JP2005109026A - Circuit module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit module wherein fine adjustment can be made easily on the inductance of an inductor pattern. <P>SOLUTION: The circuit module comprises a multilayered ceramic substrate which consists of a plurality of ceramic layers 60, 61, and 62, and on the surface of one 61 of the ceramic layers of the multilayered ceramic substrate, the inductor pattern 40 is formed, and a line pattern 50 for controlling is formed along the inductor pattern. One end of the line pattern 50 for controlling is connected to a ground terminal 23, and the other end of the pattern 50 is connected to a ground terminal 21 via a capacitor chip 1 for controlling mounted on the surface of the substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a circuit module such as a multilayer composite device equipped in an electronic apparatus such as a mobile phone.

In a cellular phone, an antenna duplexer is provided in order to share one antenna between a reception system and a transmission system, and the antenna duplexer is generally configured by a multilayer composite device (30) as shown in FIG. Has been.
In the multilayer composite device (30), a multilayer ceramic substrate (6) is composed of a plurality of ceramic layers (60) to (69) as shown in FIG. 13, and the surface of the uppermost ceramic layer (60) is formed. A plurality of chip parts (7) are mounted on the surface, and an inductor pattern and a capacitor pattern are formed on the surfaces of the second and subsequent ceramic layers (61) to (69). These chip parts (7 ) And circuit element patterns are connected to each other to form a shared antenna circuit (see Patent Documents 1 and 2).
Japanese Patent No. 3048592 Japanese Patent No. 3067612

In the multilayer composite device as described above, when it is necessary to finely adjust the inductance to be exhibited by the inductor pattern, it is necessary to change the shape of the inductor pattern.
However, since the inductor pattern is formed between the layers of the multilayer ceramic substrate, there is a problem that the inductance cannot be finely adjusted after the multilayer ceramic substrate is manufactured.
Accordingly, an object of the present invention is to provide a circuit module capable of easily fine-tuning the inductance to be exhibited by the inductor pattern.

A circuit module according to the present invention includes a dielectric substrate formed of one or a plurality of dielectric layers, and an inductor pattern formed on the surface of one dielectric layer of the dielectric substrate. A plurality of circuit element patterns including patterns are connected to each other to constitute an electronic circuit that should perform a predetermined function, and the dielectric substrate is provided with a plurality of terminals including a ground terminal.
A control line pattern is formed on the surface of the one dielectric layer along the inductor pattern, and one end of the control line pattern is connected to a ground terminal, and the control line pattern Is connected to the ground terminal via a control capacitor chip mounted on the substrate surface.

  Specifically, the dielectric substrate is configured by laminating a plurality of dielectric layers, the control capacitor chip is mounted on the surface of the uppermost dielectric layer, and one or more dielectric layers in the lower layer are mounted. The plurality of circuit element patterns are formed on the surface of the layer.

  In the circuit module of the present invention, since both ends of the control line pattern formed along the inductor pattern are connected to the ground terminal to form a closed circuit, a high frequency signal flows through the inductor pattern. Thus, the inductor pattern and the control signal line pattern are electromagnetically coupled. Here, since the control capacitor chip is interposed between the other end of the control line pattern and the ground terminal, the degree of coupling of the control signal line pattern to the ground according to the capacitance value of the control capacitor chip. As a result, the inductance of the inductor pattern is determined accordingly. Therefore, the inductance of the inductor pattern can be finely adjusted by changing the capacitance value of the control capacitor chip.

Here, various electronic circuits can be configured by connecting various circuit element patterns such as a capacitor pattern to the inductor pattern. For example, if a capacitor is connected in parallel to the inductor pattern, a parallel LC resonance circuit (trap circuit) can be configured. By replacing the control capacitor chip with one having a different capacitance value, the LC resonance circuit Can be changed.
In addition, if a capacitor is connected in series with the inductor pattern, a series LC resonance circuit (oscillation circuit) can be constructed, and the LC resonance circuit can be obtained by replacing the control capacitor chip with one having a different capacitance value. Can be changed.

  According to the circuit module of the present invention, the inductance to be exhibited by the inductor pattern can be easily finely adjusted by replacing the control capacitor chip mounted on the substrate surface with one having a different capacitance value. I can do it.

Hereinafter, embodiments of the present invention applied to a multilayer composite device will be specifically described with reference to the drawings.
A multilayer composite device (3) according to the present invention constitutes an antenna duplexer equipped in a mobile phone, and is similar to the conventional multilayer composite device (30) shown in FIGS. A multilayer ceramic substrate (6) is composed of the ceramic layers (60) to (69).

As shown in FIG. 1A, a surface acoustic wave filter (71), a diode (72), a coil (73), and a capacitor (74) that constitute an antenna shared circuit are formed on the surface of the first ceramic layer (60). Etc.) and a control capacitor chip (1) are mounted.
One end of the control capacitor chip (1) is connected to the ground terminal (21), and the other end is connected to a via (8) which is a signal line extending in the vertical direction.

As shown in FIG. 1B, on the surface of the second ceramic layer 61, a capacitor pattern 41 and an inductor pattern 40 that constitute an antenna shared circuit are formed. A control line pattern (50) is formed along the pattern (40).
Further, as shown in FIG. 1 (c), a capacitor pattern (42) to be opposed to the capacitor pattern (41) of the second ceramic layer (61) is formed on the surface of the third ceramic layer (62). Is formed.
One end of the control line pattern (50) is connected to the ground terminal (23), and the other end is connected to the other end of the control capacitor chip (1) via a via (8).
In addition, a plurality of circuit element patterns that should constitute an antenna shared circuit are also formed on the surface of the ceramic layers after the fourth layer. The ground terminals (21), (23), antenna terminals ( Necessary terminals such as 22) are provided.

  In this way, one end of the control line pattern (50) formed on the surface of the second ceramic layer (61) constituting the multilayer composite device (3) is connected to the ground terminal (23). At the same time, the other end is connected to the ground terminal (21) via the control capacitor chip (1) mounted on the surface of the first ceramic layer (60), and the control line pattern (50). Thus, a closed loop circuit composed of the control capacitor chip (1) and the ground terminals (21) and (23) is formed.

A simulation using an electronic computer was performed to confirm the effect of the present invention.
FIG. 2 shows the shapes of the inductor pattern and the control line pattern employed in the simulation. On the surface of one ceramic layer of the multilayer ceramic substrate (6), the inductor pattern (4) and the control line pattern ( 5) are formed in a U-shape and extend close to each other over their entire length, and both ends of the inductor pattern (4) are connected to the port P1 and the port P2, and the control line pattern (5) Are connected to ports P3 and P4.

  In the simulation, first, the frequency characteristics of the inductance between both ends (ports P1, P2) of the inductor pattern (4) were examined with both ends (ports P3, P4) of the control line pattern (5) open. The result shown in FIG. 3 was obtained. As is apparent from this result, the inductance L decreases as the frequency increases.

Next, as shown in FIG. 4, the port P3 is grounded, and in the circuit module grounded via the control capacitor C1, the capacitance C of the control capacitor C1 is changed in the range of 1 pF to 5 pF. The frequency characteristics of the inductance between both ends (ports P1, P2) of the inductor pattern (4) in each capacitance were examined.
FIG. 5 shows the result, and the inductance L increases as the capacitance of the control capacitor C1 increases. In particular, in the region where the frequency is low, the increase of the inductance L is slight.

  Further, as shown in FIG. 6, the port P3 is grounded, the port P4 is grounded via the control capacitor C1, and both ends of the capacitor C2 are connected to the ports P1 and P2, and the capacitor C2 and the multilayer ceramic substrate are connected. In the circuit module in which the LC resonance circuit is configured by the inductor pattern of (6), the capacitance C of the control capacitor C1 is changed to three types of 0.5 pF, 1 pF, and 2 pF, and the attenuation frequency at each capacitance is changed. The characteristics were investigated. The capacitance of the capacitor C2 was constant at 10 pF.

When the capacitance C of the control capacitor C1 is set to 0.5 pF as shown in FIG. 6, the result of FIG. 7 is obtained, and when the capacitance C of the control capacitor C1 is set to 1 pF as shown in FIG. When the capacitance C of the control capacitor C1 is set to 2 pF as shown in FIG. 10, the result of FIG. 11 is obtained.
From the results of FIGS. 7, 9 and 11, it can be seen that the resonance frequency slightly decreases as the capacitance C of the control capacitor C1 increases. This change in the resonance frequency is due to an increase in the inductance L of the inductor pattern as the capacitance C of the control capacitor C1 increases.

From the computer simulation described above, it was confirmed that the inductance L of the inductor pattern (4) changes according to the capacitance C of the control capacitor C1.
Therefore, in the multilayer composite device (3) of the present invention shown in FIG. 1, when it is necessary to finely adjust the inductance of the inductor pattern (40) after the production of the multilayer ceramic substrate, the control capacitor chip ( 1) may be replaced with one having a different capacitance. Since the control capacitor chip (1) is mounted on the surface of the substrate, the replacement is easy.

In addition, each part structure of this invention is not restricted to the said embodiment, A various deformation | transformation is possible within the technical scope as described in a claim. For example, the present invention is not limited to a multilayer composite device composed of a plurality of ceramic layers, but can be applied to a device composed of a single-layer dielectric substrate.
Further, the control signal line does not need to extend along the inductor pattern, and at least a part of the control signal line only needs to extend along the inductor pattern.
Furthermore, the present invention is not limited to the LC resonance circuit (trap circuit) constituting the antenna duplexer, but can be implemented in various circuit modules using inductors.

It is a top view of the 1st layer of the lamination type composite device concerning the present invention, the 2nd layer, and the 3rd layer. It is a top view which shows the inductor pattern and control line pattern which were used for computer simulation. It is a graph which shows the frequency characteristic of the inductance of a single inductor pattern. FIG. 3 is a circuit diagram of a circuit module in which one end of a control line pattern is grounded and the other end is grounded via a control capacitor chip. It is a graph which shows the frequency characteristic of the inductance in this circuit module. Furthermore, it is a circuit diagram of the circuit module which connected the capacitor | condenser to the both ends of the inductor pattern. It is a graph which shows the frequency characteristic of the attenuation amount in this circuit module. It is a circuit diagram of the circuit module which changed the capacitance of the capacitor chip for control. It is a graph which shows the frequency characteristic of the attenuation amount in this circuit module. It is a circuit diagram of the circuit module which further changed the capacitance of the capacitor chip for control. It is a graph which shows the frequency characteristic of the attenuation amount in this circuit module. It is a perspective view of the conventional multilayer composite device. It is a disassembled perspective view of this laminated type composite device.

Explanation of symbols

(1) Capacitor chip for control
(21) Ground terminal
(22) Antenna terminal
(23) Ground terminal
(3) Multilayer composite device
(4) Inductor pattern
(40) Inductor pattern
(5) Control line pattern
(50) Control line pattern
(6) Multilayer ceramic substrate

Claims (4)

  A plurality of circuit element patterns including a dielectric substrate formed of one or a plurality of dielectric layers, and an inductor pattern formed on the surface of one dielectric layer of the dielectric substrate. Are connected to each other to form an electronic circuit that should perform a predetermined function, and the dielectric substrate is provided with a plurality of terminals including a ground terminal. A control line pattern is formed on the surface along the inductor pattern, and one end of the control line pattern is connected to the ground terminal, and the other end of the control line pattern is mounted on the substrate surface. A circuit module, wherein the circuit module is connected to a ground terminal via a control capacitor chip.   The dielectric substrate is formed by laminating a plurality of dielectric layers, the control capacitor chip is mounted on the surface of the uppermost dielectric layer, and the surface of the one or more dielectric layers below is mounted. The circuit module according to claim 1, wherein a plurality of circuit element patterns are formed.   The circuit module according to claim 1, wherein a capacitor is connected in parallel to the inductor pattern to constitute a parallel LC resonance circuit (trap circuit). The circuit module according to claim 1, wherein a capacitor is connected in series with the inductor pattern to constitute a series LC resonance circuit (oscillation circuit).

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