in FIGS. 5A and 5B, each droplet discharge head 111 includes a vibration plate 63 and a nozzle plate 64. Between the vibration plate 63 and the nozzle plate 64, a liquid pool 65 that is always filled with the material liquid supplied from the functional liquid tank 45 through the hole 67 is located. In addition, a plurality of head partition walls 61 are located between the diaphragm 63 and the nozzle plate 64. A portion surrounded by the diaphragm 63, the nozzle plate 64, and the pair of head partition walls 61 is a cavity 60. Since the cavities 60 are provided corresponding to the nozzles 114, the number of the cavities 60 and the number of the nozzles 114 are the same. A material liquid is supplied to the cavity 60 from a liquid pool 65 through a supply port 66 positioned between the pair of head partition walls 61.

  On the diaphragm 63, the vibrator 62 is positioned corresponding to each cavity 60. The vibrator 62 includes a piezoelectric element 62c and a pair of electrodes 62a and 62b sandwiching the piezoelectric element 62c. By applying a driving voltage to the pair of electrodes 62a and 62b, the functional liquid is ejected as droplets from the corresponding nozzle 114. In addition, the volume of the droplet discharged from each of the nozzles 114 is variable between 0 pl to 42 pl (picoliter). In order to discharge the material liquid, an electrothermal conversion element may be used instead of the vibrator 62, and this is a configuration in which the material liquid is discharged using the thermal expansion of the material liquid by the electrothermal conversion element. is there.

  In the vicinity of such a droplet discharge device 1, a tank storage unit having a rack is provided. In the tank housing portion, the functional liquid tank 45 that stores the functional liquid discharged from the droplet discharge head 111, the cleaning liquid tank 46 that stores the cleaning liquid supplied to the cleaning unit 122, and the waste liquid collected from the capping unit 121 are stored. A reusable tank 47 to be stored and a drainage tank 48 to store the drained liquid discharged and discharged from the droplet discharge head 111 in the pre-drawing flushing unit, the regular flushing unit 123 and the dot dropout detection unit 19 are respectively installed (stored). Has been. A plurality of tanks are provided, and by changing the tank to be used, the tank can be replaced without stopping the operation of the droplet discharge device 1.

  The functional liquid stored in the functional liquid tank 45 is supplied to each droplet discharge head 111 of the head unit 11 through the liquid supply system. Each of the functional liquid tanks 45 can be replenished with a functional liquid when it becomes empty, or can be replaced with a full tank. The functional liquid tank 45 only needs to be able to perform at least one of replacement (detachment) and replenishment of the discharge liquid.

  Similarly, the cleaning liquid tank 46 can be replaced or replenished with cleaning liquid, respectively. Further, the reuse tank 47 and the drainage tank 48 can be replaced with empty tanks or drained when the tanks are full.

  Here, the overall operation of the droplet discharge device 1 under the control of the control device will be briefly described. When the substrate W placed (supplied) on the substrate table 3 is positioned (prealigned) at a predetermined position by the operation of the substrate positioning device (not shown) provided in the droplet discharge device 1, the substrate table 3 The substrate W is sucked and fixed to the substrate table 3 by air suction from each suction groove 33. Next, when the substrate table 3 and the camera carriage 106 move, the recognition camera moves above an alignment mark provided at a predetermined location (one or a plurality of locations) of the substrate W, and recognizes this alignment mark. . Based on this recognition result, the θ-axis rotation mechanism operates to correct the angle of the substrate W around the θ-axis, and the position correction of the substrate W in the X-axis direction and the Y-axis direction is performed on the data (this book) alignment).

  When the alignment operation of the substrate W as described above is completed, each droplet discharge head 111 is moved while moving the substrate W in the main scanning direction (Y-axis direction) by moving the substrate table 3 with the head unit 11 stopped. To selectively eject droplets onto the substrate W. At this time, the droplet discharge operation may be performed while the substrate table 3 is moving forward (forward), while it is moving backward (backward), or both forward and backward (reciprocating). Alternatively, the droplet ejection operation may be repeated a plurality of times by reciprocating the substrate table 3 a plurality of times. With the above operation, the discharge of the functional liquid droplets is completed on the substrate W in a region extending along the main scanning direction with a predetermined width (a width that can be discharged by the head unit 11).

  Thereafter, by moving the main carriage 102, the head unit 11 is moved in the sub-scanning direction (X-axis direction) by the predetermined width. In this state, similar to the above-described operation, a selective droplet discharge operation from each droplet discharge head 111 to the substrate W is performed while moving the substrate W in the main scanning direction. When the droplet discharge operation to this region is completed, the head unit 11 is further moved in the sub-scanning direction (X-axis direction) by the predetermined width, and the substrate W is moved in the main scanning direction. However, a similar droplet discharge operation is performed. By repeating this several times, droplet discharge is performed on the entire region of the substrate W. In this manner, the droplet discharge device 1 forms (draws) a predetermined pattern on the substrate W.

  Next, a description will be given of the chamber device 7 that constitutes the droplet discharge facility 10 and accommodates the droplet discharge device 1 and blocks the atmosphere of the droplet discharge device 1 from the external atmosphere. 1 is a plan view of a droplet discharge facility including a chamber apparatus, FIG. 2 is a sectional view of the droplet discharge facility including a sectional view of the chamber apparatus, and FIG. 3 is a sectional view of a preliminary chamber portion of the chamber apparatus. is there.

  The chamber device 7 includes a chamber 70 that houses the droplet discharge device 1, an air conditioner 71 that supplies conditioned air to the chamber 70, and a control panel box 72 that houses a chamber control device 75 that controls the chamber device 7. It consists of The chamber apparatus 7 of this embodiment is installed in a clean room.

  The chamber 70 is formed on the floor on which the chamber 70 is installed by each outer wall, which will be described later, and the top panel 74, and is configured to isolate the internal gas from the external gas, and has a substantially rectangular parallelepiped shape. . The interior of the chamber 70 is divided by a partition wall 76 to provide a main chamber 80 that accommodates the droplet discharge device 1 and preliminary chambers 81 and 81 that are disposed so as to sandwich the main chamber 80 therebetween.

  The main chamber 80 includes a partition wall 76, a first main chamber outer wall 77, a second main chamber outer wall 78, and a top panel 74. Near the top panel 74, a main room ceiling 84 is provided in parallel with the top panel 74 to form a main room ceiling 85. Further, a sub chamber 82 is formed by dividing a part of the main chamber 80 by a sub chamber wall 79.

  In the main chamber 80, the droplet discharge device 1 excluding the control device is installed, and in the sub chamber 82, the functional liquid tank 45, the cleaning liquid tank 46, the reuse tank 47, and the drainage of the droplet discharge device 1 are disposed. A tank 48 is installed. The sub chamber 82 corresponds to a tank storage unit installed in the vicinity of the droplet discharge device 1 described above.

  As shown in FIGS. 2 and 3, a main room air supply duct 86 and an air supply filter 87 communicating with the air conditioner 71 are arranged on the main room ceiling back 85, and air is supplied to the main room ceiling back 85. It can be done. The main room ceiling 84 is provided with a small-diameter opening (not shown) on the entire surface so that the air supplied into the main room ceiling back 85 can uniformly fall over the entire main room 80. The first main room outer wall 77 is provided with a main room exhaust duct 88, which communicates with factory exhaust equipment. In the main chamber exhaust duct 88, a main chamber exhaust damper 141 that controls the exhaust flow rate and a main chamber exhaust flow rate sensor 142 that measures the exhaust flow rate are provided. A first main chamber outer wall 77 facing the sub chamber 82 is provided with a sub chamber exhaust duct (not shown), which communicates with the exhaust system of the factory.

  The air supplied from the air conditioner 71 passes through the air supply filter 87 and enters the main room ceiling 85, passes through the small-diameter opening of the main room ceiling 84, and is supplied to the main room 80 and the sub chamber 82. The air in the main room 80 is exhausted to the factory exhaust facility via the main room exhaust duct 88. The air in the sub chamber 82 is exhausted to the factory exhaust facility via the sub chamber exhaust duct.

  The spare chamber 81 includes a partition wall 76, a first spare chamber outer wall 91 that is continuous with the first main chamber outer wall 77, a second spare chamber outer wall 92 that is continuous with the second main chamber outer wall 78, and a third spare chamber that faces the partition wall 76. The outer wall 93 and the top panel 74 are formed. Near the top panel 74, a spare room ceiling 94 is provided in parallel with the top panel 74 to form a spare room ceiling 95.

  As shown in FIG. 3, a partition wall 76 facing the spare room ceiling 95 is provided with a spare room air supply duct 96 communicating with the main room air supply duct 86. The auxiliary room ceiling 95 can be supplied with air through an air supply filter 97. The partition wall 76 facing the spare room 81 is provided with a spare room exhaust duct 98, which passes through the main room 80 and the main room ceiling 85 and exits the chamber 70 from the opening of the first main room outer wall 77. It communicates with the exhaust system. In the preliminary chamber exhaust duct 98, a preliminary chamber exhaust damper 143 for controlling the exhaust flow rate and a preliminary chamber exhaust flow rate sensor 144 for measuring the exhaust flow rate are provided. The auxiliary main room ceiling 94 is provided with a small-diameter opening (not shown) on the entire surface so that the air supplied into the auxiliary room ceiling 95 is uniformly distributed over the entire auxiliary room 81.

  The air supplied from the air conditioner 71 passes through the air supply filter 97, enters the spare room ceiling 95, passes through the small-diameter opening of the spare room ceiling 94, and is supplied to the spare room 81. The gas in the spare room 81 is exhausted to the factory exhaust facility via the spare room exhaust duct 98.

  As shown in FIGS. 1 and 2, a work supply / discharge port for supplying the work W to the droplet discharge device 1 in the main chamber 80 and discharging the processed work W is provided in the second main chamber outer wall 78. 146 is provided. The opening size of the workpiece supply / exhaust port 146 is desirably set to a minimum size that allows the workpiece W to enter and exit. An open / close shutter 147 that can close the opening of the work supply / exhaust port 146 and an air cylinder 148 that drives the open / close shutter 147 to open / close the work supply / exhaust port 146 are provided outside the second main chamber outer wall 78. Yes. Air cutters 149 are provided above and below the workpiece supply / exhaust port 146.

  When the workpiece W is not supplied or discharged, the workpiece supply / exhaust port 146 is closed by the opening / closing shutter 147 to prevent the gas in the main chamber 80 from flowing out of the chamber 70. The air cutter 149 constitutes a curtain of gas flow. In this embodiment, the air cutter 149 makes the gas flow ejection direction slightly inward of the main chamber 80 from the plane parallel to the second main chamber outer wall 78. The gas in the chamber 80 is prevented from flowing into the clean room outside the chamber 70.

  As shown in FIGS. 1 and 3, the partition wall 76 that separates the main chamber 80 from the spare chamber 81 is used to perform various operations such as entering and leaving the main chamber 80 from the spare chamber 81 and maintenance of the droplet discharge device 1. A main chamber doorway 151 is formed, and a main chamber door 152 capable of closing the main chamber doorway 151 is provided. The main chamber door 152 is provided with a main chamber door open / close sensor 153 that is an open / close detection device that detects an open / closed state of the main chamber door 152. Further, the main room door 152 is provided with a main room door lock device 155 which is a lock device capable of opening the main room door 152 in a prohibited state. The main chamber door lock device 155 includes a main chamber door lock mechanism 156 and a first actuator 157 that drives the main chamber door lock mechanism 156, and the main actuator door lock mechanism 156 is moved by the first actuator 157 as will be described later. By operating, the main chamber door 152 is brought into an opening prohibition state or an opening permission state. The main chamber door 152 is manually opened and closed, and an opening / closing lever (not shown) for performing the opening / closing operation is intended to open the main chamber door 152 when an operator performs an opening operation, which will be described later. A main room door switch 158 (not shown in FIGS. 1, 2, and 3) is provided.

  Various operations such as replacement of the functional liquid tank 45, the cleaning liquid tank 46, the reuse tank 47, or the drainage tank 48 installed in the auxiliary chamber 82 from the auxiliary chamber 81 are performed on the partition wall 76 that separates the auxiliary chamber 82 and the auxiliary chamber 81. A sub chamber working port 171 which is an opening for performing is formed, and a sub chamber door 172 capable of closing the sub chamber working port 171 is provided. The sub chamber door 172 is provided with a sub chamber door open / close sensor 173 that is an open / close detection device that detects the open / close state of the sub chamber door 172. Further, the sub chamber door 172 is provided with a sub chamber door lock device 174 that is a lock device that can prevent the sub chamber door 172 from being opened. The sub chamber door lock device 174 includes a sub chamber door lock mechanism 176 and a third actuator 177 that drives the sub chamber door lock mechanism 176, and the sub actuator door lock mechanism 176 is operated by the third actuator 177 as will be described later. Thus, the sub chamber door 172 is brought into the opening prohibited state or the opening permitted state. The opening and closing of the sub chamber door 172 is performed manually, and an opening / closing lever (not shown) for performing the opening / closing operation is intended to open the sub chamber door 172 when the operator performs an opening operation, which will be described later. A sub-chamber door switch 178 (not shown in FIGS. 1 and 3) is provided.

  The first auxiliary chamber outer wall 91 and the second auxiliary chamber outer wall 92 forming the auxiliary chamber 81 are respectively provided with auxiliary chamber inlets / outlets 161 which are openings for entering / exiting the auxiliary chamber 81 from the outside of the chamber 70. A spare chamber door 162 capable of closing the spare chamber entrance / exit 161 is provided. The spare room door 162 is provided with a spare room door opening / closing sensor 163 which is an open / close detection device for detecting the open / closed state of the spare room door 162. Further, the spare room door 162 is provided with a spare room door lock device 164 which is a lock device capable of opening the spare room door 162 in a prohibited state. The spare chamber door lock device 164 includes a spare chamber door lock mechanism 166 and a second actuator 167 that drives the spare chamber door lock mechanism 166. As described later, the spare chamber door lock mechanism 166 is moved by the second actuator 167. By operating, the spare chamber door 162 is brought into the opening prohibition state or the opening permission state. The preliminary chamber door 162 is manually opened and closed, and an open / close lever (not shown) for performing the open / close operation is intended to open the preliminary chamber door 162 when an operator performs an open operation, which will be described later. A spare room door switch outside 168 is provided outside the chamber 70, and a spare room door switch inside 169 is provided in the spare room 81 (not shown). The preliminary chamber entrance / exit 161 corresponds to the external entrance / exit described in the claims.

  Next, an electrical configuration for driving the chamber apparatus 7 having the above configuration will be described. FIG. 6 is an electrical configuration block diagram showing an electrical configuration of the chamber apparatus. The chamber control device 75 shown in FIG. 6 includes a chamber controller 182 incorporating a chamber control microcomputer 181 and a touch panel display 184 as an input device and a display device. As shown in FIG. 6, the chamber control microcomputer 181 includes a CPU (Central Processing Unit) 185 that performs arithmetic processing, a memory that stores various information, that is, a RAM 186a that is an information storage medium, and a ROM 186b. . The CPU 185 has a timer 187 that measures time.

  The main chamber exhaust damper 141, the spare chamber exhaust damper 143, the sub chamber exhaust damper 140, the first actuator 157, the second actuator 167, the third actuator 177, and the air cylinder 148 are respectively connected to the main chamber exhaust damper. The driver 141d, the spare chamber exhaust damper driver 143d, the first actuator driver 157d, the second actuator driver 167d, the third actuator driver 177d, and the air cylinder driver 148d are connected to the CPU 185. The main chamber exhaust flow sensor 142, the spare chamber exhaust flow sensor 144, the sub chamber exhaust flow sensor 145, the main chamber door opening / closing sensor 153, the spare chamber door opening / closing sensor 163, the sub chamber door opening / closing sensor 173, the main chamber door switch 158, The auxiliary room door switch 168, the auxiliary room door switch 169, the auxiliary room door switch 178, and the touch panel display 184 are also connected to the CPU 185 through an input / output interface (not shown).

The memory is RAM (Random Access Memory), ROM (Read Only Memory) of this embodiment.
) Etc., and a concept including an external storage device such as a hard disk, a CD-ROM reader, a disk-type storage medium, etc., and functionally, program software describing a procedure for controlling the operation of the chamber device 7 Are set, a work area for the CPU 185, an area functioning as a temporary file, and other various storage areas. The CPU 185 controls the supply and exhaust of the chamber 70 and the prohibition of opening of each door and the opening permission according to the program software stored in the ROM 186b.

  In the present embodiment, each of the above functions is realized by software using the CPU 185. However, when each of the above functions can be realized by a single electronic circuit that does not use the CPU, such electronic It is also possible to use a circuit.

  Hereinafter, operations related to opening and closing of the doors 152, 162, and 172 in the chamber apparatus 7 having the above-described configuration will be described. When the droplet discharge device 1 is operating normally and maintenance work is not performed, the doors 152, 162, and 172 of the chamber device 7 are closed. The main chamber 80 is supplied and exhausted, and the CPU 185 controls the main chamber exhaust damper 141 to control the exhaust flow rate. The actual exhaust flow rate is measured by a main chamber exhaust flow rate sensor 142 provided in the main chamber exhaust duct 88, and the measurement result is fed back to the CPU 185. In the present embodiment, the droplet discharge facility 10 is installed in a clean room, and in order to suppress the gas in the chamber 70 from flowing into the clean room, the room pressure in the main room 80 is higher than the room pressure in the clean room. The exhaust gas flow rate is controlled to be low.

  When the state in which all the doors of the chamber device 7 are closed continues for a predetermined time, the CPU 185 closes the preliminary chamber exhaust damper 143 and stops exhausting the preliminary chamber 81. In this case, the CPU 185 and the door opening / closing sensors 153, 153, and 173 correspond to the unmanned determination unit described in the claims. When the droplet discharge device 1 operates normally and does not perform maintenance work or the like, the doors 152, 162, and 172 of the chamber device 7 are closed, and the lock devices for the doors 152, 162, and 172 are closed. Reference numerals 155, 164, and 174 indicate that the doors 152, 162, and 172 are prohibited from being opened, and the spare chamber 81 is in a state where exhaust is stopped and supply / exhaust is stopped.

  First, the doors 152, 162, and 172 of the chamber device 7 are closed, the lock device of each door prohibits the opening of each door, and the main chamber 80 is supplied and exhausted. The operation when the spare chamber 81 enters the chamber 70 in a state where the supply / exhaust is stopped will be described. FIG. 7 is a flowchart for explaining the operation of the chamber apparatus when entering the chamber from the outside of the chamber.

  When the operator operates an open / close lever that opens the spare room door 162, the spare room door outside switch 168 is turned on (YES in step S21). At this time, the auxiliary chamber door locking device 164 remains in the open prohibited state, and the auxiliary chamber door 162 cannot be opened. Based on the detection result of the main room door opening / closing sensor 153, the main room door 152 is confirmed to be closed (step S22). If the main room door 152 is open (NO in step S22), a warning is given that the main room door 152 is open (step S23).

  If it is confirmed that the main chamber door 152 is closed (YES in step S22), the sub chamber door 172 is confirmed to be closed based on the detection result of the sub chamber door opening / closing sensor 173 (step S24). If the sub chamber door 172 is opened (NO in step S24), a warning is issued that the sub chamber door 172 is opened (step S25).

  When it is confirmed that the sub chamber door 172 is closed (YES in step S24), the auxiliary chamber exhaust damper 143 is opened to exhaust the auxiliary chamber 81 (step S26). After the preliminary chamber exhaust damper 143 is opened and exhaust of the preliminary chamber 81 is started, the elapsed time is measured by the timer 187 and the exhaust is continued for a predetermined time in which the gas in the preliminary chamber 81 can be replaced. (Step S27). The spare room door locking device 164 is released from the open prohibition state and can open the spare room door 162 (step S28). Note that an exhaust flow rate from the spare chamber 81 is measured by a spare chamber exhaust flow sensor 144 provided in the spare chamber exhaust duct 98, and the opening state of the spare chamber exhaust damper 143 is controlled so as to be a predetermined flow rate. Is done.

  Next, an operation when the main chamber door 152 is opened while the auxiliary chamber door 162 that can be opened through the respective steps of FIG. In this case, the doors 152, 162, and 172 of the chamber device 7 are closed, and the main chamber door lock device 155 and the sub chamber door lock device 174 set the main chamber door 152 and the sub chamber door 172 to the open prohibited state. The main chamber 80 and the spare chamber 81 are supplied and exhausted. FIG. 8 is a flowchart for explaining the operation of the chamber apparatus when the main chamber door is opened in the state of entering the spare chamber.

  When the operator operates the open / close lever that opens the main chamber door 152, the main chamber door switch 158 is turned on (YES in step S31). At this time, the main chamber door lock device 155 remains in the open prohibited state, and the main chamber door 152 cannot be opened. Based on the detection result of the spare chamber door opening / closing sensor 163, it is confirmed that the spare chamber door 162 is closed (step S32). If the spare room door 162 is opened (NO in step S32), a warning is given that the spare room door 162 is opened (step S33). In this embodiment, a buzzer installed in the spare room 81 sounds.

  When it is confirmed that the spare room door 162 is closed (YES in step S32), the spare room door lock device 164 is operated to lock the spare room door 162 and to be in an open prohibited state (step S34). Note that although one spare chamber 81 is provided with two spare chamber doors 162, it is assumed that the spare chamber door 162 is closed only when both of the two spare chamber doors 162 are closed. Take control. Further, the two preliminary chamber door locking devices 164 are controlled so that both are in the same state.

  The elapsed time after the preliminary chamber door 162 is closed by the timer 187 is counted, and it is confirmed whether or not a predetermined time has passed in which the gas in the preliminary chamber 81 can be replaced, that is, exhaustion is continued for a predetermined time. (Step S35). If the predetermined time has not elapsed (NO in step S35), the state is maintained as it is until the predetermined time elapses. When the predetermined time has elapsed (YES in step S35), the main chamber door lock device 155 is released from the open prohibition state and can open the main chamber door 152 (step S36). An operator manually opens the main chamber door 152 and performs operations such as maintenance of the droplet discharge device 1. While the worker is inside the chamber 70, the main room door 152 is opened and the work is performed.

  Further, when the auxiliary chamber door 162 that can be opened through the steps of FIG. 7 described above is opened and the auxiliary chamber door 172 is opened in the state of entering the auxiliary chamber 81, the operation shown in FIG. This is the same as when the main chamber door 152 is opened through the steps.

  Next, an operation when the main chamber door 152 that can be opened through the steps of FIG. 8 described above is opened and various operations are performed, and then the spare chamber door 162 is opened and the chamber 70 is exited will be described. In this case, the worker is inside the chamber 70 and the main room door 152 is opened. The spare room door 162 is closed, the spare room door lock device 164 prohibits the opening of the spare room door 162, and the main room 80 and the spare room 81 are supplied and exhausted.

  Control of the chamber pressure in the main chamber 80 is performed by keeping the air supply state from the air conditioner 71 substantially constant and adjusting the opening state of the main chamber exhaust damper 141 in the main chamber exhaust duct 88. Furthermore, the exhaust flow rate is measured by the main chamber exhaust flow rate sensor 142, and the flow rate can be adjusted according to the measurement result. The chamber pressure in the auxiliary chamber 81 is controlled by adjusting the opening state of the auxiliary chamber exhaust damper 143 in the auxiliary chamber exhaust duct 98 while the air supply state from the air conditioner 71 is substantially constant. Further, the exhaust flow rate sensor 144 measures the exhaust flow rate, and the flow rate can be adjusted according to the measurement result.

  The droplet discharge facility 10 in this embodiment is installed in a clean room, and it is not preferable that the gas in the chamber 70 flows out into the clean room. Accordingly, the opening state of the auxiliary chamber exhaust damper 143 is adjusted so that the chamber pressure in the auxiliary chamber 81 is lower than the chamber pressure in the clean room corresponding to the outside of the chamber device 7. Further, the opening state of the main chamber exhaust damper 141 is adjusted so that the chamber pressure in the main chamber 80 is lower than the chamber pressure in the auxiliary chamber 81.

  FIG. 9 is a flowchart for explaining the operation of the chamber apparatus when the auxiliary chamber door 162 is opened and the chamber 70 is exited. In order to open the spare chamber door 162, first, the opened main chamber door 152 is closed, the sub chamber door 172 is closed, and the spare chamber 81 and the main chamber 80 or the sub chamber 82 are isolated. . When the operator operates an open / close lever for opening the spare chamber door 162 in the spare chamber 81, the spare chamber door switch 169 is turned on (YES in step S41). At this time, the auxiliary chamber door locking device 164 remains in the open prohibited state, and the auxiliary chamber door 162 cannot be opened.

  Based on the detection result of the main room door opening / closing sensor 153, the main room door 152 is confirmed to be closed (step S42). If the main chamber door 152 is open (NO in step S42), a warning that the main chamber door 152 is open is issued (step S43). In this embodiment, a buzzer installed in the spare room 81 sounds. If it is confirmed that the main chamber door 152 is closed (YES in step S42), the main chamber door lock device 155 is operated to lock the main chamber door 152 and make it in an open prohibition state (step S44).

  Next, the closing of the sub chamber door 172 is confirmed based on the detection result of the sub chamber door opening / closing sensor 173 (step S45). If the sub chamber door 172 is opened (NO in step S45), a warning is issued that the sub chamber door 172 is opened (step S46). In this embodiment, a buzzer installed in the spare room 81 sounds. When it is confirmed that the sub chamber door 172 is closed (YES in step S45), the sub chamber door lock device 174 is operated to lock the sub chamber door 172 and to make it in an open prohibition state (step S47).

  Next, in step S48, the timer 187 counts the elapsed time since the door that was closed later in the main chamber door 152 and the sub chamber door 172 is closed, and the gas in the spare chamber 81 is It is confirmed whether or not a predetermined time that can be replaced has elapsed, that is, whether or not exhaustion has been continued for a predetermined time. If the predetermined time has not elapsed (NO in step S48), the state is continued as it is until the predetermined time elapses. When the predetermined time has elapsed (YES in step S48), the spare room door locking device 164 is released from the open prohibition state (locked state) and can open the spare room door 162 (step S49).

  Next, the spare room door opening / closing sensor 163 confirms that the spare room door 162 is once opened (step S50), and further confirms that the spare room door 162 is closed (step S51). If NO in step S50 or step S51, the process waits in the state after executing step S49. When the spare room door 162 is once opened (YES in step S50) and the spare room door 162 is further closed (YES in step S51), the spare room door locking device 164 is operated to open the spare room door 162. It is locked to be in an open prohibition state (step S52). In addition, although two preliminary chamber doors 162 are provided in one preliminary chamber 81, if opening and the subsequent closure are confirmed in one preliminary chamber door 162, two preliminary chamber doors 162 are provided. Step S52 is executed.

  The elapsed time after the preliminary chamber door 162 is closed by the timer 187 is counted, and it is confirmed whether or not a predetermined time has passed in which the gas in the preliminary chamber 81 can be replaced, that is, exhaustion is continued for a predetermined time. (Step S53). If the predetermined time has not elapsed (NO in step S53), the state is continued as it is until the predetermined time elapses. If the predetermined time has elapsed (YES in step S53), the auxiliary chamber exhaust damper 143 is closed and the exhaust of the auxiliary chamber 81 is stopped (step S54).

According to the first embodiment, the following effects can be obtained.
(1) The chamber 70 has a main chamber 80 and a spare chamber 81. The main chamber 80 communicates with the outside through the spare chamber 81, and is provided with a main chamber door 152 and a spare chamber door 162. Since the chamber entrance / exit 151 and the auxiliary chamber entrance / exit 161 can be closed, the main chamber 80 and the outside are not in direct communication with each other, the door can be closed to block communication, and the gas in the main chamber 80 can be blocked. Leaking outside the chamber 70 can be suppressed.

  (2) Since the air supply ducts 86 and 96 and the exhaust ducts 88 and 98 are installed in the main chamber 80 and the spare chamber 81, respectively, before the gas that has entered the spare chamber 81 from the main chamber 80 flows out to the outside. The gas inside the main chamber 80 can be more reliably suppressed from leaking outside the chamber 70.

  (3) An open / close sensor that detects the open / closed state of the main chamber door 152 and the auxiliary chamber door 162 and a lock device that can be locked in the open prohibited state are provided so that when one is open, the other is locked. Because of the control, there is no opportunity for the main chamber 80 and the outside to be in a continuous state, and even if the gas in the main chamber 80 enters the spare chamber 81, it cannot further flow out to the outside. Therefore, the possibility that the gas in the main chamber 80 flows out of the spare chamber 81 and flows outside can be extremely reduced.

  (4) The time after the doors are closed is measured by the timer 187, and when the predetermined time elapses, the chamber 70 is determined to be unattended, and the spare chamber exhaust damper 143 is closed. Therefore, the energy required for the operation can be reduced by stopping the ventilation of the spare room 81 which is not necessary in the unattended state and reducing the air supply load of the air conditioner 71.

  (5) When an operator enters the spare room 81 from the outside of the chamber 70, the timer 187 measures the ventilation execution time of the spare room 81, and the spare time is reached after the time during which the entire capacity in the spare room 81 is vented. The chamber door 162 can be opened. Therefore, any gas that has entered the spare chamber 81 from the main chamber 80 can be removed before the spare chamber door 162 is opened, and as the operator enters the spare chamber 81 from the outside of the chamber 70. Further, it is possible to more reliably suppress the gas inside the main chamber 80 from leaking outside the chamber 70.

  (6) When the worker leaves the spare room 81 from the spare room 81, the timer 187 measures the ventilation time of the spare room 81 after the main room door 152 is closed, and the total capacity in the spare room 81 is The spare room door 162 can be opened after the time for ventilation has elapsed. As a result, the gas that has entered the spare chamber 81 from the main chamber 80 can be eliminated before the spare chamber door 162 is opened, and the gas inside the main chamber 80 is more reliably prevented from leaking outside the chamber 70. can do.

  (7) When the worker goes out of the chamber 70 from the spare chamber 81, the timer 187 measures the ventilation execution time of the spare chamber 81 after the sub chamber door 172 is closed, and the total capacity in the spare chamber 81 is The spare room door 162 can be opened after the time for ventilation has elapsed. As a result, the gas that has entered the auxiliary chamber 81 from the sub chamber 82 can be eliminated before the auxiliary chamber door 162 is opened, and the gas inside the auxiliary chamber 82 is more reliably suppressed from leaking outside the chamber 70. can do.

  (8) In the spare chamber 81, the spare chamber door 162 can be closed and the main chamber door 152 can be opened, and maintenance work such as the droplet discharge device 1 can be performed. Without being provided, it is possible to realize a work environment that is shut off from the outside, and it is possible to prevent the gas inside the main chamber 80 from leaking outside the chamber 70 and to save the space of the equipment.

  (9) By controlling the exhaust amount from the main chamber 80 by the main chamber exhaust damper 141, the chamber pressure of the main chamber 80 is controlled, and by controlling the exhaust amount from the spare chamber 81 by the spare chamber exhaust damper 143. By controlling the chamber pressure of the spare chamber 81 and making the chamber pressure of the spare chamber 81 higher than the chamber pressure of the main chamber 80, it is possible to suppress the gas inside the main chamber 80 from flowing into the spare chamber 81. The gas inside the main chamber 80 can be more reliably suppressed from leaking outside the chamber 70.

  (10) By controlling the exhaust amount from the spare chamber 81 by the spare chamber exhaust damper 143, the chamber pressure of the spare chamber 81 is controlled, and the chamber pressure of the spare chamber 81 is controlled by the room pressure of the clean room outside the chamber 70. By making it low, it can suppress that the gas inside the preliminary | backup room 81 flows out into a clean room, and can suppress more reliably that the gas inside the main chamber 80 leaks into the clean room which is the exterior of the chamber 70. .

  (11) A main chamber 80 that accommodates the droplet discharge device 1 is divided to provide a sub chamber 82, and a functional liquid tank 45 that is highly likely to generate evaporation gas such as a solvent of the functional liquid in the sub chamber 82, and a cleaning liquid tank 46, the reuse tank 47, and the drainage tank 48 are accommodated, so that the atmosphere of the droplet discharge device 1 can be prevented from being contaminated with evaporating gas such as a solvent of the functional liquid.

  (12) Since the partition 76 separating the auxiliary chamber 81 and the sub chamber 82 is provided with the sub chamber working port 171 capable of replacing the functional liquid tank 45 in the sub chamber 82 and the like, the sub chamber working port 171 is provided. Work such as replacement of the functional liquid tank 45 can be performed from the spare chamber 81, and evaporating gas such as a solvent of the functional liquid leaks to a clean room outside the chamber 70 by work such as replacement of the functional liquid tank 45. Can be suppressed.

  (13) Open / close sensors 163 and 173 that detect the open / closed state of the sub chamber door 172 and the auxiliary chamber door 162 and lock devices 164 and 174 that can be locked in the open prohibited state are provided, and when one is open, the other Was controlled to be locked. As a result, there is no opportunity for the sub chamber 82 and the outside to be in a continuous state, and even if the gas in the sub chamber 82 enters the spare chamber 81, it cannot further flow out to the outside. Therefore, the possibility that the gas in the sub chamber 82 flows out of the auxiliary chamber 81 to the outside can be extremely reduced.

  (14) The workpiece supply / exhaust port 146 is provided in the second main chamber outer wall 78, the air cutters 149 are provided above and below the workpiece supply / exhaust port 146, and the gas flow direction of the air cutter 149 is parallel to the second main chamber outer wall 78. By making it slightly inward of the main chamber 80 from the surface, it is possible to suppress the outflow of gas inside the main chamber 80 to the outside of the chamber 70 accompanying the supply and discharge of the workpiece W.

  (18) The work supply / exhaust port 146 is provided in the second main chamber outer wall 78, and the opening size thereof is set to a minimum size that allows the work W to enter and exit, and the exhaust amount from the main chamber 80 is controlled by the main chamber exhaust damper 141. As a result, the chamber pressure in the main chamber 80 is controlled, and the chamber pressure in the main chamber 80 is made lower than the chamber pressure in the external clean room. Can be prevented from flowing out to the outside.

(Second Embodiment)
Next, a second embodiment according to a droplet discharge facility that is an embodiment of the present invention will be described. The droplet discharge facility 210 of the present embodiment is configured by connecting three droplet discharge facilities 10 described in the first embodiment, and the droplet discharge device 1 as a work processing apparatus is the first one. This is exactly the same as the droplet discharge device 1 described in the embodiment. Only the configuration of the chamber equipment different from the first embodiment will be described.

  FIG. 10 is a plan view showing the arrangement of the droplet discharge equipment and peripheral devices. A droplet discharge facility 210 shown in FIG. 10 includes three droplet discharge devices 1 and a chamber facility 207 configured by three chamber devices 7 that accommodate the droplet discharge devices 1. Around the droplet discharge facility 210, there are three workpiece supply / discharge devices 221, workpiece storage shelves 222, and workpiece drying devices 223, each corresponding to each of the three droplet discharge devices 1. Placed in position.

  The workpiece supply / discharge device 221 is a device that supplies the unprocessed workpiece W to the droplet discharge device 1 via the workpiece supply / discharge port 146 and takes out the processed workpiece W. The workpiece storage shelf 222 temporarily stores the workpieces W before and after processing. The workpiece drying device 223 is a device that dries the workpiece W that has been subjected to droplet ejection processing by the droplet ejection device 1. The workpiece supply / discharge device 221 also supplies and takes out the workpiece W from the workpiece drying device 223.

  The chamber equipment 207 includes a chamber 270 including three chambers 70, three air conditioners 71, and three control panel boxes 72. The chamber 270 is configured by connecting three chambers 70 described in the first embodiment. The three chambers 70 are arranged so that the outer walls of the third preliminary chambers of the chambers 70 become joints and the workpiece supply / exhaust ports 146 are in the same direction. The joint portion removes the outer wall of the third auxiliary chamber, and the auxiliary chamber 281 sandwiched between the main chambers 80 has a shape in which two auxiliary chambers 81 described in the first embodiment are connected, and the main chambers on both sides are connected. There are 80 spare rooms.

  Although some of the spare chamber doors 162 provided on the outer wall 92 of the second spare chamber cannot be opened to the outside due to the installation of the work drying device 223, in this embodiment, the door is opened to the inside. By doing so, it can be opened. Furthermore, even if one of the spare chamber entrances / outlets 161 is entirely blocked, the other spare chamber door 162 provided on the first spare chamber outer wall 91 can be used to enter / exit the spare chamber 81 or the spare chamber 281.

  The three air conditioners 71 and the three control panel boxes 72 are arranged in the same manner as the droplet discharge facility 10 of the first embodiment with respect to the three main rooms 80, respectively. The chamber equipment 207 is operated independently for each set of the main room 80, the air conditioner 71, the control panel box 72, the spare room 81, and the spare room 281. However, the control related to the auxiliary chamber 281 sandwiched between the main chambers 80 is performed by the chamber control device 75 that performs the control related to the main chamber 80 having the sub chamber 82 adjacent to the auxiliary chamber 281. Although there are two main chamber doors 152 facing one spare chamber 281, each control is performed assuming that the main chamber door 152 is closed only when both of the two main chamber doors 152 are closed. Do. Further, the two main room door lock devices 155 are controlled so that both are in the same state. Each set operated independently operates in the same manner as the chamber apparatus 7 described in the first embodiment.

  The three droplet discharge devices 1 may perform the same process in parallel. Further, the three droplet discharge devices 1 may perform each of three different processes of the same workpiece W one by one.

According to the second embodiment, the following effects can be obtained.
(1) A work supply / exhaust port 146 is formed in the second main chamber outer wall 78 not facing the partition wall 76, and a spare chamber door 162 is provided in the first spare chamber outer wall 91 and the second spare chamber outer wall 92 not facing the partition wall 76, The chamber 70 was connected by a wall surface on which the preliminary chamber door 162 was not provided. Accordingly, the chamber equipment 207 in which the chamber devices 7 are connected can be formed without affecting the workpiece supply / exhaust port 146.

  (2) Since each spare room 81 has two spare room doors 162, even if one spare room door 162 cannot be used due to the convenience of peripheral devices, the other spare room door 162 is used. And the restriction on the degree of freedom of device arrangement can be reduced.

  (3) Since the chamber equipment 207 is formed by connecting the chamber devices 7, a large number of chamber devices can be efficiently installed without requiring a space between the chamber devices.

  (4) Similarly, it is possible to efficiently arrange a plurality of apparatuses that are desirably installed in the chamber apparatus.

  (5) Since the main chamber 80 that accommodates the droplet discharge device 1 is arranged so as to be continuous with the preliminary chamber 281 interposed therebetween, the same effect as that of the first embodiment can be obtained in the chamber equipment 207 that is connected to the chamber device 7. It is done.

(Third embodiment)
Next, as an electro-optical device (flat panel display) manufactured using the droplet discharge facility 10 or the droplet discharge facility 210 of the present invention, a color filter, a liquid crystal display device, an organic EL device, a plasma display (PDP device) The structure and the manufacturing method thereof will be described with reference to an electron emission device (FED device, SED device), an active matrix substrate formed in these display devices, and the like. Note that an active matrix substrate refers to a substrate on which a thin film transistor, a source line electrically connected to the thin film transistor, and a data line are formed.

  First, a method for manufacturing a color filter incorporated in a liquid crystal display device, an organic EL device or the like will be described. FIG. 11 is a flowchart showing the manufacturing process of the color filter, and FIG. 12 is a schematic cross-sectional view of the color filter 600 (filter base body 600A) of this embodiment shown in the order of the manufacturing process. First, in the black matrix forming step (S71), a black matrix 602 is formed on a substrate (W) 601 as shown in FIG. The black matrix 602 is formed of metal chromium, a laminate of metal chromium and chromium oxide, or resin black. In order to form the black matrix 602 made of a metal thin film, a sputtering method, a vapor deposition method, or the like can be used. Further, when forming the black matrix 602 made of a resin thin film, a gravure printing method, a photoresist method, a thermal transfer method, or the like can be used.

  Subsequently, in a bank formation step (S72), a bank 603 is formed in a state of being superimposed on the black matrix 602. That is, first, as shown in FIG. 12B, a resist layer 604 made of a negative transparent photosensitive resin is formed so as to cover the substrate 601 and the black matrix 602. Then, an exposure process is performed with the upper surface covered with a mask film 605 formed in a matrix pattern shape. Further, as shown in FIG. 12C, the resist layer 604 is patterned by etching an unexposed portion of the resist layer 604 to form a bank 603. When the black matrix is formed from resin black, it is possible to use both the black matrix and the bank. The bank 603 and the black matrix 602 below the bank 603 become partition wall portions 607b for partitioning the pixel regions 607a, and in the subsequent colored layer forming step, the colored layers (film forming portions) 608R, 608G, and 608B are formed by the droplet discharge head 111. The landing area of the functional droplet is defined when forming the.

  The filter substrate 600A is obtained through the above black matrix forming step and bank forming step. In the present embodiment, as the material of the bank 603, a resin material whose surface is lyophobic (hydrophobic) is used. Since the surface of the substrate (glass substrate) 601 is lyophilic (hydrophilic), the droplets into each pixel region 607a surrounded by the bank 603 (partition wall portion 607b) in the colored layer forming step described later. The landing position accuracy is improved.

  Next, in the colored layer forming step (S73), as shown in FIG. 12D, functional droplets are ejected by the droplet ejection head 111 and land in each pixel region 607a surrounded by the partition wall portion 607b. Let In this case, functional liquid droplets are ejected by introducing functional liquids (filter materials) of three colors of R, G, and B using the liquid droplet ejection head 111. Note that the arrangement pattern of the three colors R, G, and B includes a stripe arrangement, a mosaic arrangement, a delta arrangement, and the like.

  Thereafter, the functional liquid is fixed through a drying process (a process such as heating) to form three colored layers 608R, 608G, and 608B. If the colored layers 608R, 608G, and 608B are formed, the process proceeds to the protective film forming step (S74), and as shown in FIG. A protective film 609 is formed so as to cover the upper surface. That is, after the protective film coating liquid is discharged over the entire surface of the substrate 601 where the colored layers 608R, 608G, and 608B are formed, the protective film 609 is formed through a drying process. Then, after forming the protective film 609, the color filter 600 proceeds to a film forming process such as ITO (Indium Tin Oxide) which becomes a transparent electrode in the next process.

FIG. 13 is a cross-sectional view of a principal part showing a schematic configuration of a passive matrix liquid crystal device (liquid crystal device) as an example of a liquid crystal display device using the color filter 600 described above. By attaching auxiliary elements such as a liquid crystal driving IC, a backlight, and a support to the liquid crystal device 620, a transmissive liquid crystal display device as a final product can be obtained. Since the color filter 600 is the same as that shown in FIG. 12, the corresponding parts are denoted by the same reference numerals, and the description thereof is omitted.

  The liquid crystal device 620 is roughly constituted by a color filter 600, a counter substrate 621 made of a glass substrate, and a liquid crystal layer 622 made of an STN (Super Twisted Nematic) liquid crystal composition sandwiched between them. The filter 600 is arranged on the upper side (observer side) in the figure. Although not shown, polarizing plates are disposed on the outer surfaces of the counter substrate 621 and the color filter 600 (surfaces opposite to the liquid crystal layer 622 side), and the polarizing plates positioned on the counter substrate 621 side are also provided. A backlight is disposed outside.

  On the protective film 609 of the color filter 600 (on the liquid crystal layer side), a plurality of strip-shaped first electrodes 623 elongated in the left-right direction in FIG. 29 are formed at predetermined intervals. The color of the first electrode 623 A first alignment film 624 is formed so as to cover the surface opposite to the filter 600 side. On the other hand, a plurality of strip-shaped second electrodes 626 elongated in a direction orthogonal to the first electrode 623 of the color filter 600 are formed on the surface of the counter substrate 621 facing the color filter 600 at a predetermined interval. A second alignment film 627 is formed so as to cover the surface of the two electrodes 626 on the liquid crystal layer 622 side. The first electrode 623 and the second electrode 626 are made of a transparent conductive material such as ITO.

  The spacer 628 provided in the liquid crystal layer 622 is a member for keeping the thickness (cell gap) of the liquid crystal layer 622 constant. The sealing material 629 is a member for preventing the liquid crystal composition in the liquid crystal layer 622 from leaking to the outside. Note that one end portion of the first electrode 623 extends to the outside of the sealing material 629 as a lead-out wiring 623a. A portion where the first electrode 623 and the second electrode 626 intersect with each other is a pixel, and the color layers 608R, 608G, and 608B of the color filter 600 are located in the portion that becomes the pixel.

  In a normal manufacturing process, patterning of the first electrode 623 and application of the first alignment film 624 are performed on the color filter 600 to create a portion on the color filter 600 side. Patterning of the electrode 626 and application of the second alignment film 627 are performed to create a portion on the counter substrate 621 side. Thereafter, a spacer 628 and a sealing material 629 are formed in the portion on the counter substrate 621 side, and the portion on the color filter 600 side is bonded in this state. Next, liquid crystal constituting the liquid crystal layer 622 is injected from the inlet of the sealing material 629, and the inlet is closed. Thereafter, both polarizing plates and the backlight are laminated.

  The droplet discharge device 1 according to the embodiment applies, for example, the spacer material (functional liquid) that constitutes the cell gap, and before the portion on the color filter 600 side is bonded to the portion on the counter substrate 621 side, the sealing material The liquid crystal (functional liquid) can be uniformly applied to the region surrounded by 629. In addition, the above-described sealing material 629 can be printed by the droplet discharge head 111. Further, the first and second alignment films 624 and 627 can be applied by the droplet discharge head 111.

  FIG. 14 is a cross-sectional view of an essential part showing a schematic configuration of a second example of the liquid crystal device using the color filter 600 manufactured in the present embodiment. The liquid crystal device 630 is significantly different from the liquid crystal device 620 in that the color filter 600 is arranged on the lower side (the side opposite to the observer side) in the figure. The liquid crystal device 630 is generally configured by sandwiching a liquid crystal layer 632 made of STN liquid crystal between a color filter 600 and a counter substrate 631 made of a glass substrate or the like. Although not shown, polarizing plates and the like are provided on the outer surfaces of the counter substrate 631 and the color filter 600, respectively.

  On the protective film 609 of the color filter 600 (on the liquid crystal layer 632 side), a plurality of strip-shaped first electrodes 633 elongated in the depth direction in the figure are formed at predetermined intervals, and the liquid crystal of the first electrodes 633 is formed. A first alignment film 634 is formed so as to cover the surface on the layer 632 side. A plurality of strip-shaped second electrodes 636 extending in a direction orthogonal to the first electrode 633 on the color filter 600 side are formed on the surface of the counter substrate 631 facing the color filter 600 at a predetermined interval. A second alignment film 637 is formed so as to cover the surface of the second electrode 636 on the liquid crystal layer 632 side.

  The liquid crystal layer 632 is provided with a spacer 638 for keeping the thickness of the liquid crystal layer 632 constant, and a sealing material 639 for preventing the liquid crystal composition in the liquid crystal layer 632 from leaking to the outside. Yes. Similarly to the liquid crystal device 620 described above, a portion where the first electrode 633 and the second electrode 636 intersect with each other is a pixel, and the colored layers 608R, 608G, and 608B of the color filter 600 are located in the portion that becomes the pixel. Is configured to do.

  FIG. 15 shows a third example in which a liquid crystal device is configured using a color filter 600 to which the present invention is applied, and is an exploded perspective view showing a schematic configuration of a transmissive TFT (Thin Film Transistor) type liquid crystal device. It is. In the liquid crystal device 650, the color filter 600 is arranged on the upper side (observer side) in the drawing.

  The liquid crystal device 650 includes a color filter 600, a counter substrate 651 disposed so as to face the color filter 600, a liquid crystal layer (not shown) sandwiched therebetween, and an upper surface side (observer side) of the color filter 600. The polarizing plate 655 is generally configured by a polarizing plate 655 and a polarizing plate (not shown) disposed on the lower surface side of the counter substrate 651. A liquid crystal driving electrode 656 is formed on the surface of the protective film 609 of the color filter 600 (the surface on the counter substrate 651 side). The electrode 656 is made of a transparent conductive material such as ITO, and is a full surface electrode that covers the entire region where a pixel electrode 660 described later is formed. An alignment film 657 is provided so as to cover the surface of the electrode 656 opposite to the pixel electrode 660.

  An insulating layer 658 is formed on the surface of the counter substrate 651 facing the color filter 600, and the scanning lines 661 and the signal lines 662 are formed on the insulating layer 658 so as to be orthogonal to each other. A pixel electrode 660 is formed in a region surrounded by the scanning lines 661 and the signal lines 662. Note that in an actual liquid crystal device, an alignment film is provided over the pixel electrode 660, but the illustration is omitted.

  In addition, a thin film transistor 663 including a source electrode, a drain electrode, a semiconductor, and a gate electrode is incorporated in a portion surrounded by the cutout portion of the pixel electrode 660 and the scanning line 661 and the signal line 662. . The thin film transistor 663 is turned on / off by application of a signal to the scanning line 661 and the signal line 662 so that energization control to the pixel electrode 660 can be performed.

  The liquid crystal devices 620, 630, and 650 of the above examples have a transmissive configuration, but a reflective layer or a semi-transmissive reflective layer is provided to form a reflective liquid crystal device or a transflective liquid crystal device. You can also

  Next, FIG. 16 is a cross-sectional view of a main part of a display region (hereinafter simply referred to as a display device 700) of the organic EL device. The display device 700 is schematically configured with a circuit element portion 702, a light emitting element portion 703, and a cathode 704 laminated on a substrate (W) 701. In this display device 700, light emitted from the light emitting element portion 703 to the substrate 701 side is transmitted through the circuit element portion 702 and the substrate 701 and emitted to the observer side, and the light emitting element portion 703 is opposite to the substrate 701. After the light emitted to the side is reflected by the cathode 704, the light passes through the circuit element portion 702 and the substrate 701 and is emitted to the observer side.

  A base protective film 706 made of a silicon oxide film is formed between the circuit element portion 702 and the substrate 701, and an island-like semiconductor film 707 made of polycrystalline silicon is formed on the base protective film 706 (on the light emitting element portion 703 side). Is formed. In the left and right regions of the semiconductor film 707, a source region 707a and a drain region 707b are formed by high concentration cation implantation, respectively. A central portion where no cation is implanted is a channel region 707c.

  In the circuit element portion 702, a transparent gate insulating film 708 covering the base protective film 706 and the semiconductor film 707 is formed, and a position corresponding to the channel region 707c of the semiconductor film 707 on the gate insulating film 708 is formed. For example, a gate electrode 709 made of Al, Mo, Ta, Ti, W or the like is formed. A transparent first interlayer insulating film 711 a and second interlayer insulating film 711 b are formed on the gate electrode 709 and the gate insulating film 708. Further, contact holes 712a and 712b are formed through the first and second interlayer insulating films 711a and 711b and communicating with the source region 707a and the drain region 707b of the semiconductor film 707, respectively.

  A transparent pixel electrode 713 made of ITO or the like is patterned and formed on the second interlayer insulating film 711b in a predetermined shape, and the pixel electrode 713 is connected to the source region 707a through the contact hole 712a. . A power line 714 is disposed on the first interlayer insulating film 711a, and the power line 714 is connected to the drain region 707b through the contact hole 712b. Thus, the driving thin film transistors 715 connected to the pixel electrodes 713 are formed in the circuit element portion 702, respectively.

  The light emitting element portion 703 includes a functional layer 717 stacked on each of the plurality of pixel electrodes 713, and a bank portion 718 provided between each pixel electrode 713 and the functional layer 717 to partition each functional layer 717. It is roughly structured. The pixel electrode 713, the functional layer 717, and the cathode 704 provided on the functional layer 717 constitute a light emitting element. Note that the pixel electrode 713 is formed by patterning in a substantially rectangular shape in plan view, and a bank portion 718 is formed between the pixel electrodes 713.

Bank unit 718, for example SiO, and SiO _2, the inorganic bank layer is formed of an inorganic material such as TiO _2, 718a (first bank layer), stacked on the inorganic bank layer 718a, an acrylic resin, such as polyimide resin It is composed of an organic bank layer 718b (second bank layer) having a trapezoidal cross section formed of a resist having excellent heat resistance and solvent resistance. A part of the bank portion 718 is formed on the peripheral edge of the pixel electrode 713. Between each bank portion 718, an opening 719 that gradually expands upward with respect to the pixel electrode 713 is formed.

  The functional layer 717 includes a hole injection / transport layer 717a formed on the pixel electrode 713 in a stacked state in the opening 719 and a light emitting layer 717b formed on the hole injection / transport layer 717a. Has been. Note that another functional layer having other functions may be further formed adjacent to the light emitting layer 717b. For example, it is possible to form an electron transport layer. The hole injection / transport layer 717a has a function of transporting holes from the pixel electrode 713 side and injecting them into the light emitting layer 717b. The hole injection / transport layer 717a is formed by discharging a first composition (functional liquid) containing a hole injection / transport layer forming material. A known material is used as the hole injection / transport layer forming material.

  The light emitting layer 717b emits light in red (R), green (G), or blue (B), and discharges a second composition (functional liquid) containing a light emitting layer forming material (light emitting material). Is formed. As the solvent (nonpolar solvent) of the second composition, a known material insoluble in the hole injection / transport layer 717a is preferably used, and such a nonpolar solvent is used as the second composition of the light emitting layer 717b. By using the light emitting layer 717b, the light emitting layer 717b can be formed without re-dissolving the hole injection / transport layer 717a. The light emitting layer 717b is configured such that holes injected from the hole injection / transport layer 717a and electrons injected from the cathode 704 are recombined in the light emitting layer to emit light.

  The cathode 704 is formed so as to cover the entire surface of the light emitting element portion 703, and plays a role of flowing current to the functional layer 717 in a pair with the pixel electrode 713. Note that a sealing member (not shown) is disposed on the cathode 704.

  Next, a manufacturing process of the display device 700 will be described with reference to FIGS. As shown in FIG. 17, the display device 700 includes a bank part forming step (S81), a surface treatment step (S82), a hole injection / transport layer forming step (S83), a light emitting layer forming step (S84), It is manufactured through an electrode formation step (S85). In addition, a manufacturing process is not restricted to what is illustrated, and when other processes are removed as needed, it may be added.

  First, in the bank part forming step (S81), as shown in FIG. 18, an inorganic bank layer 718a is formed on the second interlayer insulating film 711b. The inorganic bank layer 718a is formed by forming an inorganic film at a formation position and then patterning the inorganic film using a photolithography technique or the like. At this time, a part of the inorganic bank layer 718 a is formed so as to overlap with the peripheral edge of the pixel electrode 713.

  When the inorganic bank layer 718a is formed, an organic bank layer 718b is formed on the inorganic bank layer 718a as shown in FIG. This organic bank layer 718b is also formed by patterning using a photolithography technique or the like, similarly to the inorganic bank layer 718a. In this way, the bank portion 718 is formed. Accordingly, an opening 719 that opens upward with respect to the pixel electrode 713 is formed between the bank portions 718. The opening 719 defines a pixel region.

  In the surface treatment step (S82), a lyophilic process and a lyophobic process are performed. The regions to be subjected to the lyophilic treatment are the first stacked portion 718aa of the inorganic bank layer 718a and the electrode surface 713a of the pixel electrode 713. These regions are made lyophilic by plasma treatment using, for example, oxygen as a treatment gas. Is done. This plasma treatment also serves to clean the ITO that is the pixel electrode 713. In addition, the lyophobic treatment is performed on the wall surface 718s of the organic bank layer 718b and the upper surface 718t of the organic bank layer 718b, and the surface is fluorinated (treated to be liquid repellent) by plasma treatment using, for example, tetrafluoromethane. ) By performing this surface treatment process, when forming the functional layer 717 using the droplet discharge head 111, the functional droplet can be landed more reliably on the pixel region, and has landed on the pixel region. It is possible to prevent the functional droplet from overflowing from the opening 719.

  The display device base 700A is obtained through the above steps. The display device base 700A is placed on the substrate table 3 of the droplet discharge device 1 shown in FIGS. 1 and 2, and the following hole injection / transport layer forming step (S83) and light emitting layer forming step (S84). Is done.

  As shown in FIG. 20, in the hole injection / transport layer forming step (S83), the first composition containing the hole injection / transport layer forming material is transferred from the droplet discharge head 111 into each opening 719 that is a pixel region. To discharge. Then, as shown in FIG. 37, a drying process and a heat treatment are performed to evaporate the polar solvent contained in the first composition, thereby forming a hole injection / transport layer 717a on the pixel electrode (electrode surface 713a) 713.

  Next, the light emitting layer forming step (S84) will be described. In this light emitting layer forming step, as described above, in order to prevent re-dissolution of the hole injection / transport layer 717a, a hole injection / transport layer 717a is used as a solvent for the second composition used in forming the light emitting layer. A non-polar solvent insoluble in. However, since the hole injection / transport layer 717a has a low affinity for the nonpolar solvent, the hole injection / transport layer 717a has a low affinity even if the second composition containing the nonpolar solvent is discharged onto the hole injection / transport layer 717a. There is a possibility that the injection / transport layer 717a and the light emitting layer 717b cannot be adhered to each other or the light emitting layer 717b cannot be applied uniformly. Therefore, in order to increase the surface affinity of the hole injection / transport layer 717a with respect to the nonpolar solvent and the light emitting layer forming material, it is preferable to perform a surface treatment (surface modification treatment) before forming the light emitting layer. In this surface treatment, a surface modifying material which is the same solvent as the non-polar solvent of the second composition used in forming the light emitting layer or a similar solvent is applied on the hole injection / transport layer 717a, and this is applied. This is done by drying. By performing such a treatment, the surface of the hole injection / transport layer 717a is easily adapted to the nonpolar solvent, and in the subsequent process, the second composition containing the light emitting layer forming material is added to the hole injection / transport layer. It can be uniformly applied to 717a.

  Then, as shown in FIG. 22, the second composition containing the light emitting layer forming material corresponding to one of the colors (blue (B) in the example of FIG. 22) is used as a functional droplet as a pixel region ( A predetermined amount is driven into the opening 719). The second composition driven into the pixel region spreads on the hole injection / transport layer 717a and fills the opening 719. Even if the second composition deviates from the pixel region and lands on the upper surface 718t of the bank portion 718, the upper composition 718t is subjected to the liquid repellent treatment as described above, and thus the second composition An object is easy to roll into the opening 719.

  Thereafter, the second composition after discharge is dried by performing a drying process and the like, the nonpolar solvent contained in the second composition is evaporated, and as shown in FIG. 23, the hole injection / transport layer 717a A light emitting layer 717b is formed thereon. In the case of this figure, a light emitting layer 717b corresponding to blue (B) is formed.

  Similarly, using the droplet discharge head 111, as shown in FIG. 24, the same steps as in the case of the light emitting layer 717b corresponding to the blue (B) described above are sequentially performed, and other colors (red (R) and green) are performed. A light emitting layer 717b corresponding to (G)) is formed. Note that the order in which the light-emitting layers 717b are formed is not limited to the illustrated order, and may be formed in any order. For example, the order of formation can be determined according to the light emitting layer forming material. Further, the arrangement pattern of the three colors R, G, and B includes a stripe arrangement, a mosaic arrangement, a delta arrangement, and the like.

  As described above, the functional layer 717, that is, the hole injection / transport layer 717 a and the light emitting layer 717 b are formed on the pixel electrode 713. And it transfers to a counter electrode formation process (S85).

In the counter electrode forming step (S85), as shown in FIG. 25, a cathode 704 (counter electrode) is formed on the entire surface of the light emitting layer 717b and the organic bank layer 718b by, for example, vapor deposition, sputtering, CVD, or the like. In the present embodiment, the cathode 704 is configured, for example, by laminating a calcium layer and an aluminum layer. On top of the cathode 704, an Al film and an Ag film as electrodes, and a protective layer such as SiO ₂ and SiN for preventing oxidation thereof are provided as appropriate.

  After forming the cathode 704 in this way, the display device 700 is obtained by performing other processing such as sealing processing and wiring processing for sealing the upper portion of the cathode 704 with a sealing member.

  Next, FIG. 26 is an exploded perspective view of an essential part of a plasma display device (PDP device: hereinafter simply referred to as a display device 800). In the figure, the display device 800 is shown with a part thereof cut away. The display device 800 includes a first substrate 801, a second substrate 802, and a discharge display portion 803 formed between the first substrate 801 and the second substrate 802, which are disposed to face each other. The discharge display unit 803 includes a plurality of discharge chambers 805. Among the plurality of discharge chambers 805, the three discharge chambers 805 of the red discharge chamber 805R, the green discharge chamber 805G, and the blue discharge chamber 805B are arranged to form one pixel.

  Address electrodes 806 are formed in stripes at predetermined intervals on the upper surface of the first substrate 801, and a dielectric layer 807 is formed so as to cover the address electrodes 806 and the upper surface of the first substrate 801. On the dielectric layer 807, partition walls 808 are provided so as to be positioned between the address electrodes 806 and along the address electrodes 806. The partition 808 includes one extending on both sides in the width direction of the address electrode 806 as shown, and one not shown extending in a direction orthogonal to the address electrode 806. A region partitioned by the partition 808 is a discharge chamber 805.

  A phosphor 809 is disposed in the discharge chamber 805. The phosphor 809 emits red (R), green (G), or blue (B) fluorescence, and the red phosphor 809R is located at the bottom of the red discharge chamber 805R, and the green discharge chamber 805G. A green phosphor 809G and a blue phosphor 809B are disposed at the bottom and the blue discharge chamber 805B, respectively.

  On the lower surface of the second substrate 802 in the figure, a plurality of display electrodes 811 are formed in stripes at predetermined intervals in a direction orthogonal to the address electrodes 806. A dielectric layer 812 and a protective film 813 made of MgO or the like are formed so as to cover them. The first substrate 801 and the second substrate 802 are bonded so that the address electrodes 806 and the display electrodes 811 face each other in a state of being orthogonal to each other. The address electrode 806 and the display electrode 811 are connected to an AC power source (not shown). When the electrodes 806 and 811 are energized, the phosphor 809 emits light in the discharge display portion 803, and color display is possible.

  In the present embodiment, the address electrode 806, the display electrode 811, and the phosphor 809 can be formed using the droplet discharge device 1 shown in FIGS. Hereinafter, a process of forming the address electrode 806 in the first substrate 801 will be exemplified. In this case, the following steps are performed with the first substrate 801 placed on the substrate table 3 of the droplet discharge device 1. First, a liquid material (functional liquid) containing a conductive film wiring forming material is landed on the address electrode formation region as a functional liquid droplet by the liquid droplet ejection head 111. This liquid material is obtained by dispersing conductive fine particles such as metal in a dispersion medium as a conductive film wiring forming material. As the conductive fine particles, metal fine particles containing gold, silver, copper, palladium, nickel, or the like, a conductive polymer, or the like is used.

  When the replenishment of the liquid material is completed for all the address electrode formation regions to be replenished, the address material 806 is formed by drying the discharged liquid material and evaporating the dispersion medium contained in the liquid material. .

  By the way, although the formation of the address electrode 806 has been exemplified in the above, the display electrode 811 and the phosphor 809 can also be formed through the above steps. In the case of forming the display electrode 811, as in the case of the address electrode 806, a liquid material (functional liquid) containing a conductive film wiring forming material is landed on the display electrode formation region as a functional droplet. In the case of forming the phosphor 809, a liquid material (functional liquid) containing a fluorescent material corresponding to each color (R, G, B) is discharged as a droplet from the droplet discharge head 111, and the corresponding color In the discharge chamber 805.

  Next, FIG. 27 is a cross-sectional view of an essential part of an electron emission device (also referred to as an FED device or an SED device: hereinafter simply referred to as a display device 900). In the figure, a part of the display device 900 is shown as a cross section. The display device 900 is schematically configured to include a first substrate 901 and a second substrate 902 that are arranged to face each other, and a field emission display portion 903 formed therebetween. The field emission display unit 903 includes a plurality of electron emission units 905 arranged in a matrix.

  A first element electrode 906a and a second element electrode 906b constituting the cathode electrode 906 are formed on the upper surface of the first substrate 901 so as to be orthogonal to each other. In addition, a conductive film 907 having a gap 908 is formed in a portion partitioned by the first element electrode 906a and the second element electrode 906b. In other words, the first element electrode 906a, the second element electrode 906b, and the conductive film 907 constitute a plurality of electron emission portions 905. The conductive film 907 is made of, for example, palladium oxide (PdO), and the gap 908 is formed by forming after forming the conductive film 907.

  An anode electrode 909 facing the cathode electrode 906 is formed on the lower surface of the second substrate 902. A lattice-shaped bank portion 911 is formed on the lower surface of the anode electrode 909, and a phosphor 913 is disposed in each downward opening 912 surrounded by the bank portion 911 so as to correspond to the electron emission portion 905. Yes. The phosphor 913 emits fluorescence of any color of red (R), green (G), and blue (B), and each opening 912 has a red phosphor 913R, a green phosphor 913G, and a blue color. The phosphors 913B are arranged in the predetermined pattern described above.

  The first substrate 901 and the second substrate 902 configured as described above are bonded together with a minute gap. In this display device 900, electrons that jump out of the first element electrode 906a or the second element electrode 906b, which are cathodes, via the conductive film (gap 908) 907 are transferred to the phosphor 913 formed on the anode electrode 909 that is an anode. When excited, it emits light and enables color display.

  Also in this case, as in the other embodiments, the first element electrode 906a, the second element electrode 906b, the conductive film 907, and the anode electrode 909 can be formed using the droplet discharge device 1 and each color. The phosphors 913R, 913G, and 913B can be formed using the droplet discharge device 1.

  The first element electrode 906a, the second element electrode 906b, and the conductive film 907 have a planar shape shown in FIG. 28A. When these are formed, as shown in FIG. In addition, the bank portion BB is formed (photolithographic method), leaving portions where the first element electrode 906a, the second element electrode 906b, and the conductive film 907 are previously formed. Next, the first element electrode 906a and the second element electrode 906b were formed in the groove portion constituted by the bank portion BB (inkjet method using the droplet discharge device 1), and the solvent was dried to form a film. After that, a conductive film 907 is formed (an ink jet method using the droplet discharge device 1). Then, after forming the conductive film 907, the bank portion BB is removed (ashing peeling process), and the process proceeds to the above forming process. As in the case of the organic EL device described above, it is preferable to perform a lyophilic process on the first substrate 901 and the second substrate 902 and a lyophobic process on the bank portions 911 and BB.

As other electro-optical devices, devices such as metal wiring formation, lens formation, resist formation, and light diffuser formation are conceivable. By using the droplet discharge facility 10 having the above-described droplet discharge device 1 for manufacturing various electro-optical devices (devices), it is possible to efficiently manufacture various electro-optical devices.

According to the third embodiment, the following effects can be obtained.
(1) The same effects as those of the first and second embodiments can be obtained, and the functional liquid mist generated in the process of forming the electro-optical device and the evaporated gas of the functional liquid solvent are used as a droplet discharge facility. The possibility of leaking to the outside can be greatly reduced.

  (2) Since it is possible to greatly reduce the possibility that the functional liquid mist and the evaporated gas of the functional liquid solvent leak to the outside of the droplet discharge facility, the functional liquid mist, Processes that handle products that are susceptible to the effects of evaporative gas in the solvent of the functional liquid can also be performed in the vicinity of the droplet discharge facility while maintaining an environment that is extremely unlikely to affect the electro-optical device. it can.

  (3) Since the production facilities can be provided close to each other, the need for transporting the semi-finished product is reduced, and the production can be performed efficiently. In addition, the chance of being transported in the state of a semi-finished product that is easily affected by the outside is reduced, and the possibility that the electro-optical device is adversely affected can be reduced.

  The embodiments of the present invention are not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention, and can be implemented as follows.

  (Modification 1) In the above embodiment, the droplet discharge facility of the present invention is installed in a clean room. However, the installation location may not be a clean atmosphere place such as a clean room. When using the droplet discharge facilities 10 and 210 in an unclean atmosphere, it is preferable to prevent the unclean atmosphere from entering the periphery of the droplet discharge device 1. Therefore, the opening state of the auxiliary chamber exhaust damper 143 is adjusted so that the chamber pressure in the auxiliary chamber 81 becomes higher than the outdoor chamber pressure (atmospheric pressure) of the chamber device 7 or the chamber equipment 207. Further, the opening state of the main chamber exhaust damper 141 and the spare chamber exhaust damper 143 is set so that the chamber pressure in the main chamber 80 becomes higher than the chamber pressure in the spare chamber 81.

  In addition, with respect to the air cutters 149 provided above and below the workpiece supply / exhaust port 146 provided in the second main chamber outer wall 78, the main chamber is slightly set in a direction in which the gas flow is ejected from a plane parallel to the second main chamber outer wall 78. In the outward direction of 80, the gas around the chamber 70 or 270 is prevented from entering the main chamber 80. Furthermore, although the air cutter 149 is provided inside the second main chamber outer wall 78 in the embodiment, it may be provided outside the second main chamber outer wall 78.

  (Modification 2) In the above-described embodiment, the lock device such as the main chamber door lock device 155 that can prevent the doors 152, 162, and 172 from being opened is provided, but it is essential to provide the lock device. is not. For example, when the lock device is abolished and, for example, when the main chamber door 152 is open, an attempt is made to open the spare chamber door 162, it is only necessary to warn that the main chamber door 152 is open. Also good. A lock mechanism is unnecessary, and the apparatus can be simplified and reduced in cost. Further, in the event of an emergency such as an abnormality in the droplet discharge device 1, if the warning is ignored, the chamber 70 can be quickly entered without being restricted by the operation of the chamber device 7, and the emergency situation can be quickly reached. Can be dealt with.

  (Modification 3) In the above embodiment, exhaust ducts 88 and 89 are provided in the main chamber 80 and the sub chamber 82, and the intake air to the main chamber 80 is also supplied to the sub chamber 82 formed at one corner of the main chamber. However, the exhaust duct may be provided in the sub chamber 82 so that the air supplied to the main chamber 80 does not flow directly into the sub chamber 82. In this case, the exhaust duct provided in the sub chamber 82 corresponds to the main chamber exhaust duct 88 in the above-described embodiment. In this case, the sub chamber wall 79 that separates the main chamber 80 and the sub chamber 82 is provided with a small-diameter ventilation window, and the gas around the droplet discharge device 1 in the main chamber 80 passes through the ventilation window. The gas in the chamber 82 is communicated.

  The air supplied from the air conditioner 71 passes through the air supply filter 87 and enters the main room ceiling 85, passes through the small-diameter opening of the main room ceiling 84, and is supplied to the main room 80. The air in the sub chamber 82 is exhausted to the factory exhaust facility via the main chamber exhaust duct 88 in the sub chamber 82, and the air in the main chamber 80 passes through the ventilation window of the sub chamber wall 79 and passes through the sub chamber 82. It flows into the interior and is exhausted to the exhaust facility of the factory through the main chamber exhaust duct 88 in the sub chamber 82.

  The chamber pressure in the main chamber 80 is controlled by adjusting the opening state of the main chamber exhaust damper 141 in the main chamber exhaust duct 88 provided in the sub chamber 82 while the air supply state from the air conditioner 71 is substantially constant. Has been. The chamber pressure in the auxiliary chamber 81 is controlled by adjusting the open state of the auxiliary chamber exhaust damper 143 in the auxiliary chamber exhaust duct 98 while the supply state from the air conditioner 71 is substantially constant. In the droplet discharge facility according to this actual modification, the main chamber exhaust damper 141 and the spare chamber exhaust damper 143 are opened so that the chamber pressure in the main chamber 80 and the chamber pressure in the spare chamber 81 are equal. It is adjusted.

  According to the configuration of this modified example, the chamber pressure in the main chamber 80 and the chamber pressure in the auxiliary chamber 81 are equal, and the main chamber 80 and the auxiliary chamber 81 are in the state in which the main chamber door 152 is opened. Airflow from one side to the other is unlikely to occur, and the gas in the main chamber 80 does not easily flow out to the spare chamber 81 or the gas in the spare chamber 81 does not easily enter the main chamber 80. Therefore, the gas in the main chamber 80 can be prevented from leaking outside the chamber 70, and the gas outside the chamber 70 can be prevented from entering the main chamber 80.

  In addition, according to the configuration of this modification, the main chamber 80 and the sub chamber 82 communicate with each other through a small-diameter ventilation window, and convection hardly occurs in the small-diameter ventilation window portion. It can be prevented that the gas in the sub chamber 82 is mixed and the atmosphere of the droplet discharge device 1 is contaminated with an evaporation gas such as a solvent of the functional liquid. Further, since the gas in the main chamber 80 is discharged through the sub chamber 82, the gas in the main chamber 80 flows into the sub chamber 82 via the small-diameter ventilation window, The possibility that the gas flows into the main chamber 80 becomes extremely small, and the atmosphere of the droplet discharge device 1 can be suppressed from being contaminated with an evaporation gas such as a solvent of the functional liquid.

  Further, according to the configuration of the present modification, the main chamber exhaust duct 88 is provided in the sub chamber 82 so that the gas in the main chamber 80 is discharged via the sub chamber 82 and the main chamber exhaust damper 141. By controlling the exhaust amount from the main chamber 80, the chamber pressure of the main chamber 80 is controlled, and by controlling the exhaust amount from the spare chamber 81 by the spare chamber exhaust damper 143, the chamber pressure of the spare chamber 81 is reduced. The chamber pressure in the preliminary chamber 81 and the chamber pressure in the main chamber 80 were made equal. As a result, the chamber pressure in the auxiliary chamber 81 becomes higher than the chamber pressure in the sub chamber 82, and it is possible to suppress the evaporating gas such as the solvent of the functional liquid in the sub chamber 82 from flowing into the auxiliary chamber 81. The gas in the chamber 82 can be prevented from leaking outside the chamber 70.

  (Modification 4) In the above embodiment, the air in the spare chamber 81 is replaced before the doors 152, 162, and 172 are opened, but the replacement of air is not essential. For example, the gas in the main chamber 80 is prevented from leaking into the auxiliary chamber 81 by making the chamber pressure in the auxiliary chamber 81 higher than the higher one of the chamber pressure in the main chamber 80 and the chamber pressure outside the chamber 70. In addition, the gas outside the chamber 70 can be prevented from entering the preliminary chamber 81. Therefore, the gas in the main chamber 80 can be prevented from leaking outside the chamber 70, and the gas outside the chamber 70 can be prevented from entering the main chamber 80.

  (Modification 5) In the above embodiment, the air in the spare chamber 81 is replaced before the operator opens the spare chamber door 162 in order to enter the chamber 70. Replacement of is not mandatory. For example, when using the droplet discharge facilities 10 and 210 in an unclean atmosphere, it is preferable to suppress an unclean atmosphere from entering the periphery of the droplet discharge device 1, and the gas in the main chamber 80 is chambered. 70 Leaking outside is not a problem. By omitting the replacement of the air in the spare chamber 81 before entering the chamber 70, the time required for the replacement of air becomes unnecessary, and the time can be saved.

  (Modification 6) In the above embodiment, the air in the spare chamber 81 is replaced before the main chamber door 152 or the sub chamber door 172 is opened after the operator enters the spare chamber 81. Air replacement is not essential. For example, when the droplet discharge facility 10 or 210 is used in a clean atmosphere such as a clean room, it is possible to suppress leakage of unclean gas around the droplet discharge device 1 or in the sub chamber 82 to the clean room. Preferably, it is not a problem that the gas in the clean room enters the main chamber 80 and the sub chamber 82. By omitting the replacement of the air in the spare chamber 81 before opening the main chamber door 152 or the sub chamber door 172, the time required for the replacement of the air becomes unnecessary, and time can be saved.

  (Modification 7) In the above embodiment, the air in the spare chamber 81 is replaced before the worker opens the spare chamber door 162 in order to exit the chamber 70. Replacement of is not mandatory. For example, when using the droplet discharge facilities 10 and 210 in an unclean atmosphere, it is preferable to suppress an unclean atmosphere from entering the periphery of the droplet discharge device 1, and the gas in the main chamber 80 is chambered. 70 Leaking outside is not a problem. By omitting the replacement of the air in the spare chamber 81 before leaving the chamber 70, the time required for the replacement of air becomes unnecessary, and the time can be saved.

  (Modification 8) In the above-described embodiment, the spare chamber 81 is exhausted for a predetermined time even after the worker has left the chamber 70 and the door is closed, but this replacement of air is not essential. . In this case, the main chamber door 152 and the sub chamber door 172 are closed, and external gas that may have entered the spare chamber 81 can be prevented from entering the main chamber 80. By stopping the exhaust immediately after the door is closed, the load on the air supply device can be reduced and energy consumption can be reduced.

  (Modification 9) In the above embodiment, the exhaust ducts 88 and 98 are connected to the exhaust equipment to exchange the air. However, compressed air may be used for supplying air. In the above embodiment, the control of the air flow rate and the control of the chamber pressure are performed by controlling the exhaust flow rate. In this case, the supply air flow rate is controlled to control the air flow rate and the control of the chamber pressure. Do.

  (Modification 10) In the above-described embodiment, each of the doors 152, 172, and 172 is configured to be manually opened / closed. However, the automatic opening / closing mechanism and the opening / closing switch for operating the automatic opening / closing mechanism are provided. Each door may be automatically opened and closed by the above operation. In this case, a locking device for each door may not be provided. When the open / close switch is operated so as to open the door, the door is quickly opened after performing the steps necessary to open the door shown in FIG. Moreover, when the door is opened after a predetermined time, it is possible to prevent the door from being opened for a long time due to forgetting to close it by automatically setting the door to be closed. However, the main chamber door 152 is detected when an operator is detected, and the main chamber door 152 is closed when the main chamber door 152 is opened for a predetermined time after the operator is no longer detected.

  (Modification 11) In the second embodiment, in the chamber equipment 207, the work supply / exhaust port 146 is provided in the second main chamber outer wall 78, and the work is supplied and discharged from the outside of the chamber equipment 207. The workpiece may be supplied and discharged from the spare chamber 281. In this case, the supply and discharge of the workpiece may be performed through the main chamber entrance / exit 151 or may be performed through the supply / exhaust port 146 provided with the supply / exhaust port 146 in the partition wall 76 on both sides of the spare chamber 281. . A workpiece supply / discharge device 221 may be installed in the spare chamber 281. Since there is no opportunity for the inside and outside of the chamber equipment 207 to communicate with the supply and discharge of the workpiece, the outflow of the gas in the chamber equipment 207 to the outside and the invasion of the outside gas into the chamber equipment 207 are suppressed. be able to.

  In addition, the work processing apparatus installed in the main chamber 80 adjacent to the spare room 281 is used to perform a continuous process, discharge the work W after the first process, and immediately perform the next process. You may make it supply. The movement process of the workpiece W is only required once, and the time between the processes can be saved.

  (Modification 12) In the second embodiment, in the chamber equipment 207, the work supply / exhaust port 146 is provided in the second main chamber outer wall 78, and the work is supplied and discharged from the outside of the chamber equipment 207. You may provide the 2nd preliminary | backup chamber which accommodates the workpiece | work supply / discharge apparatus 221, the workpiece | work storage shelf 222, and the workpiece | work drying apparatus 223. Further, the second preliminary chamber may be configured to accommodate one workpiece supply / discharge device 221, one workpiece storage shelf 222, and one workpiece drying device 223, or each of the three workpiece supply / discharge devices 221 and the workpiece storage shelf 222. The structure which accommodates the workpiece | work drying apparatus 223 may be sufficient. Since there is no opportunity for the inside and outside of the chamber equipment 207 to communicate with the supply and discharge of the workpiece, the outflow of the gas in the chamber equipment 207 to the outside and the invasion of the outside gas into the chamber equipment 207 are suppressed. be able to.

  (Modification 13) In the above embodiment, the control of the chamber pressures of the main chamber 80 and the auxiliary chamber 81 is performed by measuring the exhaust gas flow rate by the main chamber exhaust gas flow rate sensor 142 and the auxiliary chamber exhaust gas flow rate sensor 144, respectively. Although feedback is performed to the CPU 185 and the exhaust damper is controlled, pressure sensors in the main chamber 80 and the spare chamber 81 may be provided to measure the chamber pressure.

  (Modification 14) It is preferable that the chamber apparatus and the chamber equipment of the present invention are configured so that a part of the walls constituting the chamber apparatus or the whole wall on one side can be removed. By removing the wall, the work of installing the work processing apparatus in the main room 80 is facilitated.

  (Modification 15) It is preferable that the chamber apparatus and the chamber equipment of the present invention adopt an assembling method in which a work processing apparatus is installed and then a chamber apparatus or chamber equipment surrounding the installed work processing apparatus is assembled. This is useful in the case of a chamber apparatus or a chamber facility that accommodates a large work processing apparatus that is difficult to move because the work for bringing the work processing apparatus into the main room 80 is unnecessary.

  (Modification 16) In the above embodiment, in order to confirm the completion of the replacement of the gas in the spare chamber door 162, the timer 187 measures the elapsed time after the doors 152, 162, 172 are closed, It is confirmed whether or not a predetermined time in which the gas in the chamber 81 can be replaced has elapsed, that is, whether or not exhaustion has been continued for a predetermined time. However, the amount of the exhausted gas may be measured. That is, the exhaust flow rate sensor 144 may measure the exhaust flow rate and confirm that the gas replacement has been completed when the gas corresponding to the capacity of the spare chambers 81 and 281 has been exhausted.

  (Modification 17) In the above embodiment, the discharge timing from the droplet discharge head 111 is generated based on the movement distance (current position) of the substrate table 3 detected by the laser length measuring device 15. A glass scale may be provided in parallel with the linear motor 101, and the discharge timing may be generated based on the glass scale signal.

  (Modification 18) In the above embodiment, the two spare chamber door locking devices 164 provided in one spare chamber 81 are controlled so that both are in the same state. You may control to prohibit that both the doors 162 are open.

  In this case, for example, a case where the spare chamber door 152 is opened from the outside will be described. The auxiliary room door switch 168 is turned on (YES in step S21 in the above embodiment). Subsequently, the detection result of the main chamber door opening / closing sensor 153 confirms that the main chamber door 152 is closed (step S22 in the above embodiment), and the detection result of the sub chamber door opening / closing sensor 173 indicates that the sub chamber door 172 is closed. Confirmed (step S24). In addition, the open / close state of the spare room door 162 provided in the same spare room 81, 281 where the spare room door outside switch 168 is not turned on is also checked, and if it is opened, the spare room door on the opposite side is opened. A warning is issued that 162 is open.

  Further, the opening prohibition state is released, and the spare room door 162 can be opened (step S28 in the above embodiment). In the spare room door locking device 164, the spare room door outside switch 168 is in the ON state. Only. The spare room door lock device 164 of the spare room door 162 for which the spare room door outside switch 168 is not turned on is set to the opening prohibited state when the closing of the spare room door 162 is confirmed, and the opening prohibited state is maintained. Is done.

  Since only one of the two spare chamber doors 162 can be opened, the gas in the spare chambers 81 and 281 and the external gas are mixed as compared with the case where the two spare chamber doors 162 are opened. The possibility is low, and the gas in the main chamber can be more reliably prevented from leaking outside through the spare chambers 81 and 281 and the outside gas can be prevented from entering the spare chambers 81 and 281.

  (Modification 19) In the above-described embodiment, the main chamber door 152 can be opened regardless of whether the droplet discharge device 1 is in operation or not. However, when the droplet discharge device 1 is in an operating state, The opening of the main room door 152 may be prohibited. In this case, an operation sensor for detecting operation / non-operation of the droplet discharge device 1 is provided.

  In this case, the operation when the main chamber door 152 is opened while the spare chamber door 162 that can be opened through the steps of FIG. The doors 152, 162, 172 of the chamber device 7 are closed, and the main chamber door lock device 155 and the sub chamber door lock device 174 prohibit the main chamber door 152 and the sub chamber door 172 from being opened. The chamber 80 and the spare chamber 81 are supplied and exhausted.

  When the operator operates the opening / closing lever that opens the main chamber door 152, the main chamber door switch 158 is turned on (YES in step S31 of the above embodiment). At this time, the main chamber door lock device 155 remains in the open prohibited state, and the main chamber door 152 cannot be opened. The operation sensor confirms the operation / non-operation of the droplet discharge device 1. When the droplet discharge device 1 is in operation, a warning is given that the droplet discharge device 1 is in operation. If it is in a non-operating state, the process proceeds to a step (step S32) in which the closure of the auxiliary chamber door 162 is confirmed based on the detection result of the auxiliary chamber door opening / closing sensor 163 shown in FIG. Each step after step S33 is executed.

  When the droplet discharge device 1 is in an operating state, by discharging the droplets or drying the discharged droplets, the concentration of the organic gas from the functional liquid in the main chamber 80 or the mist concentration of the functional liquid is Higher than when not in operation. Accordingly, by prohibiting the opening of the main chamber door 152 when the droplet discharge device 1 is in operation, it is possible to further suppress the organic gas and mist in the main chamber 80 from flowing out to the spare chamber door 162. It is possible to suppress the organic gas or mist in the main chamber 80 from flowing out of the chambers 70 and 270.

  Further, when the droplet discharge device 1 is in an operating state, an operator cannot enter the main chamber 80, so that the possibility of sucking air with a high concentration of mist of organic gas or functional liquid can be reduced. Opportunities for working in an unfavorable health and safety environment can be reduced. In particular, when the droplet discharge device 1 is equipped with a device that generates a discharge that may harm the human body during operation, such as a soft X-ray discharger for removing static electricity generated in a product. Is effective for worker protection. In order to protect such an operator, wearing of a protector or the like is usually performed, but according to the configuration of the present modification, the protector or the like can be made unnecessary.

  Further, when the droplet discharge device 1 is in an operating state, it is possible to prevent an operator from approaching the droplet discharge device 1, so that the operator touches the operating portion of the droplet discharge device 1 that is in operation and is injured. And damage to the device can be prevented. Further, it is possible to prevent an operator from being injured or damaging the product by touching the product being processed.

  In order to prevent such damage to the device and product and the danger of the worker, it is necessary to provide a safety device, but according to the configuration of this modification, it is not essential to provide a safety device, It is possible to suppress an increase in cost for providing the danger prevention device, an increase in the size of the device, and an increase in installation space.

The technical idea grasped from the above-described embodiments and modifications will be described below.
(Technical Thought 1) A chamber apparatus according to the present invention, which is an open / close detection device that detects the open / closed states of the sub chamber door and the spare chamber door, and each of the sub chamber door and the spare chamber door. A lock device that sets the open prohibition state or the open prohibition release state, and activates the lock device based on the detection result of the open / close detection device, and at least one of the sub chamber door and the spare chamber door is in the open prohibition state. And a lock control device that controls the chamber device.

  According to this, when one of the sub chamber door and the spare chamber door is opened, the other is locked, so there is no opportunity for the sub chamber and the outside to be in a continuous state, and the sub chamber or the outside gas Even if it enters the spare room, it does not immediately flow out to the outside or the subchamber. Therefore, the possibility that the gas in the sub chamber or the outside flows out of the auxiliary chamber and flows out to the outside or the sub chamber can be extremely reduced.

  (Technical idea 2) The chamber apparatus described in the technical idea 1, further comprising a timing device capable of measuring a time from when the preliminary chamber door is opened and closed based on a detection result of the open / close detection device. The lock control device is configured such that when the predetermined time during which the exhaust device provided in the spare chamber exhausts a gas corresponding to at least the capacity of the spare chamber is measured by the timing device, the auxiliary device by the lock device is used. A chamber apparatus, wherein an opening prohibition state of a chamber door is canceled.

  According to this configuration, the gas in the spare chamber that may have been mixed with an external gas by opening the spare chamber door is supplied from the air supply device in a state where the spare chamber is isolated from the outside and the sub chamber. After being replaced by air, the subchamber door is opened. Therefore, the possibility that the gas that has entered the spare chamber from the outside further enters the sub chamber can be extremely reduced.

  (Technical Thought 3) The chamber device described in Technical Thought 1, further comprising a timing device that can measure the time from when the sub chamber door is opened and closed based on the detection result of the closing detection device. The lock control device is configured such that when the predetermined time during which the exhaust device provided in the spare chamber exhausts a gas corresponding to at least the capacity of the spare chamber is measured by the timing device, the spare device by the lock device A chamber apparatus, wherein an opening prohibition state of a chamber door is canceled.

  According to this configuration, the gas in the auxiliary chamber that may have been mixed with the gas in the auxiliary chamber by opening the auxiliary chamber door is supplied from the air supply device in a state where the auxiliary chamber is isolated from the outside and the auxiliary chamber. The spare room door is opened after the air is replaced. Therefore, the possibility that the gas that has entered the auxiliary chamber from the sub chamber further flows out to the outside can be extremely reduced.

  (Technical Thought 4) A chamber device according to the present invention, wherein the open / close detection device detects the open / closed state of the main chamber door and the spare chamber door, and based on the detection result of the open / close detection device, A chamber apparatus comprising an open alarm device that issues a warning when both the main chamber door and the spare chamber door are open.

  According to this configuration, both the main room door and the spare room door are opened and a warning is given that the main room and the outside are in a continuous state, thereby eliminating the state in which the main room and the outside are in a continuous state. It is possible to reduce the possibility that gas in the main chamber or outside passes through the spare chamber and enters the outside or main chamber.

  (Technical Thought 5) A chamber device according to the present invention, wherein the open / close detection device detects the open / closed state of each of the sub chamber door and the auxiliary chamber door, and based on the detection result of the open / close detection device, A chamber apparatus comprising an open alarm device that issues a warning when both the main chamber door and the spare chamber door are open.

  According to this configuration, both the sub chamber door and the spare chamber door are opened, and a warning is given that the sub chamber and the outside are continuous. It is possible to reduce the possibility that gas in the sub chamber or outside passes through the spare chamber and enters the outside or sub main chamber.

  (Technical Thought 6) A chamber apparatus according to the present invention, comprising: a closing detection device that detects open / closed states of the main chamber door, the sub chamber door, and the spare chamber door; and the main chamber door and the sub chamber door A lock device for setting each of the chamber door and the spare chamber door to be in an open prohibition state or an open prohibition release state; and operating the lock device based on a detection result of the closure detection device; Provided is a lock control device that controls so that at least one of the doors is in an open-prohibited state, and controls so that at least one of the sub-chamber door and the auxiliary chamber door is in an open-prohibited state. The lock control device is configured to detect the open / closed state of the main chamber door and the sub chamber door when one or both of the main chamber door and the sub chamber door are open. Both sub-chamber doors are open Treated as a state, a chamber device, characterized in that the preliminary chamber door open disabled.

  (Technical Thought 7) A chamber apparatus according to the present invention, wherein two preliminary chamber doors are provided in one preliminary chamber, and each of the preliminary chamber door open / closed states is detected. A lock device that sets the spare chamber door to the open prohibition state or the open prohibition release state, and the lock device is operated based on a detection result of the close detection device, and at least one of the two prechamber doors is opened. A chamber apparatus comprising: a lock control device that performs control so as to be in a prohibited state.

  According to this configuration, since only one of the two spare chamber doors can be opened, the gas in the spare chamber and the external gas are mixed as compared with the case where the two spare chamber doors are opened. The possibility is low, and it is possible to more reliably suppress the gas inside the main chamber from leaking outside through the spare chamber, and it is possible to inhibit the outside gas from entering the spare chamber.

  (Technical Thought 8) An exhaust flow rate measuring device capable of measuring the exhaust amount of the exhaust device provided in the preliminary chamber is further provided, and the exhaust amount after the preliminary chamber door is opened and closed is measured, and the measurement is performed. 4. The chamber apparatus according to claim 3, wherein when the exhaust amount reaches a capacity in the spare room, an opening prohibition state of the main chamber door by the lock device is canceled based on the information.

  According to this configuration, the gas in the spare chamber that may have been mixed with an external gas by opening the spare chamber door is supplied from the air supply device in a state where the spare chamber is isolated from the outside and the main chamber. After being replaced by air, the main room door is opened. Therefore, the possibility that the gas that has entered the preliminary chamber from the outside further enters the main chamber can be extremely reduced.

  (Technical Thought 9) An exhaust flow rate measuring device that can measure the exhaust amount of the exhaust device provided in the preliminary chamber is further provided, and the exhaust amount after the main chamber door is opened and closed is measured, and the measurement is performed. The chamber apparatus according to claim 3, wherein when the exhaust amount reaches a capacity in the spare room, an opening prohibition state of the spare room door by the lock device is canceled based on the information.

  According to this configuration, the gas in the spare chamber that may have been mixed with the gas in the main chamber by opening the main chamber door is supplied from the air supply device in a state where the spare chamber is isolated from the outside and the main chamber. The spare room door is opened after the air is replaced. Therefore, the possibility that the gas that has entered the preliminary chamber from the main chamber flows out to the outside can be extremely reduced.

  (Technical Thought 10) An exhaust flow rate measuring device that can measure the exhaust amount of the exhaust device provided in the preliminary chamber is further provided, and the exhaust device starts exhausting from a state where exhaust of the exhaust device is stopped. A chamber apparatus for measuring the amount of exhaust from the chamber and releasing the prohibition of opening of the spare chamber door by the locking device when the amount of exhaust reaches the capacity of the spare chamber based on the measurement information .

  According to this configuration, after the spare room is isolated from the outside and the main room, the spare room door is opened after being replaced with the air supplied from the air supply device. Therefore, the possibility that the gas that has entered the spare room from the main room flows out from the opened spare room door to the outside can be extremely reduced.

The top view of the droplet discharge equipment comprised by accommodating the droplet discharge apparatus in 1st Embodiment in the chamber apparatus. The sectional side view in the main room of a droplet discharge equipment. The sectional side view in the preliminary | backup room of a droplet discharge equipment. (A) is a top view of a head unit, (b) is a top view of a droplet discharge head. (A) is a perspective view showing the structure of the ejection head, (b) is a cross-sectional view of the ejection head showing the detailed structure of the nozzle part. The electric block diagram which shows the electric constitution of a chamber apparatus. The flowchart explaining operation | movement of the chamber apparatus in the case of opening a spare chamber door from the outside. The flowchart explaining operation | movement of the chamber apparatus in the case of opening a main chamber door. The flowchart explaining operation | movement of the chamber apparatus in the case of opening a spare room door from a spare room. The top view which shows the droplet discharge equipment in 2nd Embodiment. 10 is a flowchart for explaining a color filter manufacturing process according to the third embodiment. The schematic cross section of the color filter which showed the manufacturing process in order of (a)-(e). 1 is a cross-sectional view of a main part showing a schematic configuration of a liquid crystal device using a color filter to which the present invention is applied. Sectional drawing of the principal part which shows schematic structure of the liquid crystal device of the 2nd example using the color filter to which this invention is applied. The disassembled perspective view which shows schematic structure of the liquid crystal device of the 3rd example using the color filter to which this invention is applied. Sectional drawing of the principal part of the display area of the organic electroluminescent apparatus to which this invention is applied. The flowchart explaining the manufacturing process of an organic electroluminescent apparatus. Sectional drawing explaining formation of an inorganic bank layer. Sectional drawing explaining formation of an organic substance bank layer. Sectional drawing explaining the process in which a positive hole injection / transport layer is formed. Sectional drawing explaining the state in which the positive hole injection / transport layer was formed. Sectional drawing explaining the process in which a blue light emitting layer is formed. Sectional drawing explaining the state in which the blue light emitting layer was formed. Sectional drawing explaining the state in which the light emitting layer of each color was formed. Sectional drawing explaining formation of a cathode. The disassembled perspective view which shows the principal part of a plasma type display apparatus (PDP apparatus). Sectional drawing of the principal part of an electron emission apparatus (FED apparatus). (A) is a top view around the electron emission part of an electron emission apparatus, (b) is a top view which shows the formation method around the electron emission part of an electron emission apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Droplet discharge apparatus as a droplet discharge device and a workpiece processing apparatus, 3 ... Substrate table, 7 ... Chamber apparatus, 10, 210 ... Droplet discharge equipment, 45 ... Functional liquid tank as liquid supply tank, 46 ... Supply Cleaning liquid tank as liquid tank, 47 ... Recycled liquid tank as liquid supply tank, 48 ... Drainage tank as liquid supply tank, 70, 270 ... Chamber, 71 ... Air conditioner, 72 ... Control panel box, 75 ... Lock Chamber control device as control device, 76 ... partition wall, 80 ... main chamber, 81, 281 ... spare chamber, 82 ... sub chamber, 86 ... main chamber air supply duct as air supply device, 88 ... main chamber as exhaust device Exhaust duct 96: Preliminary chamber supply duct as an air supply device, 98 ... Preliminary chamber exhaust duct as an exhaust device, 141 ... Main chamber exhaust damper as an exhaust flow rate adjusting device, 143 ... Exhaust flow rate control Preliminary chamber exhaust damper as device, 146 ... Work supply / exhaust port, 151 ... Main chamber doorway, 152 ... Main chamber door, 153 ... Main chamber door open / close sensor as open / close detection device, 155 ... Main chamber door lock as lock device 161: Preliminary room doorway as external doorway, 162 ... Preliminary room door, 163 ... Preliminary room door open / close sensor as open / close detection device, 164 ... Preliminary room door lock device as lock device, 172 ... Subchamber door, 173 ... Sub-chamber door open / close sensor as open / close detection device, 174 ... Sub-chamber door lock device as lock device, 182 ... Chamber controller as lock control device, 187 ... Timer as timer device, 207 ... Chamber equipment, 620, 630 , 650... Liquid crystal device which is a liquid crystal display device as an electro-optical device, 700. nce) Display device as device, 800... Display device as plasma type display device as electro-optical device, 900... Display device as electron emission device as electro-optical device, W.

Claims (20)

A chamber apparatus that houses a work processing apparatus that requires work processing to be performed in an atmosphere isolated from the surrounding atmosphere,
A main room for accommodating the workpiece processing device;
A spare room adjacent to the main room;
A door that opens and closes a main chamber entrance / exit provided in a partition wall that separates the main chamber and the auxiliary chamber, and is capable of isolating the gas inside the main chamber and the gas inside the auxiliary chamber when closed. The room door,
A door that opens and closes an external doorway provided on the wall of the spare chamber, and includes a spare chamber door that can isolate a gas outside the chamber device and a gas inside the spare chamber when closed. A chamber apparatus characterized by the above. Each of the main room and the spare room includes an air supply device and an exhaust device,
The chamber apparatus according to claim 1, wherein at least the exhaust device provided in the preliminary chamber includes an exhaust flow rate adjusting device. An open / close detection device for detecting an open / closed state of each of the main chamber door and the auxiliary chamber door;
A lock device that sets each of the main room door and the spare room door to an open prohibited state or an open prohibited release state;
A lock control device is provided that operates the lock device based on a detection result of the open / close detection device and controls so that at least one of the main chamber door and the spare chamber door is in an open prohibited state. The chamber apparatus according to claim 1 or 2. Based on the detection result of the open / close detection device, further provided a time measuring device capable of measuring the time since the preliminary chamber door opened and closed,
The lock control device is configured such that when the predetermined time during which the exhaust device provided in the spare chamber exhausts a gas corresponding to at least the capacity of the spare chamber is measured by the timing device, the main chamber door by the lock device is measured. The chamber apparatus according to claim 3, wherein the open prohibition state of the is released. Based on the detection result of the open / close detection device, further provided a time measuring device capable of measuring the time since the main chamber door opened and closed,
When the predetermined time for the exhaust device provided in the spare chamber to exhaust the gas corresponding to the capacity of at least the spare chamber is measured by the timing device, the lock control device detects the spare chamber door by the lock device. The chamber apparatus according to claim 3, wherein the open prohibition state of the is released.   A determination unit for determining whether the main chamber and the spare room are unmanned, and when the main chamber and the spare chamber are unmanned, the determination unit is configured to exhaust the exhaust of the exhaust device provided in the spare chamber; 6. The chamber apparatus according to claim 4, wherein the chamber apparatus is stopped by the exhaust flow rate adjusting device.   Further provided is a timing device capable of measuring the time since the exhaust device started exhausting from the state where exhaust of the exhaust device provided in the preliminary chamber is stopped, and provided in the preliminary chamber by the timing device. The exhaust device measures the time for exhausting the gas corresponding to the capacity of the spare room at least, and releases the prohibition of opening of the spare chamber door by the lock device based on the timing information. The chamber apparatus of any one of 2 thru | or 6. A work supply / exhaust port for supplying and discharging the work on the wall that constitutes the main chamber and does not face the partition is provided,
The chamber apparatus according to any one of claims 1 to 7, wherein the external doorway and the auxiliary chamber door are provided on a wall that does not face the partition wall.   9. The device according to claim 1, wherein a plurality of the external doorways and the spare chamber doors are provided, and the locking devices corresponding to the plurality of spare chamber doors are controlled in conjunction with each other. Chamber device.   The chamber apparatus according to claim 1, wherein the preliminary chamber is provided at two locations on both sides of the main chamber.   The spare room is a work space for performing work through the main chamber doorway with respect to the work processing apparatus accommodated in the main room in a state where the main room door is opened. The chamber apparatus according to any one of claims 1 to 10.   The chamber apparatus according to any one of claims 1 to 10, wherein a chamber pressure in the preliminary chamber is higher than a chamber pressure in the main chamber.   The chamber apparatus according to claim 12, wherein a chamber pressure in the preliminary chamber is lower than a chamber pressure around the chamber apparatus.   The chamber apparatus according to any one of claims 1 to 10, wherein a chamber pressure in the preliminary chamber is lower than a chamber pressure in the main chamber.   The chamber apparatus according to claim 14, wherein a chamber pressure in the preliminary chamber is higher than a chamber pressure around the chamber apparatus. The workpiece processing device is a droplet discharge device,
A sub chamber provided in the main chamber, adjacent to the preliminary chamber via the partition;
An exhaust device for exhausting the gas in the sub chamber;
A liquid supply tank of the droplet discharge device is installed in the sub chamber,
The chamber apparatus according to claim 1, wherein the gas in the sub chamber is exhausted from the exhaust apparatus. A work opening provided in the partition wall between the sub chamber and the auxiliary chamber;
17. The door for opening and closing the work opening, comprising: a sub chamber door capable of isolating the gas inside the sub chamber and the gas inside the spare chamber when closed. The chamber apparatus described   The chamber equipment according to claim 1, wherein the chamber devices are connected to each other at a portion of the spare chamber, and the connected spare chambers are formed as an integral space.   A liquid droplet ejection apparatus, comprising: a liquid droplet ejection apparatus as the work processing apparatus installed in a main chamber of the chamber apparatus according to any one of claims 1 to 15 or the chamber equipment according to claim 18. An electro-optical device is manufactured by using the droplet discharge device in the main chamber by the chamber device or the chamber facility according to claim 17 or 18, or the droplet discharge facility according to claim 19. A method for manufacturing an electro-optical device.

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