JP2005129236A - Ic card and manufacturing method of ic card as well as thin battery for ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a battery built-in IC card in which seal destruction of a battery is hard to occur at heat lamination. <P>SOLUTION: The manufacturing method of the IC card is provided with a battery housing process in which a cavity 79 for a battery housing is formed by overlaying an inner sheet 73 and a first over sheet 74 onto a core sheet 72 in which a through port 79a is installed, and a heat lamination process in which a second over sheet 75 is arranged in such a shape that a cap is placed on the cavity 79 and in which they are pressurized and heated from above and below, and adhered mutually. A spacer 25 is interposed between a seal part 11 of a thin-type battery 1 and a second over sheet 75, and the heat laminating process is carried out so that pressurizing force is added to a seal part 11 via that spacer 25. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an IC card, an IC card manufacturing method, and a thin battery for an IC card.

  As a storage medium replacing a magnetic card, an IC card with a built-in storage element and microcomputer attracts attention. As a power supply method for storing information or for executing computation, a method using an electromotive force due to electromagnetic induction or a method of supplying power using a built-in battery is known. The former is excellent in that it is not necessary to consider the battery life, but there is an inconvenience that information stored in the IC card cannot be confirmed in a place where there is no dedicated reader / writer. In order to provide and operate a display unit such as a liquid crystal panel, a built-in battery is required. In addition, by using the above two power supply methods in combination, it is expected that the power can be stably supplied and the multi-function of the IC card can be achieved.

  The battery incorporated in the IC card must be thin. For example, in the thin lithium primary battery 1 shown in FIGS. 9 and 10, an electrode tank constituted by metal current collectors 7 and 8 and resin frame-like sheet members 2 and 3 is partitioned by a separator 9, and a positive electrode active material 6 and the negative electrode active material 5 are accommodated. The thickness of the frame-shaped sheet members 2 and 3 is adjusted to be as small as possible so that the penetration of moisture into the battery is minimized. As a result, the main body portion 12 surrounded by the outer peripheral portion 11 (hereinafter also referred to as the seal portion 11) of the battery has a shape that rises like a plateau.

On the other hand, as a method for manufacturing an IC card, a method of thermally laminating a plurality of resin sheets is common. Specifically, a core sheet having a through hole is stacked on an inner sheet that supports built-in components such as a battery and an IC module to form a cavity for battery storage or IC storage, and an oversheet is stacked from above and below. These are then heat laminated (thermocompression bonding) together.
JP 05-266268 A Japanese Patent Laid-Open No. 10-024685

  However, in the above heat laminating process, a large pressure is applied to the battery, and seal breakage may occur, causing the electrode active material to leak out. This defect is likely to occur in a battery in which a portion weak to pressure is formed thick like the thin battery 1 of FIG. In the heat laminating process of the IC card, the pressing conditions are set at a low temperature and a low pressure as compared with the conventional magnetic card manufacturing, but it is difficult to completely prevent the battery seal from being broken by adjusting the pressing conditions.

  Further, even when the IC card is carried in a wallet or the like and carried, there is a possibility that the seal breakage similar to that at the time of manufacture may occur. The occurrence of such defects cannot be avoided by adjusting the pressing conditions during thermal lamination.

  Further, in a battery that does not have a hard container such as a coin battery, the change in battery shape accompanying the movement of the active material of one electrode to the other electrode is relatively large. While using the IC card, there is a concern that the shape change of the battery appears on the surface of the IC card. Although there is no big problem in the function of the IC card itself, there is a problem that the aesthetics deteriorate. For this reason, a user desires an IC card with a built-in battery with little shape change based on the shape change of the battery.

  For example, regarding the lithium primary battery having the configuration shown in FIGS. 9 and 10, the thickness of the battery decreases as the discharge proceeds. Then, what is firmly fixed in the card at the time of manufacture of the IC card gradually becomes wobbled. The wobbling of the battery in the card is not a welcome thing considering the connection reliability between the card side terminal and the battery terminal.

  In view of the above problems, an object of the present invention is to provide a battery built-in type IC card that is less likely to cause battery seal breakage during actual use. Another object of the present invention is to provide a method for manufacturing an IC card with a built-in battery, which is less likely to break the battery seal during thermal lamination as well as during actual use. Another object of the present invention is to provide a battery built-in type IC card that is excellent in aesthetics with little shape change based on the shape change of the battery, and a method for manufacturing the same. Another object is to provide an IC card with a built-in battery in which the battery is firmly fixed in the card from the start of use to the end of use, and a method for manufacturing the same. Another object is to provide a thin battery that can be suitably used for these IC cards.

Means for Solving the Problems and Effects of the Invention

  In order to solve the above problems, the first of the IC cards of the present invention is that the internal airtightness is maintained by a seal portion in which a resin frame-like sheet member is bonded to the outer peripheral portion of the metal current collector plate, and the thickness of the seal portion is increased. A sheet-shaped thin battery that is adjusted to be smaller than the thickness of the main body surrounded by the seal portion is accommodated in a cavity formed by cutting through the core sheet, and the upper sheet is covered with the cavity. The main feature of the IC card formed by heat laminating is that a spacer in close contact with the seal portion of the thin battery and the upper sheet is interposed.

  According to the present invention, since the spacer is inserted between the seal part of the thin battery and the upper sheet, the pressure applied to the surface of the IC card during actual use reaches the battery seal part via the spacer. Therefore, it is possible to prevent the applied pressure from being concentrated on the main body. The seal part is much stronger than the main body part against the pressure in the thickness direction. Therefore, the malfunction which leaks from an electrode active material is prevented. At the same time, the battery seal is prevented from being broken in the heat laminating process at the time of manufacture. In addition, since the spacer is interposed between the sealing portion of the battery and the oversheet, the battery is firmly fixed in the card.

  The manufacturing method of the IC card is as follows. That is, the internal airtightness is maintained by the seal portion in which the resin frame-like sheet member is bonded to the outer peripheral portion of the metal current collector plate, and the thickness of the seal portion is larger than the thickness of the main body portion surrounded by the seal portion. A battery manufacturing process for manufacturing a plate-shaped thin battery that is adjusted to a small size, and a core sheet provided with a through-hole to overlap the lower sheet to form a battery housing cavity, in which the thin battery is accommodated and the cavity In a method for producing an IC card, including a battery housing step of arranging an upper sheet in a form of a lid, and a heat laminating step of pressurizing and heating the core sheet, the lower sheet and the upper sheet from above and below, Insert a pre-shaped spacer between the seal part of the thin battery and the upper sheet, and heat pressure is applied to the seal part through the spacer. The is mainly characterized in that to perform.

  According to the method of the present invention, in the heat laminating step, the pressure from the press machine reaches the seal portion via the spacer, and the pressure can be prevented from concentrating on the main body portion. The seal part is much stronger than the main body part against the pressure in the thickness direction. Therefore, the malfunction which leaks from an electrode active material is suppressed. At the same time, the occurrence of seal breakage during actual use of the IC card is also prevented. In addition, since the spacer is interposed between the sealing portion of the battery and the oversheet, the battery is firmly fixed in the card.

  As a method of obtaining the same effect, a method of injecting molten resin after housing the battery in the cavity can be considered, but the number of processes is inevitably increased, and an expensive mold or injection molding apparatus is required. Costs also increase. Therefore, a method of inserting a pre-formed spacer as in the present invention is preferable.

  The spacer may be attached to the thin battery in advance. That is, the thin battery for an IC card of the present invention is a thin battery used for an IC card obtained by thermally laminating a plurality of layers of resin sheets, and is a resin frame-like sheet on the outer periphery of a metal current collector plate. The member has a bonded seal part, the thickness of the seal part is smaller than the thickness of the main body part surrounded by the seal part, and a spacer is attached to the main surface of the seal part. The main feature is that the total thickness of the spacer and the spacer is adjusted to be equal to or greater than the maximum thickness of the main body. According to this, it is possible to provide a battery built-in type IC card in which the battery seal is hardly broken during actual use. In addition, it is possible to effectively suppress the battery seal breakage even in the heat laminating process when manufacturing the IC card.

  In order to solve the problem, the second of the IC card of the present invention is that the internal airtightness is maintained by a seal portion in which a resin frame-like sheet member is bonded to the outer peripheral portion of the metal current collector plate. A plate-shaped thin battery whose thickness is adjusted to be smaller than the thickness of the main body surrounded by the seal part is housed in a cavity formed by cutting through the core sheet, and the upper part is covered with the cavity In an IC card in which a sheet is heat-laminated, the size of the sheet-like spacer having rubber elasticity is adjusted so as to fit in the cavity, and the sheet is inserted so as to be in close contact with both the thin battery and the upper sheet. Features.

  According to the present invention, it is possible to perform the IC card heat laminating step so that the spacer is elastically deformed. Then, a stationary load is always applied to the thin battery, and the thin battery is firmly fixed in the IC card. Also, when the battery is consumed and its thickness is reduced, the spacer elastically recovers following the change in thickness, so that the failure of the battery thickness is transferred to the surface of the IC card or the IC Occurrence of problems such as battery wobbling in the card is suppressed. Therefore, the battery is firmly fixed in the card from the start of use to the end of use, and an IC card having excellent aesthetics can be realized. In addition, since the soft elastic sheet contributes to in-plane uniformity of the pressure applied to the main body of the battery, an effect of suppressing the battery seal breakage in the thermal laminating process can be expected.

  The manufacturing method of the IC card is as follows. That is, in the IC card manufacturing method including the battery manufacturing process, the battery housing process, and the thermal laminating process already described, a sheet-like spacer having rubber elasticity preliminarily molded to a size that can be accommodated in the cavity is replaced with a thin battery. The main feature is that it is inserted so as to be in close contact with both the upper sheet and the heat laminating process.

  According to the method of the present invention, it is possible to perform the IC card heat laminating step so that the spacer is elastically deformed. Then, a stationary load is always applied to the thin battery. Therefore, the thin battery can be firmly fixed in the IC card. Since the soft elastic sheet contributes to the in-plane uniformity of the pressure applied to the main body of the battery, the effect of suppressing the battery seal breakage in the thermal laminating process can also be expected.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a schematic sectional view of an IC card 100 according to the present invention, and FIG. 2 is a block diagram of the IC card 100. The IC card 100 includes an IC module 20, a thin battery 1, a display unit 22, and the like. The IC module 20 is obtained by modularizing electronic components such as an IC chip and a capacitor. The thin battery 1 supplies power to the IC module 20, the display unit 22, and the like. In addition, an antenna coil unit for supplying power by electromagnetic induction and transmitting / receiving data can be provided (not shown).

  As shown in FIG. 1, in the IC card 100, a first oversheet 74, an inner sheet 73, a core sheet 72, and a second oversheet 75 are laminated in this order, and these are thermally laminated together. Inside the IC card 100, a part of the core sheet 72 is cut out to form a battery housing cavity 79. The thin battery 1 is accommodated in the cavity 79. The thin battery 1 includes a seal portion 11 and a main body portion 12 having a thickness larger than that of the seal portion 11. In the card thickness direction, a spacer 25 is interposed between the seal portion 11 and the second oversheet 75 so as to be in close contact with both.

  The inner sheet 73 supports the thin battery 1, the IC module 20, and the display unit 22, and is provided with circuits for supplying power and transmitting signals. The inner sheet 73 and the first oversheet 74 may be integrated before the IC card is manufactured.

  As resin materials constituting the oversheets 74 and 75, the core sheet 72, and the inner sheet 73, PVC (polyvinyl chloride), PET-G (registered trademark of Eastman Chemical Co., USA), biodegradable resin, PET (polyethylene terf) A thermoplastic resin such as talates can be preferably used. PVC is a resin that can be heat-sealed at 140 to 150 ° C., and is generally used as a card substrate. PET-G is an amorphous polyester resin that can be heat-sealed like PVC. It has many advantageous features such as a fusion temperature of 120 to 130 ° C., which is lower than PVC, excellent bending / twisting durability, and clean combustion gas. The biodegradable resin has a fusion temperature of 130 to 140 ° C. and a relatively low temperature, but does not generate harmful gases during the incineration process, like PET-G. Furthermore, since it is decomposed into water and carbon dioxide by the action of microorganisms, landfill treatment is possible. Since PET, which is a crystalline resin, does not have heat-fusibility, it is necessary to use an adhesive such as a hot-melt adhesive. Specifically, a thin hot melt adhesive layer formed on one or both sides of a PET sheet can be used. As the hot-melt adhesive, an adhesive mainly composed of a thermoplastic resin such as polyvinyl acetate, an acrylic resin, or an ethylene-vinyl acetate copolymer can be used. In addition, additives, such as a pigment and a flame retardant, can be appropriately added to the resins shown above and used.

  Next, the thin battery 1 will be described. 9 is a perspective view of the thin battery 1, and FIG. 10 is a cross-sectional view taken along the line AA in FIG. As shown in FIGS. 9 and 10, the thin battery 1 has a rectangular plate shape, and includes a separator 9, a positive electrode active material 6 and a negative electrode active material 5 separated from each other by the separator 9, and active materials 5, 5. A pair of window frames 2, 3 (frame-like sheet member) surrounding 6 on the main surface of the separator 9, and a pair of current collector plates 7, 8 sandwiching the active materials 5, 6 between the separator 9, It has. The current collecting plates 7 and 8 also serve as an exterior material for the thin battery 1. The window frames 2, 3, and the window frames 2, 3 and the positive and negative current collecting plates 7, 8 are bonded to each other on the respective electrode sides, whereby a seal portion 11 that maintains the airtightness inside the battery is provided. Is formed. The peripheral edge of the separator 9 is sandwiched between a pair of window frames 2 and 3. The inner part surrounded by the seal part 11 is the main body part 12 of the battery. As for the 1st side (negative electrode side) of the thin battery 1, the seal | sticker part 11 and the main-body part 12 become substantially flush, and the 2nd side (positive electrode side) is exhibiting plateau shape.

  As shown in the enlarged sectional view of FIG. 11, the window frames 2 and 3 are made of base materials 2a and 3a made of a thermoplastic resin such as polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), for example. Hot-melt adhesive layers 2b and 3b such as ethylene vinyl acetate (EVA), ethylene / methacrylic acid copolymer (EMAA), acid-modified polyethylene (PE-a), and acid-modified polypropylene (PP-a) are provided on both sides. It is formed. In this embodiment, a resin sheet having a three-layer structure in which biaxially oriented polypropylene (OPP) is sandwiched between ethylene / methacrylic acid copolymers is used for the window frames 2 and 3. In the case of a thin battery used for an ISO standard (ISO / IEC 7810) IC card, the thickness of the window frames 2 and 3 is preferably 90 to 150 μm, for example. Adhesion between the window frames 2 and 3 and the current collector plates 7 and 8 and adhesion between the window frames 2 and 3 and the separator 9 are performed via the adhesive layers 2b and 3b.

  As the negative electrode active material 5 (first electrode active material), lithium flakes made of lithium metal can be used. That is, the thin battery 1 is configured as a lithium primary battery. Lithium metal means lithium or a lithium alloy. In the case of a thin battery used for an ISO standard IC card, the thickness of the lithium flake is, for example, 50 to 150 μm. As the positive electrode active material 6 (second electrode active material), for example, a material containing 60 to 70% by mass of manganese dioxide powder, 1 to 5% by mass of carbon, and 25 to 35% by mass of an electrolyte is preferably used. it can.

Examples of the electrolytic solution include an organic solvent such as dimethoxyethane (DME), ethylene carbonate (EC), and propylene carbonate (PC), and lithium such as lithium perchlorate salt (LiClO ₄ ) and lithium triflate salt (LiCF ₃ SO ₃ ). What dissolved the salt can be used. The separator 9 is a thin film-like member that separates the positive electrode and the negative electrode and allows the electrolyte to penetrate sufficiently. Specifically, the separator 9 is a sheet piece having a porous and multilayer structure made of a resin such as polyethylene or polypropylene. In the case of a thin battery used for an ISO standard IC card, the thickness is preferably 20 to 60 μm, for example.

  As the material of the current collector plates 7 and 8, one kind selected from the group of highly conductive metals made of copper, copper alloy, stainless steel, aluminum, nickel and nickel alloy can be suitably used. In particular, stainless steel is preferable because it is excellent in workability, corrosion resistance, and economy. Specifically, it is recommended to use SUS301, SUS304, SUS316, SUS316L typical as austenitic stainless steel, or SUS631 typical as precipitation hardening stainless steel.

Returning to FIG. 1, the spacer 25 will be described. The spacer 25 has a function of suppressing the pressure applied to the surface of the IC card 100 from being concentrated on the main body 12 of the thin battery 1. The seal portion 11 of the thin battery 1 is a portion that does not carry an electrode active material and is strong against pressure from the thickness direction. FIG. 3 is a partially enlarged view of FIG. As shown in FIG. 3, the total thickness D ₂ of the seal portion 11 and the spacer 25 of the thin battery 1 is adjusted to be equal to or greater than the maximum thickness D ₁ of the main body portion 12 of the thin battery 1. In this way, when surface pressure is applied to the second oversheet 75 of the IC card 100, pressure is preferentially applied to the seal portion 11 of the thin battery 1, and the effect of preventing damage to the seal portion 11 is sufficient. Can be obtained. Moreover, since it is difficult to adjust the dimensions of the spacer 25 as described above, it is difficult to fill the cavity 79 with resin. Therefore, a method of inserting a previously formed spacer 25 is employed.

  In addition, the spacer 25 can be mainly composed of a resin that is less likely to be softened by heating than the resin that constitutes the oversheets 74 and 75 and the core sheet 72. By doing so, it is possible to prevent the spacer 25 from being melted or softened in a heat laminating process described later. However, when the oversheets 74 and 75 and the core sheet 72 are made of PET, a hot melt adhesive layer is provided between the sheets, and the heating temperature in the heat laminating process depends on the softening temperature of the hot melt adhesive layer. Determined. Therefore, the spacer 25 is made of a resin that is harder to soften than the hot melt adhesive. Specifically, when a hot melt adhesive having a softening temperature of less than 150 ° C. is used, polypropylene, PET, polyimide, polycarbonate, epoxy resin, ABS (acrylonitrile-butadiene-styrene copolymer), PVC, and PEN (polyethylene One type selected from the resin group consisting of phthalate) or the like can be processed into a film shape to form the spacer 25. Note that the softening temperature of the resin is approximately equal to the glass transition temperature.

  The spacer 25 can also be mainly composed of a polymer material having rubber elasticity. Specifically, an elastomer that does not melt at the heat laminating temperature at the time of manufacturing the IC card 100 such as a silicone resin can be suitably used. When the spacer 25 has rubber elasticity, the following advantageous effects can be obtained. In the lithium primary battery (thin battery 1) shown in FIGS. 9 and 10, lithium moves to the positive electrode side by discharge, and at this time, the battery thickness tends to gradually decrease. Then, it is considered that the thin battery 1 that is firmly fixed at the time of manufacturing the IC card 100 gradually becomes wobbled in the IC card. However, if the spacer 25 is elastically deformed at the time of manufacture, even if the thickness of the thin battery 1 is reduced, the decrease is offset by the elastic recovery of the spacer 25 over time. Therefore, the trouble that the thin battery 1 wobbles in the card or the shape change of the thin battery 1 is transferred to the card surface is prevented. Further, when a static load in the thickness direction is constantly applied to the thin battery 1, the mutual adhesion of the electrode active material, the separator and the metal current collector plate is enhanced, which is advantageous from the viewpoint of reducing internal resistance.

  Moreover, it is desirable that the spacer 25 has a frame shape along the seal portion 11 of the thin battery 1. For example, a spacer can be provided along only two opposing sides of the rectangular thin battery 1, but the spacer 25 is surrounded by surrounding the main body 12 of the battery 1 as in the present embodiment. By arranging, the significant effects described so far can be obtained to the maximum.

  Further, as shown in FIG. 3, the spacer 25 may be dimensionally adjusted so that the inner peripheral edge thereof coincides with the boundary HL between the seal portion 11 and the main body portion 12 of the thin battery 1. According to this arrangement, since the spacer 25 does not reach the main body 12, damage to the main body 12 can be more effectively reduced. The outer peripheral edge of the spacer 25 is preferably matched with the outer peripheral edge of the thin battery 1. Alternatively, it may extend outward beyond the outer peripheral edge of the thin battery 1 within a range that can be accommodated in the cavity 79 of the IC card 100. For example, the spacer 251 shown in FIG. 4 extends outward beyond the outer peripheral edge of the seal portion 11 and has an L-shaped cross section along the side surface of the seal portion 11. According to this, a higher fixing effect can be expected.

  The main body 12 of the thin battery 1 is in close contact with the inner sheet 73 because it is substantially flush with the seal 11 on the first side (negative electrode side). Also on the second side (positive electrode side), the main body portion 12 is substantially in close contact with the second oversheet 75.

  The IC card 100 can be manufactured by the following procedure. Before that, the manufacturing process of the thin battery 1 will be described with reference to the process explanatory diagram of FIG. First, the current collector plate 7 on the negative electrode side is brought into surface contact with the window frame 2, and the adhesive layer of the window frame 2 is melted by an ultrasonic welding method or a heat welding method, so that the current collector plate 7 is adhered to the window frame 2. (12-1). Next, the assembly of the window frame 2 and the current collector plate 7 is turned over, and the lithium thin plate 5 as the negative electrode active material is placed on the current collector plate 7. Further, the separator 9 is placed on the lithium thin plate 5 so that the peripheral edge thereof is in surface contact with the window frame 2 (12-2). At this time, it is preferable to apply an adhesive or the like to the separator 9 or the window frame 2 in advance so that the position shift of the separator 9 does not occur.

Next, a MnO ₂ containing slurry as a positive electrode active material is printed on the main surface of the separator 9 by a thick film printing method using a metal mask (12-3). Then, the positive electrode current collector plate 8 previously bonded to the window frame 3 is placed on the slurry layer 6 (12-4). Finally, the thin battery 1 is obtained by welding the window frames 2 and 3 by bringing the ultrasonic horn 52 into contact with the current collector plate 8 while sucking air from the vacuum frame or between the window frames 2 and 3. Is obtained (12-5).

  While producing the thin battery 1, as shown in FIG. 5, the inner sheet 73 having the IC module 20, the display unit 22 and the circuit, the core sheet 72 having the through-hole 79a, the oversheets 71 and 74, and the spacer 25 are produced. . The through hole 79a of the core sheet 72 can be formed by punching or the like. The spacer 25 is adjusted to a size that just fits into the through hole 79 of the core sheet 72. Next, a cavity for battery storage is obtained by overlapping the lower sheet 80 formed of the inner sheet 73 and the first oversheet 74 on the core sheet 72 so as to close the through-opening 79a of the core sheet 72 from one surface side. 79 is formed, and the thin battery 1 is accommodated in the cavity 79. Then, the spacer 25 is placed on the thin battery 1 and the second oversheet 75 is disposed so as to cover the cavity 79 (battery housing step). In FIG. 5, for simplicity, the IC module 20, the display unit 22, and the housing unit are omitted.

  After arranging the thin battery 1 and the spacer 25 and collating each sheet as described above, the core sheet 72, the inner sheet 73 and the oversheets 71 and 74 are heated while being heated from above and below by a press machine. The sheets are bonded to each other (thermal laminating step). This heat laminating step can be performed while adjusting the temperature range in which the spacer 25 is not softened or melted. Further, the heat laminating process may be performed in a vacuum atmosphere. As described above, the IC card 100 shown in FIG. 1 can be obtained.

  It is possible to employ a method of producing a multi-piece IC card work in which a plurality of IC cards are connected to each other, and punching them out with a punch or the like to separate them into individual IC cards 100. According to this method, it is easy to collate each resin sheet, and the necessity of handling the parts one by one is reduced, so that high productivity can be realized. Further, as shown in FIGS. 13 and 14, by previously bonding the spacer 25 to the seal portion 11, it is possible to avoid the problem of positional displacement of the spacer 25 during the battery housing process and the heat laminating process. A thin battery 1 'for an IC card can be provided. That is, the spacer 25 attachment process can be incorporated into the manufacturing process of the thin battery 1 shown in FIG. Even in this case, as described with reference to FIG. 3, it is preferable to adjust the thickness of the spacer 25 so that the total thickness of the seal portion 11 and the spacer 25 is equal to or greater than the total thickness of the main body portion 12. is there.

(Second embodiment)
Next, in the IC card 101 shown in FIG. 6, the size of the sheet-like spacer 27 having rubber elasticity is adjusted so as to fit in the cavity 79, and both the main body 12 of the thin battery 1 and the second oversheet 75 are adjusted. It is the example inserted so that it may closely_contact | adhere. The size of the spacer 27 is desirably adjusted so as to be in close contact with substantially the entire main body 12. As a constituent material of the spacer 27, an elastomer having an appropriate heat resistance such as a silicone resin is suitable. Having heat resistance means that the oversheets 74 and 75, the inner sheet 73, and the core sheet 72 are not melted at the heat laminating temperature for bonding the sheets to each other to obtain the IC card 101. The thin battery 1, the oversheets 74 and 75, the inner sheet 73, and the core sheet 72 are as described above.

  The thermal laminating step when manufacturing the IC card 101 is preferably performed in a temperature range in which the oversheets 74 and 75, the inner sheet 73, and the core sheet 72 are bonded to each other and the spacer 27 is not melted. The spacer 27 is elastically deformed and gives a static load to the thin battery 1. Further, the soft spacer 27 absorbs surface irregularities of the main body portion 12 of the thin battery 1 and contributes to prevention of seal breakage. The spacer 27 may be attached to the thin battery 1 in advance.

(Third embodiment)
Next, in the IC card 102 shown in FIG. 7, the spacer sheet 29 in which the opening 29a having a size that allows the main body portion 12 of the thin battery 1 to enter and prevents the seal portion 11 from entering is formed over the second overload. This is an example inserted between the sheet 75 and the core sheet 76. The spacer sheet 29 is configured as a sheet member that is integrally bonded to both the second oversheet 75 and the core sheet 76. The opening peripheral edge portion 29b of the spacer sheet 29 is in close contact with the seal portion 11 of the thin battery 1 on the first side and is bonded to the second oversheet 75 on the second side. In other words, it can be considered that the core sheet 76 and the spacer sheet 29 form a stepped cavity and the thin battery 1 is accommodated in the stepped cavity. The thin battery 1, the oversheets 74 and 75, and the inner sheet 73 are as described above. The core sheet 76 is adjusted to be thinner than the thin battery 1 for the convenience of inserting the spacer 29.

  The spacer sheet 29 is composed of the same resin material as the oversheets 74 and 75, the inner sheet 73, and the core sheet 76, specifically, thermoplastic resin such as PVC, PET-G, biodegradable resin, and PET as described above. can do. That is, the base material of the IC card 102 and the spacer that contributes to prevention of seal damage of the thin battery 1 can be used together.

  FIG. 8 is a schematic cross-sectional view showing a state before the start of the thermal laminating process for producing the IC card 102 of FIG. The thickness of the core sheet 76 is adjusted to be larger than the thickness of the seal portion 11 of the thin battery 1. The total thickness of the core sheet 76 and the spacer sheet 29 is larger than the maximum thickness of the thin battery 1. The core sheet 76 is formed with an opening 77 a large enough to fit the thin battery 1, and the spacer sheet 29 is formed with an opening 29 a smaller than the opening 77 a of the core sheet 76. The thin battery 1 is accommodated in a stepped cavity 77 formed by the openings 29a and 77a being closed by the lower sheet 80 from one side. A slight gap is formed between the opening peripheral edge portion 29b of the spacer sheet 29 and the seal portion 11 of the thin battery 1. However, as the thermal laminating process proceeds, each sheet gradually softens, Decrease. Accordingly, the opening peripheral edge portion 29 b of the spacer 29 gradually approaches the seal portion 11 of the thin battery 1, and pressure is applied to the seal portion 11, and the applied pressure is concentrated on the main body portion 12 of the thin battery 1. It is prevented. Thereby, leakage of the electrode active material can be prevented.

  In the present specification, “mainly” means containing the largest amount by mass%. “Vacuum” means a state in which the atmospheric pressure is reduced from the atmospheric pressure.

The cross-sectional schematic diagram of 1st Embodiment of the IC card of this invention. The block diagram of an IC card. The elements on larger scale of FIG. The cross-sectional schematic diagram which shows the modification of a spacer. The exploded perspective view for demonstrating the manufacture procedure of an IC card. The cross-sectional schematic diagram of 2nd Embodiment of the IC card of this invention. The cross-sectional schematic diagram of 3rd Embodiment of the IC card of this invention. The cross-sectional schematic diagram which shows the state before the assembly of the IC card of 3rd Embodiment. The perspective view of a thin battery. Sectional drawing of a thin battery. The expanded sectional view which shows the structure of a frame-shaped sheet member. Manufacturing process explanatory drawing of a thin battery. The perspective view of the thin battery for IC cards. Sectional drawing of the thin battery for IC cards.

Explanation of symbols

1,1 'thin battery 2,3 window frame (frame-like sheet member)
5,6 Metal current collector plate 11 Sealing portion 12 Body portion 25, 27, 251 Spacer 29 Spacer sheet 72 Core sheet 73 Inner sheet (lower sheet)
74 First oversheet (lower sheet)
75 Second oversheet (upper sheet)
79 Cavity 79a Through-hole 100, 101, 102 IC card

Claims (17)

  The internal airtightness is maintained by a seal portion (11) in which a resin frame-like sheet member (2, 3) is bonded to the outer peripheral portion of the metal current collector plate (7, 8), and the thickness of the seal portion (11) is increased. A plate-shaped thin battery (1), which is adjusted to be smaller than the thickness of the main body part (12) surrounded by the seal part (11), is formed through the core sheet (72, 76). In the IC card (100, 102) in which the upper sheet (75) is heat laminated so as to be accommodated in the cavity (79, 77) and cover the cavity (79, 77), the seal of the thin battery (1) An IC card (100, 102), characterized in that a spacer (25, 29) is interposed between the portion (11) and the upper sheet (75).   The total thickness of the seal portion (11) of the thin battery (1) and the spacer (25, 29) is adjusted to be equal to or greater than the maximum thickness of the main body portion (12) of the thin battery (1). Item 1. The IC card (100, 102) according to item 1.   The spacer (25) is used to bond the resin constituting the upper sheet (75) and / or the resin constituting the core sheet (72) or the upper sheet (75) and the core sheet (72). The IC card (100) according to claim 1 or 2, wherein the IC card (100) is mainly composed of a resin that is less likely to be softened by heating than the heat-fusible resin.   The IC card (100) according to claim 1 or 2, wherein the spacer (25) is made of a polymer material having rubber elasticity.   The IC card (100) according to any one of claims 1 to 4, wherein the spacer (25) has a frame shape along the seal portion (11) of the thin battery (1).   The spacer (29) is a sheet member that is interposed between the upper sheet (75) and the core sheet (76) and is integrally bonded thereto, and the main body ( The IC card (102) according to any one of claims 1 to 3, wherein an opening (29a) having a size that allows entry of the seal portion (12) and prevents entry of the seal portion (11) is formed. ).   The internal airtightness is maintained by a seal portion (11) in which a resin frame-like sheet member (2, 3) is bonded to the outer peripheral portion of the metal current collector plate (7, 8), and the thickness of the seal portion (11) is increased. A plate-shaped thin battery (1), which is adjusted to be smaller than the thickness of the main body (12) surrounded by the seal portion (11), is a cavity formed by cutting through the core sheet (72) ( 79, in an IC card (101) in which an upper sheet (75) is thermally laminated so as to cover the cavity (79), a sheet-like spacer (27) having rubber elasticity is provided in the cavity (79). The IC card (101), the size of which is adjusted so as to fit within the thin film battery (1) and the upper sheet (75). The internal airtightness is maintained by a seal portion (11) in which a resin frame-like sheet member (2, 3) is bonded to the outer peripheral portion of the metal current collector plate (7, 8), and the thickness of the seal portion (11) is increased. A battery production process for producing a plate-shaped thin battery (1) that is adjusted to be smaller than the thickness of the main body part (12) surrounded by the seal part (11),
The core sheet (72, 76) provided with the through-holes (79a, 77a) is overlapped with the lower sheet (80) to form a battery housing cavity (79, 77), and the thin shape is formed in the cavity (79, 77). A battery housing step of housing the battery (1) and disposing the upper sheet (75) in such a manner as to cover the cavity (79, 77);
A heat laminating process in which the core sheet (72, 76), the lower sheet (80), and the upper sheet (75) are pressurized and heated from above and below to bond each other to an IC card (100, 102). In the method
A preformed spacer (25, 29) is inserted between the seal portion (11) of the thin battery (1) and the upper sheet, and the pressure is applied to the seal portion (25, 29) through the spacer (25, 29). 11) A method for manufacturing an IC card (100, 102), wherein the thermal laminating step is performed as added.   The total thickness of the seal portion (11) of the thin battery (1) and the spacer (25) is adjusted to be equal to or greater than the maximum thickness of the main body portion (12) of the thin battery (1). Manufacturing method of IC card (100, 102).   The spacer (25) is used to bond the resin constituting the upper sheet (75) and / or the resin constituting the core sheet (72) or the upper sheet (75) and the core sheet (72). The heat laminating resin is mainly composed of a resin that is not easily softened by heating, and the upper sheet (75) and the core sheet (72) are bonded to the spacer ( 25. The method of manufacturing an IC card (100) according to claim 8 or 9, wherein the method is performed in a temperature range where 25) does not melt.   The method for manufacturing an IC card (100) according to claim 8 or 9, wherein the spacer (25) is made of a polymer material having rubber elasticity.   The method for manufacturing an IC card (100) according to any one of claims 8 to 11, wherein the spacer has a frame shape along the seal portion (11) of the thin battery (1).   The sheet member formed with an opening (29a) having a size that allows the main body (12) of the thin battery (1) to enter and prevents the seal (11) from entering the upper battery (75). The manufacturing method of the IC card (102) of any one of Claims 8 thru | or 10 inserted as said spacer (29) integrally adhere | attached between both of them and the said core sheet (76). The internal airtightness is maintained by a seal portion (11) in which a resin frame-like sheet member (2, 3) is bonded to the outer peripheral portion of the metal current collector plate (7, 8), and the thickness of the seal portion (11) is increased. A battery production process for producing a plate-shaped thin battery (1) that is adjusted to be smaller than the thickness of the main body part (12) surrounded by the seal part (11),
The lower sheet (80) is overlapped on the core sheet (72) provided with the through hole (79a) to form a battery housing cavity (79), and the thin battery (1) is housed in the cavity (79). A battery accommodating step of disposing the upper sheet (75) in such a manner as to cover the cavity (79);
In the method of manufacturing an IC card (101), including a heat laminating step of pressing and heating the core sheet (72), the lower sheet (80) and the upper sheet (75) from above and below,
A sheet-like spacer (27) having rubber elasticity preliminarily molded to fit in the cavity (79) is inserted so as to be in close contact with both the thin battery (1) and the upper sheet (75), A method of manufacturing an IC card (101), wherein the heat laminating step is performed.   A thin battery (1 ') used for an IC card (100) obtained by heat laminating a plurality of resin sheets (72, 73, 74, 75) to each other, comprising a metal current collector plate (7, 8) A main body portion having a seal portion (11) having a resin-made frame-like sheet member (2, 3) bonded to the outer peripheral portion, the thickness of the seal portion (11) being surrounded by the seal portion (11) It is smaller than the thickness of (12), a spacer (25) is attached to the main surface of the seal portion (11), and the total thickness of the seal portion (11) and the spacer (25) is A thin battery (1 ') for an IC card, wherein the thickness is adjusted to be equal to or greater than the maximum thickness of the main body (12).   The IC card thin battery (1 ') according to claim 15, wherein the spacer (25) is a resin sheet member having a frame shape along the seal portion (11). The thin battery (1 ') for an IC card according to claim 15 or 16, which is a lithium primary battery using lithium or a lithium alloy as the negative electrode active material (5) and an oxide of a transition metal as the positive electrode active material (6).

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