JP2005129611A - Electronic component package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component package adapted to miniaturization and the reduction of cost. <P>SOLUTION: In the electronic component package, a lid member is overlapped with a ceramic vessel so that a sealing member arranged at a peripheral edge on one face of a metallic lid member and a plane shape having a recessed part on an upper face are brought into contact with a metallized part formed on the upper face of an outer peripheral frame of the rectangular ceramic vessel, and the electronic component stored in the recessed part of the ceramic vessel is hermetically sealed by fixing the sealing member and the metallized part. The length of the side of the ceramic vessel is 3.2 mm or less, the thickness is 1.0mm or less, and the thickness of the outer peripheral frame is 0.3 to 0.5 mm. An electrode for seam welding is made to abut only on one side of the ceramic vessel and seam welding is performed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component package for coping with downsizing and cost reduction.

  Electronic devices including piezoelectric vibrators and SAW filters and other electronic devices used in these communication devices have been downsized and reduced due to rapid progress in cost reduction and downsizing with the spread of mobile communication devices such as mobile phones. The demand for lower prices is increasing. For example, in order to keep the frequency stability of a piezoelectric component highly stable, an electronic component package used for an electronic device is generally sealed in a high vacuum state or an inert gas sealed state. . As described above, in order to keep the inside of the package container in a high vacuum or in an inert gas sealed state, the metal lid and the container are usually joined using a seam welding method.

Hereinafter, a conventional electronic component package will be described.
Conventional electronic component packages include those proposed in, for example, Japanese Patent Laid-Open No. 2000-3973. FIG. 3 is a longitudinal sectional view showing the configuration of a conventional electronic component package and its sealing method. .
As shown in the figure, a ceramic container 101 having a recess on the upper surface and a metal lid member 202 for closing the opening of the recess are provided. The lid member 202 has a layer of a silver-based alloy having a liquidus temperature of 957 ° C. or a metal brazing material 204 clad with another metal-based alloy on at least one surface of the metal plate 203 of an iron-nickel-cobalt-based alloy. Is provided. An electronic component 104 is accommodated in the recess of the ceramic container 101, and a metallized portion 201 such as tungsten or molybdenum plated with nickel or gold is provided on the outer peripheral frame 102 of the ceramic container 101. It has been. The metallized portion 201 and the metal brazing material 204 are overlapped, and the metallized portion 201 and the metal brazing material are energized while pressing and energizing the pair of roller electrodes 103 along the opposing sides of the lid member 202. 204 is continuously spot-welded (seam welded), whereby the inside of the package is kept airtight.

Seam welding is capable of sealing in a short time and does not require (pre) heating time of the electronic component package, so that the productivity is excellent and the cost of the electronic device can be reduced. In addition, since only the sealing portion is heated, there is no thermal shock to the electronic component 104, and the ceramic container 101 has a sufficient thickness of the ceramic material that is a structural material thereof. Since it is not damaged, an electronic device excellent in long-term stability of electrical characteristics can be obtained.
JP 2000-3973 A

However, there is a demand for downsizing of electronic devices, for example, for electronic parts having a surface dimension of 3.2 × 2.5 × thickness 1.0 mm and a thickness of the outer peripheral frame 102 of 0.5 mm or less in a surface-mount crystal resonator. When a package is used, cracks (cracks) occur in the outer peripheral frame 102 due to the thermal shock of seam welding or the difference in thermal expansion / shrinkage between the metal plate 203 and the ceramic container 101, particularly the shrinkage stress. That is, there was a case where hermetic sealing could not be performed. Even if the sealing is completed, the electronic component 104 accommodated in the ceramic container 101 is thermally damaged by the high temperature heating in the sealing, and the electrical characteristics of the electronic component (electronic device using the electronic component) are long-term stable. There is a possibility that the problem that the sufficient amount cannot be obtained.
In addition, due to the principle of seam welding, since seam welding must be performed on the entire circumference of the overlapping portion of the ceramic container 101 and the metal plate 203, there is a limit to shortening manufacturing tact time, that is, cost reduction. It was.

  That is, the problem to be solved is that it is impossible to provide an electronic component package that can be reduced in size and cost.

  In order to solve the above-mentioned problem, the invention according to claim 1 according to the present invention is a ceramic container having a rectangular planar shape including a sealing member disposed on a peripheral portion of at least one surface of a metal lid member and a concave portion on the upper surface. The lid member and the ceramic container are overlapped so that the metallized part formed on the upper surface of the outer peripheral frame is in contact with each other, and the sealing member and the metallized part are fixed and accommodated in the concave part of the ceramic container. An electronic component package for hermetically sealing an electronic component, wherein a side length of the ceramic container is 3.2 mm or less and a thickness is 1.0 mm or less, and a thickness of the outer peripheral frame is 0. It is 3 to 0.5 mm, and the seam welding electrode is brought into contact with only a pair of opposing sides of the ceramic container to perform seam welding.

  According to a second aspect of the present invention related to the present invention, in the first aspect, the seam welding electrode is brought into contact with only the long side of the ceramic container to perform seam welding.

  A third aspect of the invention according to the present invention is characterized in that, in the first or second aspect, the sealing member is a material exhibiting a melting point of 400 ° C. or lower.

  According to a fourth aspect of the present invention related to the present invention, in any one of the first to third aspects, the sealing member is a gold-based alloy.

  Since the electronic component package of the present invention can be sealed only in one side and in a short time, the productivity associated with shortening the sealing work time and the yield associated with suppressing thermal damage to the package container. As a result, the electronic device can be reduced in price. In addition, when the electronic component package according to the present invention is used, sealing can be performed with a minimum amount of heat (amount), so that there is no thermal shock to the electronic component (contained in the electronic component package). It has the effect that the electronic device excellent in the long-term stability of the mechanical characteristics is obtained.

FIG. 1 is an explanatory diagram of an electronic component package and its sealing method according to an embodiment of the present invention.
As shown in the figure, an electronic component package according to an embodiment of the present invention includes a ceramic container 1 having a substantially rectangular planar shape with a recess on the upper surface, and a metal lid member 12 that closes the opening of the recess. ing. An electronic component 4 is mounted on the bottom surface of the concave portion of the ceramic container 1, and the top surface of the outer peripheral frame 2 standing so as to surround the concave portion of the ceramic container 1 is, for example, tungsten plated with nickel or gold. Alternatively, a metallized portion 11 such as molybdenum is provided. The lid member 12 is a gold-based alloy mainly composed of gold on at least one side of a metal plate 13 of an iron-nickel-cobalt-based alloy. For example, Au (gold) -Sn having a melting point in the range of 270 ° C. to 290 ° C. A (tin) alloy sealing member 14 is provided. As a method of preforming the sealing member 14 on the metal plate 13, the foil-like sealing member 14 is pasted into a predetermined shape by sticking the foil-like sealing member 14 to the metal plate 13 by cold rolling or the like. A paste-like sealing member is attached to the peripheral portion of the metal plate 13 by reflow heating and attached by reflow heating, or Au and a lower surface of the metal plate 13 (surface opposed to the recess) are attached. There is a method of forming an Au—Sn alloy layer (sealing member) by depositing Sn by a plating method and heat-treating it.

  In the sealing method according to the present invention, the metallized portion 11 and the sealing member 14 are overlapped, and a pair of roller electrodes 3 are provided to face each other only on the long side or the short side of the lid member 12. The metallized portion 11 and the sealing member 14 are continuously spot welded (seam welded) by applying pressure and energization along the side. As described above, the Joule heat generated by the current supplied from the roller electrode 3 is 290 ° C. or higher which is the melting point of the sealing member 14 (Au—Sn alloy), and the ceramic container 1 is thermally damaged. When one side portion of the lid member 12 is heated at a non-temperature, for example, in the range of 300 ° C. to 400 ° C. (that is, seam welding is performed), the sealing member 14 has a small heat capacity, so that the Joule heat is sealed. As a result, the sealing member formed on the other side where the roller electrode 3 is not in contact can be melted. In this way, by seam welding only one pair of opposing sides, the inside of the package (the electronic component 4 accommodated in the recess) is hermetically sealed without causing thermal damage to the ceramic container 1. Can be stopped. In addition, when the planar shape of the ceramic container 1 is not square, it is desirable to perform seam welding on the long side. Compared with the case where seam welding is performed on the short side, it is more effective in preventing the occurrence of defects due to unmelted or uneven melting of the sealing member 14 on the other side.

  In the above embodiment of the present invention, the number of energizations in seam welding (the number of heat generation at the welded part due to the welding current) is reduced, so there is almost no thermal shock due to seam welding (Joule heat), and the temperature rise during sealing is suppressed. can do. In addition, cracks are generated in the outer peripheral frame 2 even in a package for electronic components in which the planar dimension is poor with mechanical strength of 3.2 × 2.5 × thickness of 1.0 mm or less and the outer peripheral frame 2 has a thickness of 0.3 mm. Confirmed that there is nothing to do. Therefore, if the present invention is used, not only the sealing time can be shortened, but also the electronic component having a planar dimension of 3.2 × 2.5 × thickness of 1.0 mm or less and a thickness of the outer peripheral frame 2 of 0.3 to 0.5 mm. If it is a package for use, the ceramic container 1 can be sealed without causing thermal damage.

FIG. 2 is a longitudinal sectional view showing a configuration of an electronic component package as a second embodiment of the present invention and a sealing method thereof.
The second embodiment is different from the embodiment shown in FIG. 1 (first embodiment) in that the lid member 12 is sealed only on the peripheral edge of one surface of the metal plate 13 (the surface facing the recess). The stop member 14 is formed. In this way, if the sealing member 14 is formed in a limited manner, the waste of the sealing member 14 generated when the sealing member 14 is melted at the time of sealing scatters on the surface of the electronic component, and the electric power of the electronic component It is possible to prevent the occurrence of poor mechanical characteristics. Moreover, if the dimension of the said cover member 12 is made smaller than the outer periphery of the said ceramic container 1 about 0.1 mm-0.2 mm, for example, it will become easy to form the fillet by a sealing member in the periphery of the cover member 12 after sealing, Needless to say, one layer of sealing strength can be obtained.

  Also in the second embodiment, as in the first embodiment, there is almost no thermal shock due to seam welding (Joule heat), and the planar dimensions are 3.2 × 2.5 × thickness 1. Even in an electronic component package having a thickness of 0 mm or less and a thickness of 0.3 to 0.5 mm of the outer peripheral frame 2, no cracks are generated in the outer peripheral frame 2.

  As described above, the embodiment of the present invention has been described using the configuration in which the sealing member is provided only on one side of the lid member. However, the present invention is not limited to this, and the sealing member is provided on both sides of the lid member. Even if there is, the function equivalent to the package structure of FIG. 1 can be obtained, and further, it can be sealed without confirming the front and back of the lid member, that is, the surface on which the sealing member is disposed, during the sealing operation. Needless to say, it is excellent in workability.

  Further, the Au-Sn alloy has been described as the sealing member 14 having a melting point of 400 ° C. or lower, but the present invention is not limited to this, and any metal material having a melting point of 400 ° C. or lower such as solder may be used. .

  With this configuration, it is possible to obtain an electronic component package corresponding to downsizing and cost reduction.

It is explanatory drawing of the package for electronic components as embodiment of this invention, and its sealing method. (A) Longitudinal sectional view. (B) Plan view It is a longitudinal cross-sectional view which shows the structure of the package for electronic components as other form of implementation of this invention, and its sealing method. It is a longitudinal cross-sectional view which shows the structure of the conventional package for electronic components, and its sealing method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,101 .. Ceramic container 2, 102 ... Peripheral frame 3, 103 ... Roller electrode 4, 104 ... Electronic component 11, 201 ... Metallized part 12, 202 ... Lid 13, 203 ... Metal plate 14 -Sealing member 204-Metal brazing material

Claims (4)

The lid member is arranged such that the sealing member disposed on the peripheral edge of at least one surface of the metal lid member and the metallized portion formed on the upper surface of the outer peripheral frame of the ceramic container having a concave shape on the upper surface are in contact with each other. And an electronic component package that hermetically seals the electronic component accommodated in the concave portion of the ceramic container by overlapping the ceramic container and fixing the sealing member and the metallized portion,
The length of the side of the ceramic container is 3.2 mm or less and the thickness is 1.0 mm or less, and the thickness of the outer peripheral frame is 0.3 to 0.5 mm. A package for electronic parts, wherein a seam welding electrode is brought into contact with only a side portion of the set to perform seam welding. 2. The electronic component package according to claim 1, wherein a seam welding electrode is brought into contact with only the long side of the ceramic container to perform seam welding. The electronic component package according to claim 1, wherein the sealing member is a material exhibiting a melting point of 400 ° C. or less. The electronic component package according to claim 1, wherein the sealing member is a gold alloy.

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