JP2005123338A - Cooling jacket structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling jacket structure which has a cooling efficiency higher than that of the conventional cooling jacket and can reduce the flowing route resistance of a coolant, and shows highly efficient and uniform cooling operation with the structure to particularly obtain the heat exchange efficiency matched with thermal distribution of an electronic component. <P>SOLUTION: The cooling jacket structure 100 includes an inlet port 111 for introducing the coolant, an exit port 112 for discharging the coolant, and a coolant path formed between the inlet port and the exit port. The coolant path also includes the paths 100X, 100Y extending in the shape of an eddy around the central area. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a cooling jacket structure, and more particularly to a cooling jacket structure suitable for cooling electronic components and capable of being downsized.

  Conventionally, as a method of cooling electronic parts having a large heat generation amount such as a CPU and a power transistor, there is an air cooling method in which these electronic parts are brought into thermal contact with a heat radiator provided with fins and the heat radiator is cooled by a fan or the like. In general, the amount of heat generated is increasing due to the high integration of electronic components in recent years, and therefore a refrigerant (water cooling) method has been adopted.

  In this refrigerant system, a cooling jacket formed with a refrigerant passage in the interior is brought into thermal contact with the electronic component, and the refrigerant cooled by passing through a heat radiating portion (radiator) is supplied to the refrigerant passage. A cooling action is obtained (see, for example, Patent Document 1 below).

In addition, as a structure and manufacturing method of the water-cooled jacket, the groove is formed on the surface of the jacket body, and then the lid is attached to the surface of the jacket body, so that the flow path is configured by the grooves formed on the surface of the jacket body. A water-cooled jacket is known (see, for example, Patent Document 2 below).
JP 2000-340727 A JP-A-10-196940

  However, in the above-described conventional cooling jacket structure, since the flow path has a shape in which straight lines are connected to secure the flow path area, a corner portion is formed in the middle of the flow path, so that the flow of the refrigerant is increased. Because it tends to be laminar, the flow rate of the refrigerant is greatly different between the peripheral part near the wall surface of the flow path and the central part, and a refrigerant retention area is formed in the flow path. There is a problem that it is difficult to obtain efficiency. In particular, in the case of a cooling jacket built in a portable electronic device or the like, it is necessary to achieve both downsizing and cooling capacity. However, in the above situation, the cooling efficiency cannot be increased. When the size is reduced, the cooling capacity is rapidly reduced.

  In addition, since the channel shape having the corners as described above increases the channel resistance, the driving load of the refrigerant pump increases, which makes it difficult to reduce the size of the entire cooling system.

  Furthermore, in electronic components, the temperature at the center of the component is usually the highest, and the temperature gradually decreases as it approaches the periphery. However, in a cooling jacket having a meandering channel as in the above-described conventional example, The temperature at the inlet is low, but the temperature at the outlet of the refrigerant is high, so the heat exchange distribution is not consistent with the thermal environment of the electronic components, resulting in poor cooling efficiency and uniform electronic components. There is a problem that it cannot be cooled.

  Therefore, the present invention solves the above-described problems, and an object of the present invention is to provide a cooling jacket structure that has higher cooling efficiency than a conventional cooling jacket and can reduce the flow path resistance of the refrigerant. In particular, an object of the present invention is to provide a cooling jacket structure capable of exhibiting a more efficient and uniform cooling action by configuring so as to obtain a heat exchange efficiency that matches the heat distribution of the electronic component.

  In order to solve the above problems, the cooling jacket structure of the present invention includes an inlet for introducing a refrigerant, an outlet for extracting the refrigerant, and a refrigerant passage formed between the inlet and the outlet. In the cooling jacket structure, the refrigerant passage has a passage portion extending spirally around a central portion.

  According to the present invention, since the refrigerant passage has the passage portion extending in a spiral shape, since the corner portion is not formed in the passage portion, it is possible to reduce the variation in the flow rate of the refrigerant and the retention of the refrigerant. Cooling efficiency can be increased without increasing the size of the jacket. In addition, since the flow resistance can be reduced, the driving load of the pump can be reduced, and the entire cooling system can be reduced in size.

  In the present invention, it is preferable that a plurality of (for example, a plurality of) passage portions are formed around the common central portion in the refrigerant passage. Thereby, since a some channel | path part can be put together compactly, size reduction of a cooling jacket and improvement of a cooling capability can be made compatible. In this case, a plurality of passage portions may be connected in parallel, or may be connected in series with each other. Further, a configuration in which the passage portions are connected in parallel and a configuration in which the passage portions are connected in series may be used in combination.

  In the present invention, it is preferable that the introduction port is configured to face the inner end of the passage portion at the center and the outlet port to face the outer end of the passage portion. According to this, the refrigerant is introduced into the inner end of the spiral passage portion, flows to the outer periphery, and is eventually led out from the outer end of the passage portion, so that the refrigerant temperature is low in the central portion and approaches the outer periphery. It can be configured such that the refrigerant temperature rises as much as possible. Therefore, since it is possible to obtain a heat exchange distribution that matches the temperature distribution of electronic components, particularly electronic components having a large calorific value such as a CPU or power transistor (large current element), the electronic components can be more efficiently and Cooling can be performed so as to obtain a more uniform temperature distribution.

  Further, when a plurality of (a plurality of) passage portions are formed around the common center portion, in the above configuration, the introduction port faces the inner ends of the plurality of passage portions in the center portion, and the outlet port is It is comprised so that it may face the outer end of a some channel | path part in an outer peripheral part. As a result, a plurality of passage portions are configured in parallel, so that the cooling capacity can be increased without affecting the heat exchange distribution of the cooling jacket and without reducing the cooling efficiency. it can. Also in this case, the cooling jacket can be configured compactly as described above.

  When the introduction port faces the inner end of the passage portion at the center as described above, an introduction passage extending from the introduction port at the central portion to the outer peripheral portion is provided along the surface of the cooling jacket, and the outside of the introduction passage is provided. By providing an inlet for the refrigerant at the end, the refrigerant supply pipe can be connected to the outer peripheral part of the housing even though the inlet is arranged at the center, so that the inlet through the inlet from the inner end of the spiral passage portion. Without changing the state in which the refrigerant can be supplied, it is possible to reduce the thickness of the constituent parts including peripheral parts (such as connector parts of the introduction pipe and the outlet pipe) connected to the cooling jacket structure. In this case, it is further preferable to provide the inlet of the introduction passage on the outer peripheral side surface of the housing. In this case, it is desirable that the outlet is also provided on the outer peripheral side surface of the housing. As a result, the connection direction of the refrigerant supply pipe and the refrigerant recovery pipe can also be set along the main surface of the housing, so that the overall thickness can be further reduced.

  In the present invention, the introduction port faces the outer end of the one passage portion, the inner end of the one passage portion communicates with the inner end of the other passage portion, and the outlet port of the other passage portion. It is preferable to be configured to face the outer end. In this case, one passage and the other passage are connected in series. With this configuration, both the inlet and the outlet can be arranged on the outer periphery of the cooling jacket, so that peripheral portions (such as the inlet pipe and outlet pipe connector parts) connected to the cooling jacket structure are also included. It is possible to reduce the thickness of the included components.

  In the present invention, it is preferable that the housing includes an inlet and an outlet and a partition wall formed in a spiral shape inside the housing, and the plurality of passage portions are configured by the partition wall. . According to this, since it can be comprised by the simple structure which consists of a housing and a partition wall, while being reduced in size, manufacturing cost can also be reduced.

  In the present invention, the housing is configured on the other side in the axial direction of the spiral shape with respect to the partition wall, and on the other side in the axial direction of the spiral shape with respect to the partition wall. It is preferable that the first half and the partition wall are integrally formed by molding, and the second half is connected to the second half. According to this, in the cooling jacket structure of the present invention, the first half and the partition wall are integrally formed by molding, and the second half is connected thereto, so that the joining work can be reduced. Therefore, the manufacturing cost can be reduced. Moreover, by being integrally molded, the thermal conductivity between the first half and the partition wall can be increased, and the thermal conductivity can be ensured stably and reliably.

  According to the present invention, the cooling efficiency can be improved by reducing the flow rate difference and retention of the refrigerant. Further, since the flow path resistance can be reduced, the driving load of the pump can be reduced. Furthermore, since a heat exchange distribution that matches the temperature distribution of the electronic component can be realized, the electronic component can be cooled more efficiently and with a more uniform temperature distribution.

  Hereinafter, embodiments of the present invention will be described together with illustrated examples. 1 is a schematic perspective view showing the cooling jacket 100 of the first embodiment according to the present invention in a partially cut open state, FIG. 2 is a schematic side view of the first embodiment, and FIG. 3 is taken along the line III-III in FIG. It is a schematic cross-sectional view which shows the cross section along.

  The cooling jacket 100 includes a housing 110 and a partition portion 130 formed so as to partition the inside of the housing 110. The housing 110 is configured in a container shape by a first half 110A that constitutes the bottom surface of the housing 110 and a second half 110B that is connected to the first half 110A so as to be overlapped from above. The housing 110 is formed in a flat shape as a whole by forming the first half portion 110A and the second half portion 110B in a dish shape. The upper wall portion of the housing 110, that is, the second half portion 110 </ b> B, is provided with an introduction port 111 that faces the central portion in the housing 110 and an outlet port 112 that faces the outer peripheral portion in the housing 110.

  The partition part 130 is comprised so that it may extend in the shape of a spiral (helical) around the center part. The lower edge of the partition 130 is connected to the inner bottom surface of the housing 110 (the inner surface of the first half 110A), and the upper edge of the partition 130 is connected to the ceiling surface of the housing 110 (the inner surface of the second half 110B). Yes. By this partition part 130, passage parts 100 </ b> X and 100 </ b> Y extending in a spiral shape from the central part toward the outer peripheral part are configured inside the housing 110.

  More specifically, the partition part 130 has a plurality of partition walls 130X and 130Y each extending spirally around a common central part, and these partition walls 130X and 130Y form a plurality of spirals. ing. In the illustrated example, two partition walls 130X and 130Y extend spirally from the central portion toward the outer peripheral portion. As a result, a plurality of (two in the illustrated example) passage portions 100X and 100Y are formed in the housing 110 from the central portion toward the outer peripheral portion. The inlets 111 face the inner ends 100Xa and 100Ya of the passages 100X and 100Y at the center, and the outlets 112 face the outer ends 100Xb and 100Yb of the passages 100X and 100Y at the outer periphery. .

  The partition part 130 is formed in a disk shape as a whole, and the housing 110 is also formed in a substantially disk shape corresponding to the outer peripheral shape of the partition part 130. However, a part of the outer peripheral portion of the housing 110 protrudes toward the outer peripheral side, and the outlet 112 is formed in the protruding portion.

  In the present embodiment, a refrigerant composed of water, various coolants, or the like is introduced from the inlet 111 and led out from the outlet 112, whereby the outer bottom surface of the housing 110 (the bottom surface of the first half 110A). ) Can absorb heat. For example, the cooling can be efficiently performed by bringing an electronic component such as a CPU or a power transistor or a heat sink connected to the electronic component into contact with the outer bottom surface of the housing 110.

  The refrigerant is introduced into the housing 110 through a refrigerant supply pipe (not shown) connected to the introduction port 111 using the joint 121 shown in FIGS. 1 and 2, and passes through the passage portions 100X and 100Y. Thereafter, the refrigerant is discharged through a refrigerant recovery pipe (not shown) connected to the outlet 112 using the joint 122 shown in FIGS. At this time, the refrigerant smoothly passes through the spirally formed passage portions 100X and 100Y, so that the portion close to the partition walls 130X and 130Y in the passage portions 100X and 100Y and the passage away from the partition walls 130X and 130Y. Since the flow rate of the refrigerant hardly changes between the central portions of the portions 100X and 100Y, the heat exchange efficiency between the housing 110 and the refrigerant is improved, and the cooling efficiency of the cooling jacket 100 can be improved as a whole.

  In addition, since the flow path resistance can be reduced by the spiral shape of the passage portions 100X and 100Y, the driving load of a pump (not shown) connected to the refrigerant supply pipe or the refrigerant recovery pipe can be reduced. Therefore, since the pump can be easily downsized, the entire cooling system can be downsized, downsized, and energy consumption can be reduced.

  Further, since the spiral passage portions 100X and 100Y can be accommodated in a small volume with a sufficient length, the cooling jacket can be made compact without sacrificing the cooling capacity. In particular, the space efficiency is improved by configuring the passage portion so as to have a plurality of spiral shapes as described above, and further downsizing can be achieved.

  Further, since the refrigerant is introduced into the central portion of the housing 110 and gradually moves toward the outer peripheral portion of the housing 110 while passing through the passage portions 100X and 100Y, the temperature of the central portion of the housing 110 is low, The temperature of the part becomes high. Therefore, the electronic component shows a high heat exchange efficiency at the central part of the electronic component and a low heat exchange efficiency at the peripheral part of the electronic component with respect to the temperature distribution of the electronic component where the temperature of the central part is high and the temperature of the peripheral part is low That is, since the heat exchange efficiency of the cooling jacket 100 matches the temperature distribution of the electronic component, the electronic component can be cooled more efficiently and more uniformly. It can be cooled to have a temperature distribution.

  In the present embodiment, the housing 110 and the partition 130 are made of a material having good thermal conductivity such as an aluminum alloy. The first half 110A and the partition 130 are integrally formed by mold molding (for example, injection molding), and the cooling jacket 100 is manufactured by connecting the second half 110B formed separately thereto. Is done. In particular, molding the partition part 130 having a relatively complicated structure integrally with the first half part 110A has a great effect in simplifying the manufacturing process and reducing the manufacturing cost. In particular, the partition portion 130 of the present embodiment is configured by partition walls 130X and 130Y that are erected substantially perpendicularly to the bottom wall surface of the first half portion 110A, and therefore can be easily molded. Is convenient. In the above embodiment, the first half 110A and the partition 130 are integrally formed. However, the second half 110B and the partition 130 may be integrally formed. Furthermore, since the first half 110A and the partition 130 are integrally formed, there is an advantage that the thermal conductivity between the first half 110A and the partition 130 can be reliably increased. That is, stable thermal conductivity can be achieved at a high level without being affected by the connection state in the assembly process.

  The first half part 110A and the partition part 130, which are integrally configured as described above, and the second half part 110B are connected by various joining methods such as adhesion, welding, welding, screwing, tightening, caulking, and press fitting. Is done. In addition, the first half 110A and the second half 110B may be connected via a sealing material such as packing. Here, it is preferable that the partition 130 and the second half 110B are also connected by an adhesive or the like, but the upper edge of the partition 130 is simply in contact with the inner surface of the second half 110B. May be.

  FIG. 4 is a schematic perspective view showing a structure of a modified example in which a part of the above embodiment is made different in a transparent state. The cooling jacket 200 of this modified example includes a housing 210 and a partition portion 230 disposed inside the housing 210, which are configured in substantially the same manner as in the above embodiment. The housing 210 has a first half 210A and a second half 210B as in the above embodiment, and the second half 210B is provided with an introduction port 211 that opens at the center. This is different from the above embodiment in which the outlet port 212 is formed on the upper wall portion of the housing in that the outlet port 212 is formed on the outer peripheral side surface of the housing 210. The outlet 212 is configured by connecting the first half 210A and the second half 210B.

  In this modification, an introduction case 210C is connected on the second half 210B. Between the introduction case 210C and the second half 210B, an introduction passage 200Z is formed which communicates with the introduction port 211 in the central portion of the housing 210 and extends from the central portion toward the outer peripheral portion. The introduction passage 200Z communicates with an inlet 213 provided on the outer peripheral side surface of the housing 210. As a result, the refrigerant introduced from the inlet 213 is guided to the central inlet 211 through the inlet passage 200 </ b> Z, and is introduced from the inlet 211 into the passage portion similar to the above-described embodiment configured by the partition portion 230. Thereafter, the refrigerant gradually moves to the outer peripheral side along the spiral shape of the passage portion, and is eventually discharged from the outlet 212.

  In this modification, both the inlet 213 and the outlet 212 are open on the outer peripheral side surface of the housing 210, so that the refrigerant supply pipe and the refrigerant recovery pipe are in the direction along the main surface of the housing 210 (the bottom surface or top surface of the housing 210. Since the cooling jacket 200 and its peripheral portion can be accommodated almost entirely within the thickness range of the housing 210, the cooling system can be configured to be thinner.

  Also in this modified example, as shown in FIG. 5, the first half portion 210A and the partition portion 230 are integrally formed by molding. Therefore, the second half 210B and the introduction case 210C are simply assembled to the first half 210A and the partition 230 integrally formed in this manner, just as in the above-described embodiment. Can do. Further, similarly to the above embodiment, there is an advantage that the thermal conductivity between the first half 210A and the partition 230 can be reliably increased.

  FIG. 6 is a schematic perspective view showing the structure of a cooling jacket 300 of a further different modification in a transparent state. In this modification, an inlet 311 and a outlet 312 are provided on the outer peripheral side surface of the housing 310, and passage portions 330X and 330Y are formed therein. The passage portions 330X and 330Y are formed in a spiral shape around the common central portion O of the housing 310, as in the above embodiment. The passage portions 330X and 330Y may be configured by the above-described partition wall, may be configured to penetrate the interior of the housing 310, or may be configured by pipes separately disposed inside the housing 310. It may be configured. In any case, it is necessary that the thermal conductivity between the passage portions 330X and 330Y and the outer surface of the housing 310 be good.

  In this modification, the introduction port 311 faces the outer end of one of the passage portions 330X, and the inner end of the passage portion 330X is connected to the inner end of the other passage portion 330Y at the central portion O. The outlet port 312 faces the outer end of 330Y. That is, in this modification, a plurality of passage portions are not configured in parallel as in the above-described embodiment and the modification examples shown in FIGS. 4 and 5, but the passage portion 330X and the passage portion 330Y are connected in series. Has been. Even if it does in this way, since the channel | path parts 330X and 330Y are extended smoothly, while being able to improve cooling efficiency, the channel | path part of sufficient length can be comprised compactly.

  The above-described embodiments and modification examples are only some of many configuration examples that can be configured when the present invention is applied, and the present invention broadly includes other various configuration examples included in the technical scope thereof. To do. For example, although the above-described embodiment and modification examples show examples configured as independent cooling jackets, the cooling jacket structure of the present invention has a cooling jacket portion integrated with a heat sink, and the cooling jacket portion is an electronic component. Various types of cooling jacket structures such as those integrated with a cooling object such as a cooling object are included.

The schematic perspective view which shows the state which notched a part of embodiment. The side view of an embodiment. FIG. 3 is a cross-sectional view of the embodiment (showing a state cut along line III-III in FIG. 2). The schematic perspective view which shows a modification in an internal see-through state. The schematic perspective view which shows the shape of the 1st half part of a modification. The schematic perspective view which shows a different modification in an internal see-through state.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Cooling jacket, 100X, 100Y ... Passage part, 100Xa, 100Ya ... Inner end, 100Xb, 100Yb ... Outer end, 110 ... Housing, 111 ... Inlet, 112 ... Outlet, 130 ... Partition, 130X, 130Y ... Partition wall

Claims (6)

In the cooling jacket structure having an inlet for introducing the refrigerant, an outlet for extracting the refrigerant, and a refrigerant passage formed between the inlet and the outlet,
The cooling jacket structure characterized in that the refrigerant passage has a passage portion extending spirally around a central portion.   The cooling jacket structure according to claim 1, wherein a plurality of the passage portions are formed around the common central portion in the refrigerant passage.   3. The cooling jacket according to claim 1, wherein the introduction port faces the inner end of the passage portion at the center portion, and the outlet port faces the outer end of the passage portion. Construction.   The introduction port faces the outer end of the one passage portion, the inner end of the one passage portion communicates with the inner end of the other passage portion, and the outlet port faces the outer end of the other passage portion. The cooling jacket structure according to claim 2, wherein the cooling jacket structure is configured as described above.   The housing having an inlet and an outlet and a partition wall formed in a spiral shape inside the housing, wherein the plurality of passage portions are configured by the partition wall. The cooling jacket structure as described in any one of 1-4. The housing has a first half configured on one side in the axial direction with respect to the partition wall, and a second half configured on the other side in the axial direction with respect to the partition wall, The cooling jacket structure according to claim 5, wherein the first half and the partition wall are integrally formed by molding, and the second half is connected thereto.

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