JP2005106915A - Molded substrate, method for manufacturing the same, and camera module using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a molded substrate to be used for a cellular phone or the like, a method for manufacturing the molded substrate, and a camera module using the molded substrate, in which miniaturization or reduction in thickness is easily achieved and noise light reflected on an electrode or the end faces of terminals is hindered from entering. <P>SOLUTION: The structure of the molded substrate is such that the conductive metallic plate terminals 12 extending from the lower face of an insulated resin case 11 near its opening 11A on the lower face are buried into the lower face of the case 11 with the surface exposed, and the terminals 12 are not exposed to the side of the opening 11A. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a molded substrate used for a mobile phone, a manufacturing method thereof, and a camera module using the same.

  2. Description of the Related Art In recent years, with the increase in functionality of mobile phones, mobile phones equipped with camera modules for transmitting and receiving images in addition to speakers and microphones for transmitting and receiving audio are increasing.

  Such a conventional camera module will be described with reference to FIG.

  FIG. 13 is a cross-sectional view of a conventional camera module, in which 1 is a lens, 2 is a lens cover having an opening on the upper surface, and 3 is an optical filter that cuts infrared rays from incident light.

  Reference numeral 4 denotes a holder that holds and fixes the lens 1, the lens cover 2, and the optical filter 3, and has an opening below them.

  Reference numeral 5 denotes a bare chip of the image pickup element, which has a light receiving portion 5A on the upper surface, and a plurality of electrode portions 5B are formed on a peripheral portion surrounding the light receiving portion 5A.

  Reference numeral 6 denotes a bare chip mounting substrate on which the bare chip 5 is mounted. The bare chip 5 is placed and fixed, and the plurality of electrode portions 5B of the bare chip 5 are connected to the plurality of connection portions 6A on the peripheral edge of the top surface of the bare chip mounting substrate 6. It is electrically connected by wire bonding.

  Further, these connection portions 6A are connected to a plurality of connection portions 6B on the side surface, and these connection portions 6B are soldered to predetermined portions of the wiring board 7 on which a plurality of wiring patterns (not shown) are formed on the upper and lower surfaces. The camera module is configured by being electrically connected by attaching or the like.

  Further, the camera module is connected to an electronic circuit (not shown) of the mobile phone main body through a wiring pattern of the wiring board 7.

  In the above configuration, during imaging, light incident from the opening of the lens cover 2 is refracted by the lens 1, passes through the optical filter 3, and is received by the light receiving portion 5A of the bare chip 5 of the imaging device.

  Then, it is converted into an electric signal by photoelectric conversion in the light receiving portion 5A, and this electric signal is transmitted from the electrode portion 5B to the wiring pattern of the wiring substrate 7 through the connection portions 6A and 6B of the bare chip mounting substrate 6, and further this wiring pattern. It is transmitted to the electronic circuit of the mobile phone main body via the.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2003-131112 A

  However, the conventional camera module has a configuration in which the bare chip mounting substrate 6 is provided between the bare chip 5 and the wiring substrate 7 in order to transmit an electric signal from the electrode portion 5B of the bare chip 5 to the wiring pattern of the wiring substrate 7. Accordingly, the camera module becomes larger, and a gap is formed between the lower surface near the opening of the holder 4 and the upper surface of the bare chip 5, so that the light incident on the lens 1 is attached to the surface of the lens 1. There has been a problem that so-called noise light, which has been changed in its optical path due to water droplets or the like and diffusely reflected by the electrode portion 5B, easily enters the light receiving portion 5A.

  The present invention solves such a conventional problem, and an object of the present invention is to provide a molded substrate that can be easily reduced in size and thickness, and a camera module using the molded substrate.

  In order to achieve the above object, the present invention has the following configuration.

  According to the first aspect of the present invention, the terminal made of a conductive metal plate extending on the lower surface from the lower surface near the opening of the insulating resin case is buried with the surface exposed on the lower surface of the case, For example, when a camera module is manufactured using this molded substrate, the electrical signal from the electrode part of the bare chip is transmitted to the wiring pattern of the wiring substrate. Without using a bare chip mounting substrate, the electrode part of this bare chip is directly connected to the terminal on the lower surface near the opening of the upper molded substrate, and then this terminal is connected to the wiring pattern of the wiring substrate. As a result, it is possible to obtain a molded substrate that can be easily reduced in size and thickness, and there is almost no gap between the lower surface near the opening and the upper surface of the bare chip. Since the terminal on the lower surface in the vicinity of the opening is not exposed to the side surface of the opening, it is possible to make it difficult for incident noise light to be incident on the electrode surface on the upper surface of the bare chip and the end surface on the side surface of the opening of the molded substrate. Have

  According to a second aspect of the present invention, in the first aspect of the invention, an inclined portion that extends from the upper side to the lower side is provided on the side surface of the opening of the case. For example, a camera module using the molded substrate is provided. The optical path of the light incident on the lens changes due to water droplets or the like adhering to the lens surface, and noise light irregularly reflected on the side surface of the opening may be less likely to be incident on the light receiving unit than those having no inclination on the side surface of the opening. Has the effect of being able to.

  According to a third aspect of the present invention, in the first aspect of the invention, a plurality of radially extending terminals connected to the central portion of the belt-like conductive metal plate are continuously processed, and the periphery of the central portion is processed. After forming the opening of the case by insert or outsert molding of insulating resin, the terminal exposed in this opening is cut, and the insulating resin is inserted or outsert molded to cover these terminal end faces again Molded substrate, which is a method for manufacturing a substrate, can be easily reduced in size and thickness, and can make it difficult to receive noise light reflected from the end surface on the side of the opening of the electrode portion of the bare chip or the terminal of the molded substrate. It has the effect that can be realized.

  According to a fourth aspect of the present invention, a camera module is configured by disposing an image pickup element below the opening of the molded substrate according to the first aspect and disposing a lens above the molded substrate. It has the effect that an easy camera module can be obtained.

  As described above, according to the present invention, it is possible to obtain a molded substrate that can be easily reduced in size and thickness, and can be made difficult to receive noise light reflected from the electrode portion and the terminal end face, and a camera module using the molded substrate. The advantageous effect that it can be obtained.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  In addition, the same code | symbol is attached | subjected to the part of the structure same as the structure demonstrated in the term of background art, and detailed description is simplified.

(Embodiment)
1 is a cross-sectional view of a molded substrate according to an embodiment of the present invention, FIG. 2 is a plan view of the same in the lower view, in which 11 is a case made of an insulating resin having an opening 11A in the center of a substantially square shape. Thus, the outer periphery of the lower surface near the opening 11A has a convex portion 11B protruding in a frame shape, and the upper surface near the opening 11A has a protruding portion 11C protruding in a substantially cylindrical shape.

  Reference numeral 12 denotes a plurality of terminals made of a conductive metal plate insert-molded in the case 11, extending radially from the lower surface near the case 11 opening 11 </ b> A to the outer peripheral end of the convex portion 11 </ b> B. The molded substrate is configured by bending along the outer periphery of the convex portion 11B and extending to the vicinity of the inner peripheral end of the convex portion 11B.

  Next, a method of manufacturing the molded substrate configured as described above will be described with reference to the cross-sectional views and plan views of the bottom view of FIGS.

  First, as shown in the cross-sectional view of FIG. 3A and the plan view of FIG. 3B, the central portion 14 of the strip-shaped conductive metal plate 13 and a plurality of portions connected to this and extending vertically and horizontally. The central contact portion 12A, the plurality of intermediate portions 12B extending radially from the end portion of the central contact portion 12A, and the plurality of peripheral portions 12C extending vertically and horizontally from the end portion of the intermediate portion 12B are continuously punched. Process.

  At the same time, the connecting bars 15 extending from the upper, lower, left and right peripheral portions 12C toward the central portion 14 are continuously punched.

  Next, as shown in FIG. 4, an insulating resin is outsert-molded on a part of the plurality of terminals 12, a part of the convex part 11 </ b> B <b> 1 of the frame-like convex part 11 </ b> B is formed on the lower surface, and a substantially cylindrical shape is formed on the upper surface. A part of the protrusion 11 </ b> C is formed to form a part of the case 11.

  At this time, the center contact portion 12A and the intermediate portion 12B of the terminal 12 are buried in the lower surface of the case 11 with their surfaces exposed.

  Then, as shown in FIG. 5, the connecting portion 12E between the central contact portion 12A and the inner central portion 14 is cut by punching to remove the central portion 14 and provide an opening.

  In this manner, since the central portion 14 is punched and removed after the insulating resin is outsert-molded on a part of the plurality of terminals 12, the plurality of terminals 12 do not become unstable after the removal.

  After that, as shown in FIG. 6, the insulating resin is further outsert-molded on a part of the plurality of terminals 12 and the connecting rail 15, and the remaining convex portion 11B2 of the frame-shaped convex portion 11B is formed on the lower surface. The remaining protrusion 11C2 of the substantially cylindrical protrusion 11C is formed on the upper surface to cover the end face of the terminal 12.

  At this time, a screw corresponding to a mechanism capable of adjusting the lens in the optical axis direction may be formed on the inner or outer periphery of the protruding portion 11C.

  After that, as shown in FIG. 7, after the connecting portion 12D between the peripheral portion 12C and the outer conductive metal plate 13 is cut by punching, the peripheral portion 12C is bent along the convex portion 11B. The connecting rail 15 is removed by cutting or the like, and the terminal 12 extending from the lower surface near the opening 11A of the case 11 is buried on the lower surface of the case 11 with its surface exposed, and the side surface of the opening 11A. A molded substrate that is not exposed to the surface is completed.

  Next, a camera module using this molded substrate will be described with reference to a sectional view of FIG. 8 and a perspective view of FIG.

  In the figure, 1 is a lens, 2 is a lens cover having an opening on the upper surface, 3 is an optical filter for cutting infrared rays from incident light, and these lens 1, lens cover 2 and optical filter 3 are openings in the case 11. It is held and fixed at a predetermined location of the protruding portion 11C protruding in a substantially cylindrical shape on the upper surface in the vicinity of the portion 11A.

  Reference numeral 5 denotes a bare chip of an image pickup device such as a CCD image pickup device or a CMOS image pickup device. The light receiving portion 5A is provided on the upper surface, and a plurality of electrode portions 5B made of gold, aluminum, or the like are provided on the peripheral portion surrounding the light receiving portion 5A. Is formed.

  In addition, the bare chip 5 is electrically connected and fixed to the center contact portion 12A on the lower surface near the opening 11A of the molded substrate by mounting such as flip chip mounting.

  These central contact portions 12A are connected to the peripheral portion 12C via the intermediate portion 12B, and these peripheral portions 12C are soldered to predetermined portions of the wiring board 17 in which a plurality of wiring patterns 17A are formed on the upper and lower surfaces. Thus, the camera module is configured by electrical connection.

  That is, in this camera module, the electrode portion 5B of the bare chip 5 is directly connected to the wiring pattern 17A of the wiring substrate 17 via the terminal 12 of the molded substrate without using the bare chip mounting substrate 6 described in the background art section. It is configured to be connectable.

  The camera module is connected to an electronic circuit (not shown) of the mobile phone main body via a wiring pattern 17A of the wiring board 17.

  In the above configuration, during imaging, light incident from the opening of the lens cover 2 is refracted by the lens 1, passes through the optical filter 3, and is received by the light receiving portion 5A of the bare chip 5 of the imaging device.

  Then, it is converted into an electric signal by photoelectric conversion in the light receiving portion 5A, and this electric signal is transmitted from the electrode portion 5B to the wiring pattern of the wiring substrate 17 through the terminal 12 of the molded substrate, and further through this wiring pattern to the mobile phone. Is transmitted to the electronic circuit of the main body.

  At this time, since the inclined portion that spreads from the upper side to the lower side is formed on the side surface of the opening 11A, the light path is changed by water droplets etc. attached to the surface of the lens 1, and the opening is changed. The amount of noise light that diffusely reflects on the side surface and reaches the light receiving portion 5A is reduced as compared with the case where the side surface of the opening portion extends straight downward from above.

  As described above, according to the present embodiment, the terminal 12 made of the conductive metal plate extending from the lower surface near the opening 11A of the case 11 made of insulating resin is buried in the lower surface of the case 11 with its surface exposed. In addition, by forming the molded substrate so as not to be exposed to the side surface of the opening 11A, for example, when a camera module is manufactured using this molded substrate, the electrical signal from the electrode portion 5B of the bare chip is transmitted to the wiring substrate 17 Even if the bare chip mounting substrate 6 is not used for transmission to the pattern, the bare chip electrode portion 5B is directly connected to the terminal 12 in the vicinity of the opening 11A of the upper molded substrate, and then the terminal 12 is connected to the wiring substrate. Since it can be realized by connecting to 17 wiring patterns, it is possible to obtain a molded substrate that can be easily reduced in size and thickness and a camera module using the same. In addition, there is almost no gap between the lower surface near the opening 11A and the upper surface of the bare chip 5, and the terminal 12 on the lower surface near the opening 11A of the molded substrate is not exposed on the side surface of the opening 11A. It is possible to make it difficult for incident noise light to be incident on the end face on the side surface of the opening 11A of the electrode part 5B or the terminal 12 of the molded substrate.

  In addition, by providing an inclined portion that spreads from the upper side to the lower side on the side surface of the opening 11A, for example, light incident on the lens 1 of the camera module using this molded substrate is caused to pass through the optical path by water droplets or the like attached to the surface of the lens 1 The noise light irregularly reflected on the side surface of the opening 11A can be made harder to enter the light receiving unit 5A than that having no inclination on the side surface of the opening 11A.

  A plurality of radially extending terminals 12 connected to the central portion of the belt-like conductive metal plate 13 are continuously processed, and an insulating resin is inserted or outsert molded around the central portion of the case 11. After forming the opening, the terminal 12 exposed in the opening is cut, and an insulating resin is inserted or outsert-molded so as to cover these terminal end faces again, so that it is easy to reduce the size and thickness, A molded substrate that can eliminate noise light reflected from the end face of the terminal 12 on the side of the opening 11A can be easily manufactured.

  In the above description, the terminal 12 and the connecting beam 15 are described as being formed by punching, but instead, the terminal 12 and the connecting beam 15 may be formed by etching and the like. Implementation of the invention is possible.

  At that time, as shown in the partial cross-sectional view of FIG. 10, the terminal 12 is formed by etching so that the width of the exposed upper surface of the terminal 12 is narrower than the width of the lower surface buried in the case 11. Thereafter, by forming the case 11 by outsert molding of the insulating resin on a part of the terminal 12, the inclined side surface 12F of the terminal 12 is covered with the insulating resin, so that the terminal 12 is peeled in the exposed surface direction. Can be difficult.

  Further, as shown in the partial cross-sectional view of FIG. 11, the contact area between the side surface 12F of the terminal 12 and the case 11 is formed by forming a recess 12G or a convex portion 12H on the side surface 12F of the terminal 12 by punching or etching. Therefore, the terminal 12 can be firmly held in the case 11.

  Furthermore, the terminal 12 can be more firmly fixed to the case 11 by carrying out the contents described with reference to FIGS. 10 and 11 at the same time.

  In the above description, the optical filter 3 is described as being disposed on the upper surface side of the opening portion 11A. Instead, the optical filter 3 is disposed on the lower surface side of the opening portion 11A as shown in FIG. It may be arranged in close contact with the upper surface of 5A.

  Since the light incident on the lens 1 converges toward the upper surface of the light receiving unit 5A, the optical filter can be made smaller as the optical filter is arranged closer to the upper surface of the light receiving unit 5A.

  A molded substrate according to the present invention, a method for manufacturing the same, and a camera module using the molded substrate, and a molded substrate capable of making noise light reflected from an electrode portion and a terminal end surface difficult to enter while easily reducing size and thickness. This is advantageous in that a camera module using the above can be obtained, and is useful for a molded substrate used in a mobile phone or the like, a manufacturing method thereof, a camera module using the same, and the like.

Sectional drawing of the shaping | molding board | substrate by the 1st Embodiment of this invention Plan view of the molded substrate viewed from below (A) Sectional view showing the method for manufacturing the molded substrate, (b) Plan view showing the method for manufacturing the molded substrate (A) Sectional view showing the method for manufacturing the molded substrate, (b) Plan view showing the method for manufacturing the molded substrate (A) Sectional view showing the method for manufacturing the molded substrate, (b) Plan view showing the method for manufacturing the molded substrate (A) Sectional view showing the method for manufacturing the molded substrate, (b) Plan view showing the method for manufacturing the molded substrate (A) Sectional view showing the method for manufacturing the molded substrate, (b) Plan view showing the method for manufacturing the molded substrate Cross section of camera module Perspective view of the camera module Partial sectional view of the molded substrate Partial sectional view of the molded substrate Cross section of the camera module Sectional view of a conventional camera module

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lens 2 Lens cover 3 Optical filter 5 Bare chip 5A Light-receiving part 5B Electrode part 7, 17 Wiring board 11 Case 11A Opening part 11B Convex part 11B1 Part of convex part 11B2 Remaining part of convex part 11C Protruding part 11C1 Part of projecting part 11C2 Remaining part of projecting part 12 Terminal 12A Central contact part 12B Intermediate part 12C Peripheral part 12D, 12E Connecting part 12F Side of terminal 12G Concave part of terminal side 12H Convex part of side of terminal 13 Conductive metal plate 14 Central part 15 Connecting bar

Claims (4)

A case made of an insulating resin having an opening and a terminal made of a conductive metal plate extending from the lower surface in the vicinity of the opening of the case to the lower surface, the terminal being buried with the surface exposed on the lower surface of the case A molded substrate that is not exposed to the side surface of the opening. The molded substrate according to claim 1, wherein an inclined portion that extends downward from above is provided on a side surface of the opening of the case. A strip-shaped conductive metal plate was processed continuously with a plurality of radially extending terminals connected at the center, and an insulating resin was inserted or outsert molded around the center to form a case opening 2. The method for manufacturing a molded substrate according to claim 1, wherein the terminal exposed in the opening is cut and the insulating resin is inserted or outsert-molded so as to cover the terminal end surfaces again. A camera module in which an imaging element is disposed below an opening of a molded substrate according to claim 1 and a lens is disposed above.

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