JP2005136053A - Resin sealing apparatus and method for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method of sealing a semiconductor device with resin for preventing failures in mold release when sealing only one of surfaces of an interposer with the resin. <P>SOLUTION: The apparatus of sealing a semiconductor device with resin has a cavity to serve as a resin sealing part in one of a pair of opposite metal molds, and includes, in at least one of the metal molds, a cull for injecting the resin into the cavity and a dummy cavity to serve as a resin reservoir for the resin flowing out of the cavity, for sealing with resin only one surface of a substrate with a semiconductor element mounted by filling the cavity with the resin. On the other metal mold without a cavity, anchor holes communicating respectively with the cull and the dummy cavity are provided on the opposite side across the cavity of the above mentioned metal mold. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a resin sealing device and a resin sealing method for a semiconductor device in which only one surface of a substrate on which a semiconductor element is mounted is resin-sealed.

  Used for CSP (Chip Size Package), BGA (Ball Grid Array), etc. in which a semiconductor element is mounted on one side of an interposer (substrate) made of glass epoxy resin, ceramic, polyimide, etc., and only one side is resin-sealed. An example of a conventional resin sealing device and resin sealing method is shown in FIG. FIG. 3A shows a state in which the interposer is sandwiched between a pair of molds and filled with resin, and FIG. 3B shows a state in which the upper mold is released after sealing with the resin.

  As shown in FIG. 3A, the conventional resin sealing device includes a product part cavity 2 serving as a resin sealing part and a cull part 3 for injecting resin into the product part cavity 2 in the upper mold 1. The lower mold 5 is provided with a pot 6 and a plunger 7 for injecting resin, and an adsorption hole 9 for adsorbing the interposer 10.

  In the resin sealing method using the above resin sealing device, first, the interposer 10 on which the semiconductor element is mounted is set in the lower mold 5, and the columnar plunger 7 guided by the cylindrical pot 6 is used. Put a superheated resin tablet on top of the head. After the upper mold 1 and the lower mold 5 are tightened together, the plunger 7 is moved up to fill the product part cavity 2 with resin from the cull part 3 of the upper mold 1 (FIG. 3A). ). After cooling, the upper mold 1 is separated, and the filled resin and interposer 10 are left on the lower mold 5 side.

  However, in such a resin sealing device, when the upper mold 1 is separated from the lower mold 5, the surface of the interposer 10 on the non-resin-sealed side of the interposer 10 becomes the lower mold 5 as shown in FIG. On the other hand, since there is nothing to act as an anchor, a phenomenon occurs in which the interposer 10 is pulled by being bonded to the upper mold 1 even though the suction holes 9 are sucked.

  Also, as an example of another resin sealing device and resin sealing method, it is different from the type in which only one side of the substrate is resin-sealed, but it is a type of resin sealing device having cavities in both upper and lower molds. In addition, a dummy cavity serving as a resin pool connected by a runner that is a resin flow path is provided in upper and lower molds, and an ejector pin is attached to the dummy cavity (see Patent Document 1). In this resin sealing device, resin is also injected into the dummy cavity to prevent generation of voids and unfilling, and the resin in the dummy cavity is pushed out by the ejector pins to be surely released.

In addition, as an example of a resin sealing device and a resin sealing method for a semiconductor device in which a resin package is formed only on one side of the substrate as in the present invention, the cull portion When an ejector pin is installed in the anchor hole and the resin is filled, the anchor hole is also filled with the resin to form an anchor protrusion, preventing the resin package from being taken up to the upper mold when releasing. There has also been proposed a method (see Patent Document 2).
JP-A-11-26488 JP-A-11-150139

  In a resin sealing device and a resin sealing method of a semiconductor device of the type in which only one side of a conventional interposer is resin-sealed, the resin supplied by the plunger fills the product portion cavity and sealing is completed. For this reason, when the upper mold is released, the interposer surface that is not sealed with resin cannot be anchored to the lower mold, causing a phenomenon in which the upper mold is attached and pulled, resulting in defective release In addition, product defects such as peeling between the interposer and the resin due to it have occurred.

  In addition, when a release film is used on the upper mold surface and the interposer, which is an organic substrate, is clamped at a high pressure, sticking occurs between the interposer and the film, and the semiconductor device includes the interposer when released. The upper die part is pulled to the lower die. As a result, the semiconductor device is stuck to the upper die, or the resin sealing part and the cull part of the semiconductor device are divided at the gate part, and the resin sealing There was a problem that the device could not be operated.

  Also, in the type of resin sealing device that has cavities in both the upper and lower molds, dummy cavities that serve as resin pools are provided in the upper and lower molds to prevent voids and unfilling, and ejector pins in the dummy cavities A method of extruding the resin in the dummy cavity to release the mold is provided. However, even if this is applied to a semiconductor device in which only one side of the interposer is sealed with resin, the occurrence of voids and unfilling can be prevented. I couldn't lose it.

  In addition, in a semiconductor device in which a resin package is formed only on one side of the substrate, an ejector pin is provided in the anchor hole in the cull part, and when the resin is filled, the anchor hole is also filled with resin to form an anchor protrusion. However, in the method for increasing the adhesion to the lower mold, the anchor protrusion is provided only on one side of the resin sealing portion of the semiconductor device, so that the balance is poor and it is difficult to eliminate the mold release failure.

  In order to solve the above-mentioned problem, the invention according to claim 1 has a cavity serving as a resin sealing portion in one of the pair of molds facing each other, and at least one of the pair of molds. A substrate in which a mold is provided with a cull portion for injecting resin into the cavity and a dummy cavity serving as a resin pool portion of the resin flowing out of the cavity, and the semiconductor element is mounted by filling the cavity with the resin A resin sealing device for a semiconductor device for resin sealing only one side of the metal mold, wherein the other mold not having the cavity is opposed to the other mold facing the cavity In addition, an anchor hole communicating with the cull portion and the dummy cavity is provided.

  The invention according to claim 2 is the invention according to claim 1, wherein the resin sealing device is arranged such that the substrate is placed on the pair of molds in a separated state so that the mounting surface of the semiconductor element faces the cavity. Means for sandwiching the substrate between the pair of molds, and means for filling the cavity, the dummy cavity, and the anchor hole with resin from the cull portion, the cull portion and the The anchor holes communicating with the respective dummy cavities are fixed to the other mold when the one mold is released after the filled resin is cured. It is characterized by having an opening area and a depth filled with a predetermined volume of resin having an anchor effect capable of maintaining the state.

  The invention according to claim 3 is the invention according to any one of claims 1 and 2, wherein the anchor hole is provided with a resin push-out mechanism that moves forward and backward in the anchor hole. To do.

  According to a fourth aspect of the present invention, in the invention according to any one of the second or third aspect, the plunger for resin press-fitting into the cull portion is provided on the other mold side of the resin sealing device. And a pot serving as the anchor hole communicating with the cull portion where the plunger moves forward and backward, an ejector hole serving as the anchor hole communicating with the dummy cavity, and an ejector pin moving forward and backward inside and outside the ejector hole, When the resin in the pot is press-fitted with the plunger to fill the cavity and the dummy cavity from the cull portion, the top of the plunger is stopped at a predetermined position in the pot, and the predetermined portion is placed in the pot. And the top of the ejector pin is stopped in the ejector hole. The resin filled in the predetermined volume of resin, the cull part, the cavity, the dummy cavity, the pot, and the ejector hole are cured, and then the one mold is separated. When molding, the resin filled in at least the pot and the ejector hole provided in the other mold stays in the pot and the ejector hole, so that the cull part, the cavity, and the dummy The resin filled in the cavity and the substrate are kept fixed to the other mold, and the means for releasing only the one mold, the plunger and the ejector pin are respectively in the pot and the By performing the operation of extruding the resin filled in the ejector hole from the other mold, the cull portion and the die are removed from the other mold. Characterized in that it comprises a means for separating the resin and the substrate was filled with the over cavity and the anchor hole.

  In the invention according to claim 5, one of the pair of molds facing each other has a cavity serving as a resin sealing portion, and at least one of the pair of molds is connected to the cavity. A semiconductor in which only one side of a substrate on which a semiconductor element is mounted is resin-sealed using a resin-sealing device having a cull portion for injecting resin and a dummy cavity serving as a resin pool portion of the resin flowing out of the cavity A resin sealing method for an apparatus, wherein the substrate is set on the pair of molds in a separated state so that a mounting surface of the semiconductor element faces the cavity, and then the substrate is mounted on the pair of molds. And the step of filling the cavity and the dummy cavity with resin from the cull portion, and being provided in the other mold that does not have the cavity and facing the key of the one mold. A step of filling a predetermined volume of the resin into anchor holes that are respectively connected to the cull portion and the dummy cavity disposed on opposite sides with a bite in between, and the cull portion, the cavity, and the dummy cavity. And after the resin filled in the anchor hole is cured, when the one mold is released, at least the resin filled in the anchor hole provided in the other mold remains in the anchor hole. Thus, the resin and the substrate filled in the cull part, the cavity, and the dummy cavity are kept fixed to the other mold, and only the one mold is separated, and the other mold is separated. And a step of separating the resin and the substrate filled in the cull part, the dummy cavity, and the anchor hole from the mold.

  The invention according to claim 6 is the invention according to claim 5, wherein the anchor hole is provided with a resin push-out mechanism that moves forward and backward in the anchor hole, and the resin filled into the anchor hole by the resin push-out mechanism. By extruding from the other mold, the resin filled in the cull part, the dummy cavity, and the anchor hole and the substrate are separated from the other mold.

The invention according to claim 7 is the invention according to any one of claims 5 or 6, wherein a plunger for press-fitting the resin into the cull portion is provided on the other mold side of the resin sealing device. And a pot serving as the anchor hole communicating with the cull portion where the plunger moves forward and backward, an ejector hole serving as the anchor hole communicating with the dummy cavity, and an ejector pin moving forward and backward inside and outside the ejector hole, When the resin in the pot is press-fitted with the plunger to fill the cavity and the dummy cavity from the cull portion, the top of the plunger is stopped at a predetermined position in the pot, and the predetermined portion is placed in the pot. And the top of the ejector pin is stopped in the ejector hole. Filling the hole with the predetermined volume of resin, curing the resin filled in the cull part, the cavity, the dummy cavity, and the anchor hole, and then releasing the one mold In this case, at least the resin filled in the pot and the ejector hole provided in the other mold stays in the pot and the ejector hole, so that the cull part, the cavity, and the dummy cavity In the pot and the ejector hole, the resin and the substrate are fixed to the other mold, and only the one mold is separated, and the plunger and the ejector pin are operated. By extruding the resin filled in from the other mold, the cull portion, the dummy cavity, and the assembly are removed from the other mold. Characterized in that it comprises a step of separating the resin and the substrate was filled into a car hall.

  The invention according to an eighth aspect is the invention according to any one of the fifth to seventh aspects, wherein the substrate to be resin-sealed is a collective substrate for forming a plurality of semiconductor devices, and the single cavity includes the cavity. The plurality of semiconductor devices on the collective substrate are collectively sealed.

  According to the first aspect of the present invention, the other mold having no cavity has anchor holes that respectively communicate with the cull portion and the dummy cavity at positions facing each other with the cavity of the one mold facing each other. When the upper mold is released, the resin of the cull part and the dummy cavity on the opposite side across the cavity is transferred to the upper mold of the substrate part where there is no part to be an anchor to the lower mold. In addition to suppressing pulling due to adhesion of the resin, the resin in the anchor hole acts as an anchor to the lower mold, and can counterbalance the load in the peeling direction from the upper mold from both sides of the substrate in a balanced manner. The occurrence of problems such as resin peeling and release film sticking can be suppressed, and a semiconductor device with stable quality can be produced.

  According to the invention according to claim 2, in the invention according to claim 1, the anchor hole communicating with the cull portion and the dummy cavity is filled with the resin and the substrate when the one mold is separated. Has an opening area and depth filled with a predetermined volume of resin having an anchor effect sufficient to keep the state fixed to the other mold. Can act against the both sides of the interposer in a well-balanced manner and suppress peeling from the lower mold. On the other hand, since the resin in the anchor hole is not used in an actual semiconductor device, the use amount of the resin can be suppressed by setting the volume so as not to increase the waste of the resin because it is too large. As described above, in the resin sealing step of the semiconductor device of the type in which resin sealing is performed on one side, the mold can be surely released, and the occurrence of resin sealing failure can be prevented and a highly reliable semiconductor package can be formed.

  According to the invention according to claim 3, in the invention according to claim 1 or claim 2, the anchor hole is provided with a resin push-out mechanism that moves forward and backward in the anchor hole. By extruding the resin in the anchor hole, a force is applied to the resin of the product part cavity from both sides of the connected cull part and the dummy cavity, and from the other mold without directly applying force to the semiconductor device. Resins and semiconductor devices can be separated. Further, since the resin moves forward and backward in the anchor hole, the remaining resin amount can be varied. Thus, the functions of the ejector and the anchor can be shared, and the mold can be miniaturized.

According to the invention according to claim 4, in the invention according to claim 2 or claim 3,
By making the anchor hole in the cull portion a pot in which the plunger moves forward and backward, one hole can serve two roles of resin injection and anchor at the time of mold release, and the mold can be simplified and simplified.

  According to the invention of claim 5, the step of sandwiching the substrate with a pair of molds, filling the cavity and the dummy cavity with resin from the cull portion, and filling the anchor hole with the resin of a predetermined volume From the filling step, after curing the resin, maintaining the state where the filled resin and the substrate are fixed to the other mold, separating only the one mold, and from the other mold, Since the step of separating the filled resin and the substrate is included, when the upper die is released, the portion of the cull portion and the dummy cavity on the opposite side across the cavity serves as an anchor to the lower die In addition to restraining the pulling of the substrate or cavity resin that is not bonded to the upper mold, the resin in the anchor hole that leads to the cull part and the dummy cavity acts as an anchor to the lower mold. Since the load in the peeling direction due to the upper mold can be counterbalanced from both sides of the substrate, it is possible to suppress the occurrence of problems such as resin peeling and release film sticking due to mold release defects, producing stable quality products. it can.

  According to the invention of claim 6, in the invention of claim 5, the anchor hole is provided with a resin push-out mechanism that moves forward and backward in the anchor hole, and the anchor hole is filled by the resin push-out mechanism. Since the step of releasing the filled resin and the substrate from the other mold by extruding the obtained resin from the other mold, the product section is connected from both sides of the connected cull section and the dummy cavity. A force is applied to the resin in the cavity, and the resin and the semiconductor device can be separated from the other mold without directly applying a force to the semiconductor device. Further, since the volume of the resin to be filled can be changed by moving back and forth in the anchor hole, an optimal remaining resin amount can be set according to the type of resin used.

  According to the invention according to claim 7, in the invention according to claim 5 or claim 6, since the anchor hole of the cull portion is a pot in which the plunger moves forward and backward, the resin in the pot is press-fitted with the plunger. When filling, the top of the plunger is stopped at a predetermined position in the pot, so that a predetermined volume of resin having an anchor effect can be left in the pot accurately and easily.

  According to the invention according to claim 8, in the invention according to any one of claims 5 to 7, the substrate to be resin-sealed is a collective substrate for forming a plurality of semiconductor devices, and the cavity is used to Since the plurality of semiconductor devices on the collective substrate are collectively sealed, a large number of semiconductor devices can be formed with high reliability from one substrate without occurrence of defective peeling by one resin sealing.

  FIG. 1 is a schematic cross-sectional view showing one embodiment of a resin sealing device and resin method for a semiconductor device of the present invention, and FIG. 2 is one embodiment of a resin sealing device and resin sealing method for a semiconductor device of the present invention. It is the schematic from the upper surface which shows a form. FIG. 1 and FIG. 2 show the vicinity of a pair of molds composed of an upper mold 1 and a lower mold 5 that are particularly related to the present invention, among the resin sealing devices, and the other parts are conventional general Since it is the same as that of the resin sealing device, it is omitted.

  FIG. 1A shows a state in which the interposer 10 is sandwiched between a pair of molds and filled with resin, and FIG. 1B shows a state in which the upper mold is released after sealing with the resin. FIG. 2 is a schematic view from the upper surface of the interposer 10 on the lower mold 5 side of FIG. 1B and the filled resin. In FIG. 2, the product part cavity 2, the cull part 3, and the dummy cavity 4 are labeled for easy understanding. And the sealing resin of the cull part 3 and the dummy cavity 4 is connected and formed on the opposite side with the resin of the product part cavity 2 in between.

  A schematic view of the AA cross section of FIG. 2 corresponds to FIG. 1, and the AA cross section is a resin as can be seen from FIG. 1 that the cull part 3 and the product part cavity 2 are connected by a resin flow path. Since the cross section of the flow path portion is selected, it is not partially on a straight line. Further, FIG. 1 also shows the upper mold 1.

  With reference to FIG. 1A, a resin sealing device for a semiconductor device of the present invention will be described. The upper mold 1 is filled with resin to form a product part cavity 2 to be a resin sealing part, a cull part 3 for injecting resin into the product part cavity 2, a resin pool part of the resin flowing out from the product part cavity 2, A dummy cavity 4 is formed. On the other hand, a suction hole 9 for evacuation for adsorbing the interposer 10 on the side of the lower mold 5, a cylindrical pot 6 connected to the cull portion 3, and a columnar plunger 7 that can be moved forward and backward are guided by the cylindrical pot 6. An ejector hole 11 connected to the dummy cavity 4 and an ejector pin 8 capable of moving back and forth in the ejector hole 11 are provided.

  The pot 6 and the ejector hole 11 can only maintain the state in which the filled resin and the interposer 10 are fixed to the lower mold 5 when the upper mold 1 is released after the filled resin is cured. Since it has an opening area and depth filled with a predetermined volume of resin having an anchor effect, even if a tensile force is exerted by the upper mold 1, it counters with good balance from both sides of the interposer 10, Detachment from the mold 5 is suppressed. In this way, the pot 6 and the ejector hole 11 can be rephrased as an anchor hole having an anchor effect to the lower mold 5.

  On the other hand, since the resin in the anchor hole is not used in an actual semiconductor device, the use amount of the resin can be suppressed by setting the volume so as not to increase the waste of the resin because it is too large. This can be realized by freely adjusting the area and depth of the opening of the anchor hole (such as the length of the ejector pin 8) within the above range at the mold design stage. Further, the anchor effect is enhanced by changing the shape and position of the anchor hole, making the inner surface matte or forming a lateral groove.

  Although omitted in the drawing, runners and gates serving as resin flow paths are provided between the cull part 3 and the product part cavity 2 and between the product part cavity 2 and the dummy cavity 4.

  1 and 2 show one product part cavity 2 and the like, but by providing a combination of a plurality of product part cavities 2, cull parts 3 and dummy cavities 4 in one mold, etc. A plurality of interposers 10 may be sealed with resin at the same time. Further, the actual interposer 10 is mounted as a collective substrate on a single substrate by mounting a large number of semiconductor elements, for example, in a matrix form by bump connection or the like, and after encapsulating the resin together, the sealing resin and the interposer 10 are combined with a dicer, A plurality of semiconductor devices are simultaneously formed by cutting vertically and horizontally.

  As a material of the interposer 10, various materials such as an insulating substrate such as glass epoxy and ceramic and a tape substrate such as polyimide can be used.

  A resin sealing method of a semiconductor device according to the present invention will be described in the order of steps with reference to FIG. First, the interposer 10 on which the semiconductor element is mounted is placed on the lower mold 5, and the interposer 10 is sucked and fixed to the lower mold 5 by evacuation from the suction holes 9. Before the resin sealing, a mold release film may be attached to the upper mold 1 so that it can be easily released from the mold.

  A superheated and melted resin tablet is placed on the top of a cylindrical plunger 7 guided by a cylindrical pot 6 provided on the lower mold 5 side, and the upper mold 1 and the lower mold 5 are combined and tightened. After that, when the plunger 7 is lifted from the state where the resin is placed on the top of the plunger 7, the resin passes from the cull part 3 through the product part cavity 2, and further, the dummy cavity 4 is filled with a part of the resin. Is done. The leading portion of the injected resin contains a large amount of air, but this portion is enclosed in the dummy cavity 4 and the product portion cavity 2 is filled with a resin that does not contain air.

  Here, when the resin in the pot 6 is press-fitted with the plunger 7, the plunger 7 is stopped at a predetermined position in the pot 6 to leave the resin in the pot 6, and the ejector hole 11 connected to the dummy cavity 4. A predetermined amount of resin is also introduced into the inside (FIG. 1A).

  The filling amount of the resin in the pot 6 and the ejector hole 11 is such that when the upper mold 1 is released after the resin is sealed, the resin filled in the pot 6 and the ejector hole 11 is transferred to the lower mold 5. The amount is set appropriately so that the adhesion between the interposer 10 and the filled resin and the lower mold 5 is sufficient.

  After the resin is cured, the upper mold 1 and the lower mold 5 are separated from each other and the mold is opened. At the same time, the semiconductor device including the filled resin and the interposer 10 is separated from the upper mold 1. When the mold is opened, if the adhesion force between the filled resin and the interposer 10 and the lower mold 5 is not stronger than the adhesion force between the filled resin and the upper mold 1, normal release operation I can't. Until now, in a resin sealing device of a semiconductor device that performs resin molding only on one side of the interposer 10, peeling between the interposer 10 and the filled resin has occurred at the time of mold release, which has been a serious quality problem.

  However, in the present invention, the cull part 3 and the dummy cavity 4 that are connected to both sides of the product part cavity 2 and the resin in the pot 6 and the ejector hole 11 are sufficiently bonded to the lower mold 5. A stable mold release operation can be performed without causing the lower mold 5 and the product to peel off (FIG. 1B).

  In addition, until now, when using a release film on the upper mold surface and clamping the interposer, which is an organic substrate, with high pressure, sticking has occurred between the interposer and the film. Then, since the dummy cavity 4 and the product cavity 2 are connected, the product cavity 2 on the interposer 10 having no anchor at the bottom, and the resin on the side of the cull 3 having an anchor effect on the lower mold Since the resin on the dummy cavity 4 side is arranged, the adhesive force to the lower mold is also directly applied to the resin on the interposer 10 through the resin on both sides of the cull part 3 and the dummy cavity 4 side. Therefore, the semiconductor device is not stuck to the upper mold 1 and pulled. Further, by increasing the anchor effect, it is not necessary to perform suction by the suction holes 9 when the upper mold 1 is released.

  The suction by the suction hole 9 to the interposer 10 is stopped, and the resin and the interposer 10 filled with the plunger 7 and the ejector pin 8 are separated from the lower mold 5 by the lower mold 5 being lowered. In the semiconductor device in which the mold release has been completed, since the resin sealing portion on the product portion cavity 2 side is thin in both the cull portion 3 and the dummy cavity 4, this unnecessary portion can be easily separated in a later process.

  Although the present invention has been described above, the shape of each part may be variously changed. For example, in FIG. 1, the cull part 3 and the dummy cavity 4 formed in the upper mold 1 can be formed in the lower mold 5. .

  Further, as an anchor hole, instead of the pot 6, a method of providing an ejector hole 11 and an ejector pin 8 having the same anchor effect as the dummy cavity 4 side on the side of the cull part 3 and leaving the resin there, Alternatively, a groove having an anchor effect may be formed on each of the cull portion 3 side and the dummy cavity 4 side, and a resin may be filled therein to bite. In addition, the anchor hole is not formed directly in the cull portion 3 and the dummy cavity 4, but may be formed in a runner or gate that communicates with the cull portion 3 and the dummy cavity 4, or a plurality of them may be formed. .

  Further, in FIGS. 1 and 2, the resin of the cull part 3 and the dummy cavity 4 is formed in a straight line with the product part cavity 2 in between. For example, the pot 6 and the ejector hole 11 serving as anchor holes. Regardless of the position on the straight line, the product resin cavity 2 (or the interposer 10) is interposed between the resin part and the interposer 10 so that the filled resin and the interposer 10 are not brought to the upper mold 1, and on the opposite side (both sides). good. Further, the positions of the cull portion 3 and the dummy cavity 4 may not be on a straight line.

It is the schematic of the cross section which shows one Embodiment of the resin sealing apparatus and resin sealing method of the semiconductor device of this invention. It is the schematic from the upper surface which shows one Embodiment of the resin sealing apparatus and resin sealing method of the semiconductor device of this invention. It is the schematic of the cross section which shows the resin sealing apparatus and resin sealing method of the conventional semiconductor device.

Explanation of symbols

1 Upper mold 2 Product part cavity 3 Cull part 4 Dummy cavity 5 Lower mold 6 Pot 7 Plunger 8 Ejector pin 9 Adsorption hole 10 Interposer 11 Ejector hole

Claims (8)

A cull part for injecting resin into the cavity in at least one of the pair of molds having a cavity serving as a resin sealing part in one of the pair of molds facing each other And a dummy cavity serving as a resin pool portion of the resin flowing out of the cavity, and filling the cavity with resin to seal only one side of the substrate on which the semiconductor element is mounted with resin sealing of the semiconductor device Stopping device,
The other mold having no cavity is provided with an anchor hole that communicates with the cull portion and the dummy cavity on the opposite side of the one mold facing each other with the cavity therebetween. A resin sealing device for a semiconductor device. In the resin sealing device of the semiconductor device according to claim 1,
The resin sealing device is
Means for sandwiching the substrate between the pair of molds after setting the substrate so that the mounting surface of the semiconductor element faces the cavity side in the pair of molds in a separated state;
Means for filling the cavity, the dummy cavity and the anchor hole with resin from the cull portion;
The anchor holes leading to the cull part and the dummy cavity are respectively
After curing the filled resin, when releasing the one mold, the anchor effect is sufficient to keep the filled resin and the substrate fixed to the other mold. A resin sealing device for a semiconductor device, comprising an opening area and a depth filled with a predetermined volume of resin. In the resin sealing device of the semiconductor device according to claim 1 or 2,
A resin sealing device for a semiconductor device, wherein the anchor hole is provided with a resin push-out mechanism that moves forward and backward in the anchor hole. In the resin sealing device of the semiconductor device according to claim 2 or 3,
On the other mold side of the resin sealing device, a plunger for resin press-fitting into the cull part, a pot serving as the anchor hole leading to the cull part in which the plunger moves forward and backward, and the dummy cavity An ejector hole serving as the anchor hole that leads to and an ejector pin that moves back and forth inside and outside the ejector hole,
When the resin in the pot is press-fitted with the plunger to fill the cavity and the dummy cavity from the cull portion, the top of the plunger is stopped at a predetermined position in the pot, and the pot is placed in the pot. Means for leaving a predetermined volume of resin and stopping the top of the ejector pin in the ejector hole and filling the predetermined volume of resin in the ejector hole; and
After the resin filled in the cull part, the cavity, the dummy cavity, the pot, and the ejector hole is cured, the mold is provided at least on the other mold when releasing the one mold. The resin filled in the pot and the ejector hole stays in the pot and the ejector hole, so that the resin filled in the cull part, the cavity, and the dummy cavity and the substrate are the other mold. Means for keeping only the one mold and keeping the state fixed to,
The plunger and the ejector pin operate to push out the resin filled in the pot and the ejector hole from the other mold, respectively, so that the cull part and the dummy cavity are removed from the other mold. And a resin filled in the anchor hole and a means for separating the substrate. A cull part for injecting resin into the cavity in at least one of the pair of molds having a cavity serving as a resin sealing part in one of the pair of molds facing each other And a resin sealing method including a dummy cavity that serves as a resin pool of resin that has flowed out of the cavity, and is a resin sealing method for a semiconductor device in which only one surface of a substrate on which a semiconductor element is mounted is resin sealed. And
Setting the substrate on the pair of molds in a separated state so that the mounting surface of the semiconductor element faces the cavity, and then sandwiching the substrate with the pair of molds;
The resin is filled from the cull portion into the cavity and the dummy cavity, and is provided on the other mold not having the cavity, and disposed on the opposite side with the cavity of the one mold facing each other. Filling a predetermined volume of the resin into anchor holes that respectively lead to the cull portion and the dummy cavity;
After curing the resin filled in the cull part, the cavity, the dummy cavity, and the anchor hole, when releasing the one mold, at least the anchor hole provided in the other mold When the filled resin stays in the anchor hole, the resin filled in the cull part, the cavity, and the dummy cavity and the substrate are kept fixed to the other mold, and the one mold Releasing only the mold,
A resin sealing method for a semiconductor device, comprising the step of separating the resin and the substrate filled in the cull part, the dummy cavity, and the anchor hole from the other mold. In the resin sealing method of the semiconductor device according to claim 5,
The anchor hole is provided with a resin push-out mechanism that moves back and forth in the anchor hole,
The resin filled in the anchor hole is pushed out from the other mold by the resin extrusion mechanism, and the resin filled in the cull part, the dummy cavity, and the anchor hole from the other mold, and the substrate. The resin sealing method of the semiconductor device characterized by including the process of releasing | separating. In the resin sealing method of the semiconductor device in any one of Claim 5 or Claim 6,
On the other mold side of the resin sealing device, a plunger for resin press-fitting into the cull part, a pot serving as the anchor hole leading to the cull part where the plunger moves forward and backward, and the dummy cavity An ejector hole serving as the anchor hole that leads to and an ejector pin that moves back and forth inside and outside the ejector hole,
When the resin in the pot is press-fitted with the plunger to fill the cavity and the dummy cavity from the cull portion, the top of the plunger is stopped at a predetermined position in the pot and the pot is placed in the pot. Leaving a predetermined volume of resin, stopping the top of the ejector pin in the ejector hole, and filling the ejector hole with the predetermined volume of resin; and
After curing the resin filled in the cull part, the cavity, the dummy cavity, and the anchor hole, when releasing the one mold, at least in the pot provided in the other mold The resin filled in the ejector hole stays in the pot and the ejector hole, so that the resin filled in the cull part, the cavity, and the dummy cavity and the substrate are fixed to the other mold. Maintaining a state where only one mold is released, and
By the operation of the plunger and the ejector pin, the resin filled in the pot and the ejector hole is pushed out from the other mold, so that the cull part, the dummy cavity and the anchor are removed from the other mold. A resin sealing method for a semiconductor device, comprising: a step of separating the resin filled in the hole and the substrate. In the resin sealing method of the semiconductor device in any one of Claims 5 thru | or 7,
The substrate to be resin-sealed is a collective substrate for forming a plurality of semiconductor devices, and the plurality of semiconductor devices on the collective substrate are collectively sealed by a single cavity. Stop method.

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