JP2005081793A - Base material for rewriting card and rewriting card - Google Patents
Base material for rewriting card and rewriting card Download PDFInfo
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- JP2005081793A JP2005081793A JP2003319343A JP2003319343A JP2005081793A JP 2005081793 A JP2005081793 A JP 2005081793A JP 2003319343 A JP2003319343 A JP 2003319343A JP 2003319343 A JP2003319343 A JP 2003319343A JP 2005081793 A JP2005081793 A JP 2005081793A
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- 239000000463 material Substances 0.000 title claims abstract description 58
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 28
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- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 14
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 13
- 239000004417 polycarbonate Substances 0.000 claims description 7
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- 238000004519 manufacturing process Methods 0.000 abstract description 8
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- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 4
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- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004709 Chlorinated polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
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- 239000002964 rayon Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
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- 239000000314 lubricant Substances 0.000 description 1
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- 238000002360 preparation method Methods 0.000 description 1
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Images
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- Credit Cards Or The Like (AREA)
- Heat Sensitive Colour Forming Recording (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本発明は、カード表面に文字、絵などの印刷が可能で印字内容を書き換えることができるリライト層を有するリライトカード用基材およびリライトカードに関し、さらに詳しくは、リライトカード製造時に平滑であって、リーダーライターにより印字消去を繰り返してもカールが生じにくい基材構成を特徴とするリライトカード用基材およびリライトカードに関する。 The present invention relates to a rewritable card substrate and a rewritable card having a rewritable layer capable of printing characters, pictures and the like on the card surface and capable of rewriting the printed content, more specifically, when the rewritable card is manufactured, The present invention relates to a base material for a rewrite card and a rewrite card characterized by a base material structure in which curling does not easily occur even when printing is erased repeatedly by a reader / writer.
近年、ＩＣカードや磁気ストライプカードといった情報がＩＣや磁気テープに記録された硬質プラスチックカードが広く使われるようになったが、記録情報を直視できないため、カード保持者にとって不便なこともあった。これらの情報をカード表面に表示できるようにするため、可逆性感熱記録媒体を用いたリライトカードが提案され、その中でも、発色型(ロイコ型)のリライトカードが普及しつつある。
従来、リライトカードを製造する方法としては、図２に示すように透明熱可塑性樹脂シート２４の上に、基材層となる白色熱可塑性樹脂シート２２、２３を１枚または２枚以上重ね、さらにその上に可逆性感熱層を少なくとも１層有するリライトシート２１を乗せ、熱プレスで加熱圧着し、その後、抜き加工を経てカード形に成型する方法がある。このとき、リライトカード２０のリライトシート２１は、耐熱性、耐溶剤性、寸法安定性の面からＰＥＴ(ポリエチレンテレフタレート)が使用されている。
In recent years, hard plastic cards in which information such as IC cards and magnetic stripe cards are recorded on ICs and magnetic tapes are widely used. However, since the recorded information cannot be directly viewed, there are cases where it is inconvenient for the card holder. In order to be able to display such information on the card surface, a rewrite card using a reversible thermosensitive recording medium has been proposed, and among them, a color development type (leuco type) rewrite card is becoming widespread.
Conventionally, as a method for producing a rewritable card, as shown in FIG. 2, one or two or more white
しかし、このＰＥＴは熱収縮率が他の熱可塑性樹脂に比べて小さく、熱プレスで加熱圧着するとリライトシート面を凸とした約２〜５ｍｍのカールが発生することが多く、リーダーライターにかける際のトラブルの原因になっていた。 However, this PET has a smaller thermal shrinkage rate than other thermoplastic resins, and when it is heat-pressed with a hot press, a curl of about 2 to 5 mm with a convex rewrite sheet surface is often generated. Was causing trouble.
解決しようとする課題は、従来のリライトカードが、製造時の熱プレスによりカールが生じ、カードの繰り返し印字消去する際のトラブルの原因になっていた点である。 The problem to be solved is that the conventional rewritable card is curled by a hot press at the time of manufacture, which causes troubles when repeatedly printing and erasing the card.
本発明者は、カールの発生のないリライトカードを作るべく鋭意検討した結果、リライトカードを構成する基材に着目し、図１に示すリライトカード１０の典型例において、基材層１２と基材層１３の物性をコントロールすることによりカールの発生を１mm未満に抑えられることを見出し、本発明に到達した。
すなわち、本発明は、２層から構成され、それぞれの層が、JIS K7191 A法により測定した荷重たわみ温度が５０〜１５０℃である熱可塑性樹脂からなり、かつ、それぞれの層を形成する熱可塑性樹脂の該たわみ温度が異なることを特徴とするリライトカード用基材に関する。
ここで、２層の熱可塑性樹脂のたわみ温度の差は、１〜８０℃が好ましい。
また、上記熱可塑性樹脂としては、硬質塩化ビニル系樹脂、非結晶性ポリエステルおよびポリカーボネートの群から選ばれた少なくとも１種が好ましい。
さらに、本発明は、オーバーレイ、上記のリライトカード用基材、リライト層がこの順序で積層されたリライトカードであって、該基材が、リライト層に接する層の熱可塑性樹脂の該荷重たわみ温度がオーバーレイに接する層の熱可塑性樹脂の該荷重たわみ温度より高くなるように積層されていることを特徴とするリライトカードに関する。
As a result of intensive studies to make a rewritable card without curling, the present inventor paid attention to the base material constituting the rewritable card, and in the typical example of the
That is, the present invention is composed of two layers, each of which is made of a thermoplastic resin having a deflection temperature under load measured by the JIS K7191 A method of 50 to 150 ° C., and is a thermoplastic that forms each layer. The present invention relates to a rewritable card substrate characterized in that the deflection temperature of the resin is different.
Here, the difference between the deflection temperatures of the two layers of the thermoplastic resin is preferably 1 to 80 ° C.
Moreover, as said thermoplastic resin, at least 1 sort (s) chosen from the group of hard vinyl chloride resin, amorphous polyester, and a polycarbonate is preferable.
Furthermore, the present invention is a rewritable card in which an overlay, the above-mentioned rewritable card base material, and a rewritable layer are laminated in this order, wherein the base material is the deflection temperature under load of the thermoplastic resin of the layer in contact with the rewritable layer. The present invention relates to a rewritable card characterized by being laminated so as to be higher than the deflection temperature under load of the thermoplastic resin of the layer in contact with the overlay.
本発明のリライトカード用基材から構成されるリライトカードは、カード製造時の熱プレスによるカールの発生もなく、リーダーライターによる印字・消去を繰り返してもカールを発生することがない。リライトカードのカールにともなうトラブル解決にきわめて有効である。 The rewritable card composed of the rewritable card substrate of the present invention does not cause curling due to hot pressing during card production, and does not generate curl even when printing and erasing by a reader / writer are repeated. It is extremely effective in solving problems associated with curling rewrite cards.
本発明の特徴は、リライトカード用基材として、５０〜１５０℃の荷重たわみ温度(JIS K7191 A法)を示す熱可塑性樹脂が用いられ、また、基材が荷重たわみ温度がそれぞれ異なる２つの熱可塑性樹脂層から構成されることであり、さらに、これを用いリライトカードとする際には、リライト層に接する基材層１２の荷重たわみ温度が、オーバーレイに接する基材層１３の荷重たわみ温度より高くなるように積層することにある。 A feature of the present invention is that a thermoplastic resin exhibiting a deflection temperature under load (JIS K7191 A method) of 50 to 150 ° C. is used as a substrate for a rewritable card, and the substrate has two heats with different deflection temperatures under load. When the rewritable card is made of a plastic resin layer, the deflection temperature under load of the base material layer 12 in contact with the rewritable layer is higher than the deflection temperature under load of the base material layer 13 in contact with the overlay. It is to be laminated so as to be higher.
以下、実施の形態を図面により説明する。
本発明によるリライトカード用基材を用いたリライトカードの構成の典型例を図１に示す。符号１０は本発明のリライトカードである。
図１において、符号１１は可逆性感熱記録機能を有するリライト層を示すが、ここでいうリライト層は、保護層、記録層、ＰＥＴ支持体、接着層などからなる複合フィルムであって総厚み３０〜５０μｍ程度のものがサーマルリライトフィルム(原反)として入手可能であり、これらを用いることができる。
また、符号１４は、通常、オーバーレイと言われる印刷可能な透明シートであって、５０〜１００μｍ程度のものがプラスチックカード向けに市販されており、硬質塩化ビニル系フィルム、ＰＥＴＧ（非結晶性ポリエステル）系フィルムなどが知られている。本発明においては、これらのどのようなものも用いることができる。
Hereinafter, embodiments will be described with reference to the drawings.
A typical example of the configuration of a rewrite card using the base material for a rewrite card according to the present invention is shown in FIG.
In FIG. 1,
本発明の特徴である、２層からなるリライトカード用基材は、図１における基材層１２、基材層１３の部分であり、白色および／または透明のものが一般的であるがそれに限定される物ではなくまた、それぞれ４０〜７２０μｍの厚さのものが好ましい。４０μｍ未満では、本発明の効果を発揮することができず、一方、７２０μｍを超えると最終カードの総厚みの調整が困難である。さらに好ましくは、５０〜７００μｍである。なお、基材層１２と基材層１３の厚みは同一である必要はなく、リライト層１１とオーバーレイ１４の厚さにより選択され、最終リライトカードの総厚みが６８０μｍ〜８４０μｍになるように調整される。
The rewritable card substrate comprising two layers, which is a feature of the present invention, is a portion of the substrate layer 12 and the substrate layer 13 in FIG. 1, and is generally white and / or transparent, but is limited thereto. In addition, each having a thickness of 40 to 720 μm is preferable. If it is less than 40 μm, the effect of the present invention cannot be exhibited. On the other hand, if it exceeds 720 μm, it is difficult to adjust the total thickness of the final card. More preferably, it is 50-700 micrometers. The thicknesses of the base material layer 12 and the base material layer 13 do not have to be the same, and are selected according to the thickness of the
基材に用いられる熱可塑性樹脂としては、塩化ビニルホモポリマー、酢酸ビニル３〜２０％の塩ビ酢ビコポリマー、塩素化塩ビポリマーなどの硬質塩化ビニル系樹脂、ＰＥＴＧ系、超高分子量アクリル樹脂、高分子量塩素化ポリエチレン、ＡＢＳ（アクリロニトリル−ブタジエン−スチレン）樹脂、ＭＢＳ（メタクリレート−ブタジエン−スチレン）樹脂、ウレタン樹脂、ＰＳ（ポリスチレン)、ＰＣ（ポリカーボネート)、ＰＡＲ（ポリアリレート)、ＡＳ（アクリロニトリルスチレン)、ＰＥＩ（ポリイミド)などが挙げられる。これらは、１種単独でもよく、２種以上を組み合わせてもよく、需要に応じ使いわけられる。中でも、硬質塩化ビニル系樹脂、ＰＥＴＧ系、ＰＣなどが好ましい。また、これらの熱可塑性樹脂には、可塑剤、安定剤などの添加剤を含んでいてもよい。なお、基材層１２と基材層１３の熱可塑性樹脂は同一である必要はなく、異なったものを用いることもできる。 The thermoplastic resin used for the base material is a vinyl chloride homopolymer, a vinyl acetate vinyl acetate copolymer of 3 to 20% vinyl acetate, a hard vinyl chloride resin such as a chlorinated vinyl chloride polymer, PETG, an ultrahigh molecular weight acrylic resin, a high Molecular weight chlorinated polyethylene, ABS (acrylonitrile-butadiene-styrene) resin, MBS (methacrylate-butadiene-styrene) resin, urethane resin, PS (polystyrene), PC (polycarbonate), PAR (polyarylate), AS (acrylonitrile styrene), PEI (polyimide) etc. are mentioned. These may be used alone or in combination of two or more, and can be used according to demand. Of these, hard vinyl chloride resin, PETG, and PC are preferable. These thermoplastic resins may contain additives such as plasticizers and stabilizers. In addition, the thermoplastic resin of the base material layer 12 and the base material layer 13 does not need to be the same, A different thing can also be used.
本発明において、基材に用いられる熱可塑性樹脂の、JIS K7191 A法により測定した荷重たわみ温度（以下、単に荷重たわみ温度ともいう）は５０〜１５０℃、好ましくは６０〜１４５℃の範囲にある。荷重たわみ温度が５０℃未満ではカードが使用される環境温度−３５〜＋５０℃で寸法変化およびカールを発生し、一方１５０℃を超えると熱プレスによる加熱圧着が難しくなる。
また、基材は２層からなり、それぞれの層を形成する熱可塑性樹脂は異なった荷重たわみ温度を持つが、荷重たわみ温度の差は１〜８０℃が好ましい。この温度が１℃未満では、２層の荷重たわみ温度差が少なすぎるため、カールを１ｍｍ未満に抑えることができず、一方、８０℃を超えるとカード成形後、リーダーライターの印刷によってカールが大きくなってしまう。好ましくは５〜７５℃、さらに好ましくは１０〜５０℃である。
In the present invention, the deflection temperature under load (hereinafter also simply referred to as the deflection temperature under load) of the thermoplastic resin used for the substrate measured by the JIS K7191 A method is in the range of 50 to 150 ° C, preferably 60 to 145 ° C. . When the deflection temperature under load is less than 50 ° C., dimensional change and curl occur at an ambient temperature of −35 to + 50 ° C. where the card is used.
The base material is composed of two layers, and the thermoplastic resins forming the respective layers have different deflection temperatures under load, but the difference in deflection temperature under load is preferably 1 to 80 ° C. If this temperature is less than 1 ° C, the difference in deflection temperature between the two layers is too small, so the curl cannot be suppressed to less than 1 mm. On the other hand, if it exceeds 80 ° C, the curl becomes large due to printing by the reader / writer after card molding. turn into. Preferably it is 5-75 degreeC, More preferably, it is 10-50 degreeC.
基材が２層からなり、基材層１２と基材層１３のそれぞれの熱可塑性樹脂のたわみ温度に差を発現させることが本発明の特徴である。基材シートの成型加工にあたって、熱可塑性樹脂自体の物性を考慮した基材層１２、基材層１３の構成を選択することは必然であるが、熱可塑性樹脂に荷重たわみ温度を高くする添加物あるいは低くする添加物を添加して調整することができる。
ここで、リライトカードとしたときに、リライト層に接する側の層、すなわち、図１の基材層１２の熱可塑性樹脂の荷重たわみ温度が、オーバーレイに接する側の層、すなわち、図１の基材層１３の熱可塑性樹脂の荷重たわみ温度より高くなるように基材を積層する必要がある。このような順序で積層しないと、リライトカードのカールを低減するという本発明の効果は得られない。
It is a feature of the present invention that the base material is composed of two layers, and the difference in the deflection temperature of the thermoplastic resins of the base material layer 12 and the base material layer 13 is expressed. In molding the base material sheet, it is necessary to select the structure of the base material layer 12 and the base material layer 13 in consideration of the physical properties of the thermoplastic resin itself, but an additive for increasing the deflection temperature under load on the thermoplastic resin. Or it can adjust by adding the additive to make low.
Here, when the rewritable card is used, the layer on the side in contact with the rewritable layer, that is, the deflection temperature under load of the thermoplastic resin of the base material layer 12 in FIG. The base material needs to be laminated so as to be higher than the deflection temperature under load of the thermoplastic resin of the material layer 13. If the layers are not laminated in this order, the effect of the present invention for reducing the curl of the rewrite card cannot be obtained.
基材が硬質塩化ビニル系樹脂からなる場合、塩化ビニルホモポリマー、酢酸ビニル３〜２０％の塩ビ酢ビコポリマー、塩素化塩ビポリマーなどが着色剤、安定剤、滑剤とともに通常のカレンダー処方によりシート化される。ここで、基材層１２と基材層１３の荷重たわみ温度に差を発現させるため、塩ビホモポリマーよりも荷重たわみ温度の高い塩素化塩ビポリマーの基材層１２での含有量を、基材層１３での含有量より多くすることで、基材層１２のたわみ温度を基材層１３より高くすることができる。また、同様に基材層１２に荷重たわみ温度の高い超高分子量アクリル樹脂、高分子量塩素化ポリエチレン、ＡＢＳ（アクリロニトリル−ブタジエン−スチレン共重合体）樹脂、ＭＢＳ（メタクリレート−ブタジエン−スチレン）樹脂を配合してシートを成型しても、荷重たわみ温度に差を設けることができる。これらの荷重たわみ温度の高い樹脂の添加量は、硬質塩化ビニル系樹脂１００重量％に対して、通常、５〜３０重量％であり、好ましくは８〜１５重量％である。 When the base material is made of hard vinyl chloride resin, vinyl chloride homopolymer, vinyl acetate vinyl acetate copolymer of 3-20% vinyl acetate, chlorinated vinyl chloride polymer, etc. are made into a sheet by a normal calendering formula together with colorant, stabilizer and lubricant. Is done. Here, in order to express a difference in the deflection temperature under load between the base material layer 12 and the base material layer 13, the content of the chlorinated vinyl polymer having a higher deflection temperature under load than the PVC homopolymer in the base material layer 12 is determined by By increasing the content in the layer 13, the deflection temperature of the base material layer 12 can be made higher than that in the base material layer 13. Similarly, the base layer 12 is blended with a high molecular weight acrylic resin, a high molecular weight chlorinated polyethylene, an ABS (acrylonitrile-butadiene-styrene copolymer) resin, and an MBS (methacrylate-butadiene-styrene) resin having a high deflection temperature under load. Even if the sheet is molded, a difference in the deflection temperature under load can be provided. The amount of these resins having a high deflection temperature under load is usually 5 to 30% by weight, preferably 8 to 15% by weight, based on 100% by weight of the hard vinyl chloride resin.
さらに、基材層１３に対して荷重たわみ温度の低いＡＢＳ樹脂、ＭＢＳ樹脂、ウレタン樹脂を添加してシートを成型し、荷重たわみ温度に差を設けることができる。これらの樹脂の添加量は硬質塩化ビニル系樹脂の合計量１００重量％に対して５〜３０重量％、好ましくは、８〜１５重量％である。また、荷重たわみ温度を下げるため、可塑剤、安定剤の含有量を基材層１２より基材層１３に多くすることにより差を発現させることもできる。これらの添加量は、硬質塩化ビニル系樹脂の合計量１００重量％に対して１〜１５重量％、好ましくは２〜１０重量％である。 Furthermore, a sheet can be molded by adding ABS resin, MBS resin, and urethane resin having a low deflection temperature to the base material layer 13, and a difference can be provided in the deflection temperature under load. The amount of these resins added is 5 to 30% by weight, preferably 8 to 15% by weight, based on 100% by weight of the total amount of the hard vinyl chloride resin. Further, in order to lower the deflection temperature under load, the difference can be expressed by increasing the content of the plasticizer and the stabilizer in the base material layer 13 rather than the base material layer 12. These addition amounts are 1 to 15% by weight, preferably 2 to 10% by weight with respect to 100% by weight of the total amount of the hard vinyl chloride resin.
また、基材が非結晶性ポリエステルであるＰＥＴＧからなる場合、ＰＥＴＧに対し、ＰＳ（ポリスチレン)、ＡＢＳ樹脂、ＰＣ（ポリカーボネート)、ＰＡＲ（ポリアリレート)、ＭＢＳ、ＡＳ（アクリロニトリルスチレン)、ＰＥＩ（ポリイミド)などのＰＥＴＧよりも荷重たわみ温度の高い樹脂を基材層１２にブレンドして、荷重たわみ温度に基材層１３との差を発現するシートを押出加工で作ることができる。これらの樹脂のブレンド量は、ブレンドした樹脂の合計量１００重量％中５〜８０重量％、好ましくは１０〜７０重量％である。
また、基材層１３に対して、荷重たわみ温度の低いＡＢＳ樹脂、ＭＢＳ樹脂、ウレタン樹脂を添加してシートを成型し、荷重たわみ温度に基材層１２との差を設けることができる。これらの樹脂の添加量は、樹脂の合計量１００重量％に対して５〜３０重量％、好ましくは、８〜１５重量％である。
さらに、基材層１３の荷重たわみ温度を下げるため、可塑剤の含有量を、基材層１２より基材層１３に多くすることにより差を発現させることもできる。これらの添加量は、樹脂の合計量１００重量％に対して０．５〜１０重量％、好ましくは１〜８重量％である。
When the base material is made of PETG which is an amorphous polyester, PS (polystyrene), ABS resin, PC (polycarbonate), PAR (polyarylate), MBS, AS (acrylonitrile styrene), PEI (polyimide) with respect to PETG A resin having a higher deflection temperature than PETG, such as PETG, can be blended with the base material layer 12 to produce a sheet exhibiting a difference from the base material layer 13 in the deflection temperature under load. The blending amount of these resins is 5 to 80% by weight, preferably 10 to 70% by weight, in 100% by weight of the total amount of the blended resins.
Moreover, a sheet can be molded by adding ABS resin, MBS resin, or urethane resin having a low load deflection temperature to the substrate layer 13, and a difference between the substrate layer 12 and the substrate layer 12 can be provided. The addition amount of these resins is 5 to 30% by weight, preferably 8 to 15% by weight, based on 100% by weight of the total amount of the resin.
Furthermore, in order to lower the deflection temperature under load of the base material layer 13, the difference can be expressed by increasing the content of the plasticizer in the base material layer 13 rather than the base material layer 12. These addition amounts are 0.5 to 10% by weight, preferably 1 to 8% by weight, based on 100% by weight of the total amount of the resin.
上記のような基材を構成する基材層１２、基材層１３の各シートは、リライト層１１ならびにオーバーレイ１４の各フィルムとともに加熱圧着されてリライトカードが製造される。
加熱圧着は、上記の各層を構成するシートおよびフィルムをステンレス板で挟み、１００〜１５０℃で５〜１０分間、面圧１０〜２５ｋｇ／ｃｍ2でプレスして積層すればよい。冷却後に取り出して、カード型に抜き加工を行いカードを作製することができる。
なお、その際に基材層１２、基材層１３、あるいはそれらの積層シートにＩＣやコイル、磁気テープなどを装填したシートを用いて高機能複合カードとすることもできる。
Each sheet of the base material layer 12 and the base material layer 13 constituting the base material as described above is heat-pressed together with each film of the
The thermocompression bonding may be performed by sandwiching the sheet and film constituting each of the above layers with a stainless steel plate and pressing at 100 to 150 ° C. for 5 to 10 minutes at a surface pressure of 10 to 25 kg / cm 2 for lamination. It can be taken out after cooling and punched into a card mold to produce a card.
At that time, a high-performance composite card can be obtained by using the base material layer 12, the base material layer 13, or a sheet in which an IC, a coil, a magnetic tape, or the like is loaded on the laminated sheet.
次に、本発明を実施例および比較例によって具体的に説明する。
＜オーバーレイの作製＞
表１に示す組成内容でオーバーレイを作製した。Ａ−１についてはスーパーミキサーでブレンド後、カレンダー加工にて１００μｍのフィルムを作成した。Ａ−２については押出機にて１００μｍのフィルムを作製した。
Next, the present invention will be specifically described with reference to examples and comparative examples.
<Production of overlay>
An overlay was prepared with the composition shown in Table 1. For A-1, a 100 μm film was prepared by calendaring after blending with a super mixer. About A-2, the film of 100 micrometers was produced with the extruder.
＊１）平均重合度８００のポリ塩化ビニル
＊２）三菱レイヨン製「メタブレン」
＊３）スズ系安定剤
＊４）ＤＯＰ
＊５）イーストマンケミカル製「イースター６７６３」
* 1) Polyvinyl chloride with an average degree of polymerization of 800 * 2) "Metablene" manufactured by Mitsubishi Rayon
* 3) Tin-based stabilizer * 4) DOP
* 5) “Easter 6863” manufactured by Eastman Chemical
＜基材の作製＞
表２〜３に示す組成内容で、基材層用のシートを作製した。Ｂ−１〜Ｂ−５はスーパーミキサーでブレンド後、カレンダー加工にてフィルムを作製した。Ｃ−１〜Ｃ−６は二軸押出機にて混練しペレット作成後、一軸押出機にてフィルムを作成した。
また、得られたシートの荷重たわみ温度をJIS K7191 A法により測定した。結果を表２〜３に示す。
<Preparation of base material>
The sheet | seat for base material layers was produced with the composition content shown to Tables 2-3. B-1 to B-5 were blended with a super mixer, and then a film was prepared by calendering. C-1 to C-6 were kneaded with a twin screw extruder to produce pellets, and then a film was made with a single screw extruder.
Further, the deflection temperature under load of the obtained sheet was measured by JIS K7191 A method. The results are shown in Tables 2-3.
＊６）平均重合度８００のポリ塩化ビニル
＊７）積水化学工業製「セキスイＰＶＣ−ＨＡ」
＊８）酢ビ５％、平均重合度８００の塩ビ酢ビコポリマー
＊９）三菱レイヨン製「メタブレン」
＊10）スズ系安定剤
＊11）ＤＯＰ
＊12）ルチル型酸化チタン
* 6) Polyvinyl chloride with an average degree of polymerization of 800 * 7) "Sekisui PVC-HA" manufactured by Sekisui Chemical Co., Ltd.
* 8) Vinyl chloride vinyl acetate copolymer with 5% vinyl acetate and average polymerization degree of 800 * 9) "Metablene" manufactured by Mitsubishi Rayon
* 10) Tin stabilizer * 11) DOP
* 12) Rutile titanium oxide
＊13）イーストマンケミカル製「イースター６７６３」
＊14）ＧＥプラスチックス製「レキサン１３１」
＊15）ユニチカ製「Ｕポリマー Ｕ−１００」
＊16）ＧＥプラスチックス製「ウルテム１０００」
＊17）ルチル型酸化チタン
* 13) “Easter 6863” manufactured by Eastman Chemical
* 14) GE Plastics “Lexan 131”
* 15) Unitika's “U polymer U-100”
* 16) "Ultem 1000" made by GE Plastics
* 17) Rutile titanium oxide
＜カードの作製＞
作製したオーバーレイおよび基材層シートとリライトシート(三菱製紙製ＴＲＧＳ３３ＴＡ)を表４に示す厚さと層構成で重ね合わせ、これをステンレス板で挟み、実施例１〜４および９、比較例１〜３および５については、１３５℃で５分間、面圧１５ｋｇ／ｃｍ2でプレスして積層し、冷却後に取り出して、カード型に抜き加工を行いカードを作製した。また、実施例５〜８、比較例４，６，７は１１０℃で５分間、面圧１５ｋｇ／ｃｍ2でプレスして積層し、冷却後に取り出して、カード型に抜き加工を行いカードを作成した。
<Production of card>
The produced overlay and base material layer sheet and rewritable sheet (TRGS33TA manufactured by Mitsubishi Paper Industries Co., Ltd.) were overlaid with the thickness and layer configuration shown in Table 4, and sandwiched between stainless steel plates. Examples 1-4 and 9, Comparative Examples 1-3 For 5 and 5, the laminate was pressed at 135 ° C. for 5 minutes at a surface pressure of 15 kg / cm 2 to be laminated, taken out after cooling, and punched into a card mold to produce a card. Examples 5 to 8 and Comparative Examples 4, 6, and 7 were pressed and laminated at 110 ° C. for 5 minutes at a surface pressure of 15 kg / cm 2 , taken out after cooling, and punched into a card mold to produce a card. did.
＜評価＞
各実施例および比較例のカード製造後のカール量とClearjet社製のリーダーライターＣＰ２にて印字消去を５０回行いカール量を測定し、１．０mm未満のものを◎、１．０〜１．５mmのものを○、１．５〜５．０のものを△、５．０mm以上のものを×とした。
カードのカール量の評価結果については表５に示す。
<Evaluation>
The curl amount after card production in each of the examples and the comparative example and the erase amount of printing were measured 50 times with a reader / writer CP2 manufactured by Clearjet, and the curl amount was measured. A sample having a thickness of 5 mm was evaluated as ◯, a sample having a thickness of 1.5 to 5.0 was evaluated as Δ, and a sample having a size of 5.0 mm or more was evaluated as ×.
Table 5 shows the evaluation results of the curl amount of the card.
本発明のリライトカード用基材から構成されるリライトカードは、カード製造時の熱プレスによるカールの発生がなく、リーダーライターによる印字・消去を繰り返してもカールを発生することがなく、繰り返し使用に耐える、記録情報を直視できるリライトカードに用いることができる。 The rewritable card composed of the rewritable card base material of the present invention does not generate curl due to heat press during card manufacturing, and does not generate curl even after repeated printing and erasing with a reader / writer. It can be used for a rewrite card that can withstand recorded information.
１０ 本発明のリライトカード
１１ リライト層
１２ 基材層
１３ 基材層
１４ オーバーレイ
２０ 従来のリライトカード
10 Rewrite Card of the
Claims (4)
An overlay, a rewritable card substrate according to any one of claims 1 to 3, and a rewritable card in which a rewritable layer is laminated in this order, wherein the substrate is a layer of thermoplastic resin in contact with the rewritable layer. A rewritable card, wherein the deflection temperature under load is laminated so as to be higher than the deflection temperature under load of the thermoplastic resin of the layer in contact with the overlay.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003319343A JP4131494B2 (en) | 2003-09-11 | 2003-09-11 | Rewrite card |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2003319343A JP4131494B2 (en) | 2003-09-11 | 2003-09-11 | Rewrite card |
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| JP2005081793A true JP2005081793A (en) | 2005-03-31 |
| JP4131494B2 JP4131494B2 (en) | 2008-08-13 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007090834A (en) * | 2005-09-30 | 2007-04-12 | Mitsubishi Plastics Ind Ltd | Information displaying medium |
| JP2007090833A (en) * | 2005-09-30 | 2007-04-12 | Mitsubishi Plastics Ind Ltd | Information displaying medium |
| JP2008080568A (en) * | 2006-09-26 | 2008-04-10 | Mitsubishi Paper Mills Ltd | Thermal recording material and thermal recording material laminate |
| JP2016071803A (en) * | 2014-10-01 | 2016-05-09 | 共同印刷株式会社 | Media with reversible thermosensitive recording sheet |
-
2003
- 2003-09-11 JP JP2003319343A patent/JP4131494B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007090834A (en) * | 2005-09-30 | 2007-04-12 | Mitsubishi Plastics Ind Ltd | Information displaying medium |
| JP2007090833A (en) * | 2005-09-30 | 2007-04-12 | Mitsubishi Plastics Ind Ltd | Information displaying medium |
| JP4739891B2 (en) * | 2005-09-30 | 2011-08-03 | 三菱樹脂株式会社 | Information display medium |
| JP4745776B2 (en) * | 2005-09-30 | 2011-08-10 | 三菱樹脂株式会社 | Information display medium |
| JP2008080568A (en) * | 2006-09-26 | 2008-04-10 | Mitsubishi Paper Mills Ltd | Thermal recording material and thermal recording material laminate |
| JP4584221B2 (en) * | 2006-09-26 | 2010-11-17 | 三菱製紙株式会社 | Thermal recording material and thermal recording material laminate |
| JP2016071803A (en) * | 2014-10-01 | 2016-05-09 | 共同印刷株式会社 | Media with reversible thermosensitive recording sheet |
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