JP2005080230A - Lc composite component - Google Patents

Lc composite component Download PDF

Info

Publication number
JP2005080230A
JP2005080230A JP2003311862A JP2003311862A JP2005080230A JP 2005080230 A JP2005080230 A JP 2005080230A JP 2003311862 A JP2003311862 A JP 2003311862A JP 2003311862 A JP2003311862 A JP 2003311862A JP 2005080230 A JP2005080230 A JP 2005080230A
Authority
JP
Japan
Prior art keywords
capacitor
conductor
composite component
coil
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003311862A
Other languages
Japanese (ja)
Inventor
Kensho Nagatomo
憲昭 長友
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP2003311862A priority Critical patent/JP2005080230A/en
Publication of JP2005080230A publication Critical patent/JP2005080230A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Filters And Equalizers (AREA)
  • Ceramic Capacitors (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LC composite component whose strength is increased by increasing the mechanical strength. <P>SOLUTION: In the LC composite component 10 wherein a laminate provided with a coil part 16 for forming a coil conductor by laminating a plurality of sheet materials for forming an inner conductor to form a coil conductor and capacitor parts 14, 18 by laminating a plurality of sheet materials for forming an inner conductor to form a capacitor conductor, and formed by integrally baking them is provided with an external electrode connected to the coil conductor and the capacitor conductor, the capacitor parts 14, 18 are located beneath surface protection layers 13, 19 formed to both upper and lower faces of the layered body. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、電子機器などのノイズを除去するフィルタとして機能するインダクタとキャパシタとを備えたLC複合部品に関する。   The present invention relates to an LC composite component including an inductor and a capacitor that function as a filter for removing noise such as electronic equipment.

電子機器などのノイズを除去するフィルタとして用いられ、インダクタ(コイル部)とキャパシタ(コンデンサ部)とを複合してモノリシック構造としたLC複合部品が知られている。
従来、この種のLC複合部品は、誘電体材料と磁性体材料との混合材料の表面に導体を形成し、これを積層することによって形成されたインダクタ及びキャパシタにより構成されている。この場合、インダクタ及びキャパシタとなる導電膜(内部導体)を形成した層は、積層体の中間層に配置された構成となっている。
There is known an LC composite component that is used as a filter for removing noise from an electronic device or the like and has a monolithic structure by combining an inductor (coil portion) and a capacitor (capacitor portion).
Conventionally, this type of LC composite component is composed of an inductor and a capacitor formed by forming a conductor on the surface of a mixed material of a dielectric material and a magnetic material and laminating them. In this case, the layer in which the conductive film (internal conductor) serving as the inductor and the capacitor is formed is arranged in the intermediate layer of the multilayer body.

また、従来のチップ型電子部品においては、電子部品素体(積層体)の上下両面(端子電極を設けた端面どうしを結ぶ方向に延在する側面)近傍に、この上下両面と平行方向にセラミックス焼結体よりも熱膨張係数の大きな材料よりなる圧縮応力付与層を設けることにより、引張応力に弱いセラミックス焼結体である電子部品素体の耐破壊応力を向上させたものが提案されている。(たとえば、特許文献1参照)
特開平9−134304号公報
In a conventional chip-type electronic component, ceramics are placed in the vicinity of the upper and lower surfaces of the electronic component body (laminated body) (side surfaces extending in the direction connecting the end surfaces provided with the terminal electrodes) in a direction parallel to the upper and lower surfaces. It has been proposed to improve the fracture resistance of the electronic component body, which is a ceramic sintered body that is weak against tensile stress, by providing a compressive stress applying layer made of a material having a larger thermal expansion coefficient than the sintered body. . (For example, see Patent Document 1)
JP-A-9-134304

しかしながら、従来のLC複合部品においては、上下表面層の材料自体に十分な強度がなく弱いと、温度変化による熱応力や曲げ応力等の機械的な強度が不足する場合があり、信頼性や耐久性の面で不都合を生じることが懸念される。
本発明は、上記の事情に鑑みてなされたもので、機械的な強度を増して高強度化したLC複合部品の提供を主目的としている。
However, in conventional LC composite parts, if the material of the upper and lower surface layers itself is not strong enough and is weak, mechanical strength such as thermal stress and bending stress due to temperature change may be insufficient, and reliability and durability There is a concern that inconvenience will occur in terms of sex.
The present invention has been made in view of the above circumstances, and has as its main object to provide an LC composite component having increased mechanical strength and increased strength.

本発明は、上記の課題を解決するため、以下の手段を採用した。
本発明に係るLC複合部品は、内部導体を形成した複数のシート状材料を積層しコイル導体を形成するコイル部と、内部導体を形成した複数のシート状材料を積層しキャパシタ導体を形成するコンデンサ部とを具備し、これらを一体的に焼成してなる積層体に前記コイル導体及び前記キャパシタ導体に接続された外部電極が設けられているLC複合部品であって、前記積層体の上下両面に形成される表面保護層の直下に前記コンデンサ部を配設したことを特徴としている。
The present invention employs the following means in order to solve the above problems.
The LC composite component according to the present invention includes a coil portion that forms a coil conductor by laminating a plurality of sheet-like materials that form internal conductors, and a capacitor that forms a capacitor conductor by laminating a plurality of sheet-like materials that form internal conductors And a laminated body formed by integrally firing these parts, and external electrodes connected to the coil conductor and the capacitor conductor are provided on both upper and lower surfaces of the laminated body. The capacitor portion is arranged immediately below the surface protective layer to be formed.

このようなLC複合部品によれば、積層体の上下両面に形成される表面保護層の直下にコンデンサ部を配設したので、高収縮層である大面積の内部導体が表面保護層と隣接する位置に積層されることとなる。このような高収縮層は、圧縮応力付与層として機能するので、LC複合部品を高強度化することができる。
なお、表面保護層についても非磁性絶縁材料よりなる高収縮材料を採用し、上述した誘電材料層とともに圧縮応力付与層を形成することが望ましい。
According to such an LC composite component, since the capacitor portion is disposed immediately below the surface protective layer formed on the upper and lower surfaces of the laminate, the large-area internal conductor that is a high shrinkage layer is adjacent to the surface protective layer. It will be laminated in the position. Such a high shrinkage layer functions as a compressive stress applying layer, so that the strength of the LC composite component can be increased.
In addition, it is desirable that the surface protective layer is made of a highly shrinkable material made of a nonmagnetic insulating material, and a compressive stress applying layer is formed together with the above-described dielectric material layer.

また、上記のLC複合部品においては、前記コンデンサ部と前記コイル部との間に浮遊容量低減層を設けることが好ましく、これにより、コンデンサ部とコイル部との間の浮遊容量が低減されるので、高周波特性を向上させることができる。   Further, in the above LC composite component, it is preferable to provide a stray capacitance reducing layer between the capacitor portion and the coil portion, thereby reducing stray capacitance between the capacitor portion and the coil portion. High frequency characteristics can be improved.

本発明のLC複合部品によれば、積層体の上下両面に圧縮応力付与層が形成されているので、機械的強度を増して高強度化した製品を提供することができる。
また、浮遊容量低減層を設けてコンデンサ部とコイル部との間の浮遊容量を低減したので、LC複合部品の高周波特性を向上させることにより、優れたノイズ除去特性の製品を得ることができる。
According to the LC composite component of the present invention, since the compressive stress applying layers are formed on the upper and lower surfaces of the laminate, it is possible to provide a product with increased mechanical strength and increased strength.
In addition, since the stray capacitance reduction layer is provided to reduce stray capacitance between the capacitor portion and the coil portion, a product with excellent noise removal characteristics can be obtained by improving the high frequency characteristics of the LC composite component.

以下、本発明によるLC複合部品の一実施形態を図面に基づいて説明する。なお、本実施形態は2端子型ノイズフィルタに適用したものであり、図1は本実施形態におけるLC複合部品の分解斜視図、図2(a)は図1の完成状態を示すLC複合部品の外観斜視図、図2(b)はLC複合部品の等価回路図、図3は図1に示した積層体のA−A断面図である。   Hereinafter, an embodiment of an LC composite component according to the present invention will be described with reference to the drawings. The present embodiment is applied to a two-terminal type noise filter. FIG. 1 is an exploded perspective view of the LC composite component in the present embodiment, and FIG. 2A is an LC composite component showing the completed state of FIG. FIG. 2B is an equivalent circuit diagram of the LC composite component, and FIG. 3 is an AA cross-sectional view of the laminate shown in FIG.

図1ないし図3において、LC複合部品10は、磁性材料及び誘電材料の混合材料よりなるシート状材料を複数枚積層して一体化した構成とされる。また、略直方体形状の積層体としたLC複合部品10の対向する2側面には、後述する3組の内部導体と引出電極を介して接続されている2つの外部電極11,12が分配して設けられている。
図1に示す構成例では、積層体としたLC複合部品10の上から順に、第1表面保護層13、第1コンデンサ部14、第1浮遊容量低減層15、コイル部16、第2浮遊容量低減層17、第2コンデンサ部18及び第2表面保護層19を配置してある。
1 to 3, the LC composite component 10 has a structure in which a plurality of sheet-like materials made of a mixed material of a magnetic material and a dielectric material are stacked and integrated. In addition, two external electrodes 11 and 12 connected via three lead conductors and lead electrodes, which will be described later, are distributed on two opposing side surfaces of the LC composite component 10 formed as a substantially rectangular parallelepiped laminate. Is provided.
In the configuration example shown in FIG. 1, the first surface protective layer 13, the first capacitor unit 14, the first stray capacitance reducing layer 15, the coil unit 16, and the second stray capacitance are sequentially formed from the top of the LC composite component 10 that is a laminated body. A reduction layer 17, a second capacitor portion 18, and a second surface protective layer 19 are disposed.

第1表面保護層13及び第2表面保護層14は、積層体の上下両面に配設したシート状の高収縮材料であり、後述する第1及び第2コンデンサ部14,18の内部導体と共に圧縮応力付与層を形成している。このような第1表面保護層13及び第2表面保護層19のシート状材料には、たとえば表1に示す材料Aが採用される。
なお、材料Aの材料組成を見ると、ガラスの割合(wt%)がかなり多くなっている反面、磁性体及び誘電体の割合は比較的少なくなっており、従って、透磁率及び誘電率が小さい(低い)材料特性を有する非磁性絶縁材料となっている。
The first surface protective layer 13 and the second surface protective layer 14 are sheet-like highly shrinkable materials disposed on the upper and lower surfaces of the laminate, and are compressed together with the inner conductors of the first and second capacitor portions 14 and 18 described later. A stress applying layer is formed. As the sheet-like material for the first surface protective layer 13 and the second surface protective layer 19, for example, the material A shown in Table 1 is employed.
When the material composition of the material A is seen, the ratio of glass (wt%) is considerably increased, while the ratio of magnetic substance and dielectric is relatively small, and therefore the magnetic permeability and dielectric constant are small. It is a non-magnetic insulating material having (low) material properties.

Figure 2005080230
Figure 2005080230

第1コンデンサ部14及び第2コンデンサ部18は、それぞれが積層された2枚のシート状材料14a,14b及び18a,18bにより構成されている。各シート状材料14a,14b及び18a,18bの表面に対して、略全面に近い大面積の内部導体31,32及び33,34を形成することにより、二つの内部導体どうしが対向する配置となって互いに独立した2組のキャパシタが形成されている。なお、内部導体31には外部電極11と電気的に接続される引出電極31aが、内部導体32には外部電極12と電気的に接続される引出電極32aが、内部導体33には外部電極11と電気的に接続される引出電極33aが、そして、内部導体34には外部電極12と電気的に接続される引出電極34aが、それぞれ一体的に連続して設けられている。   The 1st capacitor | condenser part 14 and the 2nd capacitor | condenser part 18 are comprised by the two sheet-like materials 14a and 14b and 18a and 18b by which each was laminated | stacked. By forming large-sized internal conductors 31, 32, 33, and 34 on the surface of each sheet-like material 14a, 14b and 18a, 18b, the two internal conductors are arranged to face each other. Thus, two sets of capacitors independent of each other are formed. The internal conductor 31 has an extraction electrode 31 a electrically connected to the external electrode 11, the internal conductor 32 has an extraction electrode 32 a electrically connected to the external electrode 12, and the internal conductor 33 has an external electrode 11. A lead electrode 33a that is electrically connected to the external electrode 12 and a lead electrode 34a that is electrically connected to the external electrode 12 are provided integrally and continuously on the inner conductor 34, respectively.

このような第1コンデンサ部14及び第2コンデンサ部18のシート状材料14a,14b,18a,18bには、たとえば表1に示した材料Bが採用されている。また、内部導体31〜34の材料には、表1に示した材料Cが採用されている。
ここで、材料Bの材料組成を見ると、材料Aとは反対にガラスが全く含まれておらず、磁性体及び誘電体の割合(wt%)は比較的多くなっているため、その透磁率及び誘電率が大きな(高い)材料特性を有する磁性材料となっている。
また、材料Cの材料組成を見ると、100%が導電性の金属(たとえば銀など)となっており、このような導電体よりなる内部導体31〜34は、周知の印刷法により形成される。
For example, the material B shown in Table 1 is used for the sheet-like materials 14a, 14b, 18a, and 18b of the first capacitor portion 14 and the second capacitor portion 18 as described above. Moreover, the material C shown in Table 1 is employ | adopted for the material of the internal conductors 31-34.
Here, looking at the material composition of material B, glass is not included at all, as opposed to material A, and the magnetic substance and dielectric ratio (wt%) is relatively high. In addition, the magnetic material has a material characteristic having a large (high) dielectric constant.
Further, looking at the material composition of the material C, 100% is a conductive metal (for example, silver), and the internal conductors 31 to 34 made of such a conductor are formed by a known printing method. .

第1浮遊容量低減層15及び第2浮遊容量低減層17は、コンデンサ部14,18と、コイル部16との層間を大きく(厚く)するため、内部導体のないシート状の材料Bを多層(図示の例では5層)に積層したものである。この場合の材料Bは、上述したコンデンサ部14,18と同様のシート状材料を使用しており、従って、その透磁率及び誘電率が大きな材料特性を有する磁性材料となる。
なお、浮遊容量低減層を形成する磁性材料の積層数については、図示した5層に限定されることはなく、必要に応じて適宜変更することができる。
The first stray capacitance reducing layer 15 and the second stray capacitance reducing layer 17 are made of a sheet-like material B having no internal conductor in multiple layers (in order to increase the thickness between the capacitor portions 14, 18 and the coil portion 16). In the example shown in FIG. In this case, the material B uses a sheet-like material similar to that of the capacitor portions 14 and 18 described above. Therefore, the material B has a magnetic property having a large magnetic permeability and dielectric constant.
Note that the number of magnetic material layers forming the stray capacitance reducing layer is not limited to the illustrated five layers, and can be changed as needed.

コイル部16は、上述したコンデンサ部14,18及び浮遊容量低減層15,17と同様の材料Bに内部導体を形成して複数積層し、全体でコイル状となる内部導体40を形成している層である。図示のコイル部16は、それぞれに内部導体41〜46が形成されているシート状の磁性材料を、第1磁性材料16aから第6磁性材料16fの順に、6層に積層した構成とされる。
なお、この場合の内部導体40についても、表1に示した金属100%の材料Cが採用されており、周知の印刷法により形成されたものである。
The coil portion 16 is formed by stacking a plurality of internal conductors on the same material B as the capacitor portions 14 and 18 and the stray capacitance reducing layers 15 and 17 described above, thereby forming an internal conductor 40 having a coil shape as a whole. Is a layer. The illustrated coil portion 16 is configured by laminating sheet-like magnetic materials each formed with internal conductors 41 to 46 in six layers in the order of the first magnetic material 16a to the sixth magnetic material 16f.
The inner conductor 40 in this case is also made of a material 100% of the metal C shown in Table 1 and formed by a known printing method.

第1磁性材料16aの内部導体41は、一端に連続する引出電極47を備えて略コ字状に形成され、他端がスルーホールHaを介して下層の内部導体42と電気的に接続されている。なお、引出電極47は、内部導体41の一端と電気的に接続されて第1磁性材料16aの所定位置(端部)まで導かれる内部導体であり、最終的には内部導体40の一端を上述した外部電極11と電気的に接続させるためのものである。
第2磁性材料16bの内部導体42は、内部導体41と同様に略コ字状に形成される。この内部導体42は、第1内部電極41の引出電極47を除いた部分と略対称となるように形成され、その一端42aはスルーホールHaを介して上層の内部導体41と電気的に接続されている。また、内部導体42の他端は、スルーホールHbを介して下層の第3磁性材料16cに形成されている内部導体43の一端43aと電気的に接続されている。
The inner conductor 41 of the first magnetic material 16a is formed in a substantially U shape with an extraction electrode 47 continuous at one end, and the other end is electrically connected to the lower layer inner conductor 42 through the through hole Ha. Yes. The lead electrode 47 is an internal conductor that is electrically connected to one end of the internal conductor 41 and led to a predetermined position (end) of the first magnetic material 16a. Finally, the end of the internal conductor 40 is connected to the above-described end. The external electrode 11 is electrically connected.
The inner conductor 42 of the second magnetic material 16 b is formed in a substantially U shape like the inner conductor 41. The inner conductor 42 is formed so as to be substantially symmetric with respect to the portion of the first inner electrode 41 excluding the lead electrode 47, and one end 42a thereof is electrically connected to the upper layer inner conductor 41 through the through hole Ha. ing. The other end of the inner conductor 42 is electrically connected to one end 43a of the inner conductor 43 formed in the lower third magnetic material 16c through the through hole Hb.

以下同様にして、略コ字状の内部導体43は、スルーホールHcを介して下層の第4磁性材料16dに形成されている内部導体44の一端44aと電気的に接続され、略コ字状の内部導体44は、スルーホールHdを介して下層の第5磁性材料16eに形成されている内部導体45の一端45aと電気的に接続され、さらに、略コ字状の内部導体45は、スルーホールHeを介して最下層の第6磁性材料16fに形成されている内部導体46の一端46aと電気的に接続されている。
そして、内部導体46には、略コ字状とした内部導体46に連続して外部電極12と電気的に接続される引出電極48が設けられている。
なお、コイル状の内部導体40を形成する磁性材料の積層数については、上述した6層に限定されることはなく、必要に応じて適宜変更することができる。
Similarly, the substantially U-shaped inner conductor 43 is electrically connected to one end 44a of the inner conductor 44 formed in the lower fourth magnetic material 16d via the through hole Hc, and is substantially U-shaped. The inner conductor 44 is electrically connected to one end 45a of the inner conductor 45 formed in the lower fifth magnetic material 16e through the through hole Hd, and the substantially U-shaped inner conductor 45 is formed through the through-hole Hd. It is electrically connected to one end 46a of the inner conductor 46 formed in the lowermost sixth magnetic material 16f through the hole He.
The inner conductor 46 is provided with an extraction electrode 48 that is electrically connected to the outer electrode 12 continuously to the substantially U-shaped inner conductor 46.
The number of laminated magnetic materials forming the coiled inner conductor 40 is not limited to the six layers described above, and can be changed as appropriate.

このようにして非磁性絶縁材料及び磁性材料を積層することにより、コイル部16の上下に浮遊容量低減層15,17を介してコンデンサ部14,18が配置され、さらにコンデンサ部14,18に隣接する上下の両端面に表面保護層13,19が設けられて機械的強度の増したLC複合部品10が形成される。
すなわち、LC複合部品10の積層体は、上下両面の表面保護層13,19及びその直下の内部導体31〜34に、中間層となる浮遊容量低減層15,17及びコイル部16の材料Bより高収縮の材料A及び材料Cを配置して積層したため、上下両面に高収縮材料よりなる圧縮応力付与層が形成される。この結果、LC複合部品10に対して温度変化により発生する熱応力が作用した場合や外部から曲げ応力が作用した場合など、積層体の焼成により収縮した割合の大きい高収縮材料が形成する圧縮応力付与層の存在により、機械的な強度を増すことができる。換言すれば、LC複合部品10を構成する二つのコンデンサ部14,18に不可欠な大面積の内部導体31〜34の層を圧縮応力付与層の形成に有効利用できるように、その積層位置が表面保護層13,19の直下(すぐ内側)となるように配置して、積層体の機械的な強度を増したものである。
By laminating the nonmagnetic insulating material and the magnetic material in this way, the capacitor portions 14 and 18 are arranged above and below the coil portion 16 via the stray capacitance reducing layers 15 and 17, and further adjacent to the capacitor portions 14 and 18. Surface protective layers 13 and 19 are provided on both upper and lower end surfaces to form the LC composite component 10 with increased mechanical strength.
That is, the laminated body of the LC composite component 10 includes the surface protection layers 13 and 19 on both upper and lower surfaces and the inner conductors 31 to 34 directly below the floating capacitance reducing layers 15 and 17 serving as intermediate layers and the material B of the coil portion 16. Since the high-shrinkage material A and the material C are arranged and laminated, a compressive stress applying layer made of the high-shrinkage material is formed on the upper and lower surfaces. As a result, compressive stress formed by a high shrinkage material having a large shrinkage ratio due to firing of the laminate, such as when a thermal stress generated by a temperature change or an external bending stress acts on the LC composite component 10 The presence of the application layer can increase the mechanical strength. In other words, the lamination position is the surface so that the layers of the large-area inner conductors 31 to 34 that are indispensable for the two capacitor portions 14 and 18 constituting the LC composite component 10 can be effectively used for forming the compressive stress applying layer. The mechanical strength of the laminate is increased by placing the protective layers 13 and 19 directly below (immediately inside).

また、コンデンサ部14,18とコイル部16との間には、磁性材料を積層してなる浮遊容量低減層15,17を配置して浮遊容量の低減をはかっているが、浮遊容量の問題を考慮しなければ、磁性材料を薄く(たとえば1枚のシート状材料)配置してもよい。しかし、高周波特性を向上させ、優れたノイズ除去特性を得るためには、十分な厚さの浮遊容量低減層を設けることが好ましい。   Further, stray capacitance reduction layers 15 and 17 formed by laminating magnetic materials are arranged between the capacitor portions 14 and 18 and the coil portion 16 in order to reduce stray capacitance. If not considered, the magnetic material may be thin (for example, one sheet-like material). However, in order to improve the high-frequency characteristics and obtain excellent noise removal characteristics, it is preferable to provide a stray capacitance reducing layer having a sufficient thickness.

次に、本発明に係るLC複合部品10を、実施例により具体的に説明する。
まず、以下のようにして磁性材料、誘電材料及びガラス材料を得た。
<磁性材料>
NiO,ZnO,CuO,Fe を出発原料とし、これらを各々15:25:12:48(モル比)の割合で湿式混合後、950℃で仮焼し、Ni0.15Zn0.25Cu0.12Fe0.961.96の磁性材料を得た。得られた磁性材料は、湿式にて48時間粉砕し、平均粒径が約1μmのスピネル構造の磁性材料を得た。
Next, the LC composite component 10 according to the present invention will be specifically described with reference to examples.
First, a magnetic material, a dielectric material, and a glass material were obtained as follows.
<Magnetic material>
NiO, ZnO, CuO, and Fe 2 O 3 were used as starting materials, and these were wet-mixed at a ratio of 15: 25: 12: 48 (molar ratio), respectively, and calcined at 950 ° C. to obtain Ni 0.15 Zn 0. A magnetic material of 25 Cu 0.12 Fe 0.96 O 1.96 was obtained. The obtained magnetic material was pulverized in a wet manner for 48 hours to obtain a spinel structure magnetic material having an average particle diameter of about 1 μm.

<誘電材料>
PbO,La ,ZrO ,TiO を出発原料とし、これらを各々88:6:70:30(モル比)の割合で湿式混合後、1050℃で仮焼し、Pb0.88La0.12Zr0.7Ti0.33.06 の誘電材料を得た。得られた誘電材料は、湿式にて24時間粉砕し、平均粒径が約1μmのペロブスカイト型の誘電材料を得た。
<ガラス材料>
SiO ,Al ,CaO,BaOの各々の割合が55:15:20:10(重量比)のガラス材料を得るために、Si,Al,Ca,Baの各成分の酸化物、炭酸塩または水酸化物を混合し、1100℃で溶解後急冷し、ガラス材料を得た。得られたガラス材料は、湿式にて48時間粉砕し、平均粒径0.5〜1.5μmのガラス材料を得た。
<Dielectric material>
PbO, La 2 O 3 , ZrO 2 , TiO 2 are used as starting materials, and these are wet-mixed at a ratio of 88: 6: 70: 30 (molar ratio), respectively, and calcined at 1050 ° C., and Pb 0.88 La A dielectric material of 0.12 Zr 0.7 Ti 0.3 O 3.06 was obtained. The obtained dielectric material was pulverized in a wet manner for 24 hours to obtain a perovskite type dielectric material having an average particle diameter of about 1 μm.
<Glass material>
In order to obtain a glass material in which the ratios of SiO 2 , Al 2 O 3 , CaO, and BaO are 55: 15: 20: 10 (weight ratio), oxides and carbonic acid of each component of Si, Al, Ca, and Ba Salt or hydroxide was mixed, dissolved at 1100 ° C., and then rapidly cooled to obtain a glass material. The obtained glass material was pulverized for 48 hours in a wet manner to obtain a glass material having an average particle size of 0.5 to 1.5 μm.

次に、上記磁性材料、上記誘電材料、上記ガラス材料を用いて、表1に示す複合比でそれぞれ混合し、ポリビニルブチラール等のバインダーを混合粉に対し9.4wt%加えて混練し複合ペイントを調整する。この複合ペイントでドクターブレード法により厚み10〜50μmの材料A、材料Bの各グリーンシートを作成した。
次に、各グリーンシートを用いて積層し、その途中で、市販のAgペーストを用いて各コイル導体及び各キャパシタ導体を印刷形成し(各コイル導体は各スルーホールを介して接続)、熱間圧着後、焼成後に焼結体寸法が1.0×0.5mmとなるように切断し、LC複合部品を得た。このチップを400℃で脱脂処理した後、大気中で940℃で4時間焼成した。得られたチップ状の焼結体をバレル研磨法で面取り処理した後、両端部にディッピング法によりAg/Pd合金からなる端子電極層を形成して焼成し、2端子型ノイズフィルタを得た。
Next, the magnetic material, the dielectric material, and the glass material are mixed at the composite ratios shown in Table 1, and 9.4 wt% of a binder such as polyvinyl butyral is added to the mixed powder to knead the composite paint. adjust. Using this composite paint, green sheets of material A and material B having a thickness of 10 to 50 μm were prepared by a doctor blade method.
Next, each green sheet is laminated, and on the way, each coil conductor and each capacitor conductor are printed and formed using a commercially available Ag paste (each coil conductor is connected through each through hole), and hot After crimping, the sintered body was cut to 1.0 × 0.5 mm after firing to obtain an LC composite part. The chip was degreased at 400 ° C. and then baked at 940 ° C. for 4 hours in the air. The obtained chip-shaped sintered body was chamfered by barrel polishing, and then a terminal electrode layer made of an Ag / Pd alloy was formed on both ends by dipping, followed by firing to obtain a two-terminal noise filter.

表1に示す材料Aは、表面保護層13,19に使用されるシート状の非磁性絶縁材料である。材料Aの材料組成は、磁性体が20wt%、誘電体が13.3wt%、ガラスが66.7wt%であり、金属は全く含まれていない。
また、表1に示す材料Bは、コンデンサ部14,18、浮遊容量低減層15,17、コイル部16の磁性材料として使用されるシート状の材料である。材料Bの材料組成は、磁性体が60wt%、誘電体が40wt%、ガラスは0wt%であり、金属は全く含まれていない。
また、表1に示す材料Cは、内部導体31〜34、41〜46に使用される導電性の材料である。材料Cの材料組成は、磁性体、誘電体及びガラスを全く含まず、金属が100wt%である。
Material A shown in Table 1 is a sheet-like nonmagnetic insulating material used for the surface protective layers 13 and 19. The material composition of the material A is 20 wt% for the magnetic material, 13.3 wt% for the dielectric, and 66.7 wt% for the glass, and does not contain any metal.
A material B shown in Table 1 is a sheet-like material used as a magnetic material for the capacitor portions 14 and 18, the stray capacitance reducing layers 15 and 17, and the coil portion 16. The material composition of the material B is 60 wt% for the magnetic material, 40 wt% for the dielectric, 0 wt% for the glass, and does not contain any metal.
A material C shown in Table 1 is a conductive material used for the inner conductors 31 to 34 and 41 to 46. The material composition of the material C does not include magnetic material, dielectric material and glass at all, and the metal is 100 wt%.

上述した材料A〜Cの材料特性は、各材料のグリーンシートを約0.8mmの厚さで積層し、プレス成形し、大気中で940℃で4時間焼成して得られた焼結体試料の特性結果が表1に示されている。ここで、透磁率及び誘電率は周波数1MHzでの測定値、Δμは材料Aの誘電率を基準(すなわち1)として他の材料の誘電率の比を記載している。
また、抵抗率については、1×109Ωcm以上の場合は高絶縁性であるとして○を記載している。
さらに、収縮については、焼成前の寸法を基準として焼成後の寸法を百分率(%)で示している。
すなわち、積層体の両端側には、中間層の材料B(収縮84.4%)より収縮の大きい高収縮材料である材料A(収縮84.0%)及び材料C(収縮84.0%)が配置されて圧縮応力付与層を形成している。
The material characteristics of the materials A to C described above are the sintered body samples obtained by laminating green sheets of each material with a thickness of about 0.8 mm, press molding, and firing in the atmosphere at 940 ° C. for 4 hours. The characteristic results are shown in Table 1. Here, the magnetic permeability and the dielectric constant are measured values at a frequency of 1 MHz, and Δμ describes the ratio of the dielectric constant of another material with the dielectric constant of the material A as a reference (that is, 1).
As for the resistivity, ◯ is described as being highly insulating when it is 1 × 10 9 Ωcm or more.
Further, for shrinkage, the dimensions after firing are shown in percentage (%) based on the dimensions before firing.
That is, at both ends of the laminate, material A (shrinkage 84.0%) and material C (shrinkage 84.0%), which are high-shrinkage materials having a larger shrinkage than material B (shrinkage 84.4%) of the intermediate layer, are provided. Are arranged to form a compressive stress applying layer.

ところで、本発明の構成は上述した実施形態に限定されるものではなく、たとえばコイル部の内部導体形状や材料A〜Cの組成など、本発明の要旨を逸脱しない範囲内において適宜変更することができる。   By the way, the structure of this invention is not limited to embodiment mentioned above, For example, it can change suitably in the range which does not deviate from the summary of this invention, such as the internal conductor shape of a coil part, and the composition of material AC. it can.

本発明に係るLC複合部品の一実施形態を示す分解斜視図である。It is a disassembled perspective view which shows one Embodiment of LC composite component which concerns on this invention. (a)は図1のLC複合部品を示す外観斜視図、(b)はLC複合部品の等価回路図である。(A) is an external perspective view showing the LC composite component of FIG. 1, and (b) is an equivalent circuit diagram of the LC composite component. 図1のA−A断面を示す模式図である。It is a schematic diagram which shows the AA cross section of FIG.

符号の説明Explanation of symbols

10 LC複合部品
13 第1表面保護層
14 第1コンデンサ部
15 第1浮遊容量低減層
16 コイル部
17 第2浮遊容量低減層
18 第2コンデンサ部
19 第2表面保護層
31〜34,40〜46 内部導体
DESCRIPTION OF SYMBOLS 10 LC composite component 13 1st surface protection layer 14 1st capacitor | condenser part 15 1st stray capacitance reduction layer 16 Coil part 17 2nd stray capacitance reduction layer 18 2nd capacitor part 19 2nd surface protection layer 31-34, 40-46 Inner conductor

Claims (2)

内部導体を形成した複数のシート状材料を積層しコイル導体を形成するコイル部と、内部導体を形成した複数のシート状材料を積層しキャパシタ導体を形成するコンデンサ部とを具備し、これらを一体的に焼成してなる積層体に前記コイル導体及び前記キャパシタ導体に接続された外部電極が設けられているLC複合部品であって、
前記積層体の上下両面に形成される表面保護層の直下に前記コンデンサ部を配設したことを特徴とするLC複合部品。
A coil part that forms a coil conductor by laminating a plurality of sheet-like materials that form internal conductors and a capacitor part that forms a capacitor conductor by laminating a plurality of sheet-like materials that form internal conductors are integrated An LC composite component in which an external electrode connected to the coil conductor and the capacitor conductor is provided in a laminate obtained by firing in an automatic manner,
An LC composite component comprising the capacitor portion disposed immediately below a surface protective layer formed on both upper and lower surfaces of the laminate.
前記コンデンサ部と前記コイル部との間に浮遊容量低減層を設けたことを特徴とする請求項1記載のLC複合部品。
The LC composite component according to claim 1, wherein a stray capacitance reducing layer is provided between the capacitor portion and the coil portion.
JP2003311862A 2003-09-03 2003-09-03 Lc composite component Pending JP2005080230A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003311862A JP2005080230A (en) 2003-09-03 2003-09-03 Lc composite component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003311862A JP2005080230A (en) 2003-09-03 2003-09-03 Lc composite component

Publications (1)

Publication Number Publication Date
JP2005080230A true JP2005080230A (en) 2005-03-24

Family

ID=34413314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003311862A Pending JP2005080230A (en) 2003-09-03 2003-09-03 Lc composite component

Country Status (1)

Country Link
JP (1) JP2005080230A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014107653A (en) * 2012-11-27 2014-06-09 Panasonic Corp Common mode noise filter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014107653A (en) * 2012-11-27 2014-06-09 Panasonic Corp Common mode noise filter

Similar Documents

Publication Publication Date Title
JP5206440B2 (en) Ceramic electronic components
KR101496814B1 (en) Multilayered ceramic capacitor, the method of the same and board for mounting the same
JP2012253338A (en) Multilayer ceramic electronic component
JP7193918B2 (en) Multilayer ceramic capacitor and manufacturing method thereof
JP2011097016A (en) Laminated ceramic electronic component and method of manufacturing the same
KR102015809B1 (en) Electronic component and manufacturing method for the same
JP2020053577A (en) Electronic component
KR20180113457A (en) Multilayer ceramic capacitor
JP4771787B2 (en) Multilayer electronic components
JP5527404B2 (en) Multilayer ceramic electronic components
JP5498973B2 (en) Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor
JP2006041081A (en) Composite common mode choke coil and manufacturing method therefor
JP6301629B2 (en) Multilayer electronic components
JP4612970B2 (en) Laminated electronic components
KR20130134868A (en) Multilayer type inductor
JP7122085B2 (en) Multilayer ceramic capacitor and manufacturing method thereof
JP3918095B2 (en) Multilayer ceramic electronic component and manufacturing method thereof
JP5527405B2 (en) Multilayer ceramic electronic components
US11721482B2 (en) Method of producing ceramic electronic component and ceramic electronic component
JP2015026861A (en) Multilayer ceramic capacitor
JP3758464B2 (en) Laminated electronic components
JP2005142331A (en) Composite common mode choke coil
JP2005080231A (en) Arrayed structure of lc composite component
JP2005080230A (en) Lc composite component
JP3317246B2 (en) Composite ceramic and composite ceramic element

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060331

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090127

A02 Decision of refusal

Effective date: 20090602

Free format text: JAPANESE INTERMEDIATE CODE: A02