JP2005139261A - Resin composition, resin composition intermediate, method for producing resin composition, and method for producing resin composition intermediate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a new resin composition which can realize excellent transparency and improved mechanical characteristics such as stiffness as resin glass capable of being applied to various products instead of conventional inorganic glass. <P>SOLUTION: This method for producing the resin composition comprising phenyl group-having inorganic oxide fine particles and a polycarbonate/phenyl group-having polyvinyl copolymer comprises dissolving a resin composition intermediate containing a polycarbonate polymer having double bonds at the terminals in a prescribed solvent to produce a preliminary polymerization solution, adding the phenyl group-having inorganic oxide fine particles and a phenyl group-having vinyl monomer to the preliminary polymerization solution to produce a polymerization solution, and then heating the polymerization solution at a prescribed temperature to cause the polymerization reaction. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a resin composition capable of realizing improvement in rigidity, reduction in coefficient of thermal expansion, and improvement in surface hardness without reducing light transmittance, and a resin composition intermediate. Moreover, this invention relates to the manufacturing method of the said resin composition and the said resin composition intermediate body.

  The window glass of an automobile occupies most of the outer shape, and is an important component in terms of operation and appearance. With the appearance of various types of bent glass, the degree of freedom of shape has increased, and the use area has increased. For this reason, weight reduction and safety are required. In addition, recent headlamps have a lot of new modeling, and demands for shape flexibility, optical performance, etc. are high.

  Since resin glass has a smaller elastic modulus than inorganic glass, it has conventionally been difficult to apply it to large window glass products. In addition, the rigidity, etc. is smaller than that of inorganic glass, and in order to use it for large window glass products as described above, the thickness has to be increased and the demand for weight reduction cannot be satisfied. . Furthermore, resin glass has a larger coefficient of thermal expansion than inorganic glass. When applied to window glass products as described above, for example, in summer, the surface is wavy due to the thermal expansion of the resin glass. There was a problem that sufficient visibility could not be secured.

  On the other hand, an attempt has been made to improve the rigidity by adding glass fiber as a reinforcing material in the resin glass, but the fiber diameter of the glass fiber is about 10 microns, and the length is about 200 microns. As a result, visible light was reflected without being transmitted, and as a result, it was opaque. For this reason, since the glass fiber-containing resin glass is insufficient for securing the field of view for safety, it has not been adopted for the above-described window glass parts.

  Further, since the resin glass has a surface hardness smaller than that of the inorganic glass, it is damaged when rubbed with a wiper, so that it is difficult to apply to the window glass part from this point of view. On the other hand, attempts have been made to apply organosilane-based surface hardening treatment to the resinous glass, but such surface hardening treatment cannot sufficiently cure the resinous glass surface. As a result, many scratches occur after long-term use, and as a result, it has not been put into practical use.

  Furthermore, in order to improve the rigidity of the resin glass and ensure the surface hardness, attempts have been made to form a glass laminate by laminating inorganic glass on the surface of the resin glass. Interfacial peeling occurs due to the difference in thermal expansion between the resin glass and the inorganic glass, and as a result, it has not been put into practical use.

  On the other hand, attempts have been made to sputter silica on the desk surface for the purpose of hardening the surface and improving the rigidity of the resin storage desk surface of recent electronic components, but the sputtering process is performed in a vacuum atmosphere. Therefore, such an attempt cannot be applied to large parts, and there is a problem that productivity is low.

  In view of such a problem, the present applicant has studied a technique for blending silica fine particles in the process of synthesizing an acrylic resin (see JP-A-11-343349). However, since the obtained resin composition is mainly composed of an acrylic resin as a base material, these characteristics cannot be sufficiently satisfied at present when the required level of heat resistance and impact resistance has increased.

  Further, in the same publication, it is disclosed that a polycarbonate resin is dissolved in a methylene chloride solvent, and silica fine particles are mixed therewith. However, at a relatively large silica concentration, mixing of the silica in the polycarbonate resin is disclosed. Dispersion becomes difficult, and transparency and mechanical strength such as rigidity, elastic modulus, and impact resistance cannot be sufficiently improved.

  In view of such a problem, the surface of silica is modified with a silicone compound or the like (Japanese Patent Laid-Open No. 2003-201114), or the surface of silica is subjected to a hydrophobic treatment (Japanese Patent Laid-Open No. 2003-201405). Attempts to form functional groups that generate hydroxyl groups and hydrogen bonds on the surface of the polymer constituting the resin composition, and to disperse the hydrophobized silica in the resin composition (Japanese Patent Laid-Open No. 2003-201409) However, the dispersibility and stability of silica in the resin composition are not sufficient, and it has not been possible to obtain a resin composition that can simultaneously satisfy the transparency and mechanical strength.

  The present invention has been made in view of the above-mentioned problems of the prior art, and is excellent in transparency and improved in mechanical properties such as rigidity as a resin glass that can be applied to various products in place of the conventional inorganic glass. A novel resin composition that can be realized is provided.

In order to achieve the above object, the present invention provides:
The present invention relates to a resin composition comprising inorganic oxide fine particles having a phenyl group and a polyvinyl copolymer having a polycarbonate / phenyl group.

で示される、片末端に二重結合を有するポリカーボネート重合体を含む樹脂組成物中間体及び

で示される、両末端に二重結合を有するポリカーボネート重合体を含む樹脂組成物中間体の少なくとも一方を所定の溶媒中に溶解させて、予備重合溶液を作製する工程と、
前記予備重合溶液中に、フェニル基を有する無機酸化物微粒子及びフェニル基を有するビニルモノマーを添加して重合溶液を作製する工程と、
前記重合溶液を所定温度に加熱することにより重合反応を生ぜしめ、前記フェニル基を有する前記無機酸化物微粒子と、ポリカーボネート／フェニル基を有するポリビニル共重合体とを含むことを特徴とする、樹脂組成物を製造する工程と、
を具えることを特徴とする、樹脂組成物の製造方法に関する。 The present invention also provides:

And a resin composition intermediate comprising a polycarbonate polymer having a double bond at one end, and

A step of dissolving a resin composition intermediate containing a polycarbonate polymer having a double bond at both ends, in a predetermined solvent to prepare a prepolymerized solution;
A step of adding a phenyl group-containing inorganic oxide fine particle and a phenyl group-containing vinyl monomer to prepare a polymerization solution in the prepolymerization solution;
A resin composition characterized by causing a polymerization reaction by heating the polymerization solution to a predetermined temperature, and containing the inorganic oxide fine particles having the phenyl group and a polyvinyl copolymer having a polycarbonate / phenyl group. Manufacturing a product,
It is related with the manufacturing method of the resin composition characterized by comprising.

  In the present invention, inorganic oxide fine particles having a phenyl group are prepared, while a resin composition intermediate containing a polycarbonate polymer represented by [Chemical Formula 1] or [Chemical Formula 2] is prepared. And while preparing the prepolymerization solution containing the said resin composition intermediate body, adding the vinyl monomer which has the said inorganic oxide microparticles | fine-particles and a phenyl group in this prepolymerization solution, producing a polymerization solution, and heating to predetermined temperature Polymerization reaction.

  At this time, the vinyl monomer is added to the double bond portion of the polycarbonate polymer to form a polycarbonate / polyvinyl copolymer, and the phenyl group in the copolymer and the phenyl group in the inorganic oxide fine particles As a result, the inorganic oxide fine particles are uniformly and stably dispersed in the finally obtained resin composition. Accordingly, the resin composition exhibits sufficiently high values in mechanical strength such as transparency, linear expansion coefficient, rigidity, and elastic modulus.

  As described above, according to the present invention, a novel resin composition excellent in mechanical properties such as transparency and rigidity can be provided. Therefore, it can be widely applied as a resin glass that can be applied to various products in place of the conventional inorganic glass.

Details of the present invention, as well as other features and advantages, are described in detail below.
In the present invention, when a desired resin composition is produced, a resin composition intermediate comprising a polycarbonate polymer having a double bond at one end, first represented by [Chemical Formula 1], and / or [Chemical Formula 1] 2], a resin composition intermediate comprising a polycarbonate polymer having double bonds at both ends is prepared. These resin composition intermediates can be produced, for example, by performing a polymerization reaction by a phosgene method in two stages and adding a p-isopropenylphenol solution in the subsequent polymerization reaction.

  FIG. 1 is a process diagram showing, in time series, a production process for producing the above-described resin composition intermediate. First, a BPA alkaline aqueous solution comprising sodium hydroxide (NaOH) aqueous solution and 2,2-bis (4-hydroxypropane (BPA) is prepared, and hydrosulfide, methylene chloride, and phosgene are sequentially added to the polymerization. Carry out the reaction (preliminary polymerization reaction) .After that, add methylene chloride again if necessary, then add p-isopropenylphenol solution, add phosgene again, and add methylene chloride again if necessary. At the same time, triethylamine as a molecular weight regulator is added, and a polymerization reaction is performed for a predetermined time (polymerization reaction in the subsequent stage), thereby obtaining a target resin composition intermediate.

  FIG. 2 is a reaction formula showing a production process of the resin composition intermediate in the manufacturing process described above. FIG. 2 shows a process in which the resin composition intermediate is generated mainly by a subsequent polymerization reaction. The polycarbonate polymer on the left side in FIG. 2 is obtained by the above-described polymerization reaction, and the polycarbonate polymer thus obtained is obtained by adding p-isopropylphenol and phosgene in the subsequent polymerization process. Causes a dehydrochlorination reaction, and as a result, a target resin composition intermediate comprising a polycarbonate polymer having a double bond at the end (having a double bond at one end in the figure) is obtained.

  In the above polycarbonate polymer, whether the double bond is formed only at one end or both ends is determined by the blending ratio of bisphenol A, phosgene, and p-isopropylphenol.

  On the other hand, inorganic oxide fine particles having a phenyl group are prepared. The phenyl group can be added, for example, by subjecting the inorganic oxide fine particles to a silylation treatment.

  The inorganic oxide fine particles are preferably spherical, pearl necklace-shaped or chain-shaped. As a result, uniform dispersion in the finally obtained resin composition is facilitated, and the resin composition stably exists in the resin composition, and the transparency and mechanical strength thereof can be further improved. become able to.

  The primary particle diameter of the inorganic oxide fine particles is preferably 380 nm or less, which is the lower limit value of the visible light wavelength range, more preferably 5 nm to 200 nm, and particularly 5 nm to 100 nm. It is preferable. Thereby, the transparency of the target resin composition can be sufficiently ensured.

  The kind of the inorganic oxide fine particles is not particularly limited, but silica fine particles are preferably used.

  Next, in the present invention, the resin composition intermediate comprising the polycarbonate polymer having a terminal double bond described above is used as a raw material, and the inorganic oxide fine particles are dispersed in the raw material to obtain the resin composition.

  Conventionally, the resin composition intermediate is melted, and the inorganic oxide fine particles are blended and kneaded into the obtained melt, so that the inorganic oxide fine particles are contained in the resin composition as a final target product. When it is attempted to disperse, especially when the amount of the inorganic oxide fine particles exceeds a certain level, the inorganic oxide fine particles aggregate, and as a result, the transparency of the resin composition deteriorates. Therefore, in the present invention, a phenyl group is added to the terminal double bond of the resin composition intermediate, and the phenyl group of the inorganic oxide fine particles and the phenyl group of the resin composition intermediate interact with each other. In this way, uniform dispersion of the inorganic oxide fine particles is performed.

  Specifically, the resin composition intermediate is dissolved in a predetermined solvent, and a methylene chloride is added as necessary to prepare a prepolymerized solution. Then, the prepolymerized solution has a phenyl group. A vinyl monomer and the inorganic oxide fine particles are added to prepare a polymerization solution, and if necessary, a molecular weight adjusting agent is added to perform a polymerization reaction to obtain the resin composition. In addition, the manufacturing process until it obtains the said resin composition from the said resin composition intermediate body is shown in FIG.

  FIG. 4 is a reaction formula showing a reaction process in the manufacturing process shown in FIG. As shown in FIG. 4, a resin composition intermediate comprising a polycarbonate polymer having a terminal double bond reacts with a vinyl monomer having a phenyl group (in the figure, a styrene monomer), and the vinyl is bonded to the terminal double bond. An additional resin composition intermediate consisting of a polyvinyl copolymer having a polycarbonate / phenyl group, to which a monomer (styrene monomer) has been added, is formed.

  In the manufacturing process shown in FIG. 3, in the polymerization reaction process, as a result of the interaction between the phenyl group in the additional resin composition intermediate and the phenyl group of the inorganic oxide fine particles, the inorganic oxide fine particles are aggregated. The above-mentioned resin composition dispersed uniformly can be obtained without doing so. The resin composition is composed of inorganic oxide fine particles having a phenyl group and the additional resin composition intermediate due to the production method described above.

  As the vinyl monomer, a styrene monomer, a phenyl acrylate monomer, an isopropenyl toluene monomer, and the like can be preferably used. In particular, it is preferable to use a styrene monomer in the present invention.

  By using the aforementioned vinyl monomer, the additional resin composition intermediate is composed of a polycarbonate / polystyrene copolymer, a polycarbonate / polyacrylic acid phenyl copolymer, and a polycarbonate / polyisopropenyltoluene copolymer. It will be. Therefore, the resin composition finally obtained also contains these copolymers.

で示され、前記樹脂組成物中間体が両末端に二重結合を有する場合は

で示される。したがって、前記追加の樹脂組成物中間体及び前記樹脂組成物は、前述したような一般式の共重合体を有することになる。 In the case where a styrene monomer is used as the vinyl monomer, the general formula of the copolymer is that the resin composition intermediate comprising the polycarbonate polymer has a double bond only at one end.

When the resin composition intermediate has double bonds at both ends

Indicated by Therefore, the additional resin composition intermediate and the resin composition have the general formula copolymer as described above.

Examples will be described below. Here, polycarbonate is abbreviated as PC.
In each of the following examples and comparative examples, the total light transmittance, the dispersion state in a transmission electron microscope, the bending strength, the bending elastic modulus, and the linear expansion coefficient were evaluated using the following apparatuses.
-Total light transmittance: Measured with a haze meter (MH-65 manufactured by Murakami Color Research Laboratory)-Dispersion state with a transmission electron microscope: observed with H-800 manufactured by Hitachi, Ltd. Observation of dispersion state as white resin ・ Bending strength, bow unity ratio: measured with autograph (Shimadzu DCS-10T) ・ Measurement of linear expansion coefficient: measured with thermomechanical measuring device (TMA120C manufactured by Seiko Denshi Kogyo)

(Example 1)
First, an unsaturated terminal group PC (resin composition intermediate) having a double bond at the terminal was synthesized by the following procedure.
110 g of sodium hydroxide is dissolved in 1.25 liters of water, and this solution is kept at 20 ° C., and 228 g of 2,2-bis (4-hydroxyphenyl) propane (BPA) is added to prepare an aqueous BPA aqueous solution. did. Next, 0.25 g of hydrosulfide was dissolved in this aqueous solution, 750 ml of methylene chloride (MC) was added, and after stirring and mixing, phosgene was blown in and a polymerization reaction was carried out for 30 minutes (preceding polymerization reaction).

  Next, 625 g of MC containing 9.75 g of p-isopropenylphenol was added to the polymerization solution, phosgene was blown in for 30 minutes, and 15 ml of 1% triethylamine in MC was further added, followed by polymerization for about 1 hour (polymerization reaction in the latter stage). . The organic phase of the polymerization solution was neutralized with phosphoric acid, dropped into methanol to precipitate the polymerization composition, filtered and dried to obtain a powdery resin composition intermediate having a double bond at the terminal.

  On the other hand, 20 g of spherical silica surface-treated with a phenyl group was blended and dispersed in 20 g of styrene monomer in a predetermined container to prepare a silica dispersion solution. Also, 100 g of the resin composition intermediate was dissolved in 500 ml of MC to prepare a resin solution. Next, the silica dispersion solution and the resin solution were mixed and stirred, and heated to 120 ° C. Next, 0.11 g of n-dodecyl mercaptan was blended as a molecular weight regulator, polymerized for about 100 minutes, and precipitated with methanol to obtain a silica / PC resin composition. The manufacturing process described above is shown in time series in FIGS. 5 and 6 in association with FIGS.

  The obtained composition was dried and pulverized, and a sheet-like molded product was obtained by hot press molding. Table 1 shows the results of the total light transmittance, the dispersion state with a transmission electron microscope, the bending strength, the bending elastic modulus, and the linear expansion coefficient obtained with this test piece. Moreover, the silica compounding quantity calculated | required from the ash content of the resin composition was about 14 weight%.

(Example 2)
Example 1 except that the amount of p-isopropenylphenol added was 19.5 g and a 2% triethylamine MC solution was used in place of the 1% triethylamine MC solution in the polymerization process after the resin composition intermediate. In the same manner as above, a resin composition intermediate was produced to obtain a silica / PC resin composition.

  The obtained composition was dried and pulverized, and a sheet-like molded product was obtained by hot press molding. Table 1 shows the results of the total light transmittance, the dispersion state with a transmission electron microscope, the bending strength, the bending elastic modulus, and the linear expansion coefficient obtained with this test piece. Moreover, the silica compounding quantity calculated | required from the ash content of the resin composition was about 14 weight%.

(Example 3)
A resin composition intermediate was produced in the same manner as in Example 1 except that the amount of spherical silica was changed from 20 g to 30 g, to obtain a silica / PC resin composition. The obtained composition was dried and pulverized, and a sheet-like molded product was obtained by hot press molding. Table 1 shows the results of the total light transmittance, the dispersion state with a transmission electron microscope, the bending strength, the bending elastic modulus, and the linear expansion coefficient obtained with this test piece. Moreover, the silica compounding quantity calculated | required from the ash content of the resin composition was about 20 weight%.

Example 4
A resin composition intermediate was produced in the same manner as in Example 1 except that the amount of spherical silica was changed from 20 g to 40 g, to obtain a silica / PC resin composition. The obtained composition was dried and pulverized, and a sheet-like molded product was obtained by hot press molding. Table 1 shows the results of the total light transmittance, the dispersion state with a transmission electron microscope, the bending strength, the bending elastic modulus, and the linear expansion coefficient obtained with this test piece. Moreover, the silica compounding quantity calculated | required from the ash content of the resin composition was about 25 weight%.

(Example 5)
A resin composition intermediate was produced in the same manner as in Example 1 except that chain silica was used instead of spherical silica to obtain a silica / PC resin composition. The obtained composition was dried and pulverized, and a sheet-like molded product was obtained by hot press molding. Table 1 shows the results of the total light transmittance, the dispersion state with a transmission electron microscope, the bending strength, the bending elastic modulus, and the linear expansion coefficient obtained with this test piece. Moreover, the silica compounding quantity calculated | required from the ash content of the resin composition was about 14 weight%.

(Example 6)
In preparing the silica dispersion, a resin composition intermediate was produced in the same manner as in Example 1 except that 28.5 g of phenyl acrylate monomer was used instead of 20 g of styrene monomer, and the silica / PC resin composition was prepared. Got. The obtained composition was dried and pulverized, and a sheet-like molded product was obtained by hot press molding. Table 1 shows the results of the total light transmittance, the dispersion state with a transmission electron microscope, the bending strength, the bending elastic modulus, and the linear expansion coefficient obtained with this test piece. Moreover, the silica compounding quantity calculated | required from the ash content of the resin composition was about 14 weight%.

(Example 7)
In preparing the silica dispersion, a resin composition intermediate was produced in the same manner as in Example 1 except that 27.3 g of isopropenyltoluene monomer was used instead of 20 g of styrene monomer, and the silica / PC resin composition was prepared. Got. The obtained composition was dried and pulverized, and a sheet-like molded product was obtained by hot press molding. Table 1 shows the results of the total light transmittance, the dispersion state with a transmission electron microscope, the bending strength, the bending elastic modulus, and the linear expansion coefficient obtained with this test piece. Moreover, the silica compounding quantity calculated | required from the ash content of the resin composition was about 14 weight%.

(Comparative Example 1)
120 g of PC (Iupilon S2000 manufactured by Mitsubishi Engineering Plastics) was dissolved in 240 g of a methylene chloride solution, and 20 g of spherical silica surface-treated with a phenyl group was dispersed in advance to prepare a PC / silica mixed solution. The mixed solution was dropped into methanol to precipitate the polymerization composition, filtered and dried to obtain a powder.

  The obtained composition was dried and pulverized, and a sheet-like formed crystal was obtained by hot press molding. Table 1 shows the results of the total light transmittance, the dispersion state with a transmission electron microscope, the bending strength, the bending elastic modulus, and the linear expansion coefficient obtained with this test piece. Moreover, the silica compounding quantity calculated | required from the ash content of the resin composition was about 14 weight%.

(Comparative Example 2)
120 g of PC (Iupilon S2000 manufactured by Mitsubishi Engineering Plastics) was dissolved in 240 g of a methylene chloride solution, and 20 g of spherical silica surface-treated with a methyl group was dispersed in advance to prepare a PC / silica mixed solution. The mixed solution was dropped into methanol to precipitate the polymerization composition, filtered and dried to obtain a powder.

  The obtained composition was dried and pulverized, and a sheet-like formed crystal was obtained by hot press molding. Table 1 shows the results of the total light transmittance, the dispersion state with a transmission electron microscope, the bending strength, the bending elastic modulus, and the linear expansion coefficient obtained with this test piece. Moreover, the silica compounding quantity calculated | required from the ash content of the resin composition was about 14 weight%.

  As is apparent from the above examples and comparative examples, the resin compositions of the present invention shown in the examples were excellent in transparency, and it was confirmed that the bending strength and bending elastic modulus were improved and the thermal expansion coefficient was lowered. In addition, the resin composition different from the present invention shown in the comparative example does not ensure transparency due to the aggregation of silica, and further has low bending strength and bending elastic modulus, high thermal expansion coefficient, and various properties required for the resin composition. It was found that almost all of the resin compositions were inferior to the resin composition of the present invention.

  As described above, the present invention has been described in detail based on the embodiments of the present invention with specific examples. However, the present invention is not limited to the above contents, and all modifications and changes are made without departing from the scope of the present invention. It can be changed.

  For example, the resin composition of the present invention contains an antioxidant and a heat stabilizer (including hindered phenols, hydroquinones, thioethers, phosphites, and their substitution products and combinations thereof), ultraviolet absorption, if necessary. Agents (for example, resorcinol, salicylate, benzotriazole, benzophenone, etc.), lubricants, mold release agents (for example, silicon resin, montanic acid and salts thereof, stearic acid and salts thereof, stearyl alcohol, stearylamide, etc.), dyes (for example, nitrocin) , Coloring agents containing facials (for example, cadmium sulfide, phthalocyanine, etc.), additive additives (for example, silicone oil), crystal nucleating agents (for example, talc, kaolin, etc.), etc. .

  The resin composition of the present invention can be molded into a desired shape and applied to any application. In particular, from the viewpoint of utilizing transparency, high rigidity, and low linear expansion, it can be applied to molded articles such as parts around windows for automobiles as resinous glass replacing inorganic glass.

It is process drawing which showed the manufacturing process at the time of manufacturing the resin composition intermediate body of this invention in time series. 2 is a reaction formula showing a production process of the resin composition intermediate in the manufacturing process shown in FIG. It is process drawing which showed the manufacturing process until it obtains the resin composition of this invention from the resin composition intermediate body of this invention. 4 is a reaction formula showing a reaction process in the manufacturing process shown in FIG. 3. It is process drawing which showed the manufacturing process at the time of manufacturing the resin composition intermediate body in the Example of this invention in time series. It is process drawing which showed the manufacturing process until it obtains a resin composition from the resin composition intermediate body in the Example of this invention.

Claims (16)

  A resin composition comprising inorganic oxide fine particles having a phenyl group and a polyvinyl copolymer having a polycarbonate / phenyl group.   The polyvinyl copolymer having a polycarbonate / phenyl group is at least one selected from a polycarbonate / polystyrene copolymer, a polycarbonate / polyacrylic acid phenyl copolymer, and a polycarbonate / polyisopropenyltoluene copolymer. The resin composition according to claim 1. The polyvinyl copolymer having the polycarbonate / phenyl group is

as well as

The resin composition according to claim 2, wherein the resin composition is at least one polycarbonate / polystyrene copolymer represented by the formula:   The resin composition according to claim 1, wherein the inorganic oxide fine particles are silica fine particles.   The resin composition according to any one of claims 1 to 5, wherein the inorganic oxide fine particles have a spherical shape, a pearl necklace shape, or a chain shape.   The resin composition according to any one of claims 1 to 5, wherein the inorganic oxide fine particles have a primary particle diameter of 380 nm or less, which is a lower limit value of a visible light wavelength range.   The resin composition according to claim 6, wherein the primary particle diameter of the inorganic oxide fine particles is 5 nm to 200 nm.   The resin composition according to claim 7, wherein the primary particle diameter of the inorganic oxide fine particles is 5 nm to 100 nm.   A resin composition intermediate comprising the polycarbonate / polystyrene copolymer represented by [Chemical Formula 1].   A resin composition intermediate comprising the polycarbonate / polystyrene copolymer represented by [Chemical Formula 2].

A resin composition intermediate comprising a polycarbonate polymer having a double bond at one end, as shown in

A resin composition intermediate characterized by comprising a polycarbonate polymer having double bonds at both ends, as shown in FIG. It is a manufacturing method of the resin composition as described in any one of Claims 1-8,
A resin composition intermediate comprising a polycarbonate polymer having a double bond at one end represented by [Chemical Formula 3] and a resin composition comprising a polycarbonate polymer having a double bond at both ends represented by [Chemical Formula 4] Dissolving at least one of the product intermediates in a predetermined solvent to prepare a prepolymerized solution;
A step of adding inorganic oxide fine particles having a phenyl group and a vinyl monomer having a phenyl group to prepare a polymerization solution in the preliminary polymerization solution;
A resin composition characterized by causing a polymerization reaction by heating the polymerization solution to a predetermined temperature, and containing the inorganic oxide fine particles having the phenyl group and a polyvinyl copolymer having a polycarbonate / phenyl group. Manufacturing a product,
A process for producing a resin composition, comprising:   The method for producing a resin composition according to claim 13, wherein the vinyl monomer is at least one selected from a styrene monomer, a phenyl acrylate monomer, and an isopropenyl toluene monomer.   The method for producing a resin composition according to claim 13 or 14, wherein the phenyl group is added to the inorganic oxide fine particles by subjecting the inorganic oxide fine particles to a surface treatment with a silylating agent. A method for producing a resin composition intermediate according to claim 11 or 12,
A process for producing a resin composition intermediate, wherein a polymerization reaction is carried out in two stages in a polymerization reaction by a phosgene method, and a p-isopropenylphenol solution is added in a subsequent polymerization reaction.

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