JP2005039914A - Power converter for vehicle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize a structure for a vehicle having a closing plate 8 that covers equipment under a floor of a vehicle body 1a installed, where a cooling unit 4a of a power converter 2a efficiently radiates heat. <P>SOLUTION: In an underfloor equipment arrangement, the equipment including the power converter 2a, of which a condenser 4a for a semiconductor element 3 is provided on the vehicle body side, is disposed on the underfloor of a railroad vehicle 1a, and the closing plate 8 is provided to cover the vehicle body side of the equipment. The inner wall of the closing plate 8 is mechanically connected to a heat radiation part 6a of the condenser 4a so that the condenser 4a for the semiconductor element 3 is thermally connected to the closing plate 8 provided to cover the vehicle body side as well, allowing the closing plate 8 functioning as a part of the condenser. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a vehicular power converter installed under a railway vehicle floor.
[0002]
[Prior art]
A power converter installed under the floor of a railway vehicle performs power conversion using a semiconductor element. Therefore, a cooler for efficiently dissipating heat loss generated from the semiconductor element to the atmosphere and suppressing the temperature rise of the semiconductor element is provided. I need it.
[0003]
Some coolers of such power conversion devices forcibly cool the air using an electric blower, but some use a natural ventilation type cooler that does not use an electric blower because of the merit of no maintenance. Many. In the case of this natural ventilation system, it is common to apply the heat radiating part of the cooler toward the side of the vehicle body so that the heat dissipation to the atmosphere is good.
[0004]
FIG. 12 is a perspective view showing a state in which a conventional vehicle power converter is installed under the vehicle floor, and FIG. 13 is a cross-sectional view in a sleeper direction. A power converter 2 installed under the floor of the vehicle body 1 houses a cooler 4 for cooling the semiconductor element 3. The cooler 4 includes a heat receiving portion 5 to which the semiconductor element 3 is attached and receives the heat, and a heat radiating portion 6 that dissipates the heat received by the heat receiving portion 5, and the heat receiving portion 5 is disposed inside the casing of the power converter 2. However, the heat radiating portion 6 is disposed in a portion exposed to the outside air outside the housing on the side of the vehicle body. Moreover, it is necessary to store the equipment installed under the floor within the installation space limit 7.
[0005]
In the power conversion device 2 configured as described above, the heat loss generated from the semiconductor element 3 is transferred to the heat receiving portion 5 of the cooler 4, which is transferred to the heat radiating portion 6, and heat is transferred from the heat radiating portion 6 to the atmosphere. Will be dissipated. Therefore, with this structure, since the heat radiating portion 6 is located on the side of the vehicle body, there is an advantage that the exhausted heat is less likely to be trapped under the floor of the vehicle body 1, and traveling wind that flows around the underfloor device group when the vehicle travels. Since it is easy to flow through the heat radiating part 6, the heat radiation performance is also improved.
[0006]
However, in recent vehicles, vehicles having a cover plate so as to cover the periphery of a group of devices installed under the floor have appeared. There are various types of cover plates, such as a cover plate with a shape that extends the lower part of the body structure as it is, or a flat plate cover plate that is located deeper in the center of the vehicle body than the body structure. In any case, the device group is covered with a cover plate provided on the side of the vehicle body of the underfloor device group.
[0007]
FIG. 14 shows a side view of a vehicle provided with a cover plate so as to cover the underfloor equipment group, and FIG. 15 shows a cross-sectional view in the sleeper direction. A cover plate 8 is provided on the vehicle body 1 so as to cover the side of the vehicle body side of the underfloor device group. The purpose of installing the cover plate 8 is various, and high speed vehicles such as Shinkansen vehicles aim to reduce running resistance by covering the entire underfloor equipment group. It is also effective for preventing snow accretion and improving the appearance of the vehicle by eliminating the unevenness generated on the side of the vehicle body. Further, in the vehicular power conversion device, magnetostrictive sound is generated from the energized parts, but there is also an effect of shielding the noise by being covered with a cover plate. In addition, there is a safety merit of preventing tentacles from being applied to equipment that is energized with high voltage.
[0008]
[Problems to be solved by the invention]
As mentioned above, although the merit which provides the railroad vehicle which covers the apparatus group under a vehicle body floor was described, the lid plate 8 provided in the vehicle body side of the vehicle power converter device 2 is from the thermal radiation part 6 of the cooler 4. From the viewpoint of the heat dissipation effect, it is not preferable. The heat loss discharged from the heat radiating section 6 is likely to be trapped in the portion under the floor covered with the cover plate 8, and heat is not efficiently dissipated. The heat radiating section 6 is subjected to heat exchange between the surface of the heat radiating section 6 and the outside air by natural convection, but the air flow rate of natural convection is slowed by being covered with the cover plate 8, and the heat transfer rate is deteriorated. In addition, the air temperature of the portion covered with the cover plate 8 is also high, and it is necessary to secure a temperature difference between the heat radiation part 6 and the outside air in order to handle the same amount of heat loss, which is commensurate with the rise in the outside air temperature. As a result, the temperature of the heat dissipating part 6 increases. The increase in the temperature of the heat radiating unit 6 will also increase the temperature of the heat receiving unit 5 of the cooler 4 and, consequently, the temperature of the semiconductor element 3.
[0009]
In addition, because the cover plate increases the overall ambient temperature of the vehicular power conversion device 2, not only the semiconductor element temperature but also the air temperature in the device increases, and is stored inside the device. It is not preferable for other electrical components. In particular, electrical components such as printed boards on which electronic components vulnerable to heat are mounted may lead to a decrease in reliability.
[0010]
The present invention was made in view of the technical problem seen in the power conversion device in a railway vehicle provided with such a conventional cover plate, even in a vehicle provided with a cover plate covering the equipment under the vehicle floor, It is an object of the present invention to provide a vehicular power conversion device in which a cooler of a power conversion device can efficiently dissipate heat and a temperature increase of a power conversion semiconductor element can be suppressed.
[0011]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a vehicular power conversion device including a device group including a power conversion device installed under a floor of a railway vehicle and provided with a cooler for a semiconductor element on a side of the vehicle body, and a vehicle body of the device group. A cover plate is provided so as to cover the side, and an inner wall thereof is connected to a constituent member of the cooler.
[0012]
According to a second aspect of the present invention, in the power conversion device for a vehicle according to the first aspect, a part or all of the plurality of heat dissipating fins constituting the cooler is connected to the inner wall of the cover plate. It is characterized by that.
[0013]
According to a third aspect of the present invention, in the vehicle power converter according to the first aspect, the cooler uses a heat pipe, and one end of the heat pipe is connected to the inner wall of the cover plate. It is a feature.
[0014]
According to a fourth aspect of the present invention, there is provided a vehicular power conversion device including a device group including a power conversion device installed under a floor of a railway vehicle and provided with a cooler for a semiconductor element on a side of the vehicle body, and a vehicle body of the device group. A cover plate is provided so as to cover the side, and only a portion facing the heat radiating portion of the cooler for the semiconductor element is opened.
[0015]
According to a fifth aspect of the present invention, in the vehicle power converter according to the fourth aspect of the present invention, a member that opens and surrounds the side of the vehicle body is provided in the heat radiating portion of the cooler for the semiconductor element. It connects together with the opening part provided in the cover board, It is characterized by the above-mentioned.
[0016]
According to a sixth aspect of the present invention, there is provided a vehicular power conversion device that is provided so as to cover a device group installed under the floor of a railway vehicle and a side of the vehicle body side of the device group, and a semiconductor element for power conversion is provided on an inner wall thereof. A cover plate directly attached, and a casing that is installed so as to surround the semiconductor element and accommodates other components of the power converter.
[0017]
A seventh aspect of the present invention is the vehicle power converter according to the sixth aspect, characterized in that a radiating fin is provided on the outer side of the cover plate to which a semiconductor element is attached on the inner wall side.
[0018]
The power conversion device for a vehicle according to an eighth aspect of the invention is distributed without being adjacent to a group of devices installed under the floor of a railway vehicle and a cover plate provided to cover the side of the vehicle body side of the group of devices. And the cooler heat radiation part is provided with the semiconductor cooling unit installed toward the vehicle body side side close to the inner side of the said cover board.
[0019]
According to a ninth aspect of the present invention, in the power converter for a vehicle according to the eighth aspect, the upper part of the cover plate is not continuously connected to the vehicle body structure, and at least the vicinity of the cooler of the power converter is opened. It is characterized by this.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
The present invention is used as a heat radiating member by thermally connecting a blocking plate that only inhibits heat dissipation from the power converter as it is, and a cooler in a direction in which the blocking plate and the cooler are integrated. Equipment under the vehicle floor by means such as preventing the heat exhaust from the vehicle side to the side of the vehicle body, or by dissipating the heat source and bringing it close to the cover plate to minimize heat accumulation in the cover plate The vehicle power converter is characterized in that the cooler of the power converter efficiently dissipates heat and suppresses the temperature rise of the power conversion semiconductor element even in a vehicle in which a cover plate is installed.
[0021]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0022]
(First Embodiment) A vehicle power converter according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a cross-sectional view in the direction of sleepers under the vehicle floor, and FIG. 2 shows a cross-sectional view of the power conversion device 2a and the cover plate 8 of the vehicle body 1a.
[0023]
The power converter 2a in the first embodiment is fixed below the floor of the vehicle body 1a. This power converter 2a is installed so that the heat radiating portion 6a of the cooler 4a for cooling the semiconductor element 3 is located on the side of the vehicle body, and the tip of the heat radiating portion 6a is a cover that covers the side of the vehicle body. Connected to the plate 8.
[0024]
The heat dissipation part 6a may be connected to the cover plate 8 by any method such as welding, brazing, or fixing by screw tightening. Regardless of the connection method, heat loss is transferred from the end face of the heat radiating fin of the heat radiating portion 6a to the inner wall of the cover plate 8 by heat conduction, and the cover plate 8 has the function of heat dissipation of the cooler 4a.
[0025]
In the vehicle power converter of the first embodiment having the above configuration, the heat loss generated from the semiconductor element 3 is transferred to the heat receiving portion 5a of the cooler 4a, which is transferred to the heat radiating portion 6a, and further the heat radiating portion. Heat is transferred to the vehicle body cover plate 8 connected to 6 and dissipated to the atmosphere.
[0026]
In this way, the heat loss generated from the semiconductor element 3 is transferred from the heat receiving portion 5a of the cooler 4a to the heat radiating portion 6a and the vehicle body cover plate 8 and is released into the atmosphere, thereby effectively cooling. Temperature rise can also be suppressed. Further, since a cover for protecting the heat radiating portion 6a of the cooler 4a is not necessary, the number of parts of the power conversion device 2a can be reduced, and the power conversion device 2a and the vehicle body 1a can be reduced in weight.
[0027]
As described above, according to the vehicle power conversion device of the first embodiment of the present invention, the cooler for the semiconductor element and the cover plate provided so as to cover the side of the vehicle body are thermally connected. By making the cover plate function as a part of the cooler, safety for tentacles to the equipment installed under the floor, reduction of running resistance, prevention of snowfall, improvement of vehicle aesthetics, shielding of noise such as magnetostrictive sound, etc. It is possible to prevent the cooling performance of the power conversion device from being lowered while ensuring the original function of the cover plate.
[0028]
In addition, heat loss is transferred by heat conduction from the end face of the radiating fin of the cooler for the semiconductor element to the inner wall of the cover plate, and the heat release function of the cooler is given to the cover plate so that the temperature of the semiconductor element in the power converter The rise can be suppressed.
[0029]
(Second Embodiment) A vehicle power converter according to a second embodiment of the present invention will be described with reference to FIGS. FIG. 3 shows a cross-sectional view of the sleeper direction under the vehicle floor, and FIG. 4 shows a cross-sectional view of the power conversion device 2b and the cover plate 8a of the vehicle body 1b.
[0030]
The second embodiment is characterized in that a heat pipe 9 is used for the cooler 4b of the semiconductor element 3 in the power conversion device 2b, and the front end portion of the heat pipe 9 is covered with the side of the vehicle body. By connecting to the plate 8b, heat loss generated from the semiconductor element 3 is transferred from the heat receiving portion 5b of the cooler 4b to the heat radiating portion 6b and the vehicle body cover plate 8b through the heat pipe 9, and is released into the atmosphere. 3 is cooled.
[0031]
As a method of connecting the heat pipe 9 and the cover plate 8a, a method of penetrating and brazing the heat pipe 9 through the inner wall of the cover plate 8a or using a press-fit connection or the like is used, or the heat pipe 9 is passed through. Instead, a method of connecting to the inner wall of the cover plate 8a by brazing can be used. However, there are various modes as to whether the direction is substantially perpendicular to the cover plate 8a or brazing along the cover plate 8a, and any of these methods may be used. By this connection, heat generated by the semiconductor element 3 is transferred from the heat pipe 9 to the cover plate 8a, and the cover plate 8a takes charge of a heat radiation function with a smaller temperature difference from the heat generating portion.
[0032]
As described above, according to the vehicle power conversion device of the second embodiment of the present invention, the heat generated by the semiconductor element is transferred from the heat pipe to the cover plate, and the heat dissipation function having a smaller temperature difference from the heat generating portion is achieved. The cover plate can be used to suppress the temperature rise of the semiconductor element in the power conversion device.
[0033]
(Third Embodiment) A vehicle power converter according to a third embodiment of the present invention will be described with reference to FIGS. FIG. 5 shows a cross-sectional view of the sleeper direction under the vehicle floor, and FIG. 6 shows a cross-sectional view of the power conversion device 2c and the cover plate 8b of the vehicle body 1c.
[0034]
In the third embodiment, an opening 80 is provided only in the portion of the cover plate 8b facing the heat radiating portion 6c of the cooler 4c with respect to the semiconductor element 3 in the power conversion device 2c, and further, the heat dissipation of the cooler 4c with respect to the semiconductor element 3 is performed. An enclosing member 10 surrounding the portion 6c is provided, and this member 10 is connected to the peripheral edge of the opening 80 of the cover plate 8b. Note that the heat of the semiconductor element 3 is received by the heat receiving portion 5c and transferred by heat conduction to the heat radiating portion 6c of the cooler 4c.
[0035]
In the vehicle power conversion device of the third embodiment, only the heat radiating part 6c of the cooler 4c is partitioned from the underfloor space, and it is possible to prevent the cooling performance from deteriorating while ensuring the original function of the cover plate. Become. Here, although the cooler 4c is positioned on the inner side of the cover plate 8b, the enclosure member 10 communicates with the outside air side from the cover plate 8b. However, the cooler 4c is not a component through which a current flows, and voltage is also applied. Therefore, no magnetostrictive sound is generated from this portion, and safety for the tentacle can be secured.
[0036]
In addition, the enclosure member 10 with respect to the heat radiating portion 6c is not provided, and a simpler configuration in which the heat radiating portion 6c and the heat receiving portion 5c are positioned in the opening 80 of the cover plate 8b can be employed. In that case, the cooling air can directly pass through the portion of the opening 80, and the cooling can be effectively performed. A cover provided with punch holes or a louvered cover can be provided in the opening 80 of the cover plate 8b.
[0037]
Thus, according to the power converter for vehicles of a 3rd embodiment of the present invention, by opening the cover board partially, the part is under floor space covered with the cover board, vehicle outside air, and Therefore, the cooling air can directly pass through and contact the heat dissipating part of the cooler for the semiconductor element to dissipate heat, and the temperature rise of the semiconductor element in the power conversion device can be suppressed.
[0038]
In addition, the cover plate is provided with an opening, but this opening can be partitioned from the underfloor space with a member surrounding the heat dissipating part of the cooler, and only the cooler heat dissipating part is partitioned from the underfloor space, Prevents deterioration of cooling performance while ensuring the original function of the cover plate. As a result, while this cooler is located on the inner side of the cover plate, the cooler is connected to the outside air side by the partition, but the cooler is not a component through which current flows and voltage is not applied. No magnetostrictive sound is generated from this portion, and safety for the tentacles can be secured.
[0039]
(Fourth Embodiment) A vehicle power converter according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 7 shows a cross-sectional view of the sleeper direction under the vehicle floor.
[0040]
In the fourth embodiment, the semiconductor element 3 is directly attached to the inner wall of the cover plate 8c under the floor of the vehicle body 1d, and the power conversion circuit is configured in the casing of the power conversion device 2d installed so as to surround the semiconductor element 3. It is characterized by storing a group of parts.
[0041]
In the present embodiment, the heat generation of the semiconductor element 3 of the power conversion device 2d is received by the inner wall portion of the cover plate 8c that is in direct contact as the heat receiving portion 5d, and the surface of the cover plate 8c on the side of the vehicle body side is received. The heat radiating part 6d radiates heat to the outside air.
[0042]
As described above, according to the fourth embodiment, all the functions of the cooler for the semiconductor element 3 of the power conversion device 2d are provided in the cover plate 8c, and the cover plate 8c and the power conversion device 2d are integrated to provide power. By causing the cover plate 8c to take charge of the housing function on the side of the vehicle body of the conversion device 2d, the temperature rise of the semiconductor element of the power conversion device due to heat dissipation by heat exchange with the outside air can be suppressed, and the original function of the cover plate Can also be fulfilled. Also, the number of parts can be reduced, and the number of parts of the power conversion device and other underfloor equipment can be reduced, and the power conversion device and other underfloor equipment, and the weight of the vehicle body can be reduced.
[0043]
(Fifth Embodiment) A vehicle power converter according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 8 shows a cross-sectional view of the sleeper direction under the vehicle floor.
[0044]
In the fifth embodiment, the semiconductor element 3 is directly attached to the inner wall of the cover plate 8d under the floor of the vehicle body 1d, and the power conversion circuit is configured in the casing of the power conversion device 2d installed so as to surround the semiconductor element 3. And a fin-like protrusion is provided on the cover plate 8d as the heat dissipating part 6d.
[0045]
According to the vehicle power conversion device of the fifth embodiment of the present invention, the heat generation of the semiconductor element 3 of the power conversion device 2d is received by the inner wall portion of the cover plate 8c in direct contact with the heat receiving portion 5d. In addition, since the portion with fin-like protrusions on the surface of the side plate of the cover plate 8c radiates heat to the outside as the heat radiating portion 6d, the heat release area on the outside air side of the cover plate is increased, and according to the case of the fourth embodiment More effective cooling is possible.
[0046]
(Sixth Embodiment) A vehicle power converter according to a sixth embodiment of the present invention will be described with reference to FIGS. 9 shows a cross-sectional view of the power converter 2e and the cover plate 8 under the vehicle floor, and FIG. 10 shows a cross-sectional view in the direction of sleepers under the vehicle floor.
[0047]
In the sixth embodiment, the cooler 4d for the semiconductor element 3 is composed of a heat receiving part 5e and a heat radiating part 6e. The coolers 4d are arranged in a distributed manner without being adjacent to each other, and the heat radiating part 6e of the cooler 4d is blocked by this. It is directed to the side of the vehicle body in the vicinity of the inside of the plate 8.
[0048]
According to the vehicle power converter of the sixth embodiment of the present invention, each cooler 4d and the cover plate 8 are not mechanically connected, so that heat discharged from the cooler 4d is directly transmitted by heat conduction. Although heat is not transferred to the cover plate 8, the heat radiating portion 6 e is arranged close to the inner wall of the cover plate 8, so that heat can be transferred to the cover plate 8 by radiation and becomes a heat source. Since the semiconductor element 3 and the cooler 4d are arranged in a distributed manner, the heat discharged into the cover plate 8 is also dispersed by the convection in the underfloor space of the vehicle body 1e, and the temperature rise in the underfloor space is suppressed. It is possible to suppress degradation of the heat dissipation performance of the cooler 4d.
[0049]
(Seventh Embodiment) A vehicle power converter according to a seventh embodiment of the present invention will be described with reference to FIG. FIG. 11 shows a cross-sectional view under the vehicle floor.
[0050]
The seventh embodiment is characterized in that an opening 81 is provided at least in the vicinity of the cooler 4e of the power conversion device 2f without being continuously connected to the structure of the vehicle body 1f above the cover plate 8e. Yes.
[0051]
In the present embodiment, the heat generated by the semiconductor element 3 of the power conversion device 2f is received by the heat receiving portion 5f of the cooler 4e and transferred to the heat radiating portion 6f. Therefore, in the heat radiating portion 6f, a cooling air Air that has passed through the heat radiating portion 6f from below can be formed to flow from the opening 81 to the side of the vehicle body, so that effective cooling can be obtained.
[0052]
Thus, according to the vehicle power converter of the seventh embodiment of the present invention, the cooling air that has passed through the heat radiating portion from below the cooler heat radiating portion moves from the opening portion of the cover plate toward the side of the vehicle body. A flow of discharged air can be formed, heat generated by the semiconductor element can be dissipated by the heat radiating portion, and a temperature rise of the semiconductor element in the power conversion device can be suppressed, and effective cooling can be performed.
[0053]
【The invention's effect】
As described above, according to the present invention, the cooler of the power conversion device can efficiently dissipate heat even in a vehicle in which the cover plate that covers the equipment under the vehicle floor is installed, and the temperature rise of the semiconductor element can be suppressed. .
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a power conversion device for a vehicle according to a first embodiment of the present invention in the direction of a railroad vehicle under-floor sleeper.
FIG. 2 is a cross-sectional view of the railway power converter and the vehicle body cover plate according to the first embodiment.
FIG. 3 is a cross-sectional view of a vehicular power converter according to a second embodiment of the present invention in the direction of a railway vehicle under-floor sleeper.
FIG. 4 is a cross-sectional view of a railway power conversion device and a vehicle body cover plate according to the second embodiment.
FIG. 5 is a cross-sectional view of a power conversion device for a vehicle according to a third embodiment of the present invention in the direction of a railroad vehicle under-floor sleeper.
FIG. 6 is a cross-sectional view of the vehicle power converter and the vehicle body cover plate according to the third embodiment.
FIG. 7 is a cross-sectional view of a power conversion device for a vehicle according to a fourth embodiment of the present invention in the direction of a railway vehicle under-floor sleeper.
FIG. 8 is a cross-sectional view of a vehicular power converter according to a fifth embodiment of the present invention in the direction of a railroad vehicle under-floor sleeper.
FIG. 9 is a cross-sectional view of a vehicle power converter and a vehicle body cover plate according to a sixth embodiment of the present invention.
FIG. 10 is a cross-sectional view of the vehicular power converter according to the sixth embodiment in the direction of a railroad vehicle under-floor sleeper.
FIG. 11 is a cross-sectional view of a vehicular power converter according to a seventh embodiment of the present invention in the direction of a railroad vehicle under-floor sleeper.
FIG. 12 is a perspective view showing a state in which a conventional vehicle power converter is installed under the vehicle floor.
FIG. 13 is a cross-sectional view of the conventional vehicular power conversion device in the direction of a railroad car under floor sleeper.
FIG. 14 is a side view of a vehicle in which a cover plate is provided so as to cover a conventional underfloor device group.
15 is a sectional view taken along line XX in FIG.
[Explanation of symbols]
1a, 1b, 1c, 1d, 1e, 1f Car body 2a, 2b, 2c, 2d, 2e, 2f Power conversion device 3 Semiconductor elements 4, 4a, 4b, 4c, 4d, 4e Coolers 5, 5a, 5b, 5c, 5d, 5e, 5f Heat receiving portion 6, 6a, 6b, 6c, 6d, 6e, 6f Heat radiation portion 8, 8a, 8b, 8c, 8d, 8e Cover plate 9 Heat pipe 10 Enclosure member 80 Opening 81 Opening portion

Claims (9)

A group of devices including a power conversion device installed under the floor of a railway vehicle and provided with a cooler for semiconductor elements on the side of the vehicle body;
A vehicular power conversion device comprising: a cover plate that is provided so as to cover a side of the vehicle body side of the device group and whose inner wall is connected to a constituent member of the cooler. The vehicular power converter according to claim 1, wherein an end surface portion of a part or all of the plurality of heat dissipating fins constituting the cooler is connected to an inner wall of the cover plate. The vehicular power converter according to claim 1, wherein the cooler uses a heat pipe, and one end of the heat pipe is connected to an inner wall of a cover plate. A group of devices including a power conversion device installed under the floor of a railway vehicle and provided with a cooler for semiconductor elements on the side of the vehicle body;
A vehicular power converter comprising: a cover plate provided so as to cover a side of the vehicle body side of the device group and having an opening only at a portion facing a heat radiating portion of the cooler for the semiconductor element. . A member that opens and surrounds the side of the vehicle body is provided in the heat dissipating part of the cooler for the semiconductor element, and an end surface of the member is connected together with an opening provided in the cover plate. The power converter for vehicles according to claim 4. A group of equipment installed under the floor of the railway vehicle;
A cover plate that is provided so as to cover the side of the vehicle body side of the device group, and a semiconductor element for power conversion is directly attached to the inner wall thereof;
A vehicle power converter comprising: a housing that is installed so as to surround the semiconductor element and that houses other components of the power converter. 7. The vehicular power converter according to claim 6, wherein a radiating fin is provided on an outer side of the cover plate having a semiconductor element attached to the inner wall side. A group of equipment installed under the railcar floor;
A cover plate provided to cover the vehicle body side of the device group;
A vehicle power conversion comprising: a semiconductor cooling unit that is distributed without being adjacent to each other, and whose cooler heat dissipating part is disposed toward the side of the vehicle body close to the inside of the cover plate apparatus. 9. The vehicular power converter according to claim 8, wherein the upper part of the cover plate is not continuously connected to the vehicle body structure, and at least the vicinity of the cooler of the power converter is opened.

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