JP2005043257A - Inspection analysis method and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To receive an inspection analysis sample from a plurality of users (customers), and to provide safely and efficiently inspection analysis data to respective users, in order to break down cost increase, with a background wherein various inspection analysis devices are introduced continuously hitherto in accordance with a miniaturization level of an integrated circuit or an application material process, and this tendency causes the cost increase in development and manufacture of a semiconductor integrated circuit device. <P>SOLUTION: User authentication is performed by using a communication means such as computers on the plurality of user sides separated geographically and Internet by a person on the inspection analysis device side, to thereby insure security. Then, the inspection analysis data are provided safely and efficiently to the inspection analysis device by remote control by each user, or by control by an inspection analysis recipe by the user, or by encryption of output data of the inspection analysis. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

Inspection and analysis devices such as scanning electron microscopes (SEM) and confocal laser microscopes used in inspection and analysis processes such as development and manufacture of semiconductor integrated circuit devices, image sensors, and display devices are distributed to multiple users who are geographically separated. On the other hand, the present invention relates to a test analysis technique that ensures security and efficiently provides test analysis data of a user sample to a user.

With the progress of miniaturization and high integration of semiconductor integrated circuits, the development and manufacture of semiconductor integrated circuits has become difficult year by year. In order to efficiently develop and manufacture semiconductor integrated circuits, the importance of inspection analysis of semiconductor wafers and semiconductor chips on which integrated circuits are formed is increasing.

  For inspection and analysis of semiconductor wafers and semiconductor chips, for example, inspection and analysis of a desired location on a sample is performed by irradiating an electron beam to detect at least one of secondary electrons, scattered electrons, and transmitted electrons. It has been broken. In the case of inspection analysis of a portion below the surface, which is not the surface of a semiconductor wafer or semiconductor chip, the ion beam that has been narrowed down is irradiated under specific conditions to expose the inspection analysis portion, and then, Inspection analysis has been conducted.

In inspection analysis of semiconductor wafers, semiconductor chips, etc., if the performance of the sample to be inspected / analyzed does not match the performance of the inspection / analysis apparatus, the inspection / analysis is not effective at all. For this reason, inspection analysis apparatuses using these laser beams, electron beams, and the like have been required to have high performance of inspection analysis in accordance with miniaturization and high integration of semiconductor integrated circuits that are inspection analysis targets. .
Further, in the inspection analysis of semiconductor wafers and semiconductor chips, not only the analysis results but also what to analyze is an important confidential matter for competing semiconductor manufacturers including the analysis target. For this reason, semiconductor manufacturers have been purchasing inspection analyzers individually in accordance with semiconductor device generations.

Inspection analyzers have become more expensive to recover technology development and device manufacturing costs to obtain higher inspection analysis performance. In addition to the operation of various types of inspection and analysis equipment according to the purpose, semiconductor integrated circuit devices that are subject to inspection and analysis are becoming increasingly miniaturized and highly integrated, and experts who are familiar with semiconductor manufacturing process materials are required. As a result, labor costs are increasing.
For this reason, in the inspection and analysis of semiconductor wafers and semiconductor chips, the cost increases remarkably, which causes an increase in development and manufacturing costs of semiconductor integrated circuit devices.

As an example, the basic principle and configuration of an inspection analysis scanning electron microscope (SEM) used in the manufacturing process of a semiconductor wafer, a semiconductor chip, and the like will be described with reference to FIG.
A control program for proceeding with inspection analysis in order by sequence processing is stored in 17, and the control computer 20 controls the electron beam optical system and the XY stage system according to the control program.

  Once the semiconductor wafer to be inspected is mounted on the SEM, it is moved to the XY drive stage via the preparation chamber 15 for evacuation. The control computer 20 designates an acceleration voltage, a beam scanning range, and the like of the electron beam through the control interface 18 of the electron beam optical system, and controls the stage driving unit 13 through the control interface 14 of the XY stage system. . The semiconductor wafer is mounted on the XY stage 12, moved to a desired position on the XY plane, and inspection analysis is performed.

  In order to move to a desired position on the semiconductor wafer, pre-alignment processing for aligning the wafer direction with reference to an orientation flat or notch processed on the wafer, an XY stage position coordinate system, and a pattern position coordinate system in the wafer An alignment process for correction is performed. In order to automate these processes, it is necessary to fix a wafer size as a sample and form an alignment mark at a predetermined position on the sample.

After moving to a desired position on the semiconductor wafer, inspection analysis is performed according to the following flow.
After being accelerated, the electron beam 2 emitted from the electron gun 3 is narrowed down by the converging lens 4 and the objective lens 6 and focused on the surface of the semiconductor wafer 1 as a sample. At the same time, the electron beam 2 is bent in its orbit by the deflector 5 and scans the wafer surface two-dimensionally or one-dimensionally. On the other hand, secondary electrons 8 are emitted from the wafer portion irradiated with the electron beam as a result of the interaction between the electron beam and the wafer material.

The secondary electrons 8 are converted into detection / electrical signals by the secondary electron detector 9 and then subjected to signal processing such as A / D conversion in the signal processing unit 10. The output data signal subjected to signal processing is stored in the memory unit 16. The stored output data signal is used for luminance modulation or Y modulation of the monitor 21. The monitor 21 is scanned in synchronization with the scanning of the electron beam 2 on the wafer surface, whereby an enlarged sample image is formed on the monitor 21. If a very narrow area on the sample wafer is two-dimensionally scanned with an electron beam and brightness modulation is applied, a sample image magnified about 10,000 times can be easily obtained. Pattern defect inspection is performed using the enlarged sample image. While combining electron beam scanning and stage movement, the entire surface of the required inspection area on the wafer is raster scanned, and the formed sample image is stored in the memory unit 16. The stored sample image is similarly compared with the reference sample image stored in the memory unit, and a difference portion between the two images is detected as a defect. As the reference sample image used at this time, generally, a sample image of the same component of the chip or cell inspected immediately before is used.

By performing one-dimensional scanning on the sample wafer and applying Y modulation, pattern profile data corresponding to the step and material on the wafer can be obtained. The formed sample image and pattern profile data are used for circuit pattern shape and dimension measurement inspection formed on the wafer. The pattern dimension is determined by scanning the electron beam one-dimensionally across the measurement pattern in the measurement direction, determining the pattern edge from the obtained pattern profile according to a predetermined pattern edge determination algorithm, and measuring the pattern pattern from the obtained pattern edge interval. Are measured.

Regarding the scanning electron microscope (SEM), with respect to the resolution, which is its main performance, so far, it has been possible to reduce the position variation of the electron beam scanning that can be bent by the deflector 5, to narrow the electron beam itself, It has been implemented to suppress the charge-up of the sample to be analyzed.
High acceleration voltage SEM and low acceleration voltage SEM have been used according to the circuit pattern formed on the semiconductor wafer, and appearance inspection SEM and dimension measurement SEM have been used according to inspection items.
JP-A-8-212141

To efficiently develop and manufacture semiconductor integrated circuits, inspection and analysis of semiconductor chips and semiconductor wafers on which integrated circuits are formed must cause the following problems as circuit patterns become finer and higher integrated. The inventor found.
That is, since the progress of miniaturization and high integration of circuit patterns is fast, the development of advanced semiconductor integrated circuit devices requires a minimum pattern dimension of 0.1 microns or less, for example, an SEM having high resolution performance suitable for it. However, the frequency of use does not increase compared to mass production. This means that if an SEM with this performance is introduced at the time of development, the device will not be used efficiently. As a result, the development cost of a new semiconductor integrated circuit increases.

  In addition, since the market size of inspection analyzers is small, inspection analyzer development costs are high, and as a result, inspection analyzers such as SEM are expensive. Even general researchers, development engineers, and small and medium-sized enterprise manufacturers who cannot have such a test analysis device have a problem that users who cannot use the test analysis device cannot use it.

An object of the present invention is to provide a technique capable of efficiently performing inspection analysis at a low cost in an inspection analysis process used for efficiently developing and manufacturing a semiconductor integrated circuit device and the like.
Another object of the present invention is to provide a test analyzer for efficiently performing test analysis.
In addition, another object of the present invention is that a researcher, a development engineer, and a small and medium enterprise manufacturer who do not have a test analyzer can use a computer network to connect each test analyzer individually, regardless of the contract. The object is to provide a technology that enables individual use in secret to the user.
The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.
That is, the present invention receives a test analysis sample from a user who wishes to perform test analysis, performs test analysis of the sample according to the user's test analysis recipe, and provides test analysis data to the user quickly using communication network means. . For example, it is undertaken to inspect and analyze semiconductor wafers from multiple semiconductor manufacturers in a competitive relationship, and it is no longer necessary for each semiconductor manufacturer to individually introduce equipment with the progress of miniaturization of integrated circuits and the introduction of new processes. This reduces the cost required for inspection analysis. In other words, even if there is a charge, an open lab is realized in which the cost of inspection analysis is greatly reduced compared to the prior art.

In the above-described inspection analysis, a security ensuring means is provided for each of the administrator side and the inspection analysis user side of the inspection analysis apparatus. Conventionally, if the introduction information of a specific test analyzer is known, the technological development trend of competing manufacturers can be predicted to some extent. By ensuring the security described above, it is not known to competing manufacturers that the inspection analysis of the present invention has been performed. If the frequency of use is low, it is not necessary to introduce a special inspection analyzer for each individual user.

The administrator of the inspection analyzer uses the user guide server connected to the Internet to check with the user, including the method for processing the inspection analysis fee, for the user who wants the inspection analysis, and then register the user ID And issue a password. User authentication is performed using the user ID and password in a user authentication server different from the user guide server. By completely separating the user authentication server from the user guide server, attacks on this system from third parties were prevented. If the user authentication is not passed, the user is not a true user, and the existence of the test analyzer connected to the user authentication server is unknown.
A user who is OK in the user authentication can perform real-time control of the designated inspection analyzer or control according to a user-created recipe by the user computer.

The test analysis apparatus of the present invention is provided with a function that allows a user to have a decryption key for automatically encrypted data in addition to being controllable from another network-connected computer. Here, the encryption indicates that the output data of the inspection analysis is converted according to some rules and converted into data that does not know what the third party means as it is. Decryption indicates that the original output data before encryption can be restored by some rule (which may not be the same as the first rule).

In the inspection analysis, the inspection analysis user inputs the inspection analysis recipe designated by encryption to be added to the output data of the inspection analysis in addition to the inspection analysis sample.
The administrator side of the test analysis apparatus manages the individual test analysis data so that the test analysis apparatus maintains a predetermined performance without being involved. As a result, the administrator of the inspection / analysis apparatus only needs to be able to maintain and manage the performance of the inspection / analysis apparatus. Can be reduced.

In order to smoothly proceed with the present invention, it is necessary to present the guidance including the contents of the inspection analysis service and the processing cost corresponding thereto on the Internet or the like and inform the user well. In addition, the administrator side of the test analysis apparatus needs to inform the user that user authentication is to be performed in order to ensure security when the test analysis user remotely operates the test analysis apparatus via a communication network.
Further, it is necessary to load the test analysis sample received from the user side into the test analysis apparatus and notify the user of the test analysis conditions so that the desired test analysis can be performed.

To implement the present invention as a business in order to restrict the contractor on the inspection analysis device manager side from disclosing confidential information related to the user inspection analysis to a third party during the inspection analysis process, the inspection analysis device A confidentiality agreement between the contractor and the user on the manager side is necessary.

The user needs to remotely operate the inspection analyzer of this case in real time by a user side computer including encryption designation, or send pre-created operation recipe data including encryption designation to the inspection analyzer. is there. The encryption designation is a key for the user side to restore the encrypted data, and is necessary for ensuring the security of the test analysis data obtained as a result of the test analysis process.

  In the inspection analysis of the present invention, the sample surface is irradiated with a finely focused laser beam to detect at least one of the reflected light, scattered light, and transmitted light, or the electron beam is irradiated to form secondary electrons and scattered electrons. The desired location on the sample is analyzed by detecting at least one of the transmitted electrons.

  The inspection analysis method of the present invention allows a plurality of users to use an inspection analyzer in a remote location in common, and can easily determine the inspection analysis location when the inspection analysis sample is attached to the inspection analyzer. As described above, the optical image of the inspection analysis sample or the analysis position coordinate information on the inspection analysis sample (position information of the drive stage coordinate system holding the analysis sample) is provided to the user side.

According to the present invention, for a plurality of users who desire inspection analysis, it is possible for the user to efficiently perform inspection analysis of a user sample without investing individually for introducing an inspection analyzer.
Further, it is important for a user who wishes to inspect and analyze a sample or the like on which a semiconductor integrated circuit is formed to ensure security, and this can be realized by the present invention.
In addition, the labor cost can be reduced by dividing the roles of the management expert of the inspection analyzer and the expert who is familiar with the manufacturing process of the sample to be subjected to the inspection analysis, for example, the semiconductor integrated circuit.
The state-owned property such as inspection and analysis equipment in public facilities is widely open to the public and can be shared, and the investment efficiency of inspection and analysis equipment such as universities can be improved.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted.
In the embodiment of the present invention, a semiconductor wafer is a silicon or other semiconductor single crystal substrate (generally substantially circular) used for manufacturing a semiconductor integrated circuit device, a sapphire substrate, a glass substrate, or other insulation, anti-insulation, or semiconductor substrate. In addition, an integrated circuit is formed by forming an insulating layer, an epitaxial semiconductor layer, another semiconductor layer, a wiring layer, and the like. In addition, the semiconductor chip includes a chip divided from a semiconductor wafer into individual semiconductor integrated circuit devices and a chip mounted on a package. The object of the inspection analysis in this case is not limited to the semiconductor wafer and the semiconductor chip, but the inspection analysis object will be described as a semiconductor wafer for convenience of explanation below.

(Embodiment 1)
The present inventor has the following viewpoints for the purpose of efficiently performing inspection analysis for use in development and manufacture of a semiconductor integrated circuit device at a low cost as the semiconductor integrated circuit is miniaturized and highly integrated. The solution was examined.
As a premise, inspection analysis samples are received from an unspecified number of users (customers) and the inspection analysis is efficiently performed. Here, in the inspection analysis, the user side determines the condition setting of the inspection analysis according to the semiconductor manufacturing, and is provided as a user's inspection analysis recipe. In other words, the administrator side of the test analyzer presents the case of the test analysis technology established so far to the user who is not familiar with this, but does not need to be familiar with the contents of the individual sample of the user. Assumed. As a result, the inspection analyzer can be efficiently operated. In addition, output data of inspection analysis results is provided to a user who desires inspection analysis via a communication line such as the Internet in a short time.

FIG. 1 shows an overall system showing a correlation between a user and the system of this embodiment. FIG. 2 shows an example of the configuration according to function of a scanning electron microscope (SEM) for semiconductor inspection to which the present invention is applied. FIG. 3 shows a work flow of the inspection analysis of the present invention.

As shown in FIG. 1, the user guide server is connected to the user's workstation, PC (personal computer), etc. via a communication means such as the Internet, and secures and remotely secures the inspection analysis preparation work of the present invention. Provided to facilitate the operation.
FIG. 4 shows the contents of communication processing between the user guide server and the user's workstation or personal computer. The details consist of the following first to fifth stages.

As a first stage, as shown in 1 of FIG. 3, the user guide server presented guidance including the processing contents and processing costs of the examination analysis in this case.
The following description is based on the premise that the service provided to the user according to the present case is accepted by the user at the stage shown in FIG. This is because the user has an advantage not only in having an expensive inspection / analysis apparatus but also in speeding up the inspection / analysis of the user's sample at a low cost.

The user recognizes the merit of the inspection analysis service of this case, and as shown in 3 of FIG. 3, the user accesses the user guide server, and the user makes the inspection analysis request.

As a third step, as shown in 4 of FIG. 3, a temporary user ID registration and a password for user authentication were issued at the user guide server by user access.

As a fourth stage, the user uses a temporary user name and a temporary password to start a simulation operation program of the test analyzer built in the user guide server as shown in 5 and 6 of FIG. The user can check whether or not the test analyzer can be remotely controlled by using the user's workstation or personal computer. The user's workstation or personal computer moves as if operating a personally owned test analyzer. In addition, the user himself / herself created an inspection analysis recipe so that the created recipe can be checked for problems, and later, the inspection analysis by the created recipe can be actually used.

As the fifth stage, as shown in 7, 8, and 9 in FIG. 3, the user evaluation of the test analysis result is OK by the above-described simulation operation program, and the following processing is performed.
Upon receiving a formal request for inspection analysis from the user, a user ID and one-time password were issued to the user for user authentication. At that time, the company and the contractor on the inspection / analysis device manager agreed on a confidentiality agreement and a payment method. A one-time password is a password that is valid only at a specified date and time.
As shown in FIG. 4, the main processes from the first stage to the fifth stage were performed by the user guide server. In the case of repeat order processing, it is possible to simplify the confidentiality contract, cost payment method, etc. between the user and the contractor on the manager side of the inspection analyzer.

As a sixth stage, the user who has obtained the user ID and the one-time password can communicate with the workstation 1 of the test analyzer via the user authentication server as shown in FIG.
The process shown in 10, 11, 12, and 13 in FIG. 3 is performed for the user who has obtained the user ID and password, but the user registers the use according to the schedule that can be provided by the test analyzer side. The user and the available time of the inspection analyzer were matched. As for the meeting between the user and the test analyzer, a schedule that can provide the service of the test analyzer is built on the computer for each test analyzer, as in the case of reservations for use of shared facilities. We built a schedule registration system that allows the user to decide the time that is convenient for the user. When the schedule is registered, the inspection analysis contractor on the inspection analyzer side receives the inspection analysis sample from the user and processes it.

The contractor on the device manager side attached the sample to the inspection analyzer according to the registered schedule. In the sixth stage, as shown in FIG. 5, the user workstation or personal computer can access the test analyzer control workstation via the user authentication server and control the test analyzer. It was. In other words, a server for user authentication is provided between the inspection analyzer control workstation and the general network such as the Internet, so that a third party does not know the presence of the inspection analyzer control workstation. It was provided to prevent attacks on the control workstation of the analyzer.

In the seventh stage, the test analyzer recipe created by the user is received using the test analyzer operating program provided from the user guide server, and the test analyzer can be controlled remotely. At that time, as shown by 14, 15, and 16 in FIG. 3, the inspection analysis output data is instructed so that only the user can restore it, and the inspection analysis output data is encrypted and added to the inspection analysis apparatus. Temporarily stored. By compressing data immediately before encryption, subsequent data processing such as data storage, communication, and encryption restoration could be facilitated. The user was able to retrieve the first-stored inspection analysis output data into the user's workstation or personal computer and restore it using the user's key.

The eighth stage is a stage where the above-described inspection analysis has been completed without any problem. As shown in 17, 18, 19, and 20 in FIG. I received it. The contractor on the side of the inspection analyzer took out the sample from the apparatus, returned it to the user, and contacted the user about post-processing including inspection analysis fee billing.

As shown in FIG. 5, the workstation of the test analyzer is controlled by the user's workstation or personal computer, and the test analyzer is controlled. At that time, there are a case where the user controls the inspection analyzer in real time and a case where the user creates an operation recipe of the inspection analyzer and the contractor on the inspection analyzer management side controls. Real-time control is good for a user to perform inspection analysis of a user sample for the first time, but in that case, there may be a time restriction in using the inspection analyzer.
When the user repeats the inspection analysis of the user sample, the user creates an operation recipe for the inspection analyzer, and the contractor on the inspection analyzer management side preferably operates the inspection analyzer. In this case, time constraints can be reduced when using the inspection analyzer.

  The inspection analyzers are connected to each other through a network. In principle, it is possible for a user to become an official user for one of a plurality of inspection analyzers, and to look into the workstations of other inspection analyzers from the workstation of the corresponding inspection analyzer. The output data of the inspection analyzer was encrypted in the same manner as above. As a result, the contents cannot be known. In addition, protection is provided so that the user cannot operate any inspection analyzer other than the designated inspection analyzer.

In order to implement the present invention as a business, it is necessary to make a confidentiality contract between the user and the inspection analysis contractor on the management side of the inspection analysis apparatus. In the contract between the user and the contractor on the side of the inspection analyzer, the contractor on the side of the test analyzer not only protects the user's confidentiality but also prohibits the operation outside the permitted range by the user.

In addition, after the user decrypts, compresses and decompresses the test analysis data of the user sample, all of the original output data and a record (log) of the operation conditions of the test analysis apparatus are deleted.
With the above processing flow, it was confirmed that the user can perform inspection analysis of the user's sample efficiently by securing security without own inspection analyzer.

In the seventh stage, when an instruction for encryption is given from the user side, the processing inside the SEM as the inspection analyzer will be described in detail with reference to FIG.
FIG. 2 shows the invention of the present case including what is newly added to that used in the description of the conventional SEM of FIG.

A control program for advancing inspection analysis in order by sequence processing is stored in 17. The control computer 20 controls the electron beam optical system and the XY stage system according to the control program 17.

  Once the semiconductor wafer to be inspected is mounted on the SEM, it is moved to the XY drive stage via the preparation chamber 15 for evacuation. The control computer 20 designates the acceleration voltage of the electron beam, the beam scanning range, and the like via the control interface 18 of the electron beam optical system, and controls the stage drive unit 13 via the control interface 14 of the XY stage system. The XY stage 12 on which the semiconductor wafer is mounted is moved to a desired position.

  In order to move to a desired position on the semiconductor wafer, pre-alignment processing for aligning the wafer direction with reference to an orientation flat or notch processed on the wafer, an XY stage position coordinate system, and a pattern position coordinate system in the wafer An alignment process for correction is performed. When a user sample has a size designated by the administrator of the inspection analyzer and an alignment mark exists in a specified region on the sample, the above processing can be automatically performed.

After moving to a desired position on the semiconductor wafer, inspection analysis is performed according to the following flow.
After being accelerated, the electron beam 2 emitted from the electron gun 3 is narrowed down by the converging lens 4 and the objective lens 6 and focused on the surface of the semiconductor wafer 1 as a sample. At the same time, the electron beam 2 is bent in its orbit by the deflector 5 and scans the wafer surface two-dimensionally or one-dimensionally. On the other hand, secondary electrons 8 are emitted from the wafer portion irradiated with the electron beam as a result of the interaction between the electron beam and the wafer material.

The secondary electrons 8 are converted into detection / electrical signals by the secondary electron detector 9 and then subjected to signal processing such as A / D conversion in the signal processing unit 10. The output data signal subjected to signal processing is stored in the memory unit 16. The stored output data signal is used for luminance modulation or Y modulation of the monitor 21. The monitor 21 is scanned in synchronization with the scanning of the electron beam 2 on the wafer surface, whereby an enlarged sample image is formed on the monitor 21. However, since the output data signal is normally encrypted, the enlarged sample image is not displayed on the monitor 21. To display the enlarged sample image, it is necessary to cancel the encryption designation. .

When operating in the calibration mode for SEM adjustment or calibration processing, the sample moves to a predetermined location on the demonstration sample that is different from the user sample mounted on the stage. Two-dimensional scanning was performed so that a sample image magnified about 10,000 times could be seen without applying encryption and luminance modulation. At that time, the enlarged sample image cannot be seen on the monitor 21 unless the encryption designation is canceled for the user sample.

The pattern defect inspection using the encrypted output data was performed as follows.
While combining electron beam scanning and stage movement, the entire surface of the required inspection area on the wafer is raster scanned, and the formed sample image is stored in the memory unit 16. The stored sample image was similarly compared with the reference sample image stored in the memory unit, and if there was a difference between the two images, it could be detected as a defect. However, since whether or not the difference portion is an actual defect is immediately known if it is encrypted, it is necessary to decrypt and confirm the external shape and position coordinates. Further, by storing the encrypted output data after data compression, the memory capacity required for storage is reduced, and the processing time for data comparison, data transfer, etc. for defect detection can be shortened. As a result, an increase in processing time accompanying encryption can be suppressed.

As shown in FIG. 5, after the user receives the test analysis output data, the user's workstation or personal computer is used to encrypt and decrypt the encrypted test analysis output data. Processing and decompression processing of data compression were performed. The decryption process of the encryption and the decompression process of the data compression are automatically processed into the output result of the control of the test analyzer on the user side computer when the real time control is performed by the user. On the user's computer, output data encryption / decryption and data compression / decompression are automated, and data is output using a conventional non-encrypted test analyzer.

On the other hand, in the control based on the user recipe, which is not real-time control, after the user receives the inspection analysis output data, the decryption processing of the encryption and the decompression processing of the data compression can be performed with one command. This is because the inspection analysis data primarily stored in the inspection analyzer is loaded into the user computer by the user based on the loading request.

By performing one-dimensional scanning on the sample wafer using an electron beam and applying Y modulation, pattern profile data corresponding to the step and material on the wafer can be obtained. The formed sample image and pattern profile data are used for circuit pattern shape and dimension measurement inspection formed on the wafer. The pattern dimension is determined by scanning the electron beam one-dimensionally across the measurement pattern in the measurement direction, determining the pattern edge from the obtained pattern profile according to a predetermined pattern edge determination algorithm, and measuring the pattern pattern from the obtained pattern edge interval. Calculate the dimensions of The dimension data of this measurement pattern was also encrypted and stored.

Reference numeral 7 in FIG. 2 denotes a CCD camera, which is provided so that a user who is away from the inspection analyzer can know the inspection analysis portion. At that time, by making it possible to change the magnification of the inspection analysis sample, the inspection analysis location can be easily confirmed.

Reference numeral 11 in FIG. 2 denotes an encryption circuit for encrypting the output data of the test analysis result, which is a feature of the present invention, after signal processing (10 in FIG. 2) such as AD conversion. Encryption is a process in which two-dimensional image data is broken down into fine pixel graphic data, and is agitated and connected. In the encryption, the output data of the inspection analysis is converted in accordance with a specified rule, and the data is converted into data that cannot be understood by the third party as it is. Decryption was restored to the original output data before encryption according to a separately specified rule (which may not be the same as the first rule).
Immediately before the encryption processing, data compression processing was performed on the output data of the inspection analysis result. After the encryption process, the original image data cannot be restored without the key indicating the decryption procedure. The output data of the SEM in FIG. 2 was subjected to data compression processing and encryption processing, and was primarily stored in the image data storage unit 16 in FIG.

Note that after the user decrypted and compressed and decompressed the test analysis data of the user sample, the original output data and the record (log) of the operating conditions of the test analysis apparatus were all deleted.
As described above, the inspection analysis apparatus is configured so that the inspection analysis manager and other users can ensure security for the inspection analysis processing.
According to the present invention, security for individual users can be ensured, and restrictions on application to inspection analysis in which confidentiality is important among users, such as a semiconductor wafer on which a semiconductor integrated circuit is formed, can be eliminated. .

(Embodiment 2)
FIG. 6 shows a method in which a user brings a test analysis sample and performs a test analysis using a workstation of the test analysis apparatus. This method is suitable for users who are not accustomed to inspection analysis and users who are not accustomed to operation by a workstation or a personal computer. Similar to the one shown in the first embodiment, the user can hear the procedure from the administrator of the inspection analyzer and input the control recipe instructed to encrypt the output data of the inspection analysis. In this case as well, a confidential agreement is made between the user and the contractor on the inspection analyzer manager side. The output data of the inspection / analysis apparatus is encrypted and the contents are not known to others. The original output data is deleted after the user obtains the inspection analysis data.

  FIG. 7 shows a method for calibrating position coordinates between a user sample and a sample stage system of an inspection analyzer when a desired location on a semiconductor wafer is inspected and analyzed. Using the CCD camera 7 in FIG. 2, the alignment alignment marks 3 and 4 in FIG. 7 are detected. Thereby, the position error and the rotation error can be calibrated in the semiconductor wafer coordinate system (Xc-Yc) and the stage coordinate system (X-Y). The inspection analysis point (5 in FIG. 7) on the semiconductor wafer can be easily converted into the stage coordinate system.

In the inspection / analysis recipe, when the sample wafer is mounted on the XY stage, it is aligned using the alignment pattern formed on the sample wafer by the CCD camera, and the stage position coordinates are corrected.

Depending on the user's sample, the optical alignment method using a CCD camera may lack alignment accuracy. For such users, an operation recipe that increases the alignment accuracy using an electron beam used for inspection analysis. Is exemplified in the operation guide.
In this case, it is necessary to form at least two positioning alignment patterns on the sample wafer at a predetermined distance from other patterns, and enter the position coordinates and pattern dimensions in the operation recipe. By using the above positioning pattern, the stage is moved directly under the electron beam, electron beam irradiation / focusing, and secondary electron detection are performed, so that the alignment accuracy can be improved.

  FIG. 7 shows an example of a coordinate system displayed when the user guide workstation shown in FIG. 1 is mounted on an inspection analyzer together with a semiconductor wafer size and a semiconductor chip size that can be inspected and analyzed. By providing a user guide, a plurality of users can easily use the inspection analyzer of this case.

In order to inspect and analyze an insulator sample using an electron beam, it is necessary to inspect a user who is not familiar with this by irradiating the electron beam for a predetermined time and capturing the sample image in a memory. A guide to facilitate analysis was presented. As a result, more users can easily use the inspection analyzer of the present case.

In this embodiment, an XY stage that holds a sample is used. However, if an XYT stage that is tilted is used, inspection analysis can be performed with the sample tilted.

In the present embodiment, only the SEM is described as the inspection analyzer, but it can also be applied to an analyzer such as a characteristic X-ray analyzer or an Auger electron analyzer.

In the present embodiment, the electron beam is a single beam, and this detection corresponds to this single beam. However, a multi-beam scanning method may be used to detect the electron beam.

In the present embodiment, the case of observing a semiconductor wafer has been described. However, a wafer for an image sensor or a display element may be used instead, or a sample shape other than the wafer may be used. For example, with respect to an optical mask used for transferring an integrated circuit pattern on a semiconductor wafer, a phase difference is provided in the transmitted light. This phase difference measurement and inspection includes the introduction cost of the inspection apparatus, the measurement frequency, etc. Therefore, the inspection analysis method of this case is suitable. This is an example, but is suitable for inspection analysis shared by a user group for which phase difference measurement is desired.

In this embodiment, an electron beam is used as a probe that interacts with a sample, and a scanning electron microscope is used as an apparatus. However, a focused ion beam apparatus that uses an ion beam, a laser scanning microscope that uses a laser beam, and a mechanical probe are used. It may be an atomic force microscope or the like.

In this embodiment, the method of only the inspection analysis is shown. However, as an extension of the inspection analysis, for example, when the inspection analysis is performed on a portion below the surface that is not the surface of the semiconductor wafer or semiconductor chip, The beam is irradiated to the part under specific conditions to expose the inspection analysis part, and then the inspection analysis is performed. It is also effective according to the invention of the present invention to provide inspection analysis of a user sample by performing such finely focused ion beam processing or laser beam processing.

  The present invention is an effective means for allowing the general public to use excellent inspection and analysis apparatuses of public offices such as universities. In addition, it becomes an effective means when a test analyzer manufacturer pioneers new users. This is an effective means of using this easily for users in the field who have never used expensive inspection and analysis equipment such as an electron microscope. As a result, the user himself / herself uses the system to obtain more inspection analysis data for the user's sample as if he / she used his / her own inspection / analysis device. It can be obtained directly in real time without being known by the manager of the apparatus. This system provides a user authentication server for each of a plurality of geographically separated test analyzers and connects to the Internet, thereby expanding the user's selection range and allowing more users to use the system. It is.

It is a figure for demonstrating the test | inspection analysis method of this invention. It is a figure for demonstrating the structure according to function of the scanning electron microscope (SEM) for semiconductor inspection to which this invention is applied. It is a figure for demonstrating the work flow of the test | inspection analysis of this invention. It is a figure for demonstrating the preparatory work of the test | inspection analysis of this invention. It is a figure for demonstrating the test | inspection analysis work of this invention. It is a figure for demonstrating the test | inspection analysis work of this invention. It is a figure for explaining clarification of the inspection analysis position of the present invention. It is a figure for demonstrating the structure according to function of the conventional scanning electron microscope (SEM) for semiconductor inspection.

Explanation of symbols

2 and 8
DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer, 2 ... Electron beam, 3 ... Electron gun, 4 ... Converging lens, 5 ... Electrostatic deflector, 6 ... Objective lens, 7 ... CCD camera, 8 ... Secondary electron, 9 ... Secondary electron detector DESCRIPTION OF SYMBOLS 10 ... AD converter, 11 ... Encryption circuit, 12 ... XY stage, 13 ... Stage drive motor, 14 ... Stage control I / O, 15 ... Loader part, 16 ... Image memory part, 17 ... System control part, 18 ... an electron beam system control unit, 20 ... a system control workstation, 21 ... a monitor, 22 ... an external connection cable.
FIG.
DESCRIPTION OF SYMBOLS 1 ... XY stage, 2 ... Semiconductor wafer, 3 ... Alignment mark 1, 4 ... Alignment mark 2, 5 ... Inspection analysis point, 6 ... Stage X direction movement switch, 7 ... Stage Y direction movement switch, 8 ... Desired A switch for moving to a position, 9... A switch for switching the coordinate display on the wafer where the stage coordinate display is corrected.

Claims (5)

A method for receiving a test analysis sample from a user who desires a test analysis and providing test analysis data as a result of the test analysis of the user sample to the user,
(1) The administrator of the test analysis apparatus presents a guide including the contents of the test analysis service and processing costs corresponding to the test analysis service to the user who requests the test analysis.
(2) The administrator of the test analysis apparatus distinguishes between a user and a third party other than the user in order to ensure security when a user who requests the test analysis remotely operates the test analysis apparatus via a communication network. User authentication, and after confirming that it is a user, receive a test analysis sample from the user side,
(3) The user obtains a sample loading preparation completion notification from the test analysis contractor on the test analyzer side to the test analyzer, and then performs real-time remote operation by the user side computer including encryption designation, or The inspection analysis contractor on the device administrator side performs the operation using the operation recipe created in advance including the encryption designation by the user.
(4) In order to ensure the security of the test analysis data obtained as a result of the test analysis process, the output data resulting from the test analysis process is temporarily stored in the test analysis apparatus in a state of being encrypted so that only the user can decrypt it. , The user obtains the decrypted test analysis data of the result of the test analysis process,
Inspection analysis method characterized by this. The inspection analysis according to claim 1 irradiates at least one detection data of reflected light, scattered light, and transmitted light, or an electron beam when irradiated with a narrowed laser beam, and emits secondary electrons, scattered electrons, and transmitted electrons. A sample inspection analysis method comprising: an inspection analysis including at least one detection data of: or an inspection analysis using an atomic force microscope using a mechanical probe. The test analysis method according to claim 2 is configured so that the user can easily determine the analysis location after mounting the test analysis sample on the test analysis apparatus so that the user can definitely use the test analysis apparatus at a remote location. An inspection analysis method characterized by providing a user with an optical image of an inspection analysis sample enlarged in magnification, inspection analysis position coordinate information on the sample, or position information of a drive stage coordinate system holding the analysis sample. Inspection / analysis equipment that can control inspection / analysis conditions, inspection / analysis data output, etc., using a control computer for an atomic force microscope using a mechanical probe or an atomic force microscope using a focused beam such as an electron beam, ion beam, or laser beam Because
For the control computer of the test analyzer, a network connection means and a real-time operation of the test analyzer using a user computer connected to the network, or an operation recipe created in advance by the user, the test analyzer Can be operated by a control computer,
Furthermore, the inspection is provided with an encryption function that can restore the output data including the inspection analysis result of the individual user sample using the inspection analyzer without being known to others. Analysis equipment. Using a user's computer connected to a network such as the Internet, a processing device for inspection analysis and the like controlled by the computer connected to the network, and output data that is a processing result of the user using the processing device under specific conditions It is a business to be provided to a user, and the user operates the processing device in real time using a user computer, or after a confidential agreement between the user and a processing contractor on the processing device side such as inspection analysis. The contractor operates the device using a pre-created operation recipe including the encryption specification of the output data that is the processing result of the inspection analysis and the like, and the administrator side of the processing device via the communication network And providing the output data of the processing result by adding encryption that can be restored only by the user. Processing data providing business, characterized in that.

Images