JP2005064179A - Radiator - Google Patents

Radiator Download PDF

Info

Publication number
JP2005064179A
JP2005064179A JP2003291283A JP2003291283A JP2005064179A JP 2005064179 A JP2005064179 A JP 2005064179A JP 2003291283 A JP2003291283 A JP 2003291283A JP 2003291283 A JP2003291283 A JP 2003291283A JP 2005064179 A JP2005064179 A JP 2005064179A
Authority
JP
Japan
Prior art keywords
fan
fan frame
impeller
heat
heat dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003291283A
Other languages
Japanese (ja)
Other versions
JP3854255B2 (en
Inventor
Shou-Te Yu
ユ ショウ−テ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to JP2003291283A priority Critical patent/JP3854255B2/en
Publication of JP2005064179A publication Critical patent/JP2005064179A/en
Application granted granted Critical
Publication of JP3854255B2 publication Critical patent/JP3854255B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a radiator in which maximum air flow can be obtained without using a fan of large power or high speed rotation, desirable radiation effect can be improved and noise can be suppressed. <P>SOLUTION: In the radiation device, a fan composed of a fan frame and an impeller which is freely rotatably disposed in the fan frame is arranged in a radiation means having a plurality of fins disposed in parallel. The impeller is formed of a hub and a plurality of blades installed along a periphery on an outer peripheral face of the hub. The fan frame includes a driving part where the impeller is freely rotatably installed and a supporting part which is arranged between the fan frame and the driving part, and which connect them, and the fan frame is installed so that the supporting part is in the same direction as the fins of the radiation means in parallel. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、放熱装置に関し、特に回路ボードなどに設けられる電子素子などに取り付けて、発生する熱を放出するための放熱装置に関するものである。   The present invention relates to a heat radiating device, and more particularly to a heat radiating device that is attached to an electronic element or the like provided on a circuit board or the like to release generated heat.

コンピュータの普及と、コンピュータに関連する情報産業の急速な発展にともない、コンピュータに対する機能向上のニーズはますます高まっている。中央演算処理装置、もしくは集積回路チップによる演算速度も高速化が進んでいる。このため、相対的に発生する熱の量も増加している。過多の熱を迅速に放出することができない場合、中央演算処理装置、もしくは集積回路チップの安定性に極めて大きな影響を与える。かかる問題を改善するために、通常業界では中央演算処理装置、もしくは集積回路チップの上面に、羽根車を具える放熱手段を設けて放熱を行っている。   With the spread of computers and the rapid development of the information industry related to computers, there is an ever-increasing need for computer functions. The calculation speed by the central processing unit or the integrated circuit chip is also increasing. For this reason, the amount of heat generated relatively increases. If excessive heat cannot be released quickly, the stability of the central processing unit or integrated circuit chip is greatly affected. In order to improve such a problem, in the normal industry, heat is radiated by providing a heat radiating means having an impeller on the upper surface of a central processing unit or an integrated circuit chip.

以下、図により、従来の放熱装置について説明する。   Hereinafter, a conventional heat dissipation device will be described with reference to the drawings.

図１、２、３、４には、平行させて配設した複数のフィン（１２１）を具える放熱手段（１２）と、該放熱装置（１２）上に設けられるファン（１１）を開示する。該ファン（１１）は、固定孔（１１２ａ）を穿設してなるファンフレーム（１１２）と、該ファンフレーム（１１２）に回動自在に設けられる羽根車（１１３）とによって構成し、該ファンフレーム（１１２）は駆動部（１１２ｂ）と、該ファンフレーム（１１２）との間に輻射状に配設され、両者を連結する支持部（１１２ｃ）とによってなる。また、羽根車（１１３）は、ハブ（１１３ａ）と、該ハブ（１１３ａ）の外周面に円周に沿って設けられる複数の羽根（１１３ｂ）とによって構成する。   1, 2, 3, and 4 disclose a heat dissipating means (12) having a plurality of fins (121) arranged in parallel and a fan (11) provided on the heat dissipating device (12). . The fan (11) is constituted by a fan frame (112) formed with a fixing hole (112a) and an impeller (113) rotatably provided on the fan frame (112). The frame (112) includes a drive unit (112b) and a support unit (112c) that is radially disposed between the fan frame (112) and connects the two. The impeller (113) includes a hub (113a) and a plurality of blades (113b) provided on the outer peripheral surface of the hub (113a) along the circumference.

上述の放熱手段（１２）とファン（１１）とを組み立てる場合は、固定部材（１１１）を固定孔（１１２ａ）
に挿通させ、ファン（１１）を放熱装置（１２）のフィン（１２１）上に螺着する。さらに、放熱手段（１２）を回路ボード（１３）のチップ（１３１）上に緊密に貼着して回路ボード（１３）に取付ける。 When assembling the heat dissipation means (12) and the fan (11), the fixing member (111) is fixed to the fixing hole (112a).
The fan (11) is screwed onto the fin (121) of the heat dissipation device (12). Further, the heat dissipating means (12) is closely attached on the chip (131) of the circuit board (13) and attached to the circuit board (13).

以上の構造によれば、羽根車（１１３）が駆動部（１１２ｂ）の作用によって回転すると、ファン（１１）上方の周囲の空気が流動してファンフレーム（１１２）の吸気口（１１２ｄ）から内部に進入し、ファンフレーム（１１２）の吹き出し口（１１２ｅ）から流出する。但し、この場合、ファンフレーム（１１２）の吹き出し口（１１２ｅ）と駆動部（１１２ｂ）との間に複数の支持部（１１２ｃ）が介在し、かつ該支持部（１１２ｃ）は輻射状に配設され、平行に配設される複数のフィン（１２１）と交錯して気流の妨げとなり、ファンフレーム（１１２）から流出する気流を順調に放熱手段（１２）に送ることができないという欠点がある。これは、ファン（１１）から放熱手段（１２）に流動する気流の量（Air Flow、ＣＦＭを単位とする）を減少させるのみならず、放熱装置（１２）と空気の接触する面積を縮減させることになる。   According to the above structure, when the impeller (113) is rotated by the action of the drive unit (112b), the ambient air above the fan (11) flows to the inside from the air inlet (112d) of the fan frame (112). And flows out from the outlet (112e) of the fan frame (112). However, in this case, a plurality of support portions (112c) are interposed between the blowout opening (112e) of the fan frame (112) and the drive portion (112b), and the support portions (112c) are arranged in a radial pattern. However, there is a drawback in that the airflow is hindered by crossing with the plurality of fins (121) arranged in parallel, and the airflow flowing out from the fan frame (112) cannot be smoothly sent to the heat dissipation means (12). This not only reduces the amount of airflow flowing from the fan (11) to the heat dissipation means (12) (in units of Air Flow and CFM), but also reduces the area where the heat dissipation device (12) contacts the air. It will be.

チップ（１３１）から発生する熱は、空気によって放出される。よって、ファン（１１）によって発生する気流の量が少なくなるにつれて、放熱手段（１２）と空気の接触する面積が縮減し、放熱効果も低減する。したがって、譬え大パワーか、もしくは高速続回転のファンを使用したとしても、空気と接触する面積を増加しなければ、回路ボード（１３）に設けたチップ（１３１）から発生する熱を放出するという要求を満たすことができず、却って騒音の増大、製造コストの増加などの問題が発生する。   The heat generated from the chip (131) is released by air. Therefore, as the amount of airflow generated by the fan (11) decreases, the area where the heat dissipating means (12) contacts the air is reduced, and the heat dissipation effect is also reduced. Therefore, even if a fan with high power or high-speed continuous rotation is used, heat generated from the chip (131) provided on the circuit board (13) is released unless the area in contact with air is increased. The demand cannot be satisfied, and problems such as an increase in noise and an increase in manufacturing cost occur.

この発明は、放熱装置と気流の接触面積を増大させて、好ましい放熱効果が得られる放熱装置をすることを課題とする。   An object of the present invention is to increase the contact area between the heat dissipation device and the airflow, and to provide a heat dissipation device that can obtain a preferable heat dissipation effect.

また、この発明は、騒音を効率よく抑制できる放熱装置を提供することを課題とする。   Moreover, this invention makes it a subject to provide the thermal radiation apparatus which can suppress a noise efficiently.

そこで、本発明者は従来の技術に見られる欠点に鑑み鋭意研究を重ねた結果、ファンフレームと該ファンフレームに回動自在に設けられる羽根車とによって構成するファンを、平行に配設した複数のフィンを具える放熱手段に設けてなる放熱装置において、該ファンフレームの羽根車の駆動部とファンフレームとを連結する支持部が該放熱手段のフィンに対して同一方向に平行するように形成してなる放熱装置の構造によって本発明の課題を解決できる点に着眼し、かかる知見に基づいて本発明を完成させた。   Therefore, as a result of intensive studies in view of the drawbacks found in the prior art, the present inventor has found that a plurality of fans, each of which is configured by a fan frame and an impeller provided rotatably on the fan frame, are arranged in parallel. In the heat dissipating device provided in the heat dissipating means having the fins, the support part for connecting the drive unit of the fan wheel of the fan frame and the fan frame is formed to be parallel to the fin of the heat dissipating means in the same direction. The present invention was completed based on such knowledge, focusing on the point that the problems of the present invention can be solved by the structure of the heat dissipation device.

以下、この発明について具体的に説明する。   The present invention will be specifically described below.

請求項１に記載する放熱装置は、ファンフレームと該ファンフレームに回動自在に設けられる羽根車とによって構成するファンを、平行に配設した複数のフィンを具える放熱手段に設けてなる放熱装置であって、
該羽根車は、ハブと、該ハブの外周面に円周に沿って設けられる複数の羽根とによってなり、
該ファンフレームは、該羽根車を回動自在に設ける駆動部と、該ファンフレームと該駆動部との間に介在して両者を連結する支持部を含んでなり、かつ該支持部が該放熱手段のフィンに対して同一方向に平行して設けられる。 The heat dissipating device according to claim 1 is a heat dissipating method in which a fan constituted by a fan frame and an impeller rotatably provided on the fan frame is provided in a heat dissipating means having a plurality of fins arranged in parallel. A device,
The impeller includes a hub and a plurality of blades provided along the circumference on the outer peripheral surface of the hub,
The fan frame includes a drive unit that rotatably installs the impeller, and a support unit that is interposed between the fan frame and the drive unit and connects the two, and the support unit is configured to dissipate the heat. It is provided parallel to the same direction with respect to the fins of the means.

請求項２に記載する放熱装置は、請求項１におけるファンフレームには固定孔を穿設し、固定部材を該固定孔に挿通させて該ファンを該放熱手段のフィン上に固定する。   According to a second aspect of the present invention, a fixing hole is formed in the fan frame of the first aspect, and a fixing member is inserted into the fixing hole to fix the fan on the fin of the heat radiating means.

請求項３に記載する放熱装置は、駆動部と、該駆動部に回動自在に設けられる羽根車とによって構成するファンを、平行に配設した複数のフィンを具える放熱手段に設けてなる放熱装置であって、
該羽根車は、ハブと、該ハブの外周面に円周に沿って設けられる複数の羽根とによってなり、
該ファンは、該放熱手段のフィンと同一方向に平行させて設け、且つ一端が該駆動部に連結する支持部を具える。 According to a third aspect of the present invention, there is provided a heat dissipating device including a driving unit and a fan constituted by an impeller rotatably provided on the driving unit, provided on a heat dissipating means having a plurality of fins arranged in parallel. A heat dissipation device,
The impeller includes a hub and a plurality of blades provided along the circumference on the outer peripheral surface of the hub,
The fan includes a support portion provided in parallel with the fin of the heat radiating means and having one end connected to the drive portion.

請求項４に記載する放熱装置は、請求項３における支持部の他端には、固定部材を挿通させるための固定部を形成し、該固定部材を該固定孔に挿通させて該ファンを放熱手段のフィン上に固定する。   According to a fourth aspect of the present invention, a fixing portion for inserting a fixing member is formed at the other end of the support portion according to the third aspect, and the fixing member is inserted into the fixing hole to dissipate the fan. Secure on the fin of the means.

本発明の放熱装置は、大パワー、もしくは高速回転のファンを使用することなく最大限の風量が得られ、好ましい放熱効果を高めるとともに、騒音を抑制できるという利点がある。   The heat dissipating device of the present invention is advantageous in that the maximum air volume can be obtained without using a high-power or high-speed rotating fan, and a preferable heat dissipating effect can be enhanced and noise can be suppressed.

この発明は、電子素子の放熱を行う放熱装置を提供するものであって、ファンフレームと該ファンフレームに回動自在に設けられる羽根車とによって構成するファンを、平行に配設した複数のフィンを具える放熱手段に設けてなる放熱装置において、該ファンフレームの羽根車の駆動部とファンフレームとを連結する支持部が該放熱手段のフィンに対して同一方向に平行するように形成して構成する。   The present invention provides a heat radiating device that radiates heat from an electronic element, and includes a plurality of fins in which a fan constituted by a fan frame and an impeller rotatably provided on the fan frame is arranged in parallel. In the heat dissipating device provided in the heat dissipating means, the support part for connecting the drive unit of the impeller of the fan frame and the fan frame is formed to be parallel to the fin of the heat dissipating means in the same direction. Constitute.

かかる放熱装置の構造と特徴を詳述するために、具体的な実施例を挙げ、図面を参照にして以下に説明する。   In order to describe in detail the structure and features of such a heat dissipation device, a specific example will be given and described below with reference to the drawings.

図５、６、７、８に、この発明の好ましい実施例を開示する。図面によれば、ファン（２１）は、固定孔（２１２ａ）を穿設してなるファンフレーム（２１２）と、該ファンフレーム（２１２）に回動自在に設けられる羽根車（２１３）とを含んでなり、ファンフレーム（２１２）は、駆動部（２１２ｂ）と、支持部（２１２ｃ）とによってなる。該支持部（２１２ｃ）は、放熱手段（２２）のフィン（２２１）と平行して設けられ、該ファンフレーム（２１２）と、駆動部（２１２ｂ）との間に介在して両者を連結する。また、羽根車（２１３）は、ハブ（２１３ａ）と、該ハブ（２１３ａ）の外周面に円周に沿って設けられる複数の羽根（２１３ｂ）とによってなる。さらに、羽根車（２１３）のハブ（２１３ａ）は、ファンフレーム（２１２）の駆動部（２１２ｂ）に回動自在に設けられる。   A preferred embodiment of the present invention is disclosed in FIGS. According to the drawing, the fan (21) includes a fan frame (212) formed with a fixing hole (212a), and an impeller (213) rotatably provided on the fan frame (212). The fan frame (212) includes a drive unit (212b) and a support unit (212c). The support portion (212c) is provided in parallel with the fin (221) of the heat dissipating means (22), and is interposed between the fan frame (212) and the drive portion (212b) to connect the two. The impeller (213) includes a hub (213a) and a plurality of blades (213b) provided on the outer peripheral surface of the hub (213a) along the circumference. Further, the hub (213a) of the impeller (213) is rotatably provided on the drive unit (212b) of the fan frame (212).

上述の放熱装置を組み立てる場合は、固定部材（２１１）をファンフレーム（２１２）の固定孔（２１２ａ）に挿通させ、ファン（２１）を放熱手段（２２）のフィン（２２１）上に螺着させる。さらに、放熱手段（２２）を回路ボード（２３）のチップ（２３１）上に緊密に貼着して回路ボード（２３）に取り付ける。   When assembling the above heat dissipation device, the fixing member (211) is inserted into the fixing hole (212a) of the fan frame (212), and the fan (21) is screwed onto the fin (221) of the heat dissipation means (22). . Further, the heat radiating means (22) is closely attached on the chip (231) of the circuit board (23) and attached to the circuit board (23).

上述の構造によれば、羽根車（２１３）が駆動部（２１２ｂ）の作用によって回転すると、ファン（２１）の上方において周囲の空気が流動し、ファンフレーム（２１２）の吸気口（２１２ｄ）から内部に進入し、ファンフレーム（２１２）の吹き出し口（２１２ｅ）から流出する。この場合、支持部（２１２ｃ）とフィン（２２１）が同一方向に平行して設けられるため、空気が流動してファンフレーム（２１２）の吹き出し口（２１２ｅ）から流出すると、支持部（２１２ｃ）を順調に通過して複数のフィン（２２１）に至り、最大の風量を提供するとともに、騒音を最低限に抑制することができ、放熱手段（２２）下方の回路ボード（２３）に設けたチップ（２３１）に対して、迅速な放熱効果を提供することができる。   According to the above-described structure, when the impeller (213) is rotated by the action of the drive unit (212b), ambient air flows above the fan (21), and the air flows from the intake port (212d) of the fan frame (212). It enters the inside and flows out from the outlet (212e) of the fan frame (212). In this case, since the support part (212c) and the fin (221) are provided in parallel in the same direction, when the air flows and flows out from the outlet (212e) of the fan frame (212), the support part (212c) is moved. It passes smoothly and reaches a plurality of fins (221), providing the maximum air volume and minimizing noise, and is provided on a chip (23) on the circuit board (23) below the heat dissipating means (22). 231), a quick heat dissipation effect can be provided.

図９、１０、１１、１２に、この発明の第２の実施例を開示する。第２の実施例は、図面に開示するように全体的な構造は上述の実施例と略同様であるので、ここでは詳述しない。但し、ファン（３１）を駆動部（３１２ｂ）と、該駆動部（３１２ｂ）に回動自在に設ける羽根車（３１３）と、放熱手段（３２）のフィン（３２１）と同一方向に平行させて設け、且つ一端が該駆動部（３１２ｂ）に連結する支持部（３１２ｃ）とによって構成する点が異なる。該支持部（３１２ｃ）の他端には、固定部材（３１１）を挿通させるための固定部（３１２ｄ）を形成する。また、羽根車（３１３）はハブ（３１３ａ）と、該ハブ（３１３ａ）の外周面に円周に沿って設ける複数の羽根（３１３ｂ）とによってなる。   A second embodiment of the present invention is disclosed in FIGS. As the second embodiment is disclosed in the drawings, the overall structure is substantially the same as that of the above-described embodiment, and therefore will not be described in detail here. However, the fan (31) is parallel to the drive unit (312b), the impeller (313) rotatably provided on the drive unit (312b), and the fin (321) of the heat radiating means (32) in the same direction. It differs in that it is provided and configured by a support portion (312c) having one end connected to the drive portion (312b). A fixing portion (312d) for inserting the fixing member (311) is formed at the other end of the support portion (312c). The impeller (313) includes a hub (313a) and a plurality of blades (313b) provided on the outer peripheral surface of the hub (313a) along the circumference.

以上の放熱装置を取り付ける場合は、固定部材（３１１）を支持部（３１２ｃ）の固定部（３１２ｄ）に挿通させてファン（３１）を放熱手段（３２）のフィン（３２１）に固定し、該放熱手段（３２）を回路ボード（３３）のチップ（３３１）上に緊密に貼着して回路ボード（３３）に取り付ける。   When attaching the above heat dissipation device, the fixing member (311) is inserted into the fixing portion (312d) of the support portion (312c) to fix the fan (31) to the fin (321) of the heat dissipation means (32), The heat dissipating means (32) is attached tightly on the chip (331) of the circuit board (33) and attached to the circuit board (33).

上述の構造によれば、羽根車（３１３）が駆動部（３１２ｂ）の作用によって回転すると、ファン（３１）の上方において周囲の空気が流動する。この場合、支持部（３１２ｃ）とフィン（３２１）が同一方向に平行して設けられるため、気流が支持部（３１２ｃ）を順調に通過して複数のフィン（３２１）に至り、最大の風量を提供するとともに、騒音を最低限に抑制することができ、放熱手段（３２）下方の回路ボード（３３）に設けたチップ（３３１）に対して、迅速な放熱効果を提供することができる。
以上はこの発明の好ましい実施例であって、この発明の実施の範囲を限定するものではない。よって、当業者のなし得る修正、もしくは変更であって、この発明の精神の下においてなされ、この発明に対して均等の効果を有するものは、いずれもこの発明の特許請求の範囲に含まれるものとする。 According to the above-described structure, when the impeller (313) is rotated by the action of the driving unit (312b), ambient air flows above the fan (31). In this case, since the support portion (312c) and the fin (321) are provided in parallel in the same direction, the airflow smoothly passes through the support portion (312c) to reach the plurality of fins (321), and the maximum airflow is obtained. In addition, noise can be suppressed to a minimum, and a quick heat dissipation effect can be provided to the chip (331) provided on the circuit board (33) below the heat dissipation means (32).
The above are preferred embodiments of the present invention, and do not limit the scope of the present invention. Therefore, any modifications or changes that can be made by those skilled in the art, which are made within the spirit of the present invention and have an equivalent effect on the present invention, are included in the scope of the claims of the present invention. And

従来の放熱装置の構造と、取り付け方法を示した説明図である。It is explanatory drawing which showed the structure of the conventional heat radiator, and the attachment method. 図１に開示する放熱装置を取り付けた状態を示した斜視図である。It is the perspective view which showed the state which attached the heat radiator disclosed in FIG. 図１に開示する放熱装置のファンを示した斜視図である。It is the perspective view which showed the fan of the thermal radiation apparatus disclosed in FIG. 図２におけるＡ−Ａ線に沿った断面図である。It is sectional drawing along the AA line in FIG. この発明の第１の実施例による放熱装置の構造と、取り付け方法を示した説明図である。It is explanatory drawing which showed the structure of the thermal radiation apparatus by 1st Example of this invention, and the attachment method. 図５に開示する放熱装置を取り付けた状態を示した斜視図である。It is the perspective view which showed the state which attached the heat radiator disclosed in FIG. 図５に開示する放熱装置のファンを示した斜視図である。It is the perspective view which showed the fan of the thermal radiation apparatus disclosed in FIG. 図６におけるＢ−Ｂ線に沿った断面図である。It is sectional drawing along the BB line in FIG. この発明の第２の実施例による放熱装置の構造と、取り付け方法を示した説明図である。It is explanatory drawing which showed the structure and attachment method of the thermal radiation apparatus by 2nd Example of this invention. 図９に開示する放熱装置を取り付けた状態を示した斜視図である。It is the perspective view which showed the state which attached the heat radiator disclosed in FIG. 図１０に開示する放熱装置のファンを示した斜視図である。It is the perspective view which showed the fan of the thermal radiation apparatus disclosed in FIG. 図１０におけるＣ−Ｃ線に沿った断面図である。It is sectional drawing along the CC line in FIG.

符号の説明Explanation of symbols

１１ ファン
１１１ 固定部材
１１２ ファンフレーム
１１２ａ 固定孔
１１２ｂ 駆動部
１１２ｃ 支持部
１１２ｄ 吸気口
１１２ｅ 吹き出し口
１１３ 羽根車
１１３ａ ハブ
１１３ｂ 羽根
１２ 放熱手段
１２１ フィン
１３ 回路ボード
１３１ チップ
２１ ファン
２１１ 固定部材
２１２ ファンフレーム
２１２ａ 固定孔
２１２ｂ 駆動部
２１２ｃ 支持部
２１２ｄ 吸気口
２１２ｅ 吹き出し口
２１３ 羽根車
２１３ａ ハブ
２２ 放熱手段
２２１ フィン
２３ 回路ボード
２３１ チップ
３１ ファン
３１１ 固定部材
３１２ａ ハブ
３１２ｂ 駆動部
３１２ｃ 支持部
３１２ｄ 固定部
３１３ 羽根車
３１３ａ ハブ
３１３ｂ 羽根
３２ 放熱手段
３２１ フィン
３３ 回路ボード
３３１ チップ 11 Fan 111 Fixing member 112 Fan frame 112a Fixing hole 112b Driving part 112c Supporting part 112d Air inlet 112e Air outlet 113 Impeller 113a Hub 113b Blade 12 Heat radiation means 121 Fin 13 Circuit board 131 Chip 21 Fan 211 Fixing member 212 Fan frame 212a Fixing Hole 212b Drive portion 212c Support portion 212d Inlet port 212e Outlet port 213 Impeller 213a Hub 22 Heat radiation means 221 Fin 23 Circuit board 231 Chip 31 Fan 311 Fixing member 312a Hub 312b Drive portion 312c Support portion 312d Fixing portion 313 Impeller 313a Hub 313b Blade 32 Heat radiation means 321 Fin 33 Circuit board 331 Chip

Claims (4)

ファンフレームと該ファンフレームに回動自在に設けられる羽根車とによって構成するファンを、平行に配設した複数のフィンを具える放熱手段に設けてなる放熱装置であって、
該羽根車は、ハブと、該ハブの外周面に円周に沿って設けられる複数の羽根とによってなり、
該ファンフレームは、該羽根車を回動自在に設ける駆動部と、該ファンフレームと該駆動部との間に介在して両者を連結する支持部を含んでなり、かつ該支持部が該放熱手段のフィンに対して同一方向に平行して設けられることを特徴とする放熱装置。 A heat dissipating device comprising a fan frame and a fan constituted by an impeller rotatably provided on the fan frame provided in a heat dissipating means having a plurality of fins arranged in parallel,
The impeller includes a hub and a plurality of blades provided along the circumference on the outer peripheral surface of the hub,
The fan frame includes a drive unit that rotatably installs the impeller, and a support unit that is interposed between the fan frame and the drive unit and connects the two, and the support unit is configured to dissipate the heat. It is provided in parallel with the same direction with respect to the fin of a means, The heat radiating device characterized by the above-mentioned. 前記ファンフレームには固定孔を穿設し、固定部材を該固定孔に挿通させて該ファンを該放熱手段のフィン上に固定することを特徴とする請求項１に記載の放熱装置。   The heat dissipating apparatus according to claim 1, wherein a fixing hole is formed in the fan frame, and a fixing member is inserted into the fixing hole to fix the fan on the fin of the heat dissipating means. 駆動部と、該駆動部に回動自在に設けられる羽根車とによって構成するファンを、平行に配設した複数のフィンを具える放熱手段に設けてなる放熱装置であって、
該羽根車は、ハブと、該ハブの外周面に円周に沿って設けられる複数の羽根とによってなり、
該ファンは、該放熱手段のフィンと同一方向に平行させて設け、且つ一端が該駆動部に連結する支持部を具えることを特徴とする放熱装置。 A heat dissipating device in which a fan constituted by a drive unit and an impeller provided rotatably on the drive unit is provided in a heat dissipating means having a plurality of fins arranged in parallel,
The impeller includes a hub and a plurality of blades provided along the circumference on the outer peripheral surface of the hub,
The heat dissipating device, wherein the fan is provided in parallel with the fin of the heat dissipating means, and has a support portion having one end connected to the driving portion. 前記支持部の他端には、固定部材を挿通させるための固定部を形成し、該固定部材を該固定孔に挿通させて該ファンを放熱手段のフィン上に固定することを特徴とする請求項３に記載の放熱装置。   A fixing portion for inserting a fixing member is formed at the other end of the support portion, and the fixing member is inserted into the fixing hole to fix the fan on the fin of the heat radiating means. Item 4. The heat dissipation device according to Item 3.
JP2003291283A 2003-08-11 2003-08-11 Heat dissipation device Expired - Fee Related JP3854255B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003291283A JP3854255B2 (en) 2003-08-11 2003-08-11 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003291283A JP3854255B2 (en) 2003-08-11 2003-08-11 Heat dissipation device

Publications (2)

Publication Number Publication Date
JP2005064179A true JP2005064179A (en) 2005-03-10
JP3854255B2 JP3854255B2 (en) 2006-12-06

Family

ID=34369010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003291283A Expired - Fee Related JP3854255B2 (en) 2003-08-11 2003-08-11 Heat dissipation device

Country Status (1)

Country Link
JP (1) JP3854255B2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01167094U (en) * 1988-05-13 1989-11-22
JPH09116061A (en) * 1995-10-13 1997-05-02 Mitsubishi Materials Corp Electronic component cooling device
JPH10209658A (en) * 1997-01-20 1998-08-07 Sanyo Denki Co Ltd Electronic part-cooling device
JP2003060144A (en) * 2001-08-14 2003-02-28 Fujikura Ltd Heat sink with fan

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01167094U (en) * 1988-05-13 1989-11-22
JPH09116061A (en) * 1995-10-13 1997-05-02 Mitsubishi Materials Corp Electronic component cooling device
JPH10209658A (en) * 1997-01-20 1998-08-07 Sanyo Denki Co Ltd Electronic part-cooling device
JP2003060144A (en) * 2001-08-14 2003-02-28 Fujikura Ltd Heat sink with fan

Also Published As

Publication number Publication date
JP3854255B2 (en) 2006-12-06

Similar Documents

Publication Publication Date Title
US7391611B2 (en) Heat-dissipating device and a housing thereof
US7120019B2 (en) Coaxial air ducts and fans for cooling and electronic component
TWI463939B (en) Electronic device
JP5078872B2 (en) Heat sink with centrifugal fan
TWI573519B (en) Portable electronic apparatus and thermal module tehreof
US6552902B2 (en) Turbinate heat sink
US20100059210A1 (en) Fan impeller and heat dissipating device having the same
US20060045774A1 (en) Fans and fan frames
US8403651B2 (en) Fan and airflow guiding structure thereof
US20090135562A1 (en) Heat dissipation device
US20070242428A1 (en) Structure for fixing fan with computer casing
US6899521B2 (en) Airflow guiding structure for a heat-dissipating fan
US7864525B2 (en) Portable electronic device incorporating centrifugal blower
US20090139691A1 (en) Heat dissipation apparatus
US7778032B2 (en) Fan impeller and heat dissipating device incorporating the same
US7101149B2 (en) Axial fan for computer
US7160080B2 (en) Fan assembly
JP3854255B2 (en) Heat dissipation device
JP2004171501A (en) Miniaturized computer and heat-dissipating method
JP2006237290A (en) Radiation module mechanism
US20080055853A1 (en) Heat dissipating module and assembly of the heat dissipating module and a computer housing
US7106587B2 (en) Fluid moving device with a radiation module
JP4560399B2 (en) Mechanism of heat dissipation module for electronic devices
US7094028B2 (en) Outlet airflow direction control device
US6865079B2 (en) Cooling fan

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060815

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060907

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090915

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120915

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150915

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees