JP2005040670A - Coating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ink jet type coating apparatus by which liquid stored in a liquid tank and for forming a functional thin film is applied on a substrate without deteriorating the function. <P>SOLUTION: The ink jet system coating apparatus for jet-coating the substrate W with the liquid for forming the functional thin film possesses a head 7 provided with a nozzle for jetting the liquid, the liquid tank 31 for storing the liquid, a liquid supply pipe 21 for supplying the liquid in the liquid tank 31 to the head 7, a liquid discharge pipe 72 for discharging the liquid in the liquid tank 31 and a liquid discharge valve 73 provided in the liquid discharge pipe 72 and automatically opened when a prescribed time is elapsed after the liquid is replenished to the liquid tank 31. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an inkjet type coating apparatus that sprays a solution from a nozzle and coats a substrate.
[0002]
[Prior art]
Generally, in a manufacturing process of a liquid crystal display device, there is a film forming process for forming a circuit pattern on a substrate such as a glass substrate. In this film forming process, a functional thin film such as an alignment film or a resist is formed on the surface of the substrate.
[0003]
In the case of forming a functional thin film on a substrate, an ink jet type coating apparatus that sprays a solution (a solution for forming a functional thin film) as a material to apply to the substrate may be used.
[0004]
This coating apparatus has a transfer table for transferring a substrate. A plurality of heads having a large number of nozzles are juxtaposed above the transport table so as to intersect the transport direction of the substrate. A solution tank is connected to each head via a solution supply pipe, and the solution is applied on the substrate to be conveyed by spraying the solution stored in the solution tank from the nozzle.
[0005]
The ink jet type coating apparatus has an advantage that the use efficiency of the solution is very excellent and the use amount of the expensive solution can be suppressed.
[0006]
However, in an ink jet type coating apparatus, when a solution is ejected from a nozzle, bubbles may be mixed into the solution supply pipe. When bubbles are mixed in the solution supply tube, the solution may not be smoothly ejected, and the thickness of the functional thin film formed on the substrate may be uneven. Therefore, conventionally, before the solution is spray-coated on the substrate, a bubble removal operation for discharging bubbles mixed in the solution supply pipe has been performed.
[0007]
[Problems to be solved by the invention]
By the way, a solution for forming a functional thin film such as an alignment film or a resist has a problem that its functionality is likely to deteriorate depending on the surrounding environment. For example, when the temperature of the solution rises to about room temperature, the solution may cause a chemical reaction in the solution tank, and the functionality may be deteriorated.
[0008]
In particular, the ink jet type coating apparatus has excellent use efficiency of the solution, and since the solution once charged stays in the solution tank for a long period of time, the functionality deteriorates when this solution is applied. This may adversely affect the functional thin film formed on the substrate.
[0009]
Further, even if the bubbles mixed in the solution supply pipe are discharged before the solution is applied to the substrate, the smooth injection of the solution may be hindered by the bubbles mixed at any time during the solution injection.
[0010]
The present invention has been made in view of the above circumstances, and a first object thereof is to provide a solution for forming a functional thin film stored in a solution tank in an ink jet type coating apparatus. To provide a coating apparatus that can be applied to a substrate without deteriorating its functionality, and a second object is to provide a coating apparatus that can discharge bubbles mixed in a solution supply pipe during solution application. is there.
[0011]
[Means for Solving the Problems]
In order to solve the above problems and achieve the object, the coating apparatus of the present invention is configured as follows.
[0012]
(1) In an inkjet-type coating apparatus that sprays and coats a solution for forming a functional thin film on a substrate, a head including a nozzle for spraying the solution, a solution tank that stores the solution, and the solution A solution supply pipe for supplying the solution in the tank to the head, and a solution discharge means for discharging the solution after a predetermined time has elapsed since being supplied to the solution tank.
[0013]
(2) In an inkjet-type coating apparatus that sprays and coats a solution for forming a functional thin film on a substrate, a head including a nozzle for spraying the solution, a solution tank that stores the solution, and the solution A cooling means for cooling the solution in the tank to a predetermined temperature, and a solution supply pipe for supplying the solution in the solution tank to the head are provided.
[0014]
(3) The coating apparatus according to (2), wherein the head is provided with a heating unit for heating the solution cooled by the cooling unit to a predetermined temperature. .
[0015]
(4) In an inkjet-type coating apparatus that sprays and coats a solution on a substrate, a head including a nozzle that sprays the solution, a solution tank that stores the solution, and a solution in the solution tank is supplied to the head. And a bubble discharge means provided in the solution supply tube for discharging bubbles mixed in the solution supply tube.
[0016]
(5) The coating apparatus according to (4), wherein the bubble discharging means is provided in the vicinity of each head.
[0017]
(6) The coating apparatus according to (4), wherein the bubble discharge means includes a bubble discharge pipe connected upward to an upper portion of the solution supply pipe, and a bubble provided in the bubble discharge pipe. And a discharge valve.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a piping system diagram showing piping of a coating apparatus according to the first embodiment of the present invention, and FIG. 2 is a front view showing the coating apparatus according to the same embodiment with a supply pipe omitted.
[0019]
As shown in FIGS. 1 and 2, the coating apparatus of the present invention has a base 1. A pair of rails 2 spaced apart from each other at a predetermined interval are provided on the upper surface of the base 1 along the longitudinal direction of the base 1. A table 3 is movably provided on the rail 2 and is driven to travel by a drive source (not shown). A large number of support pins 4 are provided on the upper surface of the table 3, and a glass substrate W used for a liquid crystal display device or the like is supplied and supported on these support pins 4.
[0020]
Above the substrate W driven together with the table 3, a plurality of solutions for forming a functional thin film are spray-applied to the substrate W by an ink jet method, and in this embodiment, three heads 7 are traveling directions of the substrate W. Are arranged in a row along the direction intersecting with.
[0021]
3 is a cross-sectional view showing the configuration of the head 7 according to the embodiment, and FIG. 4 is a bottom view showing the configuration of the head 7 according to the embodiment.
[0022]
As shown in FIG. 3, the head 7 has a head body 8. The head body 8 is formed of a cylindrical body, and the lower surface opening is closed by a flexible plate 9. The flexible plate 9 is further covered with a nozzle plate 11, and a liquid chamber 12 is formed between the nozzle plate 11 and the flexible plate 9.
[0023]
A liquid supply hole 13 for communicating with the liquid chamber 12 is formed at one end of the head body 8. From the liquid supply hole 13, a solution for forming a functional thin film such as an alignment film or a resist is supplied to the liquid chamber 12. The solution is supplied until the liquid chamber 12 is filled.
[0024]
A plurality of nozzles 14 are formed in the nozzle plate 11 in a zigzag pattern along a direction substantially orthogonal to the transport direction of the substrate W (shown in FIG. 4). In addition, piezoelectric elements 15 are provided on the upper surface of the flexible plate 9 so as to face the nozzles 14.
[0025]
A driving voltage is applied to the piezoelectric element 15 by a driving unit (not shown) provided in the head body 8. Then, by applying this voltage, the piezoelectric element 15 expands and contracts, and the flexible plate 9 is partially deformed, so that the solution in the liquid chamber 12 is ejected from the nozzle 14 facing the piezoelectric element 15 toward the substrate W. .
[0026]
A recovery hole 17 communicating with the liquid chamber 12 is formed at the other end of the head body 8. The solution supplied from the liquid supply hole 13 to the liquid chamber 12 is recovered from the recovery hole 17.
[0027]
As shown in FIG. 1, a supply branch pipe 22 branched from the tip of the solution supply pipe 21 is connected to the liquid supply hole 13 (shown only in FIG. 3) of each head 7. Further, a recovery branch pipe 24 branched from the tip of the solution recovery pipe 23 is connected to the recovery hole 17 of each head 7. The supply branch pipe 22 is provided with a supply on / off valve 25, and the recovery branch pipe 24 is provided with a recovery on / off valve 26.
[0028]
A bubble discharge pipe 70 is connected to the upper part of the branch part of the solution supply pipe 21 and the supply branch pipe 22 substantially vertically upward. Each bubble discharge pipe 70 is provided with a bubble discharge valve 71 in the middle. The bubbles mixed in the solution supply pipe 21 are separated into the bubble discharge pipe 70 by the bubble discharge pipe 70 and the bubble discharge valve 71 and discharged. The bubble discharging means 91 is configured. The bubble discharge pipe 70 is provided with a level sensor (not shown). This level sensor monitors the liquid level in the bubble discharge pipe 70.
[0029]
In this embodiment, the bubble discharging means 91 is provided for each head 7. However, the bubble discharging means 91 is provided only on the most upstream head 7 or only on the upstream side of the most upstream head 7. May be provided. Further, a deaeration film or a filter may be provided at the base end portion of the bubble discharge pipe 70.
[0030]
The tip of the solution supply pipe 21 and the tip of the solution recovery pipe 23 are connected via a communication valve 27. The solution recovery pipe 23 includes a main recovery valve 28 on the proximal end side of the recovery branch pipe 24.
[0031]
The base end of the solution supply pipe 21 is connected to the bottom of the solution tank 31 in which the solution L is stored. The base end of the solution recovery tube 23 is connected to a storage tank 32 that stores the solution L supplied to the solution tank 31. The storage tank 32 is installed in a cool and dark place 78 so that the internal solution L does not deteriorate.
[0032]
A supply branch pipe 34 branched from the base end of the solution recovery pipe 23 is connected to the bottom of the solution tank 31 via a supply valve 33. Connected to the upper part of the solution tank 31 is an air release pipe 35 having a first opening / closing control valve 36.
[0033]
When the first opening / closing control valve 36 is opened, the inside of the solution tank 31 is communicated with the atmosphere. The atmosphere opening pipe 35 is connected to a processing device (not shown) for processing the vaporized solvent contained in the gas released from the atmosphere opening pipe 35 to the atmosphere.
[0034]
A gas supply pipe 38 having a second opening / closing control valve 37 is connected to the upper part of the solution tank 31. Then, an inert gas such as nitrogen is supplied into the solution tank 31 from a gas supply source (not shown) via the gas supply pipe 38.
[0035]
A filter 39 and a third opening / closing control valve 40 are sequentially connected to the gas supply pipe 38 upstream of the second opening / closing control valve 37. The third open / close control valve 40 is provided with a flow restrictor 41 in parallel.
[0036]
A solution discharge pipe 72 is connected to the bottom of the solution tank 31. The solution discharge pipe 72 includes a solution discharge valve 73, and the solution discharge means 90 for discharging the solution L in the solution tank 31 is configured by the solution discharge pipe 72 and the solution discharge valve 73.
[0037]
Connected to the upper part of the storage tank 32 are an air release pipe 44 having a fourth open / close control valve 43 and a gas supply pipe 46 having a fifth open control valve 45. A filter 47 and a sixth open / close control valve 48 are sequentially connected to the gas supply pipe 46. The sixth open / close control valve 48 is provided with a flow restrictor 49 in parallel.
[0038]
The supply on-off valve 25, the recovery on-off valve 26, the main recovery valve 28, the supply valve 33, the first to sixth on-off control valves 36, 37, 40, 43, 45, 48, the bubble discharge valve 71, and the solution discharge valve 73 Is controlled to be opened and closed by a control device (not shown).
[0039]
Further, the level of the solution L in the solution tank 31 is detected by the level sensor 50. When the level sensor 50 detects that the liquid level of the solution L has become equal to or lower than the predetermined liquid level, the solution L is supplied from the storage tank 32 to the solution tank 31 based on the detection. That is, the solution L is supplied to the solution tank 31 by pressurizing the solution L in the storage tank 32 with the inert gas supplied through the fifth open / close control valve 45.
[0040]
As shown in FIG. 2, one end surface of the table 3 is provided with an attachment member 51 having an L-shaped side surface with a vertical side fixed to the end surface of the table 3. On the other horizontal side of the mounting member 51, an upper and lower cylinder 52 is provided with the axis line vertical.
[0041]
A mounting plate 54 is attached to the rod of the upper and lower cylinders 52 via an elastic member 53. On the upper surface of the mounting plate 54, three pressing members 55 made of an elastic material such as rubber are held by a holding member 56 so as to be vertically displaceable. Each pressing member 55 has a blade shape corresponding to each head 7 and is elastically biased in the upward direction by a spring 57 provided on the holding member 56.
[0042]
The mounting plate 54 is provided with a blade-like wiping member 58 formed of an elastic material such as rubber in parallel with the pressing member 55. The wiping member 58 is formed taller than the pressing member 55.
[0043]
The placement plate 54 is provided on the inner bottom of the collection tank 61. A guide plate 62 is provided on one side of the collection tank 61, and a guide member 63 is provided on the guide plate 62. The guide member 63 moves up and down while being guided by a guide rail 64 provided on the end surface of the table 3 along the vertical direction.
[0044]
Accordingly, when the upper and lower cylinders 52 are driven, the mounting plate 54 is driven and the guide plate 62 moves up and down along the guide rails 64, so that the mounting plate 54 is prevented from swinging in the front-rear direction. Move up and down.
[0045]
A collection tank 65 shown in FIG. 1 is connected to the collection tank 61. The recovery tank 65 recovers the solution sprayed from the nozzle 14 to the recovery tank 61 when the bubbles of the nozzle 14 of the head 7 are removed.
[0046]
When the mounting plate 54 is raised and the nozzle 14 of each head 7 is closed by the pressing member 55, the solution L in the solution tank 31 is circulated from the liquid supply hole 13 of each head 7 through the liquid chamber 12 and the recovery hole 17. Can be made.
[0047]
Thereby, bubbles can be removed from the solution supply pipe 21, the head 7 and the solution recovery pipe 23. If the solution L is supplied to each head 7 in a state where the nozzle 14 is opened and the solution L in the solution tank 31 does not return to the solution recovery tube 23, the solution L is ejected from the nozzle 14. It can be carried out.
[0048]
When applying the solution L of the substrate W, if the wiping member 58 is set to a height at which the wiping member 58 comes into contact with the nozzle surface where the nozzle 14 of the head 7 is opened, the nozzle is moved when the substrate W reciprocates below the head 7. The solution L remaining on the surface can be wiped off.
[0049]
Next, the case where the solution L is applied to the substrate W by the coating apparatus having the above configuration will be described.
[0050]
The liquid level of the solution L in the solution tank 31 is maintained at a level lower than the nozzle surface of the head 7 by a predetermined dimension, and the level, that is, the level of the water head h between the nozzle surface and the liquid surface shown in FIG. It is controlled by the sensor 50.
[0051]
When the solution L is not applied to the substrate W, a small amount of inert gas is supplied into the solution tank 31 through the flow restrictor 41 and the second opening / closing control valve 37, and from the atmosphere opening pipe 35 through the first opening / closing control valve 36. Has been released.
[0052]
As a result, the solution L in the solution tank 31 is prevented from coming into contact with the atmosphere, so that the solution L is prevented from reacting with oxygen and moisture in the atmosphere and deteriorating. Since the flow rate of the inert gas supplied to the solution tank 31 can be set to a very small amount by the flow restrictor 41, the evaporation amount of the solvent contained in the solution L in the solution tank 31 is suppressed. Thereby, it is possible to suppress the concentration of the solution L in the solution tank 31 from changing with time.
[0053]
When the solution L is sprayed and applied to the substrate W and when the solution tank 31 is replenished with the solution, the second open / close control valve 37 is closed to block the supply of the inert gas to the solution tank 31. When the substrate W is transported below the head 7 by the table 3, the drive unit energizes the piezoelectric element 15, and the solution L supplied to the liquid chamber 12 of the head 7 is ejected from the nozzle 14 onto the substrate W. Thereby, the solution can be spray-coated on the substrate W.
[0054]
When the solution L is sprayed from the nozzle 14 or when the solution tank 31 is replenished with the solution, the supply of the inert gas to the solution tank 31 is stopped, so that the solution L in the solution tank 31 is as large as the head 7. It becomes atmospheric pressure, and the fluctuation of the water head h between the liquid level and the nozzle surface of the head 7 is prevented.
[0055]
That is, the solution L is ejected from the nozzle 14 by the operation of the piezoelectric element 15 under a preset water head h. Therefore, since a predetermined amount of the solution L can be precisely ejected from each nozzle 14, the solution L can be uniformly applied to the substrate W.
[0056]
However, when the solution is spray-applied to the substrate W, the solution L stored in the solution tank 31 communicates with the atmosphere via the atmosphere release pipe 35, so that the solution L absorbs oxygen and moisture in the atmosphere. As a result, its functionality deteriorates.
[0057]
Further, the solution stored in the storage tank 32 is stored in a cool and dark place. However, when the solution tank 31 is replenished, the solution is heated to substantially the same temperature as the surrounding temperature, and a chemical reaction occurs in the solution tank 31. May cause. Again, the functionality of the solution will be degraded.
[0058]
Therefore, the solution L stored in the solution tank 31 is discharged as a drain from the solution discharge pipe 72 every predetermined time. That is, when the solution is replenished from the storage tank 32 to the solution tank 31 at the start of operation of the apparatus, the solution in the solution tank 31 is automatically discharged from the solution discharge pipe 72 every predetermined time by the controller.
[0059]
When discharging the solution from the solution tank 31, the level sensor 50 is stopped, the supply of the solution from the storage tank 32 is stopped, and the solution discharge valve 73 is opened. Thereby, the solution in the head 7, the solution supply pipe 21, and the solution tank 31 is almost completely discharged, and the inside of the pipe is substantially in the same state as when the operation is started. When the solution is almost completely discharged from the solution tank 31, the level sensor 50 is activated to replenish the solution from the storage tank 32 into the solution tank 31.
[0060]
That is, when the level sensor 50 is in operation, the level sensor 50 detects the liquid level of the solution L in the solution tank 31 and changes from the storage tank 32 to the solution tank 31 until the liquid level reaches a predetermined level. The solution is replenished.
[0061]
As a result, the solution in the solution tank 31 is replaced with a solution that has been stored in the storage tank 32 at a predetermined time and the functionality is not deteriorated. Can be prevented.
[0062]
Before the solution L is applied to the substrate W, bubbles are removed from the head 7, the solution supply pipe 21 and the solution recovery pipe 23 as described above. When air bubbles are to be removed, the first open / close control valve 36 provided in the atmosphere open pipe 35 is closed, and the second open / close control valve 37 and the third open / close control valve 40 provided in the gas supply pipe 38. Is released.
[0063]
Thereby, a large amount of inert gas is supplied from the gas supply pipe 38 to the solution tank 31, and the solution L in the solution tank 31 is pressurized, so that the solution L is discharged to the solution supply pipe 21.
[0064]
If the supply opening / closing valve 25, the recovery opening / closing valve 26, the communication valve 27, and the main recovery valve 28 are opened while the nozzle 14 of the head 7 is closed by the pressing member 55 provided on the mounting plate 54, the solution L is the solution. The solution flows from the supply pipe 21 through the inside of the head 7 to the solution recovery pipe 23, and is collected from the solution recovery pipe 23 to the storage tank 32. Thereby, bubbles can be removed from the head 7, the solution supply pipe 21 and the solution recovery pipe 23.
[0065]
To remove air bubbles from the nozzle 14 of the head 7, the closed state of the nozzle 14 by the pressing member 55 is released, and the solution L in the solution tank 31 is discharged to the solution supply pipe 21 with the recovery on-off valve 26 closed. Thereby, since the solution L that has flowed into the head 7 is ejected from the nozzle 14, the bubbles of the nozzle 14 can be removed.
[0066]
When the degassing of each part is completed, the first open / close control valve 36 is opened, and the third open / close control valve 40 is closed, so that a small amount of inert gas based on the setting of the flow restrictor 41 is set in the solution tank 31. To prevent deterioration of the solution L in the solution tank 31 due to contact with the atmosphere.
[0067]
The storage tank 32 is also usually supplied with a small amount of inert gas through the flow restrictor 49, and the inert gas is diffused from the atmosphere open pipe 44 to the atmosphere through the fourth open / close control valve 43. The solution L is prevented from deteriorating due to contact with the atmosphere.
[0068]
Bubble removal from the solution supply pipe 21 is also performed during spray application of the solution. A bubble discharge pipe 71 is used to remove bubbles during spray application of the solution. That is, bubbles in the solution flowing through the solution supply pipe 21 are moved and separated into the bubble discharge pipe 71 by the buoyancy.
[0069]
When it is detected that gas has accumulated in the bubble discharge pipe 71 and the liquid level in the bubble discharge pipe 70 has fallen below a predetermined position, that is, a position set slightly higher than the solution supply pipe 31, The bubble discharge valve 71 is opened, and the accumulated gas is sucked and discharged.
[0070]
Accordingly, since almost no bubbles are mixed in the solution supplied to the head 7, it is possible to prevent the solution from being smoothly ejected from the nozzle 14 when the piezoelectric element 15 is driven.
[0071]
When supplying the solution L in the storage tank 32 to the solution tank 31, a large amount of inert gas is supplied to the storage tank 32 by closing the fourth open / close control valve 43 and opening the sixth open / close valve 48. To do.
[0072]
Thereby, since the solution in the storage tank 32 is pressurized, it flows into the solution tank 31 through the supply branch pipe 34. At this time, since the pressure of the solution tank 31 is set to atmospheric pressure, the water head difference with the head 7 when the solution is applied to the substrate W can be made constant.
[0073]
Next, a second embodiment of the present invention will be described with reference to FIGS. In the description of the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.
[0074]
FIG. 5 is a piping system diagram showing piping of the coating apparatus according to the second embodiment of the present invention, FIG. 6 is a cross-sectional view showing the configuration of the head 7 according to the embodiment, and FIG. 7 is the embodiment. It is a bottom view which shows the structure of the head which concerns.
[0075]
As shown in FIGS. 5 to 7, the coating apparatus according to the present embodiment is provided with a cooling device 74 (cooling means) in the solution tank 31 instead of the solution discharge pipe 72 in the first embodiment. It is.
[0076]
As shown in FIG. 5, the cooling device 74 is provided so as to cover the periphery of the solution tank 31. The temperature of the solution L in the solution tank 31 is detected by the in-tank solution temperature sensor 80 and fed back to the cooling device 74 via the control device described above. Thus, the solution L stored in the solution tank 31 is cooled to a predetermined temperature, that is, about 0 [° C.] in the present embodiment.
[0077]
As shown in FIGS. 6 and 7, a heating device 75 (heating means) is embedded in a predetermined position of the head body 8. The temperature of the solution L in the liquid chamber 12 is detected by the in-head solution temperature sensor 77 and fed back to the heating device 75 via the control device described above. Thereby, the solution L in the liquid chamber 12 is heated to a predetermined temperature, that is, about 17 to 18 [° C.] (normal temperature) in the present embodiment.
[0078]
When the solution L stored in the solution tank 31 is cooled to about 0 [° C.], the solution L is chemically stabilized, so that the functionality in the solution tank 31 is difficult to deteriorate. Therefore, a solution having sufficient functionality can be applied to the plate surface of the substrate W.
[0079]
However, when the solution is cooled to about 0 [° C.] in the solution tank 31, the viscosity of the solution decreases, and even if the piezoelectric element 15 is driven, the solution in the liquid chamber 12 of the head 7 smoothly flows from the nozzle 14. Sometimes it was not sprayed.
[0080]
However, in the present embodiment, as described above, since the solution in the liquid chamber 12 is heated to room temperature by the heating device 75 provided in the head 7, the solution can be smoothly ejected from the nozzle 14. .
[0081]
That is, even with the above-described configuration, it is possible to prevent the functional thin film formed on the plate surface of the substrate W from being adversely affected in the inkjet type coating apparatus.
[0082]
Further, in the coating apparatus according to the present embodiment, since the solution L is not discarded unlike the coating apparatus according to the first embodiment, the manufacturing cost due to wasting the expensive solution L is reduced. The rise can be suppressed.
[0083]
In addition, this invention is not limited to the said embodiment, In the range which does not deviate from the summary of invention, it can change variously.
[0084]
【The invention's effect】
According to the present invention, in an ink jet type coating apparatus, a solution for forming a functional thin film stored in a solution tank can be applied to a substrate without deteriorating its functionality.
[0085]
Further, bubbles mixed in the solution supply pipe can be discharged during solution application.
[Brief description of the drawings]
FIG. 1 is a piping system diagram showing piping of a coating apparatus according to a first embodiment of the present invention.
FIG. 2 is a front view showing the coating apparatus according to the embodiment with a supply pipe omitted.
FIG. 3 is a cross-sectional view showing a configuration of a head according to the embodiment.
FIG. 4 is a bottom view showing a configuration of a head according to the embodiment.
FIG. 5 is a piping system diagram showing piping of a coating apparatus according to a second embodiment of the present invention.
FIG. 6 is a cross-sectional view showing the configuration of the head according to the embodiment.
FIG. 7 is a bottom view showing the configuration of the head according to the embodiment.
[Explanation of symbols]
W ... substrate, 7 ... head, 14 ... nozzle, 31 ... solution tank, solution supply pipe, 75 ... heating device (heating means), 70 ... bubble discharge pipe, 71 ... bubble discharge valve, 72 ... solution discharge pipe, 73 ... Solution discharge valve, 74 ... cooling device (cooling means), 90 ... solution discharge means, 91 ... bubble discharge means.

Claims (6)

In an inkjet type coating apparatus that sprays and coats a solution for forming a functional thin film on a substrate,
A head including a nozzle for ejecting the solution;
A solution tank storing the above solution;
A solution supply pipe for supplying the solution in the solution tank to the head;
Solution discharging means for discharging a solution after a predetermined time has elapsed since being replenished in the solution tank;
A coating apparatus comprising: In an inkjet type coating apparatus that sprays and coats a solution for forming a functional thin film on a substrate,
A head including a nozzle for ejecting the solution;
A solution tank storing the above solution;
Cooling means for cooling the solution in the solution tank to a predetermined temperature;
A solution supply pipe for supplying the solution in the solution tank to the head;
A coating apparatus comprising: The coating apparatus according to claim 2, wherein the head is provided with heating means for heating the solution cooled by the cooling means to a predetermined temperature. In an inkjet type coating apparatus that sprays and coats a solution on a substrate,
A head provided with a nozzle for injecting the solution;
A solution tank storing the above solution;
A solution supply pipe for supplying the solution in the solution tank to the head;
Bubble discharge means provided in the solution supply pipe for discharging bubbles mixed in the solution supply pipe;
A coating apparatus comprising: 5. The coating apparatus according to claim 4, wherein the bubble discharging means is provided in the vicinity of each head. The bubble discharging means is
A bubble discharge pipe connected upward to the upper part of the solution supply pipe;
A bubble discharge valve provided in the bubble discharge pipe;
The coating apparatus according to claim 4, further comprising:

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