JP2005014596A - Method of sealing resin of semiconductor chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of cleaning a molding mold which is capable of efficiently removing dirts inside the mold. <P>SOLUTION: This invention is characterized in that a sheet 8 for cleaning the molding mold having a large number of pores allowing resin 9 particles for cleaning to pass through is prepared, the molding mold cleaning sheet 8 is clamped so as to be in contact with an entire mating surface area of the mold 1 consisting of an upper mold 1a and a lower mold 1b, the cleaning resin 9 is caused to permeate into the sheet 8 by pressurizing the resin 9 to fill the inside of the mold 1 and the sheet 8 to which the cleaning resin 9 sticks is taken out by separating the first mold 1a from the second mold 1b after an elapse of a fixed time. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a technique that is effective when applied to the removal of dirt such as oil and dust adhering to the inside of a molding die.

  For example, a semiconductor chip on which a predetermined circuit element is formed is electrically connected to a lead frame and then sealed with a predetermined member in order to protect it from an external atmosphere such as dust and humidity and mechanical shock. Stopped. Generally, the sealing form of a semiconductor chip is divided into a hermetic sealing that is sealed with a low melting point alloy or glass, and a resin sealing that is molded and sealed with a resin using a molding die (non-hermetic sealing). . Examples of the semiconductor device sealing technology described in detail are, for example, published by Nikkei BP, “Practical Course VLSI Packaging Technology (above)” (issued May 31, 1993), P76 to P79. (Non-Patent Document 1).

  In resin sealing, oil and dust are formed on the cavity forming surface of the upper mold and the lower mold that form a pair of molding molds, that is, inside the molding mold filled with the resin by repeated molding sealing. Dirt such as will accumulate.

  Such dirt causes a phenomenon that adversely affects the molding quality, such as a short shot. Therefore, an operator needs to clean the molding die every certain number of shots. However, since it takes a considerable amount of time to clean the molding die by an operator, a technique that can clean the molding die in a short time is required.

In response to this requirement, a lead frame on which no semiconductor chip is mounted is clamped in a molding die, and a cleaning resin mixed with dirt removing components such as ammonia and formalin is injected. It is conceivable to clean the mold.
Published by Nikkei BP, "Practical Course VLSI Packaging Technology (above)" (issued May 31, 1993), P76-P79

  However, according to this technology, an expensive lead frame is used for cleaning a molding die which is not the original purpose, which is not economical, and the molding die has a specific shape lead adapted to it. Since the frame is set at a predetermined position and clamped, accuracy for positioning is required and workability is poor. Further, an air vent (that is, an air escape port in the cavity) is provided in the molding die to completely fill the resin in the cavity. This area cannot be completely removed without filling up the air vent, and must be manually cleaned again.

  Therefore, an object of the present invention is to provide a technique capable of efficiently removing dirt in a molding die.

  Another object of the present invention is to provide a technique capable of cleaning the inside of a molding die at a low cost.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  The outline of typical inventions among the inventions disclosed in the present application will be described as follows.

  That is, according to the resin sealing method of a semiconductor chip according to the present invention, a semiconductor chip on which a predetermined circuit element is formed is formed of a pair of first mold and second mold and having a cavity portion and an air vent portion. Resin sealing of a semiconductor chip having a step of resin-sealing using a mold, a molding die cleaning step of cleaning the molding die, and a step of resin-sealing a semiconductor chip using the cleaned molding die The molding die cleaning step is a step of preparing a cleaning sheet formed of a material having heat resistance and flexibility and having a thickness equal to or greater than the thickness of the lead frame, and the molding die A step of clamping the cleaning sheet, and then pressurizing the cleaning resin to remove the cleaning resin from the cavity of the molding die. And a step of filling the air vent portion, in which thereafter said first mold and said second mold and said cleaning resin by separating the and a step of taking out the cleaning sheet attached.

 The molding die cleaning sheet according to the present invention cleans the inside of a molding die composed of a pair of a first die and a second die, and is made of a material having heat resistance and flexibility. A large number of pores that are formed and through which the particles of the cleaning resin can pass are formed.

  In this case, the above-described molding die cleaning sheet can be made of pulp or cotton. Further, the above-described molding die cleaning sheet can be impregnated with a release agent.

  In the molding die cleaning method according to the present invention, the above-described molding die cleaning sheet is prepared, and the molding die cleaning sheet is formed of a pair of a first die and a second die. The mold is clamped so as to be in contact with the entire mating surface, the cleaning resin is pressurized and filled into the molding die while penetrating into the molding die cleaning sheet. The mold and the second mold are separated from each other, and the molding mold cleaning sheet with the cleaning resin attached is taken out.

  In the molding die cleaning method according to the present invention, the above-described molding die cleaning sheet is prepared, and the molding die cleaning sheet is impregnated with a release agent, and the pair of first die and second die are prepared. Clamp it so that it is in contact with the entire area of the mating surface of the molding die, and pressurize the cleaning resin to infiltrate the molding die cleaning sheet and fill the inside of the molding die. The first mold and the second mold are separated from each other after a lapse of a certain time, and the molding mold cleaning sheet with the cleaning resin attached is taken out.

  According to the present invention, the molding die can be cleaned with a relatively inexpensive molding die cleaning sheet made of, for example, pulp instead of the lead frame, so that cleaning at a low cost is possible.

  In addition, the molding die cleaning sheet is simply clamped between the first die and the second die, and the cleaning resin may be infiltrated into this, so that the molding die is used as in the case of using a lead frame. There is no need for highly accurate positioning with respect to the mold, and workability is improved.

  Furthermore, since a mold having various cavities can be cleaned with one type of mold cleaning sheet, cleaning at a low cost is possible.

  The cleaning resin is reliably filled up to the air vent with the molding die cleaning sheet, so that when the molding die cleaning sheet to which the cleaning resin is attached is taken out, there are no uncleaned parts and dirt is removed. It becomes possible to remove efficiently.

Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.
(1) That is, according to the present invention, the cleaning resin is infiltrated into the molding die cleaning sheet, and the molding die cleaning sheet to which the resin adheres is taken out after a lapse of a certain time. The entire interior is uniformly cleaned. Therefore, since the molding die can be cleaned with a relatively inexpensive molding die cleaning sheet made of pulp or the like instead of the lead frame, the molding die can be cleaned at a low cost.
(2). Simply clamp the mold cleaning sheet with the first mold and the second mold, and infiltrate the cleaning resin into this, as in the case of using a lead frame. There is no need for highly accurate positioning with respect to the molding die, and workability is improved.
(3) Since a molding die having various cavity shapes can be cleaned with one type of molding die cleaning sheet, cleaning at a low cost becomes possible.
(4) Since the cleaning resin is reliably filled up to the air vent by the molding die cleaning sheet, there are no uncleaned parts when the molding die cleaning sheet with the cleaning resin attached is removed, It becomes possible to remove dirt efficiently.
(5) By using a mold release agent, the mold release property between the cleaning resin and the molding die at the time of taking out the cleaning resin becomes good, so that the working efficiency is further improved.

  Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings.

  FIG. 1 is a cross-sectional view showing a molding die cleaned using a molding die cleaning sheet according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the molding die cleaning sheet.

  The molding die 1 in this embodiment is, for example, for sealing a semiconductor chip (not shown) mounted on a lead frame with a resin, and an upper platen 2a and a lower platen that are relatively close to and away from each other. An upper mold (first mold) 1a and a lower mold (second mold) 1b are fixed to the opposing surface of the platen 2b. Therefore, the upper mold 1a and the lower mold 1b are brought into close contact with and separated from each other by the approach and separation of the upper and lower platens 2a and 2b.

  On the mating surface of the upper mold 1a and the lower mold 1b, cavities 3 having a predetermined shape where semiconductor chips are located are formed at a plurality of locations. A cylindrical pot 4 into which resin is injected is formed through the center of the upper mold 1a, and a cull 5 is engraved in the center of the lower mold 1b corresponding to the pot 4. .

  Further, a plurality of runners 6 and a cull 5 communicated with the plurality of cavities 3 are branched from the cull 5 so that the upper platen 2a and the lower platen 2b come close to each other and the upper mold 1a. In a state where the lower mold 1 b is in close contact with the lower mold 1 b, the bottom surface of the pot 4 is closed by the cull 5, and the pot 4 is communicated with the plurality of cavities 3 through the cull 5 and the runner 6. Note that an air vent 7 is formed outside the cavity 3 to allow the air in the cavity 3 to escape to the outside so as to completely fill the resin.

  A molding die cleaning sheet 8 is clamped to the mating surface of the upper die 1a and the lower die 1b so as to be in contact with the entire area of the mating surface. As shown in FIG. 2, this mold cleaning sheet 8 is formed into a sheet shape made of a material that has heat resistance and flexibility, such as pulp, and is easy to burn and dissolve. Many pores 8a having a diameter of 0.5 mm, for example, are formed on the entire surface so that particles of the resin 9 (FIG. 1) can pass through. The molding die cleaning sheet 8 has a thickness greater than that of the lead frame, for example, 1 mm. Further, the molding die cleaning sheet 8 is impregnated with a release agent that relaxes the adhesion between the cleaning resin 9 and the molding die 1 so that the cleaning resin 9 can be easily removed from the molding die 1. It has become.

  A plunger 10 that can enter the pot 4 is provided at a position facing the pot 4. Further, a cleaning resin 9 made of a lump-like resin heated to a predetermined temperature is introduced into the pot 4. Therefore, when the cleaning resin 9 is pressurized by the plunger 10, the upper mold 1a and the lower mold are formed while the cleaning resin 9 in a fluid state is permeated into the molding mold cleaning sheet 8 in which the pores 8a are formed. The cavity 3, runner 6, air vent 7, etc. formed on the mating surface with 1 b are filled. The cleaning resin 9 is a resin in which ammonia, formalin, or the like is mixed, so that dirt inside the molding die 1 is removed.

  Cleaning of the inside of the molding die 1 with such a molding die cleaning sheet 8 is performed as follows.

  First, the upper platen 2a and the lower platen 2b are brought close to each other, and the molding die cleaning sheet 8 is clamped by the upper die 1a and the lower die 1b. At this time, the molding die cleaning sheet 8 is clamped so as to be in contact with the entire area of the mating surface of the upper die 1a and the lower die 1b. Then, when the cleaning resin 9 in the pot 4 is pressurized by the plunger 10, the upper mold 1 a and the lower mold are moved while the cleaning resin 9 in a fluid state is permeated into the pores 8 a of the molding mold cleaning sheet 8. The cavity 3 or the like formed on the mating surface with the mold 1b is filled.

  If the cleaning resin 9 is left filled in the molding die 1 through the molding die cleaning sheet 8, dirt such as oil and dust accumulated by the action of ammonia and formalin is removed. The After leaving for a certain period of time, the upper and lower platens 2a and 2b are moved away from each other to separate the upper mold 1a and the lower mold 1b, and then the molding mold in which the solidified cleaning resin 9 is adhered to the whole. A cleaning sheet 8 appears. When this is taken out from the molding die 1 by the action of the impregnated release agent, a cleaned cavity 3, runner 6, air vent 7 and the like are obtained.

  Thus, according to the present embodiment, the cleaning resin 9 is infiltrated into the molding die cleaning sheet 8 so as to spread all over the molding die 1, and the cleaning resin 9 of the cleaning die 9 is passed after a predetermined time has passed. The inside of the molding die 1 is cleaned by removing the adhered molding die cleaning sheet 8.

  Therefore, since a relatively inexpensive molding die cleaning sheet 8 made of, for example, pulp or the like can be used for cleaning the molding die 1 instead of an expensive lead frame, the molding die 1 is cleaned at a low cost. Can be

  In addition, since the upper mold 1a and the lower mold 1b are not restrained by the positions of the pot 4 and the cavity 3, the mold mold cleaning sheet 8 can be clamped and the cleaning resin 9 can be infiltrated therewith. The workability is improved because there is no need for highly accurate positioning with respect to the molding die 1 as in the case of using a lead frame.

  Furthermore, since the molding die 1 having various cavity shapes can be cleaned with one type of molding die cleaning sheet 8, cleaning can be performed at low cost also in this respect.

  Since the cleaning resin 9 is reliably filled up to the air vent 7 by the molding die cleaning sheet 8, the portion not cleaned when the molding die cleaning sheet 8 to which the cleaning resin 9 is attached is taken out. The dirt can be removed efficiently.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiments. However, the present invention is not limited to the above embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention. Yes.

  For example, the molding die in this embodiment is for sealing a semiconductor chip with a resin, but is not limited to this, and other various injection moldings that require periodic cleaning. It can be applied to a molding die for use in transfer molding.

  In addition, the molding die cleaning sheet 8 according to the present embodiment is made of pulp, but various materials can be applied as long as they are formed into a sheet shape by a material having heat resistance and flexibility. it can. For example, the mold cleaning sheet 18 can be made of a cloth such as cotton, which is a woven cloth as shown in FIG. 3, and a metal cloth formed by weaving a thread metal is also used. can do. Accordingly, the pores 8a include not only bubbles generated in the manufacturing process or those formed by punching, but also meshes formed by knitting a thread-like member.

  In view of the ease of disposal, it is desirable that the molding die cleaning sheets 8 and 18 are made of a material that can be easily burned and dissolved. Further, when the thickness of the molding die cleaning sheets 8 and 18 is insufficient, that is, when the thickness is thinner than the lead frame to be molded, it may be used by stacking them up to the thickness of the lead frame. .

  Further, from the viewpoint of easy separation from the molding die 1, the molding die cleaning sheets 8 and 18 are preferably impregnated with a release agent, but this is not an essential condition. Further, the mold release agent can be impregnated in advance in the molding die cleaning sheets 8 and 18 at the manufacturing stage, or can be impregnated separately before clamping with the upper die 1a and the lower die 1b. it can.

It is sectional drawing which shows the molding die cleaned using the molding die cleaning sheet | seat by one Example of this invention. It is a perspective view which shows the sheet | seat for molding metal mold | die cleaning. FIG. 6 is a perspective view showing a molding die cleaning sheet according to another embodiment of the present invention.

Explanation of symbols

1 Mold 1a Upper mold (first mold)
1b Lower mold (second mold)
2a Upper platen 2b Lower platen 3 Cavity 4 Pot 5 Cull 6 Runner 7 Air vent 8 Mold cleaning sheet 8a Pore 9 Cleaning resin 10 Plunger 18 Mold cleaning sheet

Claims (3)

A step of resin-sealing a semiconductor chip on which a predetermined circuit element is formed, using a molding die comprising a pair of a first die and a second die and having a cavity portion and an air vent portion; A semiconductor chip resin sealing method comprising: a molding die cleaning step for cleaning a mold; and a step of resin sealing the semiconductor chip using the cleaned molding die,
The mold cleaning process includes
A step of preparing a cleaning sheet formed of a material having heat resistance and flexibility and having a thickness equal to or greater than the thickness of the lead frame;
Clamping the cleaning sheet to the molding die;
And then pressurizing the cleaning resin to fill the cavity and air vent of the molding die with the cleaning resin;
And a step of separating the first mold and the second mold and taking out the cleaning sheet to which the cleaning resin is adhered.   The method for sealing a semiconductor chip according to claim 1, wherein the cleaning sheet used in the molding die cleaning step has a large number of pores through which particles of the cleaning resin can pass. 3. The resin sealing method for a semiconductor chip according to claim 1, wherein the cleaning sheet used in the molding die cleaning step is impregnated with a release agent.

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