JP2005047212A - Ink jet head manufacturing method and ink jet head manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ink jet head manufacturing method which ensures application of an adhesive in a suitable amount to a suitable location during an adhesive step of ink jet head production, to thereby prevent degradation of the ejection performance of an ink jet head as a product and enhance manufacturing yield. <P>SOLUTION: According to the ink jet head manufacturing method, an upper surface of a channel wafer 200 forming a substrate 20 is cut away by dicing to form grooves 201 as ink chambers 26 therein at predetermined intervals, and thereafter the adhesive is applied to the upper surface by means of an adhesive applying device 60 having the ink jet head 2. Specifically a nozzle surface 2a of the ink jet head 2 is arranged above the upper surface of the channel wafer 200 at a predetermined vertical distance away from the same, and the channel wafer 200 is relatively moved in the horizontal plane with respect to the ink jet head 2, followed by driving the ink jet head 2, whereby the adhesive is ejected from nozzle holes 2b facing the upper surfaces of respective diaphragms 29 of the channel wafer 200. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an ink jet head manufacturing method and an ink jet head manufacturing apparatus for manufacturing an ink jet head used in an ink jet printer that forms an image by pressurizing ink in an ink chamber and discharging the ink onto a recording medium.

  As an inkjet head used in an inkjet printer, an electrode is formed on each of the opposing surfaces of a plurality of adjacent partition walls across a groove constituting the ink chamber, and the partition walls are formed by applying a drive pulse to the electrodes from an external drive circuit. There is one that is deformed and ejects ink in an ink chamber (see, for example, Patent Documents 1 and 2).

  A part of a conventional manufacturing method of such an ink jet head will be described with reference to FIGS. First, after laminating and curing a dry film resist on the upper surface 103a of the substrate 103 made of a piezoelectric element polarized in the thickness direction (vertical direction), the upper surface 103a is formed on the front surface 103b using a dicing blade of a dicer in a groove forming step. Half dicing is performed from the side toward the back surface 103c to form a plurality of groove portions 122 as ink chambers sandwiched between the partition walls 127. At this time, the dicing blade is raised at the intermediate portion between the front surface 103b and the back surface 103c of the substrate 103 to form a rounded portion 122a on the back surface side of the ink chamber 122, and only the dry film resist on the top surface 103a is cut to the back surface 103c. Thus, the flat portion 122b is formed.

  This dicing process is repeatedly performed with a predetermined gap in a direction parallel to the front surface 103 b and the back surface 103 c of the substrate 103 to form an ink chamber array on the substrate 103, and then the substrate 103 with respect to the longitudinal direction of the ink chamber 122. A metal to be an electrode material such as Al or Cu is deposited or sputtered obliquely from above. By performing this operation from two directions (indicated by arrows in the figure) facing each other across the ink chamber 122, the electrode 101 is formed on the facing surfaces of the partition walls 127 on both sides sandwiching the ink chamber 122.

  At this time, in the ink chamber 122, the electrode 101 is formed in the range from the upper end of the partition wall 127 to about ½ in the thickness direction by the shadowing effect of the dry film resist and the partition wall 126. Further, vapor deposition or sputtering of the electrode material from the oblique direction is simultaneously performed on the rounded portion 122a and the flat portion 122b of the ink chamber 122, but the metal film deposited or sputtered from the two left and right directions overlaps with the flat portion 122b. By setting the thickness and opening width of the dry film resist, an electrode (outdoor electrode 102) is formed on the entire surface in the flat portion 122b, and the electrode 101 in the ink chamber 122 and the outdoor portion of the flat portion 122b are formed in the round portion 122a. An electrode is formed in a state of connecting to the electrode 102.

  Thereafter, in the bonding step, a cover plate 123 having an ink supply part 124 for supplying ink into the ink chamber 122 is bonded to the upper surface 103 a of the substrate 103, and from the inside of the ink chamber 122 to the front surface 103 b of the substrate 103. By bonding a nozzle plate 125 having nozzles 126 through which ink ejected to the outside passes, the actuator 100 of the inkjet head is completed.

In the bonding process in the conventional inkjet head manufacturing method, an adhesive is applied to the upper surface 103a to which the cover plate 123 is bonded on the substrate 103 and the front surface 103b to which the nozzle plate 125 is bonded by a dispenser using a peristaltic pump or the like. After that, the cover plate 123 and the nozzle plate 125 are brought into pressure contact with the upper surface 103a and the front surface 103b of the substrate 103, respectively, so that the cover plate 123 and the nozzle plate 125 are bonded to the substrate 103 via an adhesive.
JP 08-222475 A JP 2002-178518 A

  However, in the conventional inkjet head manufacturing method, the adhesive is applied to the portion of the substrate to which the cover plate, nozzle plate, and the like are bonded by a dispenser using a peristaltic pump or the like, so that the amount and position of application are sufficiently accurate. Cannot be obtained, and the performance of the ink jet head is degraded.

  This is because in the inkjet head actuator, the amount and position of the adhesive used for bonding the cover plate, nozzle plate, and the like to the substrate greatly affect the performance of the inkjet head. That is, when the application amount of the adhesive is insufficient, the adhesive force is insufficient, and when the application amount is too large, damage due to a decrease in rigidity is likely to occur. In addition, if the application position of the adhesive is not appropriate, the presence of the cured adhesive hinders the flow of ink in the ink flow path such as in the ink chamber.

However, in a dispenser using a peristaltic pump or the like, the discharge amount of the adhesive can be adjusted only at about 10 nL (10 ⁻⁵ cm ³ ) and the discharge position is about 200 μm. It is difficult to apply an appropriate amount of adhesive at an appropriate position in an ink jet head adhering process that needs to be applied to the ink jet head.

  An object of the present invention is to apply an adhesive to an appropriate amount and an appropriate position by applying an adhesive using an ink jet head capable of accurately adjusting a discharge amount and a discharge position in an adhesion process at the time of manufacturing the ink jet head. An object of the present invention is to provide an ink jet head manufacturing method and apparatus capable of maintaining the coating state and preventing the deterioration of the performance of the ink jet head as a product and improving the yield.

  The present invention has the following configuration as means for solving the above problems.

(1) A cover plate constituting an ink supply unit for supplying ink into the ink chamber with respect to a substrate on which a groove as an ink chamber is formed, and a nozzle through which ink ejected from the ink chamber passes Including an adhesion step of adhering the nozzle plate formed with an adhesive,
The bonding step includes a step of causing the nozzle of the inkjet head containing the adhesive to face the bonding surface of the cover plate and the nozzle plate on the substrate and then driving the inkjet head to discharge the adhesive from the nozzle. It is characterized by that.

In this configuration, in the bonding process at the time of manufacturing the inkjet head, the discharge amount is generally 10 pL (10 ⁻⁸ cm ³ ) or less and the discharge position is accurately set to about 5 μm on the bonding surface of the cover plate and the nozzle plate on the substrate. Adhesive is discharged from the adjustable inkjet head. Accordingly, an appropriate amount of adhesive is accurately applied to a predetermined position on the bonding surface of the substrate.

(2) The adhesive contains an ultraviolet curable resin,
The bonding step includes a step of irradiating ultraviolet rays onto an adhesive surface of the cover plate and the nozzle plate on the substrate to which the adhesive is applied after discharging the adhesive from a nozzle of the inkjet head.

  In this configuration, in the bonding process at the time of manufacturing the inkjet head, the inkjet head capable of accurately adjusting the discharge amount and the discharge position is bonded to the inkjet head including an ultraviolet curable resin having a basic property of short-time curing, no solvent, and one liquid. After discharging the agent, the cover plate and the nozzle plate are bonded to predetermined positions of the substrate by irradiating with ultraviolet rays. Therefore, the adhesive to be applied to the bonding position of the cover plate and the nozzle plate on the substrate is maintained in an uncured state unless it is irradiated with ultraviolet rays, and the handling and storage of the adhesive becomes easy.

(3) The adhesive is a two-component adhesive composed of a main agent and a curing agent,
The bonding step includes a step of applying a main agent and a curing agent in this order to the bonding surfaces of the cover plate and the nozzle plate in the substrate.

  In this configuration, in the bonding process at the time of manufacturing the inkjet head, the two-part adhesive is discharged from the inkjet head capable of accurately adjusting the discharge amount and the discharge position, and the cover plate and the nozzle plate are bonded to predetermined positions on the substrate. Is done. Therefore, the adhesive to be applied to the bonding position of the cover plate and the nozzle plate on the substrate is maintained in an uncured state unless the main agent and the curing agent are mixed, and the handling and storage of the adhesive becomes easy.

  (4) In the bonding step, the main agent and the curing agent are discharged to the same position on the bonding surface of the cover plate and the nozzle plate on the substrate.

  In this configuration, in the bonding process when the inkjet head is manufactured, the curing agent is discharged from the inkjet head so as to overlap the main agent applied to the bonding surface of the cover plate and the nozzle plate in the substrate. Therefore, the curing agent is sufficiently mixed with the main agent by the ejection energy from the inkjet head, and the adhesive is cured.

  (5) The adhesive process includes applying a main agent from the first inkjet head to the bonding surface of the cover plate and the nozzle plate on the substrate, and applying a curing agent from the second inkjet head. And a process.

  In this configuration, the main component and the curing agent of the two-component adhesive are each discharged from the individual inkjet heads onto the cover plate and nozzle plate bonding surfaces of the substrate in the bonding process when manufacturing the inkjet head. Therefore, the main agent and the curing agent are reliably separated before being applied to the bonding position of the substrate, and the uncured state is maintained.

  (6) Out of the surface of the substrate on which the groove portion serving as the ink chamber is formed, the cover plate constituting the ink supply portion for supplying ink into the ink chamber and the ink ejected to the outside from the ink chamber pass. An ink jet head for discharging an adhesive from a nozzle is provided on a bonding surface to which a nozzle plate on which a nozzle is formed is bonded.

  In this configuration, in the bonding process when manufacturing the inkjet head, the adhesive is discharged from the inkjet head capable of accurately adjusting the discharge amount and the discharge position onto the bonding surface of the cover plate and the nozzle plate on the substrate. Accordingly, an appropriate amount of adhesive is accurately applied to a predetermined position on the bonding surface of the substrate.

  (7) The ink jet head includes a substrate made of a piezoelectric element that is deformed by application of a driving voltage.

  In this configuration, the adhesive is discharged by deformation of the substrate constituting the inkjet head. Therefore, it is not necessary to heat the adhesive when discharging from the inkjet head, and the adhesive is not cured or altered.

  (8) The ink jet head includes a heating unit that heats the adhesive in the ink chamber to a predetermined temperature.

  In this configuration, the adhesive discharged from the inkjet head is heated to a predetermined temperature in the ink chamber. Therefore, generally, the viscosity of the adhesive higher than that of the ink at normal temperature is lowered, and the dischargeability of the adhesive is improved.

  As described above, according to the present invention, the following effects can be obtained.

  (1) In the bonding process at the time of manufacturing the inkjet head, an appropriate amount of adhesion is achieved by discharging adhesive from the inkjet head whose discharge amount and discharge position can be accurately adjusted onto the bonding surface of the cover plate and nozzle plate on the substrate. The agent can be accurately applied to a predetermined position on the bonding surface of the substrate, and the discharge performance of the product inkjet head can be properly maintained to improve the yield.

  (2) In the bonding process at the time of manufacturing the inkjet head, an adhesive which is an ultraviolet curable resin having basic properties of short-time curing, solvent-free and one-component from an inkjet head capable of accurately adjusting the discharge amount and the discharge position. By discharging and bonding the cover plate and nozzle plate to a predetermined position on the substrate, the adhesive to be applied to the bonding position of the cover plate and nozzle plate on the substrate should remain uncured unless it is irradiated with ultraviolet rays. And the handling and storage of the adhesive can be facilitated.

  (3) In the bonding process when manufacturing the inkjet head, the cover plate and the nozzle plate are bonded to predetermined positions of the substrate by discharging the two-component adhesive from the inkjet head capable of accurately adjusting the discharge amount and the discharge position. Thus, the adhesive to be applied to the bonding position of the cover plate and the nozzle plate on the substrate can be maintained in an uncured state unless the main agent and the curing agent are mixed, and the handling and storage of the adhesive can be facilitated. it can.

  (4) In the bonding process at the time of manufacturing the inkjet head, the curing agent is discharged from the inkjet head by discharging the curing agent from the inkjet head over the main agent applied to the bonding surface of the cover plate and the nozzle plate in the substrate. Energy can mix well with the base agent, allowing the adhesive to cure quickly.

  (5) In the bonding process at the time of manufacturing the inkjet head, the main component and the curing agent of the two-component adhesive are each discharged from the individual inkjet head onto the bonding surface of the cover plate and the nozzle plate on the substrate, thereby bonding the substrate. The main agent and the curing agent can be reliably separated before being applied to the position, the uncured state can be maintained, and the handling and storage of the adhesive can be facilitated.

  (6) By discharging the adhesive by deformation of the substrate constituting the ink jet head, it is not necessary to heat the adhesive when discharging from the ink jet head, and curing or alteration of the adhesive can be prevented.

  (7) By heating the adhesive discharged from the inkjet head to a predetermined temperature in the ink chamber, the viscosity of the adhesive that is generally higher than that of the ink can be lowered at room temperature, and the product from the inkjet head that is the product Dischargeability can be improved.

  Embodiments of the present invention will be specifically described below with reference to the drawings. 1A to 1C are a rear cross-sectional view and a plan cross-sectional view (in FIG. 1A) showing a configuration of a main part of an ink jet head to which an electrode connection structure according to a first embodiment of the present invention is applied. It is XX section sectional drawing) and side sectional drawing (YY section sectional drawing in FIG. 1 (A)). In the inkjet head 1 according to this embodiment, a conductive resin 10 containing an Ag conductive filler is filled in each back portion of a groove-shaped ink chamber 26 formed in a plurality of substrates 20 made of PZT piezoelectric elements. The conductive resin 10 is exposed on the back side of the ink chamber 26.

  Each ink chamber 26 formed between the pair of partition walls 29 has a constant cross-sectional shape over the entire length in the longitudinal direction, which is the ink discharge direction, and electrodes 27 and 28 are formed on the side surfaces of the partition walls 29 facing each other. ing. The electrodes 27 and 28 facing each other are connected to the outer lead 42 of the driving IC 40 in a state of being electrically conducted via the conductive resin 10. A nozzle plate 25 in which nozzle holes 24 corresponding to the respective ink chambers 26 are formed is affixed to the front surface of the substrate 20, and a cover plate 30 that forms an ink supply unit 31 above the ink chamber 26 is disposed on the upper surface of the substrate 20. Is affixed.

  In this way, a drive voltage of the same potential is applied from the drive IC 40 to the electrodes 27 and 28 of the ink chamber 26 formed in an array on the substrate 20 via the conductive resin 10 and the outer lead 42, and adjacent to the electrodes 27 and 28. In the ink chamber 26, the opposite phase voltage is applied to the electrodes 27, 28 facing each other across the partition wall 29, so that the partition wall 29 is shear-deformed to control the ink pressure in the ink chamber 26. Ink is ejected from the nozzle hole 24 to the front side.

  FIG. 2 is a diagram for explaining a main part of the method of manufacturing the ink jet head. When the inkjet head 1 shown in FIG. 1 is manufactured, first, a dry film resist 70 is laminated and cured on the upper surface of a channel wafer 200 made of a piezoelectric element polarized in the thickness direction. The channel wafer 200 constitutes the substrate 20 in the inkjet head 1. Next, by using a dicer dicing blade, the upper surface of the channel wafer 200 is half-dieted at a constant pitch, thereby forming a plurality of groove portions 201 to be the ink chambers 26 as shown in FIG. At this time, the dicing width of the dicing blade should be larger than the particle size of the conductive filler contained in the conductive resin 10 to be filled later, and the conductivity containing the conductive filler having a diameter of 0.1 μm to 70 μm. When resin 10 is used, the dicing width is 70 μm or more.

  Thereafter, electrodes 27 and 28 are formed by evaporating or sputtering a metal serving as an electrode material such as Al or Cu from the diagonally upward direction indicated by the arrow in FIG. Lift off.

  Next, a liquid (uncured) conductive resin 10 having a width of 0.5 mm, for example, is applied from the upper surface of the substrate 20 in a direction orthogonal to the longitudinal direction of the groove that becomes the ink chamber 26 using a dispenser or the like. It adheres to the inside of 201 and the upper surface of the partition wall 29. Further, after removing the conductive resin 10 adhering to the upper surface of the ink chamber 29 using a rubber squeegee while filling the groove portion, the conductive resin 10 is cured by heating or the like as shown in FIG.

  Further, as shown in FIG. 3, an adhesive is applied to the upper surface of the channel wafer 200 by an adhesive application device (corresponding to the manufacturing device of the present invention) 60 provided with the inkjet head 2. At this time, the nozzle surface 2a of the ink jet head 2 of the adhesive application device 60 is disposed at a predetermined distance in the vertical direction with respect to the upper surface of the channel wafer 200, and the channel wafer 200 is located with respect to the ink jet head 2 in a horizontal plane. The ink jet head 2 is driven to discharge the adhesive so that the adhesive is discharged from the nozzle hole 2 b facing the upper surface of the partition wall 29 in the channel wafer 200. For example, the adhesive applicator 60 fixes a channel wafer 200 as a work on the upper surface and moves it in two directions orthogonal to each other in a horizontal plane, and an inkjet head 2 to fix the upper surface of the table. And a head fixing portion (not shown) that is movable in the vertical direction.

  When the adhesive is completely applied to the upper surfaces of all the partition walls 29 formed on the channel wafer 200, the cover wafer 300 on which the ink supply part 31 is formed is pressed against the upper surface of the channel wafer 200 by counterbore, thereby covering the cover wafer 300. Is bonded to the upper surface of the channel wafer 200 via an adhesive. The cover wafer 300 constitutes the cover plate 30 in the inkjet head 1. At this time, as shown in FIG. 2C, the channel wafer 200 is positioned so that the portion filled with the conductive resin 10 faces the central portion of the ink supply unit 31 formed on the cover wafer 300.

  Thereafter, dicing with a dicing blade is performed at a position indicated by a broken line in FIG. 2C, and the ink jet head 1 is divided into individual ink jet heads 1 (only the substrate 20 and the cover plate 30 at this time). 1, an adhesive is applied to one cut surface (front surface) where the conductive resin 10 is not exposed, as shown in FIG. At this time, the nozzle surface 2a of the ink jet head 2 of the adhesive application device 60 is disposed at a predetermined distance in the vertical direction with respect to the front surface of the ink jet head 1, and the ink jet head 1 is disposed with respect to the ink jet head 2 in a horizontal plane. The ink jet head 2 is driven to discharge the adhesive so that the adhesive is discharged from the nozzle holes 2b facing the front surface of the substrate 20 and the cover plate 30 in the ink jet head 1 by relatively moving.

  When the adhesive is completely applied to the entire front surface of the inkjet head 1, the nozzle plate 25 formed with a plurality of nozzles 24 is pressed against the front surface of the inkjet head 1, whereby the nozzle plate 25 is adhered to the front surface of the inkjet head 1. Glue through. At this time, each nozzle 24 of the nozzle plate 25 is positioned so as to be positioned between the two partition walls 29 in the arrangement direction of the plurality of partition walls 29 in the inkjet head 1.

  When the bonding process of bonding the cover plate 30 and the nozzle plate 25 to the substrate 20 of the inkjet head 1 via an adhesive is completed, the driving IC 40 is applied to the conductive resin 10 exposed on the other cut surface of the inkjet head 1. The outer lead 42 is electrically connected.

  As described above, in the bonding process of bonding the cover plate 30 and the nozzle plate 25 to the substrate 20 of the inkjet head 1, the adhesive application device is applied to the upper surface and the front surface of the substrate 20 of the inkjet head 1 and the front surface of the cover plate 30. The adhesive is applied using 60 inkjet heads 2. The ink jet head 2 of the adhesive application device 60 is an ink jet head used in an ink jet printer. In general, the ink discharge amount can be adjusted by about 10 pL, and the ink discharge position can be adjusted by about 5 μm.

  Therefore, the amount and position of the adhesive used for bonding the cover plate 30 and the nozzle plate 25 to the substrate 20 have a great influence on the ink ejection performance, and an extremely small amount of a predetermined amount of adhesive is applied in a very small range. In the inkjet head 1 that needs to be performed, an appropriate amount of adhesive can be applied to an appropriate position, and the yield can be improved by preventing the ejection performance of the inkjet head 1 from being deteriorated.

  As the adhesive, a two-component adhesive composed of a main agent and a curing agent can be used. In this case, as shown in FIG. 5, the adhesive application device 60 includes a first inkjet head 2 </ b> A that discharges the main agent and a second inkjet head 2 </ b> B that discharges the curing agent, from the first inkjet head 2 </ b> A. After the main agent is discharged toward a predetermined adhesion portion of the channel wafer 200 (or the ink jet head 1), the first ink jet head 2B is directed to a position where the main agent is applied on the channel wafer 200 (or the ink jet head 1). Discharge the curing agent. The main agent and the curing agent are sufficiently mixed by the ejection force of the curing agent to obtain a predetermined adhesive force, and before being applied to the channel wafer 200 (or the inkjet head 1), the adhesive in the adhesive application device 60. Does not harden, and handling and storage of the adhesive becomes easy.

  An adhesive containing an ultraviolet curable resin can also be used as the adhesive. In this case, the adhesive application device 60 includes ultraviolet irradiation means for irradiating the inkjet head 1 with the ultraviolet light after the adhesive is applied, and the cover plate 30 and the nozzle plate 25 are made of an ultraviolet transmissive material. . After an adhesive containing an ultraviolet curable resin is discharged from the inkjet head 2 of the adhesive application device 60 to a predetermined position on the substrate 20 and the cover plate 30 of the inkjet head 1, the inkjet head is out of the range of ultraviolet irradiation by the ultraviolet irradiation means. 2 is retracted, and ultraviolet rays are irradiated from the ultraviolet irradiation means to the substrate 20 of the inkjet head 1 in which the cover plate 30 and the nozzle plate 25 are pressed. The cover plate 30 and the nozzle plate 25 are instantaneously bonded to the substrate by the irradiation of ultraviolet rays, and the adhesive is not cured in the adhesive application device 60, so that the adhesive can be easily handled and stored.

  Furthermore, the inkjet head 2 included in the adhesive application device 60 uses an inkjet head that discharges ink by deformation generated in the piezoelectric element by applying a driving voltage to the electrodes, as in the inkjet head 1. As a result, the adhesive before being discharged to the inkjet head 1 is not heated in the inkjet head 2, and the adhesive is not cured or altered.

  In addition, as shown in FIG. 6, the adhesive application device 60 includes a heating unit 61 and a temperature detection unit 62, and the temperature detected by the temperature detection unit 62 is the viscosity of the adhesive stored in the ink chamber of the inkjet head 2. The heating means 61 may be driven and controlled by the control means 63 so that the temperature reaches a predetermined temperature that reduces the viscosity of the ink to the ink viscosity. As a result, the adhesive can be discharged by the same control as when the ink is discharged from the inkjet head 2.

It is the back sectional view, plane sectional view, and side sectional view showing the composition of the principal part of the ink jet head manufactured by the manufacturing method of this invention. It is a figure explaining the principal part of the manufacturing method of the said inkjet head. It is a perspective view explaining the process of discharging the adhesive agent at the time of the adhesion process which adhere | attaches a cover plate on the board | substrate of the said inkjet head. It is a perspective view explaining the process of discharging the adhesive agent at the time of the adhesion process which adhere | attaches a nozzle plate on the board | substrate of the said inkjet head. It is a perspective view explaining the process of discharging the adhesive agent in the manufacturing method concerning another embodiment of this invention. It is a figure which shows the structure of the manufacturing apparatus which concerns on another embodiment of this invention. It is side surface sectional drawing which shows the example of the structure of the conventional inkjet head. It is a perspective view which shows the principal part of the manufacturing method of the conventional inkjet head.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 2 Inkjet head 10 Conductive resin 20 Substrate 24 Nozzle hole 25 Nozzle plate 26 Ink chamber 27 Electrode 28 Electrode 29 Partition 30 Cover plate 31 Ink supply part 60 Adhesive coating device 200 Channel wafer

Claims (8)

A cover plate constituting an ink supply unit for supplying ink into the ink chamber and a nozzle through which ink ejected from the ink chamber passes are formed on the substrate on which the groove portion as the ink chamber is formed. Including a bonding step of bonding the nozzle plate via an adhesive;
The bonding step includes a step of causing the nozzle of the inkjet head containing the adhesive to face the bonding surface of the cover plate and the nozzle plate on the substrate and then driving the inkjet head to discharge the adhesive from the nozzle. Inkjet head manufacturing method. The adhesive contains an ultraviolet curable resin,
2. The method according to claim 1, wherein the bonding step includes a step of irradiating ultraviolet rays onto an adhesive surface of the cover plate and the nozzle plate on the substrate to which the adhesive is applied after discharging the adhesive from a nozzle of the inkjet head. Inkjet head manufacturing method. The adhesive is a two-component adhesive composed of a main agent and a curing agent,
The inkjet head manufacturing method according to claim 1, wherein the bonding step includes a step of applying a main agent and a curing agent in this order to bonding surfaces of the cover plate and the nozzle plate in the substrate.   The inkjet head manufacturing method according to claim 3, wherein in the bonding step, the main agent and the curing agent are discharged to the same position on the bonding surface of the cover plate and the nozzle plate on the substrate.   The adhesive step is a step of applying a main agent from a first inkjet head to a bonding surface of the cover plate and the nozzle plate in the substrate; and a step of applying a curing agent from a second inkjet head; The inkjet head manufacturing method of Claim 3 containing this.   A cover plate that forms an ink supply unit for supplying ink into the ink chamber and a nozzle through which ink ejected from the ink chamber passes is formed on the surface of the substrate on which the groove serving as the ink chamber is formed. An inkjet head manufacturing apparatus comprising an inkjet head that discharges an adhesive from a nozzle to an adhesive surface to which the nozzle plate is adhered.   The inkjet head manufacturing apparatus according to claim 6, wherein the inkjet head includes a substrate made of a piezoelectric element that deforms when a driving voltage is applied.   The inkjet head manufacturing apparatus according to claim 6, wherein the inkjet head includes a heating unit that heats the adhesive in the ink chamber to a predetermined temperature.

Images