JP2005063914A - Method for accurately insert-molding fine pitch terminal - Google Patents

Method for accurately insert-molding fine pitch terminal Download PDF

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JP2005063914A
JP2005063914A JP2003296078A JP2003296078A JP2005063914A JP 2005063914 A JP2005063914 A JP 2005063914A JP 2003296078 A JP2003296078 A JP 2003296078A JP 2003296078 A JP2003296078 A JP 2003296078A JP 2005063914 A JP2005063914 A JP 2005063914A
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terminal
molding
fine pitch
insert
free end
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Keisuke Sakai
啓介 坂井
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MEIO KASEI KK
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MEIO KASEI KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for accurately insert-molding fine pitch terminals. <P>SOLUTION: A terminal line 10 on one side of a high conductive metal strip of 0.1 mm in thickness as a carrier substrate 18, is composed of the predetermined number of terminal strips 28 to be subject to an insert molding, which are arranged so as to alternate with and to be in parallel with open grooves 26 at a fine pitch of 0.3 mm and are formed by punching with the width of 0.2 mm; and comprises an intermediate part 32 and a free end 30. Before a bending process by a progressive press of the intermediate part 32, a dummy terminal board 22 is connected to the free end 30, to the tip of the free end 30 without being subject to the bending process, and thus free deformation of each terminal strip 28 by an unexpected external force is prevented to ensure reliable alignment with the die. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、微細ピッチで配列された端子で構成するコネクタ端子台の連続成型に係わり、より具体的には、厚さ0.1mm以下の高導電性薄板に0.3mm以下のピッチで配列した幅0.2mm以下の端子片に屈曲部分を形成して構成するコネクタ端子台のインサート成型に関する。   The present invention relates to continuous molding of connector terminal blocks composed of terminals arranged at a fine pitch, and more specifically, arranged at a pitch of 0.3 mm or less on a highly conductive thin plate having a thickness of 0.1 mm or less. The present invention relates to insert molding of a connector terminal block formed by forming a bent portion in a terminal piece having a width of 0.2 mm or less.

図3に示されるように、厚みt0の高導電性薄板100に、幅w0の端子を所要のピッチp0で打抜き成形した端子列102を、インサート成型で合成樹脂と合体させてコネクタ端子台104を成形する場合、キャリア基板106の片側から平行に配列されて延在する複数本の端子103からなる櫛歯状の端子列102を合成樹脂成形金型に整合させるため、平面に対して垂直方向に屈曲させて(特に断面形状は図示しないが)、例えばL字形、逆L字形、U字形、逆U字形またはそれらの複合形などに屈曲成形される(図1(b)の例では図面の簡略化のために、所定の位置107-1,107-2で折曲げたクランク状を示す)。   As shown in FIG. 3, a terminal row 102 obtained by punching and molding terminals having a width w0 at a required pitch p0 on a highly conductive thin plate 100 having a thickness t0 is combined with a synthetic resin by insert molding to form a connector terminal block 104. When molding, in order to align the comb-like terminal row 102 composed of a plurality of terminals 103 arranged in parallel and extending from one side of the carrier substrate 106 with the synthetic resin molding die, it is perpendicular to the plane. It is bent (particularly the cross-sectional shape is not shown) and bent into, for example, an L shape, an inverted L shape, a U shape, an inverted U shape, or a combination thereof (in the example of FIG. 1B, the drawing is simplified) For the sake of simplicity, a crank shape bent at predetermined positions 107-1 and 107-2 is shown).

屈曲成形した端子列102は、金属帯材108に沿って所定間隔の離間位置に適当な手段で結合され、この金属帯材108をキャリアとして合成樹脂成形金型に順送で間欠移送し、連続的にインサート成型によりコネクタ端子台104を形成する。
特許第3338667号公報
The terminal array 102 formed by bending is coupled to a spaced position at a predetermined interval along the metal strip 108 by an appropriate means, and the metal strip 108 is intermittently transferred to the synthetic resin molding die as a carrier by continuous feeding. Specifically, the connector terminal block 104 is formed by insert molding.
Japanese Patent No. 3338667

解決しようとする問題点は、最近、携帯電話等の電子機器に要求される小型化に伴い、接続端子部分には更なる小形化が要求され、例えば、上記の各端子103は、幅w0=0.2mm以下、端子間ピッチp0=0.3mm以下といったように極端に微細な形状が必要になる。この場合、端子の素材となる高導電性薄板100の厚みt0が、例えば0.1mmだとすると、図3(a)に図示される端子103-1,103-2のように、矢印Aで示す送り方向の移動中に、解放されている自由端が予期しない僅かな外力の作用で変形を生じる可能性を含んでいる。   The problem to be solved is that with the recent miniaturization required for electronic devices such as mobile phones, further miniaturization of the connection terminal portion is required. For example, each terminal 103 has a width w0 = An extremely fine shape such as 0.2 mm or less and a pitch between terminals p 0 = 0.3 mm or less is required. In this case, if the thickness t0 of the highly conductive thin plate 100 used as the terminal material is 0.1 mm, for example, the feed indicated by the arrow A as shown by the terminals 103-1 and 103-2 shown in FIG. During directional movement, the free end that is released contains the possibility of deformation under the action of an unexpected little external force.

このため、キャリア基板106から延在する端子列102が、工程中に隣接端子間が接触し、あるいは図4に示す端子103-1,103-2のように合成樹脂成形金型110の嵌合すべき位置が逸れて嵌入が阻害され、このまま上金型112を閉じると(矢印B)高価な金型を破損するばかりか、端子列102を構成する高価な高導電性材料も製品とはなりえず、製造機械の運転停止期間を含めるとその損失は計り知れない。   Therefore, the terminal row 102 extending from the carrier substrate 106 is brought into contact between adjacent terminals during the process, or the synthetic resin molding die 110 is fitted like the terminals 103-1 and 103-2 shown in FIG. If the upper mold 112 is closed as it is (the arrow B), the expensive highly conductive material composing the terminal row 102 becomes a product. Needless to say, the loss is immeasurable when the outage period of the manufacturing machine is included.

そこで本発明の目的は、各端子の位置を正確に保持して合成樹脂と一体化するまで、変形を阻止する方法を提供することである。   Accordingly, an object of the present invention is to provide a method for preventing deformation until the position of each terminal is accurately maintained and integrated with a synthetic resin.

上記の目的を達成するために、本発明に係わる微細ピッチ端子を精度よくインサート成型する方法は、高導電性金属帯材をキャリア基板として、このキャリア基板の片側に微細ピッチで開放溝と交互に平行配列されてインサート成形に臨む所定本数の端子を打抜きにより成形した端子列の組は、前記キャリア基板に近い中間部分と、前記キャリア基板から遠い自由端とからなる構成であって、前記中間部分の順送プレスによる間欠送りの連続屈曲加工に先立って、前記自由端を前記順送プレスの送りピッチ毎に括る長さのダミー端子板を、前記屈曲加工が及ばない自由端の先端部分に、送り方向に沿って分離可能な結合手段で接合した。   In order to achieve the above-mentioned object, the method of insert-molding a fine pitch terminal according to the present invention with high accuracy uses a highly conductive metal strip material as a carrier substrate, and alternately opens grooves at a fine pitch on one side of the carrier substrate. A set of terminal rows formed by stamping a predetermined number of terminals arranged in parallel and facing insert molding is composed of an intermediate portion close to the carrier substrate and a free end far from the carrier substrate, and the intermediate portion Prior to the continuous bending process of intermittent feed by the progressive press, a dummy terminal plate having a length that ties the free end for each feed pitch of the progressive press, on the tip portion of the free end where the bending process does not reach, It joined by the coupling | bonding means separable along a feed direction.

又、前記分離可能な結合手段は、カシメによる暫定的な結合か、あるいは適当な接着剤を使用してもよい。   Further, the separable coupling means may be a temporary coupling by caulking or an appropriate adhesive.

前記端子列の組を合成樹脂と一体にインサート成形する工程は、前記自由端の先端部分に前記ダミー端子板を接合する工程と、前記中間部分を屈曲成形する工程と、屈曲成形した前記中間部分を前記合成樹脂の成形金型に嵌入する工程と、前記合成樹脂を前記成形金型に注入して前記端子列と一体成形の端子台を形成する工程と、前記ダミー端子を取り除く工程とを含む。   The step of insert-molding the set of terminal rows integrally with synthetic resin includes the step of bonding the dummy terminal plate to the tip portion of the free end, the step of bending the intermediate portion, and the intermediate portion formed by bending Inserting the synthetic resin into the molding die, forming the terminal block integrally with the terminal row by removing the synthetic resin, and removing the dummy terminals. .

本発明に係わる微細ピッチ端子を精度よくインサート成型する方法は、特に板厚0.1mm以下の電導板に幅0.2mm以下の端子を0.3mm以下のピッチで配列するコネクタ端子台の成型に有効である。   The method of insert-molding fine pitch terminals with high accuracy according to the present invention is particularly suitable for molding connector terminal blocks in which terminals having a width of 0.2 mm or less are arranged at a pitch of 0.3 mm or less on a conductive plate having a thickness of 0.1 mm or less. It is valid.

更に本発明に係わる微細ピッチ端子を精度よくインサート成型する方法は、インサートされる各端子にダミー端子を接合して各端子を相互に連結することによって、各端子の強度が補強されるので、屈曲部を有する微細なピッチで設けた端子の変形を防止し、位置精度を維持することができる。   Furthermore, the method of insert-molding fine pitch terminals with high accuracy according to the present invention is because the strength of each terminal is reinforced by joining dummy terminals to each inserted terminal and interconnecting the terminals. It is possible to prevent deformation of the terminals provided at a fine pitch having the portion and maintain the positional accuracy.

このため本発明に係わる微細ピッチ端子を精度よくインサート成型する方法は、端子を合成樹脂成形金型に嵌入する際に、端子の成形金型との整合不良によって生じる「カジリ」や成形金型の破損を防止することができ、安全に量産性を向上することができる。   For this reason, the method of insert-molding the fine pitch terminal with high accuracy according to the present invention is based on the fact that when the terminal is inserted into the synthetic resin molding die, "sagging" caused by poor alignment with the molding die of the terminal or molding die Damage can be prevented and mass productivity can be improved safely.

可能な限り微細な端子構成における屈曲加工およびインサート成形加工を良好な位置精度を損なうことなく実現した。   Bending and insert molding with the smallest possible terminal configuration was realized without sacrificing good positional accuracy.

図1は第一実施例の端子列10を平面図(a)と断面図(b)、(c)で示したもので、平面図(a)の右端に屈曲加工前の端子列12の一部を示し、残りは屈曲加工後で、長手(図中上下)方向の原長N1が屈曲部14を設けたために屈曲後の見掛けの長さN2に縮小している。例えば厚みt1=0.1mmの高導電性金属帯材16の長手方向に沿って一方の側(図中下側)をキャリア基板18とし、反対側の端部20に沿って廉価な素材(例えば黄銅薄板)で適当な幅B1のダミー端子板22を、適当な重ね幅F1で接合し、所定の端子間隔に相当するピッチS1で配分されたカシメ位置24でカシメ接合する。又は、適当な接着剤で接合面全面に亘って接着する。ダミー端子板22の長さD1は、屈曲加工を施すプレス機(図示しない)が屈曲する端子列12(10)の幅D2にほぼ等しく設定される。   FIG. 1 is a plan view (a) and sectional views (b) and (c) of a terminal row 10 of the first embodiment. One terminal row 12 before bending is shown at the right end of the plan view (a). The remaining portion is bent, and the original length N1 in the longitudinal (up and down) direction is reduced to the apparent length N2 after bending because the bent portion 14 is provided. For example, one side (the lower side in the figure) along the longitudinal direction of the highly conductive metal strip 16 having a thickness t1 = 0.1 mm is the carrier substrate 18 and an inexpensive material (for example, along the opposite end 20) (for example, A dummy terminal plate 22 having an appropriate width B1 is bonded with an appropriate overlap width F1 using a brass thin plate), and is crimped at caulking positions 24 distributed at a pitch S1 corresponding to a predetermined terminal interval. Alternatively, the entire bonding surface is bonded with a suitable adhesive. The length D1 of the dummy terminal plate 22 is set substantially equal to the width D2 of the terminal row 12 (10) bent by a press machine (not shown) for bending.

等間隔S2で間隙k1=0.2mmの平行な溝26を打抜いて、幅w1=0.2mmの端子片28が所定ピッチp1(=S1=S2)=0.3mmで平面上に平行に整列する端子列12を形成する。各溝26は金属帯材16の端縁29で開口して各端子片28は独立にキャリア基板18から延在するが、各端子片28の自由端30は、ダミー端子板21,22に拘束されて予期しない不当な外力から保護される。ダミー端子板22との接合部分(重ね幅F1)が共に打ち抜かれて端子列12を形成した高導電性金属帯材16は、キャリア基板18が、プレス機に間欠送りピッチD3で矢印M1方向に給送され、パイロット孔19で正確に位置決めされる。   A parallel groove 26 having a gap k1 = 0.2 mm is punched at an equal interval S2, and terminal pieces 28 having a width w1 = 0.2 mm are parallel to a plane at a predetermined pitch p1 (= S1 = S2) = 0.3 mm. The terminal row 12 to be aligned is formed. Each groove 26 opens at an edge 29 of the metal strip 16 and each terminal piece 28 extends independently from the carrier substrate 18, but the free end 30 of each terminal piece 28 is constrained by the dummy terminal plates 21 and 22. Protected against unexpected and unjustified external forces. The highly conductive metal strip 16 in which the joint portion (overlapping width F1) with the dummy terminal plate 22 is punched together to form the terminal row 12, the carrier substrate 18 is moved to the press machine in the direction of arrow M1 at an intermittent feed pitch D3. Is fed and accurately positioned in the pilot hole 19.

プレス機は、1ストロークで端子列12のキャリア基板18に近い中間部分32が点eを直角に曲げ(矢印E)、点fでキャリア基板18と平行になるように直角に曲げ(矢印F)、端子列12にキャリア基板18側と自由端30側の間に面方向に段差を設ける操作を行う。このため自由端30側の点gはキャリア基板18の方向に移動する(矢印G)。このため先行するダミー端子板21は端子列12の点gに引かれてキャリア基板18の方向に移動するが、後続のダミー端子板22は独立しているので、影響をうけることなく次の屈曲ストロークのために待機する。屈曲加工が施された端子列10は、ダミー端子板22が端子列10の端縁29近くの截断位置34から各端子片28の自由端30の一部と共に切落とされる。   The press machine bends the point e at a right angle (arrow E) at a point near the carrier substrate 18 of the terminal row 12 in one stroke (arrow E) and bends at a right angle so that it is parallel to the carrier substrate 18 at the point f (arrow F). The terminal row 12 is operated to provide a step in the surface direction between the carrier substrate 18 side and the free end 30 side. For this reason, the point g on the free end 30 side moves in the direction of the carrier substrate 18 (arrow G). For this reason, the preceding dummy terminal plate 21 is pulled by the point g of the terminal row 12 and moves in the direction of the carrier substrate 18. However, since the subsequent dummy terminal plate 22 is independent, the next bending is not affected. Wait for a stroke. In the terminal row 10 subjected to the bending process, the dummy terminal plate 22 is cut off together with a part of the free end 30 of each terminal piece 28 from the cutting position 34 near the end edge 29 of the terminal row 10.

図2は、図1に示したのと同様の屈曲加工e,fを施して、四端子ごとにインサート成形で一体成型する製造工程を説明する模式的平面図である。40は端子列の準備素材で、図示はプレス機による屈曲加工ステーション41に位置して、屈曲加工前の状態を示す。すなわち図示は省略するが、あらかじめ高導電性金属帯材42のキャリア44となる側を設定し、反対側の側縁46に沿って一般的に廉価な例えば幅B2で適当な厚みをもつ黄銅帯材48をダミー端子板50として適当な重ね幅F2で接合する。接合は、四端子の組52ごとに対応するカシメ位置54を設けてカシメるか、接着剤で接合面全面に亘って接着する。   FIG. 2 is a schematic plan view for explaining a manufacturing process in which bending processes e and f similar to those shown in FIG. 1 are performed and the four terminals are integrally formed by insert molding. Reference numeral 40 denotes a preparation material for a terminal row, and the drawing shows a state before bending processing, which is located at a bending processing station 41 by a press machine. That is, although not shown in the drawings, the side of the highly conductive metal band 42 to be the carrier 44 is set in advance, and a generally inexpensive brass band having a suitable thickness, for example, width B2, along the side edge 46 on the opposite side. The material 48 is joined as a dummy terminal board 50 with an appropriate overlap width F2. The joining is performed by providing a caulking position 54 corresponding to each of the four terminal sets 52 or by adhering over the entire joining surface with an adhesive.

次いで、間隙k2=0.2mmの平行な溝56を打抜いて、幅w=0.2mmの端子片58が所定ピッチp2=0.3mmで平面上に平行に整列する端子列60を有効長H1で形成する。更に、端子列60は四端子の組52ごとに高導電性金属帯材42の端縁が完全に切離される長さH2までダミー端子板50を切込む。しかもダミー端子50は、四端子の組52を八組まとめた長さD4で截断される。   Next, a parallel groove 56 with a gap k2 = 0.2 mm is punched, and a terminal row 60 in which terminal pieces 58 with a width w = 0.2 mm are aligned in parallel on a plane with a predetermined pitch p2 = 0.3 mm is effective length. Form with H1. Further, the terminal row 60 cuts the dummy terminal plate 50 to a length H2 at which the edge of the highly conductive metal strip 42 is completely cut for each set of four terminals 52. In addition, the dummy terminal 50 is cut by a length D4 in which eight sets of four terminals 52 are combined.

このような、ダミー端子板50を含む端子列60は、連設されている高導電性金属帯材42のキャリア44により四端子の組52ごとの送りピッチD5で間欠的に順送される。一部のみが図示されている屈曲加工が施される前の準備素材40は、プレス機による屈曲加工ステーション41に臨む四端子の組52の八組分のダミー長に等しい長さD4を一挙に加工するので効率および型の耐用寿命が向上する。ダミー端子板50は長さD4ごとに独立しているので、四端子の組52を八組含む先行端子列60の屈曲加工で、後続の隣接する屈曲加工が施されていない準備素材40が影響を受けることはない。   Such a terminal row 60 including the dummy terminal plate 50 is intermittently fed at a feed pitch D5 for each set of four terminals 52 by the carrier 44 of the continuous high conductive metal strip 42. The preparatory material 40, which is only partially shown, is subjected to a length D4, which is equal to the dummy length of eight sets of the four terminal sets 52 facing the bending processing station 41 by a press at a time. Processing improves efficiency and mold life. Since the dummy terminal plate 50 is independent for each length D4, the preparation material 40 which is not subjected to the subsequent adjacent bending process is affected by the bending process of the preceding terminal row 60 including the eight sets of four terminals 52. Not receive.

高導電性金属帯材42のキャリア44に並走する態様で、連続インサート成形用キャリア62が、射出成型機の金型による成形サイクルに同期して間欠的に矢印M2方向に順送している。64は圧着ステーションで、四端子の組52はキャリア44とダミー端子50が截断され、ストッパ66に沿って成形用キャリア62の方向(矢印L方向)に移動し、突当て63に衝接される。事前に設けたキャリア44の位置決め孔68と成形用キャリア62の案内孔70とを整合させて正確に位置決めし、カシメ72により四端子の組52を成形用キャリア62に接合する。   In a mode of running parallel to the carrier 44 of the highly conductive metal strip 42, the continuous insert molding carrier 62 is intermittently fed in the direction of the arrow M2 in synchronization with the molding cycle by the mold of the injection molding machine. . Reference numeral 64 denotes a crimping station. In the four-terminal set 52, the carrier 44 and the dummy terminal 50 are cut off, move along the stopper 66 in the direction of the molding carrier 62 (arrow L direction), and abut against the abutment 63. . The positioning hole 68 of the carrier 44 provided in advance and the guide hole 70 of the molding carrier 62 are aligned and positioned accurately, and the four terminal set 52 is joined to the molding carrier 62 by caulking 72.

成形用キャリア62は四端子の組52を順送して射出成形ステーション73のインサート成形金型内に誘導する。成形用キャリア62のパイロット孔74は、金型(図示省略)の位置決めピン76に係合して、パイロット孔74と正確な位置関係にある案内孔70によって整合された四端子の組52を金型に対して正確に位置付ける。そこで、公知の手段による加圧手段により金型が閉じられ、コネクタ端子台78が射出成形される。   The molding carrier 62 sequentially feeds the four terminal set 52 and guides it into the insert molding die of the injection molding station 73. The pilot hole 74 of the molding carrier 62 engages with a positioning pin 76 of a mold (not shown), and a set of four terminals 52 aligned by the guide hole 70 in an accurate positional relationship with the pilot hole 74 is molded. Position accurately with respect to the mold. Therefore, the mold is closed by a pressurizing means by a known means, and the connector terminal block 78 is injection molded.

上記実施例は、本発明に係わる微細ピッチ端子を精度よくインサート成型する方法を限定するものではなく、本発明の特許請求の範囲内で、例えば、屈曲形状や使用帯材の板厚、材質さらには一体成型端子数、カシメ箇所などに変形、修正を加えることや工程の態様をいろいろ変化させることが可能である。   The above embodiment does not limit the method of accurately insert-molding the fine pitch terminal according to the present invention. For example, within the scope of the claims of the present invention, for example, the bent shape, the thickness of the band material, the material, Can be deformed and modified in the number of integrally molded terminals, caulking locations, etc., and various aspects of the process can be changed.

以上の説明で分かるように、本発明に係わる微細ピッチ端子を精度よくインサート成型する方法は、端子列を一体に連続させた帯状のキャリアで順送間欠送りで自動製造する製品について、端子の自由端をダミー端子で拘束することによって端子を強化でき、精度を要する工程で微細構造の部品を加工してインサート成型するので、基体から櫛状に延在する各細片に対して、自由端の相対位置を正確に保持して中間部に折曲げ加工を施す全ての製品に利用することができる。   As can be seen from the above description, the method for insert molding of the fine pitch terminals according to the present invention with accuracy is the freedom of terminals for products that are automatically manufactured by continuous intermittent feed with a belt-like carrier in which terminal rows are integrated continuously. By constraining the end with a dummy terminal, the terminal can be strengthened, and a fine-structured part is processed and insert-molded in a process that requires accuracy, so that the free end of each strip extending in a comb shape from the base body It can be used for all products in which the relative position is accurately maintained and the intermediate portion is bent.

本発明に係わる微細ピッチ端子を精度よくインサート成型する方法で、インサート成型前の端子列の平面図および側面の断面図で、(a)は屈曲加工された端子の平面図で、右端に屈曲加工前の平面図の部分を示す。(b)は(a)のB−B線に沿った断面図、(c)は(a)のC−C線に沿った断面図である。(実施例1)FIG. 2 is a plan view of a terminal row before insert molding and a cross-sectional side view of a fine pitch terminal according to the present invention with high precision insert molding. FIG. 4A is a plan view of a bent terminal and is bent at the right end. The part of the previous plan view is shown. (B) is sectional drawing along the BB line of (a), (c) is sectional drawing along CC line of (a). (Example 1) 本発明に係わる微細ピッチ端子を精度よくインサート成型する方法で、4端子一体成型コネクタ端子台の製造工程を説明する模式的平面図である(実施例2)。(Example 2) which is a typical top view explaining the manufacturing process of a 4 terminal integral molding connector terminal block by the method of insert-molding the fine pitch terminal concerning this invention accurately. 従来のインサート成型前の端子列に生じる問題点の説明図である。It is explanatory drawing of the problem which arises in the terminal row | line | column before the conventional insert molding. 従来の端子列のインサート成型で生じる問題点の説明図である。It is explanatory drawing of the problem which arises by the insert molding of the conventional terminal row | line | column.

符号の説明Explanation of symbols

10 端子列
14 屈曲部
16 高導電性金属帯材
18 キャリア基板
19 パイロット孔
22 ダミー端子板
28 端子片
29 先端部
30 自由端
32 中間部分
DESCRIPTION OF SYMBOLS 10 Terminal row | line | column 14 Bending part 16 High electroconductive metal strip 18 Carrier board | substrate 19 Pilot hole 22 Dummy terminal board 28 Terminal piece 29 Tip part 30 Free end 32 Middle part

Claims (4)

高導電性金属帯材をキャリア基板として、このキャリア基板の片側に微細ピッチで開放溝と交互に平行配列されてインサート成形に臨む所定本数の端子を打抜きにより成形した端子列の組は、前記キャリア基板に近い中間部分と、前記キャリア基板から遠い自由端とからなる構成であって、前記中間部分の順送プレスによる間欠送りの連続屈曲加工に先立って、前記自由端を前記順送プレスの送りピッチ毎に括る長さのダミー端子板を、前記屈曲加工が及ばない自由端の先端部分に、送り方向に沿って分離可能な結合手段で接合したことを特徴とする微細ピッチ端子を精度よくインサート成型する方法。   A set of terminal rows in which a highly conductive metal strip is used as a carrier substrate, and a predetermined number of terminals arranged in parallel with open grooves at a fine pitch on one side of the carrier substrate to face insert molding are formed by punching. The intermediate portion close to the substrate and a free end far from the carrier substrate, wherein the free end is fed by the progressive press prior to the continuous bending process of intermittent feed by the progressive press of the intermediate portion. Insert a fine pitch terminal with high precision, characterized in that a dummy terminal plate with a length that is bundled for each pitch is joined to the tip of the free end where the bending process does not take place with a coupling means that can be separated along the feed direction. Molding method. 前記分離可能な結合手段はカシメによる暫定的な結合であることを特徴とする請求項1に記載の微細ピッチ端子を精度よくインサート成型する方法。   2. The method of insert molding a fine pitch terminal with high accuracy according to claim 1, wherein the separable coupling means is provisional coupling by caulking. 前記分離可能な結合手段は適当な接着剤によること特徴とする請求項1に記載の微細ピッチ端子を精度よくインサート成型する方法。   2. The method of insert molding a fine pitch terminal with high accuracy according to claim 1, wherein the separable coupling means is made of a suitable adhesive. 前記端子列の組を合成樹脂と一体にインサート成形する工程は、前記自由端の先端部分に前記ダミー端子板を接合する工程と、前記中間部分を屈曲成形する工程と、屈曲成形した前記中間部分を前記合成樹脂の成形金型に嵌入する工程と、前記合成樹脂を前記成形金型に注入して前記端子列と一体成形の端子台を形成する工程と、前記ダミー端子を取り除く工程とを含むことを特徴とする請求項1に記載の微細ピッチ端子を精度よくインサート成型する方法。   The step of insert-molding the set of terminal rows integrally with synthetic resin includes the step of bonding the dummy terminal plate to the tip portion of the free end, the step of bending the intermediate portion, and the intermediate portion formed by bending Inserting the synthetic resin into the molding die, forming the terminal block integrally with the terminal row by removing the synthetic resin, and removing the dummy terminals. The method of insert-molding the fine pitch terminal according to claim 1 with high accuracy.
JP2003296078A 2003-08-20 2003-08-20 Method for accurately insert-molding fine pitch terminal Pending JP2005063914A (en)

Priority Applications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101187411B1 (en) 2011-06-15 2012-10-02 주식회사 씨티씨 Terminal strip, process for making the strip and connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101187411B1 (en) 2011-06-15 2012-10-02 주식회사 씨티씨 Terminal strip, process for making the strip and connector

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