JP2005100964A - Resin keytop and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a resin keytop having no plated conducting part leading to an island-like portion from the end of the resin keytop, although the island-like portion on the top face of the resin keytop has a plating layer. <P>SOLUTION: As for the resin keytop 21 for a push button switch, having a resin 11 which can be plated and a resin 12 to form the island-like portion 25 by surrounding the surface of the resin 11, which can not be plated, a through hole 23 the one hole end of which leads to the island-like portion 25 is provided in the resin 11 which can be plated, and the island-like plating layer 10 leading to the plating layer 10 plated to the inner peripheral surface of the through hole 23 is provided in the island-like portion 25. Therefore, the resin keytop 21 has the perfectly island-like plating layer 10 on the top face of the resin keytop 21. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a resin key top to be used as a keypad for a pushbutton switch in combination with a base sheet made of a rubber-like elastic member, among pushbutton switch cover members used for input of an electronic device such as a portable information terminal and an AV device, and the like It relates to a manufacturing method.

  As a cover member for a pushbutton switch used for input of electronic devices such as portable information terminals, etc., for a pushbutton switch in which a resin key top and a base sheet are integrated because of a good operational feeling and a wide variety of designs. Keypads are widely used. As shown in FIG. 15, this pushbutton switch keypad 1 is used in, for example, a cellular phone 2, and a base sheet 3 made of a rubber-like elastic body such as silicone rubber is provided with a plurality of resin key tops 4, that is, a center. An annular key top 4a for inputting an up, down, left and right direction at the top, a key top 4b at the center, four key tops 4c around the annular key top 4a, and 14 keys from the center to the bottom The top 4d has a structure in which the adhesive 4 is fixed. Then, as shown in FIG. 16, for example, when the upper surface 6 of the resin key top 4a is pressed, the base sheet 3 is elastically deformed, and the metal on the printed circuit board 7 provided on the back side of the keypad 1 for the pushbutton switch. The disc spring 8 is pressed and the contact 9 is turned on. On the other hand, when the pressing is released, the state before the pressing is restored and the contact 9 is turned off.

  In such a keypad 1 for a pushbutton switch, one having a metallic design in which a plating layer 10 is formed on the upper surface 6 of the resin key top 4 is widely used for the purpose of giving an image of luxury. In particular, this requirement is high for the large-sized annular key top 4a located slightly in the center.

  In the design in which the plating layer 10 is formed, there is a design in which the resin key top 4 is entirely covered with the plating layer 10 and a part of the resin key top 4 is covered with the plating layer 10. There is a method of removing a part of the plating layer 10 with a laser in order to mix the portion where the plating layer 10 is formed and the portion where the plating layer 10 is not formed on the resin key top 4. In addition, a part where the plating layer 10 is provided and a part where the plating layer 10 is not provided are separately molded in advance, and after plating one part, the part is fixed to an unplated part with an adhesive. There is also a method of simply inserting and combining. However, these methods increase the number of work steps and are complicated. In particular, the method using a laser is expensive to manufacture, and the method of bonding with an adhesive requires the securing of an adhesion part, and there is a disadvantage that if the adhesion failure occurs, the part falls off. Moreover, the method of combining by fitting also has a problem that it is difficult to increase the productivity because the dimensional accuracy of each part is required to be high within ± 0.3 mm.

  As another method of partially forming the plating layer 10 on the upper surface 6 of the resin key top 4, the resin key top 4 is formed by two-color molding from a resin 11 to which plating is applied by an electroless plating method and a resin 12 to which the plating is not applied. There is a method in which the plating layer 10 is formed only on the surface of the resin 11 to which the plating is applied after being molded and then subjected to electroless plating. For example, the resin key top 4 shown in FIGS. 17 and 18 is molded from the resin 11 around which the numeral “4” and the portion of the symbol “O” are plated. When this method is used, in order to increase the thickness of the plating layer 10 or to change the type of metal to be plated, electroplating is often performed, but in order to perform electroplating, plating is performed in a plating bath. A conductive portion for providing conduction from a jig for holding an object to a place to be plated is required on the resin key top 4. For this reason, the electroplating layer 10 cannot be formed on the so-called island portion 13 that is not communicated with the edge 4G of the resin key top 4 and is insulated. In order to perform electroplating, there is a problem that the conductive portion 14 as shown in FIGS. 19 and 20 is provided and the design does not include the island-like portion 13.

As these conventional techniques, as an example in which a resin key top is formed of a resin with and without plating, JP 2003-229036 A (Patent Document 1), and a part of the plating layer is removed by a laser. Examples of these are described in JP-A-5-65687 (Patent Document 2).
JP 2003-229036 A JP-A-5-65687

  The present invention has a resin key top having an island-like plating layer on the upper surface of the resin key top, hardly causing separation between the metal-plated portion and the other portions, having a small number of production steps, and having an excellent design. It aims at obtaining the manufacturing method.

  In order to achieve the above object, the present invention relates to a resin key top for a pushbutton switch having a resin with plating and a resin without plating that surrounds the surface of the resin with plating and forms an island-shaped portion. The resin to be plated is provided with a through hole in which one end of the hole leads to the island-like portion, and the island-like portion is provided with an island-like plating layer continuous with the plating layer attached to the inner peripheral surface of the through-hole. A resin key top is provided.

  According to the resin key top of the present invention, a resin key top for a pushbutton switch having a resin with plating and a resin without plating that surrounds the surface of the resin with plating and forms an island-shaped portion. Because the resin to be plated is provided with a through hole with one end leading to the island, and the island is provided with an island plating layer that is continuous with the plating layer attached to the inner peripheral surface of the through hole. It can be set as the resin key top which has a plating layer in the island-like part of the top upper surface. And, because the resin to be plated is provided with a through hole in which one end of the hole leads to the island-shaped portion, and the island-shaped portion is provided with an island-shaped plating layer continuous with the plating layer attached to the inner peripheral surface of the through-hole, It is possible to energize the island part of the resin to which the plating is applied through the through hole, and it is not necessary to form a conduction part electrically connected to the island part on the upper surface of the resin key top. Therefore, it is a resin key top with excellent design. Here, the through-hole can be formed such that one hole end communicates with the island-shaped portion, and the other hole end communicates with a surface other than the surface where the island-shaped portion is formed.

  As an example of the through hole, a resin that is not plated from the top surface to the bottom surface of the resin key top can be penetrated, and the other hole end can be opened to the bottom surface of the resin key top.

  This through hole penetrates the resin without plating from the top surface to the bottom surface of the resin key top, and the other hole end opens to the bottom surface of the resin key top. The top surface of the key top can be electroplated, and the resin key top can be formed by electroplating an island-like portion that is completely separated from the edge of the top surface of the resin key top.

  Then, it is made of a resin to which plating is applied, and can be provided with a conduction portion that forms a continuous plating layer through the plating layer on the inner peripheral surface of the through hole and the other hole end of the through hole. If a conductive part is formed which is made of a resin to which plating is applied and forms a continuous plating layer through the plating layer on the inner peripheral surface of the through hole and the other hole end of the through hole, the through hole Electroplating can be applied to the island-shaped portion that is connected to one end of the hole.

  The conducting portion can be from the other hole end of the through hole to the bottom edge of the resin key top. The conductive part that forms the plating layer from the other hole end of the through hole to the bottom edge of the resin key top is linear, for example, from the portion of the resin with plating that forms the through hole to the surface of the resin without plating. The portion that extends to the bottom edge of the resin key top can be made of a resin that is plated to form a conductive portion, and if such a conductive portion is formed, power is supplied from the bottom edge of the resin key top. The island-shaped part can be electroplated through the conducting part.

  In this way, even if a conductive part is formed so as to cover a part of the resin that does not have plating between the through hole and the bottom edge of the resin key top, the resin that does not have plating is made an opaque colored resin. Thus, the conductive portion can be made invisible from the outside of the resin key top. Thereby, the resin key top excellent in design is obtained.

  Moreover, the conduction | electrical_connection part shall be formed in the bottom face of resin to which the plating which forms a through-hole attaches. That is, if the conductive portion is formed on the bottom surface of the resin to which the plating for forming the through hole is attached, it is not necessary to form the conductive portion protruding to the resin to which the plating is not attached. Therefore, even when a resin that is not plated is made of a transparent resin and used as an illuminated resin key top, the conductive portion is not visually recognized from the outside of the resin key top. Thereby, the resin key top excellent in design is obtained.

  In the resin key top of the present invention, the through hole may be closed by a plating layer formed on the inner peripheral surface of the through hole. If the through hole is closed by the plating layer on the inner peripheral surface, the through hole is not formed on the surface of the resin key top, and the resin key top looks good depending on the design.

  Further, the resin to be plated can be a resin that can be plated by an electroless plating method. Since the island-shaped portion is formed of a resin to which electroless plating is applied, the resin key top is excellent in a design in which the island-shaped portion becomes a plating layer. Furthermore, if the plating layer is subjected to electroplating, it is possible to obtain a plating layer of a metal type that is not attached by electroless plating, and it is possible to increase the thickness of the plating layer, which is excellent in metal tone, A resin key top that is deep and excellent in luxury can be obtained.

  Furthermore, the present invention relates to a method for producing a resin key top having an island-shaped portion separated from an edge of the resin key top and covered with a plating layer, wherein the plating has a through hole in which one hole end leads to the island-shaped portion. After forming a resin key top molded body composed of a resin having a plating and a resin surrounding the resin to which the plating is attached and not having a plating, the resin having the plating is subjected to electroless plating, and then the inner peripheral surface of the through hole is formed. A continuous plating layer is formed through the plating layer and the other hole end of the through-hole, and the electroplating is performed by energizing through a conductive portion made of a resin to which plating is applied to form a plating layer on the island-shaped portion. A method for producing a resin key top is provided.

  Since a resin key top molded body is formed of a resin with plating having a through hole with one hole end leading to the island-shaped part and a resin without plating surrounding the resin with plating, the resin with plating is attached. An island-like portion can be formed, and its periphery can be formed with a resin that is not plated. Then, after electroless plating is applied to the resin to which plating is applied, the electroplating is performed by energizing through the conduction part continuous to the other hole end of the through hole, and the plating layer is formed on the island-shaped part. Electroplating can be easily performed on the island-shaped portion separated from the edge of the key top, and a resin key top having an excellent design can be easily obtained.

  And, if a resin key top molded body having a conductive portion formed of a resin that is plated from the other hole end of the through hole to the bottom edge of the resin key top is used, electricity is supplied from the bottom edge of the resin key top. Electroplating can be performed. If this conducting part is further connected to a runner at the time of molding the resin key top, electroplating can be performed through this runner.

  Further, the electroplating may be performed through a conduction portion provided in a resin portion to be plated to form a hole edge of the through hole on the bottom surface of the resin key top molded body. Since the electroplating is performed through the conductive portion provided in the portion of the resin to be plated that forms the hole edge of the through hole on the bottom surface of the resin key top molded body, the conductive portion is formed so as to cover the resin without the plating. There is no need. Therefore, even when a highly transparent resin is used as the resin to which plating is not applied, a conductive key top having an excellent design can be manufactured without visually recognizing the conductive portion. And this conduction | electrical_connection part can mean the runner or gate (resin injection part of the cavity for resin molding) at the time of resin keytop manufacture, and the plating which forms the resin keytop bottom face is attached. It can also mean the surface of the resin.

  According to the resin key top of the present invention, the resin key top is obtained by performing metal plating on a completely island-like portion (island-like portion). In addition, the resin key top that can be produced in a small number of processes is obtained by integrating the resin with plating and the resin without plating without separation and dropping. Furthermore, it is a resin key top that can have a thick plating layer and is excellent in quality such as gloss.

  According to the method for manufacturing a resin key top of the present invention, it is possible to easily manufacture a resin key top in which an island-shaped portion is subjected to metal plating. In addition, since the plating layer is formed using both electroless plating and electrolytic plating, various types of metal can be selected, and the thickness of the film can be easily controlled.

  The resin key top of the present invention will be described below with reference to the drawings. In each embodiment, the same members as those in the prior art and other embodiments are denoted by the same reference numerals, and redundant description is omitted.

First Embodiment [FIGS. 1 to 3] FIG. 1 to FIG. 3 show a resin key top 21 of the present invention which is a part of a keypad 20 for a pushbutton switch used in a cellular phone 2. The resin key top 21 is a molded body formed of a resin 11 with plating and a resin 12 without plating. In the resin 11 to which plating is applied, a through hole 23 in which one hole end communicates with the upper surface 6 of the resin key top 21 and the other hole end communicates with the bottom surface 22 of the resin key top 21 is formed. For this reason, the resin 11 to which plating is attached is exposed on the inner peripheral surface 24 of the resin key top 21 formed by the through holes 23. Further, on the upper surface 6 of the resin key top 21, an island-like portion 25 is formed so as to expose the resin 11 to which plating is applied in an island shape by the resin 12 to which plating is not applied. On the other hand, the bottom surface 22 of the resin key top 21 surrounds the resin 11 to which plating is applied by the resin 12 to which plating is not applied, but a conductive portion 26 is formed in a part of the resin 12 to which plating is not applied. The conductive portion 26 is made of a resin 11 to which plating is applied, reaches the side surface 27 of the resin key top 21 from the through hole 23, and covers the resin 12 to which no plating is applied.

  A plating layer 10 is formed on the surface of the resin 11 to which plating is applied. In particular, the plating layer 10 is formed as an “island plating layer” on the upper surface 6 of the resin key top 21. On the other hand, the plating layer 10 is not formed on the surface of the resin 12 that is not plated. As a result, the island-like portion 25 on the upper surface 6 of the resin key top 21 is decorated with the plating layer 10. The plating layer 10 is not formed on the side surface 27 of the resin key top 21. Further, the plated layer 10 is formed on the bottom surface 22 around the through hole 23 and the conductive portion 26, and the plated layer 10 is not formed on the other portions of the bottom surface 22.

  In order to manufacture the resin key top 21 having the plating layer 10, first, the resin key top 21 is molded. The resin key top 21 can be molded by a two-color injection molding method. For example, one of the resin 11 with plating and the resin 12 without plating is first molded with a mold, and then this resin molded body is installed in the other mold for molding the other resin. The resin key top 21 is manufactured by integrating both resins by pouring resin. Formation of the plating layer 10 on the obtained resin key top 21 can be performed by an electroless plating method, and the plating layer 10 is formed on the surface of the resin 11 to which plating is applied. If necessary, electroplating is further performed, and plating is performed on the plating layer 10 generated by electroless plating, thereby obtaining a plating layer 10 in which the electroless plating layer and the electroplating layer are laminated.

  In the molding of the resin key top 21, as shown in FIGS. 4 to 7, together with a frame 30 connected to the resin key top 21 by holding bridges (runners) 28 and 29 for convenience of handling the resin key top 21. Mold. Then, electroless plating or electroplating is performed with the frame 30 attached. At the time of electroplating, since most of the frame 30 and the holding bridge 28 are made of the resin 11 to which plating is applied, if the frame 30 is attached to a hook in the plating bath and energized, the frame 30 and the holding bridge 28, Since the conductive portion 26 provided on the bottom surface 22 of the resin key top 21, the through hole 23, and the periphery of the opening of the upper surface 6 are in communication with each other, the upper surface 6 of the resin key top 21 that becomes the island-shaped portion 25 is electroplated. The plating layer 10 is formed. The plating layer 10 can be a metal layer made of a kind of metal normally obtained by each plating treatment by electroless plating or electroplating. In addition, you may make it raise the adhesion strength of a metal by performing an etching process etc. as pre-processing of a plating process. Note that the shape of the frame 30 shown in FIG. 4 is an example of holding the resin key top 21, and as a continuous frame 30 structure, a structure in which several resin key tops 21 are held in one frame. It is also possible to do.

  The size of the through-hole 23, when used as the annular resin key top 4a, needs to be larger than the diameter of the resin key top 4b at the center, but depends on the design to be the plating layer 10 It can be changed as appropriate. The shape of the through hole 23 is the same. If the diameter of the through hole 23 is too small, the hole may be blocked in the plating process. Therefore, when the through hole 23 is left, the diameter of the through hole 23 is preferably 0.5 mm or more. However, in some cases, it is preferable in terms of design that the through hole 23 does not exist. Therefore, the through hole 23 itself can be blocked by the plating layer 10 formed on the surface of the through hole 23. In this case, the plating layer 10 can eliminate the trace of the through hole 23, and a resin key top excellent in appearance can be obtained.

  The molded body made of the resin 11 with plating and the resin 12 without plating can have a cross-sectional shape as shown in FIG. 8, for example, in addition to the cross-sectional shape shown in FIG. . According to the cross-sectional shape of the resin key top 31 shown in FIG. 8, since the resin 12 that does not have plating enters the inside of the resin 11 to which plating is applied, the molding is somewhat difficult, but the plating is attached. Since the contact area between the resin 11 and the resin 12 not plated is widened, it is difficult to cause separation between the two resins.

  For the resin 11 to be plated, a resin having a plating layer formed on the resin surface by an electroless plating method is used. For example, acrylonitrile / butadiene / styrene (ABS) resin, polypropylene (PP) resin, polyphenylene oxide (PPO) Examples thereof include resins such as resins, polyacetal (POM) resins, polyamide resins, polysulfone resins, alloy resins of these resins, alloy resins with polycarbonate (PC) resins, and modified resins thereof.

  Further, as the resin 12 that is not plated, a thermoplastic resin or a thermosetting resin in which a plating layer is not formed on the resin surface by an electroless plating method can be used. For example, polymethyl methacrylate (PMMA) resin, polystyrene ( PS) resin, acrylonitrile / styrene copolymer (AS), methyl methacrylate / styrene copolymer (MS), polycarbonate (PC) resin, polyethylene (PE) resin, crystalline polyolefin resin, polycyclic norbornene methacrylate resin Etc. can be used. In the case where such a resin forms a conductive portion 26 extending from the hole end of the through hole 23 to the bottom edge of the resin key top 21, the conductive portion 26 formed on the bottom surface 22 of the resin key top 21 is plated. It is preferable to use a colored resin having low transparency so that the resin 12 is not visually recognized through the non-sticking resin 12. Moreover, the display part showing a symbol, a character, etc. can be formed by printing etc. in the resin 12 to which the upper surface 6 of the resin key top 21 is not plated.

Second Embodiment [FIGS. 9 to 11] ; The resin key top 41 of the second embodiment is a modification of the first embodiment. In the resin key top 21 of the first embodiment, the conductive portion 26 extending from the hole end of the through hole 23 to the bottom edge of the resin key top 21 is formed on the bottom surface 22 of the resin key top 21 with a part of the resin that is not plated. Whereas the resin key top 41 of the second embodiment is formed so as to cover linearly, a conductive portion 46 is formed on the surface of the resin 11 to which plating for forming the through hole 43 is attached.

  That is, in this embodiment, since the conduction | electrical_connection part 46 is formed in the surface of the resin 11 to which the plating which forms the through-hole 43 is attached in the bottom face 42 of the resin key top 41, it is the conduction | electrical_connection part to the resin 12 which does not have plating. 46 does not stick out. Thereby, even if a transparent resin is used for the resin 12 that is not plated, the conductive portion 46 is not seen through the resin key top 41, and the resin key top 41 with excellent design is obtained.

  The conducting part 46 may be provided so as to protrude outward such as on the printed circuit board side. In particular, in the molding of the resin key top molded body by injection molding, the gate portion 47 remaining at the time of molding can be used as the conductive portion 46 as shown in FIG. In such a case, even if the gate portion 47 is removed, there may be a problem that the bottom surface 42 of the resin key top 41 rises due to the remaining portion and a step is generated. Therefore, in order to prevent this step, the bottom surface 42a of the portion made of the resin 11 to which plating is applied can be provided in advance one step higher than the bottom surface 42b of the portion of the resin 12 to which plating is not applied.

  According to the resin key top 41 according to the present embodiment, the conductive portion 46 is provided on the bottom surface 42 of the resin key top molded body so that it does not protrude from the resin 12 that does not have plating. Even if it uses, the conduction | electrical_connection part 46 is not visually recognized. For this reason, if a highly transparent resin is used as the resin to which plating is not applied, an illuminated resin key top 41 that shines the edge of the resin key top 41 can be obtained. Further, since the gate portion 47 projecting outward from the portion 42a of the resin 11 to which the plating forming the hole edge of the through hole 43 is formed on the bottom surface 42 of the resin key top molded body is used as the conductive portion 46, the gate portion 47 is provided. The electroplating can be easily performed by connecting to a hook in the plating bath.

Other Embodiments : The resin key top according to the present invention includes, in addition to the above-described annular resin key tops 21, 31, 41, the resin key top 4d in FIG. The present invention can also be applied to the other resin key tops 4b to 4c. For example, in the resin key top 51 of the present invention in FIG. 13, the line portion 52 of the numeral “4” is the resin 11 with plating, the resin key top edge 4G is the resin 12 without plating, The inner portion 53 constituting the number “4” can be formed as a through hole 54. The resin key top 51 obtained in this way has a structure in which the upper surface 6 does not have a conductive portion and the plated layer 10 is provided in the line portion 52 of the numeral “4” that becomes the island-shaped portion 55.

  Further, for example, in the resin key top 61 of the present invention in FIG. 14, the first island 63 that is the line portion 62 of the numeral “4” is the resin 11 to which plating is applied, and the edge 4G of the resin key top 61 is The portion can be formed of the resin 12 without plating, and the second island-shaped portion 65 that is the inner portion 64 constituting the numeral “4” can be formed as the resin 12 without plating. In this case, the through hole 66 is formed in the first island portion 63. The diameter of the through-hole 66 is set to a size that can be blocked by the plating layer 10 formed in the line-written portion of the number “4” of the first island 63. The resin key top 61 thus obtained has a structure in which the upper surface 6 does not have a conducting portion and the plated layer 10 is provided in the line portion 62 of the number “4” that becomes the first island-like portion 63. Further, the through hole 66 is also closed and covered with the plating layer 10.

  The resin key tops 51 and 61 may also have a bottom surface (not shown) similar to the bottom surface 22 and the bottom surface 42 shown in FIGS. 3 and 11. That is, the through holes 54 and 66 penetrate from the top surface 6 to the bottom surface, enter the surface of the resin 12 without plating and go to the bottom edge of the resin key tops 51 and 61, and the through holes 54 and 66. Plating can be performed through a conducting portion provided in the vicinity of the hole end. And when a conduction | electrical_connection part is provided even to the surface of the resin 12 which does not attach plating, if the resin 12 which does not have plating is made into opaque colored resin, the conduction | electrical_connection part formed in the bottom face will not be visually recognized. Thus, the resin key tops 51 and 61 excellent in the design in which the plating layer 10 is visually recognized as the complete island portions 55 and 63 are obtained. In addition, when the conductive portion does not protrude from the surface of the resin 12 without plating, the conductive portion is not seen even if the resin 12 without plating is made of a highly transparent resin. Even if it is used as a resin key top, it has an excellent design.

The top view of the resin keytop after plating by 1st Embodiment. The SB-SB sectional view taken on the line of the resin key top shown in FIG. The bottom view of the resin key top shown in FIG. The perspective view which shows the state which shape | molded the resin keytop of the shape shown in FIG. 1 with the frame. The top view of the resin key top with a frame shown in FIG. SC-SC sectional view taken on the line of FIG. FIG. 6 is a bottom view of FIG. 5. FIG. 3 is a cross-sectional view corresponding to FIG. 2, which is a resin key top according to another embodiment. The top view of the resin keytop after plating by 2nd Embodiment. SD-SD sectional view taken on the line of the resin key top shown in FIG. The bottom view of the resin key top shown in FIG. Sectional drawing of the resin keytop molded object of a state with the gate attached. The top view of the resin key top by other embodiment. The top view of the resin key top by other embodiment. FIG. 3 is an external plan view of a mobile phone on which a resin key top is mounted. It is sectional drawing of the keypad for the conventional pushbutton switch mounted in the printed circuit board, and is a figure equivalent to the SA-SA line cross section of FIG. The top view of the conventional resin key top. The top view of the conventional resin key top. The top view of the conventional resin key top. The top view of the conventional resin key top.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,20 Keypad for pushbutton switches 2 Mobile phone 3 Base sheet 4, 4a, 4b, 4c, 4d Resin key top 4G Edge 5 Adhesive 6 Top surface of resin key top 7 Printed circuit board 8 Metal plate spring 9 Contact 10 Plating layer 11 Resin with plating 12 Resin with no plating 13, 25, 45, 54, 66 Island-like part 63 First island-like part 65 Second island-like part 14, 26, 46 Conducting parts 21, 31, 41, 51, 61 Resin key top 22, 42 Resin key top bottom surface 23, 43, 54, 66 Through hole 24 Resin key top inner peripheral surface 27 Resin key top side surface 28, 29 Holding bridge 30 Frame 47 Gate portion 52, 62 Number line portion 53 , 64 Number inside part

Claims (11)

In a resin key top for a pushbutton switch having a resin with plating and a resin without plating that surrounds the surface of the resin with plating and forms an island-shaped portion,
The resin to be plated is provided with a through hole in which one end of the hole leads to the island-like portion, and the island-like portion is provided with an island-like plating layer continuous with the plating layer attached to the inner peripheral surface of the through-hole. Resin key top.   2. The resin key top according to claim 1, wherein the through hole penetrates a resin not plated from the top surface to the bottom surface of the resin key top, and the other hole end opens at the bottom surface of the resin key top.   3. The resin key top according to claim 1, wherein the resin key top is made of a resin to which plating is applied, and is provided with a conductive portion that forms a continuous plating layer through the plating layer on the inner peripheral surface of the through hole and the other hole end of the through hole.   4. The resin key top according to claim 3, wherein the conducting portion extends from the other hole end of the through hole to the bottom edge of the resin key top.   4. The resin key top according to claim 3, wherein the conductive portion is formed on the bottom surface of the resin to which plating for forming the through hole is attached.   The resin key top according to any one of claims 1 to 5, wherein the through hole is closed by a plating layer formed on an inner peripheral surface of the through hole.   The resin key top according to any one of claims 1 to 6, wherein the resin to be plated is a resin that can be plated by an electroless plating method.   The resin key top according to any one of claims 1 to 7, wherein the plating layer is formed by laminating a metal layer formed by electroplating on a metal layer formed by electroless plating. . A method for producing a resin key top having an island-shaped portion separated from an edge of the resin key top and covered with a plating layer,
Forming a resin key top molded body composed of a resin with plating having a through-hole with one hole end leading to the island-shaped portion and a resin without plating surrounding the resin with the plating;
After electroless plating is applied to the resin to be plated,
Form a continuous plating layer through the plating layer on the inner peripheral surface of the through-hole and the other hole end of the through-hole.
A method for producing a resin key top, comprising forming a plating layer on an island portion.   The method for producing a resin key top according to claim 9, wherein a resin key top molded body having a conductive portion formed of a resin that is plated from the other hole end of the through hole to the bottom edge of the resin key top is used.   10. The method for producing a resin key top according to claim 9, wherein electroplating is performed through a conductive portion provided in a resin portion to be plated that forms a hole edge of a through hole on the bottom surface of the resin key top molded body.

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