JP2005138441A - Method for accelerating crystallization of polyamide resin and polyamide formed product excellent in crystallinity - Google Patents
Method for accelerating crystallization of polyamide resin and polyamide formed product excellent in crystallinity Download PDFInfo
- Publication number
- JP2005138441A JP2005138441A JP2003377656A JP2003377656A JP2005138441A JP 2005138441 A JP2005138441 A JP 2005138441A JP 2003377656 A JP2003377656 A JP 2003377656A JP 2003377656 A JP2003377656 A JP 2003377656A JP 2005138441 A JP2005138441 A JP 2005138441A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- resin
- butyl
- polyamide resin
- crystallization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002425 crystallisation Methods 0.000 title claims abstract description 21
- 230000008025 crystallization Effects 0.000 title claims abstract description 21
- 239000004952 Polyamide Substances 0.000 title claims abstract description 15
- 229920002647 polyamide Polymers 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 title claims abstract description 12
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 239000004953 Aliphatic polyamide Substances 0.000 claims abstract description 13
- 229920003231 aliphatic polyamide Polymers 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 230000001737 promoting effect Effects 0.000 claims description 7
- 230000001133 acceleration Effects 0.000 abstract 1
- -1 polyethylene terephthalate Polymers 0.000 description 25
- 239000003484 crystal nucleating agent Substances 0.000 description 14
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- 229920002292 Nylon 6 Polymers 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000007983 Tris buffer Substances 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 239000005995 Aluminium silicate Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 4
- 235000012211 aluminium silicate Nutrition 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- SWRGUMCEJHQWEE-UHFFFAOYSA-N ethanedihydrazide Chemical compound NNC(=O)C(=O)NN SWRGUMCEJHQWEE-UHFFFAOYSA-N 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000006078 metal deactivator Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 229930003658 monoterpene Natural products 0.000 description 2
- 150000002773 monoterpene derivatives Chemical class 0.000 description 2
- 235000002577 monoterpenes Nutrition 0.000 description 2
- UKJARPDLRWBRAX-UHFFFAOYSA-N n,n'-bis(2,2,6,6-tetramethylpiperidin-4-yl)hexane-1,6-diamine Chemical compound C1C(C)(C)NC(C)(C)CC1NCCCCCCNC1CC(C)(C)NC(C)(C)C1 UKJARPDLRWBRAX-UHFFFAOYSA-N 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 150000003568 thioethers Chemical class 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QGMCRJZYVLHHHB-UHFFFAOYSA-N (1,2,2,6,6-pentamethylpiperidin-4-yl) octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 QGMCRJZYVLHHHB-UHFFFAOYSA-N 0.000 description 1
- YEYCMBWKTZNPDH-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) benzoate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=CC=C1 YEYCMBWKTZNPDH-UHFFFAOYSA-N 0.000 description 1
- JMUOXOJMXILBTE-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 JMUOXOJMXILBTE-UHFFFAOYSA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 description 1
- KKYDYRWEUFJLER-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F KKYDYRWEUFJLER-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 1
- PFEFOYRSMXVNEL-UHFFFAOYSA-N 2,4,6-tritert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 PFEFOYRSMXVNEL-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- DXCHWXWXYPEZKM-UHFFFAOYSA-N 2,4-ditert-butyl-6-[1-(3,5-ditert-butyl-2-hydroxyphenyl)ethyl]phenol Chemical compound C=1C(C(C)(C)C)=CC(C(C)(C)C)=C(O)C=1C(C)C1=CC(C(C)(C)C)=CC(C(C)(C)C)=C1O DXCHWXWXYPEZKM-UHFFFAOYSA-N 0.000 description 1
- AWHZSQAAXPNTFI-UHFFFAOYSA-N 2-(2,4-ditert-butylphenyl)-1,3,5-triazine Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1C1=NC=NC=N1 AWHZSQAAXPNTFI-UHFFFAOYSA-N 0.000 description 1
- JRRSZPBVIHXNBS-UHFFFAOYSA-N 2-(2H-benzotriazol-4-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)c1ccc(O)c(c1)-c1cccc2[nH]nnc12 JRRSZPBVIHXNBS-UHFFFAOYSA-N 0.000 description 1
- UUINYPIVWRZHAG-UHFFFAOYSA-N 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-methoxyphenol Chemical compound OC1=CC(OC)=CC=C1C1=NC(C=2C=CC=CC=2)=NC(C=2C=CC=CC=2)=N1 UUINYPIVWRZHAG-UHFFFAOYSA-N 0.000 description 1
- FJGQBLRYBUAASW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)phenol Chemical class OC1=CC=CC=C1N1N=C2C=CC=CC2=N1 FJGQBLRYBUAASW-UHFFFAOYSA-N 0.000 description 1
- LVZZNJAPRYIRMT-UHFFFAOYSA-N 2-[1-oxo-1-(2,2,6,6-tetramethylpiperidin-4-yl)oxy-3-(2,2,6,6-tetramethylpiperidin-4-yl)oxycarbonylhexadecan-3-yl]-2-tridecylbutanedioic acid Chemical compound CCCCCCCCCCCCCC(CC(O)=O)(C(CCCCCCCCCCCCC)(CC(OC1CC(C)(C)NC(C)(C)C1)=O)C(OC1CC(C)(C)NC(C)(C)C1)=O)C(O)=O LVZZNJAPRYIRMT-UHFFFAOYSA-N 0.000 description 1
- ZSMMOCNTIRCAAL-UHFFFAOYSA-N 2-[2-[2-[2-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 2-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound C=1C(C)=C(O)C(C(C)(C)C)=CC=1C(C)C(=O)OCCOCCOCCOC(=O)C(C)C1=CC(C)=C(O)C(C(C)(C)C)=C1 ZSMMOCNTIRCAAL-UHFFFAOYSA-N 0.000 description 1
- KLIZOTJVECGYSJ-UHFFFAOYSA-N 2-[2-[3-(benzotriazol-2-yl)-5-(2-phenylpropan-2-yl)phenyl]propan-2-yl]phenol Chemical compound C=1C(N2N=C3C=CC=CC3=N2)=CC(C(C)(C)C=2C(=CC=CC=2)O)=CC=1C(C)(C)C1=CC=CC=C1 KLIZOTJVECGYSJ-UHFFFAOYSA-N 0.000 description 1
- LUNZMFXLUXABFZ-UHFFFAOYSA-N 2-[4,6-bis(2,4-ditert-butylphenyl)-1,3,5-triazin-2-yl]-5-octoxyphenol Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C1=NC(C=2C(=CC(=CC=2)C(C)(C)C)C(C)(C)C)=NC(C=2C(=CC(=CC=2)C(C)(C)C)C(C)(C)C)=N1 LUNZMFXLUXABFZ-UHFFFAOYSA-N 0.000 description 1
- UORSDGBOJHYJLV-UHFFFAOYSA-N 2-hydroxy-n'-(2-hydroxybenzoyl)benzohydrazide Chemical compound OC1=CC=CC=C1C(=O)NNC(=O)C1=CC=CC=C1O UORSDGBOJHYJLV-UHFFFAOYSA-N 0.000 description 1
- MZZYGYNZAOVRTG-UHFFFAOYSA-N 2-hydroxy-n-(1h-1,2,4-triazol-5-yl)benzamide Chemical compound OC1=CC=CC=C1C(=O)NC1=NC=NN1 MZZYGYNZAOVRTG-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- OVFNLCOUYWXMMV-UHFFFAOYSA-N 2-tert-butyl-4-[14-(5-tert-butyl-4-hydroxy-2-methylphenyl)-17,17-di(tridecyl)triacontan-14-yl]-5-methylphenol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCCCCCCCCCCCC)(CCC(CCCCCCCCCCCCC)(CCCCCCCCCCCCC)CCCCCCCCCCCCC)C1=CC(C(C)(C)C)=C(O)C=C1C OVFNLCOUYWXMMV-UHFFFAOYSA-N 0.000 description 1
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- NMAGCVWUISAHAP-UHFFFAOYSA-N 3,5-ditert-butyl-2-(2,4-ditert-butylphenyl)-4-hydroxybenzoic acid Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1C1=C(C(O)=O)C=C(C(C)(C)C)C(O)=C1C(C)(C)C NMAGCVWUISAHAP-UHFFFAOYSA-N 0.000 description 1
- YEXOWHQZWLCHHD-UHFFFAOYSA-N 3,5-ditert-butyl-4-hydroxybenzoic acid Chemical compound CC(C)(C)C1=CC(C(O)=O)=CC(C(C)(C)C)=C1O YEXOWHQZWLCHHD-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- YGMBONASMVDXEN-UHFFFAOYSA-N 3-(benzotriazol-2-yl)-5-tert-butyl-4-hydroxybenzoic acid Chemical compound CC(C)(C)C1=CC(C(O)=O)=CC(N2N=C3C=CC=CC3=N2)=C1O YGMBONASMVDXEN-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- HPFWYRKGZUGGPB-UHFFFAOYSA-N 4,6-dichloro-n-(2,4,4-trimethylpentan-2-yl)-1,3,5-triazin-2-amine Chemical compound CC(C)(C)CC(C)(C)NC1=NC(Cl)=NC(Cl)=N1 HPFWYRKGZUGGPB-UHFFFAOYSA-N 0.000 description 1
- UQAMDAUJTXFNAD-UHFFFAOYSA-N 4-(4,6-dichloro-1,3,5-triazin-2-yl)morpholine Chemical compound ClC1=NC(Cl)=NC(N2CCOCC2)=N1 UQAMDAUJTXFNAD-UHFFFAOYSA-N 0.000 description 1
- STEYNUVPFMIUOY-UHFFFAOYSA-N 4-Hydroxy-1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CC(O)CC(C)(C)N1CCO STEYNUVPFMIUOY-UHFFFAOYSA-N 0.000 description 1
- OZOAMTISPPUGSQ-UHFFFAOYSA-N 4-[14,16-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)-15,15,16,17-tetra(tridecyl)triacontan-14-yl]-2-tert-butyl-5-methylphenol phosphorous acid Chemical compound OP(O)O.OP(O)O.OP(O)O.C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCCCCCCCCCCCC)(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C(CCCCCCCCCCCCC)(CCCCCCCCCCCCC)C(CCCCCCCCCCCCC)(C(CCCCCCCCCCCCC)CCCCCCCCCCCCC)C1=CC(C(C)(C)C)=C(O)C=C1C OZOAMTISPPUGSQ-UHFFFAOYSA-N 0.000 description 1
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- ZGUBOEMAXMRLON-UHFFFAOYSA-N 4-butan-2-yl-2-[1-(5-butan-2-yl-3-tert-butyl-2-hydroxyphenyl)ethyl]-6-tert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)CC)=CC(C(C)C=2C(=C(C=C(C=2)C(C)CC)C(C)(C)C)O)=C1O ZGUBOEMAXMRLON-UHFFFAOYSA-N 0.000 description 1
- JJHKARPEMHIIQC-UHFFFAOYSA-N 4-octadecoxy-2,6-diphenylphenol Chemical compound C=1C(OCCCCCCCCCCCCCCCCCC)=CC(C=2C=CC=CC=2)=C(O)C=1C1=CC=CC=C1 JJHKARPEMHIIQC-UHFFFAOYSA-N 0.000 description 1
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 1
- QCBBOXGEDQONFF-UHFFFAOYSA-N 5-oxo-5-tridecoxypentane-1,2,3-tricarboxylic acid Chemical compound CCCCCCCCCCCCCOC(=O)CC(C(O)=O)C(C(O)=O)CC(O)=O QCBBOXGEDQONFF-UHFFFAOYSA-N 0.000 description 1
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- GQKWCESOCWEOQH-UHFFFAOYSA-N 6-[11-amino-6,11-bis[4,6-bis[butyl-(2,2,6,6-tetramethylpiperidin-4-yl)amino]-1,3,5-triazin-2-yl]undecyl]-2-n,4-n-dibutyl-2-n,4-n-bis(2,2,6,6-tetramethylpiperidin-4-yl)-1,3,5-triazine-2,4-diamine Chemical compound N=1C(CCCCCC(CCCCC(N)C=2N=C(N=C(N=2)N(CCCC)C2CC(C)(C)NC(C)(C)C2)N(CCCC)C2CC(C)(C)NC(C)(C)C2)C=2N=C(N=C(N=2)N(CCCC)C2CC(C)(C)NC(C)(C)C2)N(CCCC)C2CC(C)(C)NC(C)(C)C2)=NC(N(CCCC)C2CC(C)(C)NC(C)(C)C2)=NC=1N(CCCC)C1CC(C)(C)NC(C)(C)C1 GQKWCESOCWEOQH-UHFFFAOYSA-N 0.000 description 1
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- ATYSJAJVVFHRKR-UHFFFAOYSA-L magnesium octacosanoate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCCCCCCCC([O-])=O ATYSJAJVVFHRKR-UHFFFAOYSA-L 0.000 description 1
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- 239000012299 nitrogen atmosphere Substances 0.000 description 1
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- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 1
- AXRSHKZFNKUGQB-UHFFFAOYSA-N octyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC)OC1=CC=CC=C1 AXRSHKZFNKUGQB-UHFFFAOYSA-N 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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- BXFXQPLYASVMSV-UHFFFAOYSA-M potassium;octacosanoate Chemical compound [K+].CCCCCCCCCCCCCCCCCCCCCCCCCCCC([O-])=O BXFXQPLYASVMSV-UHFFFAOYSA-M 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
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- GDESWOTWNNGOMW-UHFFFAOYSA-N resorcinol monobenzoate Chemical compound OC1=CC=CC(OC(=O)C=2C=CC=CC=2)=C1 GDESWOTWNNGOMW-UHFFFAOYSA-N 0.000 description 1
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- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- YKIBJOMJPMLJTB-UHFFFAOYSA-M sodium;octacosanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCCCCCCCCCCCC([O-])=O YKIBJOMJPMLJTB-UHFFFAOYSA-M 0.000 description 1
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- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- WUPCFMITFBVJMS-UHFFFAOYSA-N tetrakis(1,2,2,6,6-pentamethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)C(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)CC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 WUPCFMITFBVJMS-UHFFFAOYSA-N 0.000 description 1
- NZNAAUDJKMURFU-UHFFFAOYSA-N tetrakis(2,2,6,6-tetramethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)NC(C)(C)C1)C(C(=O)OC1CC(C)(C)NC(C)(C)C1)CC(=O)OC1CC(C)(C)NC(C)(C)C1 NZNAAUDJKMURFU-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本発明は、ポリアミド樹脂を特定の表面自由エネルギー(γ)を有する基材と接触させることによりポリアミド樹脂の結晶化を促進する方法に関する。 The present invention relates to a method for promoting crystallization of a polyamide resin by contacting the polyamide resin with a substrate having a specific surface free energy (γ).
ナイロン−6やナイロン−66などのポリアミドは、優れた加工性、耐薬品性、電気的性質、機械的性質などを有しているため、射出成形品、中空成形品、フィルム、シート、繊維などに加工され各種用途に用いられている。しかし、ポリアミドは結晶化速度が遅いため結晶化度が低く、加工サイクルが長くなることや、剛性や耐熱性を向上させるために、タルクなどの結晶核剤を添加することが行われている。 Polyamides such as nylon-6 and nylon-66 have excellent processability, chemical resistance, electrical properties, mechanical properties, etc., so injection molded products, hollow molded products, films, sheets, fibers, etc. And is used for various purposes. However, polyamide has a low crystallization rate and thus has a low crystallinity and a long processing cycle, and a crystal nucleating agent such as talc is added to improve rigidity and heat resistance.
例えば、ポリアミドに無機結晶核剤と脂肪酸金属塩を併用すること(特許文献1参照)、ロジン類の金属塩を結晶核剤としてポリアミドに配合すること(特許文献2参照)、繊維状ゾノトライトをポリアミドに配合すること(特許文献3及び4参照)、モノテルペンジフェノール類又はモノテルペンジフェノール類の金属塩をポリアミドの結晶核剤として用いること(特許文献5参照)、ガラス繊維で強化された脂肪族ポリアミドに半芳香族ポリアミドを配合すること(特許文献6参照)が提案されている。
しかし、タルクなどの結晶核剤を添加する方法では、十分な結晶化速度や結晶化度が得られないことや、樹脂表面と樹脂内部での結晶化度の違いから十分な樹脂強度を有するポリアミド樹脂が得られない問題があった。 However, a method of adding a crystal nucleating agent such as talc does not provide a sufficient crystallization speed and crystallinity, and a polyamide having sufficient resin strength due to the difference in crystallinity between the resin surface and the resin interior. There was a problem that the resin could not be obtained.
本発明者らは、上記問題を解決すべく鋭意検討を重ねた結果、ポリアミドの加工時に表面自由エネルギーが42〜48mN/mである基材と接触させることで樹脂表面の結晶化が促進され、結晶化度に優れたポリアミドをサイクル性よく成形できることを見出し、本発明に到達した。 As a result of intensive studies to solve the above problems, the present inventors have promoted the crystallization of the resin surface by bringing it into contact with a substrate having a surface free energy of 42 to 48 mN / m during processing of the polyamide, The present inventors have found that a polyamide having an excellent degree of crystallinity can be molded with good cycleability, and have reached the present invention.
即ち、本発明は、脂肪族ポリアミド樹脂を表面自由エネルギーが42〜48mN/mである基材と接触させることを特徴とするポリアミド樹脂の結晶化促進方法を提供するものである。 That is, the present invention provides a method for accelerating crystallization of a polyamide resin, wherein the aliphatic polyamide resin is brought into contact with a substrate having a surface free energy of 42 to 48 mN / m.
本発明のポリアミド樹脂の結晶化促進方法によれば、ポリアミド樹脂の加工時にポリアミド樹脂の結晶化を樹脂表面から促進できる。また、結晶化が促進されることで加工サイクルが向上し、結晶性に優れたポリアミド成形品を提供できる。 According to the method for promoting crystallization of a polyamide resin of the present invention, crystallization of the polyamide resin can be promoted from the resin surface during the processing of the polyamide resin. Further, by promoting crystallization, the processing cycle is improved and a polyamide molded product having excellent crystallinity can be provided.
以下、本発明のポリアミド樹脂の結晶化促進方法について詳しく説明する。
本発明に用いられる脂肪族ポリアミド樹脂としては、ラクタムあるいはアミノカルボン酸の重合又はジアミンとカルボン酸の重縮合によって得られるホモポリアミド及びコポリアミド、そしてこれらの混合物が挙げられる。具体的には、例えばナイロン6、ナイロン66、ナイロン46、ナイロン610、ナイロン612、ナイロン11、ナイロン12などのホモポリマー、これらの2成分以上を含むコポリマーあるいは混合物が挙げられる。
Hereinafter, the method for promoting crystallization of the polyamide resin of the present invention will be described in detail.
Examples of the aliphatic polyamide resin used in the present invention include homopolyamide and copolyamide obtained by polymerization of lactam or aminocarboxylic acid or polycondensation of diamine and carboxylic acid, and mixtures thereof. Specific examples include homopolymers such as nylon 6, nylon 66, nylon 46, nylon 610, nylon 612, nylon 11 and nylon 12, and copolymers or mixtures containing these two or more components.
本発明に用いられる基材は、表面自由エネルギーが42〜48mN/mであれば特に制限されず、無機物でも有機物でもよい。
上記脂肪族ポリアミド樹脂と上記基材との接触は、例えば、上記脂肪族ポリアミド樹脂を成形加工する成形加工機の樹脂成形加工面(例えば金型やダイなどの表面)を、上記の表面自由エネルギーが42〜48mN/mである基材で形成することにより、あるいは、上記樹脂成形加工面を、表面自由エネルギーが42〜48mN/mとなるように表面処理することにより、脂肪族ポリアミド樹脂の加工時に脂肪族ポリアミド樹脂と上記基材とを接触させることができる。この場合、脂肪族ポリアミド樹脂の加工時に脂肪族ポリアミド樹脂の結晶化を樹脂表面から促進できる。
The substrate used in the present invention is not particularly limited as long as the surface free energy is 42 to 48 mN / m, and may be inorganic or organic.
The contact between the aliphatic polyamide resin and the base material may be achieved, for example, by using a resin molding surface (for example, a surface of a mold or a die) of a molding machine that molds the aliphatic polyamide resin, the surface free energy. Of the aliphatic polyamide resin by forming with a base material having a surface roughness of 42 to 48 mN / m, or by treating the surface of the resin molding so that the surface free energy is 42 to 48 mN / m. Sometimes the aliphatic polyamide resin and the substrate can be contacted. In this case, crystallization of the aliphatic polyamide resin can be promoted from the resin surface during the processing of the aliphatic polyamide resin.
上記成形加工機としては、特に制限されず、押出成形機、射出成形機、ブロー成形機、プレス成形機、ロール成形機などが挙げられる。 The molding machine is not particularly limited, and examples thereof include an extrusion molding machine, an injection molding machine, a blow molding machine, a press molding machine, and a roll molding machine.
本発明で用いられる脂肪族ポリアミド樹脂は、必要に応じて、無機系結晶核剤、有機系結晶核剤、離型剤、フェノール系酸化防止剤、リン系酸化防止剤、チオエーテル系酸化防止剤、紫外線吸収剤、ヒンダードアミン系光安定剤、難燃剤、重金属不活性化剤、ハイドロタルサイト、帯電防止剤、金属石鹸、顔料、染料などを添加して安定化することが好ましい。 The aliphatic polyamide resin used in the present invention includes an inorganic crystal nucleating agent, an organic crystal nucleating agent, a mold release agent, a phenolic antioxidant, a phosphorus antioxidant, a thioether antioxidant, if necessary. It is preferable to stabilize by adding an ultraviolet absorber, hindered amine light stabilizer, flame retardant, heavy metal deactivator, hydrotalcite, antistatic agent, metal soap, pigment, dye or the like.
上記無機系結晶核剤としては、タルク、ワラストナイト、炭酸カルシウム、カオリン、焼成カオリン、シリカ、ゼオライト、ボロンナイトライド、アルミナ、マグネシア、グラファイト、マイカなどが挙げられる。これらの中でも、タルク、カオリン、焼成カオリンが好適に使用できる。これらの結晶核剤は、アミノシランカップリング剤、エポキシシランカップリング剤などにより表面処理されたものを用いても良い。該無機系結晶核剤は、通常0.5〜10μmの範囲内の平均粒径のものが選ばれる。 Examples of the inorganic crystal nucleating agent include talc, wollastonite, calcium carbonate, kaolin, calcined kaolin, silica, zeolite, boron nitride, alumina, magnesia, graphite, mica and the like. Among these, talc, kaolin, and calcined kaolin can be preferably used. These crystal nucleating agents may be those that have been surface-treated with an aminosilane coupling agent, an epoxysilane coupling agent, or the like. As the inorganic crystal nucleating agent, those having an average particle diameter in the range of 0.5 to 10 μm are usually selected.
上記有機系結晶核剤としては、ポリアミド、ポリエチレンテレフタレート、ポリエチレン、ポリプロピレン、ロジン酸金属塩、リン酸エステル金属塩などが挙げられる。上記の無機系結晶核剤又は有機系結晶核剤の配合量は、脂肪族ポリアミド樹脂100重量部に対して、0.01〜3重量部の範囲で用いることが好ましい。これらの結晶核剤の配合量が0.01重量部未満であると、冷却固化時間の短縮がはかれないため射出成形時のハイサイクル性が低下し、量産性が低下することがある。また、これらの結晶核剤の配合量が3重量部を超えると、低温時の耐折れ曲げ性が低下する。 Examples of the organic crystal nucleating agent include polyamide, polyethylene terephthalate, polyethylene, polypropylene, rosin acid metal salt, and phosphate ester metal salt. The amount of the inorganic crystal nucleating agent or the organic crystal nucleating agent is preferably in the range of 0.01 to 3 parts by weight with respect to 100 parts by weight of the aliphatic polyamide resin. When the blending amount of these crystal nucleating agents is less than 0.01 parts by weight, the cooling and solidifying time cannot be shortened, so that the high cycle property at the time of injection molding is lowered and mass productivity may be lowered. Moreover, when the compounding quantity of these crystal nucleating agents exceeds 3 weight part, the bending-proof property at the time of low temperature will fall.
上記離型剤としては、例えば、モンタン酸ナトリウム、モンタン酸カリウム、モンタン酸カルシウム、モンタン酸マグネシウムなどが挙げられる。 Examples of the mold release agent include sodium montanate, potassium montanate, calcium montanate, and magnesium montanate.
上記フェノール系酸化防止剤としては、例えば、2,6−ジ第三ブチル−p−クレゾール、2,6−ジフェニル−4−オクタデシロキシフェノール、ジステアリル(3,5−ジ第三ブチル−4−ヒドロキシベンジル)ホスホネート、1,6−ヘキサメチレンビス〔(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオン酸アミド〕、4,4’−チオビス(6−第三ブチル−m−クレゾール)、2,2’−メチレンビス(4−メチル−6−第三ブチルフェノール)、2,2’−メチレンビス(4−エチル−6−第三ブチルフェノール)、4,4’−ブチリデンビス(6−第三ブチル−m−クレゾール)、2,2’−エチリデンビス(4,6―ジ第三ブチルフェノール)、2,2’−エチリデンビス(4−第二ブチル−6−第三ブチルフェノール)、1,1,3−トリス(2−メチル−4−ヒドロキシ−5−第三ブチルフェニル)ブタン、1,3,5−トリス(2,6−ジメチル−3−ヒドロキシ−4−第三ブチルベンジル)イソシアヌレート、1,3,5−トリス(3,5−ジ第三ブチル−4−ヒドロキシベンジル)イソシアヌレート、1,3,5−トリス(3,5−ジ第三ブチル−4−ヒドロキシベンジル)−2,4,6−トリメチルベンゼン、2−第三ブチル−4−メチル−6−(2−アクリロイルオキシ−3−第三ブチル−5−メチルベンジル)フェノール、ステアリル(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオネート、テトラキス〔3−(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオン酸メチル〕メタン、チオジエチレングリコールビス〔(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオネート〕、1,6−ヘキサメチレンビス〔(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオネート〕、ビス〔3,3−ビス(4−ヒドロキシ−3−第三ブチルフェニル)ブチリックアシッド〕グリコールエステル、ビス〔2−第三ブチル−4−メチル−6−(2−ヒドロキシ−3−第三ブチル−5−メチルベンジル)フェニル〕テレフタレート、1,3,5−トリス〔(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオニルオキシエチル〕イソシアヌレート、3,9−ビス〔1,1−ジメチル−2−{(3−第三ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオニルオキシ}エチル〕−2,4,8,10−テトラオキサスピロ〔5,5〕ウンデカン、トリエチレングリコールビス〔(3−第三ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオネート〕などが挙げられ、脂肪族ポリアミド樹脂100重量部に対して、好ましくは0.001〜10重量部、より好ましくは0.05〜5重量部が用いられる。 Examples of the phenolic antioxidant include 2,6-ditert-butyl-p-cresol, 2,6-diphenyl-4-octadecyloxyphenol, distearyl (3,5-ditert-butyl-4). -Hydroxybenzyl) phosphonate, 1,6-hexamethylenebis [(3,5-ditert-butyl-4-hydroxyphenyl) propionic acid amide], 4,4'-thiobis (6-tert-butyl-m-cresol ), 2,2′-methylenebis (4-methyl-6-tert-butylphenol), 2,2′-methylenebis (4-ethyl-6-tert-butylphenol), 4,4′-butylidenebis (6-tert-butyl) -M-cresol), 2,2'-ethylidenebis (4,6-ditert-butylphenol), 2,2'-ethylidenebis (4-secondarybutyl-6-tert-butylphenol) Nol), 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3,5-tris (2,6-dimethyl-3-hydroxy-4-tertiary) Butylbenzyl) isocyanurate, 1,3,5-tris (3,5-ditert-butyl-4-hydroxybenzyl) isocyanurate, 1,3,5-tris (3,5-ditert-butyl-4- Hydroxybenzyl) -2,4,6-trimethylbenzene, 2-tert-butyl-4-methyl-6- (2-acryloyloxy-3-tert-butyl-5-methylbenzyl) phenol, stearyl (3,5- Ditertiarybutyl-4-hydroxyphenyl) propionate, tetrakis [methyl 3- (3,5-ditertiarybutyl-4-hydroxyphenyl) propionate] methane, thiodiethyleneglycol Bis [(3,5-ditert-butyl-4-hydroxyphenyl) propionate], 1,6-hexamethylenebis [(3,5-ditert-butyl-4-hydroxyphenyl) propionate], bis [3 3-bis (4-hydroxy-3-tert-butylphenyl) butyric acid] glycol ester, bis [2-tert-butyl-4-methyl-6- (2-hydroxy-3-tert-butyl-5-methyl) Benzyl) phenyl] terephthalate, 1,3,5-tris [(3,5-ditert-butyl-4-hydroxyphenyl) propionyloxyethyl] isocyanurate, 3,9-bis [1,1-dimethyl-2- {(3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy} ethyl] -2,4,8,10-tetraoxaspiro [5,5] Ndecane, triethylene glycol bis [(3-tert-butyl-4-hydroxy-5-methylphenyl) propionate] and the like, preferably 0.001 to 10 parts by weight with respect to 100 parts by weight of the aliphatic polyamide resin. More preferably, 0.05 to 5 parts by weight are used.
上記リン系酸化防止剤としては、例えば、トリスノニルフェニルホスファイト、トリス〔2−第三ブチル−4−(3−第三ブチル−4−ヒドロキシ−5−メチルフェニルチオ)−5−メチルフェニル〕ホスファイト、トリデシルホスファイト、オクチルジフェニルホスファイト、ジ(デシル)モノフェニルホスファイト、ジ(トリデシル)ペンタエリスリトールジホスファイト、ジ(ノニルフェニル)ペンタエリスリトールジホスファイト、ビス(2,4−ジ第三ブチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,6−ジ第三ブチル−4−メチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,4,6−トリ第三ブチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,4−ジクミルフェニル)ペンタエリスリトールジホスファイト、テトラ(トリデシル)イソプロピリデンジフェノールジホスファイト、テトラ(トリデシル)−4,4’−n−ブチリデンビス(2−第三ブチル−5−メチルフェノール)ジホスファイト、ヘキサ(トリデシル)−1,1,3−トリス(2−メチル−4−ヒドロキシ−5−第三ブチルフェニル)ブタントリホスファイト、テトラキス(2,4−ジ第三ブチルフェニル)ビフェニレンジホスホナイト、9,10−ジハイドロ−9−オキサ−10−ホスファフェナンスレン−10−オキサイド、2,2’−メチレンビス(4,6−第三ブチルフェニル)−2−エチルヘキシルホスファイト、2,2’−メチレンビス(4,6−第三ブチルフェニル)−オクタデシルホスファイト、2,2’−エチリデンビス(4,6−ジ第三ブチルフェニル)フルオロホスファイト、トリス(2−〔(2,4,8,10−テトラキス第三ブチルジベンゾ〔d,f〕〔1,3,2〕ジオキサホスフェピン−6−イル)オキシ〕エチル)アミン、2−エチル−2−ブチルプロピレングリコールと2,4,6−トリ第三ブチルフェノールのホスファイトなどが挙げられる。 Examples of the phosphorus antioxidant include trisnonylphenyl phosphite, tris [2-tert-butyl-4- (3-tert-butyl-4-hydroxy-5-methylphenylthio) -5-methylphenyl]. Phosphite, tridecyl phosphite, octyl diphenyl phosphite, di (decyl) monophenyl phosphite, di (tridecyl) pentaerythritol diphosphite, di (nonylphenyl) pentaerythritol diphosphite, bis (2,4-di Tert-butylphenyl) pentaerythritol diphosphite, bis (2,6-ditert-butyl-4-methylphenyl) pentaerythritol diphosphite, bis (2,4,6-tritert-butylphenyl) pentaerythritol diphosphite Phosphite, bis (2,4-dicumylphenyl) pen Erythritol diphosphite, tetra (tridecyl) isopropylidene diphenol diphosphite, tetra (tridecyl) -4,4′-n-butylidenebis (2-tert-butyl-5-methylphenol) diphosphite, hexa (tridecyl) -1 , 1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane triphosphite, tetrakis (2,4-ditert-butylphenyl) biphenylene diphosphonite, 9,10-dihydro-9 -Oxa-10-phosphaphenanthrene-10-oxide, 2,2'-methylenebis (4,6-tert-butylphenyl) -2-ethylhexyl phosphite, 2,2'-methylenebis (4,6- Tributylphenyl) -octadecyl phosphite, 2,2′-ethylidenebis (4 6-ditert-butylphenyl) fluorophosphite, tris (2-[(2,4,8,10-tetrakis tert-butyldibenzo [d, f] [1,3,2] dioxaphosphine-6 -Yl) oxy] ethyl) amine, phosphite of 2-ethyl-2-butylpropylene glycol and 2,4,6-tritert-butylphenol, and the like.
上記チオエーテル系酸化防止剤としては、例えば、チオジプロピオン酸ジラウリル、チオジプロピオン酸ジミリスチル、チオジプロピオン酸ジステアリルなどのジアルキルチオジプロピオネート類及びペンタエリスリトールテトラ(β−アルキルメルカプトプロピオン酸エステル類が挙げられる。 Examples of the thioether-based antioxidant include dialkylthiodipropionates such as dilauryl thiodipropionate, dimyristyl thiodipropionate, and distearyl thiodipropionate, and pentaerythritol tetra (β-alkylmercaptopropionate esters). Is mentioned.
上記紫外線吸収剤としては、例えば、2,4−ジヒドロキシベンゾフェノン、2−ヒドロキシ−4−メトキシベンゾフェノン、2−ヒドロキシ−4−オクトキシベンゾフェノン、5,5’−メチレンビス(2−ヒドロキシ−4−メトキシベンゾフェノン)などの2−ヒドロキシベンゾフェノン類;2−(2’−ヒドロキシ−5’−メチルフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−3’,5’−ジ第三ブチルフェニル)−5−クロロベンゾトリアゾ−ル、2−(2’−ヒドロキシ−3’−第三ブチル−5’−メチルフェニル)−5−クロロベンゾトリアゾ−ル、2−(2’−ヒドロキシ−5’−第三オクチルフェニル)ベンゾトリアゾ−ル、2−(2’−ヒドロキシ−3’,5’−ジクミルフェニル)ベンゾトリアゾ−ル、2,2’−メチレンビス(4−第三オクチル−6−(ベンゾトリアゾリル)フェノール)、2−(2’−ヒドロキシ−3’−第三ブチル−5’−カルボキシフェニル)ベンゾトリアゾールなどの2−(2’−ヒドロキシフェニル)ベンゾトリアゾール類;フェニルサリシレート、レゾルシノールモノベンゾエート、2,4−ジ第三ブチルフェニル−3,5−ジ第三ブチル−4−ヒドロキシベンゾエート、2,4−ジ第三アミルフェニル−3,5−ジ第三ブチル−4−ヒドロキシベンゾエート、ヘキサデシル−3,5−ジ第三ブチル−4−ヒドロキシベンゾエートなどのベンゾエート類;2−エチル−2’−エトキシオキザニリド、2−エトキシ−4’−ドデシルオキザニリドなどの置換オキザニリド類;エチル−α−シアノ−β、β−ジフェニルアクリレート、メチル−2−シアノ−3−メチル−3−(p−メトキシフェニル)アクリレートなどのシアノアクリレート類;2−(2−ヒドロキシ−4−オクトキシフェニル)−4,6−ビス(2,4−ジ第三ブチルフェニル)−s−トリアジン、2−(2−ヒドロキシ−4−メトキシフェニル)−4,6−ジフェニル−s−トリアジン、2−(2−ヒドロキシ−4−プロポキシ−5−メチルフェニル)−4,6−ビス(2,4−ジ第三ブチルフェニル)−s−トリアジンなどのトリアリールトリアジン類が挙げられる。 Examples of the ultraviolet absorber include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, and 5,5′-methylenebis (2-hydroxy-4-methoxybenzophenone). 2-hydroxybenzophenones, such as 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-ditert-butylphenyl) -5-chloro Benzotriazole, 2- (2′-hydroxy-3′-tert-butyl-5′-methylphenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-5′-tert. Octylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-dicumylphenyl) benzotriazole, 2 2- (2'-methylenebis (4-tert-octyl-6- (benzotriazolyl) phenol), 2- (2'-hydroxy-3'-tert-butyl-5'-carboxyphenyl) benzotriazole and other 2- ( 2'-hydroxyphenyl) benzotriazoles; phenyl salicylate, resorcinol monobenzoate, 2,4-ditert-butylphenyl-3,5-ditert-butyl-4-hydroxybenzoate, 2,4-ditert-amylphenyl Benzoates such as 3,5-ditert-butyl-4-hydroxybenzoate, hexadecyl-3,5-ditert-butyl-4-hydroxybenzoate; 2-ethyl-2′-ethoxyoxanilide, 2-ethoxy Substituted oxanilides such as -4′-dodecyloxanilide; ethyl-α-cyano-β, β-diphenyl Cyanoacrylates such as acrylate and methyl-2-cyano-3-methyl-3- (p-methoxyphenyl) acrylate; 2- (2-hydroxy-4-octoxyphenyl) -4,6-bis (2,4 -Di-tert-butylphenyl) -s-triazine, 2- (2-hydroxy-4-methoxyphenyl) -4,6-diphenyl-s-triazine, 2- (2-hydroxy-4-propoxy-5-methylphenyl) And triaryltriazines such as -4,6-bis (2,4-ditert-butylphenyl) -s-triazine.
上記ヒンダードアミン系光安定剤としては、例えば、2,2,6,6−テトラメチル−4−ピペリジルステアレート、1,2,2,6,6−ペンタメチル−4−ピペリジルステアレート、2,2,6,6−テトラメチル−4−ピペリジルベンゾエート、ビス(2,2,6,6−テトラメチル−4−ピペリジル)セバケート、テトラキス(2,2,6,6−テトラメチル−4−ピペリジル)−1,2,3,4−ブタンテトラカルボキシレート、テトラキス(1,2,2,6,6−ペンタメチル−4−ピペリジル)−1,2,3,4−ブタンテトラカルボキシレート、ビス(2,2,6,6−テトラメチル−4−ピペリジル)・ジ(トリデシル)−1,2,3,4−ブタンテトラカルボキシレート、ビス(1,2,2,6,6−ペンタメチル−4−ピペリジル)・ジ(トリデシル)−1,2,3,4−ブタンテトラカルボキシレート、ビス(1,2,2,4,4−ペンタメチル−4−ピペリジル)−2−ブチル−2−(3,5−ジ第三ブチル−4−ヒドロキシベンジル)マロネート、1−(2−ヒドロキシエチル)−2,2,6,6−テトラメチル−4−ピペリジノ−ル/コハク酸ジエチル重縮合物、1,6−ビス(2,2,6,6−テトラメチル−4−ピペリジルアミノ)ヘキサン/2,4−ジクロロ−6−モルホリノ−s−トリアジン重縮合物、1,6−ビス(2,2,6,6−テトラメチル−4−ピペリジルアミノ)ヘキサン/2,4−ジクロロ−6−第三オクチルアミノ−s−トリアジン重縮合物、1,5,8,12−テトラキス〔2,4−ビス(N−ブチル−N−(2,2,6,6−テトラメチル−4−ピペリジル)アミノ)−s−トリアジン−6−イル〕−1,5,8,12−テトラアザドデカン、1,5,8,12−テトラキス〔2,4−ビス(N−ブチル−N−(1,2,2,6,6−ペンタメチル−4−ピペリジル)アミノ)−s−トリアジン−6−イル〕−1,5,8−12−テトラアザドデカン、1,6,11−トリス〔2,4−ビス(N−ブチル−N−(2,2,6,6−テトラメチル−4−ピペリジル)アミノ)−s−トリアジン−6−イル〕アミノウンデカン、1,6,11−トリス〔2,4−ビス(N−ブチル−N−(1,2,2,6,6−ペンタメチル−4−ピペリジル)アミノ)−s−トリアジン−6−イル〕アミノウンデカンなどのヒンダードアミン化合物が挙げられる。 Examples of the hindered amine light stabilizer include 2,2,6,6-tetramethyl-4-piperidyl stearate, 1,2,2,6,6-pentamethyl-4-piperidyl stearate, 2,2, 6,6-tetramethyl-4-piperidylbenzoate, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, tetrakis (2,2,6,6-tetramethyl-4-piperidyl) -1 , 2,3,4-butanetetracarboxylate, tetrakis (1,2,2,6,6-pentamethyl-4-piperidyl) -1,2,3,4-butanetetracarboxylate, bis (2,2, 6,6-tetramethyl-4-piperidyl) di (tridecyl) -1,2,3,4-butanetetracarboxylate, bis (1,2,2,6,6-pentamethyl-4 Piperidyl) .di (tridecyl) -1,2,3,4-butanetetracarboxylate, bis (1,2,2,4,4-pentamethyl-4-piperidyl) -2-butyl-2- (3,5 -Di-tert-butyl-4-hydroxybenzyl) malonate, 1- (2-hydroxyethyl) -2,2,6,6-tetramethyl-4-piperidinol / diethyl succinate polycondensate, 1,6- Bis (2,2,6,6-tetramethyl-4-piperidylamino) hexane / 2,4-dichloro-6-morpholino-s-triazine polycondensate, 1,6-bis (2,2,6,6 -Tetramethyl-4-piperidylamino) hexane / 2,4-dichloro-6-tert-octylamino-s-triazine polycondensate, 1,5,8,12-tetrakis [2,4-bis (N-butyl) -N- (2,2, , 6-tetramethyl-4-piperidyl) amino) -s-triazin-6-yl] -1,5,8,12-tetraazadodecane, 1,5,8,12-tetrakis [2,4-bis ( N-butyl-N- (1,2,2,6,6-pentamethyl-4-piperidyl) amino) -s-triazin-6-yl] -1,5,8-12-tetraazadodecane, 1,6 , 11-tris [2,4-bis (N-butyl-N- (2,2,6,6-tetramethyl-4-piperidyl) amino) -s-triazin-6-yl] aminoundecane, 1,6 , 11-tris [2,4-bis (N-butyl-N- (1,2,2,6,6-pentamethyl-4-piperidyl) amino) -s-triazin-6-yl] aminoundecane Compounds.
上記重金属不活性化剤としては、N,N’−ジフェニルオキサミド、N,N’−ビス(サリチロイル)ヒドラジン、N,N’−ビス(3,5−ジ第三ブチル−4−ヒドロキシフェニルプロピオニル)ヒドラジン、3−サリチロイルアミノ−1,2,4−トリアゾール、ビス(ベンジリデン)オキサリルジヒドラジド、イソフタロイルジヒドラジド、セバコイルビスフェニルヒドラジド、N,N’−ジアセチルアジポイルジヒドラジド、N,N’−ビス(サリチロイル)オキサリルジヒドラジド、N,N’−ビス(サリチロイル)チオプロピオニルジヒドラジドなどが挙げられる。 Examples of the heavy metal deactivator include N, N′-diphenyloxamide, N, N′-bis (salicyloyl) hydrazine, N, N′-bis (3,5-ditert-butyl-4-hydroxyphenylpropionyl). ) Hydrazine, 3-salicyloylamino-1,2,4-triazole, bis (benzylidene) oxalyl dihydrazide, isophthaloyl dihydrazide, sebacoyl bisphenyl hydrazide, N, N′-diacetyladipoyl dihydrazide, N, N Examples include '-bis (salicyloyl) oxalyl dihydrazide, N, N'-bis (salicyloyl) thiopropionyl dihydrazide, and the like.
以下に本発明の実施例を比較例とともに挙げるが、本発明は以下の実施例に制限されるものではない。 Examples of the present invention are listed below together with comparative examples, but the present invention is not limited to the following examples.
実施例1
過酸化水素(三徳化学工業(株)製:試薬特級)30mlと濃硫酸(ナカライテスク(株)製:試薬特級)70mlを1リットルビーカーに加え、そこに基材(表1記載)を浸し、100℃まで加熱して2時間保持した。冷却して、基材を取り出し、純水で洗浄後、室温で3時間真空乾燥し、親水化処理した基材を得た。
Example 1
Hydrogen peroxide (manufactured by Santoku Chemical Co., Ltd .: reagent special grade) 30 ml and concentrated sulfuric acid (manufactured by Nacalai Tesque Co., Ltd .: reagent special grade) 70 ml were added to a 1 liter beaker, and the substrate (described in Table 1) was immersed therein. Heat to 100 ° C. and hold for 2 hours. After cooling, the substrate was taken out, washed with pure water, and then vacuum dried at room temperature for 3 hours to obtain a hydrophilized substrate.
化学気相吸着法
上記の親水化処理した基材を、真空紫外光照射装置(Vacuum Ultraviolet, VUV,ウシオ電機(株)製)により波長172nmの紫外線を10分間照射した。その後、テフロン/ステンレス製耐圧容器中に有機シラン化合物(表1記載)とともに窒素雰囲気下で封入し、100℃で2時間反応した。反応後、基材を、表1における実施例1−2及び比較例1−1〜1−3は乾燥トルエンで、実施例1−1及び1−3は乾燥エタノールで洗浄した後、自然乾燥した。
得られた基材の水及びジヨードメタン(和光純薬工業(株)製)との接触角を接触角測定装置(KRUSS製)で測定し、Owensの式により表面自由エネルギー(mN/m)を得た。その結果を表1に示す。
Chemical Vapor Adsorption Method The above-mentioned hydrophilized base material was irradiated with ultraviolet light having a wavelength of 172 nm for 10 minutes using a vacuum ultraviolet light irradiation device (Vacuum Ultraviolet, VUV, manufactured by USHIO INC.). Thereafter, the mixture was sealed in a Teflon / stainless steel pressure vessel together with an organosilane compound (described in Table 1) in a nitrogen atmosphere and reacted at 100 ° C. for 2 hours. After the reaction, the substrate was washed in Example 1-2 and Comparative Examples 1-1 to 1-3 in Table 1 with dry toluene, and Examples 1-1 and 1-3 were washed with dry ethanol, and then naturally dried. .
The contact angle of the obtained base material with water and diiodomethane (manufactured by Wako Pure Chemical Industries, Ltd.) was measured with a contact angle measuring device (manufactured by KRUS), and surface free energy (mN / m) was obtained by the Owens formula. It was. The results are shown in Table 1.
上記の如くして得られた表面自由エネルギーの異なる基材(表1記載)に、ポリアミド−6(CM1021:東レ(株)製)0.75gを1,1,1,3,3,3−ヘキサフルオロ−2−プロパノール(関東化学(株)製:試薬特級)29.25gに溶解して滴下し、スピンコート法(2000rpmで1分間)により厚さ100〜150nmのポリアミド−6の薄膜を作成した。これを減圧下120℃で4時間乾燥して試験片とした。 0.75 g of polyamide-6 (CM1021: manufactured by Toray Industries, Inc.) was added to 1,1,1,3,3,3-3- base materials having different surface free energies obtained as described above (described in Table 1). Hexafluoro-2-propanol (manufactured by Kanto Chemical Co., Inc .: reagent grade) dissolved in 29.25 g and dropped, and a polyamide-6 thin film with a thickness of 100 to 150 nm is prepared by spin coating (1 minute at 2000 rpm) did. This was dried at 120 ° C. under reduced pressure for 4 hours to obtain a test piece.
得られた試験片を窒素気流下、加熱ステージを有する偏光顕微鏡によって解析した。結晶化条件としては250℃まで加熱して3分間保持してポリアミド−6を溶融させ、5℃/分で冷却して結晶の生成が確認される温度を3回測定して平均値の比較により結晶化性能を評価した。その結果を表1に示す。 The obtained test piece was analyzed with a polarizing microscope having a heating stage under a nitrogen stream. As crystallization conditions, heating to 250 ° C. and holding for 3 minutes to melt polyamide-6, cooling at 5 ° C./minute, measuring the temperature at which formation of crystals is confirmed three times, and comparing the average values Crystallization performance was evaluated. The results are shown in Table 1.
有機シラン化合物としては、n−オクチルトリメトキシシラン:チッソ(株)製、3−アミノプロピルトリメトキシシラン:チッソ(株)製、3−(2−アミノエチルアミノ)プロピルトリメトキシシラン:チッソ(株)製、3−メルカプトプロピルトリメトキシシラン:チッソ製、3,3,3−トリフルオロプロピルトリメトキシシラン:GELEST INC製、ヘプタデカフルオロデシルトリメトキシシラン:信越化学製を用いた。 As the organosilane compound, n-octyltrimethoxysilane: manufactured by Chisso Corporation, 3-aminopropyltrimethoxysilane: manufactured by Chisso Corporation, 3- (2-aminoethylamino) propyltrimethoxysilane: Chisso Corporation ), 3-mercaptopropyltrimethoxysilane: manufactured by Chisso, 3,3,3-trifluoropropyltrimethoxysilane: manufactured by GELEST INC, and heptadecafluorodecyltrimethoxysilane: manufactured by Shin-Etsu Chemical Co., Ltd. were used.
実施例2
実施例1と同様に表面処理して得られた基材(表2記載)の表面自由エネルギーを測定し、実施例1と同様にしてポリアミド−6(CM1061:東レ(株)製)を塗布し、得られた試験片を窒素気流下、加熱ステージを有する偏光顕微鏡によって結晶性を解析した。結晶化条件としては250℃まで加熱して3分間保持してポリアミド−6を溶融させ、20℃/分で200℃まで降温して同温度で結晶形成が確認されるまでの時間を測定した。その結果を表2に示す。
Example 2
The surface free energy of the base material (described in Table 2) obtained by surface treatment in the same manner as in Example 1 was measured, and polyamide-6 (CM1061: manufactured by Toray Industries, Inc.) was applied in the same manner as in Example 1. The crystallinity of the obtained test piece was analyzed with a polarizing microscope having a heating stage under a nitrogen stream. As crystallization conditions, the temperature was increased to 250 ° C. and held for 3 minutes to melt polyamide-6, the temperature was decreased to 200 ° C. at 20 ° C./min, and the time until crystal formation was confirmed at the same temperature was measured. The results are shown in Table 2.
通常の成形加工機の材質のアルミニウム及びSUS304について、表面自由エネルギーを測定したところ、アルミニウムは35mN/m、SUS304は36mN/mであり、本発明のポリアミドの結晶化を促進するために好ましい表面自由エネルギーは従来の加工機表面では達成されていない。
When surface free energy was measured for aluminum and SUS304, which are the materials of ordinary molding machines, aluminum was 35 mN / m and SUS304 was 36 mN / m, which is preferable for promoting the crystallization of the polyamide of the present invention. Energy is not achieved on the surface of conventional processing machines.
Claims (3)
A polyamide molded article produced by using the method for promoting crystallization of a polyamide resin according to claim 1.
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JP2011171471A (en) * | 2010-02-18 | 2011-09-01 | Dainippon Printing Co Ltd | Nano imprint method and mold for use in the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05194841A (en) * | 1992-01-21 | 1993-08-03 | Toray Ind Inc | Polyamide resin composition |
JPH09201825A (en) * | 1995-11-21 | 1997-08-05 | Mitsubishi Eng Plast Kk | Molding of automotive member, manufacture of automotive exterior part and pillar |
JP2000100648A (en) * | 1998-09-22 | 2000-04-07 | Sumitomo Rubber Ind Ltd | Manufacture of laminated ceramic capacitor |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05194841A (en) * | 1992-01-21 | 1993-08-03 | Toray Ind Inc | Polyamide resin composition |
JPH09201825A (en) * | 1995-11-21 | 1997-08-05 | Mitsubishi Eng Plast Kk | Molding of automotive member, manufacture of automotive exterior part and pillar |
JP2000100648A (en) * | 1998-09-22 | 2000-04-07 | Sumitomo Rubber Ind Ltd | Manufacture of laminated ceramic capacitor |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011171471A (en) * | 2010-02-18 | 2011-09-01 | Dainippon Printing Co Ltd | Nano imprint method and mold for use in the same |
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