JP2005030780A - Semiconductor inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor inspection device capable of easily selecting a target inspecting position. <P>SOLUTION: The photograph of an object to be inspected is displayed on a monitor and the component difference between the present coordinates and the coordinates of the region designated by a pointing device is calculated as the number of pixels of the photograph of the object to be inspected displayed on the monitor. An actual moving distance is calculated from the number of pixels and the display resolving power of the image of the object to be inspected to control the movement of the object to be inspected. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor inspection apparatus that moves and adjusts by a moving body driving means so that an inspection portion of an object to be inspected such as a semiconductor wafer comes to a position where inspection means can inspect.
[0002]
[Prior art]
Conventionally, in such a semiconductor inspection apparatus, for example, when a semiconductor wafer is moved, the moving direction and moving distance of the inspection location are directly designated. Alternatively, it is general that the chip arrangement on the semiconductor wafer is imaged and displayed, and the target chip is designated and moved to the same target chip location as the current chip inspection location (this location). .
[0003]
In addition, there is no correlation between the displayed image and the size of the semiconductor wafer, and in the above method, the current position of the part is always conscious in order to move to an arbitrary target position. It takes time and effort to move to an arbitrary position, such as the operator calculating the moving direction and distance, or performing the operation again to the target position after moving to the part.
[0004]
[Problems to be solved by the invention]
An object of the present invention is to provide an easy-to-use semiconductor inspection apparatus in which a target position (inspection location) to be inspected can be easily selected, and the inspection location is automatically moved to a position where it can be inspected by a detection means. To do.
[0005]
[Means for Solving the Problems]
The present invention provides a semiconductor inspection apparatus in which movement adjustment is performed by a moving body driving means so that an inspection portion of an inspection object comes to a position where inspection can be performed by a detection means. A CCD camera that can be photographed so as to be housed, a calculator that calculates vertical and horizontal coordinate information photographed by the CCD camera, a monitor device having a display screen including an image display area on which an image photographed by the CCD camera is displayed, A pointing device that can arbitrarily specify the inspection target position is provided on the image display area. On the image display area, an inspectable position that can be inspected by the detection means when photographing with the CCD camera is displayed as the current position. Based on the coordinate information of the current position and inspection target position, it is calculated by a computer, and the inspection target position specified by the pointing device is In and controlling the movable body drive means to come to a position that can be inspected.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0007]
First, an outline of a semiconductor inspection apparatus according to an embodiment of the present invention will be described with reference to FIG.
[0008]
A semiconductor wafer 6 (inspection object) is placed on a stage 5 (placement moving body) that moves vertically and horizontally. The stage driving device 7 (stage driving means) drives the stage 5 in the X and Y directions (vertical and horizontal) in the three-dimensional orthogonal coordinate system. The monitor device 1 displays the wafer 6 to be inspected.
[0009]
The inspection head 50 includes a detection unit 8 (detection means) and the CCD camera 4. The detection unit 8 (detection means) has a light emitting means and a light receiving means, and the light receiving means receives the light emitted from the light emitting means that rebounds from the inspection position of the inspection object (wafer 6). Inspection is performed. The detector 8 (detector) and the CCD camera 4 are desirably provided close to each other. The alignment accuracy of the inspection target position is improved. The inspection signal received by the light receiving means is sent to the computer 3 where the computer 3 performs arithmetic processing to evaluate the inspection.
[0010]
The image signal captured by the CCD camera 4 is sent to the computer 3. The monitor device 1 displays the wafer 6 photographed based on the image information signal sent from the computer 3.
[0011]
The pointing device 2 gives an instruction to select a position to be inspected on the display screen 11 via the computer 3. The keyboard 9 manages various settings and operation instructions (performs general-purpose input) via the computer 3.
[0012]
The display screen 11 of the monitor device 1 has an image display area and a command display area as shown in FIG. The photographed wafer 6 is displayed in the image display area. In addition to the display of the wafer 6, the cross cursor 12 is displayed so as to overlap the photographed image. The cross point of the cross cursor 12 indicates the current position 10. The current position 10 corresponds to the inspection position of the inspection object (wafer 6) where the inspection signal of the detection unit 8 (detection means) rebounds. In this embodiment, the inspection position of the inspection object (wafer 6) is directly below the detection unit 8 (detection means).
[0013]
In the image display area, chips arranged in a lattice pattern of the inspection object are displayed, so that the inspection target position 15 of the chip to be inspected can be specified by following the point of the pointing device 2 while viewing the display. For this reason, selection of the inspection target position 15 can be easily performed without error.
[0014]
In addition, when the pointing device 2 is specified (clicked), a movement vector 14 that connects the current position 10 and the inspection target position 15 is displayed, and the movement amount (movement length) can be visually recognized.
[0015]
In the command display area of the display screen 11, a display magnification, a magnification setting slider 16, and a movement instruction button 13 are displayed.
[0016]
By operating the magnification setting slider 16 in the command display area with the pointing device 2, the display of the wafer is enlarged / reduced. FIG. 3 shows an enlarged display. Enlarging / reducing is performed by placing the point of the pointing device 2 on the magnification setting slider 16 and moving it to the left or right to change the magnification linearly. The switching of the enlarged display can be repeated.
[0017]
The button 13 in the command display area is a function button for instructing driving of the stage driving device 7 that moves the stage 5. An instruction is given by placing the point of the pointing device 2 on the button 13 and clicking.
[0018]
In response to an instruction from the button 13, the stage 5 moves and the inspection target position 15 is carried to the current position 10. That is, the movement is performed so that the inspection target position 15 is directly below the detection unit 8 (detection means).
[0019]
The stage driving device 7 that moves the stage 5 has servo motors that move in the X and Y directions (vertical and horizontal), and moves the stage 5 to a predetermined position by the cooperation of both servo motors.
[0020]
Next, drive control of the stage drive device 7 will be described.
[0021]
Drive control of the stage drive device 7 (control of the moving body drive means) is performed by calculation of the computer 3. The computer 3 records an image signal of the inspection object (wafer 6) taken by the CCD camera 4.
[0022]
Since this image signal is configured in units of pixels taken by the CCD camera 4, the X (horizontal direction) component of the movement vector 14 connecting the current position 10 and the inspection target position 15 designated by the pointing device 2, Y (vertical) (Direction) component is obtained as the number of pixels. The number of pixels counted from the display resolution of the captured image is converted into a moving distance. The stage 5 is moved by the drive control of the stage driving device 7 in accordance with the moving distance, the inspection target position 15 moves to the cross point of the cross cursor 12, and the inspection target position 15 (chip to be inspected) is detected by the detection unit 8 ( It comes under the detection means).
[0023]
As described above, by the drive control of the stage driving device 7, the alignment is automatically performed in which the selected inspection target position 15 is positioned directly below the detection unit 8 (detection means) (a position where inspection can be performed). In addition, since the alignment is performed by the drive control obtained from the fine number of pixels photographed by the CCD camera 4, the alignment accuracy is high.
[0024]
Next, the stage moving process of the semiconductor inspection apparatus configured as described above will be described with reference to the flowchart shown in FIG.
[0025]
In step A, an image of the entire wafer is taken when the wafer is loaded. In step B, the image is displayed on the monitor device 1 as a display screen 11 showing a photographed image of the wafer, and a display magnification is set by a magnification setting slider 16. The inspection target position 15 is specified using the pointing device 2 on the display screen 11 displayed on the monitor device 1 in step C. If the enlarged display function is designated, the process returns to the wafer photo display in step B. What is displayed at this time is an enlarged display screen 17. The operator confirms the inspection target position 15 and then presses the button 13 in step D. The display resolution of the display screen 11 is calculated from the field of view of the image taken in step E and the number of pixels in the display area of the display screen 11. In step F, the number of pixels of the movement vector 14 is obtained as the difference in the number of X and Y components between the coordinates of the current position 10 and the coordinates of the inspection target position 15, and in step G, the X and Y components are multiplied by the display resolution of the display screen 11. Thus, the moving distance is calculated.
[0026]
【The invention's effect】
According to the present invention, it is possible to easily select a target position to be inspected.
[Brief description of the drawings]
FIG. 1 is a diagram showing an outline of a semiconductor inspection apparatus according to an embodiment of the present invention. .
FIG. 2 is a display screen showing a photographed image of a wafer according to an embodiment of the present invention.
FIG. 3 relates to an embodiment of the present invention, and is a display screen showing an enlarged photographed image of a wafer.
FIG. 4 is a flowchart showing a stage moving step according to the embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Monitor apparatus, 2 ... Pointing device, 3 ... Computer, 4 ... CCD camera, 5 ... Stage, 6 ... Wafer, 7 ... Stage drive device, 8 ... Wafer inspection apparatus, 9 ... Keyboard, 10 ... Current position, 11 ... Display screen, 12 ... cross cursor, 13 ... button, 14 ... movement vector, 15 ... inspection target position, 16 ... magnification setting slider, 17 ... enlarged display screen.

Claims (4)

A mounting moving body for moving an object to be inspected such as a semiconductor wafer and moving vertically and horizontally, a moving body driving means for driving the mounting moving body, and an inspection signal rebounding from an inspection position of the object to be inspected. In a semiconductor inspection apparatus having an inspection head provided with a detecting means for detecting, and moving adjustment is performed by a moving body driving means so that an inspection portion of the inspection object is located at a position where the inspection means can be inspected,
A CCD camera provided on the inspection head and capable of photographing so as to accommodate the entire object to be inspected, a calculator for calculating vertical and horizontal coordinate information photographed by the CCD camera, and an image photographed by the CCD camera A monitor device having a display screen including an image display area to be displayed, and a pointing device capable of arbitrarily specifying an inspection target position on the image display area;
On the recording image display area, an inspectable position that can be inspected by the detection means when photographing with the CCD camera is displayed as a current position,
Based on the coordinate information of the current position and the inspection target position, calculation is performed by the computer, and the moving body driving means is controlled so that the inspection target position designated by the pointing device is located at a position where inspection can be performed by the detection means. A semiconductor inspection apparatus. The semiconductor inspection apparatus according to claim 1,
A semiconductor inspection apparatus comprising a display magnification adjustment function for changing a display magnification of the image displayed in the image display area. The semiconductor inspection apparatus according to claim 1,
A semiconductor inspection apparatus, wherein a movement vector line connecting the current position and the inspection target position is displayed. The semiconductor inspection apparatus according to claim 1,
A command display area is provided on the display screen, and a display magnification adjustment command for operating a display magnification adjustment function and an instruction movement command for moving the inspection target position to a position where the detection means can be inspected are displayed in the command display area. A semiconductor inspection apparatus characterized by that.

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