JP2005143670A - Capsule type medical apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a capsule type medical apparatus having an optical system which has a constitution suitable for miniaturization. <P>SOLUTION: A transparent tip cover 33 is fittedly fixed to a fitting part 34 in which an LED chip 36 as a light emitting body is provided in the outer circumferential side so as to be coaxial with a through-hole 35 in the center of an LED board 34 mounted on a recessed board surface, and a lighting module 32 whose central axis is approximately coincident with an optical axis O of an objective optical system 31 fixed to the through-hole 35. The objective optical system 31 is fixed to the through-hole 35 without interposed with a lens frame so that this capsule type medical apparatus 3 can be provided using the lighting module 32 or the like having superior assemblability and easily miniaturized. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a capsule medical device that illuminates a body cavity and images the illuminated part.

In recent years, various capsule-type medical devices have been proposed that can capture the inside of a body cavity by swallowing from the mouth in a capsule shape.
For example, in Japanese Patent Laid-Open No. 2003-260023, a cylindrical convex portion provided on an LED substrate on which an illumination LED is mounted is fitted into a concave portion provided on a lens frame, whereby the optical axis between the LED substrate and the objective optical system is disclosed. Are combined.

In this case, the imaging optical system needs to match all the optical axes of the objective optical system / illuminating element / tip transparent cover / image sensor, and adjustments are made to match them during assembly. However, since this adjustment requires higher accuracy as the optical system becomes smaller, it has hindered downsizing of the apparatus.

JP 2003-260023 A

  In the configuration of the above-described conventional example, the axes of the transparent cover and the objective optical system are not uniquely determined, and adjustment is required. When the objective optical system is attached, the structure is attached to the substrate on which the illumination LED is mounted via the lens frame. Therefore, it is necessary to provide a space for attaching the objective optical system, and it is necessary to provide a pad for mounting the LED chip on the LED substrate, which can further reduce the size of the capsule medical device. It becomes difficult.

(Object of invention)
The present invention has been made in view of the above-described points, and an object thereof is to provide a capsule medical device having an optical system having a configuration suitable for downsizing.
It is another object of the present invention to provide a capsule medical device having an optical system that is easy to adjust and is suitable for downsizing.

The present invention relates to an illumination element, an illumination board on which the illumination element is mounted, an imaging means for imaging a part illuminated by the illumination means, an objective optical system that forms an optical image on the imaging means, and imaging of the imaging means In a capsule medical device having a transparent cover that covers a range,
An illumination unit is integrally formed on the illumination board, and an objective optical system is fitted and fixed in a through hole provided in the illumination board, and a fitting portion with a transparent cover is provided on the outer periphery of the illumination board. To do.
With the above configuration, the objective optical system is attached to the illumination substrate without using a lens frame, so that the size can be reduced.

  According to the present invention, since the objective optical system is attached to the illumination substrate without using a lens frame and the LED and the substrate are integrally molded, a small capsule medical device can be realized.

  Embodiments of the present invention will be described below with reference to the drawings.

1 to 5 relate to a first embodiment of the present invention, FIG. 1 illustrates a configuration of a capsule medical system or the like provided with the first embodiment of the present invention, FIG. 2 illustrates a configuration of an electric system of an extracorporeal unit, FIG. 3 shows the structure of the capsule medical device, FIG. 4 shows the structure of the connecting portion with the flexible substrate on the back surface of the illumination module, and FIG. 5 shows the structure of the capsule medical device of a modification.
As shown in FIG. 1A, a capsule medical system 1 that performs endoscopy including Example 1 of the present invention is swallowed from the mouth of a patient 2 to pass through a body cavity duct. The capsule medical device 3 that wirelessly transmits an image signal obtained by optically imaging the inside of the body cavity duct, and the signal transmitted by the capsule medical device 3 are received by the antenna unit 4 provided outside the body of the patient 2, And an extracorporeal unit 5 (located outside the patient 2) having a function of storing images.

The extracorporeal unit 5 includes a compact flash (R) hard disk 18 (see FIG. 2) having a capacity of, for example, 1 GB for storing image data.
The image data stored in the extracorporeal unit 5 can be connected to the display system 6 in FIG. 1B during or after the examination to display an image.
That is, as shown in FIG. 1B, the extracorporeal unit 5 is detachably connected to a personal computer (hereinafter abbreviated as a personal computer) 7 constituting the display system 6 by a communication cable for communication such as a USB cable 8. Is done.
Then, the image stored in the external unit 5 is captured by the personal computer 7 and stored in the internal hard disk or displayed, and the stored image can be displayed on the display unit 9. For example, a keyboard 10 is connected to the personal computer 7 as an operation panel for performing a data input operation.

As shown in FIG. 1A, when the capsule medical device 3 is swallowed and an endoscopic examination is performed, the patient 2 wears a shield shirt 11 having a shield function.
An antenna unit 4 to which a plurality of antennas 12 are attached is attached inside the shield shirt 11, and the antenna unit 4 is connected to the extracorporeal unit 5. The extracorporeal unit 5 receives an image captured by the capsule medical device 3 by the antenna unit 4, receives a signal transmitted from the antenna incorporated therein, and is captured by the extracorporeal unit 5 connected to the antenna unit 4. To save. The extracorporeal unit 5 is attached to the belt of the patient 2 by a detachable hook, for example.

In the present embodiment, the shield shirt 11 has antenna coils (power transmission coils) 13a and 13b that generate an AC magnetic field inside the shield portion on the outer surface and feed or transmit power from the shoulder to the side surface (patient 2). The antenna coil 13c is formed at a central portion so as to be opposed to the front side and the back side, for example, in a rectangular shape.
These antenna coils 13a, 13b, and 13c are also connected to the extracorporeal unit 5.
The extracorporeal unit 5 has, for example, a box shape, and is provided with, for example, a liquid crystal monitor 14 as a display device for displaying an image and an operation unit 15 for performing a control operation on the front surface.

2, in addition to the liquid crystal monitor 14 and the operation unit 15, a communication circuit (wireless reception circuit) 16 connected to the antenna 12 and a signal processing circuit 17 for performing signal processing are provided inside the extracorporeal unit 5. A hard disk 18 for storing the signal-processed image data, an AC output circuit 19 (consisting of an oscillation circuit and a power amplifier circuit) for generating AC power to be output to the antenna coils 13a, 13b, and 13c, a communication circuit 16 and the like And a battery 21 as a power source.
The antenna coils 13a, 13b, and 13c generate an alternating magnetic field by the alternating current power supplied from the alternating current output circuit 19. As will be described later, this alternating magnetic field is several hundred kHz or less with little attenuation in the living tissue, so that the alternating magnetic field can be applied to the capsule medical device 3 in the body with almost no attenuation.

Further, the user can control the AC power supplied from the AC output circuit 19 to the antenna coils 13 a to 13 c via the control circuit 20 by operating the operation unit 15. For example, the antennas 13a to 13c that supply AC power can be selected and set, can be switched sequentially to be supplied cyclically, and the cycle can be selected and set sequentially.
Next, the configuration of the capsule medical device 3 according to the present embodiment will be described with reference to FIGS. 3 and 4. FIG. 3A shows the internal structure of the capsule medical device 3 in a longitudinal cross-sectional view, and FIG. 3B shows a view taken in the direction of arrow A in FIG. 4A shows a structure of a connection portion with the flexible substrate on the back surface of the lighting module, and FIGS. 4B and 4C show a modification of FIG. 4A.

As shown in FIG. 3, the capsule medical device 3 of the present embodiment is formed of a transparent member in the form of a dome on the front side of an LED substrate 34 to which an objective optical system 31 for connecting optical images is attached without using a lens frame. A front end cover 33 is integrally attached, and an LED chip 36 is mounted as a light emitter for providing illumination by providing a recess around the through-hole 35 to which the objective optical system 31 is attached, and a phosphor 37 is mounted around the LED chip 36. Thus, the illumination module 32 is formed as a unitized optical system module.
That is, a through hole 35 having the same inner diameter as the outer diameter of the objective optical system 31 is provided at the center of the substantially disk-shaped LED substrate 34, and the objective optical system 31 is fitted and fixed in the through hole 35. The In addition, LED chips 36 as light emitters constituting the illumination element are mounted on, for example, a substrate surface serving as a recess provided in four places around the through hole 35 in the LED substrate 34.
The periphery of each LED chip 36 is covered with a phosphor 37, and the light emitted from the LED chip 36 is converted into white light through the phosphor 37 so as to illuminate the visual field range θ by the objective optical system 31 substantially uniformly. I have to.

Further, on the outer peripheral side of the LED substrate 34, an outer diameter is cut out in a stepped shape so as to be concentric with the through hole 35 provided in the center, and an outer diameter fitted to the inner diameter of the proximal end portion of the distal end cover 33. The fitting module 34a is formed, and the base end of the distal end cover 33 is fitted and bonded together with an adhesive or the like to be integrally fixed to form the watertight illumination module 32. In addition, in the LED board 34, it arrange | positions so that the through-hole 35, the fitting part 34a, and the optical axis center (optical axis) of LED may correspond.
The LED substrate 34 constituting the illumination module 32 can be formed of a three-dimensional wiring substrate such as MID (Molded Interconnect Device) or a cavity substrate (a resin substrate or a ceramic substrate) having a stepped structure. Furthermore, an aluminum substrate with high heat dissipation can also be used (in this case, since heat dissipation is high, more current can flow, so it can be brightened).
The objective optical system 31 that is inserted into the through-hole 35 of the LED substrate 34 and is bonded and fixed is formed by, for example, a first lens 38 and a second lens 39 that are arranged in the front and rear, and a rear surface (back surface) of the second lens 39. ) Is fixed so that the front surface of the solid-state imaging device 40 such as a CCD or CMOS is in close contact.

In this case, with the front surface of the solid-state imaging device 40 in close contact with the rear surface of the second lens 39, the optical image of the object is formed in a focused state on the light-receiving surface that performs photoelectric conversion of the solid-state imaging device 40. The distance between the two lenses 38 and 39 is adjusted in advance.
Specifically, a ring-shaped spacer portion 39 a extending to the front side is integrally provided on the periphery of the second lens 39.

By bringing the rear surface of the first lens 38 into close contact with the spacer portion 39a, the position slightly behind the rear surface of the second lens 39 becomes the imaging position, and by bringing the front surface of the solid-state imaging device 40 into close contact with the rear surface, The length of the spacer portion 39a is set in advance so that an optical image of the object is focused on the light receiving surface of the solid-state imaging device 40.
Moreover, it forms so that the center of the through-hole 35 in LED board 34 and the center of the fitting part 34a formed by notching in the shape of a step in the outer peripheral side may correspond. Then, by fitting the annular portion at the base end of the tip cover 33 into the fitting portion 34a, the light of the objective optical system 31 attached so that the central axis of the tip cover 33 is fitted into the through hole 35. It almost coincides with the axis O. Further, the center of the optical axis of the LED, the center axis of the tip cover 33, and the height O of the objective optical system 31 also coincide.
The visual field range θ that can be observed (captured) by the objective optical system 31 is set to about 90 ° to 140 °. In this case, the tip cover 33 is provided so as to cover the outside of the visual field range θ.

The solid-state imaging device 40 is fixed to the back surface of the LED substrate 34 together with the flexible substrate 41 after being flip-chip connected (flip chip mounting) to the flexible substrate 41.
An opening that communicates with the through hole 35 is provided on the back surface of the LED substrate 34, and a flexible substrate 41 that is passed through the second lens 39 is disposed. An end (upper end) of the flexible substrate 41 is electrically connected to the LED substrate 34. Connected.
In addition, the electrode pad on the solid-state imaging device 40 side is flip-chip mounted on the electrode pad 54 (see FIG. 4) provided on the back surface side of the flexible substrate 41 via bumps.
The flexible substrate 41 is formed with a narrow-width extending portion 41a extending from the vicinity of the lower end of the solid-state imaging device 40 facing the back side so as to be folded back, and the rear end of the flexible substrate 41 is connected to a rigid substrate 42. Electrically connected.

The objective optical system 31 is adjusted so that the center of the light receiving surface of the solid-state imaging device 40 flip-chip mounted on the flexible substrate 41 and the optical axis O coincide with each other, and then the rear surface of the second lens 39 receives light. As shown in FIG. 4, the objective optical system 31 is then fitted in the through hole 35 of the LED substrate 34 and the flexible substrate 41 is in contact with the back surface of the LED substrate 34. It is electrically connected and secured with an adhesive.
The rigid substrate 42 disposed on the back side of the solid-state image sensor 40 is driven by the solid-state image sensor 40 and is subjected to signal processing on an image signal that is photoelectrically converted from the solid-state image sensor 40 and compressed. A signal processing & control circuit 43 (consisting of an integrated circuit (abbreviated as IC)) that controls each circuit as well as generating image data, and the image data generated by this signal processing & control circuit 43 wirelessly A radio circuit 44 formed of an IC that performs modulation processing at a high frequency for transmission, a charging circuit 45 formed of an IC that performs charging processing, and a resistor, a capacitor, and the like for constructing these circuits incidentally An electronic component 46 is mounted.

In addition, a capacitor 47 that is formed by, for example, an electric double layer capacitor or the like that is charged by a charging circuit 45 and is substantially disk-shaped and has a large capacitance is disposed at the rear end of the substrate 42. Both electrodes are electrically connected to the substrate 42.
For example, one electrode of the capacitor 47 is connected to the electrode pad at the rear end of the lower surface of the substrate 42 by soldering in a state where the one electrode surface of the capacitor 47 is in contact, and is firmly fixed to the rear end of the substrate 42.
A cylindrical coil core 48 is disposed so as to surround the substrate 42. The coil core 48 is formed with a power receiving & transmitting coil 49 which functions as a power receiving coil and a transmitting coil (transmitting antenna) by winding a conducting wire spirally on the outer peripheral surface thereof.
Both ends of the power reception coil in the power reception & transmission coil 49 are connected to the charging circuit 45, and both ends of the transmission coil are connected to the radio circuit 44.

FIG. 4A shows a connection portion between an electrode pad 51 provided on the back surface of the LED substrate 34 and a half-through hole 52 provided at an end portion of the flexible substrate 41.
On the back surface of the LED substrate 34, two electrode pads 51 for supplying power that are electrically connected to the LED chips 36 mounted on the front surface of the LED substrate 34 are provided adjacent to each other in the horizontal direction.
The flexible substrate 41 is a circular substrate having the same outer diameter as the LED substrate 34, and the upper side is D-cut so that the upper end faces two electrode pads 51 provided on the LED substrate 34. The half through hole 52 provided at the end of the upper side is aligned so as to be in contact with the electrode pad 51 and soldered by the solder 53.
Also, the lower end side of the flexible substrate 41 is D-cut similarly to the upper side except that the central extension 41a is left.

Further, on the back surface of the flexible substrate 41, electrode pads 54 for flip-chip connection with electrode pads formed on both sides of the light receiving surface on the front surface of the solid-state imaging device 40 are formed. The electrode pads 54 and the electrode pads 51 are connected to the rigid substrate 42 through a print pattern (not shown) of the extension 41a.
On the back surface of the LED substrate 34, a solid-state imaging device 40 flip-chip connected to the flexible substrate 41, a substrate 42 connected to the extending portion 41 a of the flexible substrate 41, and a coil core 48 disposed so as to surround the substrate 42. Is surrounded by a resin 55 to form an outer package 56.
In FIG. 4 (A), the flexible substrate 41 has the same circular shape as the LED substrate 34, but may have a rectangular shape as shown in FIG. 4 (B). As shown in FIG. 4C, an octagon in which four corners of the rectangle shown in FIG. 4B are cut out may be used, or other polygons may be used.

As described above, in this embodiment, a substantially disc-shaped LED substrate 34 is provided with a through hole 35 having an inner diameter matching the outer diameter of the objective optical system 31 at the center thereof, and the objective optical system 31 is fitted into the through hole 35. By fixing them together, an optical system module having a structure in which the objective optical system 31 can be fixed to the LED substrate 34 without using a lens frame is formed.
Moreover, since the fitting part 34a concentric with the through-hole 35 in the LED board 34 is formed, almost no adjustment is performed by fitting the base end of the transparent tip cover 33 to the fitting part 34a. Even in this case, the central axis of the tip cover 33 and the optical axis of the LED can almost coincide with the optical axis O of the objective optical system 31.

The operation of this embodiment having such a configuration will be described.
As shown in FIG. 1A, the patient 2 wears a shield shirt 11, wears the extracorporeal unit 5, and swallows the capsule medical device 3 from the mouth. In this case, an AC magnetic field is applied to the antenna coils 13 a to 13 c in advance, the power is received by the power receiving & transmitting coil 49 of the capsule medical device 3, and is converted into DC power by the charging circuit 45 to charge the capacitor 47. The patient 2 swallows the capsule medical device 3 after operating each circuit of the capsule medical device 3 with the DC power stored in the capacitor 47 and confirming that it operates normally. The signal processing & control circuit 43 of the capsule medical device 3 drives and controls the LED chip 36 that forms the illumination means to emit light intermittently, and applies a driving signal to the solid-state imaging device 40.

The solid-state imaging device 40 images a part in the body cavity that is emitted by the LED chip 36 and illuminated by the white light that has passed through the phosphor 37, photoelectrically converts it, and accumulates it as a signal charge. The solid-state imaging device 40 reads out the signal charge photoelectrically converted by applying a drive signal, and outputs it as an imaging signal.
The imaging signal is converted into image data by the signal processing & control circuit 37, further converted into compressed image data, and then sent to the wireless circuit 44. The wireless circuit 44 uses the frequency of, for example, several tens of MHz or more. Is then supplied to the power receiving & transmitting coil 49 (the transmitting coil portion) and radiated to the outside as a radio wave.
This radio wave is received by the antenna 12 outside the body, demodulated by the communication circuit 16, sent to the signal processing circuit 17, and the compressed image data is stored in the hard disk 18 and decompressed, and further the video signal. The image is output to the liquid crystal monitor 14 and the image captured by the solid-state image sensor 40 is displayed on the display surface of the liquid crystal monitor 14.

In addition, for example, by applying an alternating magnetic field having a frequency of several hundreds of kHz or less through the antenna coils 13a to 13c cyclically (circularly) from the external unit 5 side, for example, at a constant cycle, the capsule medical device 3 can receive and transmit power. An AC electromotive force is induced in the coil 49, and the AC electromotive force is rectified by the charging circuit 45 and converted into a direct current, then boosted to an appropriate voltage and stored in the capacitor 47.
Therefore, since the electrical energy transmitted from the outside is stored in the capacitor 47, the image data captured inside the body can be transmitted for a long time by operating the imaging means and the like.
In the present embodiment, an illumination module 32 that uses an LED substrate 34 that does not use a lens frame and an objective optical system 31 that forms an image of the illuminated observation target portion while performing optical illumination to obtain image data. Adopted and unitized compactly.

Therefore, according to the present embodiment, it is possible to easily manufacture a capsule medical device 3 having a high-precision optical system, and to realize a small capsule medical device 3 because a lens frame is unnecessary. it can.
Moreover, by forming the illumination module 32 in which the optical component is unitized by integrating the objective optical system 31 and the tip cover 33 on the LED substrate 34, the capsule medical device 3 can be easily manufactured using the illumination module 32. . Further, the number of parts can be reduced, the assemblability can be improved, and the cost can be reduced. Moreover, the degree of freedom of design can be increased by downsizing the unit.

FIG. 5A shows a modified capsule medical device 3B in a longitudinal sectional view, and FIG. 5B shows a part in a plan sectional view. The capsule medical device 3B according to the present modification is different from the capsule medical device 3 of FIG. 3 in that the flexible substrate 41 connected to the electrode pad on the back surface of the LED substrate 34 is not provided. The electrode pads provided around the light receiving surface on the front surface of the solid-state imaging device 40 are flip-chip mounted on the electrode pads.
Further, in this modification, the front end of the rigid substrate 42 is disposed on the back surface of the solid-state image sensor 40, and the electrode pads provided on the upper and lower surfaces of the front end of the substrate 42 and the solid-state image sensor 40 are arranged. Two rows of electrode pads extending in the horizontal direction on the back surface are connected by soldering 57.

Further, in the capsule medical device 3 of FIG. 3, the exterior body 56 integrally formed with the resin 55 is formed on the back side of the LED substrate 34, but in this modification, the exterior body 56 is covered with a cylindrical frame 58. I am doing so.
In this modification, the transparent tip cover 33B that is integrally fixed to the front surface side of the LED substrate 34 has a hemispherical shape, and the center of the radius of curvature of the tip cover 33B is the optical center of the objective optical system 31. The cylindrical base end of the tip cover 33B that is fitted on the circular outer peripheral surface of the LED substrate 34 is positioned and fixed so as to coincide with the pupil position. In this case, in the illumination module 32B, the tip cover 33B is fitted on the outer peripheral surface thereof so that the optical axis O of the objective optical system 31 and the center axis of the cylinder of the tip cover 33B coincide with the optical axis of the LED. Fixed.

Further, in this modification, instead of the coil core 48 in FIG. 3, a flexible substrate 59 in which a printed pattern for forming a power receiving coil and a transmitting coil is provided on the outer peripheral surface, for example, has a cylindrical shape, The power receiving & transmitting coil 49 having the functions of the power receiving coil and the transmitting coil is formed by connecting the parts.
Then, the substrate 42 (with the signal processing & control circuit 43 and the like mounted thereon) is soldered 57 to the back surface of the solid-state imaging device 40 to be connected and mechanically fixed, or the flexible substrate 59 is formed into a cylindrical shape. After being connected to the substrate 42, the frame body 58, which is cylindrical and closed at the rear end, is fitted and bonded to the front end cover 33B to cover the built-in objects in a watertight manner.
Other configurations are the same as those of the capsule medical device 3 shown in FIG. Moreover, the effect of this modification is substantially the same as that of the capsule medical device 3 shown in FIG.

Next, Embodiment 2 of the present invention will be described with reference to FIG. FIG. 6 shows a structure near the illumination module 32C in the present embodiment. 6A is a cross-sectional view of the illumination module 32C, and FIG. 6B is a front view of FIG. 6A. In FIG. 6, the objective optical system 31 is not attached.
In the first embodiment, the LED board 34 constituting the illumination module 32 is a three-dimensional board such as MID or a cavity board having a stepped structure, but in this modification, a circular opening is provided at the center of the disk shape. An illumination module 32C having substantially the same function as that of the illumination module 32 is formed using a rigid doughnut-shaped substrate 61 or the like.
A plurality of LED chips 36 are mounted on the doughnut-shaped (hollow disk-shaped) rigid substrate 61 in the circumferential direction of the front surface by wire bonding mounting or the like. The solid-state imaging device 40 is flip-chip mounted on the back surface of the rigid substrate 61.

In addition, the D-cut lower end of the rigid substrate 61 is connected to one end of the flexible substrate 62, and the other end of the flexible substrate 62 is connected to the rigid substrate 42.
An opening provided in a circular shape at the center position of the rigid substrate 61 has an inner peripheral surface in which the objective optical system 31 is fitted and fixed (fitted to the outer diameter of the objective optical system 31) from the front side. The rear end of the cylinder 63 is fitted and fixed, and the outer cylinder 64 is fitted and fixed to the outer peripheral portion of the rigid substrate 61.
A thick portion is formed on the front side of the outer cylinder 64 corresponding to the D-cut portion below the rigid substrate 61. In the space between the D-cut portion below the rigid substrate 61 and the outer cylinder 64, the rigid substrate 61 that has been D-cut is connected to one end of the flexible substrate 62. The flexible substrate 62 extends rearward and is connected to the substrate 42.
The space between the inner cylinder 63 and the outer cylinder 64 in the LED chip 36 mounted on the rigid substrate 61 is filled with a phosphor 37.

Thus, in this embodiment, the illumination module 32B having substantially the same function as that of the first embodiment is formed.
Other configurations are the same as those of the first embodiment. In addition, according to the present embodiment, it is possible to configure the illumination module 32C having substantially the same functions and effects as in the first embodiment without using an expensive MID or cavity substrate, and the capsule medical device can be reduced in size and cost. Etc.

Next, Embodiment 3 of the present invention will be described with reference to FIGS. FIG. 7 shows a configuration of the illumination module 32D in the present embodiment.
The illumination module 32D employs a first lens 71 and a second lens 72 that are different from the objective optical system 31 in the first embodiment.
In the vicinity of the front end of the through hole 35 in the LED substrate 34, a notch 73 having a stepped diameter is provided, and a first lens 71 molded in a shape that fits into the notch 73 is bonded and fixed. From the rear of the through hole 35, the second lens 72 bonded so that the solid-state imaging device 40 is in close contact with the rear surface is inserted and fixed by adhesion.
Further, the solid-state imaging device 40 is flip-chip mounted on the back surface of the LED substrate 34 as shown in FIG.

In this case, for example, in the solid-state imaging device 40 fixed so as to be in close contact with the rear surface of the second lens 7, the second lens 72 is inserted into the through-hole 35, and in this case, the front surface of the solid-state imaging device 40 is the LED substrate 34. Flip chip mounted on the back. Then, the first lens 71 is inserted from the front side of the through hole 35, and the focus is adjusted and fixed.
Further, in the present embodiment, a rigid substrate is not used on the back side of the illumination module 32D, and a configuration is adopted in which a flexible substrate 73 on which electronic components are mounted is connected as described below.
As shown in FIG. 8 (A), a D-cut portion 34b is formed in the lower portion of the LED substrate 34, and the electrode pad facing the D-cut portion 34b is formed in a square cylindrical shape (see FIG. 9). A connection terminal portion 73 a provided in the connection 73 is electrically connected via an anisotropic conductive film (abbreviated as Anisotropic Conductive Film ACF) 74.

The ACF 74 is a film (film) that is anisotropically conductive and insulating. Specifically, the ACF 74 exhibits conductivity in the thickness direction and has insulating properties in a plane direction perpendicular to the thickness direction. Therefore, by inserting the ACF 74, the two end portions located on both sides of the portion where the ACF 74 is inserted can be electrically connected (conducted by bump connection), and the adjacent end portions in the plane direction It is possible to ensure insulation from.
In this case, as shown in FIG. 8B, which is a BB cross section of FIG. 8A, the electrode pad 75 provided on the back surface of the LED substrate 34 on which the solid-state imaging device 40 is flip-chip mounted is printed pattern. A plurality of electrode pads provided at the end of the D-cut portion 34 b are connected via 76.

The electrode pads include those connected to a power supply pattern connected to the LED chip 36. The plurality of electrode pads provided at the end of the D-cut portion 34 b are electrically connected to the connection terminal portion 73 a provided on the flexible substrate 73 via the anisotropic ACF 74. In addition, you may electrically connect a some electrode pad and the terminal part 73a for a connection, without using this ACF74.
FIG. 9 is a perspective view showing the external appearance of the flexible substrate 73 formed in a rectangular cylinder, and FIG. 10 is a developed view before being bent into a rectangular cylinder.
As shown in FIG. 10, notches 77 are provided at both ends of a folding line (shown by dotted lines) to facilitate folding. In addition, you may make thin the part along the line to be bent.

A signal processing & control circuit 43 and the like are mounted on the inner surface of the flexible substrate 73. Further, as shown in FIG. 9, a printed pattern 78 is spirally provided on the outer surface of the flexible substrate 73, and a receiving coil and a transmitting coil are connected by connecting the printed patterns 78 at the opposite ends in a cylindrical shape. The power receiving & transmitting coil 49 having the function is formed.
As shown in FIG. 8A, for example, the transparent tip cover 33 shown in FIG. 3 is fixed to the outer peripheral surface of the LED substrate 34. And the resin 55 for integral molding is poured into the back side of this LED board 34 like the case of FIG. 3, for example, and an exterior body comes to be formed.
According to the present embodiment, the power receiving & transmitting coil 49 is formed on the outer surface without using the rigid substrate 42 as in FIGS. 3 and 5 of the first embodiment, and the signal processing & control circuit is formed on the inner surface thereof. By using the flexible substrate 73 on which 43 and the like are mounted, the built-in objects can be mounted in high density in a small space, and a small capsule medical device can be manufactured.

FIG. 11 shows the structure of the periphery of the illumination module 32B in the capsule medical device 3C of the first modification.
This modified example is a configuration corresponding to the modified example of FIG. 5, and a flexible substrate 73 for forming a power receiving & transmitting coil 49 is bent so as to surround the rigid substrate 42, for example, in a square or cylindrical shape, and its end The portion is fixed on the side surface of the substrate 42.
In the present modification shown in FIG. 11, the structure of the illumination module 32 </ b> B is almost the same as that shown in FIG. 5, but the opposite ends of the printed pattern 78 formed on the flexible substrate 73 are arranged on the substrate 42. A power receiving & transmitting coil 49 having functions of a power receiving coil and a transmitting coil is formed by connecting the upper and lower surfaces of the half through hole 81 provided along the side end by soldering. According to this modification, the end portion of the printed pattern 78 formed on the flexible substrate 73 can be electrically connected so that a coil is formed, and the cylindrical flexible substrate 73 can also be fixed to the substrate 42. .

  In the configuration shown in FIG. 11, the rigid substrate 42 is employed. However, as shown in FIG. 8, the flexible substrate 73 is used to electrically connect to the solid-state imaging device 40 without using the substrate 42. May be.

FIG. 12A shows the structure of the periphery of the illumination module 32E in the second modification. In this modification, in FIG. 11, the electrode pad 83 is not provided on the front surface of the solid-state imaging device 40, and the electrode pad 83 provided on the back surface and the electrode pad 84 provided on the back surface of the LED substrate 34 are connected by wire bonding 85. It has a connected structure.
FIG. 12B shows the structure of the periphery of the illumination module 32F in the third modification. In this modified example, in FIG. 11, no electrode pad is provided on the front surface of the solid-state imaging device 40, and for example, a lead frame 86 is extended vertically and the electrode pad 87 and the lead frame 86 provided on the back surface of the LED substrate 34. Are connected by soldering.

  FIG. 12C shows the structure of the periphery of the illumination module 32G in the fourth modification. In this modified example, in FIG. 11, no electrode pad is provided on the front surface of the solid-state imaging device 40, and for example, a half through hole 88 is provided vertically, and this half through hole 88 is provided on the back surface of the LED substrate 34. Are connected by solder 90.

FIG. 12D shows a state in which the half through-hole 88 in the upper end portion of the solid-state imaging device 40 aligned with the electrode pad 89 on the back surface of the LED substrate 34 in FIG. . The second to fourth modifications have substantially the same effects as the first modification. In the first modification, the rigid substrate 42 may not be used as described, and the flexible substrate 73 may be connected to the solid-state imaging device 40.
Note that embodiments configured by partially combining the above-described embodiments also belong to the present invention.

  When it is inserted into the body cavity by swallowing from the patient's mouth and moves inside the body cavity, the image data obtained by imaging the part illuminated by the illumination means by the objective optical system and the imaging means is wirelessly transmitted to the outside of the body. By displaying on the display means, the inside of the body can be examined.

[Appendix]
1. The image pickup device according to claim 3 is flip-chip mounted on a back surface of the illumination board.
2. 4. The fitting portion according to claim 3, wherein an annular portion at the base end of a dome-shaped transparent tip cover that is concentric with the through-hole and covers the imaging element and the illumination element is fitted to and attached to the illumination board. Is provided.
3. 4. The objective optical system according to claim 3, wherein the objective optical system includes first and second lenses having outer diameters that fit into the fitting holes, and one of the first and second lenses has a constant interval between both lenses. A spacer is provided integrally.
4). In Supplementary Note 1, the illumination board is provided with a connection portion that is electrically connected to a flexible board on which electronic components are mounted.
5). In Supplementary Note 4, the flexible substrate is provided with an antenna coil for transmitting and receiving power.

The figure which shows the structure of the capsule type medical system etc. provided with Example 1 of this invention. The block diagram which shows the internal structure of an external unit. 1 is a diagram illustrating a configuration of a capsule medical device according to Embodiment 1. FIG. The figure which shows the structure of the connection part with the flexible substrate in the back surface of an illumination module. Sectional drawing which shows the structure of the capsule type medical device of a modification. The figure which shows the structure of the illumination module in Example 2 of this invention. The figure which shows the structure of the illumination module in Example 3 of this invention. The figure which shows the structure of an illumination module periphery part. The perspective view which shows the flexible substrate made into the square cylinder shape. The figure which shows the inner surface of expansion | deployment of the flexible substrate of FIG. The figure which shows the structure of the illumination module periphery part in a 1st modification. The figure which shows the structure of the illumination module periphery part in the 2nd thru | or 4th modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Capsule type medical system 2 ... Patient 3 ... Capsule type medical device 4 ... Antenna unit 5 ... Extracorporeal unit 6 ... Display system 12 ... Antenna 13a-13c ... Antenna coil (power transmission coil)
DESCRIPTION OF SYMBOLS 14 ... Liquid crystal monitor 16 ... Communication circuit 19 ... AC output circuit 31 ... Objective optical system 32 ... Illumination module 33 ... End cover 34 ... LED board 34a ... Fitting part 35 ... Through-hole 36 ... LED chip 37 ... Phosphor 38, 39 ... Lens 40 ... Solid-state imaging device 41 ... Flexible board 42 ... Board 43 ... Signal processing & control circuit 44 ... Radio circuit 45 ... Charging circuit 47 ... Condenser Agent Patent attorney Susumu Ito

Claims (3)

Illumination element, illumination substrate on which illumination element is mounted, imaging means for imaging a part illuminated by the illumination means, objective optical system for forming an optical image on the imaging means, and transparent covering the imaging range of the imaging means In a capsule medical device having a cover,
An illumination unit is integrally formed on the illumination board, and an objective optical system is fitted and fixed in a through hole provided in the illumination board, and a fitting portion with a transparent cover is provided on the outer periphery of the illumination board. Capsule type medical device.   The capsule medical device according to claim 1, wherein the illumination element includes a light emitter and a phosphor, and the light emitter and the phosphor are directly mounted in a recess provided in an illumination substrate. In a capsule medical device comprising: an illumination board on which an illumination element is mounted; an imaging element that images a portion illuminated by the illumination element; and an objective optical system that forms an optical image on the imaging element.
A through-hole having an inner diameter that is provided on the illumination substrate and almost matches the outer diameter of the objective optical system;
An objective optical system whose outer peripheral surface is fitted and fixed in the through hole; and
A capsule medical device characterized by comprising:

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