JP2005050696A - Manufacturing method of gas discharge display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simplified manufacturing method of a gas discharge display device capable of holding high dimensional precision of an electrode with manufacturing cost restrained. <P>SOLUTION: On the method of forming an electrode at least on one of a pair of base plates facing each other, the electrode is formed on a second base plate 3 by forming a metallic thin film 13 having the same shape as the electrode on the second base plate 3 on a base plate for molding 12 made of an insulation body or a dielectric body; subsequently making silver particles 20 covered by a covering film having an electrified surface adhere on the metallic thin film 13 by electrifying a part of the base plate for molding 12 excluding the metallic thin film 13; subsequently making the silver particles 20 adhere on the second base plate 3 by making the base plate for molding 12 and the second base plate 3 face each other and impressing a voltage between them, and by subsequently baking the second base plate 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a gas discharge display device such as a plasma display.

An example of a display device using a gas discharge display device is a plasma display. Various methods have been proposed as a method for manufacturing a conventional gas discharge display device. For example, a method of applying a silver paste (see, for example, Patent Document 1) and a method of attaching an electrode sheet (for example, see Patent Document 2). Etc.
10 and 11 are diagrams illustrating a conventional method for manufacturing a gas discharge display device. In the conventional method of manufacturing a gas discharge display device, as shown in FIG. 10A, first, a photosensitive silver paste 102 is applied to the entire surface of a substrate 101 formed of glass. Then, as shown in FIG. 10B, exposure is performed by irradiating light toward the substrate 101 through a photomask 104 in which light transmission holes 103 arranged at equal intervals are arranged. Thereafter, the photosensitive silver paste 102 is developed to remove the photosensitive silver paste 102 other than the exposed portion. As shown in FIG. 10C, the substrate 101 after the development is pasted on the substrate 101 at equal intervals only by the portions of the electrode 105 formed by the exposed photosensitive silver paste 102. ing. Then, the substrate 101 is baked together with the electrode 105 to form the electrode 105.

FIG. 11 shows a method for manufacturing the electrode formed in the recess. As shown in FIG. 11A, first, a silver-based electrode sheet 107 having photosensitivity is attached to the entire surface of the substrate 106 having the recess 106a. Then, as shown in FIG. 11B, the electrode sheet 107 is exposed using a photomask 108 on which an electrode pattern is formed, and then the electrode sheet 107 is developed and baked. By performing the above, as shown in FIG. 11C, the electrode 109 is formed according to the shape previously formed by the photomask 108.
In addition, as a conventional method for forming an electrode in a recess, a method is also reported in which a photosensitive silver paste is applied to the entire surface of a substrate, and development is performed by exposure.
JP 2001-325888 A JP 2001-291468 A

  However, in the conventional method of applying a silver paste, the silver paste is applied to the entire surface of the substrate and exposed and developed, so that most of the expensive silver is thrown away at the time of development, which is costly. It was bulky. In addition, the process is complicated and long. In addition, in the method of attaching the electrode sheet inside the recess, the electrode cannot be easily formed because it cannot be completely pressed into the recess even when pressed by a roller or the like. Therefore, it is impossible to transfer the electrode sheet by a printing method. In addition, since exposure and development have been performed once, there is a fear that the electrode may be thickened or contracted, and the dimensional accuracy of the electrode cannot be maintained.

  The present invention has been made in view of the above circumstances, manufacturing costs can be reduced, the manufacturing process can be simplified, the dimensional accuracy of the electrodes can be kept high, and the electrodes can be formed even if the substrate has irregularities. An object of the present invention is to provide a method of manufacturing a gas discharge display device that can be formed.

In order to solve the above problems, the present invention employs the following method for manufacturing a gas discharge display device.
In other words, the method for manufacturing a gas discharge display device according to claim 1 of the present invention is a method of forming an electrode on at least one of a pair of substrates arranged opposite to each other, and is made of an insulator or a dielectric. A conductive film having the same shape as the electrode formed on the substrate is formed on a flat plate, and then a portion of the flat plate except the conductive film is charged and covered with an insulating film whose surface is charged on the conductive film Then, the conductive particles deposited on the conductive film are adhered to the substrate by applying a voltage between the flat plate and the substrate, and applying a voltage between the flat plate and the substrate. And then firing the conductive particles together with the substrate to form an electrode on the substrate.

In the present invention, a conductive particle having the same shape as an electrode formed on a substrate is formed on a flat plate, and then a portion excluding the conductive film on the flat plate is charged and coated with a charged insulating film. Then, a voltage is applied between the opposing flat plate and the substrate to attach the conductive particles to the substrate, and then the substrate is baked to form an electrode on the substrate.
Therefore, the conductive particles are attached only on the conductive film and not on the charged portion of the flat plate. This requires less adhesion of conductive particles, and as a result, the amount of silver used is reduced. Further, since the flat plate and the substrate are opposed to each other and a voltage is applied between them, the electrode manufacturing process is simplified. In addition, since no liquids such as a solvent and a developer are used, all electrode manufacturing processes can be performed in a gas phase environment.
Further, even when the electrode is formed inside the concave portion of the substrate, it is not necessary to press the electrode onto the substrate, so that the electrode can be easily formed.

  The method of manufacturing a gas discharge display device according to claim 2 is the method of manufacturing the gas discharge display device according to claim 1, wherein the conductive film is grounded when the conductive particles are adhered onto the conductive film. The conductive particles are adhered only to the conductive film by charging the flat plate and then applying the conductive particles on the flat plate.

  In the present invention, when the conductive particles are deposited on the conductive film, the portion other than the flat conductive film is charged, the conductive particles are applied on the flat plate, and the conductive particles are deposited only on the conductive film. As a result, the portion of the flat plate where the conductive film is not formed is charged with the same polarity as the insulating film. For this reason, the electroconductive particle covered with the insulating film and the part in which the electrically conductive film is not formed repel each other, and the electroconductive particle does not adhere to the part in which the flat conductive film is not formed. Thereby, electroconductive particle adheres only on a flat conductive film, and does not adhere to another part. Therefore, the conductive particles can be easily attached only on the conductive film by applying the conductive particles over the entire plate with a drum or the like.

  The method for manufacturing a gas discharge display device according to claim 3 is the method for manufacturing a gas discharge display device according to claim 1 or 2, wherein the conductive particles covered with the insulating film are formed of an insulating resin on the surface of the metal particles. It is characterized by being coated with.

  In the present invention, the conductive particles are coated with an insulating resin on the surface of the metal particles, so that the coated insulating film is charged. Therefore, the insulating film is charged with the same polarity as that of the flat plate. Thus, the conductive particles can be prevented from adhering to the flat plate. Further, since the insulating film is made of an insulating resin, it is easily removed by baking and does not remain in the electrode. This allows a current to flow after the electrodes are formed.

According to the method for manufacturing a gas discharge display device according to the present invention, a conductive film having the same shape as an electrode formed on a substrate is formed on a flat plate, and then a portion excluding the conductive film on the flat plate is charged and charged. The conductive particles coated with the insulating film are deposited on the conductive film, and then a voltage is applied between the opposing flat plate and the substrate to adhere the conductive particles to the substrate. Since the electrode is formed on the electrode, the amount of necessary conductive particles attached can be reduced. As a result, the amount of conductive particles used can be reduced, and the manufacturing cost of the gas discharge display device can be reduced. Moreover, since a flat plate and a board | substrate are made to oppose and a voltage should just be applied between these, a manufacturing process is simplified and the time of a manufacturing process can be shortened. Further, since the step of forming the electrode is performed in a gas phase environment, liquids such as paste, ink, and developer are not necessary, and the electrode manufacturing process can be simplified.
Further, even when the electrode is formed inside the concave portion of the substrate, it is not necessary to press the electrode onto the substrate, so that the electrode can be easily manufactured even for the substrate on which the discharge cell is formed.

  In addition, when the conductive particles are attached on the conductive film, the portion other than the conductive film on the flat plate is charged, and the conductive particles are applied on the flat plate so that the conductive particles are attached only to the conductive film. The conductive particles can be attached only on the thin film, the electrode manufacturing process can be simplified, and the time required for manufacturing the electrode can be shortened.

  In addition, since the conductive particles have a structure in which the surface of the metal particles is coated with an insulating resin, the insulating film is charged to the same polarity as the charging of the flat plate so that the conductive particles do not adhere to the flat plate. be able to. Therefore, the conductive particles can be easily attached only on the conductive film, and the manufacturing process can be simplified. Further, since the insulating film is made of an insulating resin, the insulating resin is decomposed and removed by heat by baking, and the insulating resin does not remain on the electrode.

Examples according to the method for manufacturing a gas discharge display device of the present invention will be described.
Each example of the present invention is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

FIG. 1 is a view showing a plasma display (gas discharge display device) provided with electrodes obtained by the method for manufacturing a gas discharge display device of Example 1 of the present invention.
The plasma display 1 is composed of a first substrate 2 and a second substrate 3 made of glass arranged to face each other. A plurality of scan electrodes 4 and sustain electrodes 5 are formed in a stripe shape on the inner surface of the second substrate 3, and these scan electrodes 4 and sustain electrodes 5 are covered with a transparent dielectric layer 6. The dielectric layer 6 is covered and protected by a protective film made of MgO or the like not shown. Note that the scan electrodes 4 and the sustain electrodes 5 are alternately formed on the inner surface of the second substrate 3.

  On the other hand, a predetermined height is formed on the inner surface of the first substrate 2 in a direction intersecting with the extending direction of the scan electrodes 4 and the sustain electrodes 5 in order to form discharge cells 7 that are spaces for gas discharge. A plurality of barrier ribs 8 are provided in stripes, and a plurality of discharge cells 7 are partitioned by the barrier ribs 8.

The plurality of partition walls 8 may be made of a different member from the first substrate 2, but as shown in FIG. 1, in order to simplify the manufacturing process of the plasma display 1, the plurality of partition walls 8 are the first It is desirable to be formed integrally with the substrate 2.
Each discharge cell 7 has a concave curved surface 7a. Within each discharge cell 7, an address electrode 9, a highly reflective dielectric layer 10, red (R), green (G), A phosphor 11 that emits one of the colors of blue (B) is sequentially stacked.

The plasma display 1 has a discharge gas 7 filled with a rare gas such as Ne or He, and the first substrate 2 and the second substrate 3 are combined and sealed with a sealing material or the like. It has become the composition.
One end of each of the scan electrode 4, the sustain electrode 5, and the address electrode 9 extends to the outside of the display area, and a predetermined voltage is selectively applied to terminals connected thereto. As a result, a discharge is selectively generated between the scan electrode 4, the sustain electrode 5, and the address electrode 9 in the discharge cell 7, and excitation light of a predetermined color is generated from the phosphor 11 in the discharge cell 7 by this discharge. , To be displayed outside.

Next, the manufacturing method of the gas discharge display apparatus in the 2nd board | substrate 3 is demonstrated based on FIGS.
First, as shown in FIG. 2, a metal thin film (conductive film) 13 having the same shape as the electrode formed on the second substrate 3 is formed on a mold substrate (flat plate) 12 made of glass. The mold substrate 12 is formed by forming a conductor in a desired electrode shape thereon, and then transferring the conductor formed on the mold substrate 12 onto the first substrate or the second substrate. The mold substrate 12 itself is not a member constituting the plasma display 1 as a substrate.

  Next, as shown in FIG. 3, the scorotron 14 irradiates the entire mold substrate 12 on which the metal thin film 13 is formed. The scorotron 14 is a charging device having a grid 17 at the electron irradiation port 16. Inside the scorotron 14, the potential is −800 V, and electrons are irradiated from the grid 17 by causing corona discharge. One conducting wire extending from the scorotron 14 is connected to a scorotron power supply 18. The other conductor extending from the scorotron 14 is grounded. The scorotron power supply 18 is an 800V power supply, and the conductor on the side extending from the scorotron power supply 18 in a direction different from that of the scorotron 14 is grounded.

  On the other hand, the metal thin film 13 is connected to an electrode on the mold substrate 12, and a conductive wire extending from the electrode connected to the metal thin film 13 is grounded. As a result, the metal thin film 13 is not charged and the potential becomes zero. Therefore, only the glass portion 15 where the metal thin film 13 is not formed is charged by the electrons irradiated from the scorotron 14.

  After the electron irradiation is completed, the conductive wire extending from the metal thin film 13 is cut off from the mold substrate 12 to form the mold substrate 12 in which only the glass portion 15 is charged to −800V.

  Next, conductive particles are adhered to the mold substrate 12 using a coating apparatus. As the conductive particles, silver particles (conductive particles) 20 whose surface is coated with a polyester coating film (insulating film) 19 as shown in FIG. As shown in FIG. 4B, silver particles 20 are stored in the container 21. The silver particles 20 inside the container 21 are once applied to a cylindrical application member 22, and the silver particles 20 attached to the application member 22 are applied onto the mold substrate 12.

  At that time, the coating film 19 of the silver particles 20 is negatively charged due to friction between the silver particles 20 generated by the rotation of the application member 22 and the supply member 23. Similarly, the glass portion 15 of the mold substrate 12 is negatively charged. Therefore, even if the silver particles 20 are applied over the entire mold substrate 12 by the application member 22, the coating film 19 of the silver particles 20 and the glass portion 15 of the mold substrate 12 are repelled by charging with the same polarity. Hold on. Therefore, as shown in FIG. 5, the silver particles 20 are attached only on the metal thin film 13 without the silver particles 20 attaching to the glass portion 15.

  Thereafter, the silver particles 20 on the mold substrate 12 are transferred to the second substrate 3. As shown in FIG. 6, the negative electrode side of the transfer power supply 24 is connected to the metal thin film 13 of the mold substrate 12 having the silver particles 20 attached only on the metal thin film 13, and the switch is connected to the positive electrode side of the transfer power supply 24. The electrode 26 is connected via 25. Note that the second substrate 3 is attached to the electrode 26. Next, the surface of the mold substrate 12 on which the metal thin film 13 is formed is opposed to the surface of the second substrate 3 on which the electrodes are formed.

  Here, when the switch 25 is turned on, a voltage is applied between the mold substrate 12 and the second substrate 3, and the silver particles 20 are applied by applying a voltage higher than the potential at which the silver particles 20 are charged. 20 moves onto the second substrate 3. A voltage is applied, an electric field is generated, and the silver particles 20 are attracted by the electric field, so that the silver particles 20 are transferred from the mold substrate 12 onto the second substrate 3. Here, a voltage of 3 kV is applied between the positive-side second substrate 3 and the negative-side mold substrate 12 by the transfer power source 24. After the voltage application, silver particles 20 are attached on the second substrate 3 in the same shape as the metal thin film 13 formed on the mold substrate 12. Thereafter, the second substrate 3 to which the silver particles 20 are adhered is baked at a temperature of 550 to 600 ° C., and the polyester coating film 19 that has covered the silver particles 20 is decomposed and removed. To fix. In this way, as shown in FIG. 7, the scan electrode 4 and the sustain electrode 5 having a desired shape are formed.

In the method of manufacturing a gas discharge display device in the plasma display 1, the metal thin film 13 having the same shape as the scan electrode 4 and the sustain electrode 5 formed on the second substrate 3 is formed on the mold substrate 12. Next, the portion excluding the metal thin film 13 on the mold substrate 12 is charged, and the silver particles 20 coated with the coating film 19 whose surface is charged are adhered on the metal thin film 13, and then the mold substrate 12 and the second substrate The silver substrate 20 is attached to the second substrate 3 by applying a voltage between the mold substrate 12 and the second substrate 3 with the two substrates 3 facing each other, and then the second substrate 3. Then, the scan electrode 4 and the sustain electrode 5 are formed on the second substrate 3.
By manufacturing the scan electrode 4 and the sustain electrode 5 in this way, it is not necessary to apply the silver paste over the entire second substrate 3, and it is not necessary to remove the silver paste in portions other than the electrodes. In addition, the amount of silver used is reduced. Moreover, the manufacturing process of the plasma display 1 is simplified. Further, it is not necessary to use any liquids such as paste, ink, and developer, and the entire manufacturing process can be performed in a gas phase environment.

  Thereby, the usage-amount of expensive silver can be reduced and the manufacturing cost of the plasma display 1 can be reduced. In addition, since the manufacturing process is simplified, the time required for manufacturing the electrode is shortened. Further, since all the electrode manufacturing processes can be performed in a gas phase environment, the electrode can be manufactured easily.

  In addition, when the silver particles 20 are deposited on the metal thin film 13 on the second substrate 3, the substrate 12 for mold is negatively charged by the scorotron 14 while the metal thin film 13 is grounded, and negatively charged by friction in advance. The silver particles 20 covered with the coating film 19 that has been applied are applied to the surface of the mold substrate 12 on which the metal thin film 13 is formed, and the silver particles 20 are attached only to the metal thin film 13.

  Thus, even when the silver particles 20 are applied over the entire mold substrate 12, the portion of the mold substrate 12 where the metal thin film 13 is not formed is negatively charged. The particles 20 repel each other at a portion where the metal thin film 13 is not formed, and the silver particles 20 do not adhere to the glass portion 15 on the second substrate 3, and the silver particles 20 adhere only on the metal thin film 13. Further, even if the silver particles 20 are applied to the entire mold substrate 12 by the application member 22, the silver particles 20 can be attached only on the metal thin film 13, so that the silver particles can be easily applied only on the metal thin film 13. 20 can be deposited.

  Moreover, the silver particle 20 has coat | covered the surface with the coating film 19 formed with polyester. Since the silver particles 20 are covered with the coating film 19 formed of the insulating resin polyester, the surface of the silver particles 20 can be negatively charged by friction. Therefore, the glass particles 15 of the mold substrate 12 charged negatively repel each other, and the silver particles 20 can be attached only on the metal thin film 13 in the mold substrate 12.

  Example 2 of the method for manufacturing a gas discharge display device according to the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the component same as FIG.6 and FIG.7, and description is abbreviate | omitted.

In the present embodiment, the address electrodes 9 are formed on the first substrate 2 of the plasma display 1 shown in FIG. The first substrate 2 is provided with barrier ribs 8 for forming the discharge cells 7, and the surface of the first substrate 2 on which the address electrodes 9 are formed is not flat but has a concave curved surface 7a.
In the first substrate 2, similarly to the formation of the electrode on the second substrate 3, a metal thin film 27 is formed in a desired shape on the mold substrate 26, and the glass portion 28 of the mold substrate 26 is made negative. The silver particles 20 that are charged and negatively charged in advance are applied over the entire surface of the mold substrate 28, and the silver particles 20 are deposited on the metal thin film 27. As shown in FIG. 8, a voltage is applied between the first substrate 2 and the mold substrate 26 for the silver particles 20 remaining on the metal thin film 27 to generate an electric field. By this electric field, the silver particles 20 on the metal thin film 27 are moved onto the first substrate 2. Then, as shown in FIG. 9, the address electrode 9 is formed in the concave curved surface 7 a on the first substrate 2.

  In the method for manufacturing a gas discharge display device according to the present embodiment, the electrodes are not pressed against the substrate, but the silver particles 20 are moved by an electric force to form the address electrodes 9. The address electrodes 9 can be easily formed even on the first substrate 2 having the curved surface 7a.

  In this embodiment, the silver particles 20 are used as the conductive particles to be deposited on the metal thin film 13. However, the conductive particles are not limited to the silver particles 20, and the conductive particles other than the silver particles 20 are used. For example, nickel particles or copper particles may be used. In particular, if the silver particles 20 are used, the coating film 19 can be easily removed by firing, and is less oxidized than nickel particles or copper particles, and can be fired in ordinary air. The particles 20 are desirable.

  Further, in this embodiment, the coating film 19 that covers the silver particles 20 is formed of polyester. The coating film may be formed of the insulating resin material.

  Further, the coating film 19 of the silver particles 20 is negatively charged by friction between the silver particles 20 generated by the rotation of the application member 22 and the supply member 23, but the silver particles 20 are placed on the mold substrate 12. If the coating film 19 of the silver particles 20 can be charged before coating, the silver particles 20 may be negatively charged by friction with the silver particles 20 in advance before storing the silver particles 20 in the container 21. Alternatively, the container 21 may be vibrated to give friction to the silver particles 20. Further, the silver particles 20 may be negatively charged using another means.

In this embodiment, the metal thin film 13 having the same shape as the electrodes formed on the first substrate 2 and the second substrate 3 is attached on the mold substrate 12. Any conductive material that can form a fine shape may be used. For example, chromium may be deposited and the metal thin film 13 may be formed into a predetermined shape by photolithography.
Further, the material of the mold substrate 12 may be an insulator or a dielectric, and a material having excellent durability is preferable.

It is a partial exploded perspective view which shows the plasma display of Example 1 of this invention. It is a top view which shows the type | mold board | substrate used for the manufacturing method of the gas discharge display apparatus of Example 1 which concerns on this invention. It is explanatory drawing which shows the manufacturing method of the gas discharge display apparatus of Example 1 which concerns on this invention. It is explanatory drawing which shows the manufacturing method of the gas discharge display apparatus of Example 1 which concerns on this invention. It is explanatory drawing which shows the manufacturing method of the gas discharge display apparatus of Example 1 which concerns on this invention. It is explanatory drawing which shows the manufacturing method of the gas discharge display apparatus of Example 1 which concerns on this invention. It is explanatory drawing which shows the manufacturing method of the gas discharge display apparatus of Example 1 which concerns on this invention. It is explanatory drawing which shows the manufacturing method of the gas discharge display apparatus of Example 2 which concerns on this invention. It is explanatory drawing which shows the manufacturing method of the gas discharge display apparatus of Example 2 which concerns on this invention. It is process drawing which shows an example of the manufacturing method of the conventional gas discharge display apparatus. It is process drawing which shows another example of the manufacturing method of the conventional gas discharge display apparatus.

Explanation of symbols

2 First substrate 3 Second substrate 4 Scan electrode 5 Sustain electrode 9 Address electrode 12 Type substrate 13 Metal thin film 19 Coating film 20 Silver particle 27 Metal thin film 28 Type substrate

Claims (3)

A method of forming an electrode on at least one of a pair of substrates disposed opposite to each other,
On a flat plate made of an insulator or dielectric, a conductive film having the same shape as the electrode formed on the substrate is formed,
Next, the portion excluding the conductive film of the flat plate is charged to attach conductive particles coated with an insulating film whose surface is charged on the conductive film,
Next, the flat plate and the substrate are opposed to each other, and a conductive particle adhered to the conductive film by applying a voltage between the flat plate and the substrate is attached to the substrate.
Next, the conductive particles are baked together with the substrate, and an electrode is formed on the substrate. When depositing the conductive particles on the conductive film,
2. The conductive particles are attached only to the conductive film by charging the flat plate in a state where the conductive film is grounded, and then applying the conductive particles on the flat plate. The manufacturing method of the gas discharge display apparatus of description. 3. The method of manufacturing a gas discharge display device according to claim 1, wherein the conductive particles coated with the insulating film are formed by coating the surfaces of metal particles with an insulating resin.

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