JP2005011954A - Lead wire holding construction - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely hold a lead wire without requesting a complicated metal die to form a mold for holding the lead wire in the lead wire holding construction. <P>SOLUTION: A lead wire holding hole 4 to hold the lead wire 2 and an aperture 5 to insert the lead wire 2 to the lead wire holding hole 4 are formed to the mold 3 on which electronic components are mounted, and a projected portion 7 is also provided to the surface 6 opposing to the aperture 5. The aperture 5 is formed to provide the relationship of C < ϕA < B among a clearance C in the surface direction opposing to the area between the ends 7a of two projected portions 7, a gap B in which interval distance between the opposite surfaces including the projected portion 7, and the diameter ϕA of the lead wire. Accordingly, the lead wire 2 is inserted into the lead wire holding hole 4 through the gap B, and the lead wire 2 inserted into the lead wire holding hole 4 is surely be held. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a holding structure for lead wires derived from electronic components used in electronic equipment.
[0002]
[Prior art]
An example of a conventional lead wire holding structure of this type is shown in FIG. In this lead wire holding structure 101, the lead wire 2 led out from the electronic component 10 installed on the upper surface 103a of the molded product 103 is routed and held on a circuit board (not shown) installed on the lower surface 103b of the molded product 103. The molded product 103 has a lead wire holding hole 104 for holding the lead wire 2 so that it does not hit other electronic components, and the lead wire 2 connected to the circuit board. An opening 105 that can be taken in and out of the lead wire holding hole 104 is formed. Such a conventional lead wire holding structure 101 does not have a structure for preventing the lead wire 2 from coming out of the opening 105, and the lead wire extends in the opening direction of the opening 105 (the direction of arrow a in the figure). 2 was easy to escape.
[0003]
On the other hand, a lead wire floating prevention device is known in which the connector of the cord and the shape of the molded product for fixing the connector are devised and the lead wire is held by the connector and the connector fixing portion of the molded product (for example, Patent Document 1). In addition, it is possible to insert and fix the semicircular protrusion and the semicircular protrusion in a lead fixing device provided with a claw to prevent detachment or by providing rigidity to the guide rib of the lead wire insertion opening A lead wire fixing structure is known in which a hole is provided and a lead wire is fixed between a housing and a semicircular protrusion (see, for example, Patent Document 2 and Patent Document 3). In addition, a lead wire storage portion for storing the lead wire and a lead wire passage for introducing the lead wire into the lead wire storage portion are provided on the substrate provided in the intercom, and an insulating plate provided on the substrate is provided. 2. Description of the Related Art A lead wire holding structure is known in which a lead wire passage is provided to provide a detachment prevention piece that blocks a lead wire passage and prevents a lead wire from coming out of a lead wire storage portion (see, for example, Patent Document 4).
[0004]
[Patent Document 1]
Japanese Utility Model Publication No. 04-5678 [Patent Document 2]
Japanese Utility Model Publication No. 05-39000 [Patent Document 3]
Japanese Utility Model Publication No. 2000-114745 [Patent Document 4]
Japanese Utility Model Publication No. 2002-217565 [0005]
[Problems to be solved by the invention]
However, in the invention described in Patent Document 1, it is necessary to make the connector and the molded product fit, and the structure becomes complicated. In the invention described in Patent Document 2, a member for fixing the lead wire is required separately from the molded product. In the invention described in Patent Document 3, it is necessary to provide a semicircular protrusion or the like on the housing, and the structure becomes complicated. Furthermore, in the invention described in Patent Document 4, the lead wire passage and the detachment prevention piece are separate members, although the detachment prevention piece can be prevented from coming out of the lead wire storage portion by providing the insulation plate. Therefore, it was necessary to process each of the substrate and the insulating plate.
[0006]
The present invention has been made to solve the above-described problems, and can be easily formed without the need for a complicated mold when forming a molded product that holds the lead wire, and the lead wire is surely provided. It is an object of the present invention to provide a lead wire holding structure that can hold.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 is a lead wire for inserting and holding a lead wire derived from the electronic component from an upper surface side to a lower surface side of the molded component to which the electronic component is attached. In a lead wire holding structure in which a holding hole and an opening for inserting the lead wire into the lead wire holding hole from the edge surface side of the molded product are formed, A plate-like protrusion is formed from the upper part of one surface and the lower part of the other surface toward the inside of the opening, and the opening is opposed to the tip of the two protrusions. The clearance formed in the direction of the surface to be smaller than the diameter of the lead wire and the minimum distance formed between the opposing surfaces including the two protrusions are formed to be larger than the diameter of the lead wire. With gaps The lead wire is inserted into the lead wire holding hole by bending the lead wire and passing through the gap of the opening, and the lead wire held in the lead wire holding hole is inserted into the lead wire by the protruding portion. The escape from the holding hole is prevented.
[0008]
In this configuration, the lead wire is inserted into the lead wire holding hole by passing through the gap in the opening, and the lead wire held in the lead wire holding hole is separated from the lead wire holding hole by the plate-like protrusion. Pull-out is prevented. That is, when the lead wire extends in the vertical direction of the molded product and is held in the lead wire holding hole, the clearance of the opening is smaller than the diameter of the lead wire, so that the lead wire does not come out of the lead wire holding hole. . Further, since the gap of the opening is formed larger than the diameter of the lead wire, when the lead wire is inserted into the lead wire holding hole, the lead wire can be inserted into the lead wire holding hole through the gap.
[0009]
In addition, by providing a clearance in the opening, the opening is opened in the direction of the upper surface and / or the lower surface of the molded product at any position within the opening. A molded product can be molded with a mold.
[0010]
According to a second aspect of the present invention, there is provided a lead wire holding hole for holding a lead wire led out from the electronic component from an upper surface side to a lower surface side of the molded product to which the electronic component is attached, and the molded product. And an opening for inserting the lead wire into the lead wire holding hole from the edge surface side of the opening. Projecting portions are respectively formed toward the direction, and the opening includes a clearance formed such that a distance in a facing surface direction between the tips of the two projecting portions is smaller than a diameter of the lead wire, and the two A gap formed by a minimum distance between opposing surfaces including two protrusions formed larger than the diameter of the lead wire, and the lead wire passes through the gap of the opening. Lee Is inserted into the line holding hole, the lead held by the lead holding hole is to exit from the lead holding hole is prevented by the protrusion.
[0011]
In this configuration, the lead wire is inserted into the lead wire holding hole by passing through the gap in the opening, and the lead wire held in the lead wire holding hole is prevented from coming out of the lead wire holding hole by the protruding portion. The Further, by providing a clearance in the opening, a molded product can be formed with a simple mold including only an upper mold and a lower mold.
[0012]
According to a third aspect of the present invention, in the invention of the second aspect, any one of the projecting portions has a surface inclined from the upper surface or the lower surface of the molded product to the tip of the projecting portion.
[0013]
In this configuration, either one of the protrusions has a surface inclined from the upper surface or the lower surface of the molded product to the tip of the protrusion, and the lead wire is slid along the edge of the surface. The lead wire can be inserted into the lead wire holding hole.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
A lead wire holding structure according to a first embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the lead wire holding structure 1 is configured such that, for example, the lead wire 2 led out from the motor (electronic component) 10 installed on the upper surface 3 a of the molded product 3 is installed on the lower surface 3 b of the molded product 3. It is used to route and hold the circuit board (not shown). The lead wire holding structure 1 includes a lead wire holding hole 4 for inserting and holding the lead wire 2 from the upper surface 3 a side to the lower surface 3 b side of the molded product 3, and the lead wire holding hole 4 from the edge surface 3 c side of the molded product 3. An opening 5 for inserting the lead wire 2 is formed. And the protrusion part 7 is formed in the surface 6 which the opening part 5 mutually opposes from the upper part of one surface, and the lower part of the other surface.
[0015]
Next, the structure of the opening 5 will be described with reference to FIGS. The opening 5 has a clearance C in the opposing surface direction (arrow b direction) between the tips 7a of the two protrusions 7 and a gap B that minimizes the distance between the opposing surfaces including the protrusions 7. Have. The structure of the opening 5 is formed such that the relationship between the diameter φA of the lead wire 2 and the clearance C and gap B of the opening 5 satisfies C <φA <B.
[0016]
Since the clearance C of the opening 5 is smaller than the diameter φA of the lead wire 2, the lead wire 2 is in a state where the lead wire 2 extends in the vertical direction of the molded product 3 and is held in the lead wire holding hole 4. The lead wire 2 can be reliably held in the lead wire holding hole 4 without coming out of the lead wire holding hole 4 in the opening direction (arrow a direction) of the opening 5.
[0017]
Further, since the gap B of the opening 5 is formed larger than the diameter φA of the lead wire 2, the lead wire 2 can be inserted into the lead wire holding hole 4 through the gap B by bending the lead wire 2.
[0018]
Next, the metal mold | die used when shape | molding the molded article 3 is demonstrated using FIG. FIG. 3 shows a longitudinal section near the opening 5 of the mold 20 that opens and closes in the vertical direction with respect to the molded product 3. The mold 20 has a relatively simple structure including an upper mold 20a and a lower mold 20b, and the molded product 3 is molded by combining the molds 20 in the vertical direction and filling the space 22 with resin. The The convex portion 21 a of the upper mold 20 a and the convex portion 21 b of the lower mold 20 b correspond to the space of the opening 5 of the molded product 3.
[0019]
Since the clearance C is provided in the opening 5 of the molded product 3, a part of the convex portion 21a of the upper mold 20a becomes a part corresponding to the clearance C, and the mold 20 can be easily opened and closed simply by opening and closing. The molded product 3 can be molded.
[0020]
A lead wire holding structure according to a second embodiment of the present invention will be described with reference to FIG. The lead wire holding structure 1 is different from the first embodiment in that one of the protrusions has an inclined surface 6a from the lower surface 3b of the molded product 3 to the tip 7a of the protrusion 7. . As in the first embodiment, the shape of the opening 5 is such that the relationship between the lead wire diameter φA, the clearance C, and the gap B satisfies C <φA <B. The lead wire 2 inserted into the lead 4 is securely held in the lead wire holding hole 4 by the protrusion 7 provided in the opening 5.
[0021]
In the lead wire holding structure 1 according to the second embodiment, in addition to the effects described above, the lead wire 2 is inserted into the lead wire holding hole 4 because one of the protrusions 7 has the inclined surface 6a. In doing so, the lead wire 2 can be easily inserted into the lead wire holding hole 4 by sliding the lead wire 2 at the edge of the inclined surface 6 a of the protrusion 7.
[0022]
The present invention is not limited to the configuration of the above embodiment, and various modifications can be made. For example, the electronic component does not need to be directly attached to the molded product 3 and may be attached to the molded product 3 via another member.
[0023]
【The invention's effect】
As described above, according to the first aspect of the present invention, since the clearance of the opening is smaller than the diameter of the lead wire by the plate-like protrusion formed in the opening, the lead wire is in the vertical direction of the molded product. In the state where the lead wire extends and is held in the lead wire holding hole, the lead wire cannot be pulled out of the lead wire holding hole and is reliably held in the lead wire holding hole. Moreover, since the gap of the opening is formed larger than the diameter of the lead wire, the lead wire can be inserted into the lead wire holding hole through the gap.
[0024]
Furthermore, by providing a clearance in the opening, the opening is opened in the direction of the upper surface and / or the lower surface of the molded product at any position within the opening. A molded product can be molded, and since the shape of the protruding portion is a plate shape, the molded product can be easily molded without using a complicated mold.
[0025]
According to the invention of claim 2, since the clearance of the opening is formed smaller than the diameter of the lead wire, the lead wire extends in the vertical direction of the molded product and is held in the lead wire holding hole. The wire cannot be pulled out from the lead wire holding hole and is securely held in the lead wire holding hole. Moreover, since the gap of the opening is formed larger than the diameter of the lead wire, the lead wire can be inserted into the lead wire holding hole through the gap. Further, since the opening is opened on the upper surface side and / or the lower surface side of the molded product, the molded product can be easily molded with a mold having only an upper mold and a lower mold.
[0026]
According to the invention of claim 3, the lead wire is easily inserted into the lead wire holding hole by sliding the lead wire along the edge of the surface inclined from the upper surface or the lower surface of the molded product to the tip of the protruding portion. can do.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a lead wire holding structure according to a first embodiment of the present invention.
FIG. 2A is a top view showing the structure, and FIG. 2B is a front view showing the structure.
FIG. 3 is a view for explaining a mold used when a molded product having the same structure is molded.
4A is a top view showing a lead wire holding structure according to a second embodiment of the present invention, and FIG. 4B is a front view showing the structure.
FIG. 5 is a perspective view showing a conventional lead wire holding structure.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Lead wire holding structure 2 Lead wire 3 Molded product 3a Upper surface 3b Lower surface 3c Edge part 4 Lead wire holding hole 5 Opening part 6 Opposite surface 6a Inclined surface (from the upper surface or lower surface of a molded product to the front-end | tip of a protrusion part Inclined surface)
7 Projection 7a Projection Tip 10 Motor (Electronic Component)
B Gap C Clearance φA Lead wire diameter

Claims (3)

A lead wire holding hole for holding a lead wire led out of the electronic component from the upper surface side to the lower surface side of the molded product to which the electronic component is attached, and the lead from the edge surface side of the molded product In the lead wire holding structure formed by forming an opening for inserting the lead wire into the wire holding hole,
Plate-like protrusions are formed on the surfaces of the opening facing each other from the upper part of one surface and the lower part of the other surface toward the inside of the opening,
The opening is formed to have a clearance in which the distance in the opposing surface direction between the tips of the two protrusions is smaller than the diameter of the lead wire and the minimum of the opposing surfaces including the two protrusions. A gap formed by a gap distance formed larger than the diameter of the lead wire,
The lead wire is inserted into the lead wire holding hole by bending the lead wire and passing through the gap of the opening,
The lead wire holding structure, wherein the lead wire held in the lead wire holding hole is prevented from coming out of the lead wire holding hole by the protruding portion. A lead wire holding hole for holding a lead wire led out of the electronic component from the upper surface side to the lower surface side of the molded product to which the electronic component is attached, and the lead from the edge surface side of the molded product In the lead wire holding structure formed by forming an opening for inserting the lead wire into the wire holding hole,
Projections are formed on the surfaces of the openings facing each other toward the inside of the facing surfaces,
The opening is formed to have a clearance in which the distance in the opposing surface direction between the tips of the two protrusions is smaller than the diameter of the lead wire and the minimum of the opposing surfaces including the two protrusions. A gap formed by a gap distance formed larger than the diameter of the lead wire,
The lead wire is inserted into the lead wire holding hole by passing through the gap of the opening,
A lead wire holding structure in which the lead wire held in the lead wire holding hole is prevented from coming out of the lead wire holding hole by the protruding portion. The lead wire holding structure according to claim 2, wherein any one of the protrusions has a surface inclined from the upper surface or the lower surface of the molded product to the tip of the protrusion.

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