JP2005045196A - Water-cooled heat sink and water-cooled unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a water-cooled heat sink in which water can be cooled efficiently by supplying water into the diffusion bonded heat sink, and to provide a water-cooled unit in which a single heat sink or electronic component can be cooled or a plurality of heat sinks or electronic components can be cooled simultaneously. <P>SOLUTION: In the heat sink where a substrate 3a is interposed between fins 2a and 2a, interface is eliminated by diffusion bonding, and the fins and a base mount are bonded integrally, water channels are bored in the fins and the substrate and a horse coupling 4 is provided on one side face of the base mount 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a water-cooled heat sink and a water-cooled unit having a high cooling capacity.

  Conventional techniques include a base plate, a pan-shaped casing having a flat bottom in which an opening is closed by the base plate and a flat cooling water flow path is formed inside, and the flow path is separated from each other in the flow path. A pair of cooling water inlets and outlets, inner fins installed in the flow path and bent in a waveform that matches the height of the flow path, and an intermediate position between the pair of cooling water inlets and outlets. And a multi-pass partition plate whose height matches that of the flow path, and the inner fin has a wave ridge line direction arranged parallel to the partition plate and a wave traveling direction. And the interior of the casing is substantially equal to the inner width of the casing, and at least a part of the partition plate is inserted into the wave trough or top of the inner fin. Fin there is a braze joint has been cold heat sink to each other. (See Patent Document 1)

  JP 2002-170915 A (Claim 1, FIG. 1, FIG. 2)

  In the above conventional technology, cooling water is brought into contact with continuous inner fins to cool electronic components and the like. However, the cooling capacity is low due to its structure and it can be used for simple ones, but it cools quickly. In addition, it is not suitable for cooling a plurality of electronic components or the like at a time.

The present invention has been made in view of the above problems, and provides a water-cooled heat sink that can cool water efficiently by allowing water to flow into a heat sink by diffusion bonding or the like. A water-cooled unit capable of cooling a plurality of heat sinks and electronic components is provided.
In addition, when using a Peltier element directly for CPU cooling in a personal computer, etc., there is a risk of moisture in the air condensing near the cooling part due to the temperature difference from room temperature, which may cause short circuit of surrounding wiring. Development of a cooling device for this purpose is desired.

As a means for solving the problem, in the heat sink in which the base is interposed between the fins and the interface is eliminated by diffusion bonding or the like, and the fin and the base are integrally joined, water is supplied to the fin and the base. Make a water passage hole to pass through, and provide a hose joint for connecting the hose to one side of the base. At least two water channel holes are provided in each of the fin and the base material, and no water channel hole is provided in the last fin and / or base material. A water-cooled heat sink, wherein a connection hole for connecting a water channel hole is provided in a fin and / or a base material.
A water-cooled unit comprising a water channel plate provided with a water channel and a water channel and a water channel, and an upper plate and a lower plate fixed to the upper and lower surfaces of the water channel plate.
Furthermore, a first block provided with a water inlet channel and a pump inlet, a second block provided with a channel and a pump outlet, a third block provided with a channel, a channel and a water outlet channel A Peltier element, a heat sink, and a fan are provided on the upper surface of a water-cooled unit body that is integrally fixed by brazing or diffusion bonding to the fourth block that is provided. Provide a plurality of inlet and outlet channels. Provide connecting plates between each block and on the upper and lower surfaces. A water-cooled unit comprising a pump attached to a pump inlet and a pump outlet.

1) In a water-cooled heat sink, water (air) can be cooled with good efficiency (heat conduction efficiency) by flowing water (air) into the heat sink by diffusion bonding or the like.
2) Processing is simple and easy, and can be manufactured at low cost.
3) In the water-cooled unit, it can be used alone, and at the same time, a plurality of heat sinks (electronic parts, etc.) can be cooled.
4) In particular, when cooling a CPU in a personal computer or the like, an external cooling device can be constructed by combining a Peltier element, a heat sink, and a fan.
5) Cooling temperature can be controlled by controlling the pump.
6) It has an effect on heat generation not only for personal computers but also for small devices and has a wide range of applications.

First, the water-cooled heat sink of the present invention will be described.
The water-cooled heat sink 1 has a copper base 3a having a thickness of about 1 mm interposed between fins 2a --- a copper plate having a thickness of 0.01 mm to 1 mm (or comb-like if necessary). The fin 2a is formed with a water passage hole 2b through which two water passes, and the fin 2a1 is provided with a long hole-like connecting hole 2c. The base material 3a is formed with two water channel holes 3b corresponding to the water channel holes 2b, and the base material 3a1 at the rearmost portion is not provided with a water channel hole.
Moreover, the hose coupling 4 for connecting a hose to the one side (frontmost part) of the base 3 is provided in two places.

  The water-cooled heat sink 1 is filled with water from one hose joint 4, passes through the water passage hole 2 b of the fin 2 a and the water passage hole 3 b of the base material 3 a, and passes from the other hose joint 4 via the long hole-like connection hole 2 c. Water is cooled by discharging water, and the CPU of the personal computer is cooled by water cooling.

Next, the water-cooled unit of the present invention will be described.
The water-cooled unit 11 forms a flow channel 11a1 with a substantially H-shaped groove, and is fixed to the water channel plate 11a provided with a water inlet channel 11a2 and a water outlet channel 11a3 by diffusion bonding or the like on the upper and lower surfaces of the water channel plate 11a. It consists of a flat upper plate 11b and a lower plate 11c.

The test data of the water-cooled unit 11 will be described below.
As test conditions, the incoming water flow rate was 1 l / min, the shape of the water-cooled unit 11 was 4 mm × 60 mm × 60 mm for the water channel plate 11 a, and 2 mm × 60 mm × 60 mm for the upper plate 11 b and the lower plate 11 c.
As other conditions, the cooling water temperature was 21.79 ° C., the temperature inside the pelger was 23.12 ° C., the junction temperature was 25.66 ° C., and the heating value of the heater was 10.77 W.
As a result of the test, the heat sink thermal resistance value was 0.25 ° C./W, which was a very good result.

The material is preferably copper or aluminum (aluminum grat material).
The upgraded water-cooled unit 11 is the following water-cooled unit 21.

The water-cooled unit 21 connects the four water inlet channels 5a to one at the rear, the first block 5 formed by projecting a pump water inlet 5b, the channel 6a formed in the shape of a plane 5, and the pump. A second block 6 having a water outlet 6b protruding therefrom, a third block 7 having a through hole 7b formed in a flow path 7a formed in a plane 5 shape, and a plane inverted U-shaped through hole 8b. And a fourth block 8 provided with four outlet channels 8c. A flat plate is connected to the upper surface (the upper surface of the fourth block 8) and the lower surface (the lower surface of the first block 5). The plates 9 and 10 are provided, a similar connecting plate 11 is provided between the first block 5 and the second block 6, and a connecting hole 12 a is formed between the second block 6 and the third block 7. A communication hole 13a is similarly formed between the third block 7 and the fourth block 8. The top surface of the coupling plate 9 of the water-cooled unit body 14 formed by providing a plate 13, respectively, the Peltier element PE, the heat sink HS on its upper surface are a fan F is provided on its upper surface.
The material of each block and each connecting plate is copper or aluminum (aluminum grat material), and is joined by diffusion bonding or brazing.
Moreover, the pump P is attached to the pump inlet 5b and the pump outlet 6b.

A usage example of the water-cooled unit 21 will be described below.
The hose H is inserted into the four water inlet channels 5 a of the water-cooled unit 21.
Subsequently, the hose H1 is inserted into the four outlet channels 8c.
In this state, by operating the pump P, water M enters from the hose H, enters the pump P from the pump inlet 5b through the respective inlet channels 5a, and the water discharged from the pump outlet 6b passes through the channels. It passes through 6a, passes through the communication hole 12a, passes through the flow path 7a, passes through the communication hole 13a, passes through the flow path 8a and the four outlet channels 8c, and is discharged from the hose H1.
At this time, the water M (heated) is cooled by the Peltier element PE, and the heat generated when it is cooled can be dissipated by the heat sink HS, and the heat dissipation efficiency can be further increased by the fan F.
That is, the heated heat in the water-cooled unit main body 14 can be efficiently cooled.
As an effective use example of this water-cooled unit 21, the water-cooled unit 21 is installed outside a personal computer (not shown), and the respective hoses H and H1 --- are connected to the hose joint 4 of the water-cooled heat sink 1. Mounting (in the case of this embodiment, four water-cooled heat sinks 1 are mounted) The water-cooled heat sink 1 provided on four personal computers can be cooled (CPU, etc.), and a conventional Peltier element is used. As compared with the method of cooling the CPU or the like, it can be used safely without problems such as condensation.

In the water-cooled heat sink in the above embodiment, the number of fins, the shape of the water channel, and the number of water channel holes are not particularly limited and may be determined as necessary.
In the water-cooled unit, the number of blocks, the number of inlet and outlet channels, and the like may be determined as necessary, and can be applied to a coolant other than water or an air-cooling method.
A temperature control device may be provided as necessary to set the cooling temperature of the water-cooled heat sink.
Further, in addition to diffusion bonding, brazing, soldering, and the like can be considered, and may be set as necessary.

  The front view of the water cooling type heat sink of this invention.   The structure perspective view before the assembly of the water cooling type heat sink of this invention.   The top view of the water cooling type heat sink of this invention.   The principal part structure perspective view before the assembly which shows the 1st Example of the water-cooling type unit of this invention.   The side view which shows 1st Example of the water-cooled unit of this invention.   The principal part structure perspective view before the assembly which shows 2nd Example of the water-cooled unit of this invention.   The use condition figure which shows the 2nd Example of the water-cooled unit of this invention.

Explanation of symbols

1 --- Water-cooled heat sink 2a--Fin 3a--Base material 3 --- Base 4 --- Hose joint 21--Water-cooled unit 14--Water-cooled unit body PE--Peltier element HS--Heat sink F --- Fan

Claims (8)

  In the heat sink formed by interposing the base material between the fins, the interface is lost by diffusion bonding, etc., and the fin and the base are integrally joined, the water passage hole through which water passes through the fin and the base material is formed, A water-cooled heat sink comprising a hose joint for joining a hose to one side of a base.   2. The water cooling system according to claim 1, wherein at least two water channel holes are provided in each of the fin and the base material, and no water channel hole is provided in the last fin and / or base material. heatsink.   The water-cooled heat sink according to claim 1 or 2, wherein a connecting hole for connecting the water channel hole is provided in the fin and / or the base material.   A water-cooled unit comprising a water channel plate provided with a water channel and a water channel and a water channel, and an upper plate and a lower plate fixed to the upper and lower surfaces of the water channel plate.   A first block provided with an inlet channel and a pump inlet, a second block provided with a channel and a pump outlet, a third block provided with a channel, and a channel and an outlet channel provided A water-cooled unit comprising a Peltier element, a heat sink, and a fan provided on the upper surface of a water-cooled unit body integrally fixed to the fourth block by brazing or diffusion bonding.   6. The water-cooled unit according to claim 5, wherein a plurality of water inlet channels and water outlet channels are provided.   The water-cooled unit according to claim 5 or 6, wherein a connecting plate is provided between each block and on an upper surface and a lower surface.   The water-cooled unit according to claim 5, 6 or 7, wherein a pump is attached to the pump inlet and the pump outlet.

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