JP2005144743A - Resin layer forming device and embossing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin layer forming device capable of forming the resin layer closely bonded to a substrate, and an embossing device capable of forming an embossed pattern to the resin layer with high precision. <P>SOLUTION: This embossing device 30 is mainly composed of a resin layer forming device 31 and an embossing part 21. The resin layer forming device is equipped with a corona discharge device (dischargfe means) 32, a partition wall 43, a resin feeder (resin supply means) 14, a molding blade (flattening means) 45 and a feed roller 46. A substrate 17, on which the resin layer must be formed, is introduced into the embossing device 30 by the feed roller 46 and the like. The corona discharge device 32 is constituted so as to apply a high voltgage current of high frequency to one set of electrodes 32a to excite electron energy to generate corona discharge toward the substrate 17. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a resin layer forming apparatus for forming a resin layer on a substrate, and an unevenness forming apparatus for forming unevenness on the resin layer.

  For example, portable electronic devices such as a mobile phone and a portable game machine have a reflective liquid crystal display device that can suppress power consumption as a display unit because the battery driving time greatly affects usability. The reflection-type liquid crystal display device includes a reflection film for reflecting external light incident from the front surface, and includes a reflection film built-in between two substrates constituting a liquid crystal panel, 2. Description of the Related Art A transmissive liquid crystal panel having a reflector provided with a semi-transmissive film on the back side is known.

  As a reflector for reflecting light, a reflector in which a reflective film is formed on the surface of a substrate on which a large number of concave portions are formed is known. Such a reflector can obtain uniform reflected light evenly within the reflecting surface by the action of a large number of recesses.

As a conventional manufacturing method of such a reflector, for example, a method described in Patent Document 1 below can be cited. That is, a method is described in which a transfer master having an uneven surface is manufactured by an indenter, a transfer laminate is formed from the transfer master, and the transfer laminate is attached to a substrate to obtain a reflector.
JP 2001-310334 A

  However, in the reflector manufacturing method shown in Patent Document 1, it is difficult to bring the transfer laminate into close contact with the substrate with a desired strength, and there is a possibility that a reflector having a required strength cannot be obtained. Moreover, the kind of material is also limited, and it is difficult to form an uneven surface of the reflector that maintains a predetermined reflection performance in the process of attaching the transfer laminate to the substrate.

  The present invention has been made in view of the above circumstances, and a resin layer forming apparatus capable of forming a resin layer in close contact with a substrate, and an uneven forming apparatus capable of forming unevenness on such a resin layer with high accuracy. The purpose is to provide.

  In order to achieve the above object, according to the present invention, discharge means for performing corona discharge on the surface of a substrate, resin supply means for placing a fluid resin on the substrate, and planarizing the surface of the resin There is provided a resin layer forming apparatus comprising a planarizing means for forming a resin layer on the substrate.

  Further, according to the present invention, the discharge means for performing corona discharge on the surface of the substrate, the resin supply means for placing a fluid resin on the substrate, and the resin layer on the substrate by flattening the surface of the resin Provided is a concavo-convex forming apparatus comprising: a planarizing means for forming; and a concavo-convex forming means for forming concavo-convex in the resin layer.

  The electric field strength (kV / cm) of the corona discharge may be set to 5 kV / cm or more and 150 kV / cm. Moreover, the said uneven | corrugated formation means should just be a roller by which the protrusion was formed in the surrounding surface.

  According to the resin layer forming apparatus of the present invention, the substrate surface is imparted hydrophilicity or polarity by corona discharge, and the mechanism thereof is air, such as voltage, ion impact, electron impact, space charge due to corona discharge, etc. The oxygen inside is activated, and the molecular chains of the attached molecules on the substrate surface are cleaved. For example, in the case of a glass substrate, polar groups such as —OH, —SiO—, and —SiOH are generated. In the case of a resin substrate, polar groups such as = C = O, -C-O-, -COOH, -C-OH are generated. As a result, it is considered that the surface energy of the substrate is increased and the wettability of the substrate surface is greatly improved. Thereby, the board | substrate with which the resin layer which is a polar material closely_contact | adhered to the surface can be obtained. Moreover, according to the uneven | corrugated formation apparatus of this invention, since the resin layer formed on a board | substrate by corona discharge firmly adheres to a board | substrate, the stable highly accurate unevenness | corrugation can be formed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, an example of a reflector manufactured by the concavo-convex forming apparatus of the present invention will be described. 1 is a partial perspective view showing an example of the configuration of a reflector, FIG. 2 is a schematic cross-sectional view of the reflector shown in FIG. 1, and A in FIG. 3 is formed on the reflector shown in FIG. FIG. 3B is a cross-sectional configuration diagram taken along line GG shown in FIG. 3A.

  As shown in FIG. 1B, the reflector 10 is schematically configured by a substrate 11 and a reflective film 12 having a high reflectivity such as Al or Ag laminated on one surface 11 a of the substrate 11. As shown in FIG. 1A, the substrate 11 includes a support layer 15 and a resin layer 16 formed on the support layer 15. The resin layer 16 gives the reflective film 12 a predetermined surface shape, that is, a concave portion 12a following the concave portion 13 of the resin layer 16, and a plurality of concave portions 13 are provided on one surface 11a.

As shown in FIG. 1B, the concave portion 13 forms a concave portion 12 a in the reflective film 12, and gives the reflective film 12 uniform and uniform reflectivity. The support layer 15 constituting the substrate 11 may be made of, for example, a glass plate with a SiO ₂ coating, and the resin layer 16 may be made of an ultraviolet curable resin. The thickness of the substrate 11 is preferably in the range of 50 μm to 1 mm, for example, and particularly preferably in the range of 100 to 700 μm.

  The reflection film 12 may be formed by vapor-depositing a metal having high reflection characteristics such as Al or Ag on the one surface 11a of the substrate, and the film thickness is preferably in the range of 0.05 to 0.2 μm. A range of 08 to 0.15 μm is particularly preferable. If the thickness of the reflective film 12 is less than 0.05 μm, the reflectance is lowered, which is not preferable. If the thickness exceeds 0.2 μm, the film formation cost is more than necessary, and the concave portion 12 a provided by the concave portion 13 is small. This is not preferable.

  The recess 13 is formed on the resin layer 16 of the substrate 11 by embossing using a reversal mold that will be described in detail later. As shown in FIGS. 1B and 2, the reflective film 12 is formed. In the above, the contours 12c of the recesses 12a are in contact with each other. The portion where the contours 12c are in contact with each other is formed in a pointed peak shape, and it is preferable in terms of reflection characteristics that the area of the flat portion 12d between the recesses 12a is small.

  As shown in FIG. 3, the inner surface of the recess 13 includes a first curved surface 13a and a second curved surface 13b, which are part of two spherical surfaces each having a different radius, and gives these curved surfaces 13a and 13b. The sphere centers O 1 and O 2 are arranged on the normal line of the deepest point O of the recess 13. The first curved surface 13a is a part of a spherical surface with a radius R1 centered on O1, and the second curved surface 13b is a part of a spherical surface with a radius R2 centered on O2. And in the top view shown to A of FIG. 3, the 1st curved surface 13a and the 2nd curved surface 13b are divided substantially in the vicinity of the straight line H which passes the deepest point O of the recessed part 13, and is orthogonal to GG line. . The depth of the recessed part 13 should just be formed in about 0.3-2.0 micrometers, for example.

  4 irradiates the reflector 10 having the above-described structure with light at an incident angle of 30 ° from the right side of the drawing in FIG. 3, and the light receiving angle is ± 30 around 30 ° which is the direction of regular reflection with respect to the reflecting surface. It is a graph which shows the result of having measured in the range (0 degree-60 degrees; 0 degree is equivalent to the normal line direction of one surface of a reflector), and measuring the reflectance (%) of the reflector 10. FIG.

  As is apparent from the graph shown in FIG. 4, according to the reflector 10 having the above-described configuration, the absolute value of the inclination angle of the second curved surface 13b made of a spherical surface having a relatively small radius is relatively large. Is scattered at a wide angle, and a high reflectance can be obtained in a wide light receiving angle range of about 15 ° to 50 °. Further, the reflection on the first curved surface 13a composed of a spherical surface having a relatively large radius causes reflection to be scattered in a narrow range in a specific direction as compared with the second curved surface 13b, so that the reflectance is the regular reflection direction as a whole. The maximum is obtained at an angle smaller than 0 °, and the reflectance in the vicinity of the peak increases.

  As a result, the peak of light incident on and reflected by the reflector 10 is shifted to the side closer to the normal direction of the reflector 10 than the regular reflection direction, so that the reflection luminance in the front direction of the reflector 10 can be increased. Accordingly, if such a reflector 10 is applied to the reflective layer of a liquid crystal display device, the display surface is normally used with an oblique display surface. Therefore, the reflection luminance in the front direction of the liquid crystal display device can be improved. The brightness of the apparatus toward the viewer can be increased.

  Next, the uneven | corrugated formation apparatus of this invention is demonstrated. FIG. 5 is a cross-sectional view showing an unevenness forming apparatus including the resin layer forming apparatus of the present invention. The concavo-convex forming apparatus 30 is roughly divided into a resin layer forming apparatus 31 and a concavo-convex processed portion 21. The resin layer forming apparatus 31 includes a corona discharger (discharge unit) 32, a partition wall 33, a resin supply unit (resin supply unit) 34, a molding blade (flattening unit) 35, and a feed roller 46. The substrate 17 on which the resin layer is formed is introduced into the concavo-convex forming apparatus 30 by a feed roller 36 or the like.

  The corona discharger 32 is composed of a power supply / transformer system that generates a high voltage of a predetermined frequency at a pair of electrodes 32a, and applies electron energy to the atmosphere in which the electrodes exist to generate corona discharge. In this figure, corona generated by the electrodes is emitted near the surface of the substrate 17. In this way, when the electrodes are arranged along the surface of the substrate 17 that is the object to be irradiated (depending on the magnitude of the applied voltage), the distance between the electrode 32a and the object to be irradiated (substrate 17) is compared. Set to a smaller value.

  That is, it is necessary to set the electrode-substrate distance (D) smaller than the electrode 32a interval (A). For example, when the applied voltage is about 2 kV, A is 20 to 40 mm, D is 1 to 10 mm, preferably 1 to Set to 5 mm. When D is 10 mm or more, the discharge between the electrodes becomes dominant, and the irradiated surface is not irradiated with the corona atmosphere, resulting in a loss. In the case of 1 mm or less, a discharge atmosphere is likely to be generated, but the required accuracy in designing or installing the apparatus is required, which is not preferable.

  The partition wall 33 functions as a partition between the resin reservoir 19 and the corona discharger 32 that allow the resin 18 to be applied onto the substrate 17 from the resin supply device 14 and at the same time, prevents unnecessary discharge of the resin 18. . The molding blade (blade) 35 is installed, for example, adjacent to the resin reservoir 19, and a predetermined gap is maintained between the blade-shaped tip 35 a and the substrate. By controlling the gap distance, the thickness of the resin layer 36 applied on the substrate 17 is controlled.

  Usually, this film thickness is set to 2.5 to 3.5 μm, preferably 2.5 to 3.0 μm, after the formation. If it is less than 2.5 μm, it is impossible to stably form a deep concave portion among random minute irregularities, and desired reflection characteristics cannot be obtained. On the other hand, if the thickness exceeds 3.5 μm, the thickness of the flattening film formed on the formed concave portion becomes thick, which adversely affects the reliability of the panel (shrinkage of the flattening film during high temperature storage or high temperature high humidity storage). Or, in extreme cases, cracks, etc.). Although not shown in the figure, the resin application means is not limited to that described above, and a so-called roll coater may be used.

  The unevenness processing section 21 includes a processing roller (unevenness forming means) 22, a pinch roller 23, and a feed roller 24. The substantially cylindrical processing roller (unevenness forming means) 22 has a large number of unevenness (projections) 22a formed around it. The unevenness (projection) 22a may be a shape obtained by inverting the shape of the recess (unevenness) 43 formed in the resin layer 36 of the reflector 10 shown in FIG.

  By the rotation of the processing roller 22, the unevenness 22 a is continuously pressed against the resin 16 laminated on the substrate 17 by the resin layer forming device 31, and a large number of recessed portions (unevenness) 43 are formed in the resin layer 36. The processing roller 22 provided with such irregularities 22a can be formed by hitting an indenter in the shape of a concave portion (or convex portion) 43 on a plastically deformable cylindrical material.

  The pinch roller 23 is provided to face the processing roller 22 via the substrate 17 and supports the substrate with the processing roller 22. The feed roller 24 is processed by conveying the substrate 17 having the recess 43 formed in the resin layer 36 with the circumferential speed of the processing roller 22 and the moving speed of the substrate 17 matched with high accuracy.

  The operation and action of the concavo-convex forming apparatus having such a configuration will be described. It is assumed that the resin layer 36 is formed on the substrate 17 using the unevenness forming apparatus 30 of the present invention, and further the recess 43 is formed in the resin layer 36. The substrate 17 on which the resin layer 36 is formed is introduced into the concavo-convex forming apparatus 30 by the feed roller 16 and reaches the corona discharger 32.

  Here, the corona discharger 32 applies electron energy to the surrounding atmosphere by the alternating voltage applied to the pair of electrodes 32a, and an ion / radical atmosphere is generated by corona discharge in the vicinity of the surface of the substrate 17, that is, in the air. When oxygen is activated, the molecular chain of the adhesion molecule on the substrate surface is cut, and for example, in the case of a glass substrate, polar groups such as —OH, —SiO—, and SiOH are generated.

  In the case of a resin substrate, polar groups such as ═C═O, —C—O—, —COOH, and —C—OH are generated. As a result, the surface energy of the substrate increases and the wettability of the substrate to water or resin is greatly improved. In general, hydrophilic polar groups such as -SiO- and -Si-OH are inherently present in glass substrates, but the history after manufacture, for example, in the atmosphere in the manufacturing process of storage, packaging and transportation, reflectors and panels The wettability of water and the resin material to be laminated may change variously due to the effects of the work in progress, the remaining chemical solution in the previous step, and the like.

  Further, in the case of a film substrate, the wettability changes in a more complicated manner due to the hydrophobic group of the substrate material itself in addition to the above history. In the present invention, the surface treatment effect can be obtained for various materials including PET, such as polyethylene, polypropylene, and polystyrene, as the film material.

  In the present invention, in addition to those shown in FIG. 5, those having an enhanced corona discharge effect as shown in FIG. 6 are particularly preferably used. In this apparatus, the corona discharge electrodes (electrode I: 42 and electrode II: 42 ') are disposed between the upper surface of the irradiated body (substrate 17) and the lower surface of the irradiated body (substrate 17). They are arranged with a predetermined distance (D + substrate thickness) through (polytetrafluoroethylene, Duracon, acrylic, polyester, anodized aluminum plate, or the like).

The insulating material 60 is appropriately set according to the applied voltage, the thickness of the substrate 17, the insulating properties, the irradiation time, and the like, but usually a dielectric of 1 to 30 mm is used.
With such a configuration, a stable corona discharge treatment on the substrate surface and surface modification (improvement of wettability) thereby can be obtained.

  As conditions relating to corona discharge, the distance between electrodes is set to, for example, about 3 to 200 mm, and about 20 to 100 mm in order to increase the irradiation area and improve productivity. The applied voltage is selected such that the electric field strength (kV / cm: voltage per unit electrode distance) is 3 to 150 kV / cm, preferably 5 to 100 kV / cm. When the electric field strength is less than 3 kV, corona discharge does not occur effectively and it is difficult to obtain the effect of surface modification. On the other hand, if it exceeds 150 kV / cm, unnecessary sparks are generated and corona discharge is difficult to occur. In addition, there is a demerit that a power supply system requires a large amount of power.

  Furthermore, the frequency / waveform of the applied voltage is also a factor that affects the corona discharge effect. In the present invention, a pulsed high voltage is used. (In the case of a pulse of 1 μsec or less, the surface modification effect on the irradiated surface is reduced.) For example, in the present invention, a pulse of 1 μsec or more is usually used. In the present invention, the surface modification effect can be further improved by allowing an air flow to exist in the atmosphere near the corona discharge. This is presumably because the probability that the generated ions and radical species come into contact with the substrate surface by the airflow can be increased.

  The degree to which the wettability of the substrate surface is improved by corona discharge is usually evaluated by a contact angle meter (for example, Drop Master Model 100 manufactured by Kyowa Interface Science Co., Ltd.) for a polar liquid (for example, water, alcohol, acetone, etc.). Can be qualitatively judged. That is, as the polarity of the substrate surface increases, the contact angle of the polar liquid decreases and approaches 0 degrees.

  Alternatively, as a simple method, for example, hydrocarbon liquids having a surface tension in the range of about 30 dyn / cm to 70 dyn / cm are commercially available as “wetting agents”, and a small amount of these liquids are dropped on the substrate surface. The polarity of the substrate surface is qualitatively determined by the degree of spreading of the liquid when applied.

  The substrate 17 whose surface wettability is greatly improved by corona discharge enters the resin reservoir 19 from the lower part of the partition wall 33. Here, the resin 18 supplied from the resin supplier 14 is applied to the substrate 17. At this time, since the wettability of the substrate 17 is improved by corona discharge, the thickness of the applied resin 18 becomes uniform, and the accuracy of the depth of the uneven shape formed thereafter can be ensured.

  The film thickness uniformity of the formed resin layer is extremely sensitive to the wettability between the material of the resin layer on the substrate and the substrate, and when the wettability is poor, the “swell” phenomenon gradually occurs after resin application. The area where the resin layer is not formed due to the phenomenon that the surface of the resin is finely formed or is noticeable, and the resin layer is not formed due to the phenomenon called “repelling”, and the resin layer in the vicinity of it is extremely thick (Build-up part) occurs. In such a state, the characteristics as a reflector cannot be controlled.

  In the reflector according to the present invention, in order to obtain desired reflection characteristics as a completed reflector, it is necessary to control the depth shape of the unevenness with a submicron level, for example, accuracy of ± 0.15 μm. . From such a viewpoint, it is important that the film thickness of the resin layer applied to the substrate and the unevenness thereof are also controlled at the level of the above value. For this purpose, it is a basic condition that the wettability between the substrate and the resin layer is good. Furthermore, the adhesion after the resin layer formed on the substrate is cured is improved, and a good result as the reliability of the panel can be obtained.

  Referring to FIG. 5 again, as the substrate 17 coated with the resin 18 is transported, the film thickness of the resin 18 coated with the molding blade (blade) 35 is regulated to be constant, and the resin layer 36 is formed. Thereafter, the substrate 17 on which the uniform resin layer 36 is formed is introduced into the concavo-convex processed portion 21 as it is.

  In the uneven portion 21, the resin layer 36 and the substrate 17 are sandwiched between the processing roller 22 and the pinch roller 23. The unevenness 22 a of the processing roller 22 is continuously pressed against the resin 36, and a large number of recesses 43 are formed in the resin layer 36. Such a recess 43 can be stably formed since the resin layer 36 is formed after increasing the wettability of the surface of the substrate 17 by a corona discharger.

  Thereafter, the resin layer 36 in which the recesses 43 are formed is irradiated with ultraviolet rays or the like (not shown) to cure the resin layer 36, and a highly reflective film such as Al or Ag is formed on the upper surface so as to cover the recesses. By forming the film, a reflector 10 as shown in FIG. 1 can be obtained.

  Such a reflector 10 can be suitably used for a liquid crystal display panel (reflection type liquid crystal display device), for example. As shown in FIG. 9, the liquid crystal display panel 51 is a liquid crystal display panel in which a first substrate 53 and a second substrate 54 facing each other with a liquid crystal layer 52 interposed therebetween are joined and integrated with a seal material 55. A display circuit 56 for driving and controlling the liquid crystal layer 52 is formed on the liquid crystal layer 52 side of the substrate 53, and an electrode layer is formed on the liquid crystal layer 52 side of the second substrate 54. In addition, a display circuit 57 that includes an alignment film and drives and controls the liquid crystal layer 52 is stacked.

  In addition, a large number of spacer members 58 are formed between the display circuit 56 and the display circuit 57 to maintain a constant distance between the two display circuits 56 and 57. Then, the reflector 10 is formed between the first substrate 53 and the second substrate 54. An overcoat layer 59 is laminated on the upper surface of the reflector 10.

  With such a configuration, the reflector 10 efficiently reflects the external light N incident on the liquid crystal display panel 51 and brightly illuminates the liquid crystal layer 52.

  The reflector 10 can also be suitably used for, for example, a transflective liquid crystal display panel (semi-transmissive reflective liquid crystal display device). As shown in FIG. 10, the reflector 10 has an opening 10 a of a certain size, and an illumination device 61 that illuminates the liquid crystal display panel 51 is provided below the first substrate 53. . Such a liquid crystal display panel 51 efficiently reflects the external light N incident on the liquid crystal display panel 51 by the reflector 10, illuminates the liquid crystal layer 52 brightly, and reflects the illumination light L emitted from the illumination device 61 as a reflector. The liquid crystal layer 52 can be brightly illuminated even at night or in a dark place.

The present applicant verified the effect of the resin layer forming apparatus of the present invention. In the verification, a glass substrate (450 mm × 350 mm with a SiO ₂ passivation film 400 mm) having a thickness of 0.7 mm was prepared as a substrate on which the resin layer was formed. A photosensitive acrylic resin was used as the resin layer formed on the substrate. In addition, the apparatus shown in FIG. 6 was used for corona discharge treatment with a corona discharge unit (generator HV2010 type manufactured by Tantac Co., Ltd.) at 100 kV, a pulse frequency of 100 pps (number of pulses per second), an electrode width of 200 mm, and an electrode interval of 50 mm. . Thereafter, a photosensitive acrylic resin was applied on the surface of the substrate so as to have a thickness of 3 μm and flattened.

  Thereafter, the substrate was introduced into a concavo-convex forming apparatus provided with a roller having a predetermined concavo-convex shape to form a concavo-convex shape in the resin layer. At this time, a sample obtained by applying a photosensitive acrylic resin to a substrate subjected to corona discharge treatment under the same conditions in the same process and semi-curing the sample was semi-cured, and the flatness of the film was measured with a roughness meter (Surf Test SJ-400 manufactured by Mitutoyo Corporation). Type). Ra: 0.015-0.018 μm, Ry: 0.15 μm (Based on JIS, Ra and Ry are Ra: average surface roughness and Ry: maximum roughness, respectively). Further, as a comparative example, the resin layer formed without performing corona discharge of the present invention was flattened, and semi-cured in the same manner as described above, and the flatness of the film was measured. The verification results of the present invention example are shown in FIGS. 7 (a) and 7 (b), and the verification results of the comparative example are shown in FIGS. 7 (c) and 7 (d), respectively.

  According to the verification results shown in FIG. 7, the substrate according to the present invention shows lower values in both Ra and Ry values than Comparative Example 1 (without corona discharge treatment) described later, and can be seen in Comparative Example 1. No eel (maximum 0.1 μm) was observed. At this time, the water contact angle of the substrate immediately before the application of the photosensitive acrylic resin was measured and found to be about 22 ± 3 degrees.

  On the other hand, according to the conventional comparative example, the flatness was only Ra: 0.018 to 0.020 μm and Ry: 0.17 to 0.18 μm. The contact angle of water before forming the resin layer was about 47 ± 5 degrees.

  Processing was carried out using the same glass substrate as in Example 1 and the same corona discharge device. However, the surface treatment was performed by changing the level of the electric field intensity by changing the applied voltage and the distance between the electrodes. Table 1 shows the contact angle of water on the substrate surface and the uniformity of the film thickness. The corona treatment time was set to 30 seconds and the pulse was set to 300 pps.

  According to the verification results shown in Table 1, the contact angle was about ± 5 ° in the region where the electric field strength was low (˜6 kV / cm), and about ± 3 ° beyond that. The effect of surface treatment appeared at an electric field strength of 6 kV / cm or more. Moreover, at 160 kV / cm or more, the effect did not change so much in the 200 mm square area. However, film undulation was observed around the substrate (corresponding to a 300 mm square area), and part of the film repelled around the outermost periphery.

  In Example 2 described above, an air flow of 100 mm / sec was present so as to be substantially along the substrate surface. FIG. 8 shows the configuration around the electrodes according to the third embodiment. These verification results are shown in Table 2. According to Table 2, the improvement of the effect of surface treatment was seen. In addition, a comparative example shows what did not perform a corona discharge process.

  Corona discharge treatment was performed in the same manner as in Example 1 except that PET (polyethylene terephthalate (188 μm thickness) was used as the substrate. Table 3 summarizes the contact angles of water when the applied voltage and the distance between the electrodes were changed. The corona treatment time was 40 seconds and the pulse was 400 pps.As a comparative example, the one without corona discharge treatment was mentioned.

  According to the verification results shown in Table 3, in the comparative example in which the corona discharge treatment was not performed, the contact angle of water was considerably large, but decreased due to the corona treatment. In addition, uniform coating became possible as the angle decreased.

FIG. 1 is a partial perspective view showing an example of the configuration of a reflector. FIG. 2 is a schematic cross-sectional view of the reflector shown in FIG. FIG. 3 is a plan configuration diagram of a recess formed in the reflector shown in FIG. 4 is a cross-sectional configuration diagram taken along the line GG shown in FIG. FIG. 5 is a cross-sectional view showing the resin layer forming apparatus and the unevenness forming apparatus of the present invention. FIG. 6 is a plan view showing a preferred apparatus embodiment. FIG. 7 is an explanatory diagram showing the roughness of the resin film. FIG. 8 is a schematic diagram showing another embodiment. FIG. 9 is a cross-sectional view showing another embodiment. FIG. 10 is a cross-sectional view showing another embodiment.

Explanation of symbols

10 Concavity and convexity forming device 11 Resin layer forming device 12 Corona discharger (discharge means)
13 Concave (Roughness)
14 Resin supply (resin supply means)
15 Molding blade (flattening means)
16 Resin layer 17 Substrate 22 Processing roller (Unevenness forming means)
22a Concavity and convexity (protrusion)

Claims (5)

Discharging means for performing corona discharge on the surface of the substrate, resin supply means for placing a fluid resin on the substrate, and flattening means for flattening the surface of the resin to form a resin layer on the substrate. A resin layer forming apparatus. 2. The resin layer forming apparatus according to claim 1, wherein the electric field strength (kV / cm) of the corona discharge is set to 5 kV / cm or more and 150 kV / cm or less. Discharge means for performing corona discharge on the surface of the substrate; resin supply means for placing a fluid resin on the substrate; flattening means for flattening the surface of the resin to form a resin layer on the substrate; An unevenness forming apparatus comprising an unevenness forming means for forming unevenness on a resin layer. The uneven | corrugated formation apparatus of Claim 3 which sets the electric field strength (kV / cm) of the said corona discharge to 5 kV / cm or more and 150 kV / cm or less. The unevenness forming apparatus according to claim 3 or 4, wherein the unevenness forming means is a roller having protrusions formed on a peripheral surface.

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