JP2005073374A - Power conversion apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power conversion apparatus which reduces the number of part items and suppresses an influence of a noise from a power wiring part. <P>SOLUTION: The power conversion apparatus includes: a semiconductor module for constituting a part of a power converter circuit; a main circuit part 10 including a cooler for cooling the semiconductor module; a control circuit substrate part 2 electrically connected to a signal terminal of the semiconductor module and controlling the semiconductor module; and a power wiring part 3 connected to a main electrode terminal of the semiconductor module and inputting/outputting current to/from the semiconductor module. The main circuit part 10 is interposed between the control circuit substrate part 2 and the power wiring part 3. It is preferable to provide an electronic part for constituting an at least part of a step-up circuit connected to the semiconductor module in the power wiring part 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a power conversion device such as an inverter device using a semiconductor module.

  For example, in hybrid vehicles that have both an internal combustion engine and an electric motor as drive sources, and other vehicles that have an electric motor as a drive source, a large-capacity inverter that performs bidirectional conversion between DC power and AC power is required. And For this reason, various power converters including this inverter have been developed.

  The inverter circuit (power conversion circuit) is configured by using a semiconductor module incorporating an IGBT element or the like. However, since it has a large capacity as described above, it generates a large amount of heat. Therefore, the conventional power conversion device 9 is configured by incorporating a cooling device 91 for cooling the semiconductor module 92, as shown in FIG.

More specifically, the semiconductor module 92 is disposed so as to face the cooling device 91, and further, a power wiring portion 93 that allows a current such as a bus bar to enter and exit the semiconductor module 92 is disposed so as to face the semiconductor module 92. Further, the power conversion device 9 is configured by disposing the control circuit board portion 95 via the shield layer 94. The control circuit board unit 95 controls the semiconductor module 92. However, in order to avoid the influence of noise from the power wiring unit 93, the shield layer 94 is indispensable.
Such a structure of the power conversion device is also shown in, for example, Patent Document 1.

However, the conventional power converter 9 has the following problems.
That is, in the conventional power converter 9, the shield layer 94 is indispensable in order to improve the operation performance of the control circuit board unit 95. As a result, the number of parts increases, making it difficult to meet the overall cost reduction requirements.

Further, although the influence of noise from the power wiring portion 93 to the control circuit board portion 95 can be reduced by the presence of the shield layer 94, the connection line 955 for connecting the control circuit board portion 95 and the semiconductor module 92 is still provided. The shield layer 94 and the power wiring portion 93 are penetrated. Therefore, it is difficult to eliminate the influence of noise on the connection line 95.
JP-A-11-69774

  The present invention has been made in view of such conventional problems, and intends to provide a power conversion device capable of reducing the number of parts and suppressing the influence of noise from the power wiring portion. Is.

The present invention includes a main circuit unit including a semiconductor module constituting a part of a power conversion circuit and a cooling device for cooling the semiconductor module;
A control circuit board portion electrically connected to a signal terminal of the semiconductor module and having a control circuit for controlling the semiconductor module;
A power wiring portion connected to the main electrode terminal of the semiconductor module and allowing current to flow into and out of the semiconductor module;
The main circuit section is provided between the control circuit board section and the power wiring section, in a power converter (claim 1).

  As described above, the power conversion device of the present invention is arranged so that the main circuit portion composed of the semiconductor module and its cooling device is sandwiched between the control circuit board portion and the power wiring portion. Therefore, the main circuit part functions as a shield part between the control circuit board part and the power wiring part, and electrical noise from the power wiring part can be prevented from being transmitted to the control circuit board part. . As a result, the shield layer, which has been conventionally required, can be eliminated, and the number of parts can be reduced.

Also, since the main circuit part and the control circuit board part are arranged adjacent to each other, the electrical junction between them can be arranged at the boundary part between them and penetrate the power wiring part. There is no need to let them. Therefore, the influence of electrical noise from the power wiring portion to the control circuit board portion can be further suppressed.
Thus, according to the present invention, it is possible to provide a power conversion device that can reduce the number of components and can suppress the influence of noise from the power wiring portion.

In the power conversion device of the present invention, the power wiring portion is constituted by, for example, a bus bar connected to a three-phase motor and a connection portion between the bus bar and the main electrode terminal of the semiconductor module. This is a part that inputs to the semiconductor module and outputs from the semiconductor module.
The control circuit board portion is a portion having a control circuit that is connected to a signal terminal of the semiconductor module and sends a control signal to the semiconductor module.
The main circuit unit includes the semiconductor module and a cooling device for cooling the semiconductor module.
The semiconductor module is configured by using one or a plurality of semiconductor elements and provided with the main electrode terminal and the signal terminal. As described later, this semiconductor module is preferably a double-sided cooling type, that is, a structure that can be cooled not only from one surface but also from the other surface facing it.

  Moreover, it is preferable that an electronic component connected to the semiconductor module is provided in the power wiring portion. The electronic component itself or the bus bar connected to the electronic component itself may generate electrical noise, and is preferably arranged in the power wiring portion. Thereby, it is possible to suppress the influence of electrical noise from the electronic component to the control circuit board portion. Examples of the electronic components include components such as a reactor and a capacitor. Further, a booster circuit is constituted by these electronic components (claim 3).

  In addition, the semiconductor module includes a module main body containing a semiconductor, the main electrode terminal protruding from the module main body, and the signal terminal protruding in a direction different from the protruding direction of the main electrode terminal by approximately 180 degrees. The cooling device has a pair of refrigerant tubes arranged so as to sandwich the module main body from both sides, and the cooling medium is circulated in the refrigerant tubes, whereby the module main body is arranged on both sides. The semiconductor module is arranged so that the main electrode terminal and the signal terminal protrude in different directions substantially perpendicular to the longitudinal direction of the pair of refrigerant tubes, respectively. (Claim 4).

  In this case, the semiconductor module and the refrigerant tube can be arranged in parallel, and the main electrode terminal and the signal terminal can be arranged in different directions orthogonal to the arrangement direction. Therefore, it becomes very easy to distribute and arrange the control circuit board part and the power wiring part on both surfaces of the main circuit part in which the semiconductor modules and the refrigerant tubes are arranged.

The main circuit portion has a laminated structure in which a plurality of the refrigerant tubes and the semiconductor modules are alternately laminated, and the main electrode terminal of the semiconductor module projects from one surface in a direction orthogonal to the lamination direction. Preferably, the signal terminal protrudes from the opposite surface.
In this case, the laminated structure of the semiconductor module and the refrigerant tube can be easily combined as one unit, the entire main circuit part can be made compact, and the handling in manufacturing can be facilitated. .

  The arrangement of the semiconductor modules and the refrigerant tubes may be an arrangement method in which a set of two refrigerant tubes sandwiching the one row of semiconductor modules is used as one unit, and the units are repeatedly arranged. In this case, the whole unit can be unitized by producing a plurality of the one unit, arranging them in parallel, and connecting a plurality of refrigerant tubes by a pair of header portions.

(Example 1)
A power converter according to an embodiment of the present invention will be described with reference to FIGS.
The power conversion device 1 of this example is a power conversion device for a hybrid vehicle, and includes a main circuit unit 10, a control circuit board unit 2, and a power wiring unit 3 as shown in FIG. The main circuit unit 10 is interposed between the control circuit board unit 2 and the power wiring unit 3.

  As shown in FIGS. 2 and 3, the main circuit unit 10 includes a semiconductor module 4 that constitutes a part of the power conversion circuit, and a cooling device 5 that cools the semiconductor module 4. The control circuit board 2 is a board that is electrically connected to the signal terminal 42 of the semiconductor module 4 and has a control circuit (not shown) for controlling the semiconductor module 4. The power wiring portion 3 is a portion that is connected to the main electrode terminal 41 of the semiconductor module 4 and allows current to flow into and out of the semiconductor module 4.

  In this example, as shown in FIGS. 2 and 3B, the semiconductor module 4 includes a module main body 40 incorporating a semiconductor element, a main electrode terminal 41 protruding from the module main body 40, and the main module 40. The signal terminal 42 protrudes in a direction different from the protruding direction of the electrode terminal 41 by approximately 180 degrees. The module main body 40 has heat radiation plates 451 that are electrically connected to the main electrode terminals 41 exposed on both main surfaces 401 and 402 thereof.

  As shown in FIG. 3B, the cooling device 5 has a pair of refrigerant tubes 51 arranged so as to sandwich the module main body 40 from both sides. In this example, two semiconductor modules 4 are sandwiched between a pair of refrigerant tubes 51. As a whole, the main circuit unit 10 is configured by alternately stacking the refrigerant tubes 51 and the rows of the semiconductor modules 4. As a result, all the semiconductor modules 4 are in a state where both surfaces 401 and 402 are sandwiched between the refrigerant tubes 51.

  Each refrigerant tube 51 has a refrigerant passage (not shown) therein, and is configured to allow a cooling medium to flow therethrough. Further, as shown in the figure, a bellows pipe 59 is arranged so as to connect both ends of the plurality of refrigerant tubes 51, and a header portion 50 is formed. The module main body 40 can be cooled from both surfaces 401 and 402 by circulating a cooling medium in the refrigerant tube 51. Each semiconductor module 4 is disposed such that the main electrode terminal 41 and the signal terminal 42 protrude in different directions substantially perpendicular to the longitudinal direction of the pair of refrigerant tubes 51. Thereby, it becomes very easy to distribute and arrange the control circuit board part 2 and the power wiring part 3 on both surfaces of the main circuit part 10 in which the semiconductor modules 4 and the refrigerant tubes 51 are arranged.

  Further, as shown in FIG. 3C, the control circuit board portion 2 has a plurality of connection holes 22 into which the signal terminals 42 of the semiconductor module 4 are inserted, and the signal terminals 42 are inserted into the connection holes 22. Thus, the control circuit and the signal terminal 42 are configured to be electrically connected. The support rod 29 erected on the control circuit board portion 2 abuts on the refrigerant tube 51 of the main circuit portion 10 to keep the distance between the main circuit portion 10 and the control circuit board portion 2 constant. It functions as a spacer.

  Further, as shown in FIG. 3A, the power wiring portion 3 includes a plurality of bus bars 31 connected to a three-phase motor (not shown) and a resin mold portion 30 obtained by molding a part of them. A plurality of junction terminal portions (not shown) that are joined to the main electrode terminals 41 of the semiconductor module 4 are provided on the surface 302 of the power wiring portion 3 facing the main circuit portion 10.

  As shown in FIGS. 3 and 4, the power wiring portion 3 is adjacently disposed above the main circuit portion 10, the control circuit board portion 2 is adjacently disposed below the main circuit portion 10, and the main electrode terminal 41 of the semiconductor module 4 By electrically connecting the power wiring part 3 and electrically joining the signal terminal 42 to the control circuit board part 2, the power conversion device 1 of this example is obtained.

  As described above, the power conversion device 1 of this example is arranged so that the main circuit unit 10 including the semiconductor module 4 and the cooling device 5 is sandwiched between the control circuit board unit 2 and the power wiring unit 3. is there. Therefore, the main circuit section 10 functions as a shield section between the control circuit board section 2 and the power wiring section 3, and electrical noise from the power wiring section 3 is transmitted to the control circuit board section 2. Can be suppressed. As a result, the shield layer, which has been conventionally required, can be eliminated, and the number of parts can be reduced.

  Further, since the main circuit unit 10 and the control circuit board unit 2 are arranged adjacent to each other, the electrical junction between them can be arranged at the boundary between the two, and the power wiring unit 3 can be There is no need to penetrate. Therefore, the influence of electrical noise from the power wiring part 3 to the control circuit board part 2 can be further suppressed.

  Further, in this example, the semiconductor module 4 has a structure in which both surfaces can be cooled and the main electrode terminal 41 and the signal terminal 42 protrude in directions different by about 180 degrees. Then, by making the best use of this structure, a stacked structure with the refrigerant tube 51 is realized as described above, and the main electrode terminal 41 and the signal terminal 42 protrude in different directions orthogonal to the stacked direction. It was. As a result, the cooling efficiency of the semiconductor module 4 can be improved and the structure in which the control circuit board 2 and the power wiring part 3 are distributed and arranged on both surfaces of the main circuit part 10 can be easily achieved.

  In this example, the main circuit unit 10 is arranged above the control circuit board unit 2 and the power wiring unit 3 is arranged above the control circuit board unit 2. However, the vertical direction is reversed while maintaining this relative relationship. Of course, it is possible to change it to a form that has been reversed or 90 degrees.

(Example 2)
As shown in FIG. 5, this example is an example in which a reactor 61 and a capacitor 62 that constitute a part of a booster circuit are arranged in the power wiring unit 3 based on the power converter 1 in the first embodiment. is there.
In this case, the influence of electrical noise from the reactor 61 and the capacitor 62, which are electronic components constituting the booster circuit, to the control circuit board unit 3 can be suppressed.
In other respects, the same effects as those of the first embodiment can be obtained.

Explanatory drawing which shows arrangement | positioning of each part of the power converter device in Example 1. FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 3 is an explanatory diagram showing (a) a power wiring portion, (b) a main circuit portion, and (c) a control circuit board portion in the first embodiment. Explanatory drawing which shows the structure of the power converter device in Example 1. FIG. Explanatory drawing which shows the structure of the power converter device in Example 2. FIG. Explanatory drawing which shows arrangement | positioning of each part of the power converter device in a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Power converter 10 Main circuit part 2 Control circuit board part 3 Power wiring part 31 Bus bar 4 Semiconductor module 41 Main electrode terminal 42 Signal terminal 5 Cooling device 51 Refrigerant tube

Claims (5)

A main circuit unit including a semiconductor module constituting a part of the power conversion circuit, and a cooling device for cooling the semiconductor module;
A control circuit board portion electrically connected to a signal terminal of the semiconductor module and having a control circuit for controlling the semiconductor module;
A power wiring portion connected to the main electrode terminal of the semiconductor module and allowing current to flow into and out of the semiconductor module;
The power converter according to claim 1, wherein the main circuit section is interposed between the control circuit board section and the power wiring section.   2. The power converter according to claim 1, wherein the power wiring unit is provided with an electronic component connected to the semiconductor module.   3. The power conversion device according to claim 2, wherein the electronic component constitutes at least a part of a booster circuit. 4. The semiconductor module according to claim 1, wherein the semiconductor module includes a module main body including a semiconductor element, the main electrode terminal protruding from the module main body, and a protruding direction of the main electrode terminal. It consists of the above signal terminals protruding in different directions by 180 degrees,
The cooling device has a pair of refrigerant tubes arranged to sandwich the module main body from both sides, and cools the module main body from both sides by circulating a cooling medium in the refrigerant tubes. Configured,
The semiconductor module is arranged such that the main electrode terminal and the signal terminal protrude in different directions substantially perpendicular to the longitudinal direction of the pair of refrigerant tubes, respectively. Conversion device.   5. The main circuit portion according to claim 4, wherein the main circuit portion has a laminated structure in which a plurality of the refrigerant tubes and the semiconductor modules are alternately laminated, and the main electrode of the semiconductor module is formed from one surface in a direction orthogonal to the lamination direction. A power conversion device characterized in that the terminal protrudes and the signal terminal protrudes from the opposite surface.

Images