JP2005064779A - High pass filter and multiband antenna switching circuit using it, multiband antenna switch lamination module, and communication system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high pass filter coping with electrostatic surge capable of matching in a wide band and allows use at an antenna top, a multiband antenna switching circuit, a multiband antenna switch lamination module, and a communication system. <P>SOLUTION: An input terminal and an output terminal are provided. A series resonant circuit comprises a first inductor connected between the input terminal and a ground, a first capacitor connected between the input terminal and the output terminal, a second inductor connected to the output terminal, and a second capacitor connected to the second inductor and the ground. At least a part of the first inductor and the second inductor are inductive coupled and/or capacity coupled. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a high-frequency composite component such as a high-pass filter, a multi-band antenna switch circuit, and a multi-band antenna switch laminated module used in a high-frequency band such as a microwave band, and more particularly to a high-frequency switch component that handles a transmission / reception system with one antenna. More particularly, the present invention relates to a communication device with improved electrostatic surge resistance.

The portable radio communication system includes various systems such as an EGSM system and a DCS system that are popular in Europe, a PCS system that is popular in the United States, and a PDC system that is adopted in Japan.
However, with the rapid spread of mobile phones in recent years, especially in major metropolitan areas in developed countries, it is difficult to connect system users in the frequency band allocated to each system, making it difficult to connect, connecting during a call Problems such as disconnection have occurred.
Therefore, it has been proposed that the user can use a plurality of systems to substantially increase the frequency that can be used, and further expand the service area and effectively use the communication infrastructure of each system.

When a user wants to use a plurality of systems, it is necessary to have a required number of portable communication devices corresponding to each system, or to have a small and lightweight portable communication device that can communicate with a plurality of systems. In the latter case, in order to be able to use a plurality of systems with one portable communication device, the portable communication device may be configured using components for each system. However, in the signal transmission system, for example, desired transmission High-frequency switches such as filters that pass transmission signals of frequencies, high-frequency switches that switch transmission / reception circuits, antennas that receive and emit transmission / reception signals, and filters that pass the desired frequency of reception signals that have passed through the high-frequency switch in signal reception systems Circuit components are required for each system.
For this reason, the portable communication device becomes expensive and increases in volume and weight, which is not suitable for portable use.
Therefore, small and lightweight high-frequency circuit components corresponding to a plurality of systems have become necessary. For example, there are known dual-band antenna switch modules compatible with EGSM and DCS or triple-band antenna switch modules used in portable communication devices compatible with three systems of EGSM, DCS, and PCS (for example, patents). Reference 1).

FIG. 19 shows a block diagram of a triple band antenna switch circuit 7 corresponding to EGSM, DCS, and PCS. The demultiplexing circuit Dip demultiplexes the 0.9 GHz band EGSM signal and the 1.8 GHz band DCS / PCS signal.
The switch SW1 switches transmission / reception of EGSM, and SW2 switches transmission / reception of DCS and PCS.
The low-pass filters LPF1 and LPF2 reduce the amount of harmonic distortion generated by a transmission-side power amplifier (not shown). The SAW filters (SAW1 to SAW3) play a role of reducing noise outside the reception band included in the reception signal.
In this case, a PIN diode switch using a PIN diode or a GaAs FET switch is used for SW1 and SW2.

  High-frequency components such as PIN diodes, GaAs FETs, and SAW filters used in antenna switch modules are vulnerable to electrostatic surges. In particular, in the case of mobile phones, the above-described high-frequency components are applied when electrostatic surges from the human body are input to the antenna. There was a problem of being destroyed.

  In addition, even if the antenna switch module does not break down, it is possible to destroy the circuit connected to the subsequent stage of the antenna switch module, such as the power amplifier connected to the transmission terminal and the low noise amplifier connected to the reception terminal. Therefore, it was important to take measures against electrostatic surges.

Therefore, several inventions have been made as conventional techniques related to countermeasures against electrostatic surges (see, for example, Patent Document 2 and Patent Document 3).

FIG. 20 shows an antenna switch circuit 7 with a countermeasure against electrostatic surge disclosed in Patent Document 2. Inductors L1 to L3 and capacitors C1, C2, and C4 connected to the ground are inserted into signal lines of the antenna terminal ANT, the transmission terminal Tx, and the reception terminal Rx (portions surrounded by dotted lines).

FIG. 21 shows an antenna switch circuit 7 with a countermeasure against electrostatic surge disclosed in Patent Document 3. Of the two branching circuits Dip1 and Dip2, the inductor L3 connected to the ground is inserted into the branching circuit Dip1 on the low frequency band side (the portion surrounded by the inner dotted line).
In other words, as an electrostatic surge countermeasure, an inductor is added to a part of the branching circuit.

  As shown in FIG. 22, in the case of a circuit that directly switches a transmission / reception signal of a plurality of frequencies by a GaAs FET switch (DP5T SW) without using a branching circuit, between the antenna terminal ANT and the GaAs switch (DP5T SW), There have also been attempts to incorporate an electrostatic surge countermeasure circuit with an LC circuit or an inductor that falls to ground alone.

JP 2000-165288 A JP 2001-44883 A JP 2001-186047 A

The countermeasure against electrostatic surge described in Patent Document 1 requires an inductor and a capacitance for each of the antenna terminal, the transmission terminal, and the reception terminal. It was also a cause of deterioration.

In the countermeasure against electrostatic surge described in Patent Document 2, an attenuation amount near 300 MHz is only 5 dB or less, which is insufficient for countermeasure against electrostatic surge.

Further, in an attempt to prevent electrostatic surges in the conventional example that does not use the branching circuit, in order to protect the GaAs switch from electrostatic surges, it is necessary to set the inductor falling to the ground to 5 nH or less.
However, when an inductor of 5 nH or less is connected to the antenna top, it is difficult to achieve matching in a wide band from 900 MHz band to 1.8 GHz band.
Therefore, the conventional electrostatic surge countermeasure circuit cannot be used for the antenna top.

  In view of the above, the present invention solves the above-described problems in the prior art, can achieve matching in a wide band and can be used at the antenna top, and a multi-band using the high-pass filter for countermeasures against electrostatic surges. An object of the present invention is to provide an antenna switch circuit, a multiband antenna switch stack module, and a communication device.

The first means of the present invention has an input terminal (P1) and an output terminal (P2). The first inductor (L1) connected between the input terminal (P1) and the ground, the input terminal ( P1) and a first capacitor (C1) connected between the output terminal (P2), a second inductor (L2) connected to the output terminal (P2), and the second inductor (L2) ) And a second capacitor (C2) connected to the ground, and at least a part of the first inductor (L1) and the second inductor (L2) are inductively coupled and This is a high-pass filter (6) characterized by being capacitively coupled (MCL).

In the second means of the present invention, a parallel resonant circuit including a third inductor (L3) and a third capacitor (C3) is provided between the second inductor (L2) and the output terminal (P2). This is a high-pass filter (6) according to the first means.

The third means of the present invention is constituted by an LC circuit, and the LC circuit is constituted by an electrode pattern in a laminated substrate formed by laminating a plurality of dielectric layers (gs1 to gs10) and connected to a ground electrode. The first inductor (L1), the second inductor (L2) connected to the ground electrode via the second capacitor (C2), the first inductor (L1) and the second inductor ( L2) is connected to the first capacitor (C1), and the electrode pattern constituting the first inductor (L1) and the second inductor (L2) is at least one dielectric layer ( The high-pass filter (6) is arranged on gs1 to gs10).

According to a fourth means of the present invention, an antenna is connected to the input terminal (P1) of the high-pass filter (6) according to any one of the first to third means, and signals of a plurality of frequencies are transmitted / received to the output terminal (P2). A multiband antenna switch circuit (7) characterized by connecting an antenna terminal (ANT) of a multiband antenna switch circuit (7) for switching to a terminal.

According to a fifth means of the present invention, an antenna is provided at the output terminal (P2) of the high-pass filter (6) according to any one of the first to third means, and signals having a plurality of frequencies are provided at the input terminal (P1). A multiband antenna switch circuit (7) characterized in that an antenna terminal (ANT) of a multiband antenna switch circuit (7) for switching to a transmission / reception terminal is connected.

A sixth means of the present invention is a multiband antenna switch circuit (7) for switching signals of a plurality of frequencies to a transmission / reception terminal, wherein the reception terminals (EGSM Rx, DCS Rx, PCS Rx) of the multiband antenna switch circuit. ) And a receiving SAW filter (SAW1 to SAW3), a high-pass filter (6) according to any one of the first to third means is inserted into a multiband antenna switch circuit (7) is there.

The seventh means of the present invention comprises the high-pass filter (6) according to any one of the first to third means and the multiband antenna switch circuit (7) according to any one of the fourth to sixth means. A part of the inductor and the capacitor to be built in the multilayer substrate, and chip components such as a switch element, a resistor, a capacitor, an inductor and a SAW filter constituting a part of the multiband antenna switch circuit (7) are mounted on the multilayer substrate. This is a multiband antenna switch laminated module (8) characterized by the above.

The eighth means of the present invention is connected to a demultiplexing circuit (Dip) for dividing a plurality of transmission / reception systems having different pass bands into a high frequency side signal and a low frequency side signal, and the demultiplexing circuit (Dip), A switch circuit (SW1, SW2) that switches connection between a transmission system and a reception system of a transmission / reception system, a low-pass filter (LPF1, LPF2) provided in each transmission system of the plurality of transmission / reception systems, and a high-pass filter (6) The branching circuit (Dip) is composed of an LC circuit, the switch circuit (SW1, SW2) is mainly composed of a switching element and a transmission line, and the low-pass filter (LPF1, LPF2) and the high-pass filter (6 ) Is composed of an LC circuit, and the LC circuit of the branching circuit (Dip), the LC circuit of the low-pass filter (LPF1, LPF2) and the high-pass filter (6). And at least a part of the transmission line of the switch circuit (SW1, SW2) is configured by an electrode pattern in a laminated substrate formed by laminating a plurality of dielectric layers (GS1 to GS12), and the switching element or LC A chip element constituting a part of the circuit is disposed on the multilayer substrate, and the LC circuit of the high-pass filter (6) includes a first inductor (L1) connected to the ground electrode and a second electrode connected to the ground electrode. A second inductor (L2) connected via a first capacitor (C2), and a first capacitor (C1) connected between the first inductor (L1) and the second inductor (L2). The electrode patterns constituting the first inductor (L1) and the second inductor (L2) are arranged on at least one dielectric layer (GS1 to GS12). It is a multi-band antenna switch stack module (8), characterized in.

The ninth means of the present invention is the high-pass filter (6) according to any one of the first to third means and the multiband antenna switch circuit (7) according to any one of the fourth to sixth means, or A communication apparatus using the multiband antenna switch laminated module (8) described in the seventh means or the eighth means.

According to the present invention, the electrostatic surge from the antenna terminal can be released to the ground, and the electrostatic surge can be absorbed with respect to a wide frequency band, so that the countermeasure against electrostatic breakdown can be more completely performed.
Then, DIP diode switches or GaAs FET switches constituting the multiband antenna switch circuit, a reception SAW filter, a power amplifier (not shown) connected to the transmission terminal, a low noise amplifier connected to the reception terminal, and the like are quietly connected. It is possible to protect against electric surges, and these subsequent high-frequency electronic components are not destroyed.

  In addition, the transmission line and part of the capacitance of the demultiplexing circuit and the switch circuit are integrated and integrated in the multilayer substrate, so that the wiring between the demultiplexing circuit and the switch circuit is also formed on the surface or inside of the multilayer substrate, and loss due to wiring is reduced. And the alignment adjustment between the two becomes easy.

On the other hand, since chip components such as a switch element, a resistor, a capacitor, and an inductor are mounted on a multilayer substrate, a small and high-performance antenna switch multilayer module composite component with a built-in electrostatic surge countermeasure circuit can be obtained.

  In addition, a communication device using these multiband antenna switch circuits or multiband antenna switch laminated module composite parts is downsized and has low power consumption specifications.

The present inventor was able to solve the above-described problem by inductively coupling and / or capacitively coupling the inductance L1 and the inductance L2 of the high-pass filter.
In the present invention, the inductive coupling and / or capacitive coupling between the inductance L1 and the inductance L2 of the high-pass filter may be at least a part of the inductance L1 ′ of the inductance L1 and a part of the inductance L2 ′ of the inductance L2.
The inductances L1, L1 ′, L2, and L2 ′ can be formed not only by transmission lines and strip lines but also by external inductors.

  1A is a circuit diagram in the case where the inductance L1 and the inductance L2 are fully coupled, and FIG. 1B is a partial coupling of a part of the inductance L1 ′ of the inductance L1 and a part of the inductance L2 ′ of the inductance L2. The circuit diagram in the case of doing is shown. Here, the symbol MCL indicates a coupling portion of inductive coupling and / or capacitive coupling.

FIG. 1 shows a high-pass filter that prevents an AC component and a DC component having frequencies lower than the communication frequency from passing by an inductor and a capacitor built in an electrode pattern in a circuit module.
As a result, even if static electricity enters the circuit module from the antenna, the direct current component of the static electricity and the alternating current component having a frequency lower than the communication frequency are released to the ground by the inductor, and the capacitor is allowed to enter the rear side of the circuit module. Can be blocked.

The high-pass filter is composed of, for example, a transmission line and a capacitor interposed in the transmission line. The high pass fill is built in the multilayer substrate. A DC cut capacitor is disposed between the high-pass filter and the subsequent circuit.

The high-pass filter according to the present invention is not a mere high-pass filter, and is further characterized in that at least a part of the constituting inductor is inductively coupled and / or capacitively coupled. The principle of the present invention will be described with reference to FIG.
An input surge voltage (represented by an “input surge voltage” waveform in FIG. 2) input from the input terminal P1 passes through the capacitance C1 and is attenuated (represented by a “pass voltage” waveform in FIG. 2). To the output terminal P2.
On the other hand, a part of the input surge voltage is coupled by a coupling portion MCL of L1 ′ and L2 ′ in which a part of the inductance L1 and the inductance L2 are coupled, and is inverted to the opposite phase by the inductance L2−L2 ′ and the inductance L2 ′, that is, reverse Phase induction (indicated by a “reverse phase induction” waveform in FIG. 2) is supplied to the output terminal P2.
As a result, the waveform of the passing voltage that has passed through the capacitance C1 (the “passing voltage” waveform in FIG. 2) and the voltage waveform of the negative phase induction (the “negative phase induction” waveform in FIG. 2) cancel each other. As a result, the output voltage from the output terminal P2 can be reduced (indicated by an “output voltage” waveform in FIG. 2).

The coupling degree of the coupling portion MCL in which the inductance L1 and the inductance L2 are coupled, or the coupling portion MCL of L1 ′ and L2 ′ in which a part of the inductance L1 and the inductance L2 are coupled will be described.
If the degree of coupling is less than a predetermined value, the reverse phase induction voltage waveform cannot cancel the input surge voltage, and the suppression of the surge voltage of the output voltage from the output terminal P2 is insufficient. When the degree of coupling exceeds a predetermined value, the voltage waveform of the reverse phase induction exceeds the input surge voltage and becomes over-cancelled, and the reverse phase surge voltage is output from the output terminal P2, which is not preferable.

  The degree of coupling can be adjusted by changing the distance between the electrode patterns constituting the inductance. The degree of coupling can be increased by reducing the distance between the electrode patterns. Rather than juxtaposing the electrode patterns on the same plane, the degree of coupling can be increased by juxtaposing the projection surfaces on the upper and lower surfaces.

  Accordingly, in designing the high-pass filter for countermeasures against electrostatic surges according to the present invention, the inductance electrodes are configured so that the voltage waveform of the reverse phase induction appropriately cancels the input surge voltage and does not cancel or over cancel the input surge voltage. What is necessary is just to perform a three-dimensional design suitably including the space | interval of a pattern, a dimension, etc.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a high-pass filter for electrostatic surge countermeasures and a multiband antenna switch circuit using the same according to the present invention will be described with reference to the drawings.

FIG. 1 shows an embodiment of a high-pass filter circuit for countermeasures against electrostatic surges according to the present invention. FIG. 1A shows a case where the inductor L1 and the inductor L2 are all coupled, and FIG. 1B shows a case where a part L1 ′ of the inductor L1 and a part L2 ′ of the inductor L2 are partially coupled.
In FIG. 1, an inductor L1 is connected between an input terminal P1 and the ground, and a capacitance C1 is inserted between the input terminal P1 and the output terminal P2, and a series resonant circuit including the inductor L2 and the capacitance C2. Are connected between the output terminal P2 and the ground.
The inductors L1 and L2 use the inductance of the transmission line formed by a pattern. Capacitances C1 and C2 use a coupling capacity between patterns. In this case, by appropriately selecting the values of the inductor L1 and the capacitance C1, a high-pass filter is configured to release the electrostatic surge to the ground and transmit the high-frequency signal with low loss.
Here, the inductor L1 is desirably 50 nH or less, and the capacitance C1 is desirably 10 pF or less. In addition, the series resonant circuit including the inductor L2 and the capacitance C2 sets the values of the inductor L and the capacitance C so that the resonance frequency is set between 100 MHz and 500 MHz. In this case, the capacitance C2 is desirably 10 pF or more, and L2 is desirably 50 nH or less. As a result, the electrostatic surge in the resonance frequency band, which is a problem in electrostatic breakdown, can be absorbed to the ground, and countermeasures against electrostatic surge can be performed more efficiently.

The breakdown due to electrostatic surge that can occur in an actual mobile terminal is assumed to be in contact with the antenna of the mobile terminal while the human body is charged.
Human Body Model is generally used as a method for experimentally reproducing this situation.
FIG. 3 shows an equivalent circuit of a device that is replaced with a specific equivalent circuit that indicates the charging state of the human body, and that the electric charge charged in the capacitance C is discharged to the DUT through the resistor R.

FIG. 4 shows a discharge surge waveform when the Human Body Model has a capacitance C = 150 pF and a resistance R = 330Ω.
FIG. 5 shows a frequency spectrum obtained by subjecting this waveform to Fourier transform and obtaining a frequency component of the discharge surge waveform.
From this frequency spectrum, the surge waveform from the human body is dominated by frequency components from DC to 300 MHz, and as a countermeasure against electrostatic surges, DC to 300 MHz can be removed, and high-frequency signals can be transmitted with low loss. It can be estimated that the filter is ideal.

Therefore, in the electrostatic surge countermeasure circuit of the present invention shown in FIG. 1, the distance between the inductor L1 and the inductor L2 is sufficiently separated so that there is no coupling portion MCL between the inductor L1 and the inductor L2 in FIG. As a comparative example, the attenuation characteristics from DC to 2 GHz were measured using the conventional electrostatic surge countermeasure circuit described in Patent Document 2 and Patent Document 3 as a conventional example.
Here, the conventional electrostatic surge countermeasure circuit described in Patent Document 2 (Conventional Example 1) is a circuit formed by the inductor L3 of FIG. 21, and the conventional electrostatic surge countermeasure circuit described in Patent Document 3 (Conventional Example 2) is 21 is a circuit formed by the inductor L1 and the capacitance C2 in FIG.
In this embodiment, since the coupling portion MCL is formed when the distance between the inductor L1 and the inductor L2 is 0.2 mm or less, in the comparative example, the distance between the inductor L1 and the inductor L2 is 0.3 mm where the coupling portion MCL is not formed. It was.

FIG. 6 shows the attenuation characteristics. When comparing the characteristics, the signals to be passed were assumed to be 900 MHz band and 1800 MHz band.
From the attenuation characteristics shown in FIG. 6, the attenuation in the frequency band of 300 MHz or less, which is a problem in electrostatic breakdown, is only 5 dB or less in the conventional electrostatic surge countermeasure circuit (conventional examples 1 and 2). Absent. In the comparative example, an attenuation of slightly more than 25 dB (30 dB or more) is obtained, but in the present invention, an attenuation of 10 dB more than that of the comparative example is obtained, and it can be seen that the surge voltage can be reduced by 1/3.

FIG. 7 shows another embodiment of the high-pass filter 6 for electrostatic surge countermeasures according to the present invention. In FIG. 7, the roles of the inductors L1 and L2 and the capacitances C1 and C2 are the same as those shown in the first embodiment, but the capacitance C3 and the inductor L3 are connected between the capacitance C1 and the output terminal P2. The point from which the comprised parallel resonant circuit is inserted differs from Example 1. FIG.
This parallel resonant circuit functions to remove the harmonic noise signal transmitted from the antenna by setting it to have an attenuation pole at a frequency N times that of the transmission signal.
In addition, by adjusting the values of the capacitance C3 and the inductor L3, matching of the entire electrostatic surge circuit can be adjusted, which is more effective.

FIG. 8 is a block diagram showing an embodiment of a triple band antenna switch circuit 7 using the high-pass filter 6 for electrostatic surge prevention according to the present invention.
The branching circuit Dip plays a role of branching and synthesizing a signal in the EGSM band (880 to 960 MHz) and a signal in the DCS / PCS band (DCS: 1710 to 1880 MHz, PCS: 1850 to 1990 MHz).
The switch circuit SW1 switches between the EGSM transmission signal and the reception signal. The switch circuit SW2 performs switching of a DCS / PCS transmission signal, a DCS reception signal, and a PCS reception signal by using an SP3T (Single Pole 3 Throw) switch.
The low-pass filter LPF1 plays a role of attenuating Nth-order harmonic distortion included in the transmission signal input from the EGSM TX terminal. The low-pass filter LPF2 plays a role of attenuating Nth-order harmonic distortion included in the transmission signal input from the DCS / PCS TX terminal.
The SAW filters SAW1 to SAW3 each play a role of removing noise outside the reception band included in the EGSM reception signal, the DCS reception signal, and the PCS reception signal.

In FIG. 8, the high-pass filter 6 according to the present invention is inserted between the antenna terminal ANT and the branching circuit Dip, and plays a role of absorbing the electrostatic surge input from the antenna terminal ANT to the ground.
Accordingly, the DIP diode switch or GaAs FET switch constituting the antenna switch circuit 7, the reception SAW filter, the power amplifier connected to the transmission terminal, the low noise amplifier connected to the reception terminal, etc. by the high-pass filter 6 according to the present invention. This circuit can be protected from electrostatic surges.

Further, the parallel resonant circuit composed of the inductor L3 and the capacitor C3 shown in the dotted line frame is shown as a circuit that can be added if necessary (the same applies to the following embodiments).
In this case, by adjusting the attenuation pole to a frequency twice that of DCS / PCS Tx (3420 MHz to 3820 MHz), a frequency four times that of EGSM transmission (3520 MHz to 3660 MHz) can also be attenuated simultaneously. The transmission attenuation of 2 times and the attenuation of 4 times of EGSM transmission can be attenuated simultaneously.
Moreover, since the parallel resonant circuits L3 and C3 also have a function as a matching circuit, they are useful for matching adjustment of the entire antenna switch.

FIG. 9 is an equivalent circuit diagram of the latter stage from the branching circuit Dip of FIG. In FIG. 9, the surface acoustic wave filters SAW1 to SAW3 are omitted.
FIG. 10 shows the relationship between each operation mode of EGSM, DCS, and PCS and the control power supply in the circuit of FIG.
For example, in the EGSM transmission mode (Tx), the control power supply VC1 is set to High, and the control power supply VC2 and the control power supply VC3 are set to Low. As a result, as will be described in detail below with reference to FIG. 9, the PIN diodes D1 and D2 are turned on, the PIN diodes D3 to D6 are turned off, and the EGSM signal from the EGSM transmission terminal (Tx) is connected to the antenna terminal ANT. Then, it is transmitted from the antenna.

In FIG. 9, the branching circuit Dip is composed of transmission lines L101 to L104 and capacitors C101 to C104. It is desirable that the transmission line L102 and the capacitor C101 form a series resonance circuit and be designed to have resonance frequencies in the DCS and PCS bands.
Further, it is desirable that the transmission line L104 and the capacitor C103 form a series resonance circuit and be designed to have a resonance frequency in the EGSM band. This circuit makes it possible to demultiplex and synthesize an EGSM system signal and a DCS system or PCS system signal.
The transmission lines L101 and L103 are preferably set to a certain length so as to have a high impedance for the frequency of the DCS and PCS signals. This makes it difficult for DCS and PCS signals to be transmitted to the EGSM route.
Conversely, the capacitances C102 and C104 are preferably set to relatively small capacitance values so as to have a high impedance for the frequency of the EGSM signal. This makes it difficult for EGSM signals to be transmitted to the DCS / PCS route.

In FIG. 9, the first switch circuit SW1 includes capacitances C5 and C6, transmission lines L5 and L6, PIN diodes D1 and D2, and a resistor R1.
The lengths of the transmission lines are set so that the transmission lines L5 and L6 are λ / 4 resonators in the EGSM transmission frequency band.
However, the transmission line L5 can be replaced with a choke coil whose ground level looks like OPEN (high impedance state) at the EGSM transmission frequency. In this case, the inductance value is desirably about 10 to 100 nH.
The resistor R1 determines a current flowing through the first and second diodes D1 and D2 when the control power supply VC1 is in a high state.
Capacitances C5 and C6 are necessary for DC cutting of the control power supply. When the control power supply VC1 is High, the PIN diode D2 has a parasitic inductance such as a connection wire, and therefore, series resonance with the capacitor C6 is performed to cancel this. The capacitance value of the capacitance C6 is set as appropriate.

As described above, when the control power supply VC1 is High, the first and second diodes D1 and D2 are both turned ON, and the connection point between the second diode D2 and the transmission line L6 becomes the ground level, which is a λ / 4 resonator. The impedance on the opposite side of the transmission line L6 becomes infinite.
Therefore, when the control power supply VC1 is High, a signal cannot pass through the path from the demultiplexing circuit Dip to the subsequent EGSM reception terminal EGSM Rx, and between the demultiplexing circuit Dip and the EGSM transmission terminal EGSM Tx. In the path, the signal easily passes.
On the other hand, when the control power supply VC1 is Low, the first diode D1 is also turned OFF, and a signal cannot pass through the path from the branching circuit Dip to the EGSM transmission terminal EGSM Tx at the subsequent stage, and the second diode Since D2 is also OFF, a signal easily passes through a path from the branching circuit Dip to the EGSM reception terminal EGSM Rx at the subsequent stage.
With the above configuration, it is possible to switch between transmission and reception of EGSM signals.

In FIG. 9, the second switch circuit SW2 includes capacitances C7 to C10, transmission lines L7 to L10, PIN diodes D3 to D6, and resistors R2 and R3.
The transmission lines L7 to L10 set the length of the transmission line so as to be a λ / 4 resonator at the frequency of the signal from DCS to PCS.
However, the transmission lines L7 and L9 can be replaced by choke coils whose ground level is visible as OPEN (high impedance state) at the DCS transmission frequency and the PCS transmission frequency, respectively.
The resistor R2 determines the current flowing through the third and fourth diodes D3 and D4 when the control power supply VC2 is in the high state. The resistor R3 determines the current flowing through the fifth and sixth diodes D5 and D6 when the control power supply VC3 is in the high state.
Capacitors C7, C8, and C10 are necessary for DC cut (blocking) of the control power supply. Further, when the control power supply VC2 is High, a parasitic inductance such as a connection wire exists in the PIN diode D4, so that the capacitance value of the capacitor C7 is set so as to resonate in series with the capacitor C7.

As described above, when the control power supply VC2 is High, the third and fourth diodes D3 and D4 are both turned ON, and the connection point between the fourth diode D4 and the transmission line L8 becomes the ground level, which is a λ / 4 resonator. The impedance on the opposite side of the transmission line L8 becomes infinite.
Therefore, when the control power supply VC2 is High, the signal cannot pass through the path from the demultiplexing circuit Dip to the DCS reception terminal DCS Rx and the path from the demultiplexing circuit Dip to the PCS reception terminal PCSRx. A signal easily passes through a path from the wave circuit Dip to the DCS / PCS transmission terminal DCS / PCSTx.
On the other hand, when the control terminal VC2 is Low, the third diode D3 is also OFF, and a signal cannot pass through the path from the branching circuit Dip to the DCS / PCS transmission terminal DCS / PCSTx, and the fourth diode Since D4 is also OFF, a signal easily passes through the path from the demultiplexing circuit Dip to the DCS reception terminal DCSRx and the path from the demultiplexing circuit Dip to the PCS reception terminal PCSRx.

Further, when the control terminal VC3 is High, since there is a parasitic inductance such as a connection wire in the PIN diode D6, the capacitance value of the capacitor C10 is set so as to resonate in series with the capacitor C10.
Thereby, when the control terminal VC3 is High, the fifth and sixth diodes D5 and D6 are both turned ON, and the connection point between the sixth diode D6 and the transmission line L10 becomes the ground level, which is a λ / 4 resonator. The impedance on the opposite side of the transmission line L10 becomes infinite.
Therefore, when the control terminal VC3 is High, a signal cannot pass through the path between the PCS receiving terminals PCSRx, and the signal easily passes through the path between the DCS receiving terminals DCS Rx.
On the other hand, when the control terminal VC3 is Low, the fifth diode D5 is also turned OFF, and a signal cannot pass through the path between the DCS reception terminals DCS Rx, and the signal easily passes through the path between the PCS transmission / reception terminals PCSRx.

With the above configuration, when the control terminal VC2 is High, the DCS / PCS transmission terminal DCS / PCSTx, and when the control terminals VC2 and VC3 are Low and High, respectively, the DCS reception terminal DCS Rx, the control terminal VC2 and the control terminal VC3. When is low, switching to the PCS receiving terminal PCSRx is possible.

In FIG. 9, the first low-pass filter LPF1 is a π-type low-pass filter including a transmission line L11 and capacitors C11 to C13.
Here, L11 and C11 constitute a parallel resonance circuit, and the resonance frequency is set to be twice or three times the transmission frequency of EGSM.
With the above configuration, harmonic distortion contained in the EGSM-side transmission signal input from a power amplifier (not shown) can be removed.
If the capacitance connected to the ground of the first low-pass filter LPF1 is arranged in parallel with the transmission line L5, a parallel resonance circuit is formed, and the line length of the transmission line L5 is shorter than λ / 4. The inductance value of the choke coil can be reduced.

In FIG. 9, the second low-pass filter LPF2 is a π-type low-pass filter including a transmission line L12 and capacitors C14 to C16. Here, the transmission line L12 and the capacitance C14 constitute a parallel resonance circuit, and the resonance frequency is set to be twice or three times the DCS transmission frequency.
With the above configuration, harmonic distortion included in the DCS transmission signal input from a power amplifier (not shown) can be removed.

  A part of the inductor and the capacitor constituting the high-pass filter and antenna switch circuit for countermeasure against electrostatic surge in the present invention can be built in the dielectric multilayer substrate, and the other part of the capacitor constituting the electrostatic surge countermeasure circuit, Multi-band antenna switch multilayer module that is small and inexpensive by mounting chip parts such as PIN diode switch elements, GaAs FET switch elements, resistors, capacitors, and choke coils used as inductors and switch circuits on the dielectric multilayer substrate. Composite parts are obtained.

FIG. 11 is a view showing a green sheet and an electrode pattern constituting the laminate of the antenna switch laminated module composite part shown by the circuit of FIG.
In FIG. 11A, the green sheets GS1 to GS12 are laminated in order from the top. FIG. 11B is a diagram illustrating the back surface of the green sheet GS12.
On the green sheet GS1, a land electrode 14 for mounting a diode, a chip resistor, and a chip capacitor and a land electrode 16 for mounting a metal shield (metal case) are printed.
In addition, a via-hole electrode 15 (indicated by a black circle in the figure) that connects electrode patterns formed on different green sheets is formed.
On the bottom surface of the green sheet GS12, there are ground terminals 61 to 67, an antenna terminal 68, an EGSM transmission terminal 69, a DCS transmission terminal 70, a PCS transmission / reception terminal 71, a DCS reception terminal 72, an EGSM reception terminal 73, and power supply terminals 74 to 76. Is formed.
On the green sheets GS2 to GS4, GS9, and GS10, a line electrode pattern mainly serving as a transmission line is printed.
On the green sheets GS5 to GS8 and GS11, electrode patterns for capacitors that mainly form capacitors are printed.
In addition, ground electrodes 17 to 19 are printed on the green sheets GS6, GS8, and GS12.

In FIG. 11, the inductor L1 of the high-pass filter 6 according to the present invention is formed on the green sheet GS9 and the green sheet GS10, and is configured by an electrode pattern indicated by reference numeral L1. The inductor L2 is formed on the green sheet GS9 and the green sheet GS10, and is configured by an electrode pattern indicated by a symbol L2.
The electrode pattern of the inductor L1 and the electrode pattern of the inductor L2 are partially arranged close to each other, and are inductively coupled and / or capacitively coupled to form the coupling portion MCL.
Accordingly, as described with reference to FIG. 2, the negative surge can be induced to cancel the input surge voltage and reduce it.

In FIG. 11, reference numerals 20 to 28 denote transmission lines constituting the branching circuit Dip. Reference numerals 21 and 23 denote an inductor L101, reference numerals 25 and 27 denote an inductor L102, reference numerals 20 and 22 denote an inductor L103, reference numeral 26 denotes a transmission line. The inductor L104 is formed by reference numeral 28.
Reference numerals 45 to 50 correspond to capacitance electrode patterns constituting the demultiplexing circuit Dip. Reference numerals 45 and 46 indicate electrostatic capacity C2, reference numerals 47 and 48 indicate electrostatic capacity C4, and reference numerals 49 and 17 indicate static capacity. A capacitance C3 is formed by the capacitance C1, the reference numeral 50, and the reference numeral 17.
Reference numerals 29 to 34 denote transmission lines constituting the switch circuit SW1. Reference numerals 29 and 30 form an inductor L11, reference numerals 31 and 32 denote an inductor L5, and reference numerals 33 and 34 denote an inductor L6.
Reference numerals 51 to 54 correspond to capacitive electrode patterns constituting the switch circuit SW1. Reference numerals 51 and 52 indicate electrostatic capacity C11, reference numerals 53 and 18 indicate electrostatic capacity C12, and reference numerals 52 and 18 indicate electrostatic capacity. Capacitance C6 is formed by the capacitance C13, reference numeral 54, and reference numeral 18.
Reference numerals 35 to 43 are transmission lines constituting the switch circuit SW2. Reference numerals 35 and 36 denote an inductor L12, reference numeral 37 denotes an inductor L7, reference numerals 38 and 41 denote an inductor L10, reference numerals 39 and 42 denote an inductor L9, reference numeral 40. The inductor L8 is formed by reference numeral 43.
Reference numerals 55 to 59 correspond to capacitive electrode patterns constituting the switch circuit SW2. Reference numeral 55 and reference numeral 58 indicate electrostatic capacity C14, reference numeral 56 and reference numeral 19 indicate electrostatic capacity C10, reference numeral 57 and reference numeral 19 indicate electrostatic capacity C7, reference numerals 58 and 18 indicate electrostatic capacity C15, reference numerals 59 and reference numeral 17, and so on. A capacitance C16 is formed.
The through-hole electrode 15 performs electrical connection between the sheets.

The green sheet used in this example uses a ceramic dielectric material that can be fired at a low temperature of 950 ° C. or less, and a sheet having a sheet thickness of 40 to 200 μm is used so that a transmission line and a capacitor can be easily formed. After laminating these green sheets GS1 to GS12 and printing the side electrodes, firing is performed at 950 ° C. to obtain a laminate of the antenna switch laminate module composite component. The green sheet constitutes a dielectric layer after firing.
Furthermore, an antenna switch laminated module composite component can be obtained by mounting a PIN diode, a chip resistor, and a chip capacitor on the laminated body.

FIG. 12 shows a high-pass filter 6 according to the present invention configured as a laminated component having input terminals P1, output terminals P2, and ground terminals GND as side electrodes.
In this case, as shown in FIG. 11, not only the inductance values of the inductances L1, L2, L1 ′, and L2 ′ and the capacitance values of the capacitances C1 and C2 but also the inductance as compared with the case where they are built in the laminate. Since the inductive coupling and capacitive coupling of L1, L2, L1 ′, and L2 ′ can be freely changed, it is possible to take countermeasures against electrostatic surges independently of the design of the antenna switch laminated module, thereby improving versatility.

Another example of the pattern arrangement of each layer of the green sheet in the laminated component of the high-pass filter 6 illustrated in FIG. 12 is shown in FIGS. The green sheets gs1 to gsgs9 (further gs10) are stacked in order from the top.
In addition, the figure shown under the green sheet gs9 of FIG. 13 is a figure which shows the back surface of the green sheet gs9. The figure shown under the green sheet gs9 of FIG. 14 is a figure which shows the back surface of the green sheet gs9. The figure shown under the green sheet gs10 of FIG. 15 is a figure which shows the back surface of the green sheet gs10.

In FIG. 13, the electrostatic capacity C1 is formed by the green sheets gs2 and green sheets gs3, and the electrostatic capacity C2 is formed by the green sheets gs7 to gs9. The inductor L1 is formed of the green sheets gs4 to gs6, and the inductor L2 is formed of the green sheets gs4 to gs6.
The pattern interval pd between the electrode patterns of the inductor L1 and the inductor L2 can be appropriately selected so as to exhibit an appropriate canceling effect such that the reverse phase induced voltage with respect to the input surge voltage does not cause over-cancellation or under-cancellation.
When a dielectric material having a dielectric constant ε = 8 is laminated to form a 1608 type (1.6 × 0.8 mm) chip shape, the coupling portion MCL is formed when the distance pd between the inductor L1 and the inductor L2 is 0.2 mm or less. . In this case, magnetic coupling occurs.

In FIG. 14, electrostatic capacity C1 is formed by the green sheets gs2 and green sheets gs3, and electrostatic capacity C2 is formed by the green sheets gs7 to gs9. The inductor L1 is formed of the green sheets gs4 to gs6, and the inductor L2 is formed of the green sheets gs4 to gs6.
Bonded portions MCL are formed on the green sheets gs5 and gs6. In the green sheet gs5, the electrode patterns of the inductor L1 and the inductor L2 are formed, but since they are arranged apart from each other, the coupling on the green sheet gs5 is weak. The same applies to the green sheet gs6.
In this case, as indicated by a broken line, capacitive coupling between the green sheet gs5 and the green sheet gs6 that face each other with a dielectric interposed therebetween is dominant. This is because the projection pattern of the electrode pattern on the green sheet gs5 and the electrode pattern on the green sheet gs6 overlaps to constitute a capacitance electrode.
In this case, the coupling is a combination of magnetic coupling and capacitive coupling, and the degree of coupling is greater than that of the embodiment shown in FIG.

The layer distance between the inductor L1 on the green sheet gs5 and the inductor L2 on the green sheet gs6 has an appropriate canceling effect so that the negative phase induced voltage with respect to the input surge voltage does not cause over- or under-cancellation. Can be selected as appropriate. For example, about 15 to 35 μm is preferable.
When stacking dielectrics having a dielectric constant ε = 8 to form a 1608 type (1.6 × 0.8 mm) chip shape, as an example, the layer distance between the inductor L1 and the inductor L2 can be 25 μm.

In FIG. 15, the electrostatic capacity C1 is formed by the green sheets gs2 and green sheets gs3, and the electrostatic capacity C2 is formed by the green sheets gs8 to gs10. The inductor L1 is formed by the green sheets gs4 to gs6, and the inductor L2 is formed by the green sheets gs4, gs5, and gs7.
The green sheet gs4 and the green sheet gs5 are formed with the electrode patterns of the inductor L1 and the inductor L2, the green sheet gs6 is formed with only the electrode pattern of the inductor L1, and the green sheet gs7 is formed with only the electrode pattern of the inductor L2.
Bonded portions MCL are formed on the green sheets gs5 to gs7. In this case, magnetic coupling occurs.

  When a dielectric material having a dielectric constant ε = 8 is laminated to form a chip shape of 1608 type (1.6 × 0.8 mm), as one example, a coil is formed by connecting through green sheets gs4 to gs6 through a through hole. It is preferable that the number of turns of the inductor L2 that forms a coil by connecting through the green sheets gs4, gs5, and gs7 to form a coil with respect to the number of turns of the inductor L1 that is 2.5 turns.

As described above, in the high-pass filter according to the present invention, the coupling portion MCL by inductive coupling and / or capacitive coupling is formed, and the input surge voltage can be canceled and reduced by reverse phase induction.

Also in this embodiment, the used green sheet uses a ceramic dielectric material that can be fired at a low temperature of 950 ° C. or lower, and a high-pass filter in a chip can be easily obtained.
The green sheet is solidified after firing to form a dielectric layer.

FIG. 16 is a block diagram showing an embodiment of a triple-band antenna switch circuit in which a high-pass filter for electrostatic surge prevention according to the present invention is inserted between an antenna ANT and a GaAs FET switch.
In this case, the SP5T (Single Pole 5 Throw) switch switches the EGSM transmission signal, EGSM reception signal, DCS / PCS transmission signal, DCS reception signal, and PCS reception signal among the signals input / output from the antenna terminal to predetermined terminals. I do.
The low-pass filter LPF1 plays a role of attenuating N-order harmonic distortion included in the transmission signal input from the EGSM TX terminal, and the LPF 2 is N-order harmonic distortion included in the transmission signal input from the DCS / PCS TX terminal. It plays a role to attenuate.
The SAW filters SAW1 to SAW3 serve to remove noise outside the reception band included in the EGSM reception signal, the DCS reception signal, and the PCS reception signal, respectively.

In FIG. 16, the electrostatic surge countermeasure circuit of the present invention is inserted between the antenna terminal and the SP5T switch, and absorbs the electrostatic surge input from the antenna to the ground.
Accordingly, the electrostatic surge countermeasure circuit of the present invention protects circuits such as SP5T switches, reception SAW filters, power amplifiers (not shown) connected to the transmission terminals, and low noise amplifiers connected to the reception terminals from electrostatic surges. I can do it.

FIG. 17 shows an embodiment of a triple-band antenna switch circuit using a high-pass filter for electrostatic surge prevention according to the present invention.
In this case, the SP3T switch switches the EGSM transmission signal and the DCS reception signal to the branching circuit Dip1 among the signals input / output from the antenna terminal, switches the DCS / PCS transmission signal and the EGSM reception signal to the branching circuit Dip2, and receives the PCS. The signal is switched to SAW for PCS reception.
The low-pass filter LPF1 plays a role of attenuating N-order harmonic distortion included in the transmission signal input from the EGSM TX terminal, and the LPF 2 is N-order harmonic distortion included in the transmission signal input from the DCS / PCS TX terminal. It plays a role to attenuate.
The SAW filters SAW1 to SAW3 serve to remove noise outside the reception band included in the EGSM reception signal, the DCS reception signal, and the PCS reception signal, respectively. The branching circuit Dip1 is connected to LPF1 and SAW2, and the branching circuit Dip2 is connected to LPF2 and SAW1.

In FIG. 17, a high-pass filter 6 for countermeasure against electrostatic surge according to the present invention is inserted between the antenna terminal ANT and the SP3T switch, and absorbs the electrostatic surge input from the antenna to the ground.
Therefore, the electrostatic surge countermeasure circuit of the present invention protects circuits such as SP3T switches, reception SAW filters, power amplifiers (not shown) connected to the transmission terminals, and low noise amplifiers connected to the reception terminals from electrostatic surges. I can do it.
In addition, since the SP3T switch used in this embodiment has a smaller circuit scale than SP5T, it can be smaller and less expensive than the high-frequency antenna switch module using the SP5T switch shown in the fourth embodiment. There is a feature.

  A part of the inductor and the capacitor constituting the high-pass filter and the antenna switch circuit for electrostatic surge prevention in the present invention can be built in the dielectric multilayer substrate, while the part of the capacitance constituting the electrostatic surge countermeasure circuit, Multi-band antenna switch multilayer module that is small and inexpensive by mounting chip parts such as PIN diode switch elements, GaAs FET switch elements, resistors, capacitors, and choke coils used as inductors and switch circuits on the dielectric multilayer substrate. Composite parts are obtained.

For example, FIG. 18 shows a perspective view of a composite part in which the antenna switch circuit module shown in the block diagram of FIG.
Inside the laminate, the branching circuits Dip1, Dip2, the low-pass filters LPF1, LPF2, and the inductors and capacitors constituting the high-pass filter circuit for countermeasures against electrostatic surges are divided into a plurality of layers and printed. It is possible to reduce the size and weight.
On the other hand, an SP3T GaAs FET switch 2, a SAW filter 3, a chip inductor 4, and a chip capacitor 5 are mounted on the multilayer body 1, respectively.

In this embodiment, the multilayer substrate uses a ceramic dielectric material (LTCC) that can be fired at a low temperature of 950 ° C. or less, and the ceramic green sheet before firing has a sheet thickness so that a transmission line and a capacitor can be easily formed. The thing of 40-200 micrometers was used. A plurality of these ceramic green sheets are laminated, cut into individual pieces, printed with side electrodes, and then fired at 950 ° C. to obtain a laminated body of antenna switch laminated module composite parts.
Further, by mounting an SP3T GaAs FET switch, a chip inductor, and a chip capacitor on the obtained laminated body, a compact antenna switch laminated module composite part having a countermeasure against electrostatic surge can be obtained.

In the above embodiment, it is assumed that the electrostatic surge countermeasure circuit is connected to the antenna top, but the electrostatic surge countermeasure circuit of the present invention is characterized in that it can be matched in a sufficiently wide band from 900 MHz to 2 GHz. It is possible to insert not only the antenna top but also a plurality of places. For example, taking the block diagram of FIG. 17 as an example,
(1) Dip-SW1, (2) Dip-SW2, (3) SW1-LPF1, (4) SW1-SAW1, (5) SW2-LPF2, (6) SW2-SAW2, (7 ) It can be provided between SW2 and SAW3 and at a position where these (1) to (7) are combined.

In the above embodiment, the multi-band antenna switch circuit corresponding to EGSM, DCS, and PCS has been described. In addition, the PCS band (1920 MHz to 2170 MHz), the PDC 800 band (810 to 960 MHz), and DAMPS (824 to 849 MHz), GPS band (1575.42 MHz), PHS band (1895 to 1920 MHz), Bluetooth band (2400 to 2484 MHz), CDMA2000, which is expected to be popular in the United States, and TD-SCDMA, which is expected to be popular in China. Can be expected.
Therefore, according to the present invention, a dual-mode, 3-band, 4-band, 5-band, etc. multimode multiband antenna switch circuit with reduced harmonic generation can be obtained, and these functions can be integrated in the laminate. I can do it.

As a result of testing the high-pass filter shown in Example 1 and the high-pass filter of the comparative example incorporated in a mobile phone, a compact and low-power-consumption communication device with further improved electrostatic surge resistance was obtained. .
For the test, a device (see FIG. 3) was used, which was replaced with an equivalent circuit by Human Body Model, and the charge charged in the capacitance C was discharged to the DUT via the resistor R.

  According to the present invention, it is possible to more fully take countermeasures against electrostatic breakdown, and a transmission line and a part of the capacitance of the branching circuit and the switch circuit can be integrated and integrated in the laminated substrate, so that the multiband antenna switch circuit according to the present invention, or A communication device using a multi-band antenna switch laminated module composite component is downsized and has low power consumption.

It is a circuit diagram which shows one Example of the high pass filter which concerns on this invention. FIG. 1A is a circuit diagram showing a case where the inductors L1 and L2 are completely coupled, and FIG. 1B is a circuit diagram showing a case where the inductors L1 and L2 are partially coupled. It is a schematic diagram which shows the operation principle of the high pass filter which concerns on this invention. It is an equivalent circuit diagram of a Human Body Model testing machine that reproduces an electrostatic surge. It is a figure which shows an electrostatic surge voltage waveform. It is a figure which shows the frequency spectrum of an electrostatic surge waveform. It is an attenuation characteristic figure of the high pass filter concerning the present invention. It is a circuit diagram which shows another Example of the high pass filter which concerns on this invention. It is a block diagram which shows one Example of the multiband antenna switch circuit based on this invention. In the block diagram of FIG. 8, it is a circuit diagram which shows the equivalent circuit of a back | latter stage from the branching circuit Dip. FIG. 10 is a diagram illustrating an ON / OFF state of a PIN diode in each operation mode in the circuit of FIG. 9. It is a figure which shows the electrode pattern of each layer of the green sheet which comprises the laminated body of the antenna switch composite component shown by the block diagram of FIG. It is a figure which shows the example which comprised one Example of the high-pass filter which concerns on this invention with the laminated body. It is a figure which shows the electrode pattern of each layer of the green sheet which comprises a laminated body when one Example of the high pass filter which concerns on this invention is comprised with a laminated body. It is a figure which shows the electrode pattern of each layer of the green sheet which comprises a laminated body when another Example of the high pass filter which concerns on this invention is comprised with a laminated body. It is a figure which shows the electrode pattern of each layer of the green sheet which comprises a laminated body when another Example of the high pass filter which concerns on this invention is comprised with a laminated body. It is a block diagram which shows another Example of the multiband antenna switch circuit based on this invention. It is a block diagram which shows another Example of the multiband antenna switch circuit based on this invention. It is a perspective view of a multiband antenna switch laminated module composite part incorporating a high-pass filter according to the present invention. It is a block diagram which shows one Example of the conventional multiband antenna switch circuit. It is an equivalent circuit diagram of a PIN diode switch incorporating a conventional high-pass filter for electrostatic surge countermeasures. It is an equivalent circuit diagram of an antenna switch circuit incorporating a conventional high-pass filter for electrostatic surge countermeasures. It is a block diagram which shows another Example of the conventional multiband antenna switch circuit.

Explanation of symbols

ANT: antenna terminals C1 to C11: capacitors D1 to D4: PIN diodes Dip, Dip1, Dip2: branching circuits GS1 to GS12: dielectric layers (green sheets)
gs1 to gs10: dielectric layer (green sheet)
L1-L9: Inductors LPF1, LPF2: Low-pass filter MCL: Coupling part P1: Input terminal P2: Output terminal R1, R2: Resistors RX, RX1, RX2: Reception terminals SW, SW1, SW2: Switch circuits SAW, SAW1-SAW3: SAW filters TX, TX1, TX2: transmission terminals VC, VC1, VC2: control power supply terminal Vs: power supply for electrostatic surge voltage application 1: laminated dielectric 2: SP3T GaAs FET switch 3: SAW filter 4: chip inductor 5: chip Capacitor 6: High-pass filter 7: Multiband antenna switch circuit 8: Multiband antenna switch laminated module

Claims (9)

A first inductor having an input terminal and an output terminal, connected between the input terminal and the ground, a first capacitor connected between the input terminal and the output terminal, and connected to the output terminal And a series resonant circuit including the second inductor and a second capacitor connected to the ground, and at least a part of the first inductor and the second inductor is provided. A high-pass filter characterized by being inductively coupled and / or capacitively coupled. 2. The high-pass filter according to claim 1, wherein a parallel resonant circuit including a third inductor and a third capacitor is provided between the second inductor and the output terminal. The LC circuit is constituted by an electrode pattern in a substrate of a laminated substrate formed by laminating a plurality of dielectric layers, and the first inductor connected to the ground electrode and the second on the ground electrode. And a first capacitor connected between the first inductor and the second inductor, and the first inductor and the second inductor. The high-pass filter is characterized in that the electrode pattern that constitutes is disposed on at least one dielectric layer. An antenna is connected to an input terminal of the high-pass filter according to any one of claims 1 to 3, and an antenna terminal of a multiband antenna switch circuit that switches a signal having a plurality of frequencies to a transmission / reception terminal is connected to the output terminal. A featured multiband antenna switch circuit. An antenna is connected to the output terminal of the high-pass filter according to any one of claims 1 to 3, and an antenna terminal of a multiband antenna switch circuit that switches a signal having a plurality of frequencies to a transmission / reception terminal is connected to the input terminal. A featured multiband antenna switch circuit. 4. A multiband antenna switch circuit for switching signals of a plurality of frequencies to a transmission / reception terminal, wherein the multiband antenna switch circuit is provided between a reception terminal of the multiband antenna switch circuit and a reception SAW filter. 5. A multiband antenna switch circuit, wherein a high-pass filter is inserted. A high pass filter according to any one of claims 1 to 3 and a part of an inductor and a capacitor constituting the multiband antenna switch circuit according to claims 4 to 6 are built in a multilayer substrate, and a part of the multiband antenna switch circuit is configured. A multiband antenna switch laminate module comprising a chip substrate such as a switch element, a resistor, a capacitor, an inductor and a SAW filter mounted on a laminate substrate. A demultiplexing circuit that divides a plurality of transmission / reception systems having different passbands into a high-frequency signal and a low-frequency signal, and a switch that is connected to the demultiplexing circuit and switches the connection between the transmission system and the reception system of the transmission / reception system A circuit, a low-pass filter provided in each transmission system of the plurality of transmission / reception systems, and a high-pass filter, the branching circuit is configured by an LC circuit, and the switch circuit is mainly configured by a switching element and a transmission line And the low-pass filter and the high-pass filter are composed of LC circuits, and at least part of the LC circuit of the branching circuit, the LC circuit of the low-pass filter and the high-pass filter, and the transmission line of the switch circuit are a plurality of dielectric layers. A chip that is configured by an electrode pattern in a substrate of a multilayer substrate formed by laminating layers and constitutes a part of the switching element or the LC circuit And the LC circuit of the high-pass filter includes a first inductor connected to a ground electrode, a second inductor connected to the ground electrode via a second capacitor, And a first capacitor connected between the first inductor and the second inductor, and the electrode pattern constituting the first inductor and the second inductor is on at least one dielectric layer. A multi-band antenna switch laminated module characterized by being arranged. A high-pass filter according to any one of claims 1 to 3 and a multiband antenna switch circuit according to any one of claims 4 to 6, or a multiband antenna switch laminated module according to claim 7 or 8. A communication device.

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