JP2005142427A - Optical coupling element, manufacturing method thereof, and electronic equipment equipped therewith - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low input type optical coupling element, the manufacturing method of this optical coupling element, and electronic equipment formed by employing the optical coupling element or the manufacturing method of the optical coupling element. <P>SOLUTION: The optical coupling element comprises a luminous chip and an euphotic chip, which are arranged so as to be opposed optically; two sets of lead terminals wherein these chips are bonded respectively and individually through die bonding; gold wires for connecting electrically the luminous chip and the euphotic chip to predetermined positions of the lead terminals; a precoat resin part for covering the peripheral part of the luminous chip, a transparent resin parts for covering the peripheries of the luminous chip and the euphotic chip which are covered by the precoat resin; and a light shielding resin part, for covering the surface of the translucent resin. The header unit 11a of the lead frame 11 is provided with the positioning means 11a1 of a recessed part, for example. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention provides a light emitting chip and a light receiving chip that are optically arranged oppositely, two sets of lead terminals in which the light emitting chip and the light receiving chip are individually die-bonded, and a predetermined set of the light emitting chip, the light receiving chip, and the lead terminal. An optical coupling element comprising: a gold wire that electrically connects positions; a light-transmitting resin portion that covers the periphery of the light-emitting chip and the light-receiving chip; and a light-blocking resin portion that covers the surface of the light-transmitting resin portion The present invention also relates to a method for manufacturing the optical coupling element, and the optical coupling element or an electronic apparatus including the optical coupling element.

  As an example of a conventional optical coupling element, there is a double mold type optical coupling device (see, for example, Patent Document 1).

  FIG. 11 is a cross-sectional view showing an example of a conventional double mold type optical coupling device, and FIG. 12 is a flowchart showing an example of a manufacturing method of the optical coupling device shown in FIG. In FIG. 12, steps S101 to S103 are steps relating only to the part relating to light emission in the optical coupling device, and steps S121 and S122 are steps relating to only the part relating to light reception in the optical coupling device. Step S112 is a step relating to the entire optical coupling device including the part related to light emission and the part related to light reception.

  In the manufacturing process of the conventional double mold type optical coupling device, as shown in FIG. 11, the light emitting chip 101 and the light receiving chip 102 are die-bonded to individual lead frames 103a and 103b, respectively (step S101 and step S121), and light emission is performed. After wire bonding is performed to the chip 101 and the light receiving chip 102 with the gold wires 104a and 104b (step S102 and step S122), the light emitting chip 101 is precoated with silicone resin to form the precoat resin portion 105 (step S103). . After that, the lead frames 103a and 103b are spot welded or set on a loading frame, etc., so that the light emitting chip 101 and the light receiving chip 102 are optically arranged opposite to each other (step S104), and the primary is made of a translucent resin. Molding is performed to form the light-transmitting resin portion 106 (step S105), and after deburring, secondary molding is performed with the light-blocking resin to form the light-blocking resin portion 107 (step S106). . Thereafter, the external terminal portions (portions protruding from the light-shielding resin portion 107 of the lead frames 103a and 103b) are subjected to plating (exterior plating in step S107), tie bar cutting, lead bending (forming in step S108), and the like. Furthermore, the optical coupling device is completed by carrying out electrical characteristics inspection (test in step S109) and appearance inspection (step S110). Finally, this optical coupling device is shipped (step S112) after being packaged (step S111).

  Next, steps related to die bonding in the conventional method of manufacturing an optical coupling element will be described in detail with reference to FIG.

  FIG. 13 is an explanatory diagram illustrating an example of the state of the optical coupling device in the step of performing die bonding in the method of manufacturing the optical coupling device illustrated in FIG. 12. In FIG. 13, the state immediately before die bonding is shown on the left side of the drawing, and the state immediately after die bonding is shown on the right side of the drawing.

  First, the back side (sheet side) of the semiconductor chip 108 (that is, the light emitting chip 101 or the light receiving chip 102) attached to the die bonding sheet is pushed up with a needle-like pin, and the semiconductor chip 108 is peeled off from the sheet. Make it easier. Subsequently, the collet 109 of the die bonding apparatus is applied to the surface of the semiconductor chip 108 to attract the semiconductor chip 108 and hold it on the lead frame 110 (that is, the lead frame 103a on the light emitting chip 101 side or the lead frame 103b on the light receiving chip 102 side). Come. Then, the semiconductor chip 108 is mounted and fixed (die-bonded) on the lead frame 110 so that the semiconductor chip 108 is pressed against the paste 111 applied on the lead frame 110 with the collet 109.

  At this time, the mounting position of the semiconductor chip 108 is determined by setting in the die bonding apparatus for each type and size of the semiconductor chip 108.

  Next, an example of a lead frame constituting a conventional optical coupling device will be described with reference to the drawings.

  FIG. 14 is an explanatory view showing an example of a lead frame constituting a conventional optical coupling device.

  The lead frame 120 is a lead frame on the light receiving chip side, and includes two lead terminals 121 and 122 having a header portion (that is, an element mounting portion) 121a or a wire bond portion 122a, and two lead terminals 121, And a tie bar 123 connecting the middle part of 122.

The header part 121a is a flat plate-like member and is a part where the light receiving chip is die-bonded. Further, the tie bar 123 is separated and removed from the lead terminals 121 and 122 at the time of forming.
JP 59-177978 A

  In the conventional die bonding method of an optical coupling device, the mounting position of the semiconductor chip is set in advance for each type and size of the semiconductor chip to be used. However, since there are many types and sizes of semiconductor chips used on the same production line, if the positioning position is not clear at the time of setting, the operator may make a mistake in setting the mounting position or accept the original use. There is a problem that the setting is not the same as the mounting position data of another light receiving / emitting chip, not the mounting position data of the light emitting chip.

  When such a problem occurs, the mounting position shifts from the center, so that the amount of light emission that is originally required does not reach the light receiving chip, so that the yield reduction due to insufficient sensitivity occurs frequently in the completed optical coupling device. Occurs.

  In addition, in order to stably produce low-input type optical coupling elements, light emitting chips with a large amount of light emission and light receiving chips with good light receiving sensitivity were used. However, there is a balance between current technical limits and price. There is a need for a production method that can suppress variations in photosensitivity.

  SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and its object is to form a low input type optical coupling element, a method for manufacturing the optical coupling element, and the optical coupling element or the method for manufacturing the optical coupling element. Another object of the present invention is to provide an electronic device including the optical coupling element.

  In order to solve the above problems, an optical coupling element of the present invention includes a light-emitting chip and a light-receiving chip that are optically arranged opposite to each other, two sets of lead terminals in which the light-emitting chip and the light-receiving chip are individually die-bonded, and A gold wire that electrically connects the light emitting chip and the light receiving chip to a predetermined position of the lead terminal, a precoat resin portion that covers the periphery of the light emitting chip, and a peripheral portion of the light emitting chip and the light receiving chip that are covered with the precoat resin portion In an optical coupling element comprising a light-transmitting resin portion that covers and a light-shielding resin portion that covers the surface of the light-transmitting resin portion, the center of the light receiving surface of the light receiving chip emits light to the header portion of the lead frame on the light receiving chip side. A positioning means for aligning with the center of the light emitting surface of the chip is provided. As a result, the center of the light receiving surface of the light receiving chip and the center of the light emitting surface of the light emitting chip can be arranged to face each other, so that variations in photosensitivity can be suppressed and input current can be reduced.

  Further, another form of the optical coupling element of the present invention includes a light emitting chip and a light receiving chip that are optically arranged opposite to each other, two sets of lead terminals in which the light emitting chip and the light receiving chip are individually die-bonded, and light emission. A gold wire for electrically connecting the chip and the light receiving chip to a predetermined position of the lead terminal, a precoat resin portion covering the peripheral portion of the light emitting chip, and a peripheral portion of the light emitting chip and the light receiving chip covered by the precoat resin portion In an optical coupling element including a light-transmitting resin portion and a light-blocking resin portion covering the surface of the light-transmitting resin portion, the light-receiving chip is centered on the light-emitting surface of the light-emitting chip on the header portion of the lead frame on the light-emitting chip side. The positioning means for aligning with the center of the light receiving surface is provided. As a result, the center of the light receiving surface of the light receiving chip and the center of the light emitting surface of the light emitting chip can be arranged to face each other, so that variations in photosensitivity can be suppressed and input current can be reduced.

  In the above configuration, the positioning means may be a concave portion or a convex portion, or may be a marking. In this case, the positioning of the light emitting chip and the light receiving chip can be easily performed.

  Further, in the above configuration, the positioning means may be a convex portion, and solder may be used as a conductive material for mounting the light receiving chip on the header portion. The solder that has become liquid above has a shape with a raised center due to surface tension, and the light receiving chip that is lighter than the solder floats on the solder, so the light receiving chip is placed near the center of the mounting part, so Positioning can be performed easily.

  The method of manufacturing an optical coupling element according to the present invention includes a step of die bonding a light emitting chip and a light receiving chip to a lead terminal, a step of wire bonding the light emitting chip and the light receiving chip to a predetermined position of the lead terminal, and the light emitting chip and the light receiving chip. A step of optically arranging the transparent resin portion, a step of forming a light-transmitting resin portion by performing a primary mold on the periphery of the light-emitting chip and the light-receiving chip, and a step of forming the light-transmitting resin portion by a secondary mold. And a step of covering the surface with a light-shielding resin portion, wherein the header portion of the lead frame on the light-receiving chip side corresponds to the size of the light-receiving chip before the die bonding step. Forming a positioning means for aligning the center of the light receiving surface of the light receiving chip with the center of the light emitting surface of the light emitting chip, In the step of grayed has a configuration which was equipped with a step of mounting the combined center of the light receiving chip in the center of the positioning means. As a result, the center of the light receiving surface of the light receiving chip and the center of the light emitting surface of the light emitting chip can be arranged to face each other, so that variations in photosensitivity can be suppressed and input current can be reduced.

  In another embodiment of the method for manufacturing an optical coupling element of the present invention, a step of die-bonding the light-emitting chip and the light-receiving chip to the lead terminal, a step of wire-bonding the light-emitting chip and the light-receiving chip to a predetermined position of the lead terminal, A step of optically disposing the light emitting chip and the light receiving chip, a step of forming a light-transmitting resin portion by performing a primary mold on the periphery of the light emitting chip and the light receiving chip, and a secondary mold, And a step of covering the surface of the light-transmitting resin portion with a light-shielding resin portion, and before the step of die bonding, before the step of die bonding, on the header portion of the lead frame on the light emitting chip side, Comprising a step of forming a positioning means for aligning the light emitting surface center of the light emitting chip with the light receiving surface center of the light receiving chip according to the size of the light emitting chip, In the process of serial die bonding, it has a configuration which includes a step of mounting the combined center of the light emitting chip in the center of the positioning means. As a result, the center of the light receiving surface of the light receiving chip and the center of the light emitting surface of the light emitting chip can be placed opposite to each other, so that variations in photosensitivity can be suppressed and input current can be reduced.

  In the above configuration, instead of the step of forming the positioning means, a step of reading the mounting position data of the light emitting chip, and the center of the light receiving surface of the light receiving chip coincides with the center of the light emitting surface of the light emitting chip based on the mounting position data. In this case, it is easy to align the center of the light receiving surface of the light receiving chip with the center of the light emitting surface of the light emitting chip, and the light emitting chip. In addition, even if the size and type of the light receiving chip reaches a large number, the setting position of the chip is not mistaken for the mounting position of the corresponding chip and the mounting position of another chip. It becomes possible to produce, and it becomes easy to reduce the input current.

  Since the electronic device of the present invention is formed by using any one of the above-described optical coupling element or the optical coupling element manufacturing method, energy saving can be achieved.

  According to the optical coupling element of the present invention, positioning means for aligning the light receiving surface center of the light receiving chip with the light emitting surface center of the light emitting chip is provided in the header portion of the lead frame on the light emitting chip side and / or the light receiving chip side. Thus, the center of the light receiving surface of the light receiving chip and the center of the light emitting surface of the light emitting chip can be easily arranged to face each other. As a result, variations in photosensitivity can be suppressed, and the input current can be reduced.

  According to the method for manufacturing an optical coupling element of the present invention, before the die bonding step, the light emitting surface of the light emitting chip is formed on the header part of the lead frame on the light emitting chip side and / or the light receiving chip side according to the size of the light emitting chip. Positioning means for aligning the center with the light receiving surface center of the light receiving chip and / or positioning means for aligning the light receiving surface center of the light receiving chip with the light emitting surface center of the light emitting chip according to the size of the light receiving chip is formed. And a step of mounting the light emitting chip by aligning the center of the light emitting chip with the center of the positioning means and / or a step of mounting by aligning the center of the light receiving chip in the step of die bonding. The center of the surface and the center of the light emitting surface of the light emitting chip can be arranged to face each other. As a result, variations in photosensitivity can be suppressed, and the input current can be reduced.

  Since the electronic device of the present invention is formed using the above-described optical coupling element or the optical coupling element manufacturing method, energy saving can be achieved.

  Embodiments of the present invention will be described below with reference to the drawings.

  Embodiment 1 of the present invention will be described below with reference to the drawings.

  FIG. 1 is a cross-sectional view showing an optical coupling device according to a first embodiment of the present invention. In FIG. 1, L indicated by a one-dot chain line indicates the center of the light emitting chip and the light receiving chip. FIG. 2 is an explanatory view showing an example of a lead frame used in the manufacturing process of the optical coupling element shown in FIG. 1, and FIG. 3 shows another lead frame used in the manufacturing process of the optical coupling element of the present invention. FIG. 4 is an explanatory view showing still another example of the lead frame used in the manufacturing process of the optical coupling element of the present invention. In this embodiment, in order to simplify the description, FIGS. 2 to 4 are shown as lead frames common to both the light emitting chip side and the light receiving chip side.

  The optical coupling element of this embodiment includes a light emitting chip 1 and a light receiving chip 2 that are optically opposed to each other, and two sets of lead terminals 3a and 3b in which the light emitting chip 1 and the light receiving chip 2 are individually die-bonded. The gold wires 4a and 4b that electrically connect the light emitting chip 1 and the light receiving chip 2 and predetermined positions of the lead terminals 3a and 3b, the precoat resin portion 5 that covers the periphery of the light emitting chip 1, and the precoat resin portion 5 The light-emitting chip 1 and the light-receiving chip 2 are provided with a light-transmitting resin portion 6 that covers the periphery of the light-emitting chip 1 and the light-receiving chip 2 and a light-shielding resin portion 7 that covers the surface of the light-transmitting resin portion 6.

  The lead terminals 3a and 3b are members obtained from a lead frame 10 used in the manufacturing process of the optical coupling element, and the lead frame 10 has two leads provided with an element mounting portion 11a or a wire bond portion 12a. Terminals 11 and 12 (corresponding to 3a and 3b) and a tie bar 13 connecting intermediate portions of the two lead terminals 11 and 12 are provided. The element mounting portion 11a of the lead frame 10 on the light receiving chip side serves as positioning means. I have.

  In the lead frame 10 shown in FIG. 2, a concave portion 11a1 is formed on the surface of a plate-shaped element mounting portion (ie, header portion) 11a as positioning means. Moreover, in the lead frame 10 shown in FIG. 3, the convex part 11a2 is formed in the plate-shaped element mounting part 11a surface as a positioning means.

  As for the size of the bottom surface of the concave portion 11a1 and the top portion of the convex portion 11a2, it is preferable that the size of one side is 20 μm to 300 μm larger than the size of the bottom surface of the light emitting chip 1 or the light receiving chip 2 to be mounted to obtain stable photosensitivity.

  When the light receiving chip 2 is used, the light receiving chip 2 is arranged near the center of the element mounting portion 11a by using the convex portion 11a2 as positioning means and using solder as the conductive material fixed to the lead frame 10. Stable light sensitivity can be obtained. This is a method using the characteristic that the solder is heated to be liquid before being cured. That is, the solder that has become liquid on the convex portion 11a2 has a shape in which the center is raised due to surface tension, and the light receiving chip 2 that is lighter than the solder floats on the solder. It will be placed near the center.

  Furthermore, in the lead frame shown in FIG. 4, a marking 11a3 is provided on the surface of the flat element mounting portion 11a as positioning means.

  The marking 11a3 may have any shape as long as the mounting position of the light-emitting chip 1 or the light-receiving chip 2 becomes clear. In FIG. Grooves are provided, and these four grooves are arranged around the mounting position.

  Next, the manufacturing method of the optical coupling element of this invention is demonstrated.

  FIG. 5 is a flowchart showing Example 1 of the manufacturing method of the optical coupling element shown in FIG. In FIG. 5, Steps S1 to S3 are steps relating only to the part relating to light emission in the optical coupling device, and Steps S21 to S23 are steps relating to only the part relating to light reception in the optical coupling device. Step S12 is a step related to the entire optical coupling device including the part related to light emission and the part related to light reception. FIG. 6 is an explanatory diagram showing a process of performing die bonding in the method of manufacturing an optical coupling element performed using the lead frame shown in FIG. 2, and FIG. 7 is a diagram showing the lead frame shown in FIG. FIG. 8 is an explanatory view showing a step of performing die bonding in the method of manufacturing an optical coupling element performed using the method, and FIG. 8 is a method of manufacturing an optical coupling element performed using the lead frame shown in FIG. It is explanatory drawing which shows the process which is implementing die-bonding among these. 6 to 8 are illustrated as a lead frame common to the light emitting chip 1 and the light receiving chip 2. 6 to 8, the left side of the drawing shows the state immediately before die bonding, and the right side of the drawing shows the state immediately after die bonding.

  Since the optical semiconductor element of the present embodiment is manufactured using the lead frame having the positioning means as described above, in the manufacturing process, before the light emitting chip and the light receiving chip are mounted on the lead frame, the light emission is performed. Positioning means is formed in the element mounting portion of the lead frame according to the size and type of the chip and the light receiving chip. The positioning means may be formed by any method as long as the mounting position is clearly known.

  First, as shown in FIG. 5, positioning means are provided on the element mounting portions of the lead frames on the light emitting chip side and the light receiving chip side (steps S0 and S21).

  Thereafter, the collet 14 of the die bonding apparatus is applied to the surface of the light emitting chip 1 to adsorb the light emitting chip 1 and bring it onto the element mounting portion 11a of the lead frame. Then, the light emitting chip 1 is pressed against the paste 15 applied on the positioning means (the region surrounded by the concave portion 11a1, the convex portion 11a2, or the marking 11a3) of the element mounting portion 11a with the collet 14. The light emitting chip 1 is die-bonded to the lead frame by mounting and fixing on the element mounting portion 11a (step S2).

  On the other hand, the collet 14 of the die bonding apparatus is applied to the surface of the light receiving chip 2 to suck the light receiving chip 2 and bring it onto the element mounting portion 11a of the lead frame. Then, the light receiving chip 2 is pressed against the paste 15 applied on the positioning means (the region surrounded by the concave portion 11a1, the convex portion 11a2, or the marking 11a3) of the element mounting portion 11a by the collet 14. By mounting and fixing on the element mounting portion 11a, the light receiving chip is die-bonded to the two lead frame (step S22).

  Accordingly, as shown in FIGS. 6 and 7, the light emitting chip 1 or the light receiving chip 2 is mounted on the concave portion 11a1 or the convex portion 11a2, or the region surrounded by the marking 11a3 as shown in FIG. Mounted on.

  Subsequently, wire bonding is performed on the light emitting chip and the light receiving chip with gold wires (step S2 and step S23), and then the light emitting chip is precoated with silicone resin to form a precoat resin portion (step S3).

  Thereafter, the light emitting chip and the light receiving chip are optically arranged opposite to each other by spot welding or setting the lead frame on a loading frame (step S4), and a primary molding is performed with a translucent resin. A light-sensitive resin part is formed (step S5), and after deburring, secondary molding is performed with the light-shielding resin to form a light-shielding resin part (step S6).

  Subsequently, the external terminal portion is subjected to plating treatment (exterior plating in step S7), tie bar cutting, lead bending (forming in step S8), and the like, and further electrical characteristics inspection (test in step S9) and appearance inspection (step S10). The optical coupling device is completed by executing.

  Finally, after packing the optical coupling element (step S11), the completed optical coupling element is shipped from the manufacturing factory (step S12).

  Since the optical coupling element and the manufacturing method of the optical coupling element of this embodiment have such a configuration, it is easy to align the center of the light receiving surface of the light receiving chip and the center of the light emitting surface of the light emitting chip, and light receiving and emitting Even if there are many chip sizes and types, it is possible to produce a photocoupler with stable photosensitivity, eliminating the wrong setting of the mounting position and the wrong mounting position of the chip with another chip. As a result, it is easy to reduce the input current.

  In addition, when an electronic apparatus including an optical coupling element formed using such an optical coupling element or an optical coupling element manufacturing method is configured, energy saving can be achieved.

  In this embodiment, positioning means is provided on both the light emitting chip side and light receiving chip side lead frames, but positioning means is provided only on the light emitting chip side lead frame or only on the light receiving chip side lead frame. Also good.

  Next, a second embodiment of the present invention will be described with reference to the drawings.

  FIG. 9 is an explanatory view showing an example of a lead frame on the light emitting chip side used in Example 2 of the manufacturing process of the optical coupling device of the present invention, and FIG. 10 shows the manufacturing process of the optical coupling device of the present invention. 6 is an explanatory view showing an example of a lead frame on the light receiving chip side used in Example 2. FIG.

  In the method of manufacturing the optical coupling element of this embodiment, as a means for aligning the center of the light receiving surface of the light receiving chip 2 and the center of the light emitting surface of the light emitting chip 1, the light emitting chip 1 is first mounted on the lead frame 10a. Position data a1 is obtained, and based on this mounting position data, the mounting position data a2 of the light receiving chip 2 is corrected in advance so that the center of the light receiving surface of the light receiving chip 2 and the center of the light emitting surface of the light emitting chip 1 are opposed to each other. Then, the light receiving chip 2 is mounted on the lead frame 10b. That is, in this embodiment, positioning means such as the concave portion 11a1, the convex portion 11a2, or the marking 11a3 as in the first embodiment is not provided.

  Here, the distance from the tip of the element mounting portion of the lead frame 10a to one side surface of the light emitting chip 1 is adopted as the mounting position data a1 of the light emitting chip 1, and further, the mounting position data of the light receiving chip 2 is used. As a2, the distance from the tip of the element mounting portion of the lead frame 10b to one side surface of the light receiving chip 2 is adopted.

  For example, when the mounting position data a1 of the light emitting chip 1 is shifted by a μm in the X direction from the predetermined set position, the mounting position data a1 is reflected in the mounting position data a2 of the light receiving chip 2 and the light receiving chip 2 is mounted. In the same manner, the light receiving chip 2 is mounted on the element mounting portion of the lead frame 10b by setting it to be shifted from the predetermined mounting position by a μm in the X direction.

  In this case, the light receiving chip 2 may be mounted first, and the mounting position data a2 of the light receiving chip 2 may be reflected when the light emitting chip 1 is mounted.

  Since the optical coupling element manufacturing method of the present embodiment has such a configuration, it is easy to align the center of the light receiving surface of the light receiving chip and the center of the light emitting surface of the light emitting chip, and the light emitting chip and the light receiving device. Even if there are many chip sizes and types, there is no mistake in setting the mounting position between the mounting position of the corresponding chip and the mounting position of another chip, and an optical coupling element with stable light sensitivity can be produced. It is possible to reduce the input current.

  Further, when an electronic device including an optical coupling element formed using such an optical coupling element or an optical coupling element manufacturing method is configured, energy saving can be achieved.

It is sectional drawing which shows Example 1 of the optical coupling element of this invention. It is explanatory drawing which shows an example of the lead frame used in the manufacturing process of the optical coupling element shown in FIG. It is explanatory drawing which shows the other example of the lead frame used in the manufacturing process of the optical coupling element of this invention. It is explanatory drawing which shows the further another example of the lead frame used in the manufacturing process of the optical coupling element of this invention. It is a flowchart which shows Example 1 of the manufacturing method of the optical coupling element shown in FIG. It is explanatory drawing which shows the process which is implementing die-bonding among the manufacturing methods of the optical coupling element implemented using the lead frame shown in FIG. It is explanatory drawing which shows the process which is implementing die-bonding among the manufacturing methods of the optical coupling element implemented using the lead frame shown in FIG. It is explanatory drawing which shows the process which is implementing die-bonding among the manufacturing methods of the optical coupling element implemented using the lead frame shown in FIG. It is explanatory drawing which shows an example of the lead frame by the side of the light emitting chip used in Example 2 of the manufacturing process of the optical coupling element of this invention. It is explanatory drawing which shows an example of the lead frame by the side of the light receiving chip used in Example 2 of the manufacturing process of the optical coupling element of this invention. It is sectional drawing which shows an example of the conventional double mold type optical coupling device. It is a flowchart which shows an example of the manufacturing method of the optical coupling device shown in FIG. It is explanatory drawing which shows an example of the state of the optical coupling device in the process which is implementing die-bonding among the manufacturing methods of the optical coupling device shown in FIG. It is explanatory drawing which shows an example of the lead frame which comprises the conventional optical coupling device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emitting chip 2 Light receiving chip 3a, 3b Lead terminal 4a, 4b Gold wire 5 Precoat resin part 6 Translucent resin part 7 Light-shielding resin part 10 Lead frame 11a Element mounting part 11a1 Concave part 11a2 Convex part 11a3 Marking

Claims (10)

A light emitting chip and a light receiving chip which are optically opposed to each other;
Two sets of lead terminals in which the light emitting chip and the light receiving chip are individually die-bonded, and
A gold wire for electrically connecting the light emitting chip and the light receiving chip and a predetermined position of the lead terminal;
A precoat resin portion covering the periphery of the light emitting chip;
A translucent resin portion covering the periphery of the light emitting chip and the light receiving chip covered with the precoat resin portion;
In the optical coupling element comprising a light-shielding resin portion that covers the surface of the light-transmitting resin portion,
An optical coupling element characterized in that positioning means for aligning the center of the light receiving surface of the light receiving chip with the center of the light emitting surface of the light emitting chip is provided in the header portion of the lead frame on the light receiving chip side. A light emitting chip and a light receiving chip which are optically opposed to each other;
Two sets of lead terminals in which the light emitting chip and the light receiving chip are individually die-bonded, and
A gold wire for electrically connecting the light emitting chip and the light receiving chip and a predetermined position of the lead terminal;
A precoat resin portion covering the periphery of the light emitting chip;
A translucent resin portion covering the periphery of the light emitting chip and the light receiving chip covered with the precoat resin portion;
In the optical coupling element comprising a light-shielding resin portion that covers the surface of the light-transmitting resin portion,
An optical coupling element characterized in that positioning means for aligning a light emitting surface center of a light emitting chip with a light receiving surface center of a light receiving chip is provided in a header portion of a lead frame on a light emitting chip side.   The optical coupling element according to claim 1, wherein the positioning means is a concave portion or a convex portion.   3. The optical coupling element according to claim 1, wherein the positioning means is a marking.   2. The optical coupling element according to claim 1, wherein the positioning means is a convex portion, and solder is used as a conductive material for mounting the light receiving chip on the header portion. A step of die bonding the light emitting chip and the light receiving chip to the lead terminal, a step of wire bonding the light emitting chip and the light receiving chip to a predetermined position of the lead terminal, a step of optically disposing the light emitting chip and the light receiving chip, and light emission A step of forming a light-transmitting resin portion by performing primary molding on the peripheral portion of the chip and the light-receiving chip, and a step of covering the surface of the light-transmitting resin portion with a light-blocking resin portion by a secondary mold A method for manufacturing an optical coupling element comprising:
Before the die bonding step, positioning means for aligning the light receiving surface center of the light receiving chip with the light emitting surface center of the light emitting chip is formed in the header portion of the lead frame on the light receiving chip side according to the size of the light receiving chip. And a step of mounting the light receiving chip with the center of the positioning means in the die bonding step. A step of die bonding the light emitting chip and the light receiving chip to the lead terminal, a step of wire bonding the light emitting chip and the light receiving chip to a predetermined position of the lead terminal, a step of optically disposing the light emitting chip and the light receiving chip, and light emission A step of forming a light-transmitting resin portion by performing primary molding on the peripheral portion of the chip and the light-receiving chip, and a step of covering the surface of the light-transmitting resin portion with a light-blocking resin portion by a secondary mold A method for manufacturing an optical coupling element comprising:
Before the die bonding step, positioning means for aligning the light emitting surface center of the light emitting chip with the light receiving surface center of the light receiving chip is formed in the header part of the lead frame on the light emitting chip side according to the size of the light emitting chip. And a step of mounting the light emitting chip with the center of the positioning means in the die bonding step.   Instead of the step of forming the positioning means, a step of reading the mounting position data of the light emitting chip and a light receiving chip mounted so that the center of the light receiving surface of the light receiving chip coincides with the center of the light emitting surface of the light emitting chip based on the mounting position data The method of manufacturing an optical coupling element according to claim 6, further comprising a step of:   Instead of the step of forming the positioning means, a step of reading the mounting position data of the light receiving chip and a light emitting chip mounted so that the light emitting surface center of the light emitting chip coincides with the light receiving surface center of the light receiving chip based on the mounting position data The method of manufacturing an optical coupling element according to claim 7, further comprising:   10. An electronic device comprising: an optical coupling element according to claim 1; or an optical coupling element formed by using the optical coupling element manufacturing method.

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