JP2005056276A - Work procedure book automatic creation method and work procedure book automatic creation device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a work procedure automatic creation method automatically creating a procedure book mainly for dismantling and disassembling of the objects in simple configuration. <P>SOLUTION: This work procedure book automatic creation method includes a model sentence extraction process S11 extracting a plurality of model sentences from a database in order to describe the content of a plurality of work procedures regarding the objects based on the information that indicates the structure of the objects, a rearrangement process S12 rearranging a plurality of model sentences in work process executing sequence, and a detailed information embedding process S13 producing a work procedure book regarding the object by embedding detailed information constituting the content of each work process into each model sentence based on the information that indicates the structure of the objects. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a work procedure manual automatic creation method and a work procedure manual automatic creation apparatus for automatically creating a work procedure manual for analyzing and evaluating an object such as a semiconductor chip.

  Conventionally, a work procedure manual for assembling a product is automatically created based on information using a CAD system (see, for example, Japanese Patent Application No. 7-234076 (Patent Document 1)).

  FIG. 10 is a block diagram showing a configuration of a conventional automatic work procedure manual creation apparatus. The automatic work procedure manual creation apparatus includes a production drawing tool 11, a database 12, a man-machine interface 13, and a printer 20. The production drawing tool 11 includes a search function unit 11a, an automatic device placement function unit 11b, an assembly procedure manual creation function unit 11c, a simulation function unit 11d, and a marshalling instruction document creation function unit 11e. The database 12 is provided with an equipment configuration information file 12a, an arrangement information file 12b, an arrangement information file 12c, an equipment dimension information file 12d, a tool dimension information file 12e, and an adjustment maintenance information file 12f.

In the work procedure manual automatic creation apparatus described in Patent Document 1 configured as described above, information such as the installation position of each device is collected interactively by the CAD system, and a device configuration information file is created in a database. The work procedure manual is automatically created based on this information. That is, the assembly / removal procedure manual is created based on the assembly work information simulated by the CAD system.
Japanese Patent Application No. 7-234076

  However, in the above-described conventional work procedure manual automatic creation apparatus, it is necessary to perform a simulation with a CAD system in order to create a work procedure. This is an appropriate method when the target of the work is a complicated configuration, but when an assembly procedure (manufacturing flow) is created before or during the manufacturing process, or when the work is simply disassembled from the top of the target There is no need to simulate a CAD system.

  In addition, it must be possible to automatically create a procedure manual that takes into account points to be aware of when disassembling and disassembling an object.

  An object of the present invention is to provide a work procedure manual automatic creation method and a work procedure manual automatic creation device capable of automatically creating a procedure manual mainly for dismantling and disassembly of an object with a simple configuration. .

  The work procedure manual automatic creating method according to the present invention extracts a plurality of template sentences for describing the contents of a plurality of work steps related to the object from a database based on information indicating the structure of the object. Details of each work process based on a type sentence extraction process, a rearrangement process in which the plurality of template sentences are rearranged in the order in which the work processes are executed, and information indicating the structure of the object And a detailed information embedding step of embedding information in each template sentence to create a work procedure manual relating to the object.

  The work procedure manual automatic creating apparatus according to the present invention extracts, from a database, a plurality of template sentences for describing the contents of a plurality of work steps relating to the object based on information indicating the structure of the object. Details that constitute the contents of each work process based on information indicating the structure of the target object, a sort means that rearranges the plurality of template sentences in the order in which the work processes are executed, and a type sentence extraction means Detailed information embedding means for embedding information in each template sentence and creating a work procedure manual relating to the object is provided.

  According to the present invention, it is possible to provide a work procedure manual automatic creation method and a work procedure manual automatic creation device capable of automatically creating a procedure manual mainly for disassembly and disassembly of an object with a simple configuration. .

  In the work procedure manual automatic creation method according to the present embodiment, based on the information indicating the structure of the object, detailed information constituting the contents of each work process is embedded in each template sentence, and the work procedure related to the object Create a certificate. For this reason, it is possible to automatically create a procedure manual for assembling, disassembling and disassembling the object.

  In this embodiment, it is preferable that the information indicating the structure of the object includes information indicating at least one of the name, material, and structure of the object.

  The work procedure manual preferably describes a work procedure for disassembling, disassembling or observing the object with at least one of a medicine and a work implement.

  The template sentence extracting step specifies at least one of the medicine and work implement based on the information indicating the structure of the object by the template sentence, and the detailed information embedding step includes the medicine and work. Preferably, the processing time, usage, concentration, temperature, humidity and atmospheric pressure associated with the use of at least one appliance are specified by embedding the detailed information in each template text. By doing in this way, a careful work can be instructed automatically, and even an unskilled worker can perform an appropriate work.

  The object includes a semiconductor chip, and the semiconductor chip includes a first layer and a second layer stacked on the first layer, and the medicine includes the second layer. Preferably, the method further includes a modification step that includes a chemical for etching the layer, and modifies the type and concentration of the chemical so that the chemical does not etch up to the first layer.

  It is preferable that the method further includes a correction step of correcting the content of the work process related to the defective portion based on data for estimating the defective portion of the object.

  The object includes a semiconductor chip, the semiconductor chip includes a plurality of layers, and the defect is based on data inferring a layer in which a defective portion exists among the plurality of layers of the semiconductor chip. It is preferable to further include a correction process for correcting the content of the work process related to the layer in which the location exists and the layer laminated thereon. By doing in this way, it is possible to guess the layer of the defective part and modify the contents of the procedure manual so that the corresponding layer and the upper layer are carefully handled.

  It is preferable that the method further includes a correction step of correcting the content of the work process executed by the device in accordance with the usage status of the device that executes the work step. By doing so, it is possible to prevent work troubles due to the inability to use the apparatus simply by looking at the procedure manual.

  The object includes a semiconductor chip, the semiconductor chip includes a plurality of layers, and the apparatus for performing the work process includes an apparatus for etching one or a plurality of layers of the semiconductor chip. It is preferable to include.

  It is preferable that the usage status of the device includes a use start date and time and a use end date and time of the device.

(Embodiment 1)
FIG. 1 is a block diagram showing a configuration of a work procedure manual automatic creation apparatus 100 according to the first embodiment. The work procedure manual automatic creation apparatus 100 includes a template text extraction unit 31. The template sentence extraction unit 31 extracts, from the database A, a plurality of template sentences for describing the contents of a plurality of work steps related to the object based on the information indicating the structure of the object. The information indicating the structure of the object includes information indicating at least one of the name, material, and structure of the object. The template sentence extraction unit 31 identifies at least one of the medicine and the work implement by the template sentence based on the information indicating the structure of the object.

  The work procedure manual automatic creating apparatus 100 is provided with a rearrangement unit 32. The rearrangement unit 32 rearranges the plurality of template sentences extracted by the template sentence extraction unit 31 in the order in which the work steps are executed.

  The work procedure manual automatic creating apparatus 100 includes a detailed information embedding unit 33. Based on the information indicating the structure of the object, the detailed information embedding unit 33 embeds detailed information constituting the contents of each work process in each template sentence and creates a work procedure manual related to the object. This work procedure manual describes a work procedure for disassembling, disassembling, cutting or observing an object with at least one of a medicine and a work implement. The detailed information embedding unit 33 specifies the processing time, usage, concentration, temperature, humidity, and atmospheric pressure related to the use of at least one of the medicine and the work implement by embedding detailed information in each template sentence.

  The work procedure manual automatic creating apparatus 100 is provided with a correcting unit 34. The object includes a semiconductor chip. The semiconductor chip includes a first layer and a second layer stacked on the first layer. The chemical includes a chemical for etching the second layer. The correction unit 34 corrects the type and concentration of the chemical based on the database B so that the chemical does not etch up to the first layer.

  The operation of the work procedure manual automatic creation apparatus according to Embodiment 1 configured as described above will be described. FIG. 2 is a block diagram showing the concept of the work procedure manual automatic creation method according to the first embodiment, and FIG. 3 is a flowchart showing the work procedure manual automatic creation method.

  Reference numeral 1 denotes a structure information receiving step for receiving information indicating the structure of a semiconductor chip to be analyzed. 2 is a procedure manual creation process. Based on the information received in the structure information reception process 1, a text of a template necessary for creating the procedure manual is extracted from the database A, and a procedure manual for peeling each layer of the semiconductor chip. Create Reference numeral 3 denotes a correction process, which corrects the procedure manual based on the structure information of the semiconductor chip collected through the procedure manual creation process 2. Rules for correction are stored in the database B.

  The structure information receiving step 1 receives, as information indicating the structure of the semiconductor chip, the name of each step involved in the manufacture of the semiconductor chip, the material constituting each layer, and the dimension (thickness) as electronic data. This electronic data may be provided in accordance with a specific format by a person requesting analysis, or may be provided as it is with flow information indicating a semiconductor manufacturing process.

  The procedure manual creation process 2 defines the details of the work contents such as the first step for defining the order of each work and the text of the work using the equipment and chemicals used in the work, and the concentration and processing time of the chemical used in the work. A second step is provided.

  In the first step, the template text of the corresponding work content is extracted from the database A using the process name, material, and dimension information as keywords (FIG. 3: step S11). Then, the template sentences are rearranged in the order in which the work processes are executed (FIG. 3: step S12).

  Next, in the second step, values to be applied to variables (chemical concentration, processing time and processing temperature) included in the template text extracted in step S11 are calculated. Information for calculating these values is included in the database A and is a calculation formula calculated from the material and dimensions. This calculation formula detects material and dimensions as keywords. Detailed information such as the chemical concentration, processing time, and processing temperature calculated based on this calculation formula is embedded in the template text (step S13).

  Thereafter, when the semiconductor chip structure satisfies a certain condition registered in the database B, the correction process 3 includes the correction information corresponding to the condition in the work contents created in the procedure manual creation process 2. Apply. For example, if there is a B layer under the A layer, and the chemical that normally etches the A layer, even if B is etched, the concentration of the chemical is made thinner than the normal use concentration or the processing temperature is lowered. , Slow the reaction rate. Or change to chemicals that do not affect layer B.

  In the database B, correction information that can extract the material of each layer and the process name used to create each layer as a keyword is registered. In the correction process 3, the procedure manual preparation process 2 is performed based on the contents extracted from the database B. The template text is changed or the value of the variable included in the template text is changed with respect to the created work content (FIG. 3: step S14).

  As described above, according to the first embodiment, the work procedure and the contents of each work can be automatically determined from the information indicating the structure to be analyzed. Further, by providing the correction step 3, it is possible to automatically create a procedure manual for instructing to perform an appropriate work even in a place where attention should be paid to the work. The automatically created procedure is displayed on the monitor, and the analysis worker processes and observes the semiconductor chip according to the instructions of the monitor.

  In the first embodiment, the case where the object is a semiconductor chip is described. However, the first embodiment can be applied as long as the order of the work procedure can be determined from the structure of the object, and the manufacturing work is further performed. This is especially effective for those that can be dismantled if the above is reversed.

  As described above, according to the procedure manual automatic creation method of the first embodiment, the procedure manual is created using the structure information receiving step 1 for receiving data indicating the structure of the semiconductor chip, and the template sentences indicating the work contents. The procedure manual can be automatically created from the procedure manual creation step 2. Further, the correction step 3 makes it possible to carefully correct a portion to be worked on.

(Embodiment 2)
FIG. 4 is a block diagram showing a configuration of the work procedure manual automatic creating apparatus 100A according to the second embodiment. Components identical to those of the work procedure manual automatic creation apparatus 100 described in the first embodiment with reference to FIG. 1 are assigned the same reference numerals. Therefore, detailed description of these components is omitted.

  The work procedure manual automatic creation device 100A includes a correction unit 34A. 34 A of correction parts correct the content of the work process relevant to a defective location based on the data which estimates the defective location of a target object. The object preferably includes a semiconductor chip, and the semiconductor chip preferably includes a plurality of layers. Based on the data that estimates the layer where the defective portion exists among the plurality of layers of the semiconductor chip, the correcting unit 34A displays the contents of the work process related to the layer where the defective portion exists and the layer stacked thereon. It is preferable to correct.

  The operation of the work procedure manual automatic creation apparatus 100A configured as described above will be described. FIG. 5 is a block diagram showing the concept of the work procedure manual automatic creation method according to the second embodiment, and FIG. 6 is a flowchart showing the work procedure manual automatic creation method according to the second embodiment. The same components as those described in the first embodiment with reference to FIGS. 2 and 3 are denoted by the same reference numerals. Therefore, detailed description of these components is omitted.

  The difference from the above-described first embodiment is that in the correction process 3A, other system C can collect information on the state of the apparatus when the semiconductor chip to be analyzed is manufactured and the inspection result of the electrical characteristics after the manufacture is completed. It is a point which can communicate with (an electrical property inspection system or an apparatus state management system).

  In the correction process 3A, the other system C is an electrical characteristic inspection system or an apparatus state management system, and the electrical characteristic inspection system is a system for inspecting electrical characteristics of a semiconductor such as a leakage current. Guess if there is a defect in the layer. Further, the apparatus state management system manages the number of particles in the apparatus and the like, and investigates, for example, the possibility that the particles are defective from this system information.

  In the correction process 3A, a layer that is likely to have a defect is identified based on information from the other system C, and, for example, the etching reaction rate is slowed so that the film can be carefully removed from the upper layer. If it is slightly etched, it is observed with the SEM, and if it is etched slightly, the contents of the work process related to the defective portion are corrected so that the observation with the SEM is repeated little by little (FIG. 6: Step 14A).

  As described above, according to the second embodiment, the correction process 3A includes the correspondence table for identifying the defective portion from the electrical property inspection result data or the like, thereby removing the layer near the defective portion. It is possible to modify the work procedure so that the above work can be performed carefully.

  As described above, according to the procedure manual automatic creating method of the second embodiment, the layer of the defective portion is estimated in the correction step 3 based on the information obtained from the electrical characteristic inspection system and the apparatus state management system. As a result, a place (layer) requiring careful work can be identified, and the procedure manual can be corrected accordingly.

(Embodiment 3)
FIG. 7 is a block diagram illustrating a configuration of the work procedure manual automatic creation device 100B according to the third embodiment. Components identical to those of the work procedure manual automatic creation apparatus 100 described in the first embodiment with reference to FIG. 1 are assigned the same reference numerals. Therefore, detailed description of these components is omitted.

  The work procedure manual automatic creating apparatus 100B includes a correcting unit 34B. The correction unit 34B corrects the content of the work process executed by the device according to the use status of the device that executes the work process, which is managed by the device usage status management device 36. The object preferably includes a semiconductor chip, the semiconductor chip preferably includes a plurality of layers, and an apparatus for performing a work process is an apparatus for corroding a plurality of layers of the semiconductor chip ( An electric furnace or the like) or a device for cutting (FIB or the like) is preferably included. The use status of the device preferably includes the use start date and time and the use end date and time of the device.

  The operation of the work procedure manual automatic creation apparatus 100B configured as described above will be described. FIG. 8 is a block diagram showing the concept of the work procedure manual automatic creation method according to the third embodiment, and FIG. 9 is a flowchart showing the work procedure manual automatic creation method according to the third embodiment. The same components as those described in the first embodiment with reference to FIGS. 2 and 3 are denoted by the same reference numerals. Therefore, detailed description of these components is omitted.

  The difference from the first embodiment described above is that a device usage status management step 4 for managing the usage status of each device used for analysis work and a database D for recording the usage status of the device are provided.

  The device usage status management step 4 is a step of managing a device used for analysis of a semiconductor chip and its use start date / time and end date / time, and records the information in the database D. As a result, it is possible to manage currently available devices.

  The procedure manual changing process 5 can be used from the apparatus usage status management process 4 at a non-periodic timing or periodically notified by the worker that the work process has been completed for each work process described in the work procedure. If the device used in the next work process is used by another worker and cannot be used in the next work process, the expression of the work procedure manual is changed or added (FIG. 9: Step) S14B). For example, “Do not perform the next operation because the XXX device is in use”. When using an electric furnace to corrode a layer, it is not possible to use the electric furnace after putting the semiconductor chip on the chemical, so if continuous work is required, several steps before using the device It is necessary to stop the work.

  As described above, in the embodiment, the device usage status management step 4 and the procedure manual change step 5 can change the expression of the work procedure manual with time based on the usage status of the device necessary for the analysis work. In an environment where the number of devices is smaller than that of analysis workers, work troubles due to the inability to use the devices can be prevented. In the third embodiment, the use date / time and the end date / time of the apparatus are managed. However, by managing the scheduled use date / time and the scheduled end date / time of the apparatus, a work procedure manual for improving work efficiency can be provided to the analysis worker. It can also be displayed.

  In the third embodiment, the procedure manual for disassembling and disassembling the target object is described. However, regarding the assembly of the target object, if the work procedure is displayed on the monitor or instructed by voice, the work is performed. It is possible to automatically create a procedure manual in consideration of the usage status of the device to be used.

  As described above, according to the procedure manual automatic creation method of the third embodiment, the procedure manual instructed to continue or stop the work is automatically created based on the usage status of the apparatus necessary for the work. As a result, the worker can proceed with the work without considering the usage status of the apparatus by simply looking at the procedure manual that changes in time on the monitor.

  The present invention can be applied to a work procedure manual automatic creation method and a work procedure manual automatic creation device for automatically creating a procedure manual mainly for dismantling and disassembly of an object.

FIG. 1 is a block diagram showing a configuration of a work procedure manual automatic creation apparatus according to Embodiment 1; A block diagram showing a concept of a work procedure manual automatic creation method according to Embodiment 1 The flowchart which shows the work procedure manual automatic preparation method concerning Embodiment 1 A block diagram showing a configuration of an automatic work procedure manual creation apparatus according to Embodiment 2 A block diagram showing a concept of a work procedure manual automatic creation method according to Embodiment 2 The flowchart which shows the work procedure manual automatic preparation method concerning Embodiment 2 A block diagram showing a configuration of an automatic work procedure manual creation apparatus according to Embodiment 3. A block diagram showing the concept of a work procedure manual automatic creation method according to Embodiment 3 The flowchart which shows the work procedure manual automatic preparation method concerning Embodiment 3 Block diagram showing the configuration of a conventional automatic work procedure manual creation device

Explanation of symbols

31 Model sentence extraction unit 32 Rearrangement unit 33 Detailed information embedding unit 34 Correction unit 35 Monitor 36 Device usage status management device 100 Work procedure manual automatic creation device

Claims (22)

Based on the information indicating the structure of the object, a template sentence extracting step for extracting a plurality of template sentences for describing the contents of the plurality of work steps related to the object from the database;
A rearrangement step of rearranging the plurality of template sentences in an order of executing the work steps;
Including a detailed information embedding step of embedding detailed information constituting the contents of each work process in each template sentence based on information indicating the structure of the object to create a work procedure manual relating to the object. A method for automatically creating work procedure manuals.   The work procedure manual automatic creation method according to claim 1, wherein the information indicating the structure of the object includes information indicating at least one of a name, a material, and a structure of the object.   The work procedure manual automatic creation method according to claim 1, wherein the work procedure manual describes a work procedure for dismantling, disassembling or observing the object with at least one of a medicine and a work implement. The template sentence extraction step specifies at least one of the medicine and work implement by the template sentence based on information indicating the structure of the object,
The detailed information embedding step specifies processing time, usage amount, concentration, temperature, humidity, and atmospheric pressure related to use of at least one of the medicine and work implement by embedding the detailed information in each template sentence. 3. Method for automatically creating work procedure manual according to 3. The object includes a semiconductor chip,
The semiconductor chip includes a first layer and a second layer stacked on the first layer,
The chemical includes a chemical for etching the second layer;
4. The work procedure manual automatic creation method according to claim 3, further comprising a correction step of correcting the kind and concentration of the chemical so that the chemical does not etch up to the first layer.   The work procedure manual automatic creation method according to claim 1, further comprising a correction step of correcting a content of a work process related to the defective portion based on data for estimating a defective portion of the object. The object includes a semiconductor chip,
The semiconductor chip includes a plurality of layers,
Correction for correcting the contents of work steps related to the layer where the defective portion exists and the layer stacked thereon based on the data for estimating the layer where the defective portion exists among the plurality of layers of the semiconductor chip The work procedure manual automatic creation method according to claim 1, further comprising a step.   The work procedure manual automatic creation method according to claim 1, further comprising a correction step of correcting a content of the work step executed by the device according to a use situation of the device that executes the work step. The object includes a semiconductor chip,
The semiconductor chip includes a plurality of layers,
9. The work procedure manual automatic creation method according to claim 8, wherein the apparatus for executing the work process includes an apparatus for etching one or a plurality of layers of the semiconductor chip.   The work procedure manual automatic creation method according to claim 8, wherein the use status of the device includes a use start date and time and a use end date and time of the device. A template sentence extracting means for extracting, from a database, a plurality of template sentences for describing the contents of a plurality of work steps related to the object, based on information indicating the structure of the object;
Rearranging means for rearranging the plurality of template sentences in an order of executing the work steps;
Detailed information embedding means for embedding detailed information constituting the contents of each work process in each template sentence based on the information indicating the structure of the object and creating a work procedure manual relating to the object. A work procedure manual automatic creation device.   12. The work procedure manual automatic creation device according to claim 11, wherein the information indicating the structure of the object includes information indicating at least one of a name, a material, and a structure of the object.   The work procedure manual automatic creation device according to claim 11, wherein the work procedure manual describes a work procedure for dismantling, disassembling or observing the object with at least one of a medicine and a work implement. The template sentence extracting means identifies at least one of the medicine and the work implement by the template sentence based on information indicating the structure of the object,
The detailed information embedding means specifies processing time, usage, concentration, temperature, humidity, and atmospheric pressure related to use of at least one of the medicine and work implement by embedding the detailed information in each template sentence. 13. A work procedure manual automatic creation apparatus according to 13. The object includes a semiconductor chip,
The semiconductor chip includes a first layer and a second layer stacked on the first layer,
The chemical includes a chemical for etching the second layer;
The work procedure manual automatic creation device according to claim 13, further comprising a correcting unit that corrects the kind and concentration of the chemical so that the chemical does not etch up to the first layer.   The work procedure manual automatic creating apparatus according to claim 11, further comprising a correcting unit that corrects a content of a work process related to the defective portion based on data for estimating a defective portion of the object. The object includes a semiconductor chip,
The semiconductor chip includes a plurality of layers,
Correction for correcting the contents of work steps related to the layer where the defective portion exists and the layer stacked thereon based on the data for estimating the layer where the defective portion exists among the plurality of layers of the semiconductor chip The work procedure manual automatic creation device according to claim 11, further comprising means.   The work procedure manual automatic creation device according to claim 11, further comprising a correcting unit that corrects a content of the work process executed by the device according to a use situation of the device that executes the work process. The object includes a semiconductor chip,
The semiconductor chip includes a plurality of layers,
19. The work procedure manual automatic creation device according to claim 18, wherein the device for performing the work process includes a device for etching one or a plurality of layers of the semiconductor chip.   19. The work procedure manual automatic creation device according to claim 18, wherein the usage status of the device includes a use start date and time and a use end date and time of the device.   12. The work procedure manual automatic creation device according to claim 11, further comprising an output means for outputting the work procedure manual.   The work procedure manual automatic creation device according to claim 21, wherein the output means includes at least one of a monitor, a printer, and a speaker.

Images