JP2005063081A - Rfid tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the breakage of an IC chip or its circumference circuit, using a simple composition. <P>SOLUTION: A substrate 103 has an antenna coil 12 pattern formed at its upper surface, and has a slit opening 106 which extends in a range extending from the edge to the near position of the antenna coil 12 formed at its one corner part. An IC chip 10, including a memory and a control circuit, is sealed inside a hollow ceramics package 17. This ceramics package 17 is inserted and mounted on the bottom side of the substrate 103, striding across the slit opening 106. After being mounted, the substrate 103 is set to an under dish 102 made of resin, and resin is injected into the space between the ceramics package 17 and the substrate 103 via slit opening 106. After this, the substrate 103 and the under dish 102 are introduced into a metal mold, and the whole substrate 103 is resin-sealed by resin filling of an upper dish 101 and of the inside of the under dish. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an RFID tag that incorporates a semiconductor memory and can read and write information to and from the memory in a contactless manner.

  In recent years, a storage system in which various kinds of information are written is attached to goods to be transported, and a system that reads information in a non-contact manner by wireless communication with the storage medium has been introduced in the baggage management site and factory assembly lines. ing. This system is called an RFID system (Radio Frequency Identification System). A storage medium attached to the article is called an RFID tag or a non-contact IC tag, and includes an IC chip including a memory, an antenna coil for communication, and the like.

FIG. 12 shows a configuration example of a conventional RFID tag.
This RFID tag has a structure in which a substrate 83 on which an IC chip 81 is mounted and an antenna coil 82 are sealed with resin. FIG. 12A shows an arrangement example of the substrate 83 and the antenna coil 82 before sealing, and FIG. 12B shows the internal configuration of the main body 80 after molding.

  In the illustrated RFID tag, a substrate 83 is provided at the center of the upper surface of a resin lower plate 80 a, and an antenna coil 82 is provided so as to surround the substrate 83. In addition to the IC chip 81 described above, an electronic component 84 such as a capacitor is mounted on the substrate 83, and a wiring pattern (not shown) for connecting these components is formed. The antenna coil 82 is connected to an electrode pattern (not shown) on the substrate 83.

  The region 86 including the IC chip 81, the electronic component 84, and the wiring between these components on the substrate 83 is covered with a resin 86 from above. Thereafter, the lower plate 80a is introduced into a mold, and the upper portion and the periphery thereof are molded to complete the main body 80.

  Further, Patent Document 1 below discloses an RFID tag having a configuration in which a heat insulating material is provided around an IC chip (described as “solid identifier” in this document) fixed by a resin.

Japanese Patent No. 2825326 (refer to page 3, right column, Fig. 1)

  In the RFID tag having the configuration shown in FIG. 12, the resin 86 that covers a component such as the IC chip 81 thermally expands or contracts at a degree different from that of the component. For this reason, when the completed RFID tag is used in an environment with a large temperature change, stress based on the difference between the degree of expansion and the degree of contraction between the part and the resin 86 is applied to the part and its joint, and the part is destroyed. Or failure such as disconnection of joints may occur.

  In the RFID tag disclosed in Patent Document 1, since a heat insulating material is provided around the resin covering the IC chip, it is possible to prevent a rapid temperature change of the resin. However, this RFID tag has a problem that the number of parts is increased due to heat insulation treatment, resulting in high cost and large size.

  The present invention has been made paying attention to the above problems, and an object of the present invention is to provide an RFID tag that has a simple configuration and prevents damage to an IC chip and its peripheral circuits, is resistant to temperature changes, and has a long lifetime.

  An RFID tag according to the present invention includes a protective package enclosing an IC chip including a memory, an antenna coil, and a resin that seals the protective package and the antenna coil. The IC chip housing portion of the protective package is maintained in a hollow state, and electrode terminals connected to the IC chip are arranged on the outer peripheral surface of the protective package.

  In the above, the IC chip can include a control circuit for reading and writing information in the memory, a modulation circuit and a demodulation circuit for transmitting and receiving information, a power generation circuit, and the like in addition to the memory. This IC chip is disposed on the inner bottom surface of the protective package, for example, and can be connected to the electrode terminal on the protective package side by wire bonding.

  The protective package is preferably made of a material having heat resistance and pressure resistance such as a metal, a molding resin, etc. in addition to the ceramics described later. Further, it is desirable that the protective package after the IC chip is accommodated be sealed. In addition, it is desirable that the housing space of the protective package is filled with a gas having a high moisture-proof effect such as dry air or nitrogen gas.

  The RFID tag having the above configuration is produced by encapsulating the protection package and the antenna coil with resin after enclosing the IC chip in the protection package and connecting the electrodes of the protection package to the antenna coil. be able to. In addition, when incorporating electronic components such as a capacitor for circuit stabilization, it is desirable to accommodate these electronic components in a protective package.

  According to the present invention, since the IC chip is disposed in the accommodation space in the protective package having heat resistance and pressure resistance, the expansion and contraction of the sealing resin is caused by the IC even in an environment where the temperature changes greatly. There is no risk of directly affecting the chip. Therefore, it is possible to prevent the IC chip from being damaged or the joint portion from being cut.

In a preferred aspect of the RFID tag according to the present invention, a ceramic molded body is used as the protective package. In this way, even if the resin is sealed in a high temperature environment, pressure is applied for molding, or it is used in an environment with a large temperature change after completion, the protective package will not be deformed or damaged. There is no risk. Therefore, the space of the IC chip housing portion can be stably maintained and the IC chip can be kept sealed.
The protective package according to this aspect may be entirely formed of ceramics, but is not limited thereto, and for example, some members such as a lid portion that closes the IC chip housing portion may be made of other materials (for example, metal ).

  Furthermore, in another preferable aspect of the RFID tag according to the present invention, the antenna coil is a coil pattern printed on a substrate having a predetermined size, and the protective package is mounted on the substrate. The resin covers the entire substrate including the antenna coil and the protective package. In addition to the coil pattern, a wiring pattern for connecting the coil pattern to the protective package can be formed on the substrate.

The following three modes can be considered for the type of RFID tag using the above substrate.
In the first aspect, the protective package is inserted and mounted at a predetermined position on the substrate. That is, the protective package is mounted on the substrate by a method in which the electrode terminals of the protective package are formed as leads and inserted into insertion holes formed in the substrate.

  When the protective package is surface-mounted on the substrate, stress due to the difference in the degree of thermal expansion and contraction between the protective package and the substrate is applied to the joint portion including the solder, and the joint portion may be damaged. On the other hand, according to the above aspect, the lead inserted into the substrate can alleviate the difference in expansion and contraction between the protective package and the substrate, and stably maintain the bonding state between the protective package and the substrate. can do.

  Next, in the second aspect, a hole having a predetermined size is formed at the mounting position of the protective package on the substrate. The protective package is inserted and mounted on the substrate in a state of straddling the hole.

  When a hole is not provided in the substrate, an air layer may remain between the protective package and the substrate if the substrate after mounting the protective package is resin-sealed. In this case, if the air layer expands in a high-temperature environment, the protective package, the substrate, and the leads may be stressed against the air expansion, causing damage such as damage to the substrate and disconnection between the substrate and the lead. There is.

  According to the above aspect, since the hole is formed in the portion facing the ceramics package, sufficient resin can be injected into the gap between the substrate and the protective package through the hole. It is possible to prevent the air layer from remaining. Therefore, damage due to expansion of the remaining air can be prevented.

  Further, in the third aspect, the substrate is formed with a slit hole in a range from an edge of the substrate to a predetermined position outside the antenna coil. The protective package is inserted and mounted on the substrate in a state of straddling the slit hole.

  The slit hole corresponds to the hole of the second aspect. That is, also in this aspect, it is possible to prevent air from remaining between the substrate and the protective package, and to prevent the substrate from being damaged or the joint portion between the substrate and the lead from coming off. If the slit hole is used, the resin can be injected along the length direction of the protective package, so that the resin can be injected more reliably between the protective package and the substrate.

  When the substrate is square and the coil pattern is circular, the slit hole is preferably formed at one corner of the substrate. This is because the corner portion has a longer distance to the circular antenna coil than the other portions, so that a sufficient space for mounting the protective package can be secured.

  According to the RFID tag of the present invention, since the IC chip including the memory is enclosed in the hollow inside of the protective package, it is possible to remove the factor that generates stress in the IC chip and the surrounding wiring pattern. Pattern damage can be prevented. Therefore, it is possible to provide an RFID tag that is not easily broken even in an environment with a large temperature change and can be used for a long time.

FIG. 1 shows an example in which an RFID system is introduced into a factory production line. This system manages information related to a series of assembly operations in order to efficiently operate the production line, and has a RFID tag 1, an antenna 2, and a controller 3 as a basic configuration.
In the following description, the RFID tag 1 may be simply referred to as “tag 1”.

  The RFID tag 1 is attached to a pallet 5 for conveying goods, and moves along the pallet 5 and the assembled product 4. The antenna 2 is used for communication with the tag 1 and is controlled by the controller 3. The controller 3 is a programmable logic controller (PLC), and reads information written in the tag 1 via the antenna 2 or writes new information. The operation of the controller 3 is controlled by a host device (not shown). The host device is, for example, a personal computer, and uses the information of the tag 1 obtained from the controller 3 to move an assembly robot, an inspection device (none of which are shown) or to write new data to the tag 1. Control such as generating various information.

FIG. 2 shows the electrical configuration of the RFID system.
In addition to the memory 11 for storing information, the tag 1 includes an antenna coil 12, a demodulation circuit 13, a modulation circuit 14, a power generation circuit 15, a control circuit 16, and the like. The above configuration is incorporated in the IC chip 10 except for the antenna coil 12.

The antenna 2 includes a transmission coil 21, a reception coil 22, a modulation circuit 23, a demodulation circuit 24, a control circuit 25, and the like. In addition to the control circuit 31, the controller 3 includes interface circuits 32 and 33 corresponding to the antenna 2 and the higher-level equipment (indicated as a lower I / F circuit 32 and an upper I / F circuit 33 in the figure). Is incorporated.
The tag 1, the antenna 2, and the control circuits 16, 25, 31 of the controller 3 are constituted by a microprocessor.

  In the above configuration, when the tag 1 enters the communication area of the antenna 2, an induced electromotive force is generated in the antenna coil 12 of the tag 1 by a transmission wave from the antenna 2. The power generation circuit 15 converts the induced electromotive force generated in the antenna coil 12 into direct current. The control circuit 16 receives this DC supply and executes processing for accessing the memory 11 and transmitting information. The controller 3 reads / writes information from / to each tag 1 by executing a plurality of cycles of transmission / reception processing including commands and information each time the tag 1 enters the communication area.

  Hereinafter, the RFID tag 1 used in the RFID system will be described with reference to three examples.

FIG. 3 shows a configuration of the RFID tag 1 according to the first embodiment.
The RFID tag 1 has a configuration in which a printed circuit board 103 (hereinafter simply referred to as “substrate 103”) is disposed inside a resin main body 100 (shown in FIG. 7). The main body 100 has a square shape in which an upper plate 101 and a lower plate 102 are integrated. The substrate 103 is formed in a substantially square shape smaller than the upper plate 101 and the lower plate 102, and a circular hole 104 of a predetermined size is formed in the center.

  The antenna coil 12 of this embodiment is printed as a coil pattern on the upper surface of the substrate 103 and is formed so as to surround the circular hole 104. In addition, a slit hole 106 having a predetermined width is formed in one corner of the substrate 103 in a range from the end edge to a position before the antenna coil 12. A plurality (four in the illustrated example) of insertion holes (through holes) 107 for inserting leads 172 described later are formed on both sides of the slit hole 106, respectively.

  In this embodiment, the ceramic package 17 enclosing the IC chip 10 is mounted at the position where the slit hole 106 is formed. The ceramic package 17 is a case body having an opening on the upper surface provided with the accommodating portion 171 of the IC chip 10, and leads 172 corresponding to the number of the insertion holes 107 are provided on both side surfaces. The IC chip 10 is bonded and fixed to the inner bottom surface of the housing portion 171 while being electrically connected to the leads 172.

  A metal lid 173 is placed over the opening 174 of the ceramic package 17 after the IC chip 10 is accommodated. The lid 173 is welded and fixed to the ceramic package 17 by shield welding or the like. As a result, the IC chip 10 is sealed in the housing portion 171 of the ceramic package 17.

The upper plate 101 and the lower plate 102 are formed of a resin having high heat resistance such as PPS resin (polyphenylene sulfide) (the same resin material is used for the filling resin described later). A wall portion 102 a having a predetermined height is formed on the edge of the lower plate 102 over the entire circumference. The inner periphery of the wall portion 102a has a shape and a size corresponding to the outer periphery of the substrate 103, and the substrate 103 is fitted into and supported by the upper edge of the inner periphery.
Since the ceramic package 17 is attached to the back side of the substrate 103, the height of the wall portion 102 a is sufficiently larger than the height of the ceramic package 17. In addition, the space between the inner bottom surface of the lower dish 102 and the substrate 103 after the substrate 103 is attached is filled with resin.

The upper plate 101 is formed in a flat plate shape having the same size and shape as the lower plate 102. The upper plate 101 is formed integrally with the lower plate 102 that supports the substrate 103 by die molding described later. In addition, holes 108a and 108b (108b is shown in FIG. 5) having predetermined sizes are formed in the central portions of the upper plate 101 and the lower plate 102, respectively. These holes 108 a and 108 b communicate with each other through the circular hole 104 of the substrate 103 when the upper plate 101 and the lower plate 102 are integrated. This communication hole becomes a screw insertion hole when the tag 1 is fixed to the pallet 5.
Of the corner portions of the upper plate 101 and the lower plate 102, the corner portions corresponding to the mounting positions of the ceramics package 17 are cut out. This is for the purpose of allowing the user to recognize the arrangement position of the IC chip 10 and determining the direction of the tag 1 at the time of attachment.

  Next, a method for manufacturing the RFID tag 1 will be described. First, after the step of forming the substrate 103 on which the antenna coil 12 and the slit hole 106 are formed, the step of forming the ceramic package 17 and the like are executed, the step of encapsulating the IC chip 10 in the ceramic package 17, the IC chip 10 A step of mounting the ceramic package 17 enclosing the substrate on the substrate 103 is performed.

FIG. 4 shows a process of encapsulating the IC chip 10 in the ceramic package 17 and a process of mounting the ceramic package 17 after the encapsulation process on the substrate 103.
In the process of encapsulating the IC chip 10, the main body of the IC chip 10 is bonded to the inner bottom surface of the housing portion 171, and each electrode (not shown) of the IC chip 10 is connected to a predetermined lead by wire bonding. . 175 in the figure is an extracted wire for this connection. When the wire bonding is completed, the opening 174 is covered with a lid 173 and sealed by shield welding or the like. Since these series of steps are performed under a nitrogen atmosphere, the space around the IC chip 10 after sealing is also a nitrogen atmosphere.

  The ceramic package 17 after the encapsulation process is mounted on the back side of the substrate 103 as described above. In this mounting process, the ceramic package 17 is disposed so as to straddle the slit hole 106, and after inserting each lead 172 into the insertion hole 107, soldering is performed on the opposite side to the insertion direction (that is, the surface side of the substrate 103). Do.

In the next step, the substrate 103 on which the ceramic package 17 is mounted is placed on a pre-formed lower plate 102 (however, the outer peripheral surface is prepared in the final step), and the ceramic package 17 is inserted through the slit hole 106. The resin is filled in the space between the substrate 103 and the substrate 103.
FIG. 5A is a view of the state in which the substrate 103 is supported on the lower plate 102 as seen from directly above, and FIG. 5B is a slightly cross-sectional view taken along the line AA in FIG. Enlarged view. As shown in the figure, the ceramic package 17 is disposed in the space between the substrate 103 and the lower plate 102, and the bottom surface is covered with a resin 110 (shown by a halftone dot).

  Next, the process of putting the lower plate 102 on which the substrate 103 is supported in the mold and integrally molding the upper plate 101 thereabove is performed. FIG. 6 shows this molding process, in which 61 is an upper mold for molding the upper plate 101, and 62 is a lower mold for molding the outer peripheral portion of the lower plate 102. By injecting the resin 109 from the injection port 63 provided at the joining position of the upper mold 61 and the lower mold 62 and performing a pressing process, the main body 100 in which the upper plate 101 and the lower plate 102 are integrated is obtained. Complete. The resin from the injection port 63 is also guided to the space between the bottom surface of the lower dish 102 and the substrate 103.

  FIG. 7 shows the internal configuration of this final molded product. The entire substrate 103 including the main body of the ceramic package 17 and the leads 172 is embedded in the resin constituting the main body 100. However, the accommodating portion 171 in the ceramic package 17 is maintained hollow, and the IC chip 10 and the wire 175 are placed in a state where they are not covered with resin.

  In the final process shown in FIG. 6, since the resin temperature at the time of molding becomes high, stress is applied to the ceramic package 17 due to the difference in the degree of thermal expansion and contraction between the ceramic package 17 and the resin 109. However, since ceramics is a strong material, it is not easily broken even under stress. Further, since the IC chip 10 and the wire 175 are disposed in the space of the ceramic package 17, the stress caused by the difference in expansion and contraction between the resin 109 and the ceramic package 17 is directly applied to the IC chip 10 and the wire 175. There is no such thing. Therefore, even when used in an environment with a large temperature change, it is difficult for the IC chip 10 to be damaged or a failure such that the wire 175 is disconnected, and the life of the tag 1 can be extended.

  Further, in the conventional tag, the IC chip and its joint are covered with the resin before the main body is molded. Therefore, due to the stress based on the difference in the degree of expansion and contraction between the coating resin and the IC chip. There is a possibility that defects such as cracks in the IC chip and disconnection of the joints may occur. On the other hand, since the IC chip 10 of this embodiment is not covered with resin, it is possible to prevent the occurrence of defects during molding and to improve the product yield.

  In the RFID tag 1, the slit hole 106 is formed at the mounting position of the ceramic package 17 on the substrate 103 to protect the substrate 103 and strengthen the bonding between the ceramic package 17 and the substrate 103. It is to make it.

  FIG. 8 shows a problem when the slit hole 106 is not formed in the substrate 103. The substrate 103 of this example is different from the substrate 103 of the previous embodiment only in that the slit hole 106 is not formed, and the ceramic package 17 is also inserted and mounted from the back side (FIG. 8). (See (1).) However, in such a configuration, it becomes difficult to fill the resin between the ceramics package 17 and the substrate 103 when the substrate 103 is set on the lower plate 102 as shown in FIG. That is, in this case, it is necessary to cope with a method of injecting a resin into the lower mold 62 at the time of molding the mold.

  However, simply injecting resin into the space between the lower plate 102 and the substrate 103 may leave an air layer 111 between the substrate 103 and the ceramic package 17 as shown in FIG. In this case, when the temperature becomes high, stress is generated in the substrate 103 and the leads 172 due to the expansion of the air layer 111, and the substrate 103 is broken or the bonding between the leads 172 and the substrate 103 is performed as shown in FIG. There is a possibility of failure such as coming off. On the other hand, in the above-described embodiment, the space between the substrate 103 and the ceramics package 17 can be filled with sufficient resin through the slit hole 106 to eliminate the air layer. It is possible to prevent the substrate 103 from being broken without receiving stress. Further, the bonding state between the substrate 103 and the ceramic package 17 can be stably maintained.

  In the first embodiment, the resin is filled between the substrate 103 and the ceramics package 17 through the slit hole 106 before the main body 100 is molded, but this resin filling step is not performed. Immediately after placing the substrate 103 on the lower plate 102, the process may proceed to the molding process. Even in this case, since the resin injected into the upper mold 61 can be guided between the substrate 103 and the ceramic package 17 through the slit hole 106, no air layer remains in the main body 100. It is possible to prevent the substrate 103 from being destroyed.

  Next, as a method of mounting the ceramic package 17 on the substrate 103, a method of mounting the ceramic package 17 on the substrate 103 in a leadless structure as shown in FIG. However, in the configuration of FIG. 9, when the temperature is high, stress due to the difference in thermal expansion between the substrate 103 and the ceramic package 17 is directly applied to the solder 178 at the joint, and the joint may be disconnected.

  On the other hand, when the lead 172 is inserted into the insertion hole 107 and fixed as in the first embodiment, the difference in thermal expansion and contraction between the substrate 103 and the ceramic package 17 is caused by the lead 172. Alleviated. Therefore, it is possible to stabilize the bonding between the ceramic package 17 and the substrate 103 as compared with the case where the surface mounting method is adopted.

  As described above, according to the configuration of the first embodiment, the bonding between the IC chip 10 and the ceramic package 17 and the bonding between the ceramic package 17 and the substrate 103 can be stably maintained. The tag 1 that is strong and has a long lifetime can be provided.

  FIG. 10 shows a second embodiment of the RFID tag 1 using the ceramics package 17. In this embodiment, the configuration corresponding to the first embodiment is denoted by the same reference numeral, and detailed description thereof is omitted.

  The tag 1 according to the second embodiment has a configuration in which a substrate 112 is provided inside the antenna coil 12 by a copper wire 121 and the antenna coil 12 and the substrate 112 are sealed with resin. A ceramic package 17 enclosing the IC chip 10 is mounted on the substrate 112. The antenna coil 12 is connected to the ceramic package 17 through an electrode pattern (not shown) on the substrate. A recess (not shown) for supporting the antenna coil 12 and the substrate 112 is formed on the upper surface of the lower plate 102 of this embodiment. In addition, holes 113a and 113b for tag attachment are formed at the corners of the main body 100 that have a diagonal relationship.

  Even in the configuration of FIG. 10 described above, the IC chip 10 is disposed in the space inside the ceramic package 17, so that the IC chip 10 and the wires 175 are not affected by the expansion and contraction of the resin even if the IC chip 10 is placed in an environment with a large temperature change. There is no risk of reaching. Therefore, it is possible to prevent damage to the IC chip 10 and disconnection of the wire 175, and it is possible to increase the ability to withstand temperature changes as compared with conventional tags.

FIG. 11 shows a third embodiment of the RFID tag 1 using the ceramics package 17.
In the tag 1 of this embodiment, instead of the resin, a hollow main body 130 is formed by ceramics, and an IC chip 10 and an antenna coil 12 are disposed therein. The main body 130 is formed by bonding and fixing two case halves 131 and 132 in the vertical direction. The antenna coil 12 is disposed on the inner bottom surface of the lower case half 132, and the IC chip 10 is disposed on the inside thereof. This IC chip 10 is connected to the antenna coil 12 via a wire 177.

  According to the above configuration, since the IC chip 10 and the antenna coil 12 are disposed in the internal space of the ceramic main body 130, the IC chip 10 and the joint portion thereof are connected in the same manner as in the first and second embodiments. Damage can be prevented by leaving it uncoated.

It is explanatory drawing which shows the outline | summary of a RFID system. It is a block diagram which shows the electric constitution of a RFID system. It is a disassembled perspective view which shows the structure of a RFID tag. It is a figure which shows the sealing process of IC chip 10, and the attachment process to the board | substrate of a ceramics package. It is a figure which shows the state which attached the board | substrate to the lower plate. It is a figure which shows the formation process of a main-body part. It is sectional drawing which shows the internal structure of the tag after shaping | molding. It is a figure which shows the problem in the case of not providing a slit hole in a board | substrate. It is a figure which shows the example which surface-mounted the ceramics package. It is a figure which shows the structure of the RFID tag concerning 2nd Example. It is a figure which shows the structure of the RFID tag concerning 3rd Example. It is a figure which shows the structure of the conventional RDID tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 RFID tag 10 IC chip 11 Memory 12 Antenna coil 17 Ceramics package 109 Resin 100 Main body part 106 Slit hole 107 Insertion hole 171 Storage space 172 Lead

Claims (6)

A protective package enclosing an IC chip including a memory, an antenna coil, and a resin that seals the protective package and the antenna coil;
An RFID tag in which an IC chip housing portion of the protective package is maintained in a hollow state, and an electrode terminal connected to the IC chip is provided on an outer peripheral surface of the protective package.   The RFID tag according to claim 1, wherein the protective package is a ceramic body. The antenna coil is a coil pattern printed on a substrate of a predetermined size, and the protective package is mounted on the substrate,
The RFID tag according to claim 1, wherein the resin covers an entire substrate including the antenna coil and a protective package.   4. The RFID tag according to claim 3, wherein the protective package is inserted and mounted at a predetermined position on the substrate.   4. The RFID according to claim 3, wherein a hole of a predetermined size is formed at a mounting position of the protective package on the substrate, and the protective package is inserted and mounted on the substrate across the hole. tag.   A slit hole is formed in the substrate from the end edge to a predetermined position outside the antenna coil, and the protective package is inserted and mounted on the substrate across the slit hole. The RFID tag according to claim 3.

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