JP2005101128A5 - - Google Patents

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Publication number
JP2005101128A5
JP2005101128A5 JP2003330999A JP2003330999A JP2005101128A5 JP 2005101128 A5 JP2005101128 A5 JP 2005101128A5 JP 2003330999 A JP2003330999 A JP 2003330999A JP 2003330999 A JP2003330999 A JP 2003330999A JP 2005101128 A5 JP2005101128 A5 JP 2005101128A5
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JP
Japan
Prior art keywords
semiconductor device
conductive film
resin layer
wirings
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003330999A
Other languages
English (en)
Japanese (ja)
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JP2005101128A (ja
JP4247611B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003330999A priority Critical patent/JP4247611B2/ja
Priority claimed from JP2003330999A external-priority patent/JP4247611B2/ja
Publication of JP2005101128A publication Critical patent/JP2005101128A/ja
Publication of JP2005101128A5 publication Critical patent/JP2005101128A5/ja
Application granted granted Critical
Publication of JP4247611B2 publication Critical patent/JP4247611B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003330999A 2003-09-24 2003-09-24 半導体装置 Expired - Fee Related JP4247611B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003330999A JP4247611B2 (ja) 2003-09-24 2003-09-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003330999A JP4247611B2 (ja) 2003-09-24 2003-09-24 半導体装置

Publications (3)

Publication Number Publication Date
JP2005101128A JP2005101128A (ja) 2005-04-14
JP2005101128A5 true JP2005101128A5 (cg-RX-API-DMAC7.html) 2006-11-09
JP4247611B2 JP4247611B2 (ja) 2009-04-02

Family

ID=34459773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003330999A Expired - Fee Related JP4247611B2 (ja) 2003-09-24 2003-09-24 半導体装置

Country Status (1)

Country Link
JP (1) JP4247611B2 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4311376B2 (ja) 2005-06-08 2009-08-12 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法、電子部品、回路基板及び電子機器
JP2008211806A (ja) * 2008-03-06 2008-09-11 Seiko Epson Corp 半導体装置、半導体装置の製造方法、電子部品、回路基板及び電子機器
JP5516511B2 (ja) * 2011-06-09 2014-06-11 セイコーエプソン株式会社 電子部品、回路基板及び電子機器
JP5569473B2 (ja) * 2011-06-09 2014-08-13 セイコーエプソン株式会社 電子部品、回路基板及び電子機器
JP5773027B2 (ja) * 2014-04-28 2015-09-02 セイコーエプソン株式会社 電子部品及び電子機器
JP6402978B2 (ja) * 2014-07-25 2018-10-10 セイコーエプソン株式会社 半導体回路素子、電子機器、および移動体

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