JP2005063578A - Master carrier for magnetic transfer and manufacturing method for master carrier for magnetic transfer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a master carrier for magnetic transfer in which such a problem can be solved that burrs are caused by blanking a master substrate and adhesive strength for a magnetic recording medium is reduced and a manufacturing method of the master carrier for magnetic transfer. <P>SOLUTION: A metal substrate in which ruggedness in accordance with a transfer pattern in accordance with information to be transferred to the magnetic recording medium is formed on a surface is formed, a master substrate having the prescribed shape is formed by separating from the metal substrate by etching, and a magnetic layer is formed so that at least ruggedness out of the surface of the master substrate is covered with the magnetic layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a magnetic transfer master carrier provided with a magnetic layer having a transfer pattern for transferring information to a magnetic recording medium, and a method for manufacturing the magnetic transfer master carrier.

  At present, with the increase in recording density of magnetic recording media such as hard disk drives (HDD) and flexible disks (FD), information such as address signals and servo signals (hereinafter referred to as transfer information) is produced at the time of production of these magnetic recording media. Research is underway on magnetic transfer technology that can write the image in a short time.

  The magnetic transfer is a magnetic recording medium (slave medium) having a surface of a magnetic transfer master carrier (hereinafter also referred to as a master carrier) carrying transfer information by a fine uneven pattern of a magnetic material and a magnetic recording portion that receives the transfer. The magnetic pattern corresponding to the transfer information on the master carrier is transferred and recorded on the magnetic recording medium by applying a transfer magnetic field in a state where the two are in close contact with each other.

  As an example of the manufacturing procedure of the master carrier, first, Ni or the like is laminated to a predetermined thickness by electroforming on a substrate on which a concavo-convex pattern according to transfer information is formed, and then the metal substrate made of Ni is peeled off. Then, the peeled metal substrate is processed into a predetermined shape to obtain a master substrate. And a master support | carrier is obtained by forming a magnetic layer on the uneven | corrugated pattern of this master substrate (for example, patent document 1).

Japanese Patent Laid-Open No. 2002-342921

FIG. 7 is an explanatory diagram for explaining a process of forming a master substrate by processing a conventional metal substrate into a predetermined shape.
As shown in FIG. 7, when the metal substrate 50 is processed to form a master substrate having a predetermined shape, the upper blade 51 and the lower blade 52 are engaged with each other at predetermined positions from both surfaces of the metal substrate 50. Then, the disc is cut and punched along the outer peripheral edge portion 100a and the inner peripheral edge portion 100b of the desired master carrier to obtain a disk-shaped master substrate 100A. Here, the inner peripheral edge portion 100b of the master substrate 100A is a part that functions as alignment when being brought into close contact with the magnetic recording medium.

  Conventionally, when the master substrate 100A is punched, warpage and distortion may occur due to the internal stress applied to the entire master substrate 100A by the shearing force of the upper blade 51 and the lower blade 52. Due to these warpage and distortion, partial adhesion between the obtained master carrier 100 and the magnetic recording medium 101 may be deteriorated, resulting in transfer failure.

  FIG. 8 is a view taken along line AA in FIG. 7 and shows a state of the outer peripheral edge portion of the master substrate after punching. As described above, when the upper blade 51 and the lower blade 52 are mechanically cut, the outer peripheral edge portion 100a has a convex shape that protrudes substantially perpendicularly to the surface of the master substrate 100A due to the shearing force of the blade at the time of punching. It was inevitable that burrs E would be formed. Further, although not shown, it is inevitable that burrs are similarly generated in the inner peripheral edge.

Here, when the burrs are projected onto the magnetic transfer side surface (hereinafter also referred to as the front surface) of the master substrate 100A by punching, the surface opposite to the magnetic transfer side surface (hereinafter also referred to as the back surface) is referred to. In the prior art, generally, the master substrate 100A is punched out so as to protrude toward the back surface side.
As shown in FIG. 9, when the master carrier 100 obtained by protruding the burrs E on the back side of the master substrate 100A is fixed to the holder H and brought into close contact with the magnetic recording medium 101, the master substrate 100A warps during punching. In addition to a decrease in adhesion due to the occurrence of distortion, the interference between the holder H and the burrs causes the master carrier 100 to be in a curved state between the master carrier 100 and the magnetic recording medium 101. Due to the occurrence of spacing S, it was inevitable that the adhesion between the two would be reduced. At this time, even if the protruding size was reduced to about 2 μm or less by polishing the burr, it was not possible to prevent the burr E from interfering with the holder H to reduce the adhesion with the magnetic recording medium 101.
Further, even if an elastic material or a burr relief groove is provided in the holder H in order to reduce the interference between the burr and the holder H, the decrease in the adhesion between the master carrier 100 and the magnetic recording medium 101 cannot be sufficiently prevented. .

  Further, polishing powder is generated during the polishing of the burrs E, and these polishing powders adhere and remain on the surface and end of the master substrate 100A, and the remaining polishing powder lowers the adhesion with the magnetic recording medium 101, resulting in poor transfer. Could cause. Further, these polishing powders may cause the magnetic layer formed on the surface of the master substrate 100A to drop off.

On the other hand, as shown in FIG. 10, when the master carrier 100 obtained by protruding the burrs E on the surface side of the master substrate 100A is brought into close contact with the magnetic recording medium 101, the burrs E at the outer peripheral edge and inner peripheral edge are magnetically recorded. By striking the transfer surface of the medium 101, a spacing S occurs between the master carrier 100 and the magnetic recording medium 101, and a transfer pattern (not shown) formed on the surface of the master carrier 100 is not properly adhered. . As described above, the master carrier 100 obtained by protruding the burrs E on the surface side of the master substrate 100A can similarly transfer the transfer information to the magnetic recording medium 101 at the time of magnetic transfer due to the decrease in adhesion. There was concern about disappearing.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a magnetic transfer master carrier and a magnetic material capable of solving the problem that burrs are generated by punching of a master substrate and adhesion with a magnetic recording medium is reduced. It is to provide a method for producing a transfer master carrier.

  The above-mentioned object of the present invention is a method for manufacturing a magnetic transfer master carrier for manufacturing a magnetic transfer master carrier having a transfer pattern corresponding to information to be transferred to a magnetic recording medium on the surface. A metal substrate having a corresponding unevenness formed on the surface is molded, and a master substrate having a predetermined shape is formed by separating from the metal substrate by etching, so as to cover at least the unevenness on the surface of the master substrate. This is achieved by a method for manufacturing a magnetic transfer master carrier, which is characterized by forming a magnetic layer.

The manufacturing method of the master carrier for magnetic transfer is to obtain a master substrate having a desired size by etching a metal substrate on which irregularities corresponding to a transfer pattern are formed. Do not perform mechanical punching with the lower blade. Then, it is possible to avoid the occurrence of burrs at the periphery of the master substrate due to the shearing force of the blade, which is seen in the punching process. For this reason, it is possible to avoid a decrease in adhesion due to spacing caused by burrs or distortion between the master carrier and the magnetic recording medium in a state of being in close contact with the magnetic recording medium during magnetic transfer.
Further, since no burrs are generated, not only can the step of polishing the burrs be performed in a later step, but also the generation of polishing powder generated when the burrs are polished can be avoided.
Furthermore, since the master substrate is separated from the metal substrate not by the process of punching out the metal substrate but by etching that is a chemical treatment, internal stress is not applied to the separated master substrate. For this reason, it is possible to avoid the occurrence of warping or distortion due to the shearing force, which is seen when punching the master substrate.

  In the method for manufacturing a magnetic transfer master carrier, the metal substrate is preferably subjected to one-side etching or both-side etching. By using single-sided etching or double-sided etching, polishing powder generated by mechanical processing (for example, polishing with a polishing sheet) to form chamfering is not generated.

  Another object of the present invention is a master carrier for magnetic transfer provided with a transfer pattern corresponding to information to be transferred to a magnetic recording medium on the surface, and irregularities corresponding to the transfer pattern are formed on the surface. A master substrate and a magnetic layer formed so as to cover at least the unevenness of the surface of the master substrate, and a chamfered portion made of side etching generated by etching on the periphery of the master substrate. This is achieved by a master carrier for magnetic transfer characterized in that a chamfer is provided.

  In the above-described magnetic transfer master carrier, it is preferable that the side etch is chamfered from one side or both sides from the peripheral side surface of the master substrate. In this way, it is not necessary to separately perform mechanical processing for forming a chamfer on the master substrate. For this reason, since abrasive powder or the like that easily occurs when forming chamfers by mechanical processing does not occur, such abrasion powder adheres to the magnetic transfer surface or the like of the master carrier, thereby It is possible to avoid causing a decrease in adhesion.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the magnetic transfer master carrier and the magnetic transfer master carrier which can solve the problem that a burr | flash generate | occur | produces by punching of a master substrate and the adhesiveness with a magnetic recording medium falls can be provided.

(First embodiment)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a flowchart illustrating the steps of a method for manufacturing a magnetic transfer master carrier according to the present invention. FIG. 2 is a cross-sectional view illustrating a process until a metal substrate is manufactured in the method for manufacturing a magnetic transfer master carrier. FIG. 3 is a cross-sectional view illustrating a process of obtaining a master substrate from a metal substrate. In the following, all the drawings referred to in the description of the embodiment according to the present invention are schematic diagrams, and the dimensions of each part are shown in proportions different from actual ones.

  First, an adhesion liquid (not shown) is applied to one surface of a flat plate-like Si substrate 1 shown in FIG. 2A (also referred to as an undercoat), and the applied liquid as shown in FIG. 2B. A resist layer 2 is formed by applying a resist solution on the upper surface of the substrate (step S11). Thereafter, exposure and development are performed on the Si substrate 1 on which the resist layer 2 is formed, and as shown in FIG. 2 (c), the patterned resist 2a is formed on the Si substrate by patterning the concavo-convex shape corresponding to the transfer pattern. 1 (step S12). Here, the arrangement and the like of the transfer pattern are appropriately set according to the information to be transferred to the magnetic recording medium. Here, examples of the information signal to be transferred include a tracking servo signal, a clock signal, and an address information signal, but are not limited to these signals.

  On the surface of the Si substrate 1 on which the patterned resist layer 2a is formed, Ni is electroformed as shown in FIG. 2D to form the Ni layer 3 (step S13). Thereafter, the Ni layer 3 is peeled from the Si substrate 1, and the peeled Ni layer 3 is used as a Ni substrate (metal substrate) 10B (step S14). On this Ni substrate 10B, as shown in FIG. 2E, convex portions 10a and concave portions 10b are formed in a pattern corresponding to the patterned resist layer 2a.

  Next, a process for obtaining a master substrate having a desired shape from the Ni substrate by etching will be described with reference to FIGS. FIG. 3 shows a state in which the desired master substrate 10A is separated from the Ni substrate 10B along the outer peripheral edge thereof, and the convex portions constituting the concavo-convex pattern formed on the Ni substrate 10B are not shown. To do. FIG. 4 is a diagram illustrating a state where the master substrate is separated from the Ni substrate. As shown in FIG. 4, by etching, the Ni substrate is removed by corrosion only at the resist removal portion 11b corresponding to the outer peripheral edge of the target master substrate, and a part of the Ni substrate is separated in a predetermined shape. . This separated Ni substrate is used as a master substrate in the following steps.

  As shown in FIG. 3 (a), a protective sheet (not shown) is attached to prevent the etching solution from contacting the surface side of the Ni substrate 10B provided with unevenness corresponding to the transfer pattern. A resist layer 11 is formed on the back side. Then, as shown in FIG. 3B, a mask 13 corresponding to a desired processing shape is arranged at a position facing the Ni substrate 10B on which the resist layer 11 is formed through the resist layer 11, The resist layer 11 is exposed through a mask and developed. Here, the mask 13 is provided with slits S so as to match the shape of the outer peripheral edge of the target master substrate. As shown in FIG. 3C, only light that passes through the slit S at the time of exposure reaches the resist layer 2 of the Ni substrate 10B, so that only the region irradiated with light is developed in the resist layer 2. The resist is removed. Thus, a resist removal portion 11b that exposes the Ni substrate 10B disposed below is formed in the resist layer 11 of the Ni substrate 10B.

  At this time, the slit S of the mask 13 is formed in advance so as to match the shape of the outer peripheral edge of the desired master substrate so that the resist layer 2 is removed along the outer peripheral edge of the desired master substrate.

  After the exposure and development, a process of separating the Ni substrate 10B from the Ni substrate 10B as a master substrate having a predetermined shape by single-side etching is performed. In this embodiment, wet etching is performed as an example of etching. However, the etching is not limited to wet etching, and dry etching such as ion etching may be performed.

  In the case of single-sided etching as described above, a resist layer is usually coated on the entire surface side, and the entire resist layer is left without being exposed, but instead of the resist layer on the surface side, the etching solution does not adhere. You may make it affix a protective sheet. At this time, after the desired etching process is completed, it is possible to complete the processing without chemically changing the surface unevenness pattern or the surface property by peeling off the protective sheet using a peeling device. In the case of double-sided etching, it is necessary to select a resist or stripping solution that does not change the fine unevenness pattern or surface property of the Ni substrate.

  When etching is performed on the Ni substrate 10B on which the resist removing portion 11b has been formed, etching ions act on the exposed surface of the Ni substrate 10B while passing through the resist removing portion 11b, thereby forming the concave surface on the opposite side (FIG. 3C). Corrosion is removed toward the lower middle surface). By performing such etching for a predetermined time, as shown in FIG. 3D, the portion where the resist removal portion 11b is formed in the Ni substrate 10B penetrates in the thickness direction of the Ni substrate 10B by etching. . After the etching, as shown in FIG. 3E, the resist layer 11 remaining on the surface of the master substrate 10A is removed.

  At the time of etching, not only the region exposed from the resist removing portion 11b, which is an etching target, but also the corrosion removal proceeds from the lower side of the resist removing portion 11b to the left and right in the drawing in the Ni substrate 10B, thereby forming the side etch 10e. .

  Here, the case where only the outer peripheral edge is etched has been described, but the etching may be similarly performed on the inner peripheral edge. In other words, another slit corresponding to the inner peripheral edge may be provided in the mask to form a resist removal portion, and the target master substrate may be separated from the Ni substrate also at the inner peripheral edge by etching. By doing so, as shown in FIG. 4, an annular master substrate 10 </ b> A in which the outer peripheral edge and the inner peripheral edge are both etched can be formed.

FIG. 5 is a cross-sectional view showing the master carrier.
As shown in FIG. 5, after the resist layer 11 is removed, the magnetic layer 14 is formed on the surface of the master substrate 10A where the transfer pattern is formed, and the master carrier M is completed. The magnetic layer 14 should just be provided so that the convex part 10a corresponding to a transfer pattern may be covered at least. In the magnetic layer 14, convex portions 14 a forming a transfer pattern that directly contacts the magnetic recording medium are formed according to the convex portions 10 a of the master substrate 10 </ b> A.
The convex portion 14a is preferably formed with a height h of 5 nm to 1 μm from the surface of the magnetic layer 14 at a location where the convex portion 14a is not formed, and is formed with a height h of 50 nm to 300 nm. More preferably.

  The master substrate so that the saturation magnetization Ms of the master substrate 10A and the saturation magnetization Mm of the magnetic layer 14 have a relationship of 1.0 <Mm / Ms <100, preferably 2.0 ≦ Mm / Ms <3.9. The material of 10A and the magnetic layer 14 is selected and configured. The saturation magnetization Ms of the master substrate 10A is 5.65T (4500 Gauss) or more, and specifically, the master substrate 10A may be composed of not only Ni but also a material such as Ni alloy. The magnetic layer 14 can be made of an alloy material such as FeCo, FeCoNi, FeNi having a face-centered cubic structure including at least one element of Fe, Co, Ni, Gd, Dy, Sm, and Nd. Moreover, as long as it exhibits ferromagnetism as a whole, a material containing another magnetic element or nonmagnetic element may be used. The magnetic layer may be any of soft magnetism, semi-hard magnetism, and hard magnetism. However, by using a magnetic layer having a small coercive force such as soft magnetism or semi-hard magnetism, the magnetic transfer can be performed better. It can be carried out.

  The magnetic layer 14 formed on the master substrate 10A preferably has a body-centered cubic structure (bcc), a face-centered cubic structure (fcc), or an amorphous structure. Among these, when having a bcc structure or an fcc structure, the magnetic layer 14 has a particle structure in which a plurality of fine particles are randomly arranged, and the size observed from the film surface of each particle is 100 nm or less. desirable.

  The magnetic layer 14 is formed using a magnetic material by vacuum deposition, sputtering, ion plating, or other vacuum film forming means, plating, or the like. The thickness of the magnetic layer 14 is preferably in the range of 25 nm to 500 nm, more preferably 50 nm to 300 nm.

  A protective film such as diamond-like carbon (DLC) or sputtered carbon having a thickness of 2 nm to 30 nm is preferably provided on the surface of the magnetic layer 14, and a lubricant layer may be further provided. Further, an adhesion reinforcing layer such as Si may be provided between the magnetic layer 14 and the protective film. By providing the lubricant, it is possible to improve the deterioration of durability against the occurrence of scratches due to friction when correcting the deviation caused in the contact process with the magnetic recording medium.

  The manufacturing method of the magnetic transfer master carrier according to the present invention is to obtain a master substrate 10A having a desired size by etching the metal substrate 10 on which the irregularities corresponding to the transfer pattern are formed as described above. The process of mechanically punching the metal substrate 100 with the upper blade and the lower blade as in the conventional manufacturing method as shown in FIGS. Then, it is possible to prevent burrs from being generated on the periphery of the master substrate due to the shearing force of the blade during punching. For this reason, it is possible to avoid the occurrence of spacing caused by burrs between the master carrier and the magnetic recording medium in the state of being in close contact with the magnetic recording medium at the time of magnetic transfer, thereby reducing the adhesion. Therefore, according to the method for manufacturing a magnetic transfer master carrier of the present invention, it is possible to manufacture a magnetic transfer master carrier with high signal quality capable of accurately transferring transfer information.

  Also, in this method of manufacturing the master carrier for magnetic transfer, burrs are not generated, so that not only the step of polishing burrs in the subsequent steps can be omitted, but also polishing powder generated when polishing burrs is generated. Can be avoided.

  Furthermore, in this method of manufacturing a master carrier for magnetic transfer, the master substrate 10A is separated from the metal substrate 10B by etching, which is a chemical treatment, rather than the step of punching out the metal substrate 10B. No internal stress is applied. For this reason, it is possible to avoid the occurrence of warping or distortion due to the shearing force that is seen when the master substrate 10A is punched.

  In the method for manufacturing the magnetic transfer master carrier, side etching is formed on the peripheral edge of the master substrate 10A. This side etch can also function as chamfering.

The master carrier for magnetic transfer according to the present invention has a master substrate 10A having irregularities corresponding to the transfer pattern formed on the surface, and a magnetic layer 14 formed so as to cover at least the irregularities on the surface of the master substrate 10A. And a chamfered portion made of side etch 10e generated by etching is provided on the periphery of the master substrate 10A.
In the master carrier for magnetic transfer, a chamfered portion is provided at the peripheral edge of the master substrate 10A, and no burr is formed. For this reason, it is possible to avoid the occurrence of spacing caused by burrs between the master carrier and the magnetic recording medium in the state of being in close contact with the magnetic recording medium at the time of magnetic transfer. Transfer information can be accurately transferred.

(Second Embodiment)
Next, a second embodiment of the method for producing a magnetic transfer master carrier according to the present invention will be described. The manufacturing method of the magnetic transfer master carrier of this embodiment has the same steps as those of the above embodiment except for the etching step described below, and the same effects as those of the above embodiment can be obtained.
In this embodiment, double-sided etching is performed on the Ni substrate obtained in the same process as in the above embodiment.

  FIG. 6 is a cross-sectional view illustrating the etching process of the present embodiment. As shown in FIG. 6, a resist layer 11 is formed on both surfaces of the Ni substrate 10B, and development and exposure are performed on each surface via a mask (see FIG. 3B) to remove the target master substrate. A resist removal portion 11b is formed so as to correspond to the periphery. Then, etching is performed on both surfaces of the Ni substrate 10B, and the Ni substrates exposed in the resist removing portions 11b are removed by corrosion in the thickness direction to form recesses and communicate with each other.

  In the case of such double-sided etching, the width of the side etch in which the Ni substrate is etched away radially outward at the boundary portion between the resist layer and the Ni substrate is smaller than that of single-sided etching. For this reason, it is possible to provide chamfering at the peripheral portion without reducing the area of the transfer surface on which the transfer pattern of the Ni substrate is provided.

  According to the method for manufacturing a magnetic transfer master carrier of this embodiment, protrusions such as burrs are formed on the peripheral edge of the master carrier as in the above embodiment, resulting in poor contact with the magnetic recording medium during magnetic transfer. Can be prevented.

In addition, this invention is not limited to embodiment mentioned above, A suitable deformation | transformation, improvement, etc. are possible.
For example, ultrasonic cleaning in pure water or the like may be performed as a post-cleaning process.
For example, the metal substrate is not limited to Ni. However, if the metal substrate is made of Ni, the surface of the master carrier is not damaged by a strong alkaline solution used for resist pretreatment or a stripping solution or a strong acidic solution such as an etching solution.

(Example)
Next, in order to confirm the effect of the present invention, a test for evaluating the peripheral shape of the master carrier and a test for measuring the surface shape of the transfer surface side of the master carrier were performed. In the test for evaluating the peripheral shape of the master carrier, an optical microscope was used, and for the three-dimensional shape measurement, image synthesis software Dynamic Eye made by Mitani Corporation and three-dimensional measurement display software 3D Viewer were used. In the test to measure the surface shape of the transfer surface side of the master carrier, the master carrier is brought into vacuum contact with the holder, and the surface shape is measured from the surface side with a laser displacement meter (LC2430 manufactured by Keyence Corporation). The effect of Bali was investigated. Further, as an adhesion evaluation method for confirming the transferability of the master carrier, a glass plate was brought into close contact with the surface of the master carrier fixed to the holder, and interference fringes were observed.
As an example, a master carrier obtained by the method for producing a master carrier described in the above embodiment was prepared. Further, as a comparative example, a master carrier obtained by a conventional master carrier manufacturing method for performing a punching process was prepared.

  In the master carrier of the comparative example, the burrs were 10 μm or more in the thickness direction on the master substrate as punched, and it was confirmed that the peripheral edge on the surface side protrudes in the thickness direction by about 10 μm when the holder is in close contact. In addition, the interference fringes due to the glass plate adhesion were remarkably confirmed at the peripheral portion.

  In the master carrier of the example, no burr is seen on the master carrier, and the peripheral edge does not protrude in the thickness direction when the holder is in close contact. Moreover, when this master support | carrier and the glass plate were closely_contact | adhered, interference fringes could hardly be confirmed but it turned out that transfer appropriateness is favorable.

It is a flowchart explaining the process of the manufacturing method of the master carrier for magnetic transfer concerning this invention. It is sectional drawing explaining the process until manufacturing a metal substrate in the manufacturing method of the master carrier for magnetic transfer concerning this invention. It is sectional drawing explaining the process of obtaining a master substrate from a metal substrate in the manufacturing method of the master carrier for magnetic transfer concerning this invention. It is a figure explaining the state which isolate | separated the master substrate from the metal substrate in the manufacturing method of the master carrier for magnetic transfer concerning this invention. It is sectional drawing which shows the master carrier for magnetic transfer concerning this invention. It is sectional drawing explaining 2nd Embodiment of the manufacturing method of the master carrier for magnetic transfer concerning this invention. It is a figure explaining a part of process of the manufacturing method of the conventional magnetic transfer master carrier. It is an AA arrow directional view of FIG. It is an expanded sectional view showing a state when a conventional magnetic transfer master carrier is brought into close contact with a magnetic recording medium. It is an expanded sectional view which shows the other state when the conventional magnetic transfer master carrier is closely_contact | adhered with a magnetic recording medium.

Explanation of symbols

1 Si substrate 10A Ni substrate (metal substrate)
10B Master substrate 13 Mask M Master carrier for magnetic transfer

Claims (4)

A method of manufacturing a magnetic transfer master carrier for manufacturing a magnetic transfer master carrier provided with a transfer pattern on the surface according to information to be transferred to a magnetic recording medium,
A metal substrate having irregularities corresponding to the transfer pattern is formed on the surface, and a master substrate having a predetermined shape is formed by separating from the metal substrate by etching, and at least the irregularities on the surface of the master substrate A method for producing a master carrier for magnetic transfer, wherein a magnetic layer is formed so as to cover the substrate. 2. The method of manufacturing a magnetic transfer master carrier according to claim 1, wherein the metal substrate is etched on one side or both sides. A magnetic transfer master carrier provided on the surface with a transfer pattern corresponding to information to be transferred to a magnetic recording medium,
A master substrate having irregularities corresponding to the transfer pattern formed on the surface, and a magnetic layer formed so as to cover at least the irregularities on the surface of the master substrate. A magnetic transfer master carrier comprising a chamfered portion made of side etch. 4. The magnetic transfer master carrier according to claim 3, wherein the side etch is provided on a peripheral edge of one side or both sides of the master substrate.

Images